DE69830987D1 - Elektronisches bauelement - Google Patents

Elektronisches bauelement

Info

Publication number: DE69830987D1
Authority: DE; Germany
Prior art keywords: electronic component; electronic; component
Prior art date: 1997-03-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69830987T

Other languages

English (en)

Other versions

DE69830987T2 (de

Inventor

Kazuyoshi Honda

Noriyasu Echigo

Masaru Odagiri

Nobuki Sunagare

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-03-17

Filing date

1998-03-12

Publication date

2005-09-01

1998-03-12 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

2005-09-01 Publication of DE69830987D1 publication Critical patent/DE69830987D1/de

2006-04-13 Application granted granted Critical

2006-04-13 Publication of DE69830987T2 publication Critical patent/DE69830987T2/de

2018-03-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors

DE69830987T 1997-03-17 1998-03-12 Elektronisches bauelement Expired - Lifetime DE69830987T2 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP6265297		1997-03-17
JP6265297		1997-03-17
PCT/JP1998/001077 WO1998041999A1 (fr)	1997-03-17	1998-03-12	Composant electronique

Publications (2)

Publication Number	Publication Date
DE69830987D1 true DE69830987D1 (de)	2005-09-01
DE69830987T2 DE69830987T2 (de)	2006-04-13

Family

ID=13206481

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69830987T Expired - Lifetime DE69830987T2 (de)	1997-03-17	1998-03-12	Elektronisches bauelement

Country Status (6)

Country	Link
US (1)	US6195249B1 (de)
EP (1)	EP0971381B1 (de)
KR (1)	KR100344649B1 (de)
CN (1)	CN1134800C (de)
DE (1)	DE69830987T2 (de)
WO (1)	WO1998041999A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4814408B2 (ja) *	1998-10-20	2011-11-16	パナソニック株式会社	フィルムコンデンサの製造方法及びその製造装置
JP3498211B2 (ja) *	1999-12-10	2004-02-16	株式会社村田製作所	積層型半導体セラミック電子部品
US7595109B2 (en) *	2001-04-12	2009-09-29	Eestor, Inc.	Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries
US7914755B2 (en) *	2001-04-12	2011-03-29	Eestor, Inc.	Method of preparing ceramic powders using chelate precursors
US7729811B1 (en)	2001-04-12	2010-06-01	Eestor, Inc.	Systems and methods for utility grid power averaging, long term uninterruptible power supply, power line isolation from noise and transients and intelligent power transfer on demand
US6477034B1 (en) *	2001-10-03	2002-11-05	Intel Corporation	Interposer substrate with low inductance capacitive paths
JP3788329B2 (ja) *	2001-11-29	2006-06-21	株式会社村田製作所	コンデンサアレイ
US7152291B2 (en)	2002-04-15	2006-12-26	Avx Corporation	Method for forming plated terminations
US7463474B2 (en) *	2002-04-15	2008-12-09	Avx Corporation	System and method of plating ball grid array and isolation features for electronic components
US7576968B2 (en) *	2002-04-15	2009-08-18	Avx Corporation	Plated terminations and method of forming using electrolytic plating
US7345868B2 (en)	2002-10-07	2008-03-18	Presidio Components, Inc.	Multilayer ceramic capacitor with terminal formed by electroless plating
US6819543B2 (en) *	2002-12-31	2004-11-16	Intel Corporation	Multilayer capacitor with multiple plates per layer
US7081650B2 (en) *	2003-03-31	2006-07-25	Intel Corporation	Interposer with signal and power supply through vias
JP4516304B2 (ja) *	2003-11-20	2010-08-04	株式会社アルバック	巻取式真空蒸着方法及び巻取式真空蒸着装置
JP2005285801A (ja) *	2004-03-26	2005-10-13	Kyocera Corp	積層型電子部品の製法
US7050291B2 (en) *	2004-03-31	2006-05-23	Intel Corporation	Integrated ultracapacitor as energy source
US7466536B1 (en) *	2004-08-13	2008-12-16	Eestor, Inc.	Utilization of poly(ethylene terephthalate) plastic and composition-modified barium titanate powders in a matrix that allows polarization and the use of integrated-circuit technologies for the production of lightweight ultrahigh electrical energy storage units (EESU)
US20110170232A1 (en) *	2004-08-13	2011-07-14	Eestor, Inc.	Electrical energy storage unit and methods for forming same
US7206187B2 (en) *	2004-08-23	2007-04-17	Kyocera Corporation	Ceramic electronic component and its manufacturing method
TWI399765B (zh) *	2005-01-31	2013-06-21	Tdk Corp	積層電子零件
JP2006253371A (ja) *	2005-03-10	2006-09-21	Tdk Corp	多端子型積層コンデンサ及びその製造方法
US7648687B1 (en)	2006-06-15	2010-01-19	Eestor, Inc.	Method of purifying barium nitrate aqueous solution
US7993611B2 (en) *	2006-08-02	2011-08-09	Eestor, Inc.	Method of preparing ceramic powders using ammonium oxalate
US8853116B2 (en)	2006-08-02	2014-10-07	Eestor, Inc.	Method of preparing ceramic powders
US8145362B2 (en) *	2006-08-04	2012-03-27	Eestor, Inc.	Utility grid power averaging and conditioning
GB0714065D0 (en) *	2007-07-20	2007-08-29	X Fab Uk Ltd	A capacitor, and a method of manufacturing a capacitor
US20100285316A1 (en) *	2009-02-27	2010-11-11	Eestor, Inc.	Method of Preparing Ceramic Powders
JP2012519142A (ja) *	2009-02-27	2012-08-23	イーストー，インコーポレイティド	酸化物粉末の湿式化学的共沈のための反応管および熱水処理
JP2013517219A (ja) *	2010-01-20	2013-05-16	イーストー，インコーポレイティド	バリウムイオン源の精製
AU2011331918B2 (en) *	2010-11-18	2013-12-19	The Silanna Group Pty Ltd	Single-chip integrated circuit with capacitive isolation
KR101548771B1 (ko)	2011-06-23	2015-09-01	삼성전기주식회사	칩 타입 적층 커패시터
KR101843190B1 (ko) *	2011-08-31	2018-03-28	삼성전기주식회사	세라믹 전자부품 및 이의 제조방법
KR20140125111A (ko) *	2013-04-18	2014-10-28	삼성전기주식회사	적층 세라믹 전자 부품, 그 제조 방법 및 그 실장 기판
JP2019050279A (ja) *	2017-09-08	2019-03-28	Tdk株式会社	積層コンデンサ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3235772A1 (de) *	1981-09-30	1983-06-23	Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka	Mehrschichtkondensator
US5032461A (en)	1983-12-19	1991-07-16	Spectrum Control, Inc.	Method of making a multi-layered article
JPS61183913A (ja)	1985-02-08	1986-08-16	株式会社村田製作所	積層コンデンサ
JPH0793236B2 (ja) *	1988-11-16	1995-10-09	松下電器産業株式会社	フイルムコンデンサおよびその製造方法

1998
- 1998-03-12 CN CNB98803431XA patent/CN1134800C/zh not_active Expired - Fee Related
- 1998-03-12 KR KR1019997008492A patent/KR100344649B1/ko not_active IP Right Cessation
- 1998-03-12 US US09/341,737 patent/US6195249B1/en not_active Expired - Lifetime
- 1998-03-12 WO PCT/JP1998/001077 patent/WO1998041999A1/ja active IP Right Grant
- 1998-03-12 DE DE69830987T patent/DE69830987T2/de not_active Expired - Lifetime
- 1998-03-12 EP EP98907229A patent/EP0971381B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0971381A4 (de)	2004-06-16
US6195249B1 (en)	2001-02-27
CN1134800C (zh)	2004-01-14
KR20000076390A (ko)	2000-12-26
CN1250543A (zh)	2000-04-12
EP0971381A1 (de)	2000-01-12
KR100344649B1 (ko)	2002-07-25
EP0971381B1 (de)	2005-07-27
WO1998041999A1 (fr)	1998-09-24
DE69830987T2 (de)	2006-04-13

Legal Events

Date	Code	Title	Description
2006-08-17	8364	No opposition during term of opposition
2009-05-07	8327	Change in the person/name/address of the patent owner	Owner name: PANASONIC CORP., KADOMA, OSAKA, JP
2010-03-18	8320	Willingness to grant licences declared (paragraph 23)

Publication	Publication Date	Title
DE69830987D1 (de)	2005-09-01	Elektronisches bauelement
DE69819431D1 (de)	2003-12-11	Elektronisches Gerät
FI973415A0 (fi)	1997-08-20	Baerbara elektroniska anordningar
DE69816023D1 (de)	2003-08-07	Schaltungsanordnung
DE59813566D1 (de)	2006-07-06	Elektronischer Blinkgeber
DE59814138D1 (de)	2008-01-24	Elektronisches steuergerät
DE69724972D1 (de)	2003-10-23	Elektronisches Gerät
DE69816950D1 (de)	2003-09-11	Schaltungsanordnung
DE29715114U1 (de)	1997-10-16	Baugruppenträger
NO984575L (no)	1999-04-06	Piezoelektrisk kretskomponent
DE29723752U1 (de)	1999-04-01	Elektronisches Gerät
DE69828146D1 (de)	2005-01-20	Schaltungsanordnung
DK1020031T3 (da)	2004-01-26	Integreret kredsløb
DE69831460D1 (de)	2005-10-13	Schaltungsentwurfprüfung
DE29701401U1 (de)	1998-02-26	Elektronisches Gerät
DE29707528U1 (de)	1997-06-26	Baugruppenträger
DE19881344T1 (de)	1999-09-09	Elektronisches Gerät
DE29810236U1 (de)	1998-12-17	Bauelement
DE29714074U1 (de)	1998-12-10	Bauelement
DE59704877D1 (de)	2001-11-15	Mikrogalvanisch hergestelltes bauteil
DE69831998D1 (de)	2005-12-01	Elektronisches Uhrwerk
DE69820384D1 (de)	2004-01-22	Elektronisches Gerät
DE29723178U1 (de)	1998-04-23	Elektronisches Gerät
DE29809255U1 (de)	1998-09-24	Bauteil
ATA65497A (de)	2001-11-15	Bauelement