EP1357571A1 - Microelectromechanical system and its method of manufacture - Google Patents

Abstract

The micro-electromechanical system has a substrate (S) and a pair of micro-elements (1,2) having facing surfaces (3a,4a) generated via a structuring method with a minimum separation characteristic. One of the micro-elements is bistable and is switched into a second bistable state in which the separation of the surfaces is less than the minimum separation characteristic. An Independent claim for a manufacturing method for a micro-electromechanical system is also included.

Description

Technical field

• auf ein Mikro-elektromechanisches System gemäss dem Oberbegriff des Patentanspruches 1 sowie
• auf ein Verfahren zur Herstellung eines mikro-elektromechanischen Systems gemäss dem Oberbegriff des Patentanspruches 21.

The invention relates to the field of micro-electromechanical systems, in particular

• to a micro-electromechanical system according to the preamble of claim 1 and
• to a method for producing a micro-electromechanical system according to the preamble of claim 21.

State of the art

Such a, forming the preamble of claims 1 and 21 micro-electro-mechanical system (micro electro-mechanical system, MEMS) and a corresponding method are, for example, out DE 198 00 189 A1 known. A micromechanical switch is described there, which is a flat carrier substrate, one on the carrier substrate fixed contact piece, a movable electrode and a fixed to the Carrier substrate connected includes the counter electrode. The movable electrode has a free end and a fixed one connected to the carrier substrate The End. The movable electrode and the counter electrode face each other Surfaces on. By electrostatic attraction between the movable electrode can face these mutually facing surfaces bent in such a way that it is elastically deformed so that the free end of the movable electrode of the counter electrode and thereby also approach the contact piece until there is contact between the free end the movable electrode and the contact piece. The movement of the The free end of the movable electrode is lateral, that is parallel to the flat carrier substrate.

The electrostatic forces of attraction between the facing one another Surfaces of the movable electrode and the counter electrode is through applying a voltage between the movable electrode and the Counter electrode generated. A short circuit, that is an electrical one Contact between the movable electrode and the counter electrode To avoid, stoppers are inserted in the counter electrode, which over the protrude the surface of the counter electrode facing the movable electrode and are not at the same potential as the counter electrode. Springs can also be provided for the same purpose, on which the Counter electrode facing away from the movable electrode attached and the movement of the movable electrode in the direction of the counter electrode limit. In addition, the the surface of the movable electrode facing the counter electrode be provided with an electrically insulating layer.

The electrostatic attraction force F between two parallel surfaces of the surface A at a distance d when a switching voltage U is applied between the two surfaces is given by F = ε 0 · A · U 2 / ( 2d 2 )

The force therefore increases linearly with the surface, quadratically with the tension and inversely proportional to the square of the distance.

The microsystem disclosed in the aforementioned DE 198 00 189 A1 has been published under Use of a silicon deep etching process generated from the carrier substrate. After applying a mask to the carrier substrate at the points where the mask is open, material is etched out of the carrier substrate. The resulting trenches or etching channels, at least have a minimum width characteristic of the etching process.

In order to achieve mobility of the free end of the movable electrode, a sacrificial layer process is used, the free end of the movable Separates the electrode from the carrier substrate. For this, one is in the carrier substrate below the moving parts of the micromechanical switch arranged sacrificial layer selectively removed by an etching process, wherein the sacrificial layer at locations where a connection to the substrate is desired is, as on the counter electrode, the fixed contact piece and the fixed end of the movable electrode.

DE 42 05 029 C1 shows an electrostatically operated micro-electromechanical Relay that works horizontally. That means the switching movement this relay runs essentially perpendicular to a carrier substrate. A tongue-shaped electrode with a contact piece is made from a silicon substrate etched. The substrate is then placed on a counter substrate a counter electrode and a counter contact applied that the electrode includes a wedge-shaped gap with the counter electrode. By Applying a switching voltage between the electrode and the counter electrode these can be moved towards each other, creating an electrically conductive Connection between contact and counter contact can be achieved. Size Contact forces can be achieved through relatively wide electrodes.

In DE 197 36 674 C1 there is also a micro-electromechanical relay and discloses a process for its manufacture that operates horizontally. On Movable contact is on an anchor tongue attached to a substrate on one side attached, which is curved away from the substrate at rest. This contact with one acts to generate a high contact force Fixed contact together, which also bends away from the substrate Spring tongue is attached. The curvature of the contacts is caused by the application of a tension layer on both contacts. The achievement of a high reproducibility of a curvature produced in this way the contacts and thus the contact spacing in idle state (open) is not easy to manufacture.

In US 5'638'946 and US 6'057'520 are further horizontally operating MEMS Switch described.

J. Qiu et al., "A Centrally-Clamped Parallel-Beam Bistable MEMS Mechanism", Proc. of MEMS 2001, Interlaken, Switzerland, Jan. 20-22, 2001, shows a bistable switchable micro-electromechanical mechanism. This exists from two parallel spring tongues or membranes suspended on both sides, which describe a cosine course. In the middle are the spring tongues bonded together and at their ends they are on a carrier substrate set. This bistable micro-element is etched using ion depth and sacrificial layer technology generated from the silicon carrier substrate, so that the spring tongues are laterally movable and two stable states be demonstrated. By applying a perpendicular to the spring tongues and the force directed parallel to the carrier substrate is the bistable Mechanism between the two stable states back and forth switchable, the respective end position mirroring the starting position finally reached independently by snapping the mechanism becomes. On the one hand elastic mobility and on the other mechanical The 3 mm long spring tongues ensure the stability of the micro element only 10 µm to 20 µm wide, but 480 µm high.

Other laterally movable micro-electromechanical mechanisms are in M. Taher, A. Saif, "On a Tunable Bistable MEMS - Theory and Experiment", Journal of Microelectromechanical Systems, Vol. 9, 157-170 (June 2000).

In US 5'677'823 is an electrostatically switchable bistable memory element reveals which works horizontally. An essentially parallel to one Carrier-oriented, bridge-like movable contact is above arranged by a fixed contact firmly connected to the carrier substrate. At both ends is the movable contact on the carrier substrate fixed while being in the middle of the carrier substrate arched away (first stable position) or in the direction of the carrier substrate is arched (second stable position). Touch in the second stable position the moving contact and the fixed contact: the switch is closed. The switch is open in the first stable position. The bistability of the switch results from mechanical stresses, which at the manufacture of the switch can be brought into the movable contact. Also below the movable contact are on the side next to the Fixed contact two electrodes arranged. By applying electrical Voltages on the movable contact and on these electrodes can Contact and electrodes are charged electrically, so that electrostatic Attract or repulsive forces between them, through which the switch toggles between the two stable positions can be switched down.

Another horizontally operating bistable MEMS mechanism is in Sun. et al., "A Bistable Microrelay Based on Two-Segment Multimorph Cantilever Actuators ", IEEE Catalog No. 98CH36176.

Presentation of the invention

It is therefore an object of the invention to provide a micro-electro-mechanical system To create (MEMS) of the type mentioned, which is a more flexible MEMS design enables. In particular, improved switchability and new functionalities are made possible. A MEMS solves this task with the features of claim 1.

It is also an object of the invention to provide an improved method of manufacture by creating MEMS. This problem is solved by a procedure with the Features of claim 21.

Improved switchability can mean, for example, that a switching operation can already be triggered at lower switching voltages. New functionalities can, for example, the realization of de-energized closed Connections or of micro-relays with both de-energized open as well as voltage-free closed connections.

• das erste Mikro-Element und das zweite Mikro-Element mit dem Substrat verbunden sind,
• das erste Mikro-Element eine erste Fläche aufweist und das zweite Mikro-Element eine zweite Fläche aufweist, welche Flächen einander zugewandt sind und durch ein Strukturierungsverfahren erzeugt sind,
• das erste Mikro-Element einen Schaltteil beinhaltet, durch den es bistabil zwischen einer Initialposition und einer Arbeitsposition schaltbar ist, und
• der Abstand zwischen der ersten Fläche und der zweiten Fläche in der Arbeitsposition des ersten Mikro-Elementes kleiner als ein durch das Strukturierungsverfahren erzeugbarer Minimalabstand zwischen der ersten Fläche und der zweiten Fläche ist.

The MEMS according to the invention comprises a substrate and a first micro element and a second micro element, wherein

• the first micro-element and the second micro-element are connected to the substrate,
• the first micro-element has a first surface and the second micro-element has a second surface, which surfaces face each other and are generated by a structuring method,
• the first micro-element contains a switching part by which it can be switched bistably between an initial position and a working position, and
• the distance between the first surface and the second surface in the working position of the first micro-element is smaller than a minimum distance between the first surface and the second surface that can be generated by the structuring method.

So it becomes a first, initial position between the two stable positions and working position switchable micro-element in connection with such second micro-element used that the first micro-element after Switch from the initial position to the working position a smaller one Distance from the second micro-element than in the initial position. Both micro elements are connected to the substrate and in use a structuring process. The mentioned smaller distance in According to the invention, the working position is smaller than that for the structuring method characteristic minimum distance between the two micro-elements.

In this way it is achieved that new degrees of freedom in the design of MEMS can be obtained because of the technical constraints be overcome. Various micro-actuators can be new or be realized more simply or in an improved form.

In a preferred embodiment of the subject matter of the invention the second micro-element is a first solid which is firmly connected to the substrate End as well as a moving part, being in the working position of the first micro-element the movable part of the second micro-element by electrostatic forces between the first micro-element and the second micro-element from an off position to an on position is movable, and wherein the two micro-elements in the area of the the said smaller distance between the two micro-elements is present, have contact points and is electrically non-conductive are. The fact that there are points of contact means that the lower one mentioned Distance is zero.

This makes it possible to manufacture electrostatically operating actuators whose electrostatically switchable electrodes (electrode and counter electrode) touch each other. The small or vanishing achieved thereby The consequence of electrode gaps is improved switchability. Switching the actuator with very low switching voltages is possible.

In a further advantageous embodiment of the subject matter of the invention the first micro-element is additionally designed such that it is a includes adapted counter electrode, the shape of the second micro-element is adapted: the adapted counter electrode is shaped in such a way that the adjusted in the switch-on position of the second micro-element Counter electrode and the second micro-element in the area mentioned Overlap areas of contact over a large area. In the on position The matched counter electrode of the second micro-element nestle and the second micro-element to each other. This will make one Maximized the areas between which the electrostatic Attractions act, which is greater electrostatic attractions and thus results in improved switchability. Switching the actuator with very low switching voltages.

In a further advantageous embodiment, the said adapted Counter electrode additionally a second section, the opposite the section of the counterelectrode that clings to the second micro-element is stepped back. In the on position of the second micro-element close this second section of the adapted Counter electrode and the second micro-element a gap. On this way a force can be applied to the second micro-element in its on position is able to exercise, tailor-made and very large are dimensioned accordingly by the length, width and height of the gap becomes. The force that can be selected in this way can be, for example a contact force of the second micro-element on one or two electrical Contacts that are the second micro-element in its on position contacted, whereby a safe electrical contact can be made.

In a further preferred embodiment, a changeover switch relay realized.

In other advantageous embodiments of the subject matter of the invention become relays or changeover relays with voltage-free closed connections realized.

In particular, in a preferred embodiment, the movable part of the second micro-element by switching the first micro-element elastically deformable from the initial position to the working position. Thereby it is possible to implement closed connections without voltage.

After structuring, the method according to the invention includes two Micro elements with facing surfaces switching the bistable switchable micro-element. This can create new or improved ones MEMS such as those mentioned above are manufactured.

Further preferred embodiments result from the dependent patent claims and the figures.

Brief description of the drawings

Fig. 1

eine schematische Darstellung eines erfindungsgemässen MEMS mit kosinusförmigem bistabilen Element, in Aufsicht;

Fig. 2

eine schematische Darstellung eines erfindungsgemässen MEMS mit schwingungsbauchförmigem bistabilen Element, in Aufsicht;

Fig. 3

eine schematische Darstellung eines erfindungsgemässen MEMS mit kosinusförmigem bistabilen Element und angepasster Gegenelektrode, in Aufsicht;

Fig. 4

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und angepasster Gegenelektrode, in Aufsicht;

Fig. 5

eine schematische Darstellung eines erfindungsgemässen Mikro-Wechselschalt-Relais mit zwei kosinusförmigen bistabilen Elementen und angepasster Gegenelektrode, in Aufsicht;

Fig. 6

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und gestufter Gegenelektrode, in Aufsicht;

Fig. 7

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit kosinusförmigem bistabilen Element und gestufter Gegenelektrode und zweiteiligem beweglichen Teil des zweiten Mikro-Elementes, in Aufsicht;

Fig. 8

eine schematische Darstellung eines erfindungsgemässen Wechselschalt-Relais mit monostabilem zweiten Mikro-Element und NO- und NC-Anschlüssen, in Aufsicht;

Fig. 9

eine schematische Darstellung eines erfindungsgemässen Wechselschalt-Relais mit bistabilem zweiten Mikro-Element und NO- und NC-Anschlüssen, in Aufsicht;

Fig. 10a

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Initialposition; in Aufsicht;

Fig. 10b

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Arbeitsposition, zweites Mikro-Element in Ausschaltposition; in Aufsicht;

Fig. 10c

eine schematische Darstellung eines erfindungsgemässen Mikro-Relais mit NC-Anschluss, Zustand: erstes Mikro-Element in Arbeitsposition, zweites Mikro-Element in Einschaltposition; in Aufsicht;

Fig. 11a

eine schematische Darstellung eines erfindungsgemässen horizontal arbeitenden Mikro-Relais mit NC-Anschluss, geschnittene Seitenansicht;

Fig. 11b

eine schematische Darstellung eines erfindungsgemässen horizontal arbeitenden Mikro-Relais mit NC-Anschluss, in Aufsicht;

The subject matter of the invention is explained in more detail below on the basis of preferred exemplary embodiments which are illustrated in the accompanying drawings. Show it:

Fig. 1

a schematic representation of an inventive MEMS with cosine-shaped bistable element, in supervision;

Fig. 2

a schematic representation of an inventive MEMS with antinode bistable element, in supervision;

Fig. 3

a schematic representation of a MEMS according to the invention with cosine-shaped bistable element and adapted counter electrode, in supervision;

Fig. 4

a schematic representation of a micro-relay according to the invention with a cosine-shaped bistable element and adapted counter electrode, in supervision;

Fig. 5

is a schematic representation of an inventive micro changeover relay with two cosine-shaped bistable elements and adapted counter electrode, in supervision;

Fig. 6

a schematic representation of a micro-relay according to the invention with a cosine bistable element and a stepped counter electrode, in supervision;

Fig. 7

a schematic representation of a micro-relay according to the invention with a cosine-shaped bistable element and a stepped counter electrode and two-part movable part of the second micro-element, in supervision;

Fig. 8

a schematic representation of a changeover relay according to the invention with monostable second micro-element and NO and NC connections, in supervision;

Fig. 9

a schematic representation of a changeover relay according to the invention with bistable second micro-element and NO and NC connections, in supervision;

Fig. 10a

a schematic representation of an inventive micro relay with NC connection, state: first micro element in the initial position; under supervision;

Fig. 10b

a schematic representation of a micro-relay according to the invention with NC connection, state: first micro-element in the working position, second micro-element in the switch-off position; under supervision;

Fig. 10c

a schematic representation of a micro-relay according to the invention with NC connection, state: first micro-element in the working position, second micro-element in the switch-on position; under supervision;

Fig. 11a

a schematic representation of an inventive horizontally operating micro-relay with NC connection, sectional side view;

Fig. 11b

a schematic representation of an inventive horizontally operating micro-relay with NC connection, in supervision;

The reference symbols used in the drawings and their meaning are summarized in the list of reference symbols. in principle parts that have the same effect are provided with the same reference symbols in the figures.

Ways of Carrying Out the Invention

Fig. 1 shows a schematic plan view of a first according to the invention micro-electromechanical system (MEMS). It comprises a first micro element 1 and a second micro element 2, both rigid with one Substrate S are connected.

The substrate S is a wafer made of single-crystal silicon, in which one of the two largest surfaces forms a main surface of the substrate. In Fig. 1, this main surface lies in the paper plane. Using ion depths (DRIE, dry reactive ion etching) and sacrificial layer technology the first micro-element 1 and the second micro-element 2 from the S shaped substrate.

The structuring process DRIE has the property of removing material Procedure to be; it is an etching process. It also has the property good for creating narrow yet deep channels, columns or Trenches to be suitable, giving the DRIE a preferred direction which can be the direction of the preferred material removal indicates and is therefore perpendicular to the main surface of the substrate. Perpendicular again to this preferred direction is the width of one using DRIE generated trench downwards, i.e. narrow trenches. The means that there is a structuring process (e.g. DRIE) given minimum trench width that can be generated. For the two faces, which form the lateral boundaries of such a trench exist thus a minimum distance. Details, such as using ion deep etching and sacrificial cutting technology the micro elements 1, 2 are formed from the substrate can, is known to the person skilled in the art and can also, for example, of those mentioned Laid-open application DE 198 00 189 A1 can be found in the hereby included in the description with its entire disclosure content becomes.

Micro-elements created with DRIE typically have side faces, which are aligned almost perpendicular to the main surface of the substrate S, or in other words: (local) surface normal vectors of the side surfaces run practically parallel to the main surface of the substrate S. Such Micro elements are therefore essentially in the form of a straight line (right angled) prism, the base of which is parallel to the main surface of the Substrate S is aligned. In addition, the level is typically such Micro element (perpendicular to the main surface) very large compared to the (Narrowest) width of such a micro element. The first micro element and the second micro element are of this type.

The first micro-element 1 is a bistable elastic MEMS mechanism trained as described in the publication J. Qiu et al., "A Centrally-Clamped Parallel-Beam Bistable MEMS Mechanism ", Proc. Of MEMS 2001, Interlaken, Switzerland, Jan. 20-22, 2001. Details about Embodiments, properties and for the production of such Micro-elements can be found in this publication, which hereby included in the description with its entire disclosure content becomes. The first micro element 1 is at a first end 6 and a second end 7 fixed on the substrate S. In between that points first micro-element 1 two parallel, cosine curved Spring tongues on the middle 8 between the two ends 6.7 with each other are connected. Considering their small width and their large These spring tongues can be adjusted in height (perpendicular to the main substrate surface) also understand as a parallel membrane.

The first micro-element 1 is bistable between an initial position A and a working position B switchable (the latter shown in dashed lines in Fig. 1). This means that the micro-element 1 has two mechanically stable states or positions A and B, between which there is a lateral, force parallel to the substrate can be moved back and forth; the movement takes place essentially laterally. Any intermediate positions are not stable, but independently lead to a rapid transition into one of the two stable states A or B. The transition takes place by preferably elastic deformation of the first micro element 1. The first micro-element 1 consists here only of a switching part 5, through which it is bistable switchable.

The first micro-element 1 faces the second micro-element 2 Page a side formed by DRIE, the first Area 3a is called. This first surface 3a has a first coating 3b, which is electrically insulating and its outer, that is, from the Surface 3a facing away from the first surface 3 of the first Micro-element 1 forms. The first coating 3b is typically generated by oxidation of the silicon.

The second micro-element 2 has a first fixed end 10 on which it is fixed on the substrate S, and a movable part 11; it is arranged next to the first micro-element 1. On that side of the second micro-element facing the first micro-element 1 the second micro-element 2 has a side surface shaped by DRIE on, which is referred to as the second surface 4a. This second surface 4a has a second coating 4b, which is electrically insulating and whose outer surface, ie the surface facing away from the second surface 4a forms second surface 4 of the second micro-element 2. The first surface 3 and the second surface 4 are surfaces facing one another, as well as the first surface 3a and the second surface 4a facing each other are. The second coating 4b is also typically made by oxidation of silicon.

After shaping the first surface 3a and the second surface 4a by means of DRIE is the first micro-element 1 in the initial position A and that second micro-element 2 in an off position A '. Since the surfaces 3a and 4a are formed in the middle DRIE, they have a distance from each other that is at least is as large as a minimum distance given by DRIE. With the The distance between the surfaces means the distance between the two Have points that are closest to each other, one Point on the first surface 3a and the other point on the second surface 4a lies. So the distance is the width of the trench between the first Surface 3a and the second surface 4a at its narrowest point. 1 is this point at a corner of the first fixed end 10 of the second micro-element 2 and near the first end 6 of the first micro-element 1 the membrane of the first micro-element 1, which has the first surface 3a.

The initial position A of the first micro-element 1 is a production-related one Initial position. The arrangement of the first micro element 1 and of the second micro-element 2 is selected such that after a switchover of the first micro-element 1 from the initial position A to the working position B the distance of the first surface 3a from the second surface 4a is smaller than that mentioned by the manufacturing process (e.g. DRIE) given minimum distance. In the MEMS in Fig. 1, the distance is even zero, that is, in working position A, the first micro-element touch 1 and the second micro-element 2. In the working position A can intended interaction of the first micro-element 1 with the second micro-element 2 take place within the MEMS.

The MEMS in Fig. 1 represents a micro-actuator that of the first micro-element 1 and the second micro-element 2, together with the substrate S. is formed. The second micro-element 2 acts as a movable, electrostatically switchable electrode and the bistable switchable first micro-element 1 as an associated electrostatic counter electrode. The first Micro-element 1 is in working position A.

The functioning of the micro-actuator when it is in working position B is essentially known from the prior art: On the first fixed End 6 of the first micro element 1 is a contacting electrode C, and at the first fixed end 10 of the second micro-element 2 a contacting electrode C 'is provided. These contact electrodes C, C 'are used to apply switching voltages to the micro-elements 1,2, through which the micro-elements are charged electrostatically, so that electrostatic forces between micro-elements 1 and 2 Act. For this, the material from which the micro-elements are made be sufficiently conductive, for example by appropriate doping of silicon is reached. Due to the electrostatic forces between the micro elements (more precisely: between the first surface 3 and the second surface 4) is the movable part 11 of the second micro-element 2 from the switch-off position A 'to a switch-on position B' of the second micro element 2 movable. The switch-on position B 'is in FIG. 1 shown in dashed lines. In the MEMS in Fig. 1 there is an opposite Charging the micro-elements 1,2 and thus an attractive electrostatic Force provided. For switching back the second micro element 2 in the switch-off position A ', the charges of the micro-elements 1, 2 reduced. That no unwanted discharges take place, especially if the micro elements 1, 2 touch, the non-conductive ones Coatings 3b, 4b reached.

As can be seen from equation (1), the electrostatic force increases inversely proportional to the distance. The MEMS according to the invention Fig. 1 has the great advantage, even with smaller switching voltages to be switchable than they would be required for a MEMS, its distance between electrode and counterelectrode greater than or equal to that due to Structuring method given the minimum distance.

The micro actuator in FIG. 1 can be used, for example, as an optical micro switch can be used by passing a light beam to be switched or interrupted by the movable part 11 of the second micro-element 2 will, depending on whether the second micro-element 2 is in the off position A 'or in the switch-on position B'. Redirecting is just as good a light beam with the micro-actuator in Fig. 1 possible, for example when in the movable part 11 of the second micro-element 2 reflective area is arranged (not shown). The switch-on position B 'is by definition present when there are suitable switching voltages; otherwise the switch-off position A 'is present.

The bistable switchable first micro-element 1 is called an electrostatic Electrode or counter electrode used.

The embodiment in Fig. 1 has been described in great detail. Out For the sake of clarity and clarity, some of the following are already mentioned details of the functioning of the inventive MEMS, which should now have become clear to the person skilled in the art, no longer extra mentioned.

FIG. 2 shows a MEMS which largely corresponds to the MEMS from FIG. 1; Indeed the first micro element 1 is constructed differently. The first micro element 1 is here lateral as another, bistable and preferably elastic switchable mechanism. The first micro element 1 is also here at a first end 6 and a second end 7 on the substrate S. set. In between, however, the first micro-element 1 has a curved one Spring tongue, which has the shape of an antinode. In view of its small width and great height (perpendicular to the Substrate main surface) this spring tongue can also be used as a membrane describe.

In the initial position A, that is, in the state in which the first micro-element 1 is structured, the first micro-element 1 describes one symmetrical antinode, in working position B an asymmetrical one Vibration belly (the latter drawn in dashed lines in Fig. 2). The asymmetrical antinode represents the second stable position of the first Micro-element 1 represents and comes about by the fact that one with the Substrate S firmly attached stop the first micro-element 1 in the working position B touches and the corresponding deformation of the first Micro-element 1 leads. This stop is here by a corresponding formed and arranged first fixed end 10 of the second micro-element 2 formed. The corresponding point of contact is expedient right of a link that runs from the second end 7 extends to the first end 6 of the first micro-element 1 when the symmetrical antinode in the initial position A to the left of this Connection route is arranged. The value of a parallel to this link position coordinate of the point of contact not 0.5 (no asymmetrical antinode) and lies preferably between 0.52 and 0.92 the length of the link; it is here about 0.84. The stop can also by a correspondingly shaped first End 6 or second end 7 of the first micro-element 1 are formed or as a separately fixed stop on the substrate S (which is then to be regarded as belonging to the first micro-element 1).

As in the embodiment of FIG. 1, the bistable micro-element 1 generated (structured) in the initial position A, the distance between first micro element 1 and second micro element 2 at least in this way is as large as a minimum distance given by the structuring process (between these micro elements 1,2). Still in the making of the MEMS becomes the first after the application of coatings 3b, 4b Micro-element 1 switched from initial position A to working position B, where in working position B the distance between the two Micro elements 1.2 is smaller than the minimum distance mentioned. By doing MEMS thus become two micro-elements with one through the structuring process not produced a small distance apart (by taking advantage of the bistable switchability of one of the micro elements). For further details on the embodiment of FIG. 2 are related to that referenced with Fig. 1.

FIG. 3 shows a MEMS according to the invention, which largely corresponds to that in FIG. 1 shown embodiment corresponds; however, the first is here Micro-element 1 not only from a switching part 5, but also includes another electrode 9. The electrode 9 has an elongated part, the first surface 3a, the first coating 3b and the first surface 3 of the first micro-element 1 includes. This part is by means of another elongated part, which is aligned approximately perpendicular to the above is, with the switching part 5 in the middle 8 between the ends 6,7 of the first Micro-element 1 connected.

Since the electrode 9 is attached to the switching part 5, it moves with the Switching part 5 with when from the initial position A to the working position B (and back again if necessary). Become more suitable by creating Switching voltages electrostatic attraction between the first Micro element 1 (naturally in working position A) and the second micro element 2 generated, so the movable part 11 of the second micro-element 2 elastically deformed and approaches the electrode 9: It is from the switch-off position A 'switched to the switch-on position B'. The shape of the Electrode 9, and in particular the shape of first surface 3, is preferred shaped such that the first surface 3 and the second Touch surface 4 fully in the switch-on position. It means that there is a flat contact between the two surfaces 3, 4, which does not mean that the two surfaces 3, 4 completely touch have to. The first surface 3 is thus in the shape of the second surface 4 adjusted in the switch-on position. The two surfaces 3, 4 are nestled against each other in the switch-on position B '. You can do one Designate electrode 9 as an adapted electrode 9. By the adapted Electrode 9 becomes the effective area for the electrostatic forces maximized and the effective distances minimized. Consequently, at low switching voltages can be switched. For more details on the Embodiment of FIG. 3 is written to that written in connection with FIG. 1 directed.

4 shows a MEMS which is a micro-relay. The embodiment largely corresponds to that of FIG. 3. It also includes an (adapted) Electrode 9 and a cosine-shaped bistable elastic switchable micro-element 1. In addition, the second micro-element 2 has or more precisely: the movable part 11 of the second micro-element 2, one Contact area 16, which is electrically conductive. Preferably, the Contact area 16 in the area of that end of the movable part 11 of the second micro-element 2, which is not at the first fixed end 10 of the second micro-element 2 borders. The contact area 16 forms part of a side surface of the second micro-element 2 and is preferred formed as a coating that by means of vapor deposition or Sputtering techniques is applied to the second micro-element 2.

The MEMS further comprises two electrically fixed on the substrate S. conductive fixed contacts 17, 18. The arrangement of the fixed contacts 17, 18 and the contact area 16 is selected in such a way that more suitable in the event of concerns Switching voltages on the first micro-element 1 and the second micro-element 2 (i.e. in the switch-on position B 'of the second micro-element 2) the contact area 16 an electrically conductive connection between the Fixed contact 17 and the fixed contact 18 generated. A 'is in the off state this is not the case. So there is an electrostatic micro-relay through which is formed by the fixed contacts 17, 18 by means of the switching voltages Connection can be switched.

Very advantageous in this, but also in the embodiments discussed below is that the open distance between the Contact area 16 of the second micro-element 2 and the fixed contacts 17.18 can be selected and can be reproduced very well in terms of production technology.

The contact area 16 is in FIG. 4 on that side of the second micro-element 2 arranged, which faces the first micro-element 1, on the side that also contains the surface 4. Through attractive electrostatic forces between the first micro-element 1 and the second micro element 2 is an electrical contact between the fixed contacts 17.18 effective.

It is also possible (not shown) to arrange the fixed contacts 17, 18 in such a way that that they are in that area of the substrate S which is on the side of the second micro-element facing away from the first micro-element 1 2 lies. The contact area 16 is then corresponding to that Side of the movable part 11 of the second micro-element 2, which faces away from the first micro-element 1. So constructed the relay can be switched by repulsive electrostatic forces. Of course, it is also possible to use this micro relay or that Fig. 4 shown to build micro-relays without (adapted) electrode 9 (analogous to the structure in Fig. 1).

5 shows a micro changeover relay according to the invention. It contains all the features of such a MEMS as it is related to Fig. 4 has been described. In addition, the MEMS also includes one third micro-element 1 'and two further fixed contacts 17', 18 '; and the second micro-element 2 has a further electrically conductive contact area 16 'on which on one side of the movable part 11 of the second Micro-element 2 is arranged, which is the side facing the Has contact area 16. The third micro-element 1 'and the others Fixed contacts 17 ', 18' are movable with respect to the elongated Part 11 of the second micro-element 2 arranged in mirror image to the first micro element 1 and the fixed contacts 17, 18. Of course, the arrangement must not be exactly mirror images; it is sufficient if the third micro-element 1 'connected to the substrate in a region of the substrate S. is that on the side facing away from the first micro-element 1 of the second Micro-element (2) and the other fixed contacts 17 ', 18' in one area of the substrate S are connected to the substrate on which the Fixed contacts 17, 18 facing away from the second micro-element 2. The structure of the third micro-element 1 'corresponds to the structure of the first Micro-element 1. The other fixed contacts 17 ', 18' are of the same type designed like the fixed contacts 17, 18.

The interaction between the third micro-element 1 'and the corresponds to the second micro-element (2) and the further fixed contacts (17 ', 18') the interaction between the first micro-element described above 1 and the second micro-element 2 and the fixed contacts 17, 18. When suitable switching voltages are applied to the third micro-element 1 ' and the second micro-element 2 can be an electrically conductive connection between the further fixed contacts 17 ', 18' through the further contact area 16 'can be created. Thus lies with this embodiment Three-position switch or a changeover relay that defined three States have: (1.) contacts between the two fixed contact pairs 17, 18; 17 ', 18' open, (2.) contacts between the further fixed contacts 17 ', 18' open and Contacts between the fixed contacts 17, 18 closed and (3.) contacts between the fixed contacts 17, 18 open and contacts between the others Fixed contacts 17 ', 18' closed.

6 shows a further MEMS according to the invention, which largely corresponds to the MEMS from FIG. 4. It contains the characteristics of the MEMS Fig. 4, for which reference is made to the corresponding part of the description. However, the electrode 9 of the first micro-element 1 is special here educated. The electrode 9 has an (optionally step-shaped) recess on. The electrode 9 comprises a gap-forming surface 12 which stepped in relation to the first surface 3 of the first micro-element 1 is set back. You can see this electrode 9 as a stepped Designate electrode 9. With this MEMS, attractive electrostatic Forces to switch from switch-off position A 'to switch-on position B' used. The first micro-element 1 is in the working position B. and the second micro-element 2 in the switch-on position B ', they close gap-forming surface 12 and the second micro-element 2, or more precisely: the movable part 11 of the second micro-element 2, a gap 13. This allows the magnitude of a contact force to be exerted by the second micro-element 2 is exerted on the fixed contacts 17, 18 can be selected. In particular can make a very good, safe contact and a big one Contact force can be reached. The choice of the geometry of the gap allows one targeted predetermination and choice of contact force. In particular, can for this purpose the length of the gap and the width of the gap (i.e. the Distance between movable part 11 of the second micro-element 2 and the gap-forming surface 12) and optionally the course of the Width of the gap can be selected. Typically the length of the gap by approximately one order of magnitude, preferably by approximately two orders of magnitude larger than the width of the gap. An (approximately) evenly is advantageous wide gap selected, and the first surface 3 touches the second Full surface 4. The relative arrangement of the micro elements 1, 2 and the fixed contacts 17, 18 on the substrate must be carried out carefully.

Furthermore, such a MEMS has the advantage that problems that may arise when switching from switch-on position B 'to switch-off position A', caused by slow or poor detachment of the movable part 11 of the second micro-element 2 from the electrode 9 (more precisely: from the first surface 3) for example due to surface effects can occur, can be reduced. The (air) gap 13 allows one rapid detachment of the movable part 11 of the second micro-element 2 from the electrode 9 when switching from the switch-on position B 'to the switch-off position A ', while still in the switch-on position B' large electrostatic Attractive forces between the first micro-element 1 and the second micro-element 2 act if the gap width is appropriate was chosen low.

7 shows a further advantageous embodiment of the invention. It largely corresponds to the embodiment shown in FIG. 6 and is described based on that. The movable part 11 of the second Micro-element 2 is specially designed here. It has a first area 14 and a second area 15, the first area 14 being less is stiff, that is to say more easily deformable, than the second region 15. And the first area is between the fixed first end 10 of the second Micro-element 2 and the second region 15 are arranged. The contact area 16 is advantageously arranged in the second area 15, in particular in the Region of the end of the second opposite the first region 15 Area 16. Preferably, the second area 15 comprises at least that Area of the movable part 11 in which the movable part 11 and the second micro-element 2 do not face each other. Particularly advantageous is a (slight) overlap of the second area 15 with the area of the movable part 11, in which the movable part 11 and the second Micro-element 2 face each other. In the embodiment shown in FIG. 7 with stepped electrode 9, the second region 15 advantageously at least that area of the movable Part 11, in which the movable part 11 and the gap-forming surface 12 face each other. In this case, it is particularly advantageous if the second area 15 also has a (slight) overlap with the first Surface 3 has. In the switched-on state B ', there is advantageously a full-surface area Contact between the first surface 3 and a part of the second Surface 4 instead, this part of the second surface 4 completely lies in the first area 14.

The greater stiffness of the second area 15 compared to the first area 14 is achieved in the exemplary embodiment from FIG. 7 in that the second region 15 is thicker or wider than the first region 14. It is also possible to make the second region 15 more difficult to bend make, for example, by applying a coating there; to the Example on a base of the straight prismatic body that the forms second region 15, or on at least one of the side surfaces. through a correspondingly (large, long) trained contact area, the is designed as a coating, this could be achieved.

Due to the two differently rigid areas 14, 15, even at low levels Switching voltages and attractive forces between the two micro elements 1,2 a switching of the second micro-element 2 from the switch-off position A 'in the switch-on position B' enables; the mobile Part 11 (more precisely: the first region 14) of the second micro element 2 nestles, rolling, even with low attraction forces Electrode 9 on. This while in the second area and preferably in Contact area 16 little or no deformation of the second micro-element 2 is expected. A safe electrical contact can be opened this way by means of the contact area 16 between the fixed contacts 17, 18 can be produced.

The features mentioned can of course also apply to the further above and to the exemplary embodiments described below are used (FIGS. 1 to 6 and 8 to 11b).

8 shows a further advantageous embodiment of the invention, namely a two-way switching relay, which apart from a normally open connection (NO connection) also a normally closed connection (NC connection) includes. NO connection means that connection is open when a suitable switching voltage is not present (open when de-energized), as in the exemplary embodiments listed above (Fig. 4 to Fig. 7) is the case. NC connections which are not used a suitable switching voltage are closed (de-energized closed), on the other hand, are difficult to implement, but are in this Embodiment realized. In particular, an NC connection is in here a MEMS structured using DRIE.

The MEMS in FIG. 8 is constructed in mirror image and comprises a first micro element 1, a third micro-element 1 ', a fourth micro-element 19 and a fifth micro-element 20, which are all bistable and one stable initial position A (drawn solid) and a stable working position B (shown in dashed lines). They are here as such bistable micro-elements are formed, as they are in connection with FIG. 1 are described in more detail (two parallel, cosine-shaped, connected in the middle Spring tongues). The position in which these micro elements are used The first position is A. The first micro element 1 and the third micro-element 1 'largely correspond to each other in their Function. They consist of only one switching part 5. The fourth micro element 19 and the fifth micro-element 20 also correspond to one another largely in their function. They each have a contacting electrode D, D '(for applying a signal to be switched, for example one electrical current) and an electrically conductive contact electrode 21, 22 on. The conductivity of the contact electrodes 21, 22 is preferably determined by creates a metallic coating. The contact electrodes 21, 22 are elongated, finger-shaped and approximately in the middle 8 between the two Ends of the respective micro element 19, 20 on the respective micro element 19.20 attached. Furthermore, the MEMS has two more with the Fixed electrodes 17, 18 connected to substrate S (for the application of another electrical current to be switched).

The MEMS in FIG. 8 further comprises a second micro-element 2. The second micro element 2 is a monostable switchable micro element; it therefore only has a stable position. It includes a first fixed end 10 and a second fixed end 10 ', which ends 10,10' on the substrate S are fixed, and a between these two fixed ends 10,10 ' arranged movable part 11. The movable part 11 is as one, preferably Vibration-bellied, curved structure designed to the the two fixed ends 10, 10 'of the second micro-element 2 is attached and has an electrically conductive contact region 16. The mobile Part 11 also has a second surface 4, which is of an optional second coating 4b is formed, and what second surface 4 facing a first surface 3 of the first micro-element 1 is. The situation is analogous with a fourth surface 4 'of the second micro-element 2 and a third surface 3 'of the third micro-element 1'.

The second surface 4 is between the first fixed end 10 and the Contact area 16 arranged. Analogously, the fourth surface 4 'is between the second fixed end 10 'and the contact area 16. To the structuring of the second micro-element 2 is the movable one Part 11 in the off position A ', the stable position of the second Micro element 2.

Due to the existence of the minimum distance between are two micro elements or surfaces created by DRIE the bistable micro-elements 1, 1 ', 19, 20 from the second micro-element 2 spaced with at least one such minimum distance. After application the optional non-conductive coatings 3b, 3b 'of the first and third micro-element 1,1 'and the optional electrically conductive Coatings of the contact electrodes 21,22 are in the context of Manufacturing method of the MEMS according to the invention the bistable micro-elements 1,1 ', 19,20 switched from the initial position A to the working position B. This will set the distance between the micro elements or Surfaces less than the specified minimum distance; touch in Fig. 8 even the micro elements. In particular, both contact electrodes touch 21, 22 the contact area 16. This makes an electrically conductive Connection between the two contact electrodes 21, 22 and thus the NC connection generated. In this way, a voltage-free, closed but releasable contact realized. The surfaces 3, 4 and the surfaces 3 ', 4' also touch each other. This can already be done by creating relatively low switching voltages between the second micro-element 2 and the first micro-element 1 and between the second micro-element 2 and the third micro-element 1 'sufficiently large electrostatic Attractive forces between the second micro-element 2 and the Micro-elements 1,1 'are generated, which lead to a switching of the second Micro-element 2 from the switch-off position A 'to the switch-on position B' to lead. In the switch-on position B 'the NC connection is now open while the NO connection is closed. Because of its monostability switches the second micro-element 2 when a suitable one is not present Switching voltage automatically in the switch-off position: NC connection closed, NO connection open.

• Es ist möglich, das MEMS nicht spiegelsymmetrisch aufzubauen.
• Man kann auf die Fixkontakte 17,18 verzichten und hat dann ein NC-Anschluss-Mikro-Relais.
• Man kann auf die Mikro-Elemente 19,20 verzichten und hat dann ein NO-Anschluss-Mikro-Relais.
• Wenn auf die Fixkontakte 17,18 oder auf die Mikro-Elemente 19,20 verzichtet wird, reicht es, wenn der Kontaktbereich 16 des zweiten Mikro-Elementes 2 nur auf einer Seite elektrisch leitfähig ist.
• Man kann die Mikro-Elemente 1,1' mit (angepassten, optional: gestuften) Elektroden 9 versehen (siehe Fig. 3 bis Fig. 7).
• Man kann die Kontaktierungselektroden 21,22 anders ausbilden; oder ganz auf sie verzichten und dann mittels des vorzugsweise elektrisch leitend beschichteten Schaltteils den Kontaktteil 16 des zweiten Mikro-Elementes 2 kontaktieren.
• Es ist möglich, die Mikro-Elemente 1,1' auf der anderen Seite des zweiten Mikro-Elementes 2 anzuordnen, also in dem Bereich des Substrates S, der auf der den Fixkontakten 17,18 abgewandten Seite des zweiten Mikro-Elementes 2 liegt. Dann ist das Mikro-Relais durch elektrostatische Abstossungskäfte schaltbar.
• Es ist auch möglich, das erste Mikro-Element 1 in einem anderen Bereich (des Substrates S, bezüglich des zweiten Mikro-Elementes 2) anzuordnen als das dritte Mikro-Element 1'.
• Man kann auf das dritte Mikro-Element 1' verzichten und nur das erste Mikro-Element 1 als elektrostatische Gegenelektrode zu dem zweiten Mikro-Element 2 als beweglicher Elektrode einsetzen.

Die genannten Merkmale können gemeinsam oder auch einzeln oder in beliebiger Kombination vorteilhaft sein.Numerous modifications of the embodiment of FIG. 8 are conceivable and advantageous: Here are some examples:

• It is possible not to set up the MEMS with mirror symmetry.
• You can do without the fixed contacts 17, 18 and then have an NC connection micro relay.
• You can do without the micro elements 19, 20 and then have a NO connection micro relay.
• If the fixed contacts 17, 18 or the micro elements 19, 20 are dispensed with, it is sufficient if the contact area 16 of the second micro element 2 is only electrically conductive on one side.
• The micro-elements 1, 1 'can be provided with (adapted, optionally: stepped) electrodes 9 (see FIGS. 3 to 7).
• The contacting electrodes 21, 22 can be designed differently; or dispense with them entirely and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part.
• It is possible to arrange the micro-elements 1, 1 'on the other side of the second micro-element 2, that is to say in the region of the substrate S which is on the side of the second micro-element 2 facing away from the fixed contacts 17, 18. Then the micro-relay can be switched by electrostatic repulsive forces.
• It is also possible to arrange the first micro-element 1 in a different area (of the substrate S, with respect to the second micro-element 2) than the third micro-element 1 '.
• You can do without the third micro-element 1 'and only use the first micro-element 1 as an electrostatic counter electrode to the second micro-element 2 as a movable electrode.

The features mentioned can be advantageous together or individually or in any combination.

Fig. 9 shows a two-way switching relay, which apart from a normally open connection (NO connection) also a normally closed connection (NC connection) includes. The MEMS is structured very similar to that described in Figure 8; for corresponding features, refer to the above Text referenced. However, the second micro-element 2 is not monostable here, but designed to be bistable. In particular, it has a structure with two parallel, cosine-shaped spring tongues connected in the middle, as described in detail in connection with FIG. 1. The two stable positions of the second micro-element 2 are the switch-off position A 'and the switch-on position B'. A big advantage of the bistability of the second micro element 2 is that there is no applied switching voltage required to the second micro-element 2 in the switch-off position A 'or Hold switch position B '. After applying a suitable switching voltage and the switching process caused thereby into the other state A ', B', the second micro-element 2 automatically remains in this state FROM'. This allows each of the two pairs of contacts to which one is closed switching signal is present (fixed electrodes 17, 18 or micro-elements 19, 20) can be an NO connection or an NC connection.

In addition, the MEMS in FIG. 9 has two further bistable switchable micro-elements on: the sixth micro element 23 and the seventh micro element 24. These are also here with two parallel, cosine-shaped, in the middle connected spring tongues and each have one (adapted) electrode 9. They are arranged in the region of the substrate S, which is on the side of the second micro-element 2 that the Micro-elements 1.1 'is facing away. The micro elements 23, 24 act in analogously with the second micro-element 2 together as the micro-elements 1.1 '. For example, the second micro-element 2 has one sixth surface 26a and an eighth surface 26a 'with a fifth Surface 25a (of the sixth micro element 23) or a seventh Surface 25a '(the seventh micro-element 24) interact. through electrostatic attraction forces between the second micro-element 2 and the sixth micro-element 23 (more precisely: between the corresponding Surfaces or surfaces) or the seventh micro-element 24 (more precisely: between the corresponding surfaces or surfaces) can the second micro-element 2 from the on state B 'in the Switch-off state A 'can be switched.

• Es ist möglich, das MEMS nicht spiegelsymmetrisch aufzubauen.
• Man kann auf die Fixkontakte 17,18 verzichten.
• Man kann auf die Mikro-Elemente 19,20 verzichten.
• Wenn auf die Fixkontakte 17,18 oder auf die Mikro-Elemente 19,20 verzichtet wird, reicht es, wenn der Kontaktbereich 16 des zweiten Mikro-Elementes 2 nur auf einer Seite elektrisch leitfähig ist.
• Man kann die Mikro-Elemente 1,1' mit (angepassten, optional: gestuften) Elektroden 9 versehen (siehe Fig. 3 bis Fig. 7).
• Man kann die Mikro-Elemente 23,24 ohne angepasste Elektroden 9 einsetzen.
• Man kann die Kontaktierungselektroden der Mikro-Elemente 19,20 anders ausbilden; oder ganz auf sie verzichten und dann mittels des vorzugsweise elektrisch leitend beschichteten Schaltteils den Kontaktteil 16 des zweiten Mikro-Elementes 2 kontaktieren.
• Es ist möglich, das Mikro-Relais durch elektrostatische Abstossungskäfte zu schalten; oder es mittels elektrostatischer Abstossungskäfte und elektrostatischer Anziehungskäfte zu schalten.
• Man kann auf eines, zwei oder drei der Mikro-Elemente 1,1',23,24 verzichten; insbesondere auf die diagonal einander gegenüberleigenden Mikro-Elemente 1,24 oder die Mikro-Elemente 1',23.
• Wenn ein Schaltvorgang durch Zusammenwirken mindestens zweier Mikro-Elemente 1,1',23,24 mit dem zweiten Mikro-Element 2 erzeugt wird, ist es besonders vorteilhaft, wenn mindestens eine der entsprechenden Schaltspannungen mit einer zeitlicher Verzögerung relativ zu mindestens einer der anderen Schaltspannungen angelegt wird. Dadurch kann die Bewegung, welche der bewegliche Teil 11 des zweiten Mikro-Elementes 2 beim Schaltvorgang macht, unterstützt werden. Insbesondere kann der asymmetrischen Bewegung der zwei parallelen, kosinusförmig gekrümmten Federzungen des zweiten Mikro-Elementes 2 Rechnunng getragen werden. Es können auch entsprechend angepasste zeitliche Schaltspannungsprofile benutzt werden.
• Wenn statt eines kosinusförmigen bistabilen zweiten Mikro-Elementes 2 ein schwingungsbauchförmiges eingesetzt wird, werden vorteilhaft die Fixkontakte 17,18 oder das vierte und/oder fünfte Mikro-Element 19,20 derart angeordnet, dass mindestens einer von diesen für die Asymmetrische Ausbildung des Schwingungsbauches sorgt.

Die genannten Merkmale können gemeinsam oder auch einzeln oder in beliebiger Kombination vorteilhaft sein.Several advantageous modifications of this embodiment are conceivable:

• It is possible not to set up the MEMS with mirror symmetry.
• One can do without the fixed contacts 17, 18.
• One can do without the micro elements 19, 20.
• If the fixed contacts 17, 18 or the micro elements 19, 20 are dispensed with, it is sufficient if the contact area 16 of the second micro element 2 is only electrically conductive on one side.
• The micro-elements 1, 1 'can be provided with (adapted, optionally: stepped) electrodes 9 (see FIGS. 3 to 7).
• The micro elements 23, 24 can be used without adapted electrodes 9.
• The contacting electrodes of the micro elements 19, 20 can be designed differently; or dispense with them entirely and then contact the contact part 16 of the second micro-element 2 by means of the preferably electrically conductive coated switching part.
• It is possible to switch the micro relay by electrostatic repulsive forces; or to switch it by means of electrostatic repulsive forces and electrostatic attractive forces.
• One can dispense with one, two or three of the micro-elements 1, 1 ', 23, 24; in particular to the diagonally opposite micro elements 1, 24 or the micro elements 1 ', 23.
• If a switching process is generated by the interaction of at least two micro-elements 1, 1 ', 23, 24 with the second micro-element 2, it is particularly advantageous if at least one of the corresponding switching voltages with a time delay relative to at least one of the other switching voltages is created. As a result, the movement which the movable part 11 of the second micro-element 2 makes during the switching process can be supported. In particular, the asymmetrical movement of the two parallel, cosine-shaped spring tongues of the second micro-element 2 can be carried out. Correspondingly adapted switching voltage profiles over time can also be used.
• If, instead of a cosine-shaped bistable second micro-element 2, an antinode is used, the fixed contacts 17, 18 or the fourth and / or fifth micro-element 19, 20 are advantageously arranged such that at least one of them ensures the asymmetrical formation of the antinode ,

The features mentioned can be advantageous together or individually or in any combination.

10a to 10c show a further advantageous embodiment of the Invention in different positions. This MEMS is a micro relay with an NC connection, which is generally only is difficult to implement. The MEMS is based on that shown in FIG. 4 Embodiment described, since it has the same components having. 10a shows the MEMS, in the state it is after the structuring by means of DRIE: The first micro element 1 is in the initial position A. Fig. 10b shows the MEMS in a state in which the first micro-element 1 is in the working position B, and that second micro-element 2 is in the off state A '. 10c shows the MEMS in a state in which the first micro-element 1 is in the working position B, and the second micro-element 2 in the Switched on state B '.

In contrast to the embodiments discussed above, it is here so that the first micro-element 1 after switching from the initial position A in the working position B not just the second micro element 2 comes closer than the minimum distance given by DRIE and only touches the second micro element 2 (lightly). Rather, here is the arrangement of the micro elements 1, 2 on the substrate S and the configuration of the Micro elements 1, 2 selected such that the first micro element 1 in the Working position B a force on the movable part 11 of the second micro-element 2 exercises, which leads to a (clear) elastic deformation of the Movable part 11 of the second micro-element 2 leads (see Fig. 10b). The movable part 11 of the second micro-element 2 is deformed in such a way that the electrically conductive contact area 16 of the second micro-element 2 Conductively connects the fixed contacts 17, 18: The NC connection is closed. It becomes a tension-free closed but detachable contact realized; in a MEMS structured using DRIE. Expressed differently: By switching the first micro-element 1 from the initial position A in the working position B is a switching operation of the second micro-element 2 evoked. Since there is no switching voltage required, is the second micro-element 2 after this switching process in the Switch-off position A '. To open the NC connection again, a suitable switching voltage between the first micro-element 1 and the second micro-element 2 can be created. By means of electrostatic attraction the NC connection is opened and the second micro element 2 goes into the on state B '(see Fig. 10c).

In combination with the features mentioned above, the Basis of Figures 10a-10c further advantageous embodiments be created. In particular, the electrode 9 can be omitted. Or the electrode 9 can be designed differently. In particular the electrode 9 and the micro-elements can advantageously be designed in this way 1.2 to each other so that the points of contact between the two micro-elements 1, 2 (if the first micro-element 1 in is the working position A and the second micro-element 2 in the switch-off position A 'is) lying essentially on a straight line with the center 8 in the initial position A and the middle 8 in the working position. This can cause a low mechanical stress on the first micro-element 1 reached be, with large contact forces on the fixed contacts 17,18 can be exercised (safe contacts).

It is also advantageous, in analogy to the embodiment shown in FIG. 5, a second pair of fixed contacts 17 ', 18' (not shown in Fig. 10) to be provided, these fixed contacts 17 ', 18' being arranged such that the contact area 16 of the second micro-element 2 these fixed contacts 17 ', 18' electrically conductively connects to one another when the second micro-element 2 is in the switch-on position B '. So you get a two-way switching relay, similar to that of Fig. 5, but with only one bistable micro-element 1. The movable part 11 of the second micro-element 2 are formed in two parts (analogous to that Embodiment of Fig. 7).

Only laterally operating MEMS were discussed in the above explanations. However, it is also possible to use the MEMS described (in a similar form) as to build horizontally operating MEMS. It is then typically used for production not used DRIE, but rather it is used on others from the Known methods such as MEMS or semiconductor technology are used for example in the already mentioned patents US 5,638,946, US 5,677,823 or DE 42 05 029 C1 may be mentioned. The revelation these patents are therefore hereby incorporated into the present description added.

11a and 11b show a possible embodiment in which the moving parts of the MEMS are essentially horizontally movable. Figure 11a is a cross-sectional side view of the one shown in plan in Figure 11b MEMS. In Fig. 11b with XIa-XIa is the line of the section of the 11a. The MEMS is a micro relay with an NC connection.

The first micro-element 1 is here a bistable in the form of an antinode elastically switchable micro-element, analogous to that in FIG. 2 shown first micro-element 1. In the initial position A is the symmetrical Vibration belly arched away from the substrate S. The second end 7 of the first micro-element 1 is designed here as a bridge. Thereby can the second micro-element arranged below the antinode 2 to outside the area between the first end 6 and second end 7 of the first micro-element 1 extend. The first firm End 10 of the second micro-element 2 serves as a stop for the Formation of the asymmetrical antinode of the first micro-element 1 in working position B.

The movable part 11 of the second micro-element 2 initially runs (after structuring) substantially parallel to the main surface of the Substrates S. After switching the first micro-element 1 from the initial position A in working position B the first micro-element 1 exercises Compressive force on the movable part 11 of the second micro-element 2. The second micro element 2 is elastically deformed. It gets into his Switch-off position A ', in which a fixedly attached to the movable part 11 movable contact electrode E a fixed electrode fixed on the Sustrat S. 17 touches. This creates an NC connection between the movable Contact electrode E and the fixed electrode 17. This generation of a NC connection is quite analogous to that in connection with the 10a to 10c described method.

Are suitable switching voltages between the two micro-elements 1,2 applied, the second micro-element 2 goes into the on state B 'above, in which the movable part 11 of the second micro-element 2 is bent away from the substrate and the NC connection is opened is. The contacting electrodes C, C 'serve to apply Switching voltages. Contacting electrodes are used to apply a signal to be switched D, D 'The contacting electrode D, which is electrical connected to the movable contact electrode E is here on the first fixed end 10 of the second micro-element 2 arranged. With the fixed contact 17 electrically connected contacting electrode D 'is on arranged the substrate S.

Other MEMS according to the invention, such as those described above MEMS can also be implemented as horizontally operating MEMS.

An arrangement with a fixed electrode 17 and a movable contact electrode E, as in Fig. 11a and 11b, is also advantageous in the above described MEMS, which with a contact area 16 and two fixed electrodes 17, 18 are described, realizable.

It is very advantageous in this embodiment of FIGS. 11a, b that the distance in the open state between the movable contact electrode E of the second micro-element 2 and the fixed contact 17 is selectable and manufacturing technology is very reproducible. The same applies to the others Embodiments discussed above, provided that they are analogous to 11a, b with a movable contact electrode E.

A MEMS according to the invention is not only, as in the examples above, as Switch or relay executable. Various micro-actuators can be implemented. For example, MEMS micro valves or Represent or operate micro pumps.

The substrate S used to produce a MEMS according to the invention is preferably flat. Typically it has one Main area that is structured to produce the MEMS, the Movement of the moving parts of the MEMS essentially parallel or are movable perpendicular to this main surface. Preferably there is Substrate S made of a semiconductor material, in particular silicon, which is advantageous monocrystalline and particularly advantageous (for sufficient electrical Conductivity) is also endowed. With single-crystalline silicon is under Mechanical stress-resistant bistable switchable micro elements 1,1 ', 2,19,20,23,24 advantageously no or only very slow Relaxation to be expected.

In particular, an SOI wafer (silicon-on-insulator) can be used that of three layers parallel to the substrate silicon-silicon oxide-silicon. there the silicon oxide layer serves as a sacrificial layer.

The structuring process mentioned is typically a material-removing process Process, preferably an etching process. The LIGA technology or in particular the reactive ion etching and particularly advantageously the ion etching (DRIE) come into question here. The DRIE process has the advantage to be very well suited for the creation of surfaces which (relative to their subtrate perpendicular height) are closely spaced and practically perpendicular to the main surface of the substrate S. For the laterally working MEMS is well suited DRIE. But also procedures, the material Applying are conceivable, for example when facing each other Depending on the process, surfaces must have a minimum distance. For example Rapid prototyping processes using photopolymerization.

In addition to electrostatically actuable actuators, for example also actuators that can be actuated electromagnetically or piezoelectrically will be realized. The actuating forces can be repulsive or attractive his.

A bistable switchable micro-element according to the invention can also be tristable or otherwise switchable multistable. It is for some applications furthermore, it is not necessary for the micro-elements 1, 1 ', 19, 20, 23, 24 after the first switch from the initial position A to the working position B can also be switched back to the initial position A. One can also consider a single, for example plastic, deformation. The micro elements 1, 1 ', 19, 20, 23, 24 are preferably bistably elastic switchable and switchable back to initial position A. Especially It is advantageous to use the bistable micro-elements 1,1 ', 2,19,20,23,24 the described cosine or as the described antinode Form micro-elements, these also in modified form Form and combined within a MEMS can be realized.

Depending on the purpose, the micro elements can optionally be electrically conductive or be coated electrically non-conductive. A non-conductive coating preferably serves to prevent discharges between one another touching electrostatic electrodes. For example, as an alternative or additional protection against such discharges can stop or Springs are used, as they are from the already cited DE 198 00 189 A1 are known. The contacting electrodes C, C ', D, D' can be produced in a known manner (for example by sputtering) and for example contactable by bonding.

Regarding the manufacturing process for the MEMS according to the invention, it should be noted that that the first switching of the first micro-element 1 and also the other bistable switchable micro-elements 1 ', 19, 20, 23, 24 of the initial position A in the working position B as yet to the manufacturing process of the MEMS is to be considered properly. This initial switching process can be done mechanically. However, this switching operation is preferably carried out in Carried out as part of a quality or functional test (burn-in) of the MEMS, other units connected to the substrate also being tested or can be initialized. The initial switching process can then preferably by creating an attractive force between the bistable Micro-element 1,1 ', 19,20,23,24 and the second micro-element 2 take place, this force advantageously by applying a switching voltage he follows. Such a switching voltage is typically higher than one Switching voltage used to switch the second micro-element 2 between Switch-off position A 'and switch-on position B' is used.

The features mentioned can be common or individually or in any Combination can be advantageous.

The linear expansion of the MEMS described is typically between 0.2 mm and 5 mm, preferably 0.8 mm to 2 mm. For DRIE as a structuring process is the minimum distance mentioned (minimum trench width) about 5 µm to 15 µm; it shows little dependence on the Depth of the structured trench. Typically, the depth of the structured trench 300 µm to 550 µm. By switching from the initial position A in the working position B is the corresponding distance to typically reduced to zero or 0.1 µm to 1 µm. Layer thicknesses of the electrically non-conductive coatings 3b, 3b ', 4b, 4b' are typically 50 nm to 500 nm

The switching voltages for the MEMS described (switching between the switch-off position A 'and switch-on position B') are typically 10 V to 80 V, preferably 25 V to 50 V. When the first switching of the bistable Micro-elements from the initial position A to the working position electrostatic attractive forces are typically used for this Switching voltages between 70 V and 300 V, preferably between 100 V and 200 V.

LIST OF REFERENCE NUMBERS

1

first micro element

1'

third micro element

2

second micro element

3

first surface (of the first micro-element); the second surface facing

3a

first surface (of the first micro-element); facing the second surface

3b

first coating (the first surface)

3 '

third surface (of the third micro-element); the fourth surface facing

3a '

third surface (of the third micro-element); facing the fourth surface

3b '

third coating (the third surface)

4

second surface (of the second micro-element); the first Surface facing

4a

second surface (of the second micro-element); the first area facing

4b

second coating (of the second surface)

4 '

fourth surface (of the second micro-element); the third surface facing

4a '

fourth surface (of the second micro-element); facing the third surface

4b '

fourth coating (the fourth surface)

5

Switching part of the first micro element

6

first end of the first micro element

7

second end of the first micro-element

8th

Middle between the first and the second end of the first micro-element

9

(adapted) electrode of the first micro-element

10

first fixed end of the second micro-element

10 '

second fixed end of the second micro-element

11

movable part of the second micro-element

12

gap-forming surface

13

gap

14

first area of the movable part of the second micro-element

15

second area of the movable part of the second micro-element

16.16 '

Contact area of the moving part of the second micro-element

17.18

Fixkontakte

17 ', 18'

Fixkontakte

19

fourth micro element

20

fifth micro element

21.22

contact electrode

23

sixth micro element

24

seventh micro element

25a

fifth surface (of the sixth micro-element); the sixth surface facing

25a '

seventh surface (of the seventh micro-element); facing the eighth surface

26a

sixth surface (of the second micro-element); the fifth area facing

26a '

eighth surface (of the second micro-element); the fifth area facing

A

initial position

B

working position

A '

Switch-off position (of the second micro-element)

B '

Switch-on position (of the second micro-element)

C, C '

contacting electrodes

D, D '

contacting electrodes

e

movable contact electrode (of the second micro-element)

S

substratum

Claims (23)

Micro-electromechanical system comprising a substrate (S) and a first micro-element (1) and a second micro-element (2), wherein (a) the first micro-element (1) and the second micro-element (2) are connected to the substrate (S) and (b) the first micro-element (1) has a first surface (3a) and the second micro-element (2) has a second surface (4a), which surfaces (3a, 4a) face each other and are generated by a structuring method are,
characterized by (d) that the first micro-element (1) contains a switching part (5) by means of which it can be switched bistably between an initial position (A) and a working position (B), and (e) that the distance between the first surface (3a) and the second surface (4a) in the working position (B) of the first micro-element (1) is smaller than a minimum distance that can be generated by the structuring method between the first surface (3a) and the second surface (4a). Micro-electromechanical system according to claim 1, characterized in that (a) that the first micro-element (1) has a first surface (3) which is the same as the first surface (3a) or, if the first surface (3a) is provided with a first coating (3b), is the same Surface of this coating (3b), and (b) that the second micro-element (2) has a second surface (4) which is the same as the second surface (4a) or, if the second surface (4a) is provided with a second coating (4b), is the same Surface of this coating (4b). Micro-electromechanical system according to claim 2, wherein (a) the second micro-element (2) has a first fixed end (10) firmly connected to the substrate (S) and a movable part (11),
characterized by (b) that the first surface (3) and the second surface (4) are electrically non-conductive, and (c) that the first surface (3) and the second surface (4) have contact points in the working position (B), and (d) that the second micro-element (2) can be switched from a switch-off position (A ') to a switch-on position (B') in that in the working position (B) of the first micro-element (1) the movable part (11 ) of the second micro-element (2) can be moved by electrostatic forces between the first micro-element (1) and the second micro-element (2). Micro-electromechanical system according to claim 3, characterized in that (a) that the first micro-element (1) comprises an electrode (9), which electrode (9) contains the first surface (3), and (b) that the electrode (9) and the second micro-element (2) are designed such that in the switch-on position (B ') of the second micro-element (2) the first surface (3) and the second surface ( 4) Touch all over. Micro-electromechanical system according to Claim 4, characterized in that the electrode (9) has a gap-forming surface (12) which is designed in such a way that it is set back in steps with respect to the first surface (3) and with the second micro-element ( 2) includes a gap (13) when the first micro-element (1) is in the working position (B) and the second micro-element (2) is in the switch-on position (B '). Micro-electromechanical system according to one of claims 3 to 5,
characterized in that the movable part (11) of the second micro-element (2) has a first region (14) and a second region (15), the first region (14) is arranged between the second region (15) and the first fixed end (10) of the second micro-element (2), comprises a part of the second surface (4), and is less rigid than the second region (15). Micro-electromechanical system according to one of claims 3 to 5,
characterized by (a) that the micro-electromechanical system has two fixed contacts (17, 18) firmly connected to the substrate, and (b) that the movable part (11) of the second micro-element (2) has an electrically conductive contact area (16), which contact area (16) is arranged in the area of an end of the second micro-element (2) opposite the first fixed end (10) of the second micro-element (2), and through which contact area (16) in the switch-on position (B ') of the second micro-element (2) the two fixed contacts (17, 18) are conductively connected to one another. Micro-electromechanical system according to claim 7, characterized in that (a) that the micro-electromechanical system comprises a third micro-element (1 '), which is bistable switchable, which is connected to the substrate (S), and which is arranged in an area which lies on the side of the second micro-element (2) facing away from the first micro-element (1), and (b) that the micro-electromechanical system has two further fixed contacts (17 ', 18'), which further fixed contacts (17 ', 18') are firmly connected to the substrate (S) and are arranged in an area on the the fixed contacts (17, 18) facing away from the second micro-element (2), (c) that the movable part (11) of the second micro-element (2) has a further electrically conductive contact area (16 ') which is in the area of an end opposite the first fixed end (10) of the second micro-element (2) of the second micro-element (2), on the side of the second micro-element (2) facing away from the contact area (16), and (d) the third micro-element (1 ') interacting in an analogous manner with the second micro-element (2) and with the further fixed contacts (17', 18 ') like the first micro-element (1) with the second Micro-element (2) and cooperates with the fixed contacts (17, 18). Micro-electromechanical system according to claims 6 and 7 or according to claims 6 and 8, characterized in that the contact area (16) is arranged in the second area (15) of the movable part (11) of the second micro-element (2). Micro-electromechanical system according to claim 1, characterized in that (a) that the micro-electromechanical system comprises a third micro-element (1 ') which is connected to the substrate (S) and has a third surface (3a '), (b) that the second micro-element (2) includes a switching part which a first fixed end (10) firmly connected to the substrate (S), a second fixed end (10 ') firmly connected to the substrate (S), a movable part (11) and arranged between these two fixed ends (10, 10 ') a fourth surface (4a ') has, and (c) by which switching part the second micro-element (2) can be switched between a switch-off position (A ') and a switch-on position (B'),
in which (d) the movable part (11) of the second micro-element (2) comprises an electrically conductive contact area (16), (e) the second surface (4a) is arranged between the first fixed end (10) and the contact region (16), and (f) the fourth surface (4a ') is arranged between the second fixed end (10') and the contact area (16), (g) the third surface (3a ') and the fourth surface (4a') are generated by the structuring method and face each other, and (h) that the third micro-element (1 ') contains a switching part by means of which it can be switched bistably between an initial position (A) and a working position (B), and (i) that the distance between the third surface (3a ') and the fourth surface (4a') in the working position (B) of the third micro-element (1 ') is smaller than a minimum distance between the third surface which can be generated by the structuring method ( 3a ') and the fourth surface (4a'). Micro-electromechanical system according to claim 10, characterized in that (a) that the third micro-element (1 ') has a third surface (3') which is equal to the third surface (3a ') or if the third surface (3a') has a third coating (3b ') is provided, is equal to the surface of this coating (3b '), and (b) that the second micro-element (2) has a fourth surface (4 ') which is equal to the fourth surface (4a') or if the fourth surface (4a ') is provided with a fourth coating (4b') is equal to the surface of this coating (4b '). Micro-electromechanical system according to claim 11, characterized in that (a) that the micro-electromechanical system contains two fixed contacts (17, 18) firmly connected to the substrate (S), (b) that the second micro-element (2) can be switched from its switch-off position (A ') to its switch-on position (B') by the fact that in the working position (B) the first micro-element (1) and the third micro- Element (1 ') the movable part (11) of the second micro-element (2) by electrostatic forces between the first micro-element (1) and the second micro-element (2) and between the third micro-element (1' ) and the second micro-element (2) is elastically movable, and (c) that in the switch-on position (B ') of the second micro-element (2) the two fixed contacts (17, 18) are conductively connected to one another by the contact area (16). Micro-electromechanical system according to claim 12, characterized in that (a) that the micro-electromechanical system a fourth micro-element (19) and a fifth micro element (20) includes, (b) which micro elements (19, 20) are connected to the substrate (S) in a region which is on the side of the second micro-element (2) facing away from the fixed contacts (17, 18), Include switching parts through which they can be switched bistably between an initial position (A) and a working position (B), and each have a contact electrode (21, 22) provided with an electrically conductive coating, and (c) that in the switch-off position (A ') of the second micro-element (2) in the working position (B) of the fourth micro-element (19) and the fifth micro-element (20), the two contact electrodes (21, 22) are electrically conductively connected to one another through the contact region (16). Micro-electromechanical system according to one of Claims 10 to 13, characterized in that the second micro-element (2) can be switched in a bistable, elastic manner between its switch-off position (A ') and its switch-on position (B'). Micro-electromechanical system according to claim 14, characterized in that (a) that the micro-electromechanical system a sixth micro element (23) and a seventh micro element (24) includes, (b) which micro elements (23, 24) are connected to the substrate (S), are arranged on the side of the second micro-element (2) which faces away from the second surface (4) and fourth surface (4 '), Contain switching parts by means of which they can be switched bistably between an initial position (A) and a working position (B), (c) that the sixth micro-element (23) has a fifth surface (25a), (d) that the second micro-element (2) comprises a sixth surface (26a) which, on the side of the second micro-element (2) facing away from the second surface (4), between the first fixed end (10) and the contact area (16) is arranged, (e) the fifth surface (25a) and the sixth surface (26a) facing each other and being produced by the structuring method, (f) that the seventh micro-element (24) has a seventh surface (25a '), (g) that the second micro-element (2) comprises an eighth surface (26a '), which on the fourth surface (4') facing away from the second micro-element (2) between the second fixed end (10 ') and the contact area (16) is arranged, (h) the seventh surface (25a ') and the eighth surface (26a') facing each other and being produced by the structuring method, and (i) that the distance between the fifth surface (25a) and the sixth surface (26a) in the working position (B) of the sixth micro-element (23) is smaller than a minimum distance that can be generated by the structuring method between the fifth surface (25a) and the sixth surface (26a), and (i) that the distance between the seventh surface (25a ') and the eighth surface (26a') in the working position (B) of the seventh micro-element (24) is smaller than a minimum distance between the seventh surface (25a ') and the eighth surface (25a', 26a '), and (j) that the second micro-element (2) can be switched from its switch-on position (B ') to its switch-off position (A') by the fact that in the working position (B) the sixth micro-element (23) and the seventh micro- Element (24) of the movable part (11) of the second micro-element (2) by electrostatic forces between the sixth micro-element (23) and the second micro-element (2) and between the seventh micro-element (24) and the second micro element (2) is elastically movable. Micro-electromechanical system according to one of claims 14 or 15, wherein (a) the substrate (S) is in the form of a solid with a major surface, and (b) the micro-elements (1, 1 ', 2, 19, 20, 23, 24) are designed as straight prismatic bodies, the base surfaces of which are aligned parallel to the main surface, characterized in that (c) that the movable part (11) of the second micro-element (2) is designed as a straight prismatic body and is laterally movable, and (d) that the base of the straight prismatic body forming the movable part (11) either in the switch-off position (A ') the shape of a symmetrical antinode and in the switch-on position (B ') has the shape of an asymmetrical antinode, or describes two parallel cosine-shaped lines, which are connected in the middle (8) between their two ends (6,7). Micro-electromechanical system according to one of claims 1 to 16, wherein (a) the substrate (S) is in the form of a solid with a major surface, and (b) the micro-elements (1, 1 ', 2, 19, 20, 23, 24) are designed as straight prismatic bodies, the base surfaces of which are aligned parallel to the main surface, characterized in that (c) that there is at least one micro-element (1,1 ', 2,19,20,23,24) switchable between an initial position (A) and a working position (B), the switching part of which a first fixed end firmly connected to the substrate (S), a second fixed end fixed to the substrate (S) and a movable part arranged between these two fixed ends includes, (d) which moving part is designed as a straight prismatic body and is laterally movable, and (e) that the base of the straight prismatic body forming the movable part either in the switch-off position (A ') the shape of a symmetrical antinode and in the switch-on position (B ') has the shape of an asymmetrical antinode or describes two parallel cosine-shaped lines, which are connected in the middle between their two ends. Micro-electromechanical system according to claim 3, characterized in that
the movable part (11) of the second micro-element (2) can be elastically deformed from the initial position A in the working position A by switching the first micro-element (1). Micro-electromechanical system according to claim 18, characterized in that (a) that the micro-electromechanical system has two fixed contacts (17, 18) firmly connected to the substrate, and (b) that the movable part (11) of the second micro-element (2) has an electrically conductive contact area (16), which contact area (16) is arranged in the area of an end of the second micro-element (2) opposite the first fixed end (10) of the second micro-element (2), and through which contact area (16) in the switch-off position (A ') of the second micro-element (2) the two fixed contacts (17, 18) are conductively connected to one another. Micro-electromechanical system according to one of claims 1 to 9 or 18 or 19, wherein (a) the substrate (S) is in the form of a solid body with a major surface, characterized in that (b) that the switching part (5) of the first micro-element (1) is horizontally movable, and (c) that the movable part (11) of the second micro-element (2) is horizontally movable. Process for producing a micro-electromechanical system, in which process (a) a first micro-element (1) connected to the substrate is produced from a substrate (S), and (b) a second micro-element (2) connected to the substrate is produced from a substrate, and (c) using a structuring method, a first surface (3a) of the first micro-element (1) and a second surface (4a) of the second micro-element (2) are formed, which surfaces (3a, 4a) face each other and from each other are spaced,
characterized by (d) that the first micro-element (1) is shaped such that it is in an initial position (A), it can be switched bistably from the initial position (A) to a working position (B) and the distance of the first surface (3a) from the second surface (4a) in the working position (B) is smaller than a minimum distance that can be generated by the structuring method between the first surface (3a) and the second surface (4a), and (e) after the first surface (3a) and the second surface (4a) have been shaped by the structuring method, the first micro-element (1) is switched to the working position (B). Manufacturing method according to claim 21, characterized in that before the switching of the first micro-element (1) into the working position (B), the first surface (3a) of the first micro-element (1) with a first electrically conductive or electrically non-conductive coating ( 3b) is provided,
and or
the second surface (4a) of the second micro-element (2) is provided with a second electrically conductive or electrically non-conductive coating (4b). Manufacturing method according to one of claims 21 to 22, characterized in that one of the micro-electromechanical systems is manufactured according to one of claims 1 to 20.

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