DE9403108U1 - Low-inductance high-current busbar for converter modules - Google Patents

Low-inductance high-current busbar for converter modules

Info

Publication number
DE9403108U1
DE9403108U1 DE9403108U DE9403108U DE9403108U1 DE 9403108 U1 DE9403108 U1 DE 9403108U1 DE 9403108 U DE9403108 U DE 9403108U DE 9403108 U DE9403108 U DE 9403108U DE 9403108 U1 DE9403108 U1 DE 9403108U1
Authority
DE
Germany
Prior art keywords
low
converter modules
current busbar
inductance high
inductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9403108U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9403108U priority Critical patent/DE9403108U1/en
Publication of DE9403108U1 publication Critical patent/DE9403108U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
DE9403108U 1994-02-24 1994-02-24 Low-inductance high-current busbar for converter modules Expired - Lifetime DE9403108U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9403108U DE9403108U1 (en) 1994-02-24 1994-02-24 Low-inductance high-current busbar for converter modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9403108U DE9403108U1 (en) 1994-02-24 1994-02-24 Low-inductance high-current busbar for converter modules

Publications (1)

Publication Number Publication Date
DE9403108U1 true DE9403108U1 (en) 1994-04-14

Family

ID=6905083

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9403108U Expired - Lifetime DE9403108U1 (en) 1994-02-24 1994-02-24 Low-inductance high-current busbar for converter modules

Country Status (1)

Country Link
DE (1) DE9403108U1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19518479A1 (en) * 1995-05-19 1996-11-21 Thyssen Aufzuege Gmbh Power converter
DE19600367A1 (en) * 1996-01-08 1997-07-10 Abb Daimler Benz Transp Busbar system for the intermediate circuit of a converter
WO1999052148A1 (en) * 1998-04-03 1999-10-14 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
DE19914894A1 (en) * 1999-04-01 2000-10-26 Mannesmann Sachs Ag High power electronics power unit conductor rail connector having multi layered connection unit and conformal zone with current measurement mechanism connection.
EP1120895A2 (en) 1999-12-20 2001-08-01 Murata Manufacturing Co., Ltd. Capacitor module for use in invertor, invertor, and capacitor module
FR2810154A1 (en) * 2000-06-07 2001-12-14 Murata Manufacturing Co INVERTER CAPACITOR MODULE AND INVERTER
WO2002015651A2 (en) * 2000-08-11 2002-02-21 American Superconductor Corporation Low inductance transistor module with distributed bus
WO2002028155A1 (en) * 2000-09-29 2002-04-04 American Superconductor Corporation Low-inductance connector for printed-circuit board
US6380728B1 (en) 1999-04-01 2002-04-30 Mannesmann Sachs Ag Bus bar for connecting electrical components with arrangement for measuring current and power electronics for controlling an electric machine
DE102005055608B3 (en) * 2005-11-22 2007-05-10 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with capacitors connected in parallel with each other
WO2013171136A1 (en) * 2012-05-16 2013-11-21 Sagem Defense Securite Electronic power module arrangement
WO2014210125A1 (en) * 2013-06-26 2014-12-31 Siemens Industry, Inc. Printed circuit board power cell
WO2022017715A1 (en) * 2020-07-22 2022-01-27 Robert Bosch Gmbh Emc filter having shielding

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2295825A (en) * 1939-07-18 1942-09-15 Packard Motor Car Co Distribution system for electricity
GB940310A (en) * 1961-03-22 1963-10-30 Wego Condenser Company Ltd Improvements in and relating to electrical connectors
US3932932A (en) * 1974-09-16 1976-01-20 International Telephone And Telegraph Corporation Method of making multilayer printed circuit board
US4670833A (en) * 1984-06-01 1987-06-02 Anton Piller Gmbh & Co. Kg Semiconductor module for a high-speed switching arrangement
DE3609065A1 (en) * 1986-03-18 1987-09-24 Siemens Ag LOW-INDUCTIVE RAILING
EP0241250A2 (en) * 1986-04-08 1987-10-14 Tucker Fasteners Limited Switching mode power supply
EP0277546A1 (en) * 1987-01-21 1988-08-10 Siemens Aktiengesellschaft Semiconductor device having at least one semiconductor body
DE8909246U1 (en) * 1989-07-31 1989-09-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
DE4000056A1 (en) * 1989-04-21 1990-10-25 Transform Roentgen Matern Veb Modular assembly for high voltage transistor frequency changer - provides physical separation of power output, control module and pulse unit in minimum space
DE9105035U1 (en) * 1991-04-24 1992-06-17 Siemens Ag, 8000 Muenchen, De
EP0495470A2 (en) * 1991-01-17 1992-07-22 Firma Carl Zeiss Device for noise suppressing of a switched power unit
DE4124757A1 (en) * 1991-01-21 1992-07-30 Mitsubishi Electric Corp SEMICONDUCTOR DEVICE
US5136471A (en) * 1987-02-26 1992-08-04 Nec Corporation Laminate wiring board
US5170337A (en) * 1992-01-29 1992-12-08 General Electric Company Low-inductance package for multiple paralleled devices operating at high frequency
US5172310A (en) * 1991-07-10 1992-12-15 U.S. Windpower, Inc. Low impedance bus for power electronics
EP0519305A2 (en) * 1991-06-21 1992-12-23 Siemens Aktiengesellschaft Converter assembly
EP0533158A2 (en) * 1991-09-20 1993-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
DE4222068C1 (en) * 1992-07-04 1993-06-09 Abb Patent Gmbh, 6800 Mannheim, De
DE4230510C1 (en) * 1992-09-11 1993-09-02 Gruendl Und Hoffmann Gesellschaft Fuer Elektrotechnische Entwicklungen Mbh, 82319 Starnberg, De
EP0590643A2 (en) * 1992-09-30 1994-04-06 Mitsubishi Denki Kabushiki Kaisha Large-current circuit board and method therefor

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2295825A (en) * 1939-07-18 1942-09-15 Packard Motor Car Co Distribution system for electricity
GB940310A (en) * 1961-03-22 1963-10-30 Wego Condenser Company Ltd Improvements in and relating to electrical connectors
US3932932A (en) * 1974-09-16 1976-01-20 International Telephone And Telegraph Corporation Method of making multilayer printed circuit board
US4670833A (en) * 1984-06-01 1987-06-02 Anton Piller Gmbh & Co. Kg Semiconductor module for a high-speed switching arrangement
DE3609065A1 (en) * 1986-03-18 1987-09-24 Siemens Ag LOW-INDUCTIVE RAILING
EP0241250A2 (en) * 1986-04-08 1987-10-14 Tucker Fasteners Limited Switching mode power supply
EP0277546A1 (en) * 1987-01-21 1988-08-10 Siemens Aktiengesellschaft Semiconductor device having at least one semiconductor body
US5136471A (en) * 1987-02-26 1992-08-04 Nec Corporation Laminate wiring board
DE4000056A1 (en) * 1989-04-21 1990-10-25 Transform Roentgen Matern Veb Modular assembly for high voltage transistor frequency changer - provides physical separation of power output, control module and pulse unit in minimum space
DE8909246U1 (en) * 1989-07-31 1989-09-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
EP0495470A2 (en) * 1991-01-17 1992-07-22 Firma Carl Zeiss Device for noise suppressing of a switched power unit
DE4124757A1 (en) * 1991-01-21 1992-07-30 Mitsubishi Electric Corp SEMICONDUCTOR DEVICE
DE9105035U1 (en) * 1991-04-24 1992-06-17 Siemens Ag, 8000 Muenchen, De
EP0519305A2 (en) * 1991-06-21 1992-12-23 Siemens Aktiengesellschaft Converter assembly
US5172310A (en) * 1991-07-10 1992-12-15 U.S. Windpower, Inc. Low impedance bus for power electronics
WO1993001648A1 (en) * 1991-07-10 1993-01-21 U.S. Windpower, Inc. Low impedance bus for power electronics
EP0533158A2 (en) * 1991-09-20 1993-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
US5170337A (en) * 1992-01-29 1992-12-08 General Electric Company Low-inductance package for multiple paralleled devices operating at high frequency
DE4222068C1 (en) * 1992-07-04 1993-06-09 Abb Patent Gmbh, 6800 Mannheim, De
DE4230510C1 (en) * 1992-09-11 1993-09-02 Gruendl Und Hoffmann Gesellschaft Fuer Elektrotechnische Entwicklungen Mbh, 82319 Starnberg, De
EP0590643A2 (en) * 1992-09-30 1994-04-06 Mitsubishi Denki Kabushiki Kaisha Large-current circuit board and method therefor

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19518479A1 (en) * 1995-05-19 1996-11-21 Thyssen Aufzuege Gmbh Power converter
DE19600367A1 (en) * 1996-01-08 1997-07-10 Abb Daimler Benz Transp Busbar system for the intermediate circuit of a converter
WO1999052148A1 (en) * 1998-04-03 1999-10-14 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
US6380728B1 (en) 1999-04-01 2002-04-30 Mannesmann Sachs Ag Bus bar for connecting electrical components with arrangement for measuring current and power electronics for controlling an electric machine
DE19914894A1 (en) * 1999-04-01 2000-10-26 Mannesmann Sachs Ag High power electronics power unit conductor rail connector having multi layered connection unit and conformal zone with current measurement mechanism connection.
DE19914894C2 (en) * 1999-04-01 2001-07-05 Mannesmann Sachs Ag Busbar for connecting electrical components
EP1120895A2 (en) 1999-12-20 2001-08-01 Murata Manufacturing Co., Ltd. Capacitor module for use in invertor, invertor, and capacitor module
EP1120895A3 (en) * 1999-12-20 2004-05-06 Murata Manufacturing Co., Ltd. Capacitor module for use in invertor, invertor, and capacitor module
FR2810154A1 (en) * 2000-06-07 2001-12-14 Murata Manufacturing Co INVERTER CAPACITOR MODULE AND INVERTER
US6459605B1 (en) 2000-08-11 2002-10-01 American Superconductor Corp. Low inductance transistor module with distributed bus
WO2002015651A2 (en) * 2000-08-11 2002-02-21 American Superconductor Corporation Low inductance transistor module with distributed bus
WO2002015651A3 (en) * 2000-08-11 2002-08-29 American Superconductor Corp Low inductance transistor module with distributed bus
WO2002028155A1 (en) * 2000-09-29 2002-04-04 American Superconductor Corporation Low-inductance connector for printed-circuit board
US6472613B1 (en) 2000-09-29 2002-10-29 American Superconductor Corporation Low-inductance connector for printed-circuit board
DE102005055608B3 (en) * 2005-11-22 2007-05-10 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with capacitors connected in parallel with each other
US9414532B2 (en) 2012-05-16 2016-08-09 Sagem Defense Securite Electronic power module arrangement
WO2013171136A1 (en) * 2012-05-16 2013-11-21 Sagem Defense Securite Electronic power module arrangement
WO2014210125A1 (en) * 2013-06-26 2014-12-31 Siemens Industry, Inc. Printed circuit board power cell
CN105794326A (en) * 2013-06-26 2016-07-20 西门子公司 Printed circuit board power cell
RU2641007C2 (en) * 2013-06-26 2018-01-15 Сименс Акциенгезелльшафт Power component on printed mounting board
CN105794326B (en) * 2013-06-26 2020-03-17 西门子公司 Power battery with printed circuit board
US11437922B2 (en) 2013-06-26 2022-09-06 Siemens Aktiengesellschaft Printed circuit board power cell
WO2022017715A1 (en) * 2020-07-22 2022-01-27 Robert Bosch Gmbh Emc filter having shielding

Similar Documents

Publication Publication Date Title
DE69518110D1 (en) Solder connection for converter head
DE69510877D1 (en) Carrier system for converters
BR9508162A (en) Copper conversion
NO982990L (en) Electrical converter cell
DE69533695D1 (en) BUS ARBITRATION PROCEDURE FOR TELECOMMUNICATION
DE59510873D1 (en) Connection and assembly technology for multichip modules
DE69711772T2 (en) Packing structure for multichip modules
DE9403108U1 (en) Low-inductance high-current busbar for converter modules
DE69310050T2 (en) Insert-shaped connection terminal for three-phase generator
NO963667D0 (en) Copper catalyst
DE69500870D1 (en) Socket clamp for high current
DE69316692T2 (en) Inverters for electrical equipment
DE69534189D1 (en) Power unit for vehicles
DE69713439D1 (en) Fastening structure for die holder
DE69504439T2 (en) Set for connecting low-voltage power cables
DE59706920D1 (en) Busbar system for the intermediate circuit of a converter
DE59708851D1 (en) Connection module for telecommunications technology
GB9413147D0 (en) Statical electrical converter arrangement
DE69514015D1 (en) Power conversion system
DE4480575T1 (en) Clamping device for roof-mounted load carriers
ITMI942111A0 (en) SWITCHBOARD FOR ELECTRICAL SYSTEMS
DE29505259U1 (en) Busbar support for low-voltage power distributors
DE9415876U1 (en) Insulation carrier for busbars
DE29517289U1 (en) Connection device for a low-voltage busbar
DE69524039T2 (en) Control device for power converter