DE69932589D1 - Magnetischer tunnelübergang mit geringer umschalt-feldstärke für magnetische mehrzustands-speicherzelle - Google Patents

Magnetischer tunnelübergang mit geringer umschalt-feldstärke für magnetische mehrzustands-speicherzelle

Info

Publication number
DE69932589D1
DE69932589D1 DE69932589T DE69932589T DE69932589D1 DE 69932589 D1 DE69932589 D1 DE 69932589D1 DE 69932589 T DE69932589 T DE 69932589T DE 69932589 T DE69932589 T DE 69932589T DE 69932589 D1 DE69932589 D1 DE 69932589D1
Authority
DE
Germany
Prior art keywords
magnetic
memory cell
state memory
field thickness
tunnel transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69932589T
Other languages
English (en)
Other versions
DE69932589T2 (de
Inventor
Eugene Chen
N Tehrani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of DE69932589D1 publication Critical patent/DE69932589D1/de
Application granted granted Critical
Publication of DE69932589T2 publication Critical patent/DE69932589T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5607Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using magnetic storage elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2211/00Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/56Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
    • G11C2211/561Multilevel memory cell aspects
    • G11C2211/5615Multilevel magnetic memory cell using non-magnetic non-conducting interlayer, e.g. MTJ

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
DE69932589T 1998-07-20 1999-07-19 Magnetischer tunnelübergang mit geringer umschaltfeldstärke für magnetische mehrzustandsspeicherzelle Expired - Fee Related DE69932589T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US118979 1998-07-20
US09/118,979 US5953248A (en) 1998-07-20 1998-07-20 Low switching field magnetic tunneling junction for high density arrays
PCT/US1999/016314 WO2000004552A1 (en) 1998-07-20 1999-07-19 Low switching field magnetic tunneling junction usable for multi-state magnetic memory cell

Publications (2)

Publication Number Publication Date
DE69932589D1 true DE69932589D1 (de) 2006-09-14
DE69932589T2 DE69932589T2 (de) 2006-12-07

Family

ID=22381922

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69932589T Expired - Fee Related DE69932589T2 (de) 1998-07-20 1999-07-19 Magnetischer tunnelübergang mit geringer umschaltfeldstärke für magnetische mehrzustandsspeicherzelle

Country Status (6)

Country Link
US (1) US5953248A (de)
EP (1) EP1038299B1 (de)
JP (1) JP4815051B2 (de)
DE (1) DE69932589T2 (de)
TW (1) TW451192B (de)
WO (1) WO2000004552A1 (de)

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US6727105B1 (en) * 2000-02-28 2004-04-27 Hewlett-Packard Development Company, L.P. Method of fabricating an MRAM device including spin dependent tunneling junction memory cells
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US6469926B1 (en) * 2000-03-22 2002-10-22 Motorola, Inc. Magnetic element with an improved magnetoresistance ratio and fabricating method thereof
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US6538921B2 (en) 2000-08-17 2003-03-25 Nve Corporation Circuit selection of magnetic memory cells and related cell structures
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FR2817999B1 (fr) * 2000-12-07 2003-01-10 Commissariat Energie Atomique Dispositif magnetique a polarisation de spin et a empilement(s) tri-couche(s) et memoire utilisant ce dispositif
JP3576111B2 (ja) 2001-03-12 2004-10-13 株式会社東芝 磁気抵抗効果素子
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US6657888B1 (en) 2001-05-11 2003-12-02 Board Of Regents Of The University Of Nebraska Application of high spin polarization materials in two terminal non-volatile bistable memory devices
US6744086B2 (en) 2001-05-15 2004-06-01 Nve Corporation Current switched magnetoresistive memory cell
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US6545906B1 (en) * 2001-10-16 2003-04-08 Motorola, Inc. Method of writing to scalable magnetoresistance random access memory element
US6633498B1 (en) * 2002-06-18 2003-10-14 Motorola, Inc. Magnetoresistive random access memory with reduced switching field
US6693824B2 (en) * 2002-06-28 2004-02-17 Motorola, Inc. Circuit and method of writing a toggle memory
US6850433B2 (en) * 2002-07-15 2005-02-01 Hewlett-Packard Development Company, Lp. Magnetic memory device and method
JP3837102B2 (ja) * 2002-08-20 2006-10-25 Tdk株式会社 電磁変換素子、薄膜磁気ヘッド、磁気ヘッドアセンブリおよび磁気再生装置、ならびに電磁変換素子の製造方法
JP2004128237A (ja) * 2002-10-03 2004-04-22 Sony Corp 磁気抵抗効果素子および磁気メモリ装置
US6873542B2 (en) 2002-10-03 2005-03-29 International Business Machines Corporation Antiferromagnetically coupled bi-layer sensor for magnetic random access memory
US6870758B2 (en) * 2002-10-30 2005-03-22 Hewlett-Packard Development Company, L.P. Magnetic memory device and methods for making same
JP3863484B2 (ja) * 2002-11-22 2006-12-27 株式会社東芝 磁気抵抗効果素子および磁気メモリ
DE10258860A1 (de) * 2002-12-17 2004-07-15 Robert Bosch Gmbh Magnetoresistives Schichtsystem und Sensorelement mit diesem Schichtsystem
US6714446B1 (en) * 2003-05-13 2004-03-30 Motorola, Inc. Magnetoelectronics information device having a compound magnetic free layer
JP4253225B2 (ja) * 2003-07-09 2009-04-08 株式会社東芝 磁気抵抗効果素子および磁気メモリ
US6956764B2 (en) * 2003-08-25 2005-10-18 Freescale Semiconductor, Inc. Method of writing to a multi-state magnetic random access memory cell
US7310265B2 (en) * 2003-10-14 2007-12-18 Agency For Science, Technology And Research Magnetic memory device
US6985383B2 (en) * 2003-10-20 2006-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Reference generator for multilevel nonlinear resistivity memory storage elements
JP4581394B2 (ja) * 2003-12-22 2010-11-17 ソニー株式会社 磁気メモリ
KR100528341B1 (ko) * 2003-12-30 2005-11-15 삼성전자주식회사 자기 램 및 그 읽기방법
US7105372B2 (en) 2004-01-20 2006-09-12 Headway Technologies, Inc. Magnetic tunneling junction film structure with process determined in-plane magnetic anisotropy
US7436700B2 (en) * 2004-02-06 2008-10-14 Infineon Technologies Ag MRAM memory cell having a weak intrinsic anisotropic storage layer and method of producing the same
DE102005004126B4 (de) * 2004-02-06 2008-05-08 Qimonda Ag MRAM-Speicherzelle mit schwacher intrinsisch anisotroper Speicherschicht
FR2869445B1 (fr) * 2004-04-26 2006-07-07 St Microelectronics Sa Element de memoire vive magnetique
US7372116B2 (en) * 2004-06-16 2008-05-13 Hitachi Global Storage Technologies Netherlands B.V. Heat assisted switching in an MRAM cell utilizing the antiferromagnetic to ferromagnetic transition in FeRh
US7477490B2 (en) * 2004-06-30 2009-01-13 Seagate Technology Llc Single sensor element that is naturally differentiated
US7187576B2 (en) * 2004-07-19 2007-03-06 Infineon Technologies Ag Read out scheme for several bits in a single MRAM soft layer
WO2006038193A2 (en) * 2004-10-05 2006-04-13 Csi Technology, Inc. Transferring arbitrary binary data over a fieldbus network
US7355884B2 (en) * 2004-10-08 2008-04-08 Kabushiki Kaisha Toshiba Magnetoresistive element
US7599156B2 (en) * 2004-10-08 2009-10-06 Kabushiki Kaisha Toshiba Magnetoresistive element having specially shaped ferromagnetic layer
JP4388008B2 (ja) * 2004-11-30 2009-12-24 株式会社東芝 半導体記憶装置
JP4012196B2 (ja) * 2004-12-22 2007-11-21 株式会社東芝 磁気ランダムアクセスメモリのデータ書き込み方法
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FR2925747B1 (fr) 2007-12-21 2010-04-09 Commissariat Energie Atomique Memoire magnetique a ecriture assistee thermiquement
US8242776B2 (en) * 2008-03-26 2012-08-14 Everspin Technologies, Inc. Magnetic sensor design for suppression of barkhausen noise
KR102034210B1 (ko) * 2013-03-15 2019-10-18 에스케이하이닉스 주식회사 반도체 장치 및 이의 제조 방법, 이 반도체 장치를 포함하는 마이크로프로세서, 프로세서, 시스템, 데이터 저장 시스템 및 메모리 시스템

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Also Published As

Publication number Publication date
EP1038299A1 (de) 2000-09-27
TW451192B (en) 2001-08-21
US5953248A (en) 1999-09-14
JP2002520873A (ja) 2002-07-09
JP4815051B2 (ja) 2011-11-16
EP1038299B1 (de) 2006-08-02
DE69932589T2 (de) 2006-12-07
WO2000004552A1 (en) 2000-01-27

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee