DE69512971T2 - Linear Poliergerät und Wafer Planarisierungsverfahren - Google Patents

Linear Poliergerät und Wafer Planarisierungsverfahren

Info

Publication number
DE69512971T2
DE69512971T2 DE69512971T DE69512971T DE69512971T2 DE 69512971 T2 DE69512971 T2 DE 69512971T2 DE 69512971 T DE69512971 T DE 69512971T DE 69512971 T DE69512971 T DE 69512971T DE 69512971 T2 DE69512971 T2 DE 69512971T2
Authority
DE
Germany
Prior art keywords
wafer
polishing member
polisher
planarization process
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69512971T
Other languages
English (en)
Other versions
DE69512971D1 (de
Inventor
Talieh Homayoun
David Edwin Weldon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Publication of DE69512971D1 publication Critical patent/DE69512971D1/de
Application granted granted Critical
Publication of DE69512971T2 publication Critical patent/DE69512971T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
DE69512971T 1994-08-09 1995-07-31 Linear Poliergerät und Wafer Planarisierungsverfahren Expired - Fee Related DE69512971T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28765894A 1994-08-09 1994-08-09

Publications (2)

Publication Number Publication Date
DE69512971D1 DE69512971D1 (de) 1999-12-02
DE69512971T2 true DE69512971T2 (de) 2000-05-18

Family

ID=23103828

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512971T Expired - Fee Related DE69512971T2 (de) 1994-08-09 1995-07-31 Linear Poliergerät und Wafer Planarisierungsverfahren

Country Status (6)

Country Link
US (2) US5692947A (de)
EP (1) EP0696495B1 (de)
JP (1) JPH0852652A (de)
AT (1) ATE186001T1 (de)
DE (1) DE69512971T2 (de)
ES (1) ES2137459T3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105364672A (zh) * 2015-09-22 2016-03-02 南漳富元鼎航空器材配件有限公司 一种自动打磨机的改进工装

Families Citing this family (150)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5645682A (en) * 1996-05-28 1997-07-08 Micron Technology, Inc. Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
US5868857A (en) * 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
US5871390A (en) * 1997-02-06 1999-02-16 Lam Research Corporation Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
US6328642B1 (en) * 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6059643A (en) * 1997-02-21 2000-05-09 Aplex, Inc. Apparatus and method for polishing a flat surface using a belted polishing pad
EP1015177A1 (de) * 1997-04-04 2000-07-05 Obsidian, Inc. Verbesserter speicher für poliermittel
US6425812B1 (en) * 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US5990010A (en) 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5987554A (en) * 1997-05-13 1999-11-16 Micron Electronics, Inc. Method of controlling the transfer of information across an interface between two buses
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US6149512A (en) * 1997-11-06 2000-11-21 Aplex, Inc. Linear pad conditioning apparatus
US6336845B1 (en) * 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6117778A (en) * 1998-02-11 2000-09-12 International Business Machines Corporation Semiconductor wafer edge bead removal method and tool
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US7718102B2 (en) 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6113465A (en) * 1998-06-16 2000-09-05 Speedfam-Ipec Corporation Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
TW396084B (en) * 1998-08-12 2000-07-01 Worldwild Semiconductor Mfg Co Chemical mechanic polishing machine
TWI235115B (en) 1998-10-26 2005-07-01 Scapa Group Plc Seamless, composite belts
US6036589A (en) * 1998-10-27 2000-03-14 Reilly; Cliff Cleaner for a belt sander
US6325706B1 (en) 1998-10-29 2001-12-04 Lam Research Corporation Use of zeta potential during chemical mechanical polishing for end point detection
US6186865B1 (en) 1998-10-29 2001-02-13 Lam Research Corporation Apparatus and method for performing end point detection on a linear planarization tool
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6902659B2 (en) * 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US7204924B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US7578923B2 (en) * 1998-12-01 2009-08-25 Novellus Systems, Inc. Electropolishing system and process
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US6468139B1 (en) * 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
WO2000037217A1 (en) * 1998-12-21 2000-06-29 Lam Research Corporation Method for cleaning an abrasive surface
US6179709B1 (en) 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6241583B1 (en) 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6244935B1 (en) 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6475070B1 (en) 1999-02-04 2002-11-05 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6387188B1 (en) 1999-03-03 2002-05-14 Speedfam-Ipec Corporation Pad conditioning for copper-based semiconductor wafers
US6224461B1 (en) 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6413873B1 (en) * 1999-05-03 2002-07-02 Applied Materials, Inc. System for chemical mechanical planarization
US6352595B1 (en) * 1999-05-28 2002-03-05 Lam Research Corporation Method and system for cleaning a chemical mechanical polishing pad
US6296717B1 (en) * 1999-06-11 2001-10-02 International Business Machines Corporation Regeneration of chemical mechanical polishing pads in-situ
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6241585B1 (en) 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing
US6261163B1 (en) * 1999-08-30 2001-07-17 Micron Technology, Inc. Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6244944B1 (en) * 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6520843B1 (en) * 1999-10-27 2003-02-18 Strasbaugh High planarity chemical mechanical planarization
US6626744B1 (en) 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6630059B1 (en) * 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
US20090020437A1 (en) * 2000-02-23 2009-01-22 Basol Bulent M Method and system for controlled material removal by electrochemical polishing
US6517414B1 (en) 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6582579B1 (en) 2000-03-24 2003-06-24 Nutool, Inc. Methods for repairing defects on a semiconductor substrate
US6428394B1 (en) 2000-03-31 2002-08-06 Lam Research Corporation Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6261959B1 (en) 2000-03-31 2001-07-17 Lam Research Corporation Method and apparatus for chemically-mechanically polishing semiconductor wafers
US6616801B1 (en) 2000-03-31 2003-09-09 Lam Research Corporation Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
AU2001247428A1 (en) * 2000-04-19 2001-11-07 Nutool, Inc. Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby
US20060118425A1 (en) * 2000-04-19 2006-06-08 Basol Bulent M Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
US7048607B1 (en) 2000-05-31 2006-05-23 Applied Materials System and method for chemical mechanical planarization
US6500056B1 (en) 2000-06-30 2002-12-31 Lam Research Corporation Linear reciprocating disposable belt polishing method and apparatus
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same
US6447380B1 (en) 2000-06-30 2002-09-10 Lam Research Corporation Polishing apparatus and substrate retainer ring providing continuous slurry distribution
US6495464B1 (en) * 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6520841B2 (en) 2000-07-10 2003-02-18 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
US6419559B1 (en) 2000-07-10 2002-07-16 Applied Materials, Inc. Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
US6666751B1 (en) * 2000-07-17 2003-12-23 Micron Technology, Inc. Deformable pad for chemical mechanical polishing
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US7754061B2 (en) 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US7220322B1 (en) * 2000-08-24 2007-05-22 Applied Materials, Inc. Cu CMP polishing pad cleaning
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6439978B1 (en) 2000-09-07 2002-08-27 Oliver Design, Inc. Substrate polishing system using roll-to-roll fixed abrasive
US6923711B2 (en) 2000-10-17 2005-08-02 Speedfam-Ipec Corporation Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US6805613B1 (en) 2000-10-17 2004-10-19 Speedfam-Ipec Corporation Multiprobe detection system for chemical-mechanical planarization tool
US6482072B1 (en) 2000-10-26 2002-11-19 Applied Materials, Inc. Method and apparatus for providing and controlling delivery of a web of polishing material
US6793565B1 (en) 2000-11-03 2004-09-21 Speedfam-Ipec Corporation Orbiting indexable belt polishing station for chemical mechanical polishing
US6773337B1 (en) 2000-11-07 2004-08-10 Planar Labs Corporation Method and apparatus to recondition an ion exchange polish pad
US6722950B1 (en) 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6905526B1 (en) 2000-11-07 2005-06-14 Planar Labs Corporation Fabrication of an ion exchange polish pad
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US20040170753A1 (en) * 2000-12-18 2004-09-02 Basol Bulent M. Electrochemical mechanical processing using low temperature process environment
US6572463B1 (en) 2000-12-27 2003-06-03 Lam Research Corp. Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
US6561889B1 (en) 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6729945B2 (en) 2001-03-30 2004-05-04 Lam Research Corporation Apparatus for controlling leading edge and trailing edge polishing
US6462409B1 (en) * 2001-06-06 2002-10-08 Advanced Micro Devices, Inc. Semiconductor wafer polishing apparatus
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US6712679B2 (en) 2001-08-08 2004-03-30 Lam Research Corporation Platen assembly having a topographically altered platen surface
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US6821794B2 (en) 2001-10-04 2004-11-23 Novellus Systems, Inc. Flexible snapshot in endpoint detection
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6827822B2 (en) * 2001-11-09 2004-12-07 Temple University Of The Commonwealth System Of Higher Education Method and apparatus for increasing and modulating the yield shear stress of electrorheological fluids
US6939212B1 (en) 2001-12-21 2005-09-06 Lam Research Corporation Porous material air bearing platen for chemical mechanical planarization
US6572731B1 (en) 2002-01-18 2003-06-03 Chartered Semiconductor Manufacturing Ltd. Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMP
US6855031B2 (en) * 2002-02-08 2005-02-15 Applied Materials, Inc. Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
US6790128B1 (en) 2002-03-29 2004-09-14 Lam Research Corporation Fluid conserving platen for optimizing edge polishing
US6726545B2 (en) 2002-04-26 2004-04-27 Chartered Semiconductor Manufacturing Ltd. Linear polishing for improving substrate uniformity
US20030224678A1 (en) * 2002-05-31 2003-12-04 Applied Materials, Inc. Web pad design for chemical mechanical polishing
US6769970B1 (en) 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
DE10239191A1 (de) * 2002-08-21 2004-03-11 Heesemann, Jürgen, Dipl.-Ing. Schleifmaschine und Verfahren zum Schleifen eines Werkstücks
US6864181B2 (en) * 2003-03-27 2005-03-08 Lam Research Corporation Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US7406549B2 (en) * 2003-08-01 2008-07-29 Intel Corporation Support for non-standard device containing operating system data
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US6843709B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for reducing slurry reflux
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US20070202777A1 (en) * 2004-03-31 2007-08-30 Japan Science And Technology Agency Linearly Advancing Polishing Method And Apparatus
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US7153182B1 (en) 2004-09-30 2006-12-26 Lam Research Corporation System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
WO2007027486A2 (en) * 2005-08-29 2007-03-08 Applied Materials, Inc. Method for conditioning a polishing pad
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
JP2010080766A (ja) * 2008-09-26 2010-04-08 Toyo Advanced Technologies Co Ltd ダイシング方法、ワイヤソー及びダイシング装置
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
KR101279681B1 (ko) * 2010-09-29 2013-06-27 주식회사 엘지실트론 단결정 잉곳 절단장치
JP6113960B2 (ja) 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
CN106180895A (zh) * 2016-07-07 2016-12-07 重庆明友钢具制造有限公司 手把锯片锯齿加工工艺
DE102016117992A1 (de) * 2016-09-23 2018-03-29 Karl Heesemann Maschinenfabrik Gmbh & Co Kg Schleifmaschine
DE102016117994A1 (de) * 2016-09-23 2018-03-29 Karl Heesemann Maschinenfabrik Gmbh & Co. Kg Schleifmaschine
DE102016117991A1 (de) * 2016-09-23 2018-03-29 Karl Heesemann Maschinenfabrik Gmbh & Co Kg Schleifmaschine
CN106404230A (zh) * 2016-10-12 2017-02-15 江苏汉生成科技有限公司 一种压力感测补偿系统
CN109079645B (zh) * 2018-09-29 2024-03-05 大连绿云科技有限公司 一种打磨抛光设备及方法
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US619399A (en) * 1899-02-14 Glass grinding and polishing machine
US2187743A (en) * 1938-04-28 1940-01-23 Carborundum Co Granular coated article
US3427765A (en) * 1966-02-11 1969-02-18 Carborundum Co Abrasive belts and method of making same
US3447306A (en) * 1966-09-16 1969-06-03 Barnes Drill Co Abrading machine
DE1907060A1 (de) * 1969-02-12 1970-09-03 Metabowerke Kg Bandschleifmaschine
US3753269A (en) * 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US3906678A (en) * 1972-09-14 1975-09-23 Buehler Ltd Automatic specimen polishing machine and method
US4016857A (en) * 1974-10-10 1977-04-12 Hall George H Epoxy bond diamond saw
SE419193B (sv) * 1979-04-25 1981-07-20 Bertil Jonasson Anordning vid en bladslipmaskin som omfattar minst ett slipaggregat vid vilket er anordnade slipdjupet paverkande anslagsorgan och minst ett tryckbord for anpressning av arbetstycket mot slipaggregatet och ...
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
JPS59232768A (ja) * 1983-06-16 1984-12-27 Kanebo Ltd 平面研磨装置
US4593495A (en) * 1983-11-25 1986-06-10 Toshiba Machine Co., Ltd. Polishing machine
DE3401462A1 (de) * 1984-01-17 1985-08-01 Johannsen, Hans-Peter, Dipl.-Ing., 3559 Battenberg Vorrichtung zum abstuetzen des umlaufenden schleifbandes einer breitbandschleifmaschine gegen ein werkstueck
US4651474A (en) * 1984-08-24 1987-03-24 Timesavers, Inc. Wide belt sanding machine with platen oscillating means
CA1260717A (en) * 1984-08-29 1989-09-26 Clarence I. Steinback Abrasive surfacing machine
US4642943A (en) * 1985-11-21 1987-02-17 Taylor Jr Joseph R Belt abrading apparatus and method
JPS62162466A (ja) * 1986-01-09 1987-07-18 Rohm Co Ltd ウエハ用ラツピング装置
JPS63200965A (ja) * 1987-02-12 1988-08-19 Fujitsu Ltd ウエ−ハ研磨装置
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPS63251166A (ja) * 1987-04-07 1988-10-18 Hitachi Ltd ウエハチヤツク
JPS63267155A (ja) * 1987-04-24 1988-11-04 Babcock Hitachi Kk 研磨装置
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US4941293A (en) * 1989-02-07 1990-07-17 Ekhoff Donald L Flexible rocking mount with forward pivot for polishing pad
JP2525892B2 (ja) * 1989-04-06 1996-08-21 ロデール・ニッタ 株式会社 ポリッシング方法およびポリッシング装置
JPH0811356B2 (ja) * 1989-04-06 1996-02-07 ロデール・ニッタ株式会社 ポリッシング方法およびポリッシング装置
KR960002336B1 (ko) * 1990-06-09 1996-02-16 반도오 기코 가부시끼가이샤 유리판의 평면연마기계
JP2516480B2 (ja) * 1990-12-28 1996-07-24 アミテック株式会社 ワイドベルトサンダ―機の踏圧装置
US5341609A (en) * 1992-01-28 1994-08-30 Minnesota Mining And Manufacturing Company Abrasive belts and their manufacture
RU2007784C1 (ru) * 1991-04-16 1994-02-15 Рогов Владимир Викторович Способ полирования полупроводниковых пластин
DE69206685T2 (de) * 1991-06-06 1996-07-04 Commissariat Energie Atomique Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf
FR2677276B1 (fr) * 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
FR2677291B1 (fr) * 1991-06-06 1995-12-15 Commissariat Energie Atomique Machine de polissage a controle de pression.
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5230184A (en) * 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
IT226758Z2 (it) * 1992-07-09 1997-07-01 Norton Utensile abrasivo quale disco striscia e simili per una macchina per la carteggiatura e la levigatura
US5274964A (en) * 1992-08-19 1994-01-04 Abrasive Cleaning Systems, Inc. Dry abrasive belt cleaner
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5487697A (en) * 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5399125A (en) * 1993-06-11 1995-03-21 Dozier; Robert L. Belt grinder
JPH07111256A (ja) * 1993-10-13 1995-04-25 Toshiba Corp 半導体製造装置
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5782679A (en) * 1996-09-23 1998-07-21 Hunter; David T. Metal abrasive belt and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105364672A (zh) * 2015-09-22 2016-03-02 南漳富元鼎航空器材配件有限公司 一种自动打磨机的改进工装

Also Published As

Publication number Publication date
ES2137459T3 (es) 1999-12-16
ATE186001T1 (de) 1999-11-15
EP0696495A1 (de) 1996-02-14
DE69512971D1 (de) 1999-12-02
US6231427B1 (en) 2001-05-15
JPH0852652A (ja) 1996-02-27
US5692947A (en) 1997-12-02
EP0696495B1 (de) 1999-10-27

Similar Documents

Publication Publication Date Title
DE69512971T2 (de) Linear Poliergerät und Wafer Planarisierungsverfahren
TW363218B (en) Integrated pad and belt for chemical mechanical polishing
DE69928319D1 (de) Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
ATE280014T1 (de) Hin- und hergehende linear poliermaschine mit ladbarem halter
KR960700864A (ko) 폴리싱 장치 및 방법(Apparatus and method for polishing)
MY133888A (en) Process and device for polishing semiconductor wafers
MY130639A (en) Method of rough polishing semiconductor wafers to reduce surface roughness
MY132588A (en) Apparatus and method for double-side polishing semiconductor wafers
ATE168306T1 (de) Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung
GB2270866B (en) Polishing pad conditioning apparatus for wafer planarization process
DE69405342T2 (de) Poliervorrichtung für Halbleiterscheibe
WO2002066206A3 (en) Wafer carrier and method of material removal from a semiconductor wafer
JP2002509811A (ja) ケミカルメカニカルポリシングコンディショナ
ATE228915T1 (de) Halbleiterscheiben-polierkopf
EP0940222A3 (de) Verfahren und Vorrichtung zum chemisch-mechanisch Planarisieren (CMP) einer Halbleiterscheibe
MY116349A (en) Semiconductor wafer polishing apparatus and method
EP0870576A3 (de) Poliervorrichtung
GB2329601A (en) Methods and apparatus for the chemical mechanical planarization of electronic devices
GB2340777A (en) Chemical mechanical planarization tool having a linear polishing roller
EP1060835A3 (de) Verfahren und Vorrichtung zum Regeln der Planheit von polierten Halbleiterscheiben
TW330881B (en) The apparatus & method for shaping a polishing pad & polishing semiconductor wafers
DE69934658D1 (de) Lineares chemisch-mechanisches Polierwerkzeug mit an Ort und Stelle Verteilung der Polierzusammensetzung und gleichzeitigem konditionieren des Polierkissens
TW375554B (en) Wafer holder for chemical and mechanical planarization machines
MY123286A (en) Semiconductor wafer manufacturing method
TW376352B (en) Wafer polishing apparatus having measurement device and polishing method thereby

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: LAM RESEARCH CORP.(N.D.GES.D.STAATES DELAWARE), FR

8339 Ceased/non-payment of the annual fee