DE69615510T2 - Passivierung von organischen Vorrichtungen - Google Patents

Passivierung von organischen Vorrichtungen

Info

Publication number
DE69615510T2
DE69615510T2 DE69615510T DE69615510T DE69615510T2 DE 69615510 T2 DE69615510 T2 DE 69615510T2 DE 69615510 T DE69615510 T DE 69615510T DE 69615510 T DE69615510 T DE 69615510T DE 69615510 T2 DE69615510 T2 DE 69615510T2
Authority
DE
Germany
Prior art keywords
passivation
organic devices
organic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69615510T
Other languages
English (en)
Other versions
DE69615510D1 (de
Inventor
Iii Thomas B Harvey
Song Q Shi
Franky So
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE69615510D1 publication Critical patent/DE69615510D1/de
Publication of DE69615510T2 publication Critical patent/DE69615510T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/958Passivation layer
DE69615510T 1995-11-30 1996-11-11 Passivierung von organischen Vorrichtungen Expired - Lifetime DE69615510T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/565,124 US5686360A (en) 1995-11-30 1995-11-30 Passivation of organic devices

Publications (2)

Publication Number Publication Date
DE69615510D1 DE69615510D1 (de) 2001-10-31
DE69615510T2 true DE69615510T2 (de) 2002-05-29

Family

ID=24257302

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69615510T Expired - Lifetime DE69615510T2 (de) 1995-11-30 1996-11-11 Passivierung von organischen Vorrichtungen

Country Status (6)

Country Link
US (2) US5686360A (de)
EP (1) EP0777280B1 (de)
JP (1) JP3579556B2 (de)
KR (1) KR100420749B1 (de)
DE (1) DE69615510T2 (de)
TW (1) TW447146B (de)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7727601B2 (en) 1999-10-25 2010-06-01 Vitex Systems, Inc. Method for edge sealing barrier films
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US10038012B2 (en) 2002-12-27 2018-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof, delamination method, and transferring method
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device

Families Citing this family (321)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811177A (en) * 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5952778A (en) * 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
CA2295676A1 (en) * 1997-07-11 1999-01-21 Fed Corporation Sealing structure for organic light emitting devices
US6198220B1 (en) * 1997-07-11 2001-03-06 Emagin Corporation Sealing structure for organic light emitting devices
JP3887079B2 (ja) * 1997-09-29 2007-02-28 新日鐵化学株式会社 多重型多色発光有機電界発光素子
US6224948B1 (en) 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
KR100249784B1 (ko) * 1997-11-20 2000-04-01 정선종 고분자복합막을이용한유기물혹은고분자전기발광소자의패키징방법
US6146225A (en) * 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
CA2337085A1 (en) * 1998-08-03 2000-02-17 Uniax Corporation Encapsulation of polymer-based solid state devices with inorganic materials
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
EP1054747A1 (de) * 1998-09-22 2000-11-29 Fed Corporation Gefärbte organische elektrolumineszierende vorrichtung und herstellungsverfahren
US7126161B2 (en) 1998-10-13 2006-10-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having El layer and sealing material
US6274887B1 (en) 1998-11-02 2001-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
EP1127381B1 (de) 1998-11-02 2015-09-23 3M Innovative Properties Company Transparente leitfähige oxide für kunststoff-flachbildschirme
US7141821B1 (en) * 1998-11-10 2006-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
US7022556B1 (en) 1998-11-11 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Exposure device, exposure method and method of manufacturing semiconductor device
US6277679B1 (en) 1998-11-25 2001-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing thin film transistor
US6207239B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition of conjugated polymer
US6217947B1 (en) 1998-12-16 2001-04-17 Battelle Memorial Institute Plasma enhanced polymer deposition onto fixtures
US6274204B1 (en) 1998-12-16 2001-08-14 Battelle Memorial Institute Method of making non-linear optical polymer
US6228436B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making light emitting polymer composite material
US6228434B1 (en) * 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
WO2000036665A1 (en) * 1998-12-16 2000-06-22 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6207238B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition for high and/or low index of refraction polymers
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
WO2000036661A1 (en) * 1998-12-17 2000-06-22 Cambridge Display Technology Ltd. Organic light-emitting devices
JP3817081B2 (ja) * 1999-01-29 2006-08-30 パイオニア株式会社 有機el素子の製造方法
US7697052B1 (en) 1999-02-17 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Electronic view finder utilizing an organic electroluminescence display
US6358570B1 (en) 1999-03-31 2002-03-19 Battelle Memorial Institute Vacuum deposition and curing of oligomers and resins
US6506461B2 (en) 1999-03-31 2003-01-14 Battelle Memorial Institute Methods for making polyurethanes as thin films
MXPA01010917A (es) * 1999-04-28 2002-07-30 Du Pont Dispositivo electronico organico flexible con resistencia mejorada a la degradacion por oxigeno y humedad.
US6680487B1 (en) 1999-05-14 2004-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same
TWI232595B (en) * 1999-06-04 2005-05-11 Semiconductor Energy Lab Electroluminescence display device and electronic device
US7288420B1 (en) 1999-06-04 2007-10-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing an electro-optical device
US8853696B1 (en) 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
US6174613B1 (en) * 1999-07-29 2001-01-16 Agilent Technologies, Inc. Method and apparatus for fabricating polymer-based electroluminescent displays
TW522453B (en) 1999-09-17 2003-03-01 Semiconductor Energy Lab Display device
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 El表示装置及び電子装置
JP3423261B2 (ja) * 1999-09-29 2003-07-07 三洋電機株式会社 表示装置
TW480722B (en) * 1999-10-12 2002-03-21 Semiconductor Energy Lab Manufacturing method of electro-optical device
US6573652B1 (en) * 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
JP4776769B2 (ja) * 1999-11-09 2011-09-21 株式会社半導体エネルギー研究所 発光装置の作製方法
US6646287B1 (en) 1999-11-19 2003-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with tapered gate and insulating film
US20010053559A1 (en) * 2000-01-25 2001-12-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
TW494447B (en) * 2000-02-01 2002-07-11 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
US7129918B2 (en) * 2000-03-10 2006-10-31 Semiconductor Energy Laboratory Co., Ltd. Electronic device and method of driving electronic device
TWI226205B (en) 2000-03-27 2005-01-01 Semiconductor Energy Lab Self-light emitting device and method of manufacturing the same
US6492026B1 (en) * 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US20010052752A1 (en) * 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
US7579203B2 (en) * 2000-04-25 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP5183838B2 (ja) * 2000-05-12 2013-04-17 株式会社半導体エネルギー研究所 発光装置
US7633471B2 (en) * 2000-05-12 2009-12-15 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and electric appliance
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
JP2002056986A (ja) * 2000-08-09 2002-02-22 Korai Kagi Kofun Yugenkoshi 放熱効果を有する有機エレクトロルミネッセンスデバイス、及びその製造方法
US6605826B2 (en) 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
MY141175A (en) * 2000-09-08 2010-03-31 Semiconductor Energy Lab Light emitting device, method of manufacturing the same, and thin film forming apparatus
DE10044841B4 (de) 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
JP2002100469A (ja) * 2000-09-25 2002-04-05 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル
US6924594B2 (en) * 2000-10-03 2005-08-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US6537688B2 (en) 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
JP2002170678A (ja) * 2000-12-01 2002-06-14 Canon Inc 有機エレクトロルミネッセンス素子
EP1360729A2 (de) * 2001-02-05 2003-11-12 Dow Global Technologies Inc. Organische lichtemittierende dioden auf plastiksubstraten
US6614057B2 (en) 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US7222981B2 (en) * 2001-02-15 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6881447B2 (en) * 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
US20050274322A1 (en) * 2001-02-26 2005-12-15 Lee Chung J Reactor for producing reactive intermediates for low dielectric constant polymer thin films
US6624568B2 (en) * 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
AU2002305393A1 (en) * 2001-05-04 2002-11-18 General Atomics O2 and h2o barrier material
JP2002343580A (ja) * 2001-05-11 2002-11-29 Pioneer Electronic Corp 発光ディスプレイ装置及びその製造方法
JP4041660B2 (ja) * 2001-05-31 2008-01-30 ユーディナデバイス株式会社 半導体装置及びその製造方法
US6692326B2 (en) 2001-06-16 2004-02-17 Cld, Inc. Method of making organic electroluminescent display
US7294517B2 (en) 2001-06-18 2007-11-13 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of fabricating the same
US7211828B2 (en) 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
JP4244120B2 (ja) * 2001-06-20 2009-03-25 株式会社半導体エネルギー研究所 発光装置及びその作製方法
TW548860B (en) * 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
TW546857B (en) * 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
US6664730B2 (en) 2001-07-09 2003-12-16 Universal Display Corporation Electrode structure of el device
US7469558B2 (en) 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
KR20010099356A (ko) * 2001-09-21 2001-11-09 김경현 파릴렌코팅방법
US20090208754A1 (en) * 2001-09-28 2009-08-20 Vitex Systems, Inc. Method for edge sealing barrier films
JP4166455B2 (ja) * 2001-10-01 2008-10-15 株式会社半導体エネルギー研究所 偏光フィルム及び発光装置
JP2003140561A (ja) * 2001-10-30 2003-05-16 Seiko Epson Corp 電気光学装置及びその製造方法並びに電子機器
JP4019690B2 (ja) * 2001-11-02 2007-12-12 セイコーエプソン株式会社 電気光学装置及びその製造方法並びに電子機器
US6888305B2 (en) * 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
US7404877B2 (en) 2001-11-09 2008-07-29 Springworks, Llc Low temperature zirconia based thermal barrier layer by PVD
US6753096B2 (en) 2001-11-27 2004-06-22 General Electric Company Environmentally-stable organic electroluminescent fibers
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
SG114514A1 (en) 2001-11-28 2005-09-28 Univ Singapore Organic light emitting diode (oled)
KR20040066898A (ko) * 2001-12-13 2004-07-27 코닌클리케 필립스 일렉트로닉스 엔.브이. 디스플레이 디바이스용 밀봉 구조
JP4010394B2 (ja) * 2001-12-14 2007-11-21 大日本印刷株式会社 エレクトロルミネッセント素子
US6903505B2 (en) 2001-12-17 2005-06-07 General Electric Company Light-emitting device with organic electroluminescent material and photoluminescent materials
US6765351B2 (en) * 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
US7012363B2 (en) * 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
JP3865056B2 (ja) 2002-01-22 2007-01-10 セイコーエプソン株式会社 封止用基板の製造方法
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US7378356B2 (en) 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US20030175142A1 (en) * 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
JP2003282241A (ja) * 2002-03-25 2003-10-03 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル及び製造方法
JP2003282238A (ja) * 2002-03-25 2003-10-03 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル及び製造方法
JP2003282240A (ja) * 2002-03-25 2003-10-03 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル及び製造方法
JP4010845B2 (ja) * 2002-03-28 2007-11-21 富士フイルム株式会社 発光素子
US6891330B2 (en) * 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
EP1492387A1 (de) * 2002-03-29 2004-12-29 Pioneer Corporation Organische elektrolumineszenzanzeigetafel
US20070216300A1 (en) * 2002-04-04 2007-09-20 International Display Systems, Inc. Organic opto-electronic device with environmentally protective barrier
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
US20050174045A1 (en) * 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US6897474B2 (en) * 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
KR100461844B1 (ko) * 2002-04-16 2004-12-20 (주)누리셀 다층박막 소자용 출발기판
KR100462469B1 (ko) * 2002-04-17 2004-12-17 한국전자통신연구원 접착식 유기-무기 복합막을 갖춘 엔캡슐레이션 박막과이를 포함하는 유기 전기발광 소자
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
US7164155B2 (en) 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7230271B2 (en) 2002-06-11 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof
TW569644B (en) * 2002-08-06 2004-01-01 Chi Mei Optoelectronics Corp Plastic substrate for organic electroluminescent display element, manufacturing method thereof and organic electroluminescent display element made by the substrate
WO2004014644A1 (ja) * 2002-08-07 2004-02-19 Kabushiki Kaisha Toyota Chuo Kenkyusho 密着層を備える積層体及び保護膜を備える積層体
US9793523B2 (en) 2002-08-09 2017-10-17 Sapurast Research Llc Electrochemical apparatus with barrier layer protected substrate
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
JP3693118B2 (ja) * 2002-08-12 2005-09-07 セイコーエプソン株式会社 シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法並びに液体噴射ヘッド
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US6929864B2 (en) * 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US6933051B2 (en) 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US7215473B2 (en) * 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
AU2003261463A1 (en) 2002-08-27 2004-03-19 Symmorphix, Inc. Optically coupling into highly uniform waveguides
JP2004095330A (ja) * 2002-08-30 2004-03-25 Tohoku Pioneer Corp 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器
US20060208634A1 (en) * 2002-09-11 2006-09-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US7449246B2 (en) * 2004-06-30 2008-11-11 General Electric Company Barrier coatings
US6887733B2 (en) * 2002-09-11 2005-05-03 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Method of fabricating electronic devices
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
US20050181212A1 (en) * 2004-02-17 2005-08-18 General Electric Company Composite articles having diffusion barriers and devices incorporating the same
US7224116B2 (en) * 2002-09-11 2007-05-29 Osram Opto Semiconductors Gmbh Encapsulation of active electronic devices
US7193364B2 (en) * 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
TW548853B (en) * 2002-09-13 2003-08-21 Ind Tech Res Inst Method of manufacturing flexible TFT display
US20040124421A1 (en) * 2002-09-20 2004-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and manufacturing method thereof
KR100662297B1 (ko) * 2002-10-18 2007-01-02 엘지전자 주식회사 유기 el 소자
JP2004152563A (ja) * 2002-10-30 2004-05-27 Canon Inc 表示装置
US7710019B2 (en) 2002-12-11 2010-05-04 Samsung Electronics Co., Ltd. Organic light-emitting diode display comprising auxiliary electrodes
US7011983B2 (en) * 2002-12-20 2006-03-14 General Electric Company Large organic devices and methods of fabricating large organic devices
TW586329B (en) * 2003-01-29 2004-05-01 Au Optronics Corp Sealing structure and method of making the same
GB0302550D0 (en) * 2003-02-05 2003-03-12 Cambridge Display Tech Ltd Organic optoelectronic device
US7042020B2 (en) * 2003-02-14 2006-05-09 Cree, Inc. Light emitting device incorporating a luminescent material
KR100691168B1 (ko) 2003-02-27 2007-03-09 섬모픽스, 인코포레이티드 유전 장벽층 필름
US7365442B2 (en) * 2003-03-31 2008-04-29 Osram Opto Semiconductors Gmbh Encapsulation of thin-film electronic devices
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
KR100496286B1 (ko) * 2003-04-12 2005-06-17 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 이의 제조 방법
GB0311234D0 (en) * 2003-05-16 2003-06-18 Isis Innovation Organic phosphorescent material and organic optoelectronic device
CN103215569A (zh) * 2003-05-16 2013-07-24 纳幕尔杜邦公司 通过原子层沉积形成的塑料基材阻挡层膜
US7238628B2 (en) 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US6921929B2 (en) * 2003-06-27 2005-07-26 Lockheed Martin Corporation Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens
US20050023974A1 (en) * 2003-08-01 2005-02-03 Universal Display Corporation Protected organic electronic devices and methods for making the same
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
WO2005025853A1 (en) * 2003-09-05 2005-03-24 Helicon Research, L.L.C. Nanophase multilayer barrier and process
JP4497881B2 (ja) * 2003-09-30 2010-07-07 三洋電機株式会社 有機el素子および有機elパネル
JP4716699B2 (ja) * 2003-09-30 2011-07-06 三洋電機株式会社 有機elパネル
JP4428979B2 (ja) * 2003-09-30 2010-03-10 三洋電機株式会社 有機elパネル
JP2005123012A (ja) * 2003-10-16 2005-05-12 Pioneer Electronic Corp 有機エレクトロルミネセンス表示パネルとその製造方法
US7052355B2 (en) * 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
KR100563057B1 (ko) * 2003-11-14 2006-03-24 삼성에스디아이 주식회사 초박형 유기 전계 발광 표시장치 및 그 제조방법
GB0327093D0 (en) * 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
JP4439260B2 (ja) * 2003-12-26 2010-03-24 三洋電機株式会社 表示装置の製造方法
JP2005197009A (ja) * 2003-12-26 2005-07-21 Sanyo Electric Co Ltd 表示装置及びその製造方法及び製造装置
US7495644B2 (en) * 2003-12-26 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing display device
JP4475942B2 (ja) * 2003-12-26 2010-06-09 三洋電機株式会社 表示装置及びその製造方法
US20050181535A1 (en) * 2004-02-17 2005-08-18 Yun Sun J. Method of fabricating passivation layer for organic devices
US7202504B2 (en) 2004-05-20 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element and display device
DE102004026618A1 (de) * 2004-06-01 2005-12-29 Siemens Ag Röntgendetektor
US20050269943A1 (en) * 2004-06-04 2005-12-08 Michael Hack Protected organic electronic devices and methods for making the same
KR20060046476A (ko) 2004-06-18 2006-05-17 산요덴키가부시키가이샤 일렉트로루미네센스 패널
US8034419B2 (en) * 2004-06-30 2011-10-11 General Electric Company Method for making a graded barrier coating
US20090110892A1 (en) * 2004-06-30 2009-04-30 General Electric Company System and method for making a graded barrier coating
JP4792717B2 (ja) * 2004-07-07 2011-10-12 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
JP4363365B2 (ja) * 2004-07-20 2009-11-11 株式会社デンソー カラー有機elディスプレイおよびその製造方法
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7342356B2 (en) * 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US7506998B2 (en) * 2004-09-24 2009-03-24 Koninklijke Philips Electronics, N.V. Illumination system
CN100454606C (zh) * 2004-09-30 2009-01-21 清华大学 一种有机电致发光器件
KR100637197B1 (ko) * 2004-11-25 2006-10-23 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
KR101021536B1 (ko) 2004-12-08 2011-03-16 섬모픽스, 인코포레이티드 LiCoO2의 증착
KR100668408B1 (ko) * 2004-12-09 2007-01-16 한국전자통신연구원 유기 전계효과 트랜지스터의 제조방법
GB2421626A (en) * 2004-12-24 2006-06-28 Cambridge Display Tech Ltd Organic electroluminescent device
US20060145599A1 (en) * 2005-01-04 2006-07-06 Reza Stegamat OLEDs with phosphors
JP4631683B2 (ja) * 2005-01-17 2011-02-16 セイコーエプソン株式会社 発光装置、及び電子機器
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器
JP2006216344A (ja) * 2005-02-03 2006-08-17 Dainippon Printing Co Ltd フレキシブル透明電極基板および有機elディスプレイデバイス
JP4573672B2 (ja) * 2005-02-28 2010-11-04 三洋電機株式会社 有機elパネル
JP2006243127A (ja) * 2005-03-01 2006-09-14 Victor Co Of Japan Ltd シートディスプレイ
KR100770257B1 (ko) * 2005-03-21 2007-10-25 삼성에스디아이 주식회사 유기전계 발광소자 및 그 제조방법
JP2006269338A (ja) * 2005-03-25 2006-10-05 Dainippon Printing Co Ltd フレキシブル透明電極基板および有機elディスプレイデバイス
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
JP2006310070A (ja) * 2005-04-28 2006-11-09 Dainippon Printing Co Ltd フレキシブル透明電極基板および有機elディスプレイデバイス
TWM281293U (en) * 2005-05-06 2005-11-21 Harvatek Corp Optoelectronic chip array package structure
KR100719554B1 (ko) * 2005-07-06 2007-05-17 삼성에스디아이 주식회사 평판 디스플레이 장치 및 그 제조방법
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7838133B2 (en) 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US7549905B2 (en) * 2005-09-30 2009-06-23 International Display Systems, Inc. Method of encapsulating an organic light emitting device
US7621794B2 (en) * 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
JP4702009B2 (ja) * 2005-11-22 2011-06-15 セイコーエプソン株式会社 発光装置および電子機器
TW200726311A (en) * 2005-12-30 2007-07-01 Au Optronics Corp Display panel structure with shielding structure
KR101194859B1 (ko) * 2006-05-02 2012-10-26 엘지디스플레이 주식회사 전계발광소자 및 그의 제조방법
DE102006027393A1 (de) 2006-06-13 2007-12-20 Applied Materials Gmbh & Co. Kg Verkapselung für organisches Bauelement
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
TWI421607B (zh) * 2006-08-24 2014-01-01 Creator Technology Bv 可撓性裝置上的滲透阻障
US8088502B2 (en) 2006-09-20 2012-01-03 Battelle Memorial Institute Nanostructured thin film optical coatings
KR20090069323A (ko) 2006-09-29 2009-06-30 인피니트 파워 솔루션스, 인크. 가요성 기판의 마스킹 및 가요성 기판에 배터리 층을 증착하기 위한 재료의 구속
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
KR101328879B1 (ko) * 2006-12-12 2013-11-13 엘지디스플레이 주식회사 플렉서블기판 및 이를 구비한 플렉서블 표시장치
WO2008083308A1 (en) 2006-12-28 2008-07-10 3M Innovative Properties Company Nucleation layer for thin film metal layer formation
EP2118336B1 (de) * 2006-12-29 2017-02-15 3M Innovative Properties Company Verfahren zur härtung von filmen, die metal-alkoxide enthalten
EP2111480A2 (de) * 2006-12-29 2009-10-28 3M Innovative Properties Company Verfahren zur herstellung von anorganischen filmen oder anorganisch/organischen hybridfilmen
US7416820B2 (en) * 2007-01-31 2008-08-26 International Business Machines Corporation Pellicle film optimized for immersion lithography systems with NA>1
JP5020710B2 (ja) * 2007-06-06 2012-09-05 キヤノン株式会社 撮像装置及び交換レンズ
KR100873704B1 (ko) * 2007-06-13 2008-12-12 삼성모바일디스플레이주식회사 유기 전계 발광표시장치 및 그의 제조방법
JP5208591B2 (ja) 2007-06-28 2013-06-12 株式会社半導体エネルギー研究所 発光装置、及び照明装置
US20090162667A1 (en) * 2007-12-20 2009-06-25 Lumination Llc Lighting device having backlighting, illumination and display applications
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
EP2225406A4 (de) 2007-12-21 2012-12-05 Infinite Power Solutions Inc Verfahren für sputter-targets für elektrolyt-filme
BRPI0819548A2 (pt) 2007-12-28 2015-05-19 3M Innovative Properties Co "sistemas de filme de encapsulação flexível"
CN101911367B (zh) 2008-01-11 2015-02-25 无穷动力解决方案股份有限公司 用于薄膜电池及其他器件的薄膜包封
WO2009090423A1 (en) * 2008-01-14 2009-07-23 Merck Patent Gmbh Barrier coated substrate and electro-optical device
EP2091096A1 (de) * 2008-02-15 2009-08-19 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Verkapselte elektronische Vorrichtung und Herstellungsverfahren
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
CN101983469B (zh) 2008-04-02 2014-06-04 无穷动力解决方案股份有限公司 与能量采集关联的储能装置的无源过电压/欠电压控制和保护
US8350451B2 (en) 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
WO2010002755A2 (en) * 2008-06-30 2010-01-07 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
FR2934417B1 (fr) 2008-07-25 2010-11-05 Centre Nat Rech Scient Composants electroniques a encapsulation integree
WO2010019577A1 (en) 2008-08-11 2010-02-18 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
US8260203B2 (en) 2008-09-12 2012-09-04 Infinite Power Solutions, Inc. Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
US8033885B2 (en) * 2008-09-30 2011-10-11 General Electric Company System and method for applying a conformal barrier coating with pretreating
US20100080929A1 (en) * 2008-09-30 2010-04-01 General Electric Company System and method for applying a conformal barrier coating
FR2936651B1 (fr) * 2008-09-30 2011-04-08 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
EP2178133B1 (de) 2008-10-16 2019-09-18 Semiconductor Energy Laboratory Co., Ltd. Flexible lichtemittierende Vorrichtung, elektronische Vorrichtung und Herstellungsverfahren für die flexible lichtemittierende Vorrichtung
KR20110100618A (ko) * 2008-12-05 2011-09-14 로터스 어플라이드 테크놀로지, 엘엘씨 향상된 장벽 층 특성을 갖는 얇은 막의 고속 증착
US8219408B2 (en) * 2008-12-29 2012-07-10 Motorola Mobility, Inc. Audio signal decoder and method for producing a scaled reconstructed audio signal
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
JP5471035B2 (ja) * 2009-05-26 2014-04-16 ソニー株式会社 表示装置、表示装置の製造方法、および電子機器
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
EP2474056B1 (de) 2009-09-01 2016-05-04 Sapurast Research LLC Bestückte leiterplatte mit integrierter dünnschichtbatterie
EP2292339A1 (de) 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Beschichtungsverfahren und Beschichtungsvorrichtung
US9101005B2 (en) * 2009-09-15 2015-08-04 Industrial Technology Research Institute Package of environmental sensitive element
US9472783B2 (en) * 2009-10-12 2016-10-18 General Electric Company Barrier coating with reduced process time
KR101117726B1 (ko) * 2009-12-15 2012-03-07 삼성모바일디스플레이주식회사 플렉서블 디스플레이용 기판, 이를 제조하는 방법, 및 이 기판제조방법을 이용한 유기 발광 디스플레이 장치의 제조 방법
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
KR101108161B1 (ko) 2009-12-24 2012-01-31 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR101359657B1 (ko) * 2009-12-30 2014-02-06 엘지디스플레이 주식회사 전자장치 및 유기전계발광장치, 다층보호막
KR101155904B1 (ko) 2010-01-04 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치
TWI589042B (zh) * 2010-01-20 2017-06-21 半導體能源研究所股份有限公司 發光裝置,撓性發光裝置,電子裝置,照明設備,以及發光裝置和撓性發光裝置的製造方法
US9000442B2 (en) * 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
KR101108166B1 (ko) * 2010-02-09 2012-01-31 삼성모바일디스플레이주식회사 실리콘 산화물막과 실리콘 리치 실리콘 질화물막을 포함하는 배리어층을 포함하는 유기 발광 장치
US9142804B2 (en) 2010-02-09 2015-09-22 Samsung Display Co., Ltd. Organic light-emitting device including barrier layer and method of manufacturing the same
JP2011227369A (ja) 2010-04-22 2011-11-10 Hitachi Displays Ltd 画像表示装置及びその製造方法
US20110291544A1 (en) * 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
GB2481367B (en) * 2010-06-04 2015-01-14 Plastic Logic Ltd Moisture Barrier for Electronic Devices
CN102947976B (zh) 2010-06-07 2018-03-16 萨普拉斯特研究有限责任公司 可充电、高密度的电化学设备
TWI641287B (zh) 2010-09-14 2018-11-11 半導體能源研究所股份有限公司 固態發光元件,發光裝置和照明裝置
JP5827104B2 (ja) 2010-11-19 2015-12-02 株式会社半導体エネルギー研究所 照明装置
JP6118020B2 (ja) 2010-12-16 2017-04-19 株式会社半導体エネルギー研究所 発光装置
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
US8735874B2 (en) 2011-02-14 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, and method for manufacturing the same
KR101922603B1 (ko) 2011-03-04 2018-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 조명 장치, 기판, 기판의 제작 방법
FR2977720A1 (fr) * 2011-07-08 2013-01-11 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
CN103988578B (zh) 2011-08-04 2017-07-21 3M创新有限公司 边缘受保护的阻隔组件
JP2014526985A (ja) * 2011-08-04 2014-10-09 スリーエム イノベイティブ プロパティズ カンパニー エッジの保護されたバリアー性組立品
KR20130065219A (ko) 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP5577373B2 (ja) * 2012-04-16 2014-08-20 株式会社半導体エネルギー研究所 発光装置
KR102079188B1 (ko) 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
US9761830B1 (en) 2012-05-14 2017-09-12 Eclipse Energy Systems, Inc. Environmental protection film for thin film devices
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
US9991399B2 (en) 2012-10-04 2018-06-05 Cree, Inc. Passivation structure for semiconductor devices
US9812338B2 (en) * 2013-03-14 2017-11-07 Cree, Inc. Encapsulation of advanced devices using novel PECVD and ALD schemes
CN103904248B (zh) * 2012-12-25 2016-08-03 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
US9196849B2 (en) * 2013-01-09 2015-11-24 Research & Business Foundation Sungkyunkwan University Polymer/inorganic multi-layer encapsulation film
KR20150120376A (ko) 2013-02-20 2015-10-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 반도체 장치, 및 박리 장치
KR102034253B1 (ko) 2013-04-12 2019-10-21 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102081285B1 (ko) * 2013-04-16 2020-02-26 삼성디스플레이 주식회사 증착마스크, 이를 이용한 디스플레이 장치 제조방법 및 이에 따라 제조된 디스플레이 장치
TWI557962B (zh) * 2013-08-23 2016-11-11 鴻海精密工業股份有限公司 有機發光二極體封裝結構及其製造方法
US9293730B2 (en) 2013-10-15 2016-03-22 Samsung Display Co., Ltd. Flexible organic light emitting diode display and manufacturing method thereof
JP6322380B2 (ja) * 2013-10-17 2018-05-09 株式会社ジャパンディスプレイ 表示装置
CN105793957B (zh) 2013-12-12 2019-05-03 株式会社半导体能源研究所 剥离方法及剥离装置
WO2016063869A1 (ja) * 2014-10-22 2016-04-28 コニカミノルタ株式会社 光取り出し基板、光取り出し基板の製造方法、有機エレクトロルミネッセンス素子、及び、有機エレクトロルミネッセンス素子の製造方法
JP6474337B2 (ja) * 2015-08-27 2019-02-27 株式会社ジャパンディスプレイ 表示装置及びその製造方法
WO2017043057A1 (ja) * 2015-09-08 2017-03-16 シャープ株式会社 有機el表示装置
KR102550694B1 (ko) * 2016-07-12 2023-07-04 삼성디스플레이 주식회사 플렉서블 표시 장치 및 이의 제조 방법
JP6297654B2 (ja) * 2016-09-29 2018-03-20 株式会社半導体エネルギー研究所 発光装置
WO2018061237A1 (ja) * 2016-09-30 2018-04-05 パイオニア株式会社 発光装置
FR3061404B1 (fr) * 2016-12-27 2022-09-23 Packaging Sip Procede de fabrication collective de modules electroniques hermetiques
KR102212920B1 (ko) * 2018-09-03 2021-02-08 주식회사 엘지화학 봉지 필름
CN110943066A (zh) * 2018-09-21 2020-03-31 联华电子股份有限公司 具有高电阻晶片的半导体结构及高电阻晶片的接合方法
US10834825B1 (en) 2019-05-08 2020-11-10 Raytheon Company Hermetic chip on board
US11588137B2 (en) 2019-06-05 2023-02-21 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
US11659758B2 (en) 2019-07-05 2023-05-23 Semiconductor Energy Laboratory Co., Ltd. Display unit, display module, and electronic device
CN113994494A (zh) 2019-07-12 2022-01-28 株式会社半导体能源研究所 功能面板、显示装置、输入输出装置、数据处理装置
JP2020024425A (ja) * 2019-09-26 2020-02-13 株式会社半導体エネルギー研究所 発光装置
KR20210079898A (ko) * 2019-12-20 2021-06-30 엘지디스플레이 주식회사 표시장치
CN111430423B (zh) * 2020-04-02 2023-03-28 京东方科技集团股份有限公司 Oled显示面板及其制作方法、显示装置
US20220384366A1 (en) * 2021-06-01 2022-12-01 Cree, Inc. Multilayer encapsulation for humidity robustness and related fabrication methods

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989003163A1 (en) * 1987-09-29 1989-04-06 Sumitomo Chemical Company, Limited Dispersion type electroluminescence device
US5061657A (en) * 1990-07-18 1991-10-29 The United States Of America As Represented By The Secretary Of The Navy Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
US5315129A (en) * 1990-08-20 1994-05-24 University Of Southern California Organic optoelectronic devices and methods
JP2661804B2 (ja) * 1991-03-13 1997-10-08 シャープ株式会社 白色有機el素子
JPH05182759A (ja) * 1991-12-26 1993-07-23 Pioneer Video Corp 有機el素子
US5482896A (en) * 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
JP3170542B2 (ja) * 1993-12-08 2001-05-28 出光興産株式会社 有機el素子
JPH07169567A (ja) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機el素子
JPH07192867A (ja) * 1993-12-27 1995-07-28 Idemitsu Kosan Co Ltd 有機el素子
US5532550A (en) * 1993-12-30 1996-07-02 Adler; Robert Organic based led display matrix
US5478658A (en) * 1994-05-20 1995-12-26 At&T Corp. Article comprising a microcavity light source
US5424560A (en) * 1994-05-31 1995-06-13 Motorola, Inc. Integrated multicolor organic led array
US5587589A (en) * 1995-03-22 1996-12-24 Motorola Two dimensional organic light emitting diode array for high density information image manifestation apparatus
DE19603746A1 (de) * 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7727601B2 (en) 1999-10-25 2010-06-01 Vitex Systems, Inc. Method for edge sealing barrier films
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US9839940B2 (en) 2002-04-15 2017-12-12 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US10038012B2 (en) 2002-12-27 2018-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof, delamination method, and transferring method
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9362530B2 (en) 2008-12-22 2016-06-07 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US8904819B2 (en) 2009-12-31 2014-12-09 Samsung Display Co., Ltd. Evaporator with internal restriction

Also Published As

Publication number Publication date
JP3579556B2 (ja) 2004-10-20
KR970030470A (ko) 1997-06-26
JPH09161967A (ja) 1997-06-20
US5686360A (en) 1997-11-11
US5757126A (en) 1998-05-26
EP0777280B1 (de) 2001-09-26
EP0777280A2 (de) 1997-06-04
EP0777280A3 (de) 1997-09-03
TW447146B (en) 2001-07-21
DE69615510D1 (de) 2001-10-31
KR100420749B1 (ko) 2004-05-31

Similar Documents

Publication Publication Date Title
DE69615510T2 (de) Passivierung von organischen Vorrichtungen
DE69630162D1 (de) Passivierung von organischen Vorrichtungen
DE69613945D1 (de) Passivierung von organischen elektrolumineszenten Vorrichtungen
DE69622034D1 (de) Herstellung von organischen elektrolumineszenten vorrichtungen
NO962381L (no) Spiss-beskytter-innretning
DE69621026T2 (de) Zyklische gmp-spezifische phosphodiesteraseinhibitoren
DE69624591T2 (de) Leitweglenkung von paketen
DE69631098D1 (de) Halbleiterstrukturen
DE69837906D1 (de) Insektizides proteintoxin von xenorhabus
DE69625265T2 (de) Halbleiterstrukturen
DE69312218T2 (de) Redistribution von organischen Polycarbonatzusammensetzungen
DE59601770D1 (de) Substituierte quaterrylentetracarbonsäurediimide
DE69703584D1 (de) Kaskadierter anschluss von kommunizierenden geräte
DE69535239D1 (de) Verbrennung von organischen Abfällen
DE69636697D1 (de) Waschvorrichtung
DE59601893D1 (de) Flussmittelfreie kontaktierung von bauelementen
DE69430725D1 (de) Testen von Halbleiterbauelementen
KR970001740U (ko) 아우트리거
DE29520375U1 (de) Einrichtung zum wahlweisen Anstellen von Zusatzeinrichtungen
DE69800973D1 (de) Bedienung von peripheriegeräten
KR970016230U (ko) 신발세척기
DE59611096D1 (de) Funktionalität von endgeräten
KR970039367U (ko) 이조식 세탁기의 탈수통
DE69617324T2 (de) Beilagscheibe
KR970020550U (ko) 육망성 목걸이

Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN

8364 No opposition during term of opposition
R082 Change of representative

Ref document number: 777280

Country of ref document: EP

Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT MBH

R079 Amendment of ipc main class

Ref document number: 777280

Country of ref document: EP

Free format text: PREVIOUS MAIN CLASS: H01L0051200000

Ipc: H01L0051500000