DE69833193D1 - Verfahren zur herstellung mehrerer elektronischer bauteile - Google Patents

Verfahren zur herstellung mehrerer elektronischer bauteile

Info

Publication number
DE69833193D1
DE69833193D1 DE69833193T DE69833193T DE69833193D1 DE 69833193 D1 DE69833193 D1 DE 69833193D1 DE 69833193 T DE69833193 T DE 69833193T DE 69833193 T DE69833193 T DE 69833193T DE 69833193 D1 DE69833193 D1 DE 69833193D1
Authority
DE
Germany
Prior art keywords
electronic components
multiple electronic
producing multiple
producing
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69833193T
Other languages
English (en)
Other versions
DE69833193T2 (de
Inventor
Johannes Nellissen
Grunsven Cornelis Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69833193D1 publication Critical patent/DE69833193D1/de
Application granted granted Critical
Publication of DE69833193T2 publication Critical patent/DE69833193T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
DE69833193T 1997-08-05 1998-06-11 Verfahren zur herstellung mehrerer elektronischer bauteile Expired - Fee Related DE69833193T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP97202432 1997-08-05
EP97202432 1997-08-05
PCT/IB1998/000916 WO1999008297A2 (en) 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components

Publications (2)

Publication Number Publication Date
DE69833193D1 true DE69833193D1 (de) 2006-04-06
DE69833193T2 DE69833193T2 (de) 2006-09-21

Family

ID=8228622

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69833193T Expired - Fee Related DE69833193T2 (de) 1997-08-05 1998-06-11 Verfahren zur herstellung mehrerer elektronischer bauteile

Country Status (8)

Country Link
US (1) US6240621B1 (de)
EP (1) EP0941545B1 (de)
JP (1) JP2001502123A (de)
KR (1) KR100561792B1 (de)
CN (1) CN1179381C (de)
DE (1) DE69833193T2 (de)
TW (1) TW412763B (de)
WO (1) WO1999008297A2 (de)

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US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6452247B1 (en) * 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6815220B2 (en) * 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
JP3955241B2 (ja) * 2002-06-21 2007-08-08 東京エレクトロン株式会社 Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法
KR100678496B1 (ko) * 2002-09-10 2007-02-06 티디케이가부시기가이샤 적층 콘덴서
KR20050048644A (ko) * 2002-09-27 2005-05-24 코닌클리케 필립스 일렉트로닉스 엔.브이. 회로기판의 측면을 배선하기 위한 리소그래픽 방법
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
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KR20070107746A (ko) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부 중첩된 조절기
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US8134548B2 (en) * 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
EP1991996A1 (de) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energiekonditionierungsstrukturen
JP4872134B2 (ja) * 2008-03-31 2012-02-08 Ｔｄｋ株式会社 端子電極形成方法
JP5233637B2 (ja) * 2008-04-02 2013-07-10 日立金属株式会社 多層セラミック基板、及び電子部品
CN102122553B (zh) * 2010-12-17 2013-03-20 深圳顺络电子股份有限公司 卧式结构的低阻值片式负温度系数热敏电阻及其制造方法
DE102011005658A1 (de) * 2011-03-16 2012-09-20 Sirona Dental Systems Gmbh Träger, vorzugsweise für ein elektronisches Bauteil, eine Baugruppe solcher Träger und ein Verfahren zur Herstellung einer Baugruppe solcher Träger
DE102012109704A1 (de) * 2012-10-11 2014-04-17 Epcos Ag Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung
JP6136507B2 (ja) * 2013-04-16 2017-05-31 Tdk株式会社 積層コンデンサアレイ
CN109963409B (zh) * 2019-04-10 2021-02-23 京东方科技集团股份有限公司 基板侧面导线的制造方法和基板结构

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Also Published As

Publication number Publication date
KR20000068710A (ko) 2000-11-25
JP2001502123A (ja) 2001-02-13
EP0941545B1 (de) 2006-01-11
US6240621B1 (en) 2001-06-05
WO1999008297A3 (en) 1999-04-15
KR100561792B1 (ko) 2006-03-21
WO1999008297A2 (en) 1999-02-18
DE69833193T2 (de) 2006-09-21
CN1241285A (zh) 2000-01-12
EP0941545A2 (de) 1999-09-15
TW412763B (en) 2000-11-21
CN1179381C (zh) 2004-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee