US20010012705A1 - Self-aligning lcd connector assembly - Google Patents
Self-aligning lcd connector assembly Download PDFInfo
- Publication number
- US20010012705A1 US20010012705A1 US09/245,683 US24568399A US2001012705A1 US 20010012705 A1 US20010012705 A1 US 20010012705A1 US 24568399 A US24568399 A US 24568399A US 2001012705 A1 US2001012705 A1 US 2001012705A1
- Authority
- US
- United States
- Prior art keywords
- contact
- lcd
- conductive body
- base circuit
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
Definitions
- the present invention relates generally to liquid-crystal display (“LCD”) connectors, and in particular, to a mechanical self-aligning interconnect device used to connect an LCD with a base circuit.
- LCD liquid-crystal display
- LCD liquid-crystal material
- ITO indium tin oxide
- other aspects of the LCDs are not as precise due to the nature of the materials that are used or the methods in which they are manufactured.
- LCDs have a very wide tolerance for the mechanical dimensions of the glass and the positioning of the electrical traces with respect to the edges of the glass. These tolerance ranges are much larger and are generally only required to be accurate within ⁇ 0.200 mm or even greater. This large tolerance is predominantly a result of the manufacturing process that necessitates scoring and breaking of a larger glass panel to create discrete LCDs.
- the LCD In prior cellular phone designs, the LCD is generally held in place with a light guide.
- the LCD is mounted in the lightguide and the edges of the lightguide are used to align and hold the LCD in position.
- the edges of the LCD which have wide tolerances, are used to align the LCD in place.
- an LCD connector is retained by the lightguide and used to electrically connect the LCD with the printed circuit board of the cellular phone. Since all known prior art cellular phone designs align the LCD by using the edge of the LCD glass they suffer from the large tolerances associated with the LCD glass. To that end, this creates connection and quality problems that are difficult to deal with in the manufacture of a larger number of cellular phones.
- the present invention discloses an interconnection device for interconnecting a plurality of contacts accurately positioned on an LCD with a plurality of connections on an underlying base circuit which provides operating signals to the LCD.
- the interconnection device solves the problems associated with the large tolerances of the LCD glass used in cellular phone applications by taking advantage of the characteristics of chip-on-glass LCD design.
- Chip-on-glass LCD design mounts an LCD driver chip to the LCD with a high degree of accuracy.
- the LCD and printed circuit board interconnection can be improved significantly, reducing size, increasing performance and reliability, and easing the manufacture of the LCD and associated hardware.
- the interconnection device allows tighter framing of the LCD in the cellular phone or device.
- the interconnection device directly takes advantage of the precision location of the LCD contacts and the LCD driver chip as a means to align the interconnection device to the LCD.
- the LCD driver chip is normally mounted to a tolerance of ⁇ 0.04 mm in the LCD design. Further, the LCD driver chip is bonded to the glass permanently because the bonding agent used is stronger than the LCD glass.
- the LCD contacts are also precisely located on the LCD in relation to the LCD driver chip. As previously mentioned, the LCD contacts are normally made from ITO or some other conductive material.
- the tolerance of the glass is eliminated from the design. This allows the size of the LCD contacts, which are in electrical connection with the LCD driver chip, to be reduced by essentially twice the tolerance that is associated with using the LCD glass as the alignment point. These features will ensure that the contacts of the interconnection device make electrical contact with the LCD contacts at a much tighter tolerance than previously possible.
- the precise make-up of the contacts used on the interconnection device are irrelevant and could be selected from the group including spring contacts, pogo pins, a discreet conductive elastomer, or conductive wires.
- the interconnection device preferably comprises a non-conductive body having at least one surface located for self-aligning engagement with the LCD driver chip. At least one conductive lead is included in the non-conductive body that has a first contact and a second contact that emerge from the non-conductive body. The first contact is used to make an electrical connection with the LCD contacts and the second contact is used to make an electrical connection with the base circuit contacts.
- FIG. 1 a depicts the top view of an LCD.
- FIG. 1 b is a right side view of the LCD assembly depicted in FIG. 1 a.
- FIG. 2 a is a top view of an interconnection device.
- FIG. 2 b is a bottom view of the interconnection device depicted in FIG. 2 a.
- FIG. 2 c is a right end view of the device depicted in FIG. 2 b.
- FIG. 3 a depicts a top view of an interconnection device connected with the LCD driver chip.
- FIG. 3 b is a right side view of FIG. 3 a.
- FIG. 4 a is a perspective view of a base circuit.
- FIG. 4 b is a side view of an interconnection device, connected with an LCD before being mated with a base circuit.
- FIG. 5 is a side view of the LCD, the interconnection device, and a base circuit after being mated together.
- FIG. 6 illustrates a bottom view of an interconnection device having a spring arm.
- FIG. 7 illustrates a side view of an interconnection device having a hook.
- FIG. 8 illustrates an exploded perspective view of an LCD, an interconnection device, a light guide, and a base circuit before assembly.
- a typical LCD 10 that has a plurality of LCD contacts 12 that are electrically connected with a driver chip 14 on the LCD 10 .
- the driver chip 14 together with an upper glass plate 16 , are mounted on a lower glass plate 18 .
- the LCD contacts 12 are positioned in relation to the driver chip 14 with a high degree of accuracy. This is because the design tolerances for the driver chip 14 require the LCD contacts 12 to be positioned with a high degree of precision.
- the upper glass plate 16 and the lower glass plate 18 are typically bonded together with a bonding agent.
- Such LCDs are known in the art, and are employed in various devices, such as cellular phones. The exact shape and size of the LCD 10 may vary depending on the particular design of the cellular phone.
- FIGS. 2 a , 2 b and 2 c illustrate a preferred embodiment of an interconnection device 20 .
- the interconnection device 20 electrically connects the LCD contacts 12 (see FIG. 1 a ) with a base circuit board 42 (see FIG. 4 a ) that includes a plurality of base circuit contacts 44 .
- the base circuit board 42 should be broadly construed to include any electrical circuitry that can provide operating signals to the LCD 10 during operation, such as the base circuit in a typical cellular phone.
- the interconnection device 20 has a non-conductive body 22 that is made from any suitable dielectric material, such as plastic for instance. As depicted in FIGS. 2 a and 2 b , the interconnection device 20 includes a plurality of engagement surfaces 24 , 26 , 28 , that are used connect the non-conductive body 22 to the driver chip 14 of the LCD 10 . In the preferred embodiment, the plurality of engagement surfaces 24 , 26 , 28 form a U-shaped notch 30 that fits securely around the perimetrical edges of the driver chip 14 , as shown in FIG. 3 a . As illustrated in FIGS. 2 a , 2 b and 3 a , the engagement surfaces 24 , 28 engage the edges of the driver chip 14 .
- the interconnection device 20 includes at least one conductive lead 32 that is located in the non-conductive body 22 .
- the exact positioning of the at least one conductive lead 32 will vary, depending on the design tolerances of the interconnection device 20 .
- Each conductive lead 32 has one or more first contacts 34 and one or more second contacts 36 .
- the one or more first contacts 34 emerge from the non-conductive body 22 on the bottom surface of the non-conductive body 22 and the one or more second contacts 36 emerge from the non-conductive body 22 on its top surface.
- the first contacts 34 and the second contacts 36 may be, for example solder pads, spring contacts, pogo pins or discreet conductive elastomers.
- the interconnection device 20 securely clips to the driver chip 14 of the LCD 10 in a friction fit, wherein the engagement surfaces 24 , 28 press against the ends of the driver chip 14 .
- the interconnection device 20 uses the precise positioning of the driver chip 14 in relation to the LCD contacts 12 to advantageously mate each respective first contact 34 with a respective LCD contact 12 . Once the interconnection device 20 is clipped to the driver chip 14 the LCD contacts 12 are electrically connected with the first contacts 34 .
- the non-conductive body 22 is formed having an L-shaped cross section. As illustrated in FIG. 3 b , the base 38 of the non-conductive body 22 mates with a top edge 40 of the LCD 10 . It should be noted however, that the non-conductive body 22 may not include the base 38 .
- the engagement surfaces 24 , 28 provide the critical alignment feature in relation to the driver chip 14 . Referring to FIG. 3 a , the x-axis of the LCD 10 is the most critical feature for purposes of proper alignment. Due to the nature of the positioning of the LCD contacts 12 the y-axis of the LCD 10 is not as critical as the x-axis of the LCD 10 .
- a base circuit board 42 is illustrated that includes one or more base circuit contacts 44 .
- the base circuit board 42 should be broadly construed to include any device that contains electrical circuitry that can provide operating signals to the LCD 10 .
- the base circuit board 42 illustrated in FIG. 4 a is for illustrative purposes only and should not be construed as a limitation of the present invention. Those skilled in the art would recognize that the base circuit board 42 may have many different shapes and sizes other than that depicted in FIG. 4 a.
- the interconnection device 20 is shown clipped to the LCD 10 before being connected with the base circuit board 42 .
- the interconnection device 20 may include one or more pins 46 , which engage apertures 48 in the base circuit board 42 to align the interconnection device 20 in relation to the base circuit board 42 .
- the pin 46 is designed to fit in its corresponding aperture 48 located in the base circuit board 42 .
- the exact position of the pin or pins 46 is not critical, however, the pin or pins 46 should be positioned clear of the second contacts 36 .
- each pin or pins 46 may be dimensioned to provide a friction fit with its associated aperture 48 .
- FIG. 5 illustrates the interconnection device 20 assembled with the LCD 10 and the base circuit 42 .
- the interconnection device 20 precisely positions the LCD contacts 12 in electrical contact with the base circuit contacts 44 , thereby interconnecting the two components.
- the interconnection device 20 allows the LCD 10 to be connected with the base circuit 42 in an extremely precise, compact, and removable manner.
- the one or more second contacts 36 may be soldered to the base circuit contacts 44 to provide a permanent electrical connection.
- FIG. 6 another embodiment discloses an interconnection device 50 with a non-conductive body 52 including a projecting surface 54 spaced for self-aligning engagement with one side surface of the driver chip 14 .
- a portion of the non-conductive body 52 opposite the projecting surface 54 is a spring arm 56 .
- the spring arm 56 is sufficiently flexible to accommodate variations in driver chip 14 tolerances, while still assuring that the interconnection device 50 is aligned and secured to the driver chip 14 .
- an interconnection device 60 that includes a clip 62 that resiliently connects the non-conductive body 64 of the interconnection device 60 to the edge of the LCD 10 .
- the clip 62 resiliently secures the interconnection device 60 to the top edge of the LCD 10 , thereby securely holding the interconnection device 60 in place.
- this disclosed embodiment may also include a pin 66 to align the interconnection device 60 with a base circuit board 42 .
- FIG. 8 shows an alternative method of using an interconnection device 70 .
- a light guide 72 further assists alignment of the interconnection device 70 in the final assembly of the cellular phone.
- the light guide 72 may be used to hold other components of a cellular phone, however that is beyond the scope of the present invention.
- the light guide 72 includes a generally square shaped aperture 74 that fits around the perimetrical edges 76 , 78 , 80 , 82 of the interconnection device 70 , which is itself engaged and aligned with the driver chip 14 .
- the light guide 72 is therefore aligned with the driver chip 14 .
- Pins 84 of the light guide engage corresponding apertures 86 of the base circuit board 42 and therefore align the base circuit board 42 with the light guide 72 .
- the pins 84 can be dimensioned to provide a friction fit in the apertures 86 , thereby securing the light guide 72 to the base circuit board 42 .
- the interconnection device 70 interconnects the LCD contacts 12 with the base circuit contacts 44 (not shown in FIG. 8) as with other embodiments.
Abstract
An interconnection device for connecting a plurality of LCD contacts with a plurality of base circuit contacts. The interconnection device includes a non-conductive body having a U-shaped notch located for self-aligning engagement with a LCD driver chip. In addition, the non-conductive body includes at least one conductive lead. The conductive lead includes a first contact and a second contact that emerge from the non-conductive body. The contacts of the non-conductive body engage corresponding contacts of the LCD and base circuit board when the non-conductive body is engaged in alignment with the LCD driver chip.
Description
- The present invention relates generally to liquid-crystal display (“LCD”) connectors, and in particular, to a mechanical self-aligning interconnect device used to connect an LCD with a base circuit.
- The number of cellular phones being used in the United States is growing at a rapid rate. This means that more and more people are carrying cellular phones with them from one location to another. As such, most cellular phone users desire a phone that is lightweight, compact, easy to carry and full of features As a result of this demand, cellular phone designers are striving to develop smaller types of cellular phones that are still capable of incorporating all of the features that are available to cellular phone users.
- Most cellular phones use an LCD to communicate information to the user while the phone is being used. A LCD uses strips or squares of liquid-crystal material to form digits or pixels that communicate information when energized. Some aspects of the manufacture of LCDs are extremely precise. For example, the tolerances for the location of the electrical traces or contacts on the LCD that are used to drive the LCD are on the order of ±0.025 mm. The electrical traces that interconnect the LCD with a second device are typically made from indium tin oxide (“ITO”) or some other conductive material. However, other aspects of the LCDs are not as precise due to the nature of the materials that are used or the methods in which they are manufactured.
- LCDs have a very wide tolerance for the mechanical dimensions of the glass and the positioning of the electrical traces with respect to the edges of the glass. These tolerance ranges are much larger and are generally only required to be accurate within ±0.200 mm or even greater. This large tolerance is predominantly a result of the manufacturing process that necessitates scoring and breaking of a larger glass panel to create discrete LCDs.
- Due to the number of parts and their associated tolerances, designing mechanical interconnects for the LCDs that are used in cellular phones is problematic. This is particularly true for LCDs that use chip-on-glass technology, in which an LCD driver chip is bonded directly to the LCD glass. These designs do not incorporate a secondary connection means, such as a flex film, which is used in chip-on-flex and chip-on-tab technologies. Flex film is an array of conductors bonded to a thin dielectric film. In these designs, one end of the flex film is bonded to the LCD driver chip while the other end, because the flex film is flexible, may be manipulated and bent around objects until being connected to a circuit which drives the LCD driver chip. However, using flex film is no longer appealing in cellular phone designs due to size constraints.
- In prior cellular phone designs, the LCD is generally held in place with a light guide. The LCD is mounted in the lightguide and the edges of the lightguide are used to align and hold the LCD in position. Thus, the edges of the LCD, which have wide tolerances, are used to align the LCD in place. In these devices, an LCD connector is retained by the lightguide and used to electrically connect the LCD with the printed circuit board of the cellular phone. Since all known prior art cellular phone designs align the LCD by using the edge of the LCD glass they suffer from the large tolerances associated with the LCD glass. To that end, this creates connection and quality problems that are difficult to deal with in the manufacture of a larger number of cellular phones.
- Since the LCD driver chip must be electrically connected with the contacts on the printed circuit board of the cellular phone an optimization of the respective interconnection between the of the LCD contacts and the printed circuit board contacts is required to provide a reliable and repeatable mechanical design. Best engineering practice dictates that the system must function under all tolerance conditions. However, since the LCD is captured and aligned by the edges of the LCD glass, ultimately the large glass tolerances drive the design of these devices to incorporate a large connection pad size and pitch, often beyond the limits of practicality. This hinders efforts to miniaturize the size of cellular phones.
- Another problem that must be dealt with is that the performance and functionality of the LCD may be negatively impacted due to the relatively high resistance of the indium-tin oxide which is used as the material to electrically connect the driver to the pixels within the LCD. The ITO traces therefore need to be minimized for low resistance and optimal performance. This is in direct conflict with the requirements of large ITO pads required for reliable design. To illustrate, the acknowledge pulse of the typical LCD may not work if the connection resistance approaches 90 mΩ, which allows for very little ITO in the electrical path.
- As cellular phones get smaller and more featured, space within the transceiver has become extremely important. The problem associated with interconnecting the LCD with the cellular phone's printed circuit board was not dealt with in prior devices because designs were either accommodating to the large tolerances or design principles were sacrificed to meet space requirements. To that end, a need exists for a way to optimally electrically interconnect the LCD to the printed circuit board in a cellular phone with precision.
- The present invention discloses an interconnection device for interconnecting a plurality of contacts accurately positioned on an LCD with a plurality of connections on an underlying base circuit which provides operating signals to the LCD. The interconnection device solves the problems associated with the large tolerances of the LCD glass used in cellular phone applications by taking advantage of the characteristics of chip-on-glass LCD design. Chip-on-glass LCD design mounts an LCD driver chip to the LCD with a high degree of accuracy. By reducing the alignment tolerances by one order of magnitude, the LCD and printed circuit board interconnection can be improved significantly, reducing size, increasing performance and reliability, and easing the manufacture of the LCD and associated hardware. In addition, the interconnection device allows tighter framing of the LCD in the cellular phone or device.
- The interconnection device directly takes advantage of the precision location of the LCD contacts and the LCD driver chip as a means to align the interconnection device to the LCD. As a necessity to the proper operation of the LCD, the LCD driver chip is normally mounted to a tolerance of ±0.04 mm in the LCD design. Further, the LCD driver chip is bonded to the glass permanently because the bonding agent used is stronger than the LCD glass. The LCD contacts are also precisely located on the LCD in relation to the LCD driver chip. As previously mentioned, the LCD contacts are normally made from ITO or some other conductive material.
- By aligning the interconnection device with the LCD driver chip instead of the LCD glass, the tolerance of the glass is eliminated from the design. This allows the size of the LCD contacts, which are in electrical connection with the LCD driver chip, to be reduced by essentially twice the tolerance that is associated with using the LCD glass as the alignment point. These features will ensure that the contacts of the interconnection device make electrical contact with the LCD contacts at a much tighter tolerance than previously possible. The precise make-up of the contacts used on the interconnection device are irrelevant and could be selected from the group including spring contacts, pogo pins, a discreet conductive elastomer, or conductive wires.
- The interconnection device preferably comprises a non-conductive body having at least one surface located for self-aligning engagement with the LCD driver chip. At least one conductive lead is included in the non-conductive body that has a first contact and a second contact that emerge from the non-conductive body. The first contact is used to make an electrical connection with the LCD contacts and the second contact is used to make an electrical connection with the base circuit contacts.
- FIG. 1a depicts the top view of an LCD.
- FIG. 1b is a right side view of the LCD assembly depicted in FIG. 1a.
- FIG. 2a is a top view of an interconnection device.
- FIG. 2b is a bottom view of the interconnection device depicted in FIG. 2a.
- FIG. 2c is a right end view of the device depicted in FIG. 2b.
- FIG. 3a depicts a top view of an interconnection device connected with the LCD driver chip.
- FIG. 3b is a right side view of FIG. 3a.
- FIG. 4a is a perspective view of a base circuit.
- FIG. 4b is a side view of an interconnection device, connected with an LCD before being mated with a base circuit.
- FIG. 5 is a side view of the LCD, the interconnection device, and a base circuit after being mated together.
- FIG. 6 illustrates a bottom view of an interconnection device having a spring arm.
- FIG. 7 illustrates a side view of an interconnection device having a hook.
- FIG. 8 illustrates an exploded perspective view of an LCD, an interconnection device, a light guide, and a base circuit before assembly.
- Referring to FIGS. 1a and 1 b, a
typical LCD 10 is disclosed that has a plurality ofLCD contacts 12 that are electrically connected with adriver chip 14 on theLCD 10. Generally, when theLCD 10 is designed by the manufacturer, thedriver chip 14, together with anupper glass plate 16, are mounted on alower glass plate 18. As previously set forth, theLCD contacts 12 are positioned in relation to thedriver chip 14 with a high degree of accuracy. This is because the design tolerances for thedriver chip 14 require theLCD contacts 12 to be positioned with a high degree of precision. Theupper glass plate 16 and thelower glass plate 18 are typically bonded together with a bonding agent. Such LCDs are known in the art, and are employed in various devices, such as cellular phones. The exact shape and size of theLCD 10 may vary depending on the particular design of the cellular phone. - FIGS. 2a, 2 b and 2 c illustrate a preferred embodiment of an
interconnection device 20. Theinterconnection device 20 electrically connects the LCD contacts 12 (see FIG. 1a) with a base circuit board 42 (see FIG. 4a) that includes a plurality ofbase circuit contacts 44. Thebase circuit board 42 should be broadly construed to include any electrical circuitry that can provide operating signals to theLCD 10 during operation, such as the base circuit in a typical cellular phone. - The
interconnection device 20 has anon-conductive body 22 that is made from any suitable dielectric material, such as plastic for instance. As depicted in FIGS. 2a and 2 b, theinterconnection device 20 includes a plurality of engagement surfaces 24, 26, 28, that are used connect thenon-conductive body 22 to thedriver chip 14 of theLCD 10. In the preferred embodiment, the plurality of engagement surfaces 24, 26, 28 form aU-shaped notch 30 that fits securely around the perimetrical edges of thedriver chip 14, as shown in FIG. 3a. As illustrated in FIGS. 2a, 2 b and 3 a, the engagement surfaces 24, 28 engage the edges of thedriver chip 14. - Referring to FIG. 2c, the
interconnection device 20 includes at least oneconductive lead 32 that is located in thenon-conductive body 22. The exact positioning of the at least oneconductive lead 32 will vary, depending on the design tolerances of theinterconnection device 20. Eachconductive lead 32 has one or morefirst contacts 34 and one or moresecond contacts 36. As depicted, the one or morefirst contacts 34 emerge from thenon-conductive body 22 on the bottom surface of thenon-conductive body 22 and the one or moresecond contacts 36 emerge from thenon-conductive body 22 on its top surface. Thefirst contacts 34 and thesecond contacts 36 may be, for example solder pads, spring contacts, pogo pins or discreet conductive elastomers. - As depicted in FIGS. 3a and 3 b, the
interconnection device 20 securely clips to thedriver chip 14 of theLCD 10 in a friction fit, wherein the engagement surfaces 24,28 press against the ends of thedriver chip 14. As previously stated, theinterconnection device 20 uses the precise positioning of thedriver chip 14 in relation to theLCD contacts 12 to advantageously mate each respectivefirst contact 34 with arespective LCD contact 12. Once theinterconnection device 20 is clipped to thedriver chip 14 theLCD contacts 12 are electrically connected with thefirst contacts 34. - In the embodiments depicted in FIGS. 2a, 2 b and 2 c, the
non-conductive body 22 is formed having an L-shaped cross section. As illustrated in FIG. 3b, thebase 38 of thenon-conductive body 22 mates with atop edge 40 of theLCD 10. It should be noted however, that thenon-conductive body 22 may not include thebase 38. The engagement surfaces 24,28 provide the critical alignment feature in relation to thedriver chip 14. Referring to FIG. 3a, the x-axis of theLCD 10 is the most critical feature for purposes of proper alignment. Due to the nature of the positioning of theLCD contacts 12 the y-axis of theLCD 10 is not as critical as the x-axis of theLCD 10. - Referring to FIG. 4a, a
base circuit board 42 is illustrated that includes one or morebase circuit contacts 44. As previously set forth, thebase circuit board 42 should be broadly construed to include any device that contains electrical circuitry that can provide operating signals to theLCD 10. Thebase circuit board 42 illustrated in FIG. 4a is for illustrative purposes only and should not be construed as a limitation of the present invention. Those skilled in the art would recognize that thebase circuit board 42 may have many different shapes and sizes other than that depicted in FIG. 4a. - Referring to FIG. 4b, the
interconnection device 20 is shown clipped to theLCD 10 before being connected with thebase circuit board 42. In some preferred embodiments, theinterconnection device 20 may include one ormore pins 46, which engageapertures 48 in thebase circuit board 42 to align theinterconnection device 20 in relation to thebase circuit board 42. Thepin 46 is designed to fit in its correspondingaperture 48 located in thebase circuit board 42. The exact position of the pin or pins 46 is not critical, however, the pin or pins 46 should be positioned clear of thesecond contacts 36. Also, each pin or pins 46 may be dimensioned to provide a friction fit with its associatedaperture 48. - FIG. 5 illustrates the
interconnection device 20 assembled with theLCD 10 and thebase circuit 42. As depicted, theinterconnection device 20 precisely positions theLCD contacts 12 in electrical contact with thebase circuit contacts 44, thereby interconnecting the two components. Theinterconnection device 20 allows theLCD 10 to be connected with thebase circuit 42 in an extremely precise, compact, and removable manner. If desired, the one or moresecond contacts 36 may be soldered to thebase circuit contacts 44 to provide a permanent electrical connection. - Referring to FIG. 6, another embodiment discloses an
interconnection device 50 with a non-conductive body 52 including a projectingsurface 54 spaced for self-aligning engagement with one side surface of thedriver chip 14. In this embodiment, a portion of the non-conductive body 52 opposite the projectingsurface 54 is aspring arm 56. Thespring arm 56 is sufficiently flexible to accommodate variations indriver chip 14 tolerances, while still assuring that theinterconnection device 50 is aligned and secured to thedriver chip 14. - Referring to FIG. 7, another embodiment discloses an
interconnection device 60 that includes aclip 62 that resiliently connects thenon-conductive body 64 of theinterconnection device 60 to the edge of theLCD 10. In this embodiment, theclip 62 resiliently secures theinterconnection device 60 to the top edge of theLCD 10, thereby securely holding theinterconnection device 60 in place. As with the other embodiments, this disclosed embodiment may also include apin 66 to align theinterconnection device 60 with abase circuit board 42. - FIG. 8, shows an alternative method of using an
interconnection device 70. In this method, alight guide 72 further assists alignment of theinterconnection device 70 in the final assembly of the cellular phone. Thelight guide 72 may be used to hold other components of a cellular phone, however that is beyond the scope of the present invention. Thelight guide 72 includes a generally square shapedaperture 74 that fits around the perimetrical edges 76, 78, 80, 82 of theinterconnection device 70, which is itself engaged and aligned with thedriver chip 14. Thelight guide 72 is therefore aligned with thedriver chip 14.Pins 84 of the light guide engagecorresponding apertures 86 of thebase circuit board 42 and therefore align thebase circuit board 42 with thelight guide 72. Thepins 84 can be dimensioned to provide a friction fit in theapertures 86, thereby securing thelight guide 72 to thebase circuit board 42. Theinterconnection device 70 interconnects theLCD contacts 12 with the base circuit contacts 44 (not shown in FIG. 8) as with other embodiments. - While the invention has been described in its currently best known modes of operation and embodiments, other modes and embodiments of the invention will be apparent to those skilled in the art.
Claims (28)
1. An alignment and connection device, comprising:
a device component with at least one device component electrical contact;
a base circuit board with at least one base circuit electrical contact;
a non-conductive body having at least one device component contacting surface, at least one base contacting surface and at least one conductive lead with a first contact disposed in association with the device component contacting surface and a second contact disposed in association with the base contacting surface; and
whereby the device component contacting surface engages in aligned relation to the device component, the base contacting surface engages in aligned relation to the base circuit board and the first contact electrically connects with the device component electrical contact and the second contact electrically connects with the base circuit electrical contact.
2. The device of , wherein the first contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 1
3. The device of , wherein the second contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 1
4. The device of , wherein the first contact emerges from the top surface of the non-conductive body.
claim 1
5. The device of , wherein the second contact emerges from the bottom of the non-conductive body.
claim 1
6. The device of , wherein the non-conductive body has an L-shaped cross section.
claim 1
7. The device of , wherein the non-conductive body has a U-shaped notch for engaging the device component in aligned relation.
claim 1
8. The device of , wherein one leg of the U-shaped notch comprises a spring arm, the spring arm resiliently engaging the device component in aligned relation.
claim 7
9. The device of , wherein the non-conductive body includes a pin for engaging the base circuit board in aligned relation.
claim 1
10. The device of , wherein the device component has an edge and the non-conductive body includes a hook for engaging the edge in aligned relation.
claim 1
11. The device of , wherein the second contact is soldered to the at least one base circuit electrical contact.
claim 1
12. The device of , wherein the device component is a driver chip for an LCD.
claim 1
13. An interconnection device for connecting a LCD driver chip having at least one LCD contact with a base circuit board having at least one corresponding base circuit contact, comprising:
a non-conductive body having a plurality of surfaces spaced for self-aligning engagement with surfaces of the LCD driver chip;
at least one lead located in the non-conductive body, wherein the at least one lead includes a first contact for being electrically connected with a LCD contact and a second contact for being electrically connected in alignment with the corresponding base circuit contact.
14. The interconnection device of , wherein the first contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 13
15. The interconnection device of , wherein the second contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 13
16. The interconnection device of , wherein the non-conductive body includes at least one pin and the base circuit board includes at least one aperture for receiving the pin, the pin being used to align the non-conductive body on the base circuit and to secure the non-conductive body on the base circuit.
claim 13
17. The interconnection device of , wherein the plurality of surfaces of the non-conductive body comprises a pair of projective surfaces.
claim 13
18. The interconnection device of , wherein one projective surface comprises a spring arm for securing the non-conductive body to an edge of a LCD driver chip.
claim 13
19. The interconnection device of , wherein the non-conductive body further includes a hook to secure the non-conductive body to a top edge of the LCD.
claim 13
20. The interconnection device of , wherein each respective second contact is soldered to a respective base circuit contact.
claim 13
21. A method of interconnecting a LCD driving chip having a plurality of LCD contacts with a base circuit board having a plurality of base circuit contacts, comprising the steps of:
providing a non-conductive body having a plurality of engagement surfaces and including a plurality of conductive leads, each lead having a first contact and a second contact emerging from the non-conductive body;
affixing the engagement surfaces in alignment with the LCD driver chip so that the first contacts electrically connect with their respective LCD contacts; and
aligning the base circuit board with respect to the non-conductive body so that the second contacts electrically connect with their respective base circuit contacts.
22. The method of , further comprising the step engaging an opening of a light guide with the edges of the non-conductive body.
claim 21
23. The method of , wherein each of the first contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 21
24. The method of , wherein each of the second contact is selected from the group consisting of a solder pad, a spring contact, a pogo pin or a discreet conductive elastomer.
claim 21
25. The method of , further including the step of securing the non-conductive body to an edge of an LCD.
claim 21
26. The method of , further including the step of securing the non-conductive body to an edge of the LCD driver chip with a spring arm.
claim 21
27. The method of , further including the step of a pin of the non-conductive body into an aperture of the base circuit board.
claim 21
28. The method of , further including the step of using a hook on the non-conductive body to latch the non-conductive body to an edge of an LCD.
claim 21
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/245,683 US6293804B2 (en) | 1999-02-08 | 1999-02-08 | Self-aligning LCD connector assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/245,683 US6293804B2 (en) | 1999-02-08 | 1999-02-08 | Self-aligning LCD connector assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010012705A1 true US20010012705A1 (en) | 2001-08-09 |
US6293804B2 US6293804B2 (en) | 2001-09-25 |
Family
ID=22927645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/245,683 Expired - Lifetime US6293804B2 (en) | 1999-02-08 | 1999-02-08 | Self-aligning LCD connector assembly |
Country Status (1)
Country | Link |
---|---|
US (1) | US6293804B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6506059B2 (en) * | 2001-03-29 | 2003-01-14 | Avx Corporation | Electrical connectors for display devices |
US6551134B1 (en) * | 2001-06-11 | 2003-04-22 | Picolight Incorporated | Mounted transceivers |
DE10205615A1 (en) * | 2002-02-11 | 2003-08-28 | Leoni Ag | Device with a unit having an electrical connection |
CN101086508B (en) * | 2006-06-07 | 2010-05-12 | 瀚斯宝丽股份有限公司 | Checking apparatus and its connector and checking method |
GB2463837B8 (en) * | 2007-06-27 | 2013-04-03 | Gkn Aerospace Services Structures Corp | In-situ electrical connector with composite structure |
US8441275B1 (en) * | 2010-01-14 | 2013-05-14 | Tapt Interconnect, LLC | Electronic device test fixture |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4120843A (en) * | 1976-03-29 | 1978-10-17 | International Business Machines Corporation | Strippable solder mask material comprising polysulfone, silicon dioxide filler, and solvent |
US5767575A (en) * | 1995-10-17 | 1998-06-16 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
US6330967B1 (en) * | 1997-03-13 | 2001-12-18 | International Business Machines Corporation | Process to produce a high temperature interconnection |
US6396707B1 (en) * | 1999-10-21 | 2002-05-28 | Siliconware Precision Industries Co., Ltd. | Ball grid array package |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3991463A (en) * | 1975-05-19 | 1976-11-16 | Chomerics, Inc. | Method of forming an interconnector |
US4643499A (en) * | 1985-09-04 | 1987-02-17 | At&T Bell Laboratories | Component mounting apparatus |
DE3538630A1 (en) * | 1985-10-30 | 1987-05-07 | Siemens Ag | COLLECTING DEVICE |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5358412A (en) * | 1993-04-26 | 1994-10-25 | Eastman Kodak Company | Method and apparatus for assembling a flexible circuit to an LCD module |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
GB2307598B (en) * | 1995-11-24 | 2000-02-23 | Varintelligent | Combined printed circuit board and integrated circuit driver |
US5709576A (en) * | 1996-04-01 | 1998-01-20 | Delco Electronics Corporation | LCD connector alignment with printed wiring board |
US5905638A (en) * | 1997-12-18 | 1999-05-18 | Ericsson Inc. | Method and apparatus for packaging a microelectronic device with an elastomer gel |
US6019610A (en) * | 1998-11-23 | 2000-02-01 | Glatts, Iii; George F. | Elastomeric connector |
-
1999
- 1999-02-08 US US09/245,683 patent/US6293804B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4120843A (en) * | 1976-03-29 | 1978-10-17 | International Business Machines Corporation | Strippable solder mask material comprising polysulfone, silicon dioxide filler, and solvent |
US5767575A (en) * | 1995-10-17 | 1998-06-16 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
US6330967B1 (en) * | 1997-03-13 | 2001-12-18 | International Business Machines Corporation | Process to produce a high temperature interconnection |
US6396707B1 (en) * | 1999-10-21 | 2002-05-28 | Siliconware Precision Industries Co., Ltd. | Ball grid array package |
Also Published As
Publication number | Publication date |
---|---|
US6293804B2 (en) | 2001-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6597416B1 (en) | Display panel with supporting member having recess for elastic connector | |
US6191838B1 (en) | Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device | |
US7419380B2 (en) | Wiring board, mount structure, and method for manufacturing the same | |
US6342932B1 (en) | Liquid crystal display | |
KR100467183B1 (en) | Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same | |
KR100559802B1 (en) | Liquid crystal device and electronic apparatus therewith | |
US6091474A (en) | Display assembly | |
KR20010067058A (en) | Board-to-board connector capable of readily electrically connecting two parallel boards to each other | |
US6855013B2 (en) | LCD connector for printed circuit boards | |
US6123551A (en) | Electronic circuit interconnection method and apparatus | |
US5066235A (en) | Connector assembly for electronic devices | |
US6293804B2 (en) | Self-aligning LCD connector assembly | |
EP1096611A2 (en) | Flat cable connector | |
US6172731B1 (en) | Display device including reinforcing plate between circuit substrate and display panel | |
JP2849639B2 (en) | Imaging device | |
US7258550B2 (en) | Electrical connector assembly | |
JP4316722B2 (en) | IC card with antenna | |
US6969263B2 (en) | Electrical connector assembly | |
US6285432B1 (en) | Method and apparatus for locating LCD connectors | |
US20040077189A1 (en) | Adhesive interconnector | |
US5786877A (en) | Reflector holding structure for liquid crystal module | |
EP1078426B1 (en) | Display device | |
JPH11202788A (en) | Assembling device and assembling method for electrically connectable display device | |
JP2004296419A (en) | Connector | |
JP3486531B2 (en) | Liquid crystal device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ERICSSON INC., NORTH CAROLINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SMITH, STACY;REEL/FRAME:009759/0723 Effective date: 19990203 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |