DE69812022D1 - EMV-Belüftungseinsatz - Google Patents

EMV-Belüftungseinsatz

Info

Publication number
DE69812022D1
DE69812022D1 DE69812022T DE69812022T DE69812022D1 DE 69812022 D1 DE69812022 D1 DE 69812022D1 DE 69812022 T DE69812022 T DE 69812022T DE 69812022 T DE69812022 T DE 69812022T DE 69812022 D1 DE69812022 D1 DE 69812022D1
Authority
DE
Germany
Prior art keywords
emc
ventilation insert
ventilation
insert
emc ventilation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69812022T
Other languages
English (en)
Other versions
DE69812022T2 (de
Inventor
Brad E Clements
Kristina L Mann
Andrew M Cherniski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69812022D1 publication Critical patent/DE69812022D1/de
Publication of DE69812022T2 publication Critical patent/DE69812022T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0041Ventilation panels having provisions for screening
DE69812022T 1997-09-25 1998-09-01 EMV-Belüftungseinsatz Expired - Lifetime DE69812022T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08937933 US5928076C1 (en) 1997-09-25 1997-09-25 Emi-attenuating air ventilation panel

Publications (2)

Publication Number Publication Date
DE69812022D1 true DE69812022D1 (de) 2003-04-17
DE69812022T2 DE69812022T2 (de) 2003-12-04

Family

ID=25470594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69812022T Expired - Lifetime DE69812022T2 (de) 1997-09-25 1998-09-01 EMV-Belüftungseinsatz

Country Status (4)

Country Link
US (1) US5928076C1 (de)
EP (1) EP0906009B1 (de)
JP (1) JPH11163568A (de)
DE (1) DE69812022T2 (de)

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US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
WO1999041963A1 (en) * 1998-02-17 1999-08-19 Parker-Hannifin Corporation Emi shielded vent panel and method
US6297446B1 (en) * 1999-02-26 2001-10-02 Hewlett Packard Company High performance EMC vent panel
CN1350772A (zh) * 1999-04-16 2002-05-22 西门子公司 电气模块支架的屏蔽装置
US8257428B2 (en) * 1999-08-09 2012-09-04 Cardiokinetix, Inc. System for improving cardiac function
US6252161B1 (en) 1999-11-22 2001-06-26 Dell Usa, L.P. EMI shielding ventilation structure
US6324075B1 (en) * 1999-12-20 2001-11-27 Intel Corporation Partially covered motherboard with EMI partition gateway
US6411102B1 (en) * 2000-01-07 2002-06-25 International Business Machines Corporation Apparatus for testing various structural parameters of an electro-magnetic radiation barrier
US6449150B1 (en) * 2000-11-13 2002-09-10 Cisco Technology, Inc. Method and system for cooling a card shelf
US6671186B2 (en) * 2001-04-20 2003-12-30 Hewlett-Packard Development Company, L.P. Electromagnetic interference shield
US6567276B2 (en) * 2001-04-20 2003-05-20 Hewlett-Packard Development Company L.P. Electromagnetic interference shield
US6610922B1 (en) 2001-12-20 2003-08-26 Cisco Technology, Inc. Apparatus for securing an electromagnetic shield in a conductive casing
KR100445033B1 (ko) * 2002-08-26 2004-08-18 삼성에스디아이 주식회사 전자부품 수납용 케이스 및 이를 구비한 화상표시장치
GB2396059B (en) * 2002-12-04 2006-02-08 Shuttle Inc Decoration window apparatus of a computer housing
DE20306848U1 (de) * 2002-12-04 2003-08-14 Shuttle Inc Dekorationsfenster für ein Computergehäuse
US6707675B1 (en) 2002-12-18 2004-03-16 Hewlett-Packard Development Company, L.P. EMI containment device and method
WO2004075615A1 (ja) * 2003-02-20 2004-09-02 Fujitsu Limited 電子機器の冷却構造及び冷却方法
TWM241965U (en) 2003-05-23 2004-08-21 Hon Hai Prec Ind Co Ltd EMI-Attenuating air ventilation panel
US20050002161A1 (en) * 2003-07-02 2005-01-06 Inventec Corporation Heat dissipation device of serve
SE0302201D0 (sv) * 2003-08-13 2003-08-13 Airson Ab Lufttillförselanordning
US7675729B2 (en) 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
US20050135075A1 (en) * 2003-12-23 2005-06-23 E. Com Compucase Co., Ltd. Computer case and parts thereof
US20050281003A1 (en) * 2004-06-21 2005-12-22 Carullo Thomas J Waveguide power supply enclosure
US7183500B2 (en) * 2004-06-30 2007-02-27 Intel Corporation Electromagnetic interference (EMI) filter with passive noise cancellation
US7199310B2 (en) * 2004-08-23 2007-04-03 Tortured Path- EMI Solutions LLC Electromagnetic interference shielding structures for computer hard-drive enclosures
JP2006093549A (ja) * 2004-09-27 2006-04-06 Orion Denki Kk プリント基板にアース接続用ランドを備えた電子機器
US7173822B2 (en) * 2004-10-28 2007-02-06 Cisco Technology, Inc. Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ,エルエルシー 共平面導体を有する調整器
US7817397B2 (en) 2005-03-01 2010-10-19 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US7371977B1 (en) * 2005-10-26 2008-05-13 L-3 Services, Inc. RF shield and method for fabricating the same
US7135644B1 (en) * 2006-02-01 2006-11-14 International Business Machines Corporation Permeable conductive shield having a laminated structure
KR101390426B1 (ko) 2006-03-07 2014-04-30 엑스2와이 어테뉴에이터스, 엘.엘.씨 에너지 컨디셔너 구조물들
US7492610B2 (en) * 2006-06-23 2009-02-17 International Business Machines Corporation Apparatus for improving server electromagnetic shielding
US8164911B2 (en) 2006-08-18 2012-04-24 Delphi Technologies, Inc. Lightweight electronic device for automotive applications and method
CN101257780B (zh) * 2007-02-27 2011-05-04 鸿富锦精密工业(深圳)有限公司 电子设备导风装置
KR20090054755A (ko) * 2007-11-27 2009-06-01 삼성전자주식회사 전자파 장애 차단 플레이트를 갖는 터치 패드
CN101451540B (zh) * 2007-12-06 2011-12-21 鸿富锦精密工业(深圳)有限公司 风扇逆流防止装置
JP2011086749A (ja) * 2009-10-15 2011-04-28 Panasonic Corp 電子機器
TW201137576A (en) * 2010-04-30 2011-11-01 Hon Hai Prec Ind Co Ltd Enclosure
CN102243514A (zh) * 2010-05-12 2011-11-16 鸿富锦精密工业(深圳)有限公司 机箱
CN102243515A (zh) * 2010-05-12 2011-11-16 鸿富锦精密工业(深圳)有限公司 机箱
TW201146126A (en) * 2010-06-07 2011-12-16 Hon Hai Prec Ind Co Ltd Enclosure
TWI477949B (zh) * 2010-06-07 2015-03-21 Hon Hai Prec Ind Co Ltd 機箱
CN102548370A (zh) * 2010-12-09 2012-07-04 深圳富泰宏精密工业有限公司 屏蔽罩及其制作方法
TW201227244A (en) * 2010-12-27 2012-07-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
JP5637937B2 (ja) * 2011-06-10 2014-12-10 株式会社日立製作所 制御装置
CN102833964A (zh) * 2011-06-15 2012-12-19 鸿富锦精密工业(深圳)有限公司 机箱
US9173331B2 (en) 2012-11-20 2015-10-27 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Variable thickness EMI shield with variable cooling channel size
JP6132692B2 (ja) 2013-07-19 2017-05-24 株式会社東芝 アンテナ装置
US9370132B2 (en) * 2013-08-27 2016-06-14 Parker-Hannifin Corporation Homogeneous EMI vent panel and method for preparation thereof
CN104684341A (zh) * 2013-11-30 2015-06-03 鸿富锦精密工业(深圳)有限公司 散热器
JP6273182B2 (ja) 2014-08-25 2018-01-31 株式会社東芝 電子機器
CN106415292B (zh) * 2014-12-26 2020-03-31 华为技术有限公司 射频测试座
KR102370421B1 (ko) * 2015-09-30 2022-03-07 삼성디스플레이 주식회사 구동 회로 유닛 및 이를 포함하는 표시 장치
US10356964B2 (en) 2016-07-21 2019-07-16 Hewlett Packard Enterprise Development Lp Waveguide structures
US11272644B2 (en) * 2017-02-02 2022-03-08 Eaton Intelligent Power Limited Grill for facilitating air flow
GB2568502B (en) * 2017-11-17 2022-03-30 Bae Systems Plc Shield
US10788868B1 (en) * 2019-05-06 2020-09-29 Dell Products L.P. Information handling system reflective outer housing
USD942441S1 (en) * 2019-06-01 2022-02-01 Apple Inc. Electronic device

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AT364441B (de) * 1980-06-13 1981-10-27 Siemens Ag Oesterreich Elektromagnetische abschirmung fuer durchtrittsoeffnungen
JPS593902A (ja) * 1982-06-29 1984-01-10 Nitsukan Kogyo Kk 導電性接着シ−ト
US4616101A (en) * 1984-07-13 1986-10-07 U.S. Philips Corporation Ventilation panel for electromagnetic shielding
US4631641A (en) * 1985-07-18 1986-12-23 Northern Telecom Limited Electronic apparatus with electro-magnetic interference screening
FR2741504A1 (fr) * 1990-02-20 1997-05-23 Telecommunications Internation Gaine d'aeration etanche a un rayonnement electromagnetique a tres haute frequence
US5285350A (en) * 1992-08-28 1994-02-08 Aavid Engineering, Inc. Heat sink plate for multiple semi-conductors
US5401914A (en) * 1993-02-03 1995-03-28 The Curran Company Vent for shielded enclosures
US5707282A (en) * 1996-02-28 1998-01-13 Hewlett-Packard Company Fan diffuser

Also Published As

Publication number Publication date
EP0906009A3 (de) 1999-07-28
US5928076C1 (en) 2001-04-24
EP0906009B1 (de) 2003-03-12
DE69812022T2 (de) 2003-12-04
EP0906009A2 (de) 1999-03-31
US5928076A (en) 1999-07-27
JPH11163568A (ja) 1999-06-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE