EP2737549A1 - Solar cell and method of fabricating the same - Google Patents
Solar cell and method of fabricating the sameInfo
- Publication number
- EP2737549A1 EP2737549A1 EP12820573.9A EP12820573A EP2737549A1 EP 2737549 A1 EP2737549 A1 EP 2737549A1 EP 12820573 A EP12820573 A EP 12820573A EP 2737549 A1 EP2737549 A1 EP 2737549A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- solar cell
- optical path
- path converting
- protrusion pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 230000003287 optical effect Effects 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 27
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 10
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 229910021478 group 5 element Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002585 base Substances 0.000 claims description 6
- 229910052723 transition metal Inorganic materials 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 4
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000000750 constant-initial-state spectroscopy Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052730 francium Inorganic materials 0.000 description 1
- KLMCZVJOEAUDNE-UHFFFAOYSA-N francium atom Chemical compound [Fr] KLMCZVJOEAUDNE-UHFFFAOYSA-N 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/056—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means the light-reflecting means being of the back surface reflector [BSR] type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the embodiment relates to a solar cell and a method of fabricating the same.
- a CIGS-based solar cell which is a PN hetero junction apparatus having a substrate structure including a glass substrate, a metallic back electrode layer, a P type CIGS-based light absorbing layer, a high resistance buffer layer, and an N type window layer, has been extensively used.
- the embodiment provides a solar cell which may be easily fabricated and have improved photoelectric conversion efficiency.
- a solar cell including a back electrode layer on a support substrate; an optical path converting layer on the back electrode layer, the optical path converting layer including a protrusion pattern; a light absorbing layer on the optical path converting layer; and a front electrode layer on the light absorbing layer.
- a method for fabricating a solar cell includes the steps of: forming a back electrode layer on a support substrate; forming an optical path converting layer on the back electrode layer and forming a protrusion pattern by etching the optical path converting layer; forming a light absorbing layer including the protrusion pattern on the optical path converting layer; and forming a front electrode layer on the light absorbing layer.
- the solar cell according to the embodiment includes an optical path converting layer which includes a protrusion pattern and is disposed on the back electrode layer.
- the optical path converting layer including the protrusion pattern reflects a light, which is transmitted without being absorbed in the light absorbing layer, toward the light absorbing layer, so that a light absorption rate of the light absorbing layer may be increased.
- the solar cell according to the embodiment may have improved efficiency.
- the light absorption rate of the light absorbing layer may be increased.
- the efficiency of the solar cell can be improved even if the light absorbing layer has a thin thickness.
- the solar cell according to the embodiment can be fabricated by using the light absorbing layer having the thin thickness, so that a thin film solar cell having a thickness in the range of several nm to several hundreds of nm may be provided.
- the thickness of the light absorbing layer may be reduced due to the protrusion pattern, so that the raw material cost may be reduce and the productivity may be improved.
- the solar cell may have good physical and chemical interfacial characteristics between the optical path converting layer and the light absorbing layer.
- the optical path converting layer may include a group V element.
- the interfacial characteristic of the optical path converting layer with respect to the light absorbing layer may be more improved.
- FIG. 1 is a sectional view showing a solar cell according to the embodiment
- FIG. 2 is a transparent perspective view showing the solar cell according to the embodiment
- FIG. 3 is a sectional view of a protrusion included in an optical path converting layer according to the embodiment
- FIG. 4 is a sectional view showing a solar cell according to another embodiment
- FIG. 5 is a sectional view illustrating a process of converting an optical path of an incident light by the optical path converting layer according to the embodiment.
- FIGS. 6 to 12 are views illustrating a process of fabricating a solar cell according to the embodiment.
- FIGS. 1 and 4 are sectional views showing a solar cell according to the embodiment.
- FIG. 2 is a transparent perspective view showing the solar cell of FIG. 1.
- FIG. 3 is a sectional view of a protrusion included in an optical path converting layer according to the embodiment.
- FIG. 5 is a sectional view illustrating a process of converting an optical path of an incident light by the optical path converting layer according to the embodiment.
- the solar cell according to the embodiment includes a back electrode layer 200 which is formed on a support substrate 100, an optical path converting layer 300 which includes a protrusion pattern and is disposed on the back electrode layer 200, a light absorbing layer 400 which is disposed on the optical path converting layer 300, a buffer layer 500 on the light absorbing layer 400, a high-resistance buffer layer 600 on the buffer layer 500, and a front electrode layer 700 on the high-resistance buffer layer 600.
- the support substrate 100 has a plate shape and supports the back electrode layer 200, the optical path converting layer 300, the light absorbing layer 400, the buffer layer 500, the high-resistance buffer layer 600 and the front electrode layer 700.
- the support substrate 100 may be an insulator.
- the support substrate 100 may be a glass substrate, a plastic substrate or a metal substrate.
- the support substrate 100 may be a soda lime glass substrate.
- the support substrate 100 may be transparent. Further, the support substrate 100 may be rigid or flexible.
- the back electrode layer 200 is disposed on the support substrate 100.
- the back electrode layer 200 is a conductive layer.
- a material used for the back electrode layer 200 is metal such as molybdenum (Mo).
- the back electrode layer 200 may include two layers or more.
- the layers may be formed of the same material or different materials, respectively.
- the optical path converting layer 300 is disposed on the back electrode layer 200.
- the optical path converting layer 300 includes the protrusion pattern 320.
- the optical path converting layer 300 includes a compound selected from the group consisting of zinc oxide, indium tin oxide (ITO), tin oxide and a combination thereof.
- the optical path converting layer 300 may be zinc oxide.
- optical path converting layer 300 may be transparent.
- the optical path converting layer 300 may have a thickness in the range of 10 nm to 100 nm.
- the optical path converting layer 300 may include a material selected from the group consisting of a group V element, a transition metal element, alkali metal and a combination thereof.
- the optical path converting layer 300 may be doped with a dopant selected from the group consisting of a group V element, a transition metal element, alkali metal and a combination thereof.
- the optical path converting layer 300 may be doped with a compound consisting of a group V element, a transition metal element, alkali metal and a combination thereof. That is, the optical path converting layer 300 may be doped with at least two doping materials.
- the dopant concentration is in a range of 1.0 ⁇ 1016 atoms/cm3 to 1.0 ⁇ 1019 atoms/cm3, but the embodiment is not limited thereto.
- the group V element may include one selected from the group consisting of nitrogen, phosphor, arsenic and a combination thereof, but the embodiment is not limited thereto.
- the transition metal element includes one selected from the group consisting of vanadium (V), chrome (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu) and a combination thereof, but the embodiment is not limited thereto.
- the alkali metal may include one selected from the group consisting of lithium (Li), potassium (K), rubidium (Rb), cesium (Cs), francium (Fr) and a combination thereof, but the embodiment is not limited thereto.
- the protrusion pattern 320 may have various shapes to the extent that the protrusion pattern 320 has a shape including an inclined surface inclined with respect to the support substrate 100. Further, as shown in FIG, 1, although the protrusion pattern 320 has a regular interval, the shape of the protrusion pattern 320 is not limited thereto, and the protrusion pattern 320 may include protrusions which have various sizes and are spaced apart from each other at irregular intervals.
- the protrusion pattern 320 may have a pyramid shape, a hemisphere shape, or a triangular prism shape.
- the protrusion pattern 320 may have a pyramid shape.
- the protrusion pattern 320 may include the first and second inclined surfaces 321 and 322 which are opposite to each other.
- the first inclined surfaces 321 are directed in the first direction.
- the first inclined surfaces 321 may extend in the same direction.
- the first inclined surfaces 321 are inclined with respect to an upper surface of the back electrode layer 200.
- the second inclined surfaces 322 may extend in the same direction.
- the second inclined surfaces 322 may be opposite to the first inclined surfaces 321.
- the second inclined surfaces 322 may be symmetrical to the first inclined surfaces 321.
- Gradients ( ⁇ 1, ⁇ 2) of the first and second inclined surfaces about the back electrode layer 200 may be in the range of about 10 degrees to about 90 degrees.
- the gradients ( ⁇ 1, ⁇ 2) of the first and second inclined surfaces may be in the range of about 30 degrees to about 55 degrees.
- the gradient of the first inclined surface may be equal to or different from the gradient of the second inclined surface.
- the optical path converting layer 300 may include a base layer 310 disposed on the back electrode layer 100 and the protrusion pattern 320 on the base layer 310. That is, as shown in FIGS. 1 and 2, the optical path converting layer 300 may be formed only with the protrusion pattern 320, or, as shown in FIGS. 3 and 4, may have the base layer 310 and the protrusion pattern 320 on the base layer 310.
- the base layer 310 is prepared as a thin film.
- the protrusion pattern 320 on the base layer 310 may have a height in the range of 30 nm to 100 nm.
- the surface area of the optical path converting layer 300 may be expanded due to the protrusion pattern 320 and may scatter an incident light.
- the protrusion pattern 320 may reflect the light incident from the top of the optical path converting layer 300 in several directions.
- the light incident into an upper surface of the back electrode layer 200 through the light absorbing layer 400 is scattered by the protrusion pattern 320.
- the light incident from the top to the bottom is laterally reflected by the protrusion pattern 320 placed over the upper surface of the back electrode layer 200.
- the optical path of the reflected light in the light absorbing layer 400 can be increased.
- the optical path of the light passing through the light absorbing layer 400 can be increased, so that the photoelectric conversion efficiency may be improved.
- the solar cell due to the optical path converting layer 300 including the protrusion pattern 320, the solar cell may have the improved efficiency even if the light absorbing layer 400 has a thin thickness.
- the solar cell according to the embodiment can be fabricated by using the light absorbing layer 400 having the thinner thickness, so that a thin film solar cell having a thickness in the range of several nm to several hundreds of nm may be provided.
- the upper surface of the optical path converting layer 300 may represent high roughness. That is, the optical path converting layer 300 may be fully formed with the protrusion pattern 320, or a concavo-convex section such as the protrusion pattern 320 is formed on the upper surface of the base layer 200.
- the upper surface of the back electrode has a large surface area. Therefore, the back electrode layer 200 and the light absorbing layer 400 have a large contact area. Accordingly, the back electrode layer 200 and the light absorbing layer 400 have improved physical and electrical contact characteristics.
- the light absorbing layer 400 is disposed on the optical path converting layer 300.
- the optical path converting layer 300 is coated around the back electrode layer 200 and the light absorbing layer 300.
- the light absorbing layer 400 includes a group I-III-VI compound.
- the light absorbing layer 400 may have a CIGSS (Cu(IN,Ga)(Se,S)2) crystal structure, a CISS (Cu(IN)(Se,S)2) crystal structure or a CGSS (Cu(Ga)(Se,S)2) crystal structure.
- the energy band gap of the light absorbing layer 400 may be in the range of about 1 eV to about 1.8 eV.
- the buffer layer 500 is disposed on the light absorbing layer 400.
- the buffer layer 500 directly makes contact with the light absorbing layer 400.
- cadmium sulfide (CdS) is used as a material of the buffer layer 500.
- the energy band gap of the buffer layer 500 is in the range of about 1.9 eV to about 2.3 eV.
- the high resistance buffer layer 600 is disposed on the buffer layer 500.
- the high resistance buffer layer 600 includes i-ZnO that is not doped with impurities.
- the energy band gap of the high resistance buffer layer 600 may be in the range of about 3.1 eV to about 3.3 eV.
- the front electrode layer 700 is disposed on the high resistance buffer layer 600.
- the front electrode layer 700 is a transparent and conductive layer.
- a material such as Al doped zinc oxide (Al doped ZnO;AZO) may be used for the front electrode layer 700.
- FIGS. 6 to 12 are views illustrating a process of fabricating a solar cell according to the embodiment. The fabrication method will be described with reference to the solar cell described above. The description about the solar cell may be basically incorporated herein by reference.
- the back electrode layer 200 is formed by depositing a metal such as molybdenum (Mo) on the support substrate 100 through a sputtering process.
- the back electrode layer 200 may be formed by performing processes twice under different conditions.
- the optical path converting layer 300 is formed on the back electrode layer 200 and is etched, such that the protrusion pattern 320 is formed.
- the protrusion pattern 320 may be formed by wet-etching or dry-etching the optical path converting layer 300.
- an etching solution generally used in the art such as a hydrochloric acid or a nitric acid, is used.
- the optical path converting layer 300 disposed on the back electrode layer 200 is dipped into an solution including a hydrochloric acid (HCl) by a predetermined % and is reacted for several seconds to several hours, such that the optical path converting layer 300 may be etched.
- HCl hydrochloric acid
- the etching degree of the optical path converting layer 300 may be controlled according to the conditions of the etching process such as acidity of the etching solution, concentration of the etching solution, reaction time, reaction temperature, etc.
- the etching process is performed under the condition that may sufficiently etch the optical path converting layer 300, as shown in FIG. 1, the optical path converting layer 300 is entirely converted into the protrusion pattern 320.
- the entire upper surface of the optical path converting layer 300 may not be uniformly etched. That is, the optical path converting layer 300 may be selectively etched naturally. For example, one part of the optical path converting layer 300 is etched too much and the other part is insufficiently etched, such that the optical path converting layer 300 may have the inclined surface inclined with respect to the support substrate 100.
- the upper surface of the optical path converting layer 300 is partially etched, such that the protrusion pattern 320 is formed and the optical path converting layer 300, which comes into contact with the back electrode layer 200, may remain in a thin film shape.
- the light absorbing layer 400 is formed on the back electrode layer 200 and the optical path converting layer 300.
- the light absorbing layer 400 may be formed through a sputtering process or an evaporation process.
- Cu, In, Ga and Se are simultaneously or independently evaporated to form the CIGS-based light absorbing layer, or the light absorbing layer can be formed through the selenization process after forming a metal precursor layer.
- the metal precursor layer is formed on the back electrode layer 200 by performing the sputtering process using a Cu target, an In target, and a Ga target.
- the selenization process is performed to form the CIGS-based light absorbing layer.
- the sputtering process using the Cu target, the In target, and the Ga target and the selenization process can be simultaneously performed.
- the CIS-based or CIG-based light absorbing layer 400 can be formed through the selenization process and the sputtering process using only the Cu and In targets or the Cu and Ga targets.
- the buffer layer 500 and the high resistance buffer layer 600 are formed on the light absorbing layer 400.
- the buffer layer 500 may be formed through a CBD (Chemical Bath Deposition) process.
- CBD Chemical Bath Deposition
- the light absorbing layer 400 is immersed in a solution including materials for forming cadmium sulfide, such that the buffer layer 500 including the cadmium sulfide is formed on the light absorbing layer 400.
- i-ZnO that is not doped with impurities is deposited on the buffer layer 500 through the sputtering process and then the high resistance buffer layer 600 is formed.
- the front electrode layer 700 is formed on the high resistance buffer layer 600.
- transparent conductive materials are laminated on the high resistance buffer layer 700.
- transparent conductive materials include zinc oxide doped with aluminum, indium zinc oxide or indium tin oxide (ITO).
- the solar cell having improved efficiency can be fabricated.
- any reference in this specification to “one embodiment,” “an embodiment,” “example embodiment,” etc. means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention.
- the appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment.
Abstract
Description
- The embodiment relates to a solar cell and a method of fabricating the same.
- Recently, as energy consumption is increased, a solar cell has been developed to convert solar energy into electrical energy.
- In particular, a CIGS-based solar cell, which is a PN hetero junction apparatus having a substrate structure including a glass substrate, a metallic back electrode layer, a P type CIGS-based light absorbing layer, a high resistance buffer layer, and an N type window layer, has been extensively used.
- The embodiment provides a solar cell which may be easily fabricated and have improved photoelectric conversion efficiency.
- According to the embodiment, there is provided a solar cell including a back electrode layer on a support substrate; an optical path converting layer on the back electrode layer, the optical path converting layer including a protrusion pattern; a light absorbing layer on the optical path converting layer; and a front electrode layer on the light absorbing layer.
- A method for fabricating a solar cell according to the embodiment includes the steps of: forming a back electrode layer on a support substrate; forming an optical path converting layer on the back electrode layer and forming a protrusion pattern by etching the optical path converting layer; forming a light absorbing layer including the protrusion pattern on the optical path converting layer; and forming a front electrode layer on the light absorbing layer.
- The solar cell according to the embodiment includes an optical path converting layer which includes a protrusion pattern and is disposed on the back electrode layer. The optical path converting layer including the protrusion pattern reflects a light, which is transmitted without being absorbed in the light absorbing layer, toward the light absorbing layer, so that a light absorption rate of the light absorbing layer may be increased. Thus, the solar cell according to the embodiment may have improved efficiency.
- That is, since an optical path of an incident light is lengthened about two times due to the optical path converting layer including the protrusion pattern, the light absorption rate of the light absorbing layer may be increased.
- Further, according to the solar cell of the embodiment, due to the optical path converting layer including the protrusion pattern 320, the efficiency of the solar cell can be improved even if the light absorbing layer has a thin thickness. Thus, the solar cell according to the embodiment can be fabricated by using the light absorbing layer having the thin thickness, so that a thin film solar cell having a thickness in the range of several nm to several hundreds of nm may be provided. Further, according to the solar cell of the embodiment, the thickness of the light absorbing layer may be reduced due to the protrusion pattern, so that the raw material cost may be reduce and the productivity may be improved.
- Further, since the optical path converting layer includes the protrusion pattern, the solar cell may have good physical and chemical interfacial characteristics between the optical path converting layer and the light absorbing layer. Further, the optical path converting layer may include a group V element. Thus, the interfacial characteristic of the optical path converting layer with respect to the light absorbing layer may be more improved.
- FIG. 1 is a sectional view showing a solar cell according to the embodiment;
- FIG. 2 is a transparent perspective view showing the solar cell according to the embodiment;
- FIG. 3 is a sectional view of a protrusion included in an optical path converting layer according to the embodiment;
- FIG. 4 is a sectional view showing a solar cell according to another embodiment;
- FIG. 5 is a sectional view illustrating a process of converting an optical path of an incident light by the optical path converting layer according to the embodiment; and
- FIGS. 6 to 12 are views illustrating a process of fabricating a solar cell according to the embodiment.
- In the description of the embodiments, it will be understood that, when a substrate, a layer, a film, or an electrode is referred to as being “on” or “under” another substrate, another layer, another film, or another electrode, it can be “directly” or “indirectly” on the other substrate, the other layer, the other film, or the other electrode, or one or more intervening layers may also be present. Such a position of each component has been described with reference to the drawings. The thickness and size of each component shown in the drawings may be exaggerated, omitted or schematically drawn for the purpose of convenience or clarity. In addition, the size of elements does not utterly reflect an actual size.
- FIGS. 1 and 4 are sectional views showing a solar cell according to the embodiment. FIG. 2 is a transparent perspective view showing the solar cell of FIG. 1. FIG. 3 is a sectional view of a protrusion included in an optical path converting layer according to the embodiment. FIG. 5 is a sectional view illustrating a process of converting an optical path of an incident light by the optical path converting layer according to the embodiment.
- Referring to FIG. 1, the solar cell according to the embodiment includes a back electrode layer 200 which is formed on a support substrate 100, an optical path converting layer 300 which includes a protrusion pattern and is disposed on the back electrode layer 200, a light absorbing layer 400 which is disposed on the optical path converting layer 300, a buffer layer 500 on the light absorbing layer 400, a high-resistance buffer layer 600 on the buffer layer 500, and a front electrode layer 700 on the high-resistance buffer layer 600.
- The support substrate 100 has a plate shape and supports the back electrode layer 200, the optical path converting layer 300, the light absorbing layer 400, the buffer layer 500, the high-resistance buffer layer 600 and the front electrode layer 700.
- The support substrate 100 may be an insulator. The support substrate 100 may be a glass substrate, a plastic substrate or a metal substrate. In detail, the support substrate 100 may be a soda lime glass substrate. The support substrate 100 may be transparent. Further, the support substrate 100 may be rigid or flexible.
- The back electrode layer 200 is disposed on the support substrate 100. The back electrode layer 200 is a conductive layer. For example, a material used for the back electrode layer 200 is metal such as molybdenum (Mo).
- Further, the back electrode layer 200 may include two layers or more. The layers may be formed of the same material or different materials, respectively.
- The optical path converting layer 300 is disposed on the back electrode layer 200. The optical path converting layer 300 includes the protrusion pattern 320. The optical path converting layer 300 includes a compound selected from the group consisting of zinc oxide, indium tin oxide (ITO), tin oxide and a combination thereof. In detail, the optical path converting layer 300 may be zinc oxide.
- Further, the optical path converting layer 300 may be transparent. The optical path converting layer 300 may have a thickness in the range of 10 ㎚ to 100 ㎚.
- The optical path converting layer 300 may include a material selected from the group consisting of a group V element, a transition metal element, alkali metal and a combination thereof. The optical path converting layer 300 may be doped with a dopant selected from the group consisting of a group V element, a transition metal element, alkali metal and a combination thereof. In detail, the optical path converting layer 300 may be doped with a compound consisting of a group V element, a transition metal element, alkali metal and a combination thereof. That is, the optical path converting layer 300 may be doped with at least two doping materials. The dopant concentration is in a range of 1.0 × 1016 atoms/㎤ to 1.0 × 1019 atoms/㎤, but the embodiment is not limited thereto.
- At this time, the group V element may include one selected from the group consisting of nitrogen, phosphor, arsenic and a combination thereof, but the embodiment is not limited thereto. Further, the transition metal element includes one selected from the group consisting of vanadium (V), chrome (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu) and a combination thereof, but the embodiment is not limited thereto. Further, the alkali metal may include one selected from the group consisting of lithium (Li), potassium (K), rubidium (Rb), cesium (Cs), francium (Fr) and a combination thereof, but the embodiment is not limited thereto.
- The protrusion pattern 320 may have various shapes to the extent that the protrusion pattern 320 has a shape including an inclined surface inclined with respect to the support substrate 100. Further, as shown in FIG, 1, although the protrusion pattern 320 has a regular interval, the shape of the protrusion pattern 320 is not limited thereto, and the protrusion pattern 320 may include protrusions which have various sizes and are spaced apart from each other at irregular intervals.
- In detail, the protrusion pattern 320 may have a pyramid shape, a hemisphere shape, or a triangular prism shape. For example, as shown in FIG. 1, the protrusion pattern 320 may have a pyramid shape.
- In more detail, the protrusion pattern 320 may include the first and second inclined surfaces 321 and 322 which are opposite to each other. Referring to FIG. 3, the first inclined surfaces 321 are directed in the first direction. The first inclined surfaces 321 may extend in the same direction. The first inclined surfaces 321 are inclined with respect to an upper surface of the back electrode layer 200. Similarly, the second inclined surfaces 322 may extend in the same direction. The second inclined surfaces 322 may be opposite to the first inclined surfaces 321. For example, the second inclined surfaces 322 may be symmetrical to the first inclined surfaces 321.
- Gradients (θ1, θ2) of the first and second inclined surfaces about the back electrode layer 200 may be in the range of about 10 degrees to about 90 degrees. Preferably, the gradients (θ1, θ2) of the first and second inclined surfaces may be in the range of about 30 degrees to about 55 degrees. The gradient of the first inclined surface may be equal to or different from the gradient of the second inclined surface.
- In contrast, the optical path converting layer 300 according to the embodiment may include a base layer 310 disposed on the back electrode layer 100 and the protrusion pattern 320 on the base layer 310. That is, as shown in FIGS. 1 and 2, the optical path converting layer 300 may be formed only with the protrusion pattern 320, or, as shown in FIGS. 3 and 4, may have the base layer 310 and the protrusion pattern 320 on the base layer 310. The base layer 310 is prepared as a thin film. At this time, the protrusion pattern 320 on the base layer 310 may have a height in the range of 30 ㎚ to 100 ㎚.
- Referring to FIG. 5, the surface area of the optical path converting layer 300 may be expanded due to the protrusion pattern 320 and may scatter an incident light. The protrusion pattern 320 may reflect the light incident from the top of the optical path converting layer 300 in several directions.
- The light incident into an upper surface of the back electrode layer 200 through the light absorbing layer 400 is scattered by the protrusion pattern 320. The light incident from the top to the bottom is laterally reflected by the protrusion pattern 320 placed over the upper surface of the back electrode layer 200. Thus, the optical path of the reflected light in the light absorbing layer 400 can be increased.
- Therefore, according to the solar cell of the embodiment, the optical path of the light passing through the light absorbing layer 400 can be increased, so that the photoelectric conversion efficiency may be improved.
- Further, according to the solar cell of the embodiment, due to the optical path converting layer 300 including the protrusion pattern 320, the solar cell may have the improved efficiency even if the light absorbing layer 400 has a thin thickness. Thus, the solar cell according to the embodiment can be fabricated by using the light absorbing layer 400 having the thinner thickness, so that a thin film solar cell having a thickness in the range of several nm to several hundreds of nm may be provided.
- Further, the upper surface of the optical path converting layer 300 may represent high roughness. That is, the optical path converting layer 300 may be fully formed with the protrusion pattern 320, or a concavo-convex section such as the protrusion pattern 320 is formed on the upper surface of the base layer 200. Thus, the upper surface of the back electrode has a large surface area. Therefore, the back electrode layer 200 and the light absorbing layer 400 have a large contact area. Accordingly, the back electrode layer 200 and the light absorbing layer 400 have improved physical and electrical contact characteristics.
- The light absorbing layer 400 is disposed on the optical path converting layer 300. In detail, the optical path converting layer 300 is coated around the back electrode layer 200 and the light absorbing layer 300. The light absorbing layer 400 includes a group Ⅰ-Ⅲ-Ⅵ compound. For example, the light absorbing layer 400 may have a CIGSS (Cu(IN,Ga)(Se,S)2) crystal structure, a CISS (Cu(IN)(Se,S)2) crystal structure or a CGSS (Cu(Ga)(Se,S)2) crystal structure. The energy band gap of the light absorbing layer 400 may be in the range of about 1 eV to about 1.8 eV.
- The buffer layer 500 is disposed on the light absorbing layer 400. The buffer layer 500 directly makes contact with the light absorbing layer 400. For example, cadmium sulfide (CdS) is used as a material of the buffer layer 500. The energy band gap of the buffer layer 500 is in the range of about 1.9 eV to about 2.3 eV.
- The high resistance buffer layer 600 is disposed on the buffer layer 500. The high resistance buffer layer 600 includes i-ZnO that is not doped with impurities. The energy band gap of the high resistance buffer layer 600 may be in the range of about 3.1 eV to about 3.3 eV.
- The front electrode layer 700 is disposed on the high resistance buffer layer 600. The front electrode layer 700 is a transparent and conductive layer. For example, a material such as Al doped zinc oxide (Al doped ZnO;AZO) may be used for the front electrode layer 700.
- FIGS. 6 to 12 are views illustrating a process of fabricating a solar cell according to the embodiment. The fabrication method will be described with reference to the solar cell described above. The description about the solar cell may be basically incorporated herein by reference.
- Referring to FIG. 6, the back electrode layer 200 is formed by depositing a metal such as molybdenum (Mo) on the support substrate 100 through a sputtering process. The back electrode layer 200 may be formed by performing processes twice under different conditions.
- Referring to FIGS. 7 and 8, the optical path converting layer 300 is formed on the back electrode layer 200 and is etched, such that the protrusion pattern 320 is formed. The protrusion pattern 320 may be formed by wet-etching or dry-etching the optical path converting layer 300. In the case of wet etching, an etching solution generally used in the art, such as a hydrochloric acid or a nitric acid, is used. In detail, the optical path converting layer 300 disposed on the back electrode layer 200 is dipped into an solution including a hydrochloric acid (HCl) by a predetermined % and is reacted for several seconds to several hours, such that the optical path converting layer 300 may be etched.
- At this time, for example, the etching degree of the optical path converting layer 300 may be controlled according to the conditions of the etching process such as acidity of the etching solution, concentration of the etching solution, reaction time, reaction temperature, etc. For example, when the etching process is performed under the condition that may sufficiently etch the optical path converting layer 300, as shown in FIG. 1, the optical path converting layer 300 is entirely converted into the protrusion pattern 320. In the etching process, the entire upper surface of the optical path converting layer 300 may not be uniformly etched. That is, the optical path converting layer 300 may be selectively etched naturally. For example, one part of the optical path converting layer 300 is etched too much and the other part is insufficiently etched, such that the optical path converting layer 300 may have the inclined surface inclined with respect to the support substrate 100.
- In contrast, referring to FIG. 3, when the etching process time is short, the upper surface of the optical path converting layer 300 is partially etched, such that the protrusion pattern 320 is formed and the optical path converting layer 300, which comes into contact with the back electrode layer 200, may remain in a thin film shape.
- Referring to FIG. 9, the light absorbing layer 400 is formed on the back electrode layer 200 and the optical path converting layer 300. The light absorbing layer 400 may be formed through a sputtering process or an evaporation process.
- For example, Cu, In, Ga and Se are simultaneously or independently evaporated to form the CIGS-based light absorbing layer, or the light absorbing layer can be formed through the selenization process after forming a metal precursor layer..
- In detail, the metal precursor layer is formed on the back electrode layer 200 by performing the sputtering process using a Cu target, an In target, and a Ga target.
- Then, the selenization process is performed to form the CIGS-based light absorbing layer.
- In addition, the sputtering process using the Cu target, the In target, and the Ga target and the selenization process can be simultaneously performed.
- Further, the CIS-based or CIG-based light absorbing layer 400 can be formed through the selenization process and the sputtering process using only the Cu and In targets or the Cu and Ga targets.
- Referring to FIGS. 10 and 11, the buffer layer 500 and the high resistance buffer layer 600 are formed on the light absorbing layer 400.
- The buffer layer 500 may be formed through a CBD (Chemical Bath Deposition) process. For example, after the light absorbing layer 400 is formed, the light absorbing layer 400 is immersed in a solution including materials for forming cadmium sulfide, such that the buffer layer 500 including the cadmium sulfide is formed on the light absorbing layer 400.
- Then, i-ZnO that is not doped with impurities is deposited on the buffer layer 500 through the sputtering process and then the high resistance buffer layer 600 is formed.
- Referring to FIG. 12, the front electrode layer 700 is formed on the high resistance buffer layer 600. In order to form the front electrode layer 700, transparent conductive materials are laminated on the high resistance buffer layer 700. For example, transparent conductive materials include zinc oxide doped with aluminum, indium zinc oxide or indium tin oxide (ITO).
- Therefore, according to the method for fabricating a solar cell of the embodiment, the solar cell having improved efficiency can be fabricated.
- Any reference in this specification to “one embodiment,” “an embodiment,” “example embodiment,” etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature, structure, or characteristic in connection with other ones of the embodiments.
- Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
Claims (17)
- A solar cell comprising:a back electrode layer on a support substrate;an optical path converting layer on the back electrode layer, the optical path converting layer including a protrusion pattern;a light absorbing layer on the optical path converting layer; anda front electrode layer on the light absorbing layer.
- The solar cell of claim 1, wherein the protrusion pattern includes an inclined surface inclined with respect to the support substrate.
- The solar cell of claim 1, wherein the protrusion pattern includes a first inclined surface and a second inclined surface which are opposed to each other.
- The solar cell of claim 1, wherein the protrusion pattern includes a plurality of first inclined surfaces and a plurality of second inclined surfaces opposed to the plurality of first inclined surfaces.
- The solar cell of claim 1, wherein the protrusion pattern has a pyramid shape.
- The solar cell of claim 1, wherein the protrusion pattern has a height in a range of 30 ㎚ to 100 ㎚.
- The solar cell of claim 1, wherein the optical path converting layer includes a base layer on the back electrode layer and the protrusion pattern over the back electrode layer.
- The solar cell of claim 7, wherein the base layer is prepared as a thin film, and the protrusion pattern is disposed on the base layer.
- The solar cell of claim 1, wherein the optical path converting layer includes one selected from the group consisting of zinc oxide, indium tin oxide (ITO), tin oxide and a combination thereof.
- The solar cell of claim 1, wherein the optical path converting layer has a thickness in a range of 10 ㎚ to 100 ㎚.
- The solar cell of claim 1, wherein the optical path converting layer is doped with a dopant selected from the group consisting of a group V element, a transition metal element, alkali metal and a combination thereof.
- The solar cell of claim 11, wherein the group V element includes one selected from the group consisting of nitrogen, phosphor, arsenic and a combination thereof.
- The solar cell of claim 11, wherein the transition metal element includes one selected from the group consisting of vanadium (V), chrome (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu) and a combination thereof.
- The solar cell of claim 11, wherein concentration of the dopant is in a range of 1.0 × 1016 atoms/㎤ to 1.0 × 1019 atoms/㎤.
- The solar cell of claim 1, wherein the optical path converting layer is transparent.
- A method for fabricating a solar cell, the method comprising:forming a back electrode layer on a support substrate;forming an optical path converting layer on the back electrode layer and forming a protrusion pattern by etching the optical path converting layer;forming a light absorbing layer including the protrusion pattern on the optical path converting layer; andforming a front electrode layer on the light absorbing layer.
- The method of claim 16, wherein the forming of the protrusion pattern is performed through wet etching or dry etching.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110076275A KR101305802B1 (en) | 2011-07-29 | 2011-07-29 | Solar cell and method of fabricating the same |
PCT/KR2012/005992 WO2013019029A1 (en) | 2011-07-29 | 2012-07-26 | Solar cell and method of fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2737549A1 true EP2737549A1 (en) | 2014-06-04 |
EP2737549A4 EP2737549A4 (en) | 2015-04-08 |
Family
ID=47629484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12820573.9A Ceased EP2737549A4 (en) | 2011-07-29 | 2012-07-26 | Solar cell and method of fabricating the same |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2737549A4 (en) |
KR (1) | KR101305802B1 (en) |
CN (1) | CN103843156A (en) |
WO (1) | WO2013019029A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105071758A (en) * | 2015-09-02 | 2015-11-18 | 广西广拓新能源科技有限公司 | Rotatable solar panel |
CN106935668A (en) * | 2015-12-30 | 2017-07-07 | 中国建材国际工程集团有限公司 | Transparency conducting layer stacking and its manufacture method comprising pattern metal functional layer |
CN109962122A (en) * | 2017-12-22 | 2019-07-02 | 北京铂阳顶荣光伏科技有限公司 | Thin-film solar cells and preparation method thereof |
CN108649080A (en) * | 2018-07-19 | 2018-10-12 | 北京铂阳顶荣光伏科技有限公司 | A kind of solar cell and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0554877A1 (en) * | 1992-02-05 | 1993-08-11 | Canon Kabushiki Kaisha | Photovoltaic device and method for producing the same |
US5998730A (en) * | 1997-05-13 | 1999-12-07 | Canon Kabushiki Kaisha | Production method for deposited film, production method for photoelectric conversion element, production apparatus for deposited film, production apparatus for photoelectric conversion element |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4304638B2 (en) | 2007-07-13 | 2009-07-29 | オムロン株式会社 | CIS solar cell and manufacturing method thereof |
JP4904311B2 (en) * | 2008-04-28 | 2012-03-28 | 株式会社カネカ | Method for manufacturing substrate with transparent conductive film for thin film photoelectric conversion device |
KR101063699B1 (en) * | 2009-06-19 | 2011-09-07 | 엘지이노텍 주식회사 | Solar cell and manufacturing method thereof |
KR20110014039A (en) * | 2009-08-04 | 2011-02-10 | 엘지디스플레이 주식회사 | Solar cell and method for fabricaitng the same |
-
2011
- 2011-07-29 KR KR1020110076275A patent/KR101305802B1/en active IP Right Grant
-
2012
- 2012-07-26 EP EP12820573.9A patent/EP2737549A4/en not_active Ceased
- 2012-07-26 CN CN201280047399.8A patent/CN103843156A/en active Pending
- 2012-07-26 WO PCT/KR2012/005992 patent/WO2013019029A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0554877A1 (en) * | 1992-02-05 | 1993-08-11 | Canon Kabushiki Kaisha | Photovoltaic device and method for producing the same |
US5998730A (en) * | 1997-05-13 | 1999-12-07 | Canon Kabushiki Kaisha | Production method for deposited film, production method for photoelectric conversion element, production apparatus for deposited film, production apparatus for photoelectric conversion element |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013019029A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2737549A4 (en) | 2015-04-08 |
KR20130014265A (en) | 2013-02-07 |
KR101305802B1 (en) | 2013-09-06 |
WO2013019029A1 (en) | 2013-02-07 |
CN103843156A (en) | 2014-06-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012102451A1 (en) | Solar cell and manufacturing method of the same | |
WO2012102470A1 (en) | Solar cell apparatus and method for manufacturing the same | |
WO2011043609A2 (en) | Photovoltaic power-generating apparatus and method for manufacturing same | |
WO2013019029A1 (en) | Solar cell and method of fabricating the same | |
WO2013069998A1 (en) | Solar cell and method of fabricating the same | |
WO2012138194A2 (en) | Solar cell and manufacturing method thereof | |
WO2013069997A1 (en) | Solar cell and method of fabricating the same | |
WO2013055008A1 (en) | Solar cell and solar cell module | |
WO2012102449A1 (en) | Solar cell and method for manufacturing the same | |
WO2013085228A1 (en) | Solar cell module and method of fabricating the same | |
WO2012102453A1 (en) | Solar cell and method for manufacturing the same | |
WO2012046932A1 (en) | Solar cell and method for manufacturing same | |
WO2013055005A1 (en) | Solar cell and preparing method of the same | |
WO2013058611A1 (en) | Solar cell and method of fabricating the same | |
WO2012102452A1 (en) | Solar cell and method for manufacturing the same | |
WO2013094937A1 (en) | Solar cell apparatus and method of fabricating the same | |
WO2013081344A1 (en) | Solar cell module and method of fabricating the same | |
WO2013019028A2 (en) | Solar cell and method of fabricating the same | |
WO2012102533A2 (en) | Solar cell and method of manufacturing same | |
WO2012102469A2 (en) | Solar cell and manufacturing method of the same | |
WO2012102492A2 (en) | Solar cell and method of fabricating the same | |
WO2013094940A1 (en) | Solar cell module and method of fabricating the same | |
WO2013042942A1 (en) | Solar cell and method of fabricating the same | |
WO2013019000A2 (en) | Solar cell and solar cell module using the same | |
WO2012138117A2 (en) | Solar cell and method of fabricating the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20140220 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20150309 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 31/18 20060101ALI20150303BHEP Ipc: H01L 31/0392 20060101ALI20150303BHEP Ipc: H01L 31/056 20140101ALI20150303BHEP Ipc: H01L 31/0236 20060101ALI20150303BHEP Ipc: H01L 31/052 20140101AFI20150303BHEP |
|
17Q | First examination report despatched |
Effective date: 20170410 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LG INNOTEK CO., LTD. |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R003 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 20190323 |