US20010011685A1 - Smart card - Google Patents

Smart card Download PDF

Info

Publication number
US20010011685A1
US20010011685A1 US09/354,131 US35413199A US2001011685A1 US 20010011685 A1 US20010011685 A1 US 20010011685A1 US 35413199 A US35413199 A US 35413199A US 2001011685 A1 US2001011685 A1 US 2001011685A1
Authority
US
United States
Prior art keywords
carrier
smart card
sections
module carrier
transmitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/354,131
Other versions
US6375083B2 (en
Inventor
Manfred Fries
Frank Puschner
Josef Mundigl
Jurgen Fischer
Detlef Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Siemens AG
Original Assignee
Infineon Technologies AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, Siemens AG filed Critical Infineon Technologies AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MUNDIGL, JOSEF, FISCHER, JURGEN, FRIES, MANFRED, HODEAU, DETLEF, PUSCHNER, FRANK
Publication of US20010011685A1 publication Critical patent/US20010011685A1/en
Application granted granted Critical
Publication of US6375083B2 publication Critical patent/US6375083B2/en
Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SIEMENS AKTIENGESELLSCHAFT
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the invention relates to a smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided.
  • a generic smart card and an external data processing station form a data system that is used for counting cashless purchases, for monitoring passenger traffic or for simple charge management in the context of access to a telephone network.
  • a user acquires a smart card on which a data processing circuit containing a microprocessor is provided.
  • an alternating field generated by the external data processing station is modulated by the smart card in the case of contactless transmission methods.
  • a smart card coil provided in the connection assembly is subjected to a capacitive or resistive load in a varying manner over time, with the result that its electromagnetic properties alter. This has a reaction upon a station coil in the external data processing station. From the reaction, it is possible to draw conclusions about data stored in the data processing circuit.
  • the generic smart card is constructed as a plastic card large enough to be stowed securely in a purse, for example.
  • an integrated circuit is applied to a card carrier made of plastic.
  • a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the smart card.
  • Such a smart card is disclosed for example in Published, Non-Prosecuted German Patent Application DE 44 10 732 A1.
  • the fact that production is complicated and expensive is disadvantageous. If a smart card does not operate correctly, the defective smart card is destroyed.
  • a smart card containing a card carrier having a given region and at least one module carrier disposed in the given region of the card carrier.
  • the at least one module carrier includes a base plate; a connection assembly disposed on the base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which the base plate extends, the sections of the at least one transmitting/receiving coil operating in a synchronized manner with one another; and a data processing circuit.
  • the connection assembly provides contactless communication of data between the data processing circuit and an external data processing station.
  • the sections are configured such that the sections are kept in a resonance phase angle with respect to one another.
  • the data processing circuit and the connection assembly are provided in the region of at least one module carrier and the card carrier has a region for accommodating the module carrier or the module carriers.
  • the invention is based on the fundamental concept that the disadvantages in generic smart cards stem from the fact that only when the smart card has been completed is it possible to test whether the integrated circuit cooperates correctly with the transmitting/receiving coil.
  • the parts which are essential for the functioning of the smart card that is to say a functional assembly
  • the parts which are essential for the functioning of the smart card are produced separately from the card carrier on the module carrier and connected to one another only during the final assembly of the card carrier and the module carrier. This makes it possible firstly to test the functional assembly in respect to its functioning. If it is established that the data processing circuit does not cooperate correctly with the connection assembly on the functional assembly, then the functional assembly can be destroyed without an inherently useful card carrier having to be destroyed as well. Furthermore, it is possible to accelerate the production of the functional assembly since the module carrier, which takes up only a small amount of space, makes it possible to provide smaller and faster production apparatuses.
  • the module carrier can be fixedly connected to the smart card, it being possible for that region which is provided on the card carrier for accommodating the module carrier also to be configured as a cutout. With a suitable configuration of the module carrier and the cutout, it is possible to ensure that a positively locking connection is already produced when the module carrier is inserted into the receptacle, the connection only having to be fixed.
  • connection assembly has at least one transmitting/receiving coil which can also be disposed in two different planes with respect to the main direction in which the module carrier extends.
  • connection assembly has at least one transmitting/receiving coil which can also be disposed in two different planes with respect to the main direction in which the module carrier extends.
  • This can be achieved in a particularly simple manner by use of a two-layer metallization coating, a sandwich-like structure being particularly appropriate for the module carrier.
  • the sections of the transmitting/receiving coil on the surface of the module carrier and inside the module carrier may be disposed in a plane-parallel manner, the individual sections being connected to one another by contacts.
  • This can be achieved in a particularly simple manner by use of plated-through holes in the region of terminals of the respective transmitting/receiving coil regions. It is preferable for the individual sections of the transmitting/receiving coil to be connected in series, since this results in a transmitting/receiving coil which can influence an external alternating field with a high efficiency.
  • a particularly high efficiency of the transmitting/receiving coil is produced when the transmission device, which is often part of the data processing circuit, is configured in such a way that the sections of the transmitting/receiving coil can be kept in a resonance phase angle with respect to one another.
  • This can be done for example by suitably connecting in capacitances and/or inductances, this preferably being done in such a way that the resonant frequencies of the regions of the transmitting/receiving coil in each case correspond.
  • the transmission device may also be configured in such a way that the sections of the transmitting/receiving coil can be operated such that they are synchronized with one another. This can advantageously be done so as to result in amplification of the alternating field issuing from the transmitting/receiving coil. This is significant for active cards that emit a signal.
  • phase gating technology it is possible to achieve synchronization of an edge position with the sections of the transmitting/receiving coil, to be precise in such a way as to result in amplification of an alternating field generated by the transmitting/receiving coil.
  • passive cards it is thereby possible to achieve a particularly high degree of coupling between the smart card and an external data processing station.
  • the module carrier has at least one section configured as a coil core for the transmitting/receiving coil.
  • the module carrier may be formed from plastic into which permeable material such as ferrite, for example, is incorporated. If the permeable material is present as a multiplicity of ferrite particles, the latter are bound, for the purpose of mutual insulation, in a synthetic composition provided in the module carrier.
  • the coil core produced in this way serves for achieving a high field amplification factor.
  • Such a dielectric makes it possible to achieve relative magnetic permeabilities of the order of magnitude of 5,000 and thus high flux densities.
  • a method for producing the module carrier for the smart card configured in the manner described above has the following steps:
  • the step of connecting the terminal regions of the first coil section to the second coil section can be effected by through-plating, which can be achieved in a simple manner using known production methods.
  • the step of applying the integrated circuit can be effected either by a flip-chip technique or by conventional bonding techniques.
  • the conventional bonding techniques it is possible to have recourse to a conductive adhesive or to known solders as the bonding agent.
  • the bonding techniques it is provided that not only the connection assembly but also the data processing circuit may optionally be covered with a hardenable covering composition, to be precise, in particular after the production of the module carrier.
  • the covering compositions used for this purpose may be in particular thermally or UV curing.
  • the invention also relates to a method for producing a smart card which has the following steps:
  • the method according to the invention enables a smart card to be produced in a particularly simple and cost-effective manner.
  • FIG. 1 is a diagrammatic, plan view of a module carrier with a data processing circuit and with a transmitting/receiving coil according to the invention
  • FIG. 2 is a plan view of a card carrier
  • FIG. 3 is a plan view of a smart card with the module carrier shown in FIG. 1 and the card carrier shown in FIG. 2;
  • FIG. 4 is a sectional view of the module carrier shown in FIG. 1;
  • FIG. 5 is a plan view of a continuous strip for the production of the module carrier shown in FIG. 1.
  • FIG. 1 there is shown a module carrier 1 of a smart card 13 according to the invention.
  • the module carrier 1 has a base plate 2 produced from plastic and an essentially rectangular cross section. In this case, corners of the base plate 2 are rounded, as can be seen particularly clearly in FIG. 1.
  • a transmitting/receiving coil 3 is provided on a top side of the base plate 2 by use of metallization, in which case turns of the transmitting/receiving coil 3 , proceeding from a first terminal contact 4 provided in a center of the base plate 2 , extend essentially spirally around the first terminal contact 4 as far as a second terminal contact 5 .
  • an integrated circuit 7 is fitted on the first terminal contact 4 by an insulating adhesive layer 6 .
  • the integrated circuit 7 has a first connecting line 8 connected to the first terminal contact 4 , and also a second connecting line 9 connected to the second terminal contact 5 .
  • a region between the integrated circuit 7 and the second terminal contact 5 is illustrated as having been broken out from the module carrier 1 in order to allow the module carrier 1 to be illustrated more simply in the drawing.
  • the module carrier 1 is covered with a covering layer 10 made of a thermally curable or UV-curable composition in a region of the first terminal contact 4 and in a region of the second terminal contact 5 .
  • FIG. 2 shows a card carrier 11 with an essentially rectangular outer shape having a rectangular recess 12 for accommodating the module carrier 1 shown in FIG. 1.
  • the card carrier 11 is produced from a plastic plate having essentially the same thickness as the base plate 2 of the module carrier 1 .
  • the recess 12 is in this case formed in such a way that the module carrier 1 can be inserted into the recess 12 in a positive locking manner.
  • FIG. 3 shows the smart card 13 according to the invention, which is composed of the module carrier 1 in accordance with FIGS. 1 and 4 and of the card carrier 11 in accordance with FIG. 2.
  • the module carrier 1 is inserted into the recess 12 in such a way as to produce a positively locking connection.
  • the module carrier 1 is additionally connected to the card carrier 11 by an adhesive bond.
  • Both the base plate 2 and the card carrier 11 can be produced from a plastic such as glass fiber reinforced epoxy resin, PVC, PET, PC and/or ABS.
  • the transmitting/receiving coil 3 can be applied to the base plate 2 using an etching, winding, laying or printing technique.
  • the module carriers 1 according to the invention are fabricated in a continuous strip process, provision being made of a continuous strip 14 made of a plastic which has a respective conveying perforation 15 on both long sides.
  • the provision of the conveying perforation 15 results in that the continuous strip 14 can be guided in a particularly simple manner through machines used in the production of the module carriers 1 according to the invention.
  • the transmitting/receiving coil 3 is combined with the semiconductor chip 7 in a single module carrier 1 that can be mass-produced in a simple manner.
  • the module carriers 1 according to the invention are inserted into the card carrier 11 only in a concluding work step.
  • the semiconductor chip 7 can be fixed on the module carrier 2 according to the invention either according to a conventional wire bonding technique or by a flip-chip technique.

Abstract

A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This is a continuation of copending International Application PCT/DE98/00033, filed Jan. 7, 1998, which designated the United States. [0001]
    • BACKGROUND OF THE INVENTION
  • Field of the Invention [0002]
  • The invention relates to a smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. [0003]
  • A generic smart card and an external data processing station form a data system that is used for counting cashless purchases, for monitoring passenger traffic or for simple charge management in the context of access to a telephone network. For such purposes, a user acquires a smart card on which a data processing circuit containing a microprocessor is provided. For the communication of data between the data processing circuit and the external data processing station, an alternating field generated by the external data processing station is modulated by the smart card in the case of contactless transmission methods. In this case, by way of example, a smart card coil provided in the connection assembly is subjected to a capacitive or resistive load in a varying manner over time, with the result that its electromagnetic properties alter. This has a reaction upon a station coil in the external data processing station. From the reaction, it is possible to draw conclusions about data stored in the data processing circuit. [0004]
  • The generic smart card is constructed as a plastic card large enough to be stowed securely in a purse, for example. In the course of producing the generic smart card, first of all an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the smart card. Such a smart card is disclosed for example in Published, Non-Prosecuted German Patent Application DE 44 10 732 A1. In the case of the generic smart card, the fact that production is complicated and expensive is disadvantageous. If a smart card does not operate correctly, the defective smart card is destroyed. [0005]
  • Published, Non-Prosecuted German Patent Application DE 44 37 721 A1 shows an electronic module for incorporation into a data carrier, the electronic module has an integrated circuit which is disposed on a module carrier and is conductively connected to a coil for contactless data exchange. [0006]
    • SUMMARY OF THE INVENTION
  • It is accordingly an object of the invention to provide a smart card which overcome the above-mentioned disadvantages of the prior art methods and devices of this general type, which always operates reliably, and is produced reliably and with little outlay. [0007]
  • With the foregoing and other objects in view there is provided, in accordance with the invention, a smart card, containing a card carrier having a given region and at least one module carrier disposed in the given region of the card carrier. The at least one module carrier, includes a base plate; a connection assembly disposed on the base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which the base plate extends, the sections of the at least one transmitting/receiving coil operating in a synchronized manner with one another; and a data processing circuit. The connection assembly provides contactless communication of data between the data processing circuit and an external data processing station. In an alternative, the sections are configured such that the sections are kept in a resonance phase angle with respect to one another. [0008]
  • According to the invention, the data processing circuit and the connection assembly are provided in the region of at least one module carrier and the card carrier has a region for accommodating the module carrier or the module carriers. [0009]
  • The invention is based on the fundamental concept that the disadvantages in generic smart cards stem from the fact that only when the smart card has been completed is it possible to test whether the integrated circuit cooperates correctly with the transmitting/receiving coil. According to the invention, the parts which are essential for the functioning of the smart card, that is to say a functional assembly, are produced separately from the card carrier on the module carrier and connected to one another only during the final assembly of the card carrier and the module carrier. This makes it possible firstly to test the functional assembly in respect to its functioning. If it is established that the data processing circuit does not cooperate correctly with the connection assembly on the functional assembly, then the functional assembly can be destroyed without an inherently useful card carrier having to be destroyed as well. Furthermore, it is possible to accelerate the production of the functional assembly since the module carrier, which takes up only a small amount of space, makes it possible to provide smaller and faster production apparatuses. [0010]
  • According to the invention, the module carrier can be fixedly connected to the smart card, it being possible for that region which is provided on the card carrier for accommodating the module carrier also to be configured as a cutout. With a suitable configuration of the module carrier and the cutout, it is possible to ensure that a positively locking connection is already produced when the module carrier is inserted into the receptacle, the connection only having to be fixed. [0011]
  • A particularly advantageous smart card according to the invention is produced when the connection assembly has at least one transmitting/receiving coil which can also be disposed in two different planes with respect to the main direction in which the module carrier extends. In this case, provision is made, in particular, for a section of the transmitting/receiving coil to be disposed on a surface of the module carrier, while another section may be disposed in a layer inside of the module carrier. This can be achieved in a particularly simple manner by use of a two-layer metallization coating, a sandwich-like structure being particularly appropriate for the module carrier. In this case, the sections of the transmitting/receiving coil on the surface of the module carrier and inside the module carrier may be disposed in a plane-parallel manner, the individual sections being connected to one another by contacts. This can be achieved in a particularly simple manner by use of plated-through holes in the region of terminals of the respective transmitting/receiving coil regions. It is preferable for the individual sections of the transmitting/receiving coil to be connected in series, since this results in a transmitting/receiving coil which can influence an external alternating field with a high efficiency. In this case, a particularly high efficiency of the transmitting/receiving coil is produced when the transmission device, which is often part of the data processing circuit, is configured in such a way that the sections of the transmitting/receiving coil can be kept in a resonance phase angle with respect to one another. This can be done for example by suitably connecting in capacitances and/or inductances, this preferably being done in such a way that the resonant frequencies of the regions of the transmitting/receiving coil in each case correspond. [0012]
  • In a departure from this, or to supplement the above-mentioned embodiment, the transmission device may also be configured in such a way that the sections of the transmitting/receiving coil can be operated such that they are synchronized with one another. This can advantageously be done so as to result in amplification of the alternating field issuing from the transmitting/receiving coil. This is significant for active cards that emit a signal. By applying phase gating technology, it is possible to achieve synchronization of an edge position with the sections of the transmitting/receiving coil, to be precise in such a way as to result in amplification of an alternating field generated by the transmitting/receiving coil. In the case of passive cards, it is thereby possible to achieve a particularly high degree of coupling between the smart card and an external data processing station. [0013]
  • A further improvement in the transmission quality of data between the smart card and the external data processing station is produced when the module carrier has at least one section configured as a coil core for the transmitting/receiving coil. In this case, the module carrier may be formed from plastic into which permeable material such as ferrite, for example, is incorporated. If the permeable material is present as a multiplicity of ferrite particles, the latter are bound, for the purpose of mutual insulation, in a synthetic composition provided in the module carrier. The coil core produced in this way serves for achieving a high field amplification factor. Such a dielectric makes it possible to achieve relative magnetic permeabilities of the order of magnitude of 5,000 and thus high flux densities. [0014]
  • A method for producing the module carrier for the smart card configured in the manner described above has the following steps: [0015]
  • a. incorporating a first coil section into a plastic layer; [0016]
  • b. applying a second coil section to the plastic layer; [0017]
  • c. connecting terminal regions of the first coil section and of the second coil section to one another; and [0018]
  • d. applying an integrated circuit to the module carrier. [0019]
  • In this case, the step of connecting the terminal regions of the first coil section to the second coil section can be effected by through-plating, which can be achieved in a simple manner using known production methods. [0020]
  • The step of applying the integrated circuit can be effected either by a flip-chip technique or by conventional bonding techniques. In the case of the conventional bonding techniques, it is possible to have recourse to a conductive adhesive or to known solders as the bonding agent. Especially in the case of the bonding techniques, it is provided that not only the connection assembly but also the data processing circuit may optionally be covered with a hardenable covering composition, to be precise, in particular after the production of the module carrier. The covering compositions used for this purpose may be in particular thermally or UV curing. [0021]
  • The invention also relates to a method for producing a smart card which has the following steps: [0022]
  • a. providing a card carrier having a receptacle for a module carrier; [0023]
  • b. providing a module carrier according to the invention having a data processing circuit and a connection assembly; [0024]
  • c. introducing the module carrier into the receptacle; and [0025]
  • d. connecting the module carrier to the card carrier. [0026]
  • The method according to the invention enables a smart card to be produced in a particularly simple and cost-effective manner. [0027]
  • The above-mentioned production steps for producing the smart card according to the invention and/or the module carrier according to the invention with a double-layered transmitting/receiving coil can, of course, also be applied to the production of smart cards and/or module carriers with a single coil layer. [0028]
  • Other features which are considered as characteristic for the invention are set forth in the appended claims. [0029]
  • Although the invention is illustrated and described herein as embodied in a smart card, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims. [0030]
  • The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings. [0031]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a diagrammatic, plan view of a module carrier with a data processing circuit and with a transmitting/receiving coil according to the invention; [0032]
  • FIG. 2 is a plan view of a card carrier; [0033]
  • FIG. 3 is a plan view of a smart card with the module carrier shown in FIG. 1 and the card carrier shown in FIG. 2; [0034]
  • FIG. 4 is a sectional view of the module carrier shown in FIG. 1; and [0035]
  • FIG. 5 is a plan view of a continuous strip for the production of the module carrier shown in FIG. 1. [0036]
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • In all the figures of the drawing, sub-features and integral parts that correspond to one another bear the same reference symbol in each case. Referring now to the figures of the drawing in detail and first, particularly, to FIG. 1 thereof, there is shown a [0037] module carrier 1 of a smart card 13 according to the invention. The module carrier 1 has a base plate 2 produced from plastic and an essentially rectangular cross section. In this case, corners of the base plate 2 are rounded, as can be seen particularly clearly in FIG. 1. A transmitting/receiving coil 3 is provided on a top side of the base plate 2 by use of metallization, in which case turns of the transmitting/receiving coil 3, proceeding from a first terminal contact 4 provided in a center of the base plate 2, extend essentially spirally around the first terminal contact 4 as far as a second terminal contact 5.
  • As is best seen in FIG. 4, an [0038] integrated circuit 7 is fitted on the first terminal contact 4 by an insulating adhesive layer 6. The integrated circuit 7 has a first connecting line 8 connected to the first terminal contact 4, and also a second connecting line 9 connected to the second terminal contact 5. In the view shown in FIG. 4, a region between the integrated circuit 7 and the second terminal contact 5 is illustrated as having been broken out from the module carrier 1 in order to allow the module carrier 1 to be illustrated more simply in the drawing.
  • As is likewise readily evident in FIG. 4, the [0039] module carrier 1 is covered with a covering layer 10 made of a thermally curable or UV-curable composition in a region of the first terminal contact 4 and in a region of the second terminal contact 5.
  • FIG. 2 shows a [0040] card carrier 11 with an essentially rectangular outer shape having a rectangular recess 12 for accommodating the module carrier 1 shown in FIG. 1. The card carrier 11 is produced from a plastic plate having essentially the same thickness as the base plate 2 of the module carrier 1. The recess 12 is in this case formed in such a way that the module carrier 1 can be inserted into the recess 12 in a positive locking manner.
  • FIG. 3 shows the [0041] smart card 13 according to the invention, which is composed of the module carrier 1 in accordance with FIGS. 1 and 4 and of the card carrier 11 in accordance with FIG. 2. As can be seen particularly well in this view, the module carrier 1 is inserted into the recess 12 in such a way as to produce a positively locking connection. In this state, the module carrier 1 is additionally connected to the card carrier 11 by an adhesive bond.
  • Both the [0042] base plate 2 and the card carrier 11 can be produced from a plastic such as glass fiber reinforced epoxy resin, PVC, PET, PC and/or ABS. The transmitting/receiving coil 3 can be applied to the base plate 2 using an etching, winding, laying or printing technique.
  • As can be seen particularly well in FIG. 5, the [0043] module carriers 1 according to the invention are fabricated in a continuous strip process, provision being made of a continuous strip 14 made of a plastic which has a respective conveying perforation 15 on both long sides. The provision of the conveying perforation 15 results in that the continuous strip 14 can be guided in a particularly simple manner through machines used in the production of the module carriers 1 according to the invention.
  • Following the completion of the [0044] continuous strip 14 with the module carriers 1 provided thereon, these are individually tested and subsequently detached from the continuous strip 14 by performing a stamping process. In a further method step (not illustrated here), the module carriers 1 that have been tested in respect of their functioning are inserted into card carriers 11 that are ready, and the smart cards 13 according to the invention are thereby completed.
  • With the [0045] module carrier 1 according to the invention, the transmitting/receiving coil 3 is combined with the semiconductor chip 7 in a single module carrier 1 that can be mass-produced in a simple manner. The module carriers 1 according to the invention are inserted into the card carrier 11 only in a concluding work step. In this case, the semiconductor chip 7 can be fixed on the module carrier 2 according to the invention either according to a conventional wire bonding technique or by a flip-chip technique.

Claims (22)

We claim:
1. A module carrier for use in a smart card, comprising:
a base plate; and
a transmission device disposed on said base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes and disposed one above one another with respect to a main direction in which said base plate extends, said sections of said at least one transmitting/receiving coil configured such that said sections being kept in a resonance phase angle with respect to one another.
2. A module carrier for use in a smart card, comprising:
a base plate; and
a transmission device disposed on said base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which said base plate extends, said sections of said at least one transmitting/receiving coil operating in a synchronized manner with one another.
3. A smart card, comprising:
a card carrier having a given region; and
at least one module carrier disposed in said given region of said card carrier, said at least one module carrier, including:
a base plate;
a connection assembly disposed on said base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which said base plate extends, said sections of said at least one transmitting/receiving coil operating in a synchronized manner with one another; and
a data processing circuit, said connection assembly providing contactless communication of data between said data processing circuit and an external data processing station.
4. The smart card according to
claim 3
, wherein said at least one module carrier is fixedly connected to said card carrier.
5. The smart card according to
claim 3
, wherein said card carrier has a cutout formed therein serving as said given region for receiving said at least one module carrier.
6. The smart card according to
claim 3
, wherein said at least one carrier module has a surface and one section of said sections of said at least one transmitting/receiving coil is disposed on said surface of said at least one carrier module carrier.
7. The smart card according to
claim 6
, wherein a further section of said sections of said at least one transmitting/receiving coil is disposed inside of said at least one module carrier.
8. The smart card according to
claim 7
, including contacts connecting said one section of said sections to said further section of said sections of said at least one transmitting/receiving coil.
9. The smart card according to
claim 8
, wherein said one section and said further section are connected in series.
10. The smart card according to
claim 3
, wherein said at least one module carrier has at least one section of said sections configured as a coil core.
11. The smart card according to
claim 10
, wherein said at least one module carrier is formed from plastic and a permeable material incorporated into said plastic.
12. A smart card, comprising:
a card carrier having a given region;
at least one module carrier disposed in said given region of said card carrier, said at least one module carrier, including:
a base plate;
a connection assembly disposed on said base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes and disposed one above one another with respect to a main direction in which said base plate extends, said sections of said at least one transmitting/receiving coil configured such that said sections being kept in a resonance phase angle with respect to one another; and
a data processing circuit, said connection assembly providing contactless communication of data between said data processing circuit and an external data processing station.
13. The smart card according to
claim 12
, wherein said at least one module carrier is fixedly connected to said card carrier.
14. The smart card according to
claim 12
, wherein said card carrier has a cutout formed therein serving as said given region for receiving said at least one module carrier.
15. The smart card according to
claim 12
, wherein said at least one carrier module has a surface and one section of said sections of said at least one transmitting/receiving coil is disposed on said surface of said at least one carrier module carrier.
16. The smart card according to
claim 15
, wherein a further section of said sections of said at least one transmitting/receiving coil is disposed inside of said at least one module carrier.
17. The smart card according to
claim 16
, including contacts connecting said one section to said further section of said at least one transmitting/receiving coil.
18. The smart card according to
claim 17
, wherein said one section and said further section are connected in series.
19. The smart card according to
claim 12
, wherein said at least one module carrier has at least one section of said sections configured as a coil core.
20. The smart card according to
claim 19
, wherein said at least one module carrier is formed from plastic and a permeable material incorporated into said plastic.
21. A method for producing a smart card, which comprises:
providing a module carrier including a base plate, a transmission device disposed on the base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which the base plate extends, the sections of the at least one transmitting/receiving coil operating in a synchronized manner with one another, and a data processing circuit, the transmission device providing contactless communication of data between the data processing circuit and an external data processing station;
providing a card carrier having a receptacle for receiving the module carrier;
introducing the module carrier into the receptacle of the card carrier; and
connecting the module carrier to the card carrier.
22. A method for producing a smart card, which comprises:
providing a module carrier including a base plate, a transmission device disposed on the base plate and having at least one transmitting/receiving coil with sections disposed in at least two different planes with respect to a main direction in which the base plate extends, the sections of the at least one transmitting/receiving coil configured such that the sections being kept in a resonance phase angle with respect to one another, and a data processing circuit, the transmission device providing contactless communication of data between the data processing circuit and an external data processing station;
providing a card carrier having a receptacle for receiving the module carrier;
introducing the module carrier into the receptacle of the card carrier; and
connecting the module carrier to the card carrier.
US09/354,131 1997-01-15 1999-07-15 Smart card Expired - Lifetime US6375083B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19701167.5 1997-01-15
DE19701167A DE19701167A1 (en) 1997-01-15 1997-01-15 Smart card
DE19701167 1997-01-15
PCT/DE1998/000033 WO1998032099A1 (en) 1997-01-15 1998-01-07 Chip card

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000033 Continuation WO1998032099A1 (en) 1997-01-15 1998-01-07 Chip card

Publications (2)

Publication Number Publication Date
US20010011685A1 true US20010011685A1 (en) 2001-08-09
US6375083B2 US6375083B2 (en) 2002-04-23

Family

ID=7817441

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/354,131 Expired - Lifetime US6375083B2 (en) 1997-01-15 1999-07-15 Smart card

Country Status (9)

Country Link
US (1) US6375083B2 (en)
EP (1) EP0951691B1 (en)
JP (1) JP2000509538A (en)
KR (1) KR20000070160A (en)
CN (1) CN1241145C (en)
AT (1) ATE206835T1 (en)
DE (2) DE19701167A1 (en)
IN (1) IN192329B (en)
WO (1) WO1998032099A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010099429A (en) * 2001-09-27 2001-11-09 김경현 System of Checking falsification of an identification card
US6552422B1 (en) * 1999-08-31 2003-04-22 Koninklijke Philips Electronics N.V. Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component
EP1324261A1 (en) * 2001-12-28 2003-07-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20040206829A1 (en) * 2001-05-09 2004-10-21 Ando Welling throughplating of flexible printed boards
JP2013061710A (en) * 2011-09-12 2013-04-04 Hitachi Chemical Co Ltd Rfid tag and automatic recognition system
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
US20180330221A1 (en) * 2015-11-12 2018-11-15 Bundesdruckerei Gmbh Value or security document from a fibre composite material and method for producing the value or security document

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU223718B1 (en) * 1994-12-29 2004-12-28 Savient Pharmaceuticals, Inc. Process for the production of human insulin starting with the expression of a hybrid peptide containing proinsulin
FR2769390B1 (en) * 1997-10-08 2003-02-14 Gemplus Card Int METHOD FOR MANUFACTURING CHIP CARDS SUITABLE FOR PROVIDING CONTACT AND NON-CONTACT OPERATION, AND CONTACTLESS CHIP CARDS
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
JP3180086B2 (en) * 1998-08-31 2001-06-25 株式会社シーメディア Mobile communication device, information transmission system and method, non-contact IC media usable in mobile communication device
US8538801B2 (en) 1999-02-19 2013-09-17 Exxonmobile Research & Engineering Company System and method for processing financial transactions
EP1031940A1 (en) * 1999-02-24 2000-08-30 Sihl GmbH Device comprising a plurality of electronic circuits
FR2796183B1 (en) * 1999-07-07 2001-09-28 A S K CONTACTLESS ACCESS TICKET AND MANUFACTURING METHOD THEREOF
DE19939347C1 (en) * 1999-08-19 2001-02-15 Orga Kartensysteme Gmbh Chip card manufacture, of e.g. credit cards or admission cards, which allows for fitting with displays or keys, involves laminating circuit board with several perforated layers and machining cut-outs
JP2003515855A (en) * 1999-12-05 2003-05-07 アムリー，モシャ エッサ アル Bank check system using checks with magnetized strips and / or storage chips
DE10014620A1 (en) * 2000-03-24 2001-09-27 Andreas Plettner Electronic chip carrier band manufacturing method has contact elements for applied chips provided by metallized plastics foil or metal foil
DE10017431C2 (en) * 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Method and device for producing data carriers with an integrated transponder
KR100746742B1 (en) * 2001-02-03 2007-08-06 삼성전자주식회사 Reader coil antenna and non-contacting type card identification system using the same
DE10151941A1 (en) * 2001-10-22 2003-01-02 Infineon Technologies Ag Chip card or storage card, such as a multimedia card is configured as a TSLP package so that higher production rates can be achieved with lower production costs
KR100407451B1 (en) * 2002-03-04 2003-11-28 주식회사 티오디 A radio frequency module
JP4110380B2 (en) * 2002-09-05 2008-07-02 富士ゼロックス株式会社 Display recording medium and information writing apparatus
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7926728B2 (en) * 2007-10-31 2011-04-19 Infineon Technologies Ag Integrated circuit device including a contactless integrated circuit inlay
DE102009022136A1 (en) 2009-05-20 2010-11-25 Prüftechnik Dieter Busch AG Apparatus and method for inductive measurements
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514709A (en) 1978-07-18 1980-02-01 Toshiba Corp Facsimile device
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
FR2641102B1 (en) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE4034225C2 (en) * 1990-10-26 1994-01-27 Reinhard Jurisch Data carriers for identification systems
FR2674052A1 (en) 1991-03-15 1992-09-18 Philips Composants MICROCIRCUIT CARD.
JPH04321190A (en) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
DE4220194C2 (en) * 1992-06-19 1996-02-22 Herbert Stowasser Device and method for producing a transponder, wherein the winding wire of a coil is connected to the connection surfaces of an electronic component (chip)
JP2709223B2 (en) * 1992-01-30 1998-02-04 三菱電機株式会社 Non-contact portable storage device
DE69220029T2 (en) * 1992-02-05 1997-09-18 Texas Instruments Inc Method for producing a flat, flexible antenna core for a chip transponder, built into a card or similar object, and an antenna core produced in this way
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4311493C2 (en) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC card module for producing an IC card
JPH07146922A (en) 1993-09-28 1995-06-06 Dainippon Printing Co Ltd Noncontact ic module and noncontact ic card, and their manufacture
DE4403753C1 (en) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Combined chip card
DE4410732C2 (en) 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit
DE9406390U1 (en) * 1994-04-16 1994-06-23 Karakas Gmbh Gyroscope device
DE4431605C2 (en) * 1994-09-05 1998-06-04 Siemens Ag Method for producing a chip card module for contactless chip cards
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
DE4437721A1 (en) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Contactless electronic module
DE4443980C2 (en) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Process for the production of chip cards and chip card produced according to this process
JPH08202844A (en) * 1995-01-25 1996-08-09 Nippon Retsuku Kk Electronic unit and its manufacture
JPH08216570A (en) 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Ic card
DE19527359A1 (en) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Circuit unit and method for manufacturing a circuit unit

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6552422B1 (en) * 1999-08-31 2003-04-22 Koninklijke Philips Electronics N.V. Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component
US20040206829A1 (en) * 2001-05-09 2004-10-21 Ando Welling throughplating of flexible printed boards
US7000845B2 (en) * 2001-05-09 2006-02-21 Giesecke & Devrient Gmbh Throughplating of flexible printed boards
KR20010099429A (en) * 2001-09-27 2001-11-09 김경현 System of Checking falsification of an identification card
US7018844B2 (en) 2001-12-28 2006-03-28 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US6774470B2 (en) 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20040219714A1 (en) * 2001-12-28 2004-11-04 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20030122233A1 (en) * 2001-12-28 2003-07-03 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
EP1324261A1 (en) * 2001-12-28 2003-07-02 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
JP2013061710A (en) * 2011-09-12 2013-04-04 Hitachi Chemical Co Ltd Rfid tag and automatic recognition system
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD702240S1 (en) 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD702241S1 (en) 2012-04-23 2014-04-08 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US20180330221A1 (en) * 2015-11-12 2018-11-15 Bundesdruckerei Gmbh Value or security document from a fibre composite material and method for producing the value or security document
US10664737B2 (en) * 2015-11-12 2020-05-26 Bundesdruckerei Gmbh Value or security document from a fibre composite material and method for producing the value or security document

Also Published As

Publication number Publication date
WO1998032099A1 (en) 1998-07-23
DE19701167A1 (en) 1998-07-23
CN1243585A (en) 2000-02-02
EP0951691B1 (en) 2001-10-10
CN1241145C (en) 2006-02-08
JP2000509538A (en) 2000-07-25
KR20000070160A (en) 2000-11-25
EP0951691A1 (en) 1999-10-27
US6375083B2 (en) 2002-04-23
DE59801682D1 (en) 2001-11-15
IN192329B (en) 2004-04-10
ATE206835T1 (en) 2001-10-15

Similar Documents

Publication Publication Date Title
US6375083B2 (en) Smart card
US6319827B1 (en) Integrated electronic micromodule and method for making same
RU2194306C2 (en) Electronic contactless unit for card or label
US6837438B1 (en) Non-contact information medium and communication system utilizing the same
US6719206B1 (en) Data transaction card and method of manufacture thereof
US7078304B2 (en) Method for producing an electrical circuit
US5598032A (en) Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
US5880934A (en) Data carrier having separately provided integrated circuit and induction coil
US5671525A (en) Method of manufacturing a hybrid chip card
US7746230B2 (en) Radio frequency identification device and method
EP0992366B1 (en) Card mounted with circuit chip and circuit chip module
KR100961671B1 (en) Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
US6180434B1 (en) Method for producing a contactless chip card
US20010007335A1 (en) Method of manufacturing an enclosed transceiver
JPH11149537A (en) Composite ic card and composite ic module
US20080117056A1 (en) RFID label with release liner window, and method of making
US6384425B1 (en) Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed
US20060255160A1 (en) Memory card, the fabrication thereof and a mobile phone apparatus having a memory card
JP2001101371A (en) Ic card
JP2001034725A (en) Non-contact ic module, production thereof and non- contact information medium
JPH11224316A (en) Composite type ic card
JP2000172814A (en) Composite ic module and composite ic card
KR20000031557A (en) Radio frequency integrated circuit card using conductive adhesive films and manufacturing method thereof
CN215189723U (en) Multi-chip induction ring based on radio frequency technology
JPH11161763A (en) Non-contact card medium equipped with antenna circuit and its manufacture

Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FRIES, MANFRED;PUSCHNER, FRANK;MUNDIGL, JOSEF;AND OTHERS;REEL/FRAME:010972/0221;SIGNING DATES FROM 19990723 TO 19990809

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: INFINEON TECHNOLOGIES AG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SIEMENS AKTIENGESELLSCHAFT;REEL/FRAME:026358/0703

Effective date: 19990331

FPAY Fee payment

Year of fee payment: 12