EP0720224A1 - Method and device for fixing two elements such as an integrated circuit radiator to a printed circuit card - Google Patents

Method and device for fixing two elements such as an integrated circuit radiator to a printed circuit card Download PDF

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Publication number
EP0720224A1
EP0720224A1 EP95402901A EP95402901A EP0720224A1 EP 0720224 A1 EP0720224 A1 EP 0720224A1 EP 95402901 A EP95402901 A EP 95402901A EP 95402901 A EP95402901 A EP 95402901A EP 0720224 A1 EP0720224 A1 EP 0720224A1
Authority
EP
European Patent Office
Prior art keywords
force
fixing device
fixing
radiator
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95402901A
Other languages
German (de)
French (fr)
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EP0720224B1 (en
Inventor
Gérard Dehaine
Yves Stricot
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Bull SA
Original Assignee
Bull SA
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Filing date
Publication date
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Publication of EP0720224A1 publication Critical patent/EP0720224A1/en
Application granted granted Critical
Publication of EP0720224B1 publication Critical patent/EP0720224B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the subject of the invention is a method and a device for fixing two elements together, enclosing an electrical or electronic component to exert a contact force on the component.
  • the contact may be thermal and relate to the devices for removing the heat dissipated by the component, called radiators.
  • the invention therefore relates more particularly to devices for fixing a radiator to a connection card of this component.
  • the invention will be highlighted in the following text with reference, as an illustrative example, to the devices for fixing a finned radiator to a printed circuit board.
  • the invention has as corollary objects a radiator and a connection card.
  • the contact can also be electrical, one of the elements serving for example as a voltage supply electrode of the component.
  • the type of fixing device concerned by the invention must be adapted to a simple, effective, reliable and possibly removable fixing that can be of low cost.
  • the efficiency criteria mainly concern the contact force exerted on the component between the radiator and the card.
  • the contact force it is desired in many cases for the contact force to be easily adjustable to a substantially constant desired value.
  • the adjustment of the contact force can adapt to various types of components, determined for example by their thickness. It may still be desirable for the contact force to be insensitive to flatness defects of the radiator and / or of the card and / or of the component.
  • the contact force be independent of the thickness of the component within predetermined or reasonable limits.
  • Another important factor which may be requested in addition relates to the independence between the desired contact force of the radiator on the component and the desired fixing force of the card fixing device. Another factor which can intervene concerns the degree of sensitivity of the binding to the vibrations of the card.
  • the fixing device is adapted to the connection mode of the component. For example, if the component is an integrated circuit mounted on the card via conductive wires or tabs, the radiator fixing device must not modify or influence this assembly. Another important characteristic may relate to the availability of the fixing device on the radiator or on the card. It is indeed desirable that all the elements of the fixing are present on the radiator and / or on the card.
  • the fixing device will be suitable for large area radiators, such as radiators for housings of integrated circuits of high heat dissipation. Of all known radiators of this type, none fully meets all of these conditions.
  • the invention makes it possible to satisfy all or part of the above requirements, in a simple, efficient, reliable and possibly inexpensive manner and to apply more generally to two elements, at least one of which acts on an electrical or electronic component. a contact force of a thermal and / or electrical nature.
  • It relates to a method of fixing two elements enclosing an electrical or electronic component by means of a fixing device exerting a contact force on the component, characterized in that the fixing device exerts on a first of the two elements a force independent of the mounting of the two elements and in relation to said contact force.
  • the fixing device can exert said contact force substantially independently of the fixing force of the fixing device to the second element.
  • the invention also relates to the fixing device resulting directly from this process. More specifically, it relates to a device for fixing two elements enclosing an electrical or electronic component and exerting a contact force on the component, characterized in that the fixing device has means of coupling to a first of the two elements for exert on it a force independent of the mounting of the two elements and in relation to said contact force.
  • the invention more particularly has as a corollary object a radiator for cooling an electrical or electronic component, characterized in that it constitutes said first element provided with the fixing device defined above.
  • the invention also more particularly has as a corollary object a card for the connection of at least one electrical or electronic component, characterized in that it constitutes the first element provided with the fixing device defined above.
  • FIG. 1 represents a fixing device 10 between a printed circuit board 11 and a radiator 12 provided for cooling a component 13 intended to be mounted on the board 11. It has been assumed that the component 13 is already mounted on the card 11 and that this component is an integrated circuit provided with lugs 14 whose ends are connected to the card. The active face which carries the interconnection circuit of the integrated circuit 13 is placed opposite the corresponding face of the card 11. The radiator 12 is intended to come into contact against the opposite, non-active face of the circuit integrated 13, directly or via a well-known thermal interface. It will be assumed that the contact is made via an interface (not shown) in the form of a layer requiring a predetermined contact force Fc to obtain a predetermined thermal resistance.
  • the radiator 12 illustrated is in the form of a metal plate 15, for example made of aluminum and of square section, the face of which faces the integrated circuit 13 is provided with a sole 16 slightly raised and adapted to form a good thermal contact with the corresponding face of the integrated circuit.
  • the opposite face of the radiator 12 is provided with fins 17 embedded perpendicularly in the plate 15.
  • the fixing device 10 illustrated comprises four screws 18 passing through the plate 15 in holes 19 arranged at the four corners of the plate.
  • the head of each screw 18 is placed on the side of the fins 17 and has a larger section than the adjacent body so as to form a rim.
  • the fixing device 10 also comprises four helical springs 20.
  • Each helical spring 20 is placed coaxially with the screw and at its two ends resting respectively on the plate 15 and on the edge of the head of the screw 18.
  • each screw 18 is provided with a coupling means with the radiator, having in the illustrated example the form of a stop 21 constituted by the illustrated clip, engaged in a groove formed in the body of the screw at a predetermined distance from the screw head and identical for each screw.
  • each distance corresponds to a length L0 of each spring 20 between the screw head and the plate 15.
  • the body of each screw 18 ends in a threaded part placed below the clip 21.
  • the card 11 is provided with holes 22 intended for receiving the threaded ends of the corresponding screws 18.
  • the location of the holes 22 on the card determines the position of the radiator relative to the integrated circuit 13.
  • Each hole 22 is threaded and constitutes, in the example illustrated, the inner hole of a nut 23 fixed in a hole 24 of the card 11.
  • Each nut 23 has one end forming a rim serving as a stop against the opposite face of the card.
  • the radiator 12 is illustrated in its state outside of the card 11, for example in the state in which it was purchased.
  • the springs 20 are compressed so that the sum of the forces F0 that they exert between the heads of the screws 18 and the radiator 12 corresponds substantially to the predetermined contact force Fc of the radiator 12 against the integrated circuit 13.
  • the force F0 is therefore constantly applied to any desired value before mounting on the card.
  • the screws 18 of the radiator are also illustrated in correspondence with the holes 22 of the card 11. It therefore suffices to approach the radiator 12 of the card 11 in order to mount the radiator on the card.
  • FIGS. 2a and 2b illustrate steps of the method for fixing the radiator 12 to the card 11.
  • FIG. 2a represents an intermediate position of the fixing, in which the screws have been screwed into the holes 22 to bring the floor 16 of the radiator 12 with the non-active face of the integrated circuit 13. Up to this position, the clips 21 have remained in contact with the radiator. By continuing to screw, the force exerted by the springs 18 is transmitted to the integrated circuit 13 and the clips 21 begin to move away from the plate 15.
  • FIG. 2b illustrates the position where the clips 21 come into abutment with the card 11. Consequently, the screws 18 can be tightened until the desired fixing force Ff is obtained.
  • the length L0 of each spring 20 is that indicated in Figure 1 and kept in Figure 2a. Each spring 20 of length L0 exerts the force F0.
  • the contact force Fc of the radiator on the integrated circuit is equal to the sum of the four forces F1 exerted by the four springs 20.
  • the radiator 12 is provided for a type of component 13 having a predetermined non-negligible thickness W or varying slightly around this thickness.
  • the total force exerted by the fixing device 10 on the radiator 12 outside of its mounting on the card 11 can be different from the predetermined force Fc by a predetermined value, here corresponding to the thickness W.
  • This thickness can of course include other thicknesses than that of the component itself even. It can therefore be said that in general the fixing device 10 on the radiator 12 exerts a force independent of the mounting of the radiator on the card 11 and in relation to the contact force.
  • the predetermined contact force Fc can be a minimum force required to obtain a minimum thermal resistance.
  • obtaining any force F1 greater than F0 is favorable, since it will decrease the thermal resistance and improve the heat exchange.
  • the minimum force required may be very low and imprecise, so that those skilled in the art have a very wide range of values and that the contact force can be considered to be arbitrary, or included in a very wide range. range of possible values.
  • the attachment made according to the method and the device 10 of the invention is perfectly symmetrical.
  • the screws 18, the spring 20 and the stops 21 could just as easily be mounted on the card 11 at the level of the holes 22 on the face opposite to that placed opposite the radiator 12.
  • the screws 18 would then be fixed for example in the holes 19 of the radiator, or by any other means.
  • the fixing device 10 could generally include fastening means 18 other than the illustrated screws, which could for example be piles fixed by rotation in staples, or else flanges.
  • the springs 20 can also be blades, for example, and be incorporated or integrated into the attachment means 18, for example in the form of at least one elastic flange. In this case, the fixing device 10 merges with the attachment means and the spring means.
  • the method and the fixing device 10 of the invention can also be applied to any electrical or electronic heat dissipating component.
  • the contact can be thermal and / or electrical.
  • one of the elements can serve as an electrode or a potential plane for making contact with the non-active face of an integrated circuit with field effect transistors, for example of the MOS (Metal-Oxide-Semiconductor) type.
  • MOS Metal-Oxide-Semiconductor
  • the nuts 23 are connected to a potential plane, ground for example, and that the nuts, the screws and the radiator make an electrical connection with the non-active face of the integrated circuit to establish a both thermal and electrical contact.
  • the card 11 and the radiator 12 can therefore more generally be replaced by other elements enclosing a component by means of a fixing device 10 exerting a contact force on the component.
  • the invention relates to a method for fixing two elements 11, 12 enclosing an electrical or electronic component 13 by means of a fixing device 10 exerting a contact force Fc on the component, the fixing device exerting on a first 12 of the two elements a force F0 independent of the mounting of the two elements (fig. 1) and in relation to said contact force.
  • relation can be substantially equal, or provide for a determined thickness W of the component, or be arbitrary.
  • force exerted F0 can be predetermined or arbitrary.
  • An advantage of the invention can be obtained by firmly fixing the fixing device 10 to the card 11 constituting the second element in the example illustrated.
  • the radiator 12 is then well wedged in the desired position on the card 11 and insensitive to vibrations, the springs then serving to dampen the vibrations.
  • Another advantage can also be obtained by making the fixing device relatively independent of the first element 12 so that the contact force Fc is distributed uniformly over the component 13. It would suffice, for example, to widen the diameter of the holes 19 to make the radiator 12 floating relative to the screws 18 so as to allow it to better adjust to the contact surface presented by the component.
  • the fastening device 10 could then be insensitive to flatness defects of the radiator 12 and / or of the card 11 and / or of the component 13.
  • the corollary object of the invention is therefore a device 10 for fixing two elements 11, 12 enclosing an electrical or electronic component 13 and exerting a contact force Fc on the component via a first 12 of the two elements on which it exerts a force independent of the mounting of the two elements.
  • the fixing device can be arbitrary and can be applied to the radiator or to the card by means other than holes 19 and 22.
  • the independence between the force exerted by the fixing device and the fixing of the two elements can be obtained with coupling means of the fixing device with one of the elements, the radiator 12 in the example illustrated.
  • the fixing device comprises attachment means 18 coupled to spring means 20
  • the coupling means comprise first abutment means 21 against said first element.
  • the stop means 21 can be any.
  • the clips illustrated they could be constituted by a thin ring, secured to the body of the screw and of larger section.
  • each screw could be replaced by a non-threaded element.
  • each stop 21 could be a shoulder formed by a larger section of the screw body below the stop.
  • the stops 21 could also be adjustable to adjust the force F0 to a predetermined value.
  • the force exerted by the spring means 20 can be arbitrary, it can be adjusted to a predetermined value by adjusting the stop means 21, as described for example with reference to FIG. 3.
  • the stop means could therefore be adjustable so that I can make this adjustment, for example by replacing the clip with a nut of adjustable height.
  • the stops 21 allow the attachment means 18 to be fixed to the radiator 11 with a force independent of said contact force Fc.
  • the stops provided to make the fastening force Ff of the device 10 to the card 11 independent of the contact force Fc could be different from the stops 21.
  • the fixing force Ff described is completely independent of the contact force Fc, these two forces could be linked together.
  • the fixing force Ff could be determined by a spring linked to the screwing of each screw also conditioning the contact force Fc.
  • An advantage of the invention is to be able to take advantage of this link or to make these two forces Ff and Fc substantially independent, for example by putting as a stopper for determining the fixing force Ff a substantially conical washer and acting as a spring.
  • the invention also relates to an element 11 or 12 provided with the preceding device 10 for fixing this element to another element 12 or 11 and exerting a contact force Fc on an electrical or electronic component 13 enclosed between the two elements.
  • the invention therefore more particularly relates to a radiator 12 for cooling an electric or electronic component and comprising a fixing device, the radiator constituting the first element in the fixing device described previously.
  • the invention also more particularly relates to a card for the connection of at least one electrical or electronic component, the card constituting the first element provided with the fixing device 10 defined above.

Abstract

The connector includes a square aluminium plate (15) with lower pad (16) and upper protruding cooling fins (17). Each corner has a hole through which are place spring loaded (20) screws (18). There is a lower securing washer (21). The printed circuit board (PCB) (11) has a component (13) with outer connectors (14). Four nuts (23) are inset into the PCB base. The cooling section is lowered onto the PCB, and the screws tightened in the nuts. The mechanical spring spacing ensures a fixed mechanical force is applied to the component, ensuring good thermal conduction.

Description

Domaine techniqueTechnical area

L'invention a pour objets un procédé et un dispositif de fixation de deux éléments entre eux enserrant un composant électrique ou électronique pour exercer sur le composant une force de contact. Le contact peut être thermique et concerner les dispositifs d'évacuation de la chaleur dissipée par le composant, appelés radiateurs. L'invention se rapporte alors plus particulièrement aux dispositifs de fixation d'un radiateur à une carte de connexion de ce composant. L'invention sera bien mise en relief dans la suite du texte en se référant, comme exemple illustratif, aux dispositifs de fixation d'un radiateur à ailettes à une carte de circuits imprimés. Dans ce contexte, l'invention a pour objets corollaires un radiateur et une carte de connexion. Cependant, le contact peut aussi être électrique, l'un des éléments servant par exemple d'électrode d'alimentation en tension du composant.The subject of the invention is a method and a device for fixing two elements together, enclosing an electrical or electronic component to exert a contact force on the component. The contact may be thermal and relate to the devices for removing the heat dissipated by the component, called radiators. The invention therefore relates more particularly to devices for fixing a radiator to a connection card of this component. The invention will be highlighted in the following text with reference, as an illustrative example, to the devices for fixing a finned radiator to a printed circuit board. In this context, the invention has as corollary objects a radiator and a connection card. However, the contact can also be electrical, one of the elements serving for example as a voltage supply electrode of the component.

L'art antérieurThe prior art

On connaît déjà de nombreux dispositifs de fixation de radiateurs à une carte de circuits imprimés. Ils peuvent être classés en divers types selon leur adaptation à diverses contraintes. Le type de dispositif de fixation concerné par l'invention doit être adapté à une fixation amovible simple, efficace, fiable et pouvant être de faible coût. Les critères d'efficacité concernent principalement la force de contact exercée sur le composant entre le radiateur et la carte. De préférence, on souhaite dans de nombreux cas que la force de contact soit aisément ajustable à une valeur désirée sensiblement constante. Dans certains cas, il est aussi avantageux que l'ajustement de la force de contact puisse s'adapter à divers types de composants, déterminés par exemple par leur épaisseur. Il peut encore s'avérer souhaitable que la force de contact soit peu sensible aux défauts de planéité du radiateur et/ou de la carte et/ou du composant. Il peut même être demandé que la force de contact soit indépendante de l'épaisseur du composant dans des limites prédéterminées ou raisonnables. Un autre facteur important qui peut être demandé en plus concerne l'indépendance entre la force de contact désirée du radiateur sur le composant et la force de fixation désirée du dispositif de fixation à la carte. Un autre facteur qui peut intervenir concerne le degré de sensibilité de la fixation aux vibrations de la carte. Dans certains cas, il faut encore que le dispositif de fixation soit adapté au mode de connexion du composant. Par exemple, si le composant est un circuit intégré monté sur la carte par l'intermédiaire de fils ou pattes (leads) conducteurs, le dispositif de fixation du radiateur ne doit pas modifier ou influer sur ce montage. Une autre caractéristique importante peut concerner la disponibilité du dispositif de fixation sur le radiateur ou sur la carte. Il est en effet souhaitable que tous les éléments du dispositif de fixation soient présents sur le radiateur et/ou sur la carte. Ceci facilite la manipulation et la manoeuvre de fixation. Mais il ne faut pas que la présence de ces éléments puisse interférer avec la présence du composant ou de son montage sur la carte. De préférence aussi le dispositif de fixation conviendra aux radiateurs de grande surface, tels que les radiateurs pour boîtiers de circuits intégrés de haute dissipation thermique. Parmi tous les radiateurs connus de ce type, aucun ne satisfait pleinement à toutes ces conditions.Numerous devices are already known for fixing radiators to a printed circuit board. They can be classified into various types according to their adaptation to various constraints. The type of fixing device concerned by the invention must be adapted to a simple, effective, reliable and possibly removable fixing that can be of low cost. The efficiency criteria mainly concern the contact force exerted on the component between the radiator and the card. Preferably, it is desired in many cases for the contact force to be easily adjustable to a substantially constant desired value. In some cases, it is also advantageous that the adjustment of the contact force can adapt to various types of components, determined for example by their thickness. It may still be desirable for the contact force to be insensitive to flatness defects of the radiator and / or of the card and / or of the component. It may even be requested that the contact force be independent of the thickness of the component within predetermined or reasonable limits. Another important factor which may be requested in addition relates to the independence between the desired contact force of the radiator on the component and the desired fixing force of the card fixing device. Another factor which can intervene concerns the degree of sensitivity of the binding to the vibrations of the card. In some cases, it is still necessary that the fixing device is adapted to the connection mode of the component. For example, if the component is an integrated circuit mounted on the card via conductive wires or tabs, the radiator fixing device must not modify or influence this assembly. Another important characteristic may relate to the availability of the fixing device on the radiator or on the card. It is indeed desirable that all the elements of the fixing are present on the radiator and / or on the card. This facilitates handling and the fixing operation. However, the presence of these elements must not interfere with the presence of the component or of its mounting on the card. Preferably also the fixing device will be suitable for large area radiators, such as radiators for housings of integrated circuits of high heat dissipation. Of all known radiators of this type, none fully meets all of these conditions.

L'invention.The invention.

L'invention permet de satisfaire à tout ou partie des exigences précédentes, de façon simple, efficace, fiable, et pouvant être peu coûteuse et de s'appliquer plus généralement à deux éléments dont l'un au moins exerce sur un composant électrique ou électronique une force de contact de nature thermique et/ou électrique.The invention makes it possible to satisfy all or part of the above requirements, in a simple, efficient, reliable and possibly inexpensive manner and to apply more generally to two elements, at least one of which acts on an electrical or electronic component. a contact force of a thermal and / or electrical nature.

Elle a pour objet un procédé de fixation de deux éléments enserrant un composant électrique ou électronique au moyen d'un dispositif de fixation exerçant une force de contact sur le composant, caractérisé en ce que le dispositif de fixation exerce sur un premier des deux éléments une force indépendante du montage des deux éléments et en relation avec ladite force de contact.It relates to a method of fixing two elements enclosing an electrical or electronic component by means of a fixing device exerting a contact force on the component, characterized in that the fixing device exerts on a first of the two elements a force independent of the mounting of the two elements and in relation to said contact force.

Selon une autre caractéristique, le dispositif de fixation peut exercer ladite force de contact sensiblement indépendamment de la force de fixation du dispositif de fixation au second élément.According to another characteristic, the fixing device can exert said contact force substantially independently of the fixing force of the fixing device to the second element.

Il s'ensuit que l'invention a aussi pour objet le dispositif de fixation résultant directement de ce procédé. Plus spécialement, elle a pour objet un dispositif de fixation de deux éléments enserrant un composant électrique ou électronique et exerçant une force de contact sur le composant, caractérisé en ce que le dispositif de fixation a des moyens de couplage à un premier des deux éléments pour exercer sur lui une force indépendante du montage des deux éléments et en relation avec ladite force de contact.It follows that the invention also relates to the fixing device resulting directly from this process. More specifically, it relates to a device for fixing two elements enclosing an electrical or electronic component and exerting a contact force on the component, characterized in that the fixing device has means of coupling to a first of the two elements for exert on it a force independent of the mounting of the two elements and in relation to said contact force.

L'invention a plus particulièrement pour objet corollaire un radiateur pour le refroidissement d'un composant électrique ou électronique, caractérisé en ce qu'il constitue ledit premier élément pourvu du dispositif de fixation défini précédemment.The invention more particularly has as a corollary object a radiator for cooling an electrical or electronic component, characterized in that it constitutes said first element provided with the fixing device defined above.

L'invention a encore plus particulièrement pour objet corollaire une carte pour la connexion d'au moins un composant électrique ou électronique, caractérisée en ce qu'elle constitue le premier élément pourvu du dispositif de fixation défini précédemment.The invention also more particularly has as a corollary object a card for the connection of at least one electrical or electronic component, characterized in that it constitutes the first element provided with the fixing device defined above.

Les caractéristiques et avantages de l'invention ressortent de la description qui suit, donnée à titre d'exemple et faite en référence aux dessins annexés. Dans ces dessins :

  • la figure 1 est une vue en coupe schématique d'un dispositif conforme à l'invention pour la fixation d'un radiateur à une carte de connexion pourvu d'un circuit intégré à refroidir, illustrant le radiateur hors de la carte et en position pour son montage ultérieur sur la carte;
  • les figures 2a et 2b sont des vues semblables à celles de la figure 1, illustrant deux étapes principales du procédé de fixation conforme à l'invention ; et
  • la figure 3 est un graphe représentatif des variations de la force exercée par chaque ressort utilisé dans le dispositif de fixation représenté sur les figures 1, 2a et 2b en fonction de leur élongation et illustrant un mode de réglage de la force exercée par ces ressorts sur le radiateur.
The characteristics and advantages of the invention appear from the description which follows, given by way of example and made with reference to the accompanying drawings. In these drawings:
  • Figure 1 is a schematic sectional view of a device according to the invention for fixing a radiator to a connection card provided with an integrated circuit to cool, illustrating the radiator off the card and in position for its subsequent mounting on the card;
  • Figures 2a and 2b are views similar to those of Figure 1, illustrating two main steps of the fixing method according to the invention; and
  • FIG. 3 is a graph representative of the variations in the force exerted by each spring used in the fixing device shown in FIGS. 1, 2a and 2b as a function of their elongation and illustrating a mode of adjustment of the force exerted by these springs on the radiator.

La figure 1 représente un dispositif de fixation 10 entre une carte de circuits imprimés 11 et un radiateur 12 prévu pour le refroidissement d'un composant 13 destiné à être monté sur la carte 11. On a supposé que le composant 13 est déjà monté sur la carte 11 et que ce composant est un circuit intégré pourvu de pattes 14 dont les extrémités sont connectées à la carte. La face active qui porte le circuit d'interconnexion du circuit intégré 13 est placée en vis-à-vis de la face correspondante de la carte 11. Le radiateur 12 est destiné à venir en contact contre la face opposée, non active, du circuit intégré 13, directement ou par l'intermédiaire d'une interface thermique bien connue. On supposera que le contact se fait par l'intermédiaire d'une interface (non représentée) sous forme d'une couche nécessitant une force de contact Fc prédéterminée pour obtenir une résistance thermique prédéterminée. Le radiateur 12 illustré se présente sous la forme d'une plaque métallique 15, par exemple en aluminium et de section carrée, dont la face en vis-à-vis du circuit intégré 13 est pourvue d'une sole 16 légèrement surélevée et adaptée à former un bon contact thermique avec la face correspondante du circuit intégré. La face opposée du radiateur 12 est pourvue d'ailettes 17 encastrées perpendiculairement dans la plaque 15.FIG. 1 represents a fixing device 10 between a printed circuit board 11 and a radiator 12 provided for cooling a component 13 intended to be mounted on the board 11. It has been assumed that the component 13 is already mounted on the card 11 and that this component is an integrated circuit provided with lugs 14 whose ends are connected to the card. The active face which carries the interconnection circuit of the integrated circuit 13 is placed opposite the corresponding face of the card 11. The radiator 12 is intended to come into contact against the opposite, non-active face of the circuit integrated 13, directly or via a well-known thermal interface. It will be assumed that the contact is made via an interface (not shown) in the form of a layer requiring a predetermined contact force Fc to obtain a predetermined thermal resistance. The radiator 12 illustrated is in the form of a metal plate 15, for example made of aluminum and of square section, the face of which faces the integrated circuit 13 is provided with a sole 16 slightly raised and adapted to form a good thermal contact with the corresponding face of the integrated circuit. The opposite face of the radiator 12 is provided with fins 17 embedded perpendicularly in the plate 15.

Le dispositif de fixation 10 illustré comprend quatre vis 18 traversant la plaque 15 dans des trous 19 disposés aux quatre coins de la plaque. La tête de chaque vis 18 est placée du côté des ailettes 17 et a une section plus grande que le corps adjacent de façon à former un rebord. Le dispositif de fixation 10 comprend aussi quatre ressorts hélicoïdaux 20. Chaque ressort hélicoïdal 20 est placé coaxialement à la vis et a ses deux extrémités s'appuyant respectivement sur la plaque 15 et sur le rebord de la tête de la vis 18. De l'autre côté de la plaque 15, chaque vis 18 est pourvue d'un moyen de couplage avec le radiateur, ayant dans l'exemple illustré la forme d'une butée 21 constituée par le clip illustré, engagé dans une gorge ménagée dans le corps de la vis à une distance prédéterminée de la tête de vis et identique pour chaque vis. Cette distance correspond à une longueur L0 de chaque ressort 20 entre la tête de vis et la plaque 15. Le corps de chaque vis 18 se termine par une partie filetée placée en dessous du clip 21. La carte 11 est pourvue de trous 22 destinés à recevoir les extrémités filetées des vis correspondantes 18. L'emplacement des trous 22 sur la carte détermine la position du radiateur par rapport au circuit intégré 13. Chaque trou 22 est fileté et constitue, dans l'exemple illustré, le trou intérieur d'un écrou 23 fixé dans un trou 24 de la carte 11. Chaque écrou 23 a une extrémité formant un rebord servant de butée contre la face opposée de la carte.The fixing device 10 illustrated comprises four screws 18 passing through the plate 15 in holes 19 arranged at the four corners of the plate. The head of each screw 18 is placed on the side of the fins 17 and has a larger section than the adjacent body so as to form a rim. The fixing device 10 also comprises four helical springs 20. Each helical spring 20 is placed coaxially with the screw and at its two ends resting respectively on the plate 15 and on the edge of the head of the screw 18. From the other side of plate 15, each screw 18 is provided with a coupling means with the radiator, having in the illustrated example the form of a stop 21 constituted by the illustrated clip, engaged in a groove formed in the body of the screw at a predetermined distance from the screw head and identical for each screw. This distance corresponds to a length L0 of each spring 20 between the screw head and the plate 15. The body of each screw 18 ends in a threaded part placed below the clip 21. The card 11 is provided with holes 22 intended for receiving the threaded ends of the corresponding screws 18. The location of the holes 22 on the card determines the position of the radiator relative to the integrated circuit 13. Each hole 22 is threaded and constitutes, in the example illustrated, the inner hole of a nut 23 fixed in a hole 24 of the card 11. Each nut 23 has one end forming a rim serving as a stop against the opposite face of the card.

Dans la figure 1, le radiateur 12 est illustré dans son état hors de la carte 11, par exemple dans l'état où il a été acheté. Dans cet état, les ressorts 20 sont comprimés de façon que la somme des forces F0 qu'ils exercent entre les têtes des vis 18 et le radiateur 12 corresponde sensiblement à la force de contact Fc prédéterminée du radiateur 12 contre le circuit intégré 13. La force F0 est donc appliquée constamment à une valeur quelconque désirée avant son montage sur la carte. Dans la figure 1, les vis 18 du radiateur sont aussi illustrées en correspondance avec les trous 22 de la carte 11. Il suffit donc d'approcher le radiateur 12 de la carte 11 pour procéder au montage du radiateur sur la carte. Les figures 2a et 2b illustrent des étapes du procédé de fixation du radiateur 12 à la carte 11. La figure 2a représente une position intermédiaire de la fixation, dans laquelle les vis ont été vissées dans les trous 22 pour mettre en contact la sole 16 du radiateur 12 avec la face non active du circuit intégré 13. Jusqu'à cette position, les clips 21 sont restés en contact avec le radiateur. En continuant de visser, la force exercée par les ressorts 18 est transmise au circuit intégré 13 et les clips 21 commencent à s'écarter de la plaque 15. La figure 2b illustre la position où les clips 21 viennent en butée avec la carte 11. Dès lors, les vis 18 peuvent être serrées jusqu'à obtenir la force de fixation Ff désirée.In FIG. 1, the radiator 12 is illustrated in its state outside of the card 11, for example in the state in which it was purchased. In this state, the springs 20 are compressed so that the sum of the forces F0 that they exert between the heads of the screws 18 and the radiator 12 corresponds substantially to the predetermined contact force Fc of the radiator 12 against the integrated circuit 13. The force F0 is therefore constantly applied to any desired value before mounting on the card. In FIG. 1, the screws 18 of the radiator are also illustrated in correspondence with the holes 22 of the card 11. It therefore suffices to approach the radiator 12 of the card 11 in order to mount the radiator on the card. FIGS. 2a and 2b illustrate steps of the method for fixing the radiator 12 to the card 11. FIG. 2a represents an intermediate position of the fixing, in which the screws have been screwed into the holes 22 to bring the floor 16 of the radiator 12 with the non-active face of the integrated circuit 13. Up to this position, the clips 21 have remained in contact with the radiator. By continuing to screw, the force exerted by the springs 18 is transmitted to the integrated circuit 13 and the clips 21 begin to move away from the plate 15. FIG. 2b illustrates the position where the clips 21 come into abutment with the card 11. Consequently, the screws 18 can be tightened until the desired fixing force Ff is obtained.

La figure 3 est un graphe illustrant les variations de la force F exercée par chaque ressort 20 en fonction de la longueur L du ressort entre ses deux extrémités. On a supposé que la force F varie linéairement en fonction inversement proportionnelle de sa longueur, depuis sa longueur maximale LM à l'état non comprimé (F = 0) et sa longueur minimale Lm quand il est complètement comprimé et exerce la force maximale FM. La longueur L0 de chaque ressort 20 est celle indiquée dans la figure 1 et conservée dans la figure 2a. Chaque ressort 20 de longueur L0 exerce la force F0. Le serrage de chaque vis 18 entre la position intermédiaire de la figure 2a et la position finale de la figure 2b se fait sur une longueur d qui comprime le ressort 20 de cette longueur, de sorte que sa longueur finale dans la position illustrée dans la figure 2b est L1 = L0 - d et exerce la force finale F1. Dans la position finale, la force de contact Fc du radiateur sur le circuit intégré est égale à la somme des quatre forces F1 exercée par les quatre ressorts 20.FIG. 3 is a graph illustrating the variations of the force F exerted by each spring 20 as a function of the length L of the spring between its two ends. It has been assumed that the force F varies linearly as an inversely proportional function of its length, from its maximum length LM in the uncompressed state (F = 0) and its minimum length Lm when it is fully compressed and exerts the maximum force FM. The length L0 of each spring 20 is that indicated in Figure 1 and kept in Figure 2a. Each spring 20 of length L0 exerts the force F0. The tightening of each screw 18 between the position intermediate of Figure 2a and the final position of Figure 2b is on a length d which compresses the spring 20 of this length, so that its final length in the position illustrated in Figure 2b is L1 = L0 - d and exerts the final force F1. In the final position, the contact force Fc of the radiator on the integrated circuit is equal to the sum of the four forces F1 exerted by the four springs 20.

Plusieurs cas sont possibles. Si, comme dans l'exemple représenté par le graphe de la figure 3, la compression initiale LM - L0 pour amener le ressort 20 de son état libre à l'état comprimé indiqué à la figure 1 est sensiblement plus grande que la distance d (LM - L0 >> d), alors on peut considérer que la variation d se traduira par une variation faible ou négligeable de la force F0. Dans ces conditions, on peut considérer que la force finale F1 correspondant au quart de la force de contact prédéterminée Fc est sensiblement égale à la force F0. On peut donc dire que l'ensemble des ressorts exerce initialement, quand le radiateur n'est pas monté sur la carte comme indiqué dans la figure 1, une force 4F0 sensiblement égale à la force de contact prédéterminée Fc.Several cases are possible. If, as in the example represented by the graph in FIG. 3, the initial compression LM - L0 to bring the spring 20 from its free state to the compressed state indicated in FIG. 1 is substantially greater than the distance d ( LM - L0 >> d), then we can consider that the variation d will result in a small or negligible variation of the force F0. Under these conditions, it can be considered that the final force F1 corresponding to a quarter of the predetermined contact force Fc is substantially equal to the force F0. It can therefore be said that all of the springs initially exert, when the radiator is not mounted on the card as indicated in FIG. 1, a force 4F0 substantially equal to the predetermined contact force Fc.

Selon un autre exemple non illustré, le radiateur 12 est prévu pour un type de composant 13 ayant une épaisseur W non négligeable prédéterminée ou variant légèrement autour de cette épaisseur. Par exemple, le composant 13 peut être un boîtier de circuit intégré d'un type déterminé. On sait alors que chaque ressort aura sensiblement une longueur finale L1 = L0 - W. Par conséquent, les ressorts 20 seront initialement comprimés à la longueur L0 = L1 + W. Dans ce cas, la force totale exercée par le dispositif de fixation 10 sur le radiateur 12 en dehors de son montage sur la carte 11 peut être différente de la force prédéterminée Fc d'une valeur prédéterminée, ici correspondant à l'épaisseur W. Cette épaisseur peut bien sûr inclure d'autres épaisseurs que celle du composant lui-même. On peut donc dire que d'une manière générale le dispositif de fixation 10 sur le radiateur 12 exerce une force indépendante du montage du radiateur sur la carte 11 et en relation avec la force de contact.According to another example not shown, the radiator 12 is provided for a type of component 13 having a predetermined non-negligible thickness W or varying slightly around this thickness. For example, the component 13 can be an integrated circuit package of a determined type. It is then known that each spring will have substantially a final length L1 = L0 - W. Consequently, the springs 20 will initially be compressed to the length L0 = L1 + W. In this case, the total force exerted by the fixing device 10 on the radiator 12 outside of its mounting on the card 11 can be different from the predetermined force Fc by a predetermined value, here corresponding to the thickness W. This thickness can of course include other thicknesses than that of the component itself even. It can therefore be said that in general the fixing device 10 on the radiator 12 exerts a force independent of the mounting of the radiator on the card 11 and in relation to the contact force.

Le fait que dans l'exemple illustré la force F0 est prédéterminée est un cas particulier. Ainsi, selon un autre exemple qui peut être aussi celui illustré, la force de contact prédéterminée Fc peut être une force minimale requise pour obtenir une résistance thermique minimale. Dans ce cas, l'obtention d'une force F1 quelconque supérieure à F0 est favorable, puisqu'elle diminuera la résistance thermique et améliorera l'échange thermique. Dans certains cas, la force minimale requise peut être très basse et imprécise, de sorte que l'homme du métier dispose d'une marge de valeurs très grande et que la force de contact peut être considérée comme quelconque, ou comprise dans une très large gamme de valeurs possibles.The fact that in the example illustrated the force F0 is predetermined is a special case. Thus, according to another example which can also be that illustrated, the predetermined contact force Fc can be a minimum force required to obtain a minimum thermal resistance. In this case, obtaining any force F1 greater than F0 is favorable, since it will decrease the thermal resistance and improve the heat exchange. In some cases, the minimum force required may be very low and imprecise, so that those skilled in the art have a very wide range of values and that the contact force can be considered to be arbitrary, or included in a very wide range. range of possible values.

D'autre part, la description qui précède fait bien ressortir que la fixation faite selon le procédé et le dispositif 10 de l'invention est parfaitement symétrique. Les vis 18, le ressort 20 et les butées 21 pourraient aussi bien être montés sur la carte 11 au niveau des trous 22 de la face opposée à celle placée vis-à-vis du radiateur 12. Les vis 18 seraient alors fixées par exemple dans les trous 19 du radiateur, ou par tout autre moyen. Ceci fait aussi apparaître que le dispositif de fixation 10 pourrait d'une manière générale inclure des moyens d'attache 18 autres que les vis illustrées, qui pourraient par exemple être des pieux fixés par rotation dans des agrafes, ou bien des brides. Les ressorts 20 peuvent aussi être des lames, par exemple, et être incorporés ou intégrés aux moyens d'attache 18, par exemple sous la forme d'au moins une bride élastique. Dans ce cas, le dispositif de fixation 10 se confond avec les moyens d'attache et les moyens à ressort.On the other hand, the above description clearly shows that the attachment made according to the method and the device 10 of the invention is perfectly symmetrical. The screws 18, the spring 20 and the stops 21 could just as easily be mounted on the card 11 at the level of the holes 22 on the face opposite to that placed opposite the radiator 12. The screws 18 would then be fixed for example in the holes 19 of the radiator, or by any other means. This also shows that the fixing device 10 could generally include fastening means 18 other than the illustrated screws, which could for example be piles fixed by rotation in staples, or else flanges. The springs 20 can also be blades, for example, and be incorporated or integrated into the attachment means 18, for example in the form of at least one elastic flange. In this case, the fixing device 10 merges with the attachment means and the spring means.

Par ailleurs, le procédé et le dispositif de fixation 10 de l'invention peuvent aussi bien s'appliquer à tout composant électrique ou électronique dissipatif de chaleur. Il est évident aussi que le contact peut être thermique et/ou électrique. Par exemple, l'un des éléments peut servir d'électrode ou de plan de potentiel pour faire contact avec la face non active d'un circuit intégré à transistors à effet de champ, par exemple de type MOS (Métal-Oxyde-Semiconducteur). Dans l'exemple illustré, il suffirait que les écrous 23 soient connectés à un plan de potentiel, la masse par exemple, et que les écrous, les vis et le radiateur fasse une liaison électrique avec la face non active du circuit intégré pour établir un contact à la fois thermique et électrique. La carte 11 et le radiateur 12 peuvent donc être plus généralement remplacés par d'autres éléments enserrant un composant au moyen d'un dispositif de fixation 10 exerçant une force de contact sur le composant.Furthermore, the method and the fixing device 10 of the invention can also be applied to any electrical or electronic heat dissipating component. It is also obvious that the contact can be thermal and / or electrical. For example, one of the elements can serve as an electrode or a potential plane for making contact with the non-active face of an integrated circuit with field effect transistors, for example of the MOS (Metal-Oxide-Semiconductor) type. . In the example illustrated, it would suffice that the nuts 23 are connected to a potential plane, ground for example, and that the nuts, the screws and the radiator make an electrical connection with the non-active face of the integrated circuit to establish a both thermal and electrical contact. The card 11 and the radiator 12 can therefore more generally be replaced by other elements enclosing a component by means of a fixing device 10 exerting a contact force on the component.

D'une manière générale, on peut donc dire que l'invention a pour objet un procédé de fixation de deux éléments 11, 12 enserrant un composant électrique ou électronique 13 au moyen d'un dispositif de fixation 10 exerçant une force de contact Fc sur le composant, le dispositif de fixation exerçant sur un premier 12 des deux éléments une force F0 indépendante du montage des deux éléments (fig. 1) et en relation avec ladite force de contact.In general, it can therefore be said that the invention relates to a method for fixing two elements 11, 12 enclosing an electrical or electronic component 13 by means of a fixing device 10 exerting a contact force Fc on the component, the fixing device exerting on a first 12 of the two elements a force F0 independent of the mounting of the two elements (fig. 1) and in relation to said contact force.

On a vu que la relation peut être sensiblement une égalité, ou prévoir une épaisseur W déterminée du composant, ou être quelconque. On a vu aussi que la force exercée F0 peut être prédéterminée ou quelconque.We have seen that the relation can be substantially equal, or provide for a determined thickness W of the component, or be arbitrary. We have also seen that the force exerted F0 can be predetermined or arbitrary.

Il est aussi remarquable dans le procédé décrit en référence aux figures 2a et 2b que le dispositif de fixation 10 exerce la force de contact Fc sensiblement indépendamment de la force de fixation Ff du dispositif de fixation au second élément 11.It is also remarkable in the method described with reference to FIGS. 2a and 2b that the fixing device 10 exerts the contact force Fc substantially independently of the fixing force Ff of the fixing device to the second element 11.

Un avantage de l'invention peut être obtenu en fixant fermement le dispositif de fixation 10 à la carte 11 constituant le second élément dans l'exemple illustré. Le radiateur 12 est alors bien calé dans la position désirée sur la carte 11 et peu sensible aux vibrations, les ressorts servant alors à amortir les vibrations.An advantage of the invention can be obtained by firmly fixing the fixing device 10 to the card 11 constituting the second element in the example illustrated. The radiator 12 is then well wedged in the desired position on the card 11 and insensitive to vibrations, the springs then serving to dampen the vibrations.

Un autre avantage peut encore être obtenu en rendant le dispositif de fixation relativement indépendant du premier élément 12 de façon que la force de contact Fc soit répartie uniformément sur le composant 13. Il suffirait par exemple d'élargir le diamètre des trous 19 pour rendre le radiateur 12 flottant par rapport aux vis 18 de manière à lui permettre de mieux s'ajuster à la surface de contact présentée par le composant. Le dispositif de fixation 10 pourrait alors être peu sensible aux défauts de planéité du radiateur 12 et/ou de la carte 11 et/ou du composant 13.Another advantage can also be obtained by making the fixing device relatively independent of the first element 12 so that the contact force Fc is distributed uniformly over the component 13. It would suffice, for example, to widen the diameter of the holes 19 to make the radiator 12 floating relative to the screws 18 so as to allow it to better adjust to the contact surface presented by the component. The fastening device 10 could then be insensitive to flatness defects of the radiator 12 and / or of the card 11 and / or of the component 13.

L'invention a donc pour objet corollaire un dispositif de fixation 10 de deux éléments 11, 12 enserrant un composant électrique ou électronique 13 et exerçant une force de contact Fc sur le composant par l'intermédiaire d'un premier 12 des deux éléments sur lequel il exerce une force indépendante du montage des deux éléments.The corollary object of the invention is therefore a device 10 for fixing two elements 11, 12 enclosing an electrical or electronic component 13 and exerting a contact force Fc on the component via a first 12 of the two elements on which it exerts a force independent of the mounting of the two elements.

On a vu que le dispositif de fixation peut être quelconque et s'appliquer sur le radiateur ou sur la carte par des moyens autres que les trous 19 et 22. L'indépendance entre la force exercée par le dispositif de fixation et la fixation des deux éléments peut être obtenue avec des moyens de couplage du dispositif de fixation avec l'un des éléments, le radiateur 12 dans l'exemple illustré. Dans le cas particulier ayant servi d'exemple où le dispositif de fixation comprend des moyens d'attache 18 couplés à des moyens à ressort 20, les moyens de couplage comprennent des premiers moyens de butée 21 contre ledit premier élément. Il est évident que les moyens de butée 21 peuvent être quelconques. Par exemple, au lieu des clips illustrés, ils pourraient être constitués par une bague de faible épaisseur, solidaire du corps de la vis et de plus grande section. Dans ce cas, le passage dans les trous 19 du radiateur pourrait se faire en rendant la tête de vis amovible, par exemple en la vissant dans le corps de la vis ou en remplaçant la tête de la vis par une rondelle ou un clip. Dans ce dernier cas, on comprend que chaque vis pourrait être remplacée par un élément non fileté. Selon une autre variante, chaque butée 21 pourrait être un épaulement formé par une section plus grande du corps de vis en dessous de la butée. Les butées 21 pourraient aussi être réglables pour ajuster la force F0 à une valeur prédéterminée. Bien que la force exercée par les moyens à ressort 20 puisse être quelconque, elle peut être ajustée à une valeur prédéterminée en réglant les moyens de butée 21, comme décrit par exemple en référence à la figure 3. Les moyens de butée pourraient donc être réglables de façon à pouvoir faire cet ajustement, par exemple en remplaçant le clip par un écrou de hauteur réglable.We have seen that the fixing device can be arbitrary and can be applied to the radiator or to the card by means other than holes 19 and 22. The independence between the force exerted by the fixing device and the fixing of the two elements can be obtained with coupling means of the fixing device with one of the elements, the radiator 12 in the example illustrated. In the particular case having served as an example where the fixing device comprises attachment means 18 coupled to spring means 20, the coupling means comprise first abutment means 21 against said first element. It is obvious that the stop means 21 can be any. For example, instead of the clips illustrated, they could be constituted by a thin ring, secured to the body of the screw and of larger section. In this case, the passage in the holes 19 of the radiator could be done by making the screw head removable, for example by screwing it into the body of the screw or by replacing the head of the screw with a washer or a clip. In the latter case, it is understood that each screw could be replaced by a non-threaded element. According to another variant, each stop 21 could be a shoulder formed by a larger section of the screw body below the stop. The stops 21 could also be adjustable to adjust the force F0 to a predetermined value. Although the force exerted by the spring means 20 can be arbitrary, it can be adjusted to a predetermined value by adjusting the stop means 21, as described for example with reference to FIG. 3. The stop means could therefore be adjustable so that I can make this adjustment, for example by replacing the clip with a nut of adjustable height.

En référence aux figures 2a et 2b, on a vu que les butées 21 permettent de fixer les moyens d'attache 18 au radiateur 11 avec une force indépendante de ladite force de contact Fc. Cependant, ces figures font bien ressortir que les butées prévues pour rendre la force de fixation Ff du dispositif 10 à la carte 11 indépendante de la force de contact Fc pourraient être différentes des butées 21. Ce pourrait être par exemple d'autres clips placés plus bas, fixement ou de façon réglable, ou bien un épaulement solidaire d'une partie de vis de plus forte section, dont la hauteur pourrait être choisie de façon que l'épaulement supérieur joue le rôle des butées 21 relatives au radiateur 12. Bien que la force de fixation Ff décrite est totalement indépendante de la force de contact Fc, ces deux forces pourraient être liées entre elles. Par exemple, la force de fixation Ff pourrait être déterminée par un ressort lié au vissage de chaque vis conditionnant aussi la force de contact Fc. Un avantage de l'invention est de pouvoir profiter de ce lien ou de rendre ces deux forces Ff et Fc sensiblement indépendantes, par exemple en mettant comme butée de détermination de la force de fixation Ff une rondelle sensiblement conique et jouant le rôle de ressort.With reference to FIGS. 2a and 2b, it has been seen that the stops 21 allow the attachment means 18 to be fixed to the radiator 11 with a force independent of said contact force Fc. However, these figures clearly show that the stops provided to make the fastening force Ff of the device 10 to the card 11 independent of the contact force Fc could be different from the stops 21. This could for example be other clips placed more bottom, fixedly or in an adjustable manner, or else a shoulder integral with a portion of screws of larger section, the height of which could be chosen so that the upper shoulder acts as stops 21 relating to the radiator 12. Although the fixing force Ff described is completely independent of the contact force Fc, these two forces could be linked together. For example, the fixing force Ff could be determined by a spring linked to the screwing of each screw also conditioning the contact force Fc. An advantage of the invention is to be able to take advantage of this link or to make these two forces Ff and Fc substantially independent, for example by putting as a stopper for determining the fixing force Ff a substantially conical washer and acting as a spring.

Il en résulte que l'invention a pour aussi pour objet un élément 11 ou 12 pourvu du dispositif précédent 10 pour la fixation de cet élément à un autre élément 12 ou 11 et exercer une force de contact Fc sur un composant électrique ou électronique 13 enserré entre les deux éléments.It follows that the invention also relates to an element 11 or 12 provided with the preceding device 10 for fixing this element to another element 12 or 11 and exerting a contact force Fc on an electrical or electronic component 13 enclosed between the two elements.

En se référant à l'exemple illustré, l'invention a donc plus particulièrement pour objet un radiateur 12 pour le refroidissement d'un composant électrique ou électronique et comprenant un dispositif de fixation, le radiateur constituant le premier élément dans le dispositif de fixation décrit précédemment.Referring to the example illustrated, the invention therefore more particularly relates to a radiator 12 for cooling an electric or electronic component and comprising a fixing device, the radiator constituting the first element in the fixing device described previously.

Réciproquement, l'invention a aussi plus particulièrement pour objet une carte pour la connexion d'au moins un composant électrique ou électronique, la carte constituant le premier élément pourvu du dispositif de fixation 10 défini précédemment.Reciprocally, the invention also more particularly relates to a card for the connection of at least one electrical or electronic component, the card constituting the first element provided with the fixing device 10 defined above.

Claims (10)

Procédé de fixation de deux éléments (11, 12) enserrant un composant électrique ou électronique (13) au moyen d'un dispositif de fixation (10) exerçant une force de contact (Fc) sur le composant, caractérisé en ce que le dispositif de fixation exerce sur un premier (12) des deux éléments une force (F0) indépendante du montage des deux éléments et en relation avec ladite force de contact.Method for fixing two elements (11, 12) enclosing an electrical or electronic component (13) by means of a fixing device (10) exerting a contact force (Fc) on the component, characterized in that the device fixing exerts on a first (12) of the two elements a force (F0) independent of the mounting of the two elements and in relation to said contact force. Procédé selon la revendication 1, caractérisé en ce que le dispositif de fixation exerce ladite force de contact sensiblement indépendamment de la force de fixation (Ff) du dispositif de fixation au second élément.Method according to claim 1, characterized in that the fixing device exerts said contact force substantially independently of the fixing force (Ff) of the fixing device to the second element. Procédé selon la revendication 1 ou 2, caractérisé en ce qu'il consiste à fixer fermement le dispositif de fixation au second élément.Method according to claim 1 or 2, characterized in that it consists in firmly fixing the fixing device to the second element. Procédé selon la revendication 3, caractérisé en ce qu'il consiste à rendre le dispositif de fixation relativement indépendant du premier élément de façon que ladite force de contact soit répartie uniformément sur le composant.Method according to claim 3, characterized in that it consists in making the fixing device relatively independent of the first element so that said contact force is distributed uniformly over the component. Dispositif de fixation (10) de deux éléments (11, 12) enserrant un composant électrique ou électronique (13) et exerçant une force de contact (Fc) sur le composant, caractérisé en ce que le dispositif de fixation a des moyens de couplage (21) à un premier (12) des deux éléments pour exercer une force indépendante du montage des deux éléments et en relation avec ladite force de contact.Fixing device (10) for two elements (11, 12) enclosing an electrical or electronic component (13) and exerting a contact force (Fc) on the component, characterized in that the fixing device has coupling means ( 21) to a first (12) of the two elements to exert a force independent of the mounting of the two elements and in relation to said contact force. Dispositif selon la revendication 5, caractérisé en ce que le dispositif de fixation comprenant des moyens d'attache (18) couplés à des moyens à ressort (20), les moyens de couplage (21) comprennent des premiers moyens de butée contre ledit premier élément (12).Device according to claim 5, characterized in that the fixing device comprising attachment means (18) coupled to spring means (20), the coupling means (21) comprise first abutment means against said first element (12). Dispositif selon la revendication 5 ou 6, caractérisé en ce que les moyens d'attache comprennent des seconds moyens de butée (21) permettant de fixer les moyens d'attache au second élément avec une force (Ff) sensiblement indépendante de ladite force de contact.Device according to claim 5 or 6, characterized in that the attachment means comprise second stop means (21) making it possible to fix the attachment means to the second element with a force (Ff) substantially independent of said contact force . Dispositif selon l'une des revendications 5 à 7, caractérisé en ce que les premiers et seconds moyens de butée sont confondus.Device according to one of claims 5 to 7, characterized in that the first and second stop means are combined. Radiateur (12) pour le refroidissement d'un composant électrique ou électronique, caractérisé en ce qu'il constitue ledit premier élément pourvu du dispositif de fixation défini par l'une des revendications 5 à 8.Radiator (12) for cooling an electrical or electronic component, characterized in that it constitutes said first element provided with the fixing device defined by one of claims 5 to 8. Carte (11) pour la connexion d'au moins un composant électrique ou électronique, caractérisée en ce qu'elle constitue le premier élément pourvu du dispositif de fixation défini par l'une des revendications 5 à 8.Card (11) for the connection of at least one electrical or electronic component, characterized in that it constitutes the first element provided with the fixing device defined by one of claims 5 to 8.
EP95402901A 1994-12-29 1995-12-21 Method and device for fixing two elements such as an integrated circuit radiator to a printed circuit card Expired - Lifetime EP0720224B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9415886 1994-12-29
FR9415886A FR2729045B1 (en) 1994-12-29 1994-12-29 METHOD AND DEVICE FOR FIXING TWO ELEMENTS SUCH AS AN INTEGRATED CIRCUIT RADIATOR IN A PRINTED CIRCUIT BOARD

Publications (2)

Publication Number Publication Date
EP0720224A1 true EP0720224A1 (en) 1996-07-03
EP0720224B1 EP0720224B1 (en) 2007-11-28

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Application Number Title Priority Date Filing Date
EP95402901A Expired - Lifetime EP0720224B1 (en) 1994-12-29 1995-12-21 Method and device for fixing two elements such as an integrated circuit radiator to a printed circuit card

Country Status (6)

Country Link
US (1) US5901039A (en)
EP (1) EP0720224B1 (en)
JP (1) JP3054351B2 (en)
KR (1) KR100242487B1 (en)
DE (1) DE69535656T2 (en)
FR (1) FR2729045B1 (en)

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Also Published As

Publication number Publication date
DE69535656D1 (en) 2008-01-10
FR2729045B1 (en) 1997-01-24
JPH08247117A (en) 1996-09-24
FR2729045A1 (en) 1996-07-05
DE69535656T2 (en) 2008-10-30
KR100242487B1 (en) 2000-02-01
EP0720224B1 (en) 2007-11-28
US5901039A (en) 1999-05-04
KR960028748A (en) 1996-07-22
JP3054351B2 (en) 2000-06-19

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