DE69715072T2 - Kompakter Mikrowellenmodul - Google Patents

Kompakter Mikrowellenmodul

Info

Publication number
DE69715072T2
DE69715072T2 DE69715072T DE69715072T DE69715072T2 DE 69715072 T2 DE69715072 T2 DE 69715072T2 DE 69715072 T DE69715072 T DE 69715072T DE 69715072 T DE69715072 T DE 69715072T DE 69715072 T2 DE69715072 T2 DE 69715072T2
Authority
DE
Germany
Prior art keywords
microwave module
compact microwave
compact
module
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69715072T
Other languages
English (en)
Other versions
DE69715072D1 (de
Inventor
Christian Tronche
Philippe Monfraix
Vera Augustin Coello
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Espace Industries SA
Original Assignee
Alcatel Espace Industries SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espace Industries SA filed Critical Alcatel Espace Industries SA
Application granted granted Critical
Publication of DE69715072D1 publication Critical patent/DE69715072D1/de
Publication of DE69715072T2 publication Critical patent/DE69715072T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
DE69715072T 1996-04-04 1997-03-27 Kompakter Mikrowellenmodul Expired - Fee Related DE69715072T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9604249A FR2747239B1 (fr) 1996-04-04 1996-04-04 Module hyperfrequence compact

Publications (2)

Publication Number Publication Date
DE69715072D1 DE69715072D1 (de) 2002-10-10
DE69715072T2 true DE69715072T2 (de) 2003-05-22

Family

ID=9490914

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715072T Expired - Fee Related DE69715072T2 (de) 1996-04-04 1997-03-27 Kompakter Mikrowellenmodul

Country Status (5)

Country Link
US (1) US5917388A (de)
EP (1) EP0800210B1 (de)
CA (1) CA2201771A1 (de)
DE (1) DE69715072T2 (de)
FR (1) FR2747239B1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2759527B1 (fr) * 1997-02-10 2002-07-19 Alsthom Cge Alkatel Structure monobloc de composants empiles
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP2000195720A (ja) * 1998-10-22 2000-07-14 Taiyo Yuden Co Ltd 積層電子部品
EP1069639B1 (de) * 1999-06-29 2006-04-26 Mitsubishi Denki Kabushiki Kaisha Modul mit einer Hochfrequenzschaltung
US6317011B1 (en) * 2000-03-09 2001-11-13 Avaya Technology Corp. Resonant capacitive coupler
US6882239B2 (en) * 2001-05-08 2005-04-19 Formfactor, Inc. Electromagnetically coupled interconnect system
KR100435813B1 (ko) * 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
WO2004044982A1 (ja) * 2002-11-12 2004-05-27 Fujitsu Limited 実装構造
US6956445B2 (en) * 2003-02-19 2005-10-18 Electro-Tec Corp. Broadband high-frequency slip ring system
US7675729B2 (en) 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
US7466157B2 (en) * 2004-02-05 2008-12-16 Formfactor, Inc. Contactless interfacing of test signals with a device under test
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
KR100618378B1 (ko) * 2005-02-25 2006-08-31 삼성전자주식회사 코플레나 웨이브가이드에서 평행 전송선으로 광대역 전송변환 장치
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器
CN101395683A (zh) 2006-03-07 2009-03-25 X2Y衰减器有限公司 能量调节装置结构
US7851709B2 (en) * 2006-03-22 2010-12-14 Advanced Semiconductor Engineering, Inc. Multi-layer circuit board having ground shielding walls
US9000851B1 (en) * 2011-07-14 2015-04-07 Hittite Microwave Corporation Cavity resonators integrated on MMIC and oscillators incorporating the same
US9123983B1 (en) 2012-07-20 2015-09-01 Hittite Microwave Corporation Tunable bandpass filter integrated circuit
JP6222747B2 (ja) * 2015-08-26 2017-11-01 Ｎｅｃスペーステクノロジー株式会社 回路構造体
DE102018105349A1 (de) 2018-03-08 2019-09-12 Infineon Technologies Ag Vorrichtung mit mindestens einem Streifenleiter

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
US5057798A (en) * 1990-06-22 1991-10-15 Hughes Aircraft Company Space-saving two-sided microwave circuitry for hybrid circuits
US5376561A (en) * 1990-12-31 1994-12-27 Kopin Corporation High density electronic circuit modules
US5768109A (en) * 1991-06-26 1998-06-16 Hughes Electronics Multi-layer circuit board and semiconductor flip chip connection
JPH0637202A (ja) * 1992-07-20 1994-02-10 Mitsubishi Electric Corp マイクロ波ｉｃ用パッケージ
US5309122A (en) * 1992-10-28 1994-05-03 Ball Corporation Multiple-layer microstrip assembly with inter-layer connections
US5406125A (en) * 1993-04-15 1995-04-11 Martin Marietta Corp. Semiconductor device having a metalized via hole
US5545924A (en) * 1993-08-05 1996-08-13 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits
US5644277A (en) * 1995-02-27 1997-07-01 Hughes Aircraft Company Three-wire-line vertical interconnect structure for multilevel substrates
US5689216A (en) * 1996-04-01 1997-11-18 Hughes Electronics Direct three-wire to stripline connection

Also Published As

Publication number Publication date
EP0800210A1 (de) 1997-10-08
CA2201771A1 (fr) 1997-10-04
FR2747239A1 (fr) 1997-10-10
US5917388A (en) 1999-06-29
EP0800210B1 (de) 2002-09-04
DE69715072D1 (de) 2002-10-10
FR2747239B1 (fr) 1998-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee