EP2290285A1 - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- EP2290285A1 EP2290285A1 EP10173791A EP10173791A EP2290285A1 EP 2290285 A1 EP2290285 A1 EP 2290285A1 EP 10173791 A EP10173791 A EP 10173791A EP 10173791 A EP10173791 A EP 10173791A EP 2290285 A1 EP2290285 A1 EP 2290285A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- led lamp
- housing
- lamp according
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
- F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an LED lamp which is arranged in an elongated hollow housing.
- an LED lamp which has an LED unit which is housed together with a matching electronics in a housing which corresponds to that of a conventional incandescent lamp.
- a converging lens is integrated in the transparent part of the housing.
- high-power LEDs have come on the market, which have an electrical power of up to a few watts. If such a high-power LED is housed in a housing, as it is out of the DE 202 19 987 U1 is known, creates a strong heat development within the housing, which can lead to damage of the high-power LED.
- the invention has for its object to provide with structurally simple means an LED lamp, in which sufficient heat dissipation is ensured in order to prevent damage to the LED unit.
- the LED lamp according to the invention has a hollow, preferably cylindrical housing made of metal, preferably brass, in which an elongated cooling body made of ceramic is arranged.
- the outer surface of the heat sink abuts against the inner surface of the housing.
- An LED unit is on the front face of the heat sink appropriate.
- At the front end of the housing is located in front of the LED unit optics.
- a groove extending in its longitudinal direction is formed on the outside of the heat sink, in which at least one the connection lines for the LED unit is arranged.
- CeramCool ® As a ceramic material for the heat sink, for example, CeramCool ® can be used, which is sold by CeramTec AG.
- the heat can be dissipated reliably by the LED unit. Since the heat sink preferably rests with its outer surface along its entire length on the inner surface of the metal housing - except in the outer groove -, the heat is perfectly dissipated to the outside, so that overheating of the LED unit is avoided. To ensure optimum heat transfer between the two surfaces of the heat sink and the housing, thermal paste or thermal adhesive can be used.
- the hollow housing is preferably cylindrical with a circular cross-section.
- other cross sections are possible, e.g. oval or rectangular cross sections.
- terminals for the LED unit in contact with the leads are projected onto the front face of the ceramic heat sink, e.g. metallized by electroplating.
- the heat sink made of ceramic can be coated directly and therefore used as a circuit carrier. At the same time it is reliably electrically isolated.
- the LED unit is connected to the heat sink via a metallized on the front end side of the heat sink contact surface.
- a high-power LED often has not only the electrical connections, but also a metallic surface through which heat can be dissipated. This metallic Surface is connected to the metallized contact surface on the heat sink, whereby a reliable dissipation of heat is ensured.
- circuit electronics e.g. be accommodated for the current control for the LED unit in a recess in the heat sink, which is preferably formed in the side wall of the heat sink. Circuits for the circuit electronics can also be applied by metallization.
- a storage choke consisting e.g. of a ferrite core and a surrounding choke coil adjacent to the rear end face of the heat sink are arranged in the housing.
- the rear end face of the housing is preferably closed by an insulating bush, in which at least one contact pin is arranged, which is connected to the at least one connecting line.
- the optics can be formed by a condenser lens, a rod lens or other lenses or in the simplest case by a protective glass. Between the LED unit and lens optics also a variety of aperture elements can be accommodated.
- LED lamp 10 shown has a total of hollow cylindrical, elongated housing 11 made of metal, for example brass.
- the front end opening of the housing 11 is closed by a converging lens 12, which is mounted concentrically to the central axis of the housing 11.
- the housing 11 has an outwardly extending annular collar 24.
- the opening of the rear end face of the housing 11 is closed by an insulating sleeve 22 made of insulating material.
- the front end of the insulating sleeve 22 extends in a radial plane to the central axis of the housing 11.
- At the front end of the insulating sleeve 22 is an elongated, generally cylindrical ceramic body 14 with its rear Front side.
- the outer diameter of the ceramic body 14 corresponds to the inner diameter of the housing 11 in this area, so that it touches the inner surface of the housing 11 with its outer surface.
- the front end face of the ceramic body 14 is spaced from the condenser lens 12 so that a gap 13 is formed between them.
- an LED unit 16 is mounted centrally, the front end side is located at a small distance to the condenser lens 12.
- a first connecting line 21 of the LED unit 16 is connected in the intermediate space 13 between the condenser lens 12 and the heat sink 14 to the housing 11.
- This connection diametrically opposite in the outer surface of the heat sink 14 is formed in its longitudinal direction extending outer groove 18 which extends over the entire length of the heat sink 14 and thus forms a passage between the gap 13 and the rear end of the heat sink 14.
- a contact pin 26 is coaxially inserted, which rests with its front end on the rear end side of the heat sink 14 and the rear end projects beyond the insulating sleeve 22.
- a radial groove 28 is formed, which communicates with the outer groove 18 in the heat sink 14 and leads to the contact element 26.
- a second connection line 20 of the LED unit 16 is connected to one end of the LED unit 16 and contacted with its other end with the contact element 26 and extends over the intermediate space 13 through the outer groove 18 and the radial groove 28th
- LED lamp 10 is no electronic circuitry for the LED unit 16 housed.
- the electronic circuit (not shown) is arranged outside and is connected via the contact pin 26 and the housing 11 with the LED unit 16 in connection.
- the LED unit 16 has on its rear side a metallic surface 15, which is provided with a galvanized on the front end side of the heat sink 14 contact surface 17, for. is connected by soldering, whereby an excellent heat transfer between the LED unit 16 and the heat sink 14 is ensured.
- connection lines 21 and 20 with metallized on the front end side of the heat sink 14 contact surfaces, which in turn are in contact with terminals of the LED unit 16.
- Another possibility is to apply a high-power LED chip directly to the ceramic body and to bond the terminals of the chip directly to the metallized pads of the ceramic body.
- the in the FIGS. 3 to 6 shown LED lamp 30 differs from the LED lamp 10 of FIGS. 1 and 2 essentially in that a circuit electronics 37 is integrated in the LED lamp 30. Elements that also in the embodiment of Fig. 1 are present, are denoted by the same reference numerals.
- the circuit electronics 37 are arranged in a recess 36 in the heat sink 32, which is formed by an enlarged intermediate portion of the outer groove 34 between a front groove portion 34a and a rear groove portion 34b.
- the tracks for the circuit electronics 37 are galvanized in the recess 36 on the material of the heat sink 32.
- the one connecting line 21 of the LED unit 16 can also be in communication with the housing 11 here.
- the second connecting line 38 is in contact with a terminal 39 for the LED unit 16, which is metallized on the front end face of the heat sink 14, 32, and extends over the front groove portion 34a of the outer groove 34 in the recess 36th
- the rear end of the housing 11 is closed by an insulating bushing 52. Between the front end of the insulating bushing 52 and the rear end face of the heat sink 32, a storage inductor 44 is arranged, which is formed by a ferrite core 42 which is surrounded by a choke coil 40.
- the choke coil 40 is connected via two connecting lines with the switching electronics 37 in connection, which are guided by the rear groove portion 34b of the outer groove 34.
- three contact pins 46, 48, 50 are used, which are connected via connecting wires to the circuit electronics in connection.
- one connection for the power supply another one e.g. for the fast time-synchronous switching on and off of the LED and the next one e.g. used for adjusting the brightness.
- the number of ports may vary depending on the required control signals.
- a serial bus connection for the various settings and control functions is also possible.
- the connections can be made as contact pins as shown, but also as multi-pole miniature connectors.
Abstract
Description
Die Erfindung betrifft eine LED-Lampe, die in einem länglichen hohlen Gehäuse angeordnet ist.The invention relates to an LED lamp which is arranged in an elongated hollow housing.
Aus der
In letzter Zeit sind Hochleistungs-LED auf den Markt gekommen, die eine elektrische Leistung bis zu einigen Watt aufweisen. Wenn eine solche Hochleistungs-LED in einem Gehäuse untergebracht wird, wie es aus der
Der Erfindung liegt die Aufgabe zugrunde, mit konstruktiv einfachen Mitteln eine LED-Lampe zu schaffen, bei der eine ausreichende Wärmeabführung gewährleistet ist, um die Beschädigung der LED-Einheit zu verhindern.The invention has for its object to provide with structurally simple means an LED lamp, in which sufficient heat dissipation is ensured in order to prevent damage to the LED unit.
Diese Aufgabe wird erfindungsgemäß durch eine LED-Lampe mit den Merkmalen des Patentanspruchs 1 gelöst. Vorteilhafte Weiterbildungen der erfindungsgemäßen LED-Lampe sind Gegenstand der Patentansprüche 2 bis 10.This object is achieved by an LED lamp with the features of claim 1. Advantageous developments of the LED lamp according to the invention are the subject of claims 2 to 10.
Die erfindungsgemäße LED-Lampe weist ein hohles, vorzugsweise zylindrisches Gehäuse aus Metall, vorzugsweise Messing, auf, in dem ein länglicher Kühlkörper aus Keramik angeordnet ist. Die Außenfläche des Kühlkörpers liegt an der Innenfläche des Gehäuses an. Eine LED-Einheit ist auf der vorderen Stirnseite des Kühlkörpers angebracht. An dem vorderen Stirnende des Gehäuses befindet sich vor der LED-Einheit eine Optik. Um eine elektrische Verbindung zwischen der LED-Einheit und einem am hinteren Ende des Gehäuses vorgesehenen Kontaktelement zu schaffen, das mit einer Stromversorgung in Kontakt gebracht werden kann, ist an der Außenseite des Kühlkörpers eine sich in dessen Längrichtung erstreckende Nut ausgebildet, in der wenigstens eine der Anschlussleitungen für die LED-Einheit angeordnet ist.The LED lamp according to the invention has a hollow, preferably cylindrical housing made of metal, preferably brass, in which an elongated cooling body made of ceramic is arranged. The outer surface of the heat sink abuts against the inner surface of the housing. An LED unit is on the front face of the heat sink appropriate. At the front end of the housing is located in front of the LED unit optics. In order to provide an electrical connection between the LED unit and a contact element provided at the rear end of the housing, which can be brought into contact with a power supply, a groove extending in its longitudinal direction is formed on the outside of the heat sink, in which at least one the connection lines for the LED unit is arranged.
Als Keramikmaterial für den Kühlkörper kann beispielsweise CeramCool® verwendet werden, das von der Firma CeramTec AG vertrieben wird.As a ceramic material for the heat sink, for example, CeramCool ® can be used, which is sold by CeramTec AG.
Durch das Keramikmaterial kann die Wärme zuverlässig von der LED-Einheit abgeführt werden. Da der Kühlkörper mit seiner Außenfläche bevorzugt entlang seiner gesamten Länge an der Innenfläche des Gehäuses aus Metall anliegt - außer im Bereich der Außennut - , wird die Wärme hervorragend nach außen abgeleitet, so dass eine Überhitzung der LED-Einheit vermieden wird. Um einen optimalen Wärmeübergang zwischen den zwei Flächen des Kühlkörpers und des Gehäuses zu gewährleisten, kann Wärmeleitpaste oder Wärmeleitkleber verwendet werden.Due to the ceramic material, the heat can be dissipated reliably by the LED unit. Since the heat sink preferably rests with its outer surface along its entire length on the inner surface of the metal housing - except in the outer groove -, the heat is perfectly dissipated to the outside, so that overheating of the LED unit is avoided. To ensure optimum heat transfer between the two surfaces of the heat sink and the housing, thermal paste or thermal adhesive can be used.
Das hohle Gehäuse ist bevorzugt zylindrisch mit kreisförmigem Querschnitt ausgebildet. Es sind jedoch auch andere Querschnitte möglich, z.B. ovale oder rechteckige Querschnitte.The hollow housing is preferably cylindrical with a circular cross-section. However, other cross sections are possible, e.g. oval or rectangular cross sections.
Vorzugsweise sind mit den Anschlussleitungen in Kontakt stehende Anschlüsse für die LED-Einheit auf die vordere Stirnfläche des Kühlkörpers aus Keramik z.B. durch Galvanisierung metallisiert. Der Kühlkörper aus Keramik kann direkt beschichtet und daher als Schaltungsträger verwendet werden. Gleichzeitig ist er zuverlässig elektrisch isoliert.Preferably, terminals for the LED unit in contact with the leads are projected onto the front face of the ceramic heat sink, e.g. metallized by electroplating. The heat sink made of ceramic can be coated directly and therefore used as a circuit carrier. At the same time it is reliably electrically isolated.
Bei einer bevorzugten Ausführungsform ist die LED-Einheit über eine auf die vordere Stirnseite des Kühlkörpers metallisierte Kontaktfläche mit dem Kühlkörper verbunden. Eine Hochleistungs-LED weist oft neben den elektrischen Anschlüssen auch eine metallische Fläche auf, über die Wärme abgeführt werden kann. Diese metallische Fläche wird mit der metallisierten Kontaktfläche auf dem Kühlkörper verbunden, wodurch eine zuverlässige Abfuhr von Wärme gewährleistet wird.In a preferred embodiment, the LED unit is connected to the heat sink via a metallized on the front end side of the heat sink contact surface. A high-power LED often has not only the electrical connections, but also a metallic surface through which heat can be dissipated. This metallic Surface is connected to the metallized contact surface on the heat sink, whereby a reliable dissipation of heat is ensured.
Zusätzlich kann eine Schaltungselektronik, z.B. für die Stromregelung für die LED-Einheit in einer Aussparung in dem Kühlkörper untergebracht werden, die vorzugsweise in der Seitenwand des Kühlkörpers ausgebildet ist. Leiterbahnen für die Schaltungselektronik können ebenfalls durch Metallisierung aufgebracht werden.In addition, circuit electronics, e.g. be accommodated for the current control for the LED unit in a recess in the heat sink, which is preferably formed in the side wall of the heat sink. Circuits for the circuit electronics can also be applied by metallization.
Es ist auch möglich, die Aussparung in der hinteren Stirnseite des Kühlkörpers auszubilden.It is also possible to form the recess in the rear end side of the heat sink.
Bei den erfindungsgemäßen Ausführungsformen, bei denen eine Schaltungselektronik in einer Aussparung angeordnet ist, kann eine Speicherdrossel bestehend z.B. aus einem Ferritkern und einer diesen umgebenden Drosselspule angrenzend an die hintere Stirnseite des Kühlkörpers in dem Gehäuse angeordnet werden.In the embodiments according to the invention, in which a circuit electronics is arranged in a recess, a storage choke consisting e.g. of a ferrite core and a surrounding choke coil adjacent to the rear end face of the heat sink are arranged in the housing.
Die hintere Stirnseite des Gehäuses wird vorzugsweise durch eine Isolierbuchse verschlossen, in der wenigstens ein Kontaktstift angeordnet ist, der mit der wenigstens einen Anschlussleitung verbunden ist.The rear end face of the housing is preferably closed by an insulating bush, in which at least one contact pin is arranged, which is connected to the at least one connecting line.
Die Optik kann abhängig vom Einsatzgebiet der LED-Lampe von einer Kondensorlinse, einer Stablinse oder anderen Linsen oder im einfachsten Fall von einem Schutzglas gebildet werden. Zwischen der LED-Einheit und Linsenoptik können auch verschiedenste Blendenelemente untergebracht werden.Depending on the field of application of the LED lamp, the optics can be formed by a condenser lens, a rod lens or other lenses or in the simplest case by a protective glass. Between the LED unit and lens optics also a variety of aperture elements can be accommodated.
Ausführungsbeispiele der Erfindung werden nachstehend anhand von Zeichnungen näher erläutert. Es zeigen
- Figur 1
- eine perspektivische Ansicht einer ersten Ausführungsform einer LED- Lampe,
- Figur 2
- einen Längsschnitt durch die LED-Lampe von
Figur 1 , - Figur 3
- einen Längsschnitt durch eine zweite Ausführungsform der LED-Lampe,
- Figur 4
- die Einzelheit X von
Fig. 3 , - Figur 5
- eine Seitenansicht des Kühlkörpers der LED-Lampe von
Fig. 3 , - Figur 6
- eine Stirnansicht des Kühlkörpers von
Figur 5 .
- FIG. 1
- a perspective view of a first embodiment of an LED lamp,
- FIG. 2
- a longitudinal section through the LED lamp of
FIG. 1 . - FIG. 3
- a longitudinal section through a second embodiment of the LED lamp,
- FIG. 4
- the detail X of
Fig. 3 . - FIG. 5
- a side view of the heat sink of the LED lamp of
Fig. 3 . - FIG. 6
- an end view of the heat sink of
FIG. 5 ,
Die in
In die Isolierbuchse 22 ist koaxial ein Kontaktstift 26 eingesetzt, der mit seinem vorderen Ende an der hinteren Stirnseite des Kühlkörpers 14 anliegt und dessen hinteres Ende über die Isolierbuchse 22 vorsteht. In der vorderen Stirnseite der Isolierbuchse 22 ist eine Radialnut 28 ausgebildet, die mit der Außennut 18 in dem Kühlkörper 14 in Verbindung steht und zu dem Kontaktelement 26 führt. Eine zweite Anschlussleitung 20 der LED-Einheit 16 ist mit einem Ende an der LED-Einheit 16 und mit ihrem anderen Ende mit dem Kontaktelement 26 kontaktiert und verläuft über den Zwischenraum 13 durch die Außennut 18 und die Radialnut 28.In the insulating
In der in den
Die LED-Einheit 16 weist an ihrer hinteren Seite eine metallische Fläche 15 auf, die mit einer auf die vordere Stirnseite des Kühlkörpers 14 aufgalvanisierten Kontaktfläche 17 z.B. durch Löten verbunden ist, wodurch ein ausgezeichneter Wärmeübergang zwischen der LED-Einheit 16 und dem Kühlkörper 14 gewährleistet wird.The
Es ist auch möglich, die Anschlussleitungen 21 und 20 mit auf die vordere Stirnseite des Kühlkörpers 14 metallisierten Kontaktflächen zu verbinden, die ihrerseits mit Anschlüssen der LED-Einheit 16 in Kontakt stehen.It is also possible to connect the connection lines 21 and 20 with metallized on the front end side of the
Eine weitere Möglichkeit ist es, einen Hochleistungs-LED-Chip direkt auf den Keramikkörper aufzubringen und die Anschlüsse des Chips direkt zu den metallisierten Anschlussflächen des Keramikkörpers zu bonden.Another possibility is to apply a high-power LED chip directly to the ceramic body and to bond the terminals of the chip directly to the metallized pads of the ceramic body.
Die in den
Das hintere Ende des Gehäuses 11 ist durch eine Isolierbuchse 52 verschlossen. Zwischen der vorderen Stirnseite der Isolierbuchse 52 und der hinteren Stirnseite des Kühlkörpers 32 ist eine Speicherdrossel 44 angeordnet, die von einem Ferritkern 42 gebildet wird, der von einer Drosselspule 40 umgeben wird.The rear end of the
Die Drosselspule 40 steht über zwei Anschlussleitungen mit der Schaltelektronik 37 in Verbindung, die durch den hinteren Nutabschnitt 34b der Außennut 34 geführt sind.The
In die hintere Stirnseite der Isolierbuchse 52 sind drei Kontaktstifte 46, 48, 50 eingesetzt, die über Anschlussdrähte mit der Schaltungselektronik in Verbindung stehen. Dabei kann ein Anschluss für die Stromversorgung, ein Anderer z.B. für das schnelle zeitsynchrone Ein- und Ausschalten der LED und der Nächste z.B. für die Einstellung der Helligkeit verwendet werden. Die Anzahl der Anschlüsse kann abhängig von den benötigten Steuersignalen variieren. Eine serielle Busverbindung für die verschiedenen Einstellungen und Steuerfunktionen ist ebenso realisierbar. Die Anschlüsse können, wie abgebildet als Kontaktstifte, aber auch als mehrpoliger Miniatur-Steckverbinder ausgeführt werden.In the rear end face of the insulating
Claims (10)
einem hohlen Gehäuse (11) aus Metall,
einem länglichen Kühlkörper (14, 32) aus Keramik, der in dem Gehäuse (11) angeordnet ist und dessen Außenfläche an der Innenfläche des Gehäuses (11) anliegt, einer LED-Einheit (16), die auf der vorderen Stirnseite des Kühlkörpers (14, 32) angebracht ist, und
einer Optik (12), die an dem vorderen Stirnende des Gehäuses (11) vor der LED-Einheit (16) angebracht ist,
wobei an der Außenseite des Kühlkörpers (14, 32) eine sich in dessen Längrichtung erstreckende Außennut (18, 34) ausgebildet ist, in der wenigstens eine der Anschlussleitungen (20, 38) für die LED-Einheit (16) angeordnet ist.LED lamp with
a hollow housing (11) made of metal,
an elongated heat sink (14, 32) of ceramic, which is arranged in the housing (11) and whose outer surface bears against the inner surface of the housing (11), an LED unit (16) on the front end side of the heat sink (14 , 32), and
an optic (12), which is attached to the front end of the housing (11) in front of the LED unit (16),
wherein on the outside of the heat sink (14, 32) extending in the longitudinal direction of the outer groove (18, 34) is formed, in which at least one of the connecting lines (20, 38) for the LED unit (16) is arranged.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009038827A DE102009038827B4 (en) | 2009-08-25 | 2009-08-25 | Led lamp |
Publications (1)
Publication Number | Publication Date |
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EP2290285A1 true EP2290285A1 (en) | 2011-03-02 |
Family
ID=43332729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP10173791A Withdrawn EP2290285A1 (en) | 2009-08-25 | 2010-08-24 | LED lamp |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110051432A1 (en) |
EP (1) | EP2290285A1 (en) |
DE (1) | DE102009038827B4 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012136578A1 (en) * | 2011-04-04 | 2012-10-11 | Ceramtec Gmbh | Led lamp comprising an led as the luminaire and a glass or plastic lampshade |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Also Published As
Publication number | Publication date |
---|---|
DE102009038827A8 (en) | 2011-06-01 |
DE102009038827A1 (en) | 2011-03-03 |
DE102009038827B4 (en) | 2012-10-25 |
US20110051432A1 (en) | 2011-03-03 |
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