US20020185409A1 - Desiccant containing product carrier - Google Patents
Desiccant containing product carrier Download PDFInfo
- Publication number
- US20020185409A1 US20020185409A1 US09/543,346 US54334600A US2002185409A1 US 20020185409 A1 US20020185409 A1 US 20020185409A1 US 54334600 A US54334600 A US 54334600A US 2002185409 A1 US2002185409 A1 US 2002185409A1
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- US
- United States
- Prior art keywords
- carrier
- desiccant
- product
- semiconductor device
- bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002274 desiccant Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004927 clay Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000440 bentonite Substances 0.000 claims description 3
- 229910000278 bentonite Inorganic materials 0.000 claims description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 3
- 239000010437 gem Substances 0.000 claims description 3
- 229910001751 gemstone Inorganic materials 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000002372 labelling Methods 0.000 claims 2
- 239000000969 carrier Substances 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- -1 e.g. Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000011140 metalized polyester Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/264—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing liquids
Definitions
- the present invention relates to a product carrier that has a desiccant incorporated therein.
- the present invention is particularly applicable in reducing the steps required to package a semiconductor device.
- Some IC packages are susceptible to moisture induced damage. The risk of this is highest when plastic encapsulation materials are used, as plastic is naturally permeable to moisture. The moisture in the package will increase or decrease to reach the Relative Humidity (RH) of the surrounding environment.
- RH Relative Humidity
- controlling the moisture level in the package body is critical to reducing the risk of moisture-induced damage.
- damage may include delamination between the die and the plastic encapsulation material, which may result in open connections due to broken wirebonds.
- Package cracking may also occur when the components are exposed to the high temperatures and steep temperature gradients used in reflow board assembly techniques. Moisture in the package rapidly heats and vaporizes and, if there is sufficient steam due to the moisture in the package having reached a critical level, it will fracture the package to escape. This phenomenon is known as the “popcorn effect.”
- plastic semiconductor devices are susceptible to moisture due to the permeable nature of their plastic components. It is well known that integrated circuits which are contaminated by high levels of moisture may not be useful. Mechanical failure of such contaminated integrated circuits often leads to the subsequent electrical failure of the device which contains the integrated circuit due to thermal and mechanical stresses. Accordingly, exposure of integrated circuits to moisture should be limited.
- the preferred method to form a packaging system for integrated circuits includes baking the integrated circuit devices until dry, placing them into a water and humidity proof packaging bag which contains desiccant packets and a humidity indicator card, sealing the bag immediately, and then shipping the device to the customer in these packaging bags.
- the product is typically dry packed for storage and shipment. This is done for all types of product carrier (e.g., tubes, trays, reels, etc.). Dry packing protects product from environmental moisture by maintaining the interior of the dry pack bag at (less than or equal to) 20 percent RH. Included in the dry pack bag are a prescribed number of desiccant pouches. The desiccant pouches greatly reduce the presence of moisture.
- a carrier for a semiconductor device includes a material containing desiccant particles embedded therein and a holding region for the semiconductor device.
- Another aspect of the present invention provides a method for manufacturing such a semiconductor carrier.
- the method includes the steps of mixing a desiccant with molten plastic and molding the mixture into a product carrier.
- FIG. 1 illustrates an embodiment of the present invention.
- FIG. 2 illustrates a flow chart for practicing a method of the present invention.
- the product carrier is a tray 20 formed from a material, e.g., plastic.
- a material e.g., plastic.
- exemplary materials include, for example, conductive thermoplastic, non-conductive and insulated plastic, antistatically coated PVC, antistatically coated polysulfone (to provide protection from ESD damage and to eliminate the potential for low leakage between component leads), conductive carbon-filled polypropylene, and black dissipative BPI-10 plastic.
- the carrier material can withstand temperatures up to about 40° C. to about 60° C., for example, temperatures of ⁇ 125° C. to 150° C.
- the material can also include a carbon-based material or be antistatically coated to provide ESD protection.
- desiccant particles 25 are embedded within tray 20 .
- a preferred desiccant is montmorillonite (bentonite) clay.
- Tray 20 includes a notched corner 25 , a flat or open bottom 27 , two sets of opposing vertical sides 23 a , 23 b , and an open top 29 . Together, the flat bottom and two sets of opposing vertical sides form a holding region in which a semiconductor device may be placed. Multiple trays of product can be stacked for shipment with an additional tray serving as a cover. All devices can be uniformly oriented so pin one is aligned with the notched corner 25 of tray 20 .
- the product carrier of the present invention may comprise one or more materials and/or may comprise one or more layers of material.
- the inventive product carriers may comprise a recycled material, such as about 5% to 30% recycled materials
- the product carrier is a tray.
- the particular product carrier e.g., tube, tray, reel, and jewel box, can be readily selected and optimized based on a particular semiconductor device to achieve the goals of the present invention.
- the present invention is not limited to product carriers for any particular IC package style. Rather, the product carriers of the present invention may be configured to accommodate, for example, Pin Grid Arrays (PGAs), ceramic flat packs, non-quad flat packs, quad flat packs, and Dual-In-Line packages.
- PGAs Pin Grid Arrays
- ceramic flat packs non-quad flat packs
- quad flat packs quad flat packs
- Dual-In-Line packages Dual-In-Line packages.
- the tray is configured to accommodate multiple semiconductor devices.
- the inventive product carrier may be configured to accommodate a single device and/or product carriers may be configured to accommodate a plurality of devices, each of which is already being held in a carrier.
- inventive product carriers are uniformly sized, in compliance with standard JEDEC outlines.
- inventive product carriers are also sized to ensure that there is no excessive movement of product in the tube during shipping and handling. This protects the mechanical integrity of the package and, if present, leads; it also ensures an unimpaired dispensing of product for manufacturing operations.
- a stack of trays for example, six trays, can be secured with straps; five containing parts and the sixth serving as a cover. Bound trays may then be loaded into an antistatic bubble pack bag, for extra cushioning protection, and then packed in a tray box for shipment. Because a desiccant is incorporated directly into the product carrier, it is unnecessary to include separate desiccant packets in the packaging bag.
- FIG. 2 is a flow diagram illustrating the method for forming a product carrier in accordance with an embodiment of the present invention.
- desiccant particles such as montmorillonite (bentonite) clay
- molten plastic with desiccant particles mixed therein is molded into the product carrier, as with conventional techniques.
- a dry pack bag i.e., moisture barrier bag
- the amount of desiccant mixed with the molten plastic can be optimized such that there are about 32 grams of clay to about 64 grams of clay per dry pack bag.
- the amount of desiccant mixed with the molten plastic can be optimized such that the environment in the bag is maintained at no greater than 20 percent RH, thus protecting the devices during shipment and storage for at least 12 months. If this 12-month shelf life is exceeded, the devices need to be dry baked again only if the RH in the bag has exceeded 30 percent, as evidenced by a humidity indicator card.
- the product Upon determination that a product is moisture sensitive, the product is dry packed for storage and shipment. This is done regardless of the type of product carrier (e.g., tubes, trays, reels, etc.).
- the first step in the dry pack process is to remove any moisture buildup in the package by baking the finished product for 5 to 15.5 hours, depending on the package type, at 125° C.+/ ⁇ 5° C. While baking, the product is contained in the product carriers (provided the carrier is made of material that can withstand the high temperature) or aluminum trays or tubes. Within 50 hours after baking, the product is sealed in a dry pack bag under a partial vacuum.
- An exemplary dry pack bag (i.e., moisture barrier bag) is designed with three layers.
- the inner layer is a low-density polyethylene, which has a static-dissipative coating.
- a second layer is 400 angstroms aluminum metallized to 92-guage polyester.
- the third layer is 400 angstrom aluminum metallized to 92-guage polyester, which has a static-dissipative coating. ESD protection is provided by the inner layer of antistatic polyethylene and the second layer of aluminum metallized polyester.
- the bag is sealed using an impulse heat sealer at a seal time of about 1.0 to about 1.5 seconds; and a seal pressure of about 40 to about 50 psi; and a temperature range of about 191 to about 232° C.
- each dry pack bag includes a card that has humidity sensitive elements which turn from blue to pink whenever the specific RH level is exceeded.
- Labels may also be applied to the outside of the dry pack bag.
- a standard product label which identifies the contents by manufacturing lot number, product part number, and the product date code(s) and quantity per date code.
- a dry pack caution label which identifies the date the bag was sealed, the dry pack expiration date (which is 12 months later)), as well as product handling guidelines.
- a small moisture-sensitivity caution label may also be applied to the outside of the box in which the dry packed parts are packed.
- An advantage of the invention is that it can easily be implemented and is both efficient and cost-effective in reducing the number of steps required to package and ship a semiconductor device.
- Another advantage of the invention is that it is readily fabricated and customized to various semiconductor devices.
Abstract
Disclosed is a product carrier having a desiccant incorporated therein and a method for making the same. The inventive carrier reduces the number of steps required to package a semiconductor device.
Description
- The present invention relates to a product carrier that has a desiccant incorporated therein. The present invention is particularly applicable in reducing the steps required to package a semiconductor device.
- The world of shipping and handling is a hostile one in which product can encounter stress from moisture, temperature changes, and rough handling. Carefully designed packaging methodologies that ensure the preservation of product quality from the factory floor to the customer are required.
- Some IC packages are susceptible to moisture induced damage. The risk of this is highest when plastic encapsulation materials are used, as plastic is naturally permeable to moisture. The moisture in the package will increase or decrease to reach the Relative Humidity (RH) of the surrounding environment.
- Therefore, controlling the moisture level in the package body is critical to reducing the risk of moisture-induced damage. Such damage may include delamination between the die and the plastic encapsulation material, which may result in open connections due to broken wirebonds. Package cracking may also occur when the components are exposed to the high temperatures and steep temperature gradients used in reflow board assembly techniques. Moisture in the package rapidly heats and vaporizes and, if there is sufficient steam due to the moisture in the package having reached a critical level, it will fracture the package to escape. This phenomenon is known as the “popcorn effect.”
- Thus, plastic semiconductor devices are susceptible to moisture due to the permeable nature of their plastic components. It is well known that integrated circuits which are contaminated by high levels of moisture may not be useful. Mechanical failure of such contaminated integrated circuits often leads to the subsequent electrical failure of the device which contains the integrated circuit due to thermal and mechanical stresses. Accordingly, exposure of integrated circuits to moisture should be limited.
- This concern about limiting the exposure of integrated circuits to moisture has been addressed in the design of shipping packaging for integrated circuits. Currently the preferred method to form a packaging system for integrated circuits includes baking the integrated circuit devices until dry, placing them into a water and humidity proof packaging bag which contains desiccant packets and a humidity indicator card, sealing the bag immediately, and then shipping the device to the customer in these packaging bags.
- Once it is determined that a product is moisture sensitive, the product is typically dry packed for storage and shipment. This is done for all types of product carrier (e.g., tubes, trays, reels, etc.). Dry packing protects product from environmental moisture by maintaining the interior of the dry pack bag at (less than or equal to) 20 percent RH. Included in the dry pack bag are a prescribed number of desiccant pouches. The desiccant pouches greatly reduce the presence of moisture.
- There exists a need for an efficient cost-effective carrier for a semiconductor device which eliminates unnecessary product packaging steps.
- There is also a need for a method for manufacturing such a carrier in an efficient, cost-effective manner.
- According to one aspect of the invention, a carrier for a semiconductor device is provided. The carrier includes a material containing desiccant particles embedded therein and a holding region for the semiconductor device.
- Another aspect of the present invention provides a method for manufacturing such a semiconductor carrier. The method includes the steps of mixing a desiccant with molten plastic and molding the mixture into a product carrier.
- Other objects and advantages of the present invention will become readily apparent to those skilled in this art from the following detailed description. The embodiments shown and described provide illustration of the best mode contemplated for carrying out the invention. The invention is capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings are to be regarded as illustrative in nature, and not as restrictive.
- Reference is made to the attached drawings, wherein elements having the same reference numeral designations represent like elements throughout.
- FIG. 1 illustrates an embodiment of the present invention.
- FIG. 2 illustrates a flow chart for practicing a method of the present invention.
- An embodiment of the present invention is illustrated in FIG. 1, wherein the product carrier is a
tray 20 formed from a material, e.g., plastic. It will be appreciated that other materials suitable for forming relatively thin, sturdy structures can be used to formtray 20. Exemplary materials include, for example, conductive thermoplastic, non-conductive and insulated plastic, antistatically coated PVC, antistatically coated polysulfone (to provide protection from ESD damage and to eliminate the potential for low leakage between component leads), conductive carbon-filled polypropylene, and black dissipative BPI-10 plastic. In certain embodiments, the carrier material can withstand temperatures up to about 40° C. to about 60° C., for example, temperatures of −125° C. to 150° C. The material can also include a carbon-based material or be antistatically coated to provide ESD protection. - With continued reference to FIG. 1.
desiccant particles 25 are embedded withintray 20. A preferred desiccant is montmorillonite (bentonite) clay. Tray 20 includes anotched corner 25, a flat oropen bottom 27, two sets of opposing vertical sides 23 a, 23 b, and anopen top 29. Together, the flat bottom and two sets of opposing vertical sides form a holding region in which a semiconductor device may be placed. Multiple trays of product can be stacked for shipment with an additional tray serving as a cover. All devices can be uniformly oriented so pin one is aligned with thenotched corner 25 oftray 20. - Though the embodiment depicted in FIG. 1 comprises a single material, it should be emphasized that the product carrier of the present invention may comprise one or more materials and/or may comprise one or more layers of material. Further, the inventive product carriers may comprise a recycled material, such as about 5% to 30% recycled materials In this exemplary embodiment, the product carrier is a tray. However, given the guidance and objectives disclosed herein, the particular product carrier, e.g., tube, tray, reel, and jewel box, can be readily selected and optimized based on a particular semiconductor device to achieve the goals of the present invention.
- Moreover, one having ordinary skill in the art will appreciate that the present invention is not limited to product carriers for any particular IC package style. Rather, the product carriers of the present invention may be configured to accommodate, for example, Pin Grid Arrays (PGAs), ceramic flat packs, non-quad flat packs, quad flat packs, and Dual-In-Line packages.
- In the embodiment illustrated in FIG. 1, the tray is configured to accommodate multiple semiconductor devices. However, the inventive product carrier may be configured to accommodate a single device and/or product carriers may be configured to accommodate a plurality of devices, each of which is already being held in a carrier.
- The inventive product carriers are uniformly sized, in compliance with standard JEDEC outlines. The inventive product carriers are also sized to ensure that there is no excessive movement of product in the tube during shipping and handling. This protects the mechanical integrity of the package and, if present, leads; it also ensures an unimpaired dispensing of product for manufacturing operations.
- For shipment, a stack of trays, for example, six trays, can be secured with straps; five containing parts and the sixth serving as a cover. Bound trays may then be loaded into an antistatic bubble pack bag, for extra cushioning protection, and then packed in a tray box for shipment. Because a desiccant is incorporated directly into the product carrier, it is unnecessary to include separate desiccant packets in the packaging bag.
- FIG. 2 is a flow diagram illustrating the method for forming a product carrier in accordance with an embodiment of the present invention. Referring to FIG. 2 at
step 200, desiccant particles, such as montmorillonite (bentonite) clay, are mixed with molten plastic. Atstep 210, the molten plastic with desiccant particles mixed therein is molded into the product carrier, as with conventional techniques. One of ordinary skill in the art will appreciate that the amount of desiccant mixed with the molten plastic will be sufficient to greatly reduce the presence of moisture in a dry pack bag (i.e., moisture barrier bag). For example, the amount of desiccant mixed with the molten plastic can be optimized such that there are about 32 grams of clay to about 64 grams of clay per dry pack bag. Alternatively, the amount of desiccant mixed with the molten plastic can be optimized such that the environment in the bag is maintained at no greater than 20 percent RH, thus protecting the devices during shipment and storage for at least 12 months. If this 12-month shelf life is exceeded, the devices need to be dry baked again only if the RH in the bag has exceeded 30 percent, as evidenced by a humidity indicator card. - Upon determination that a product is moisture sensitive, the product is dry packed for storage and shipment. This is done regardless of the type of product carrier (e.g., tubes, trays, reels, etc.). The first step in the dry pack process is to remove any moisture buildup in the package by baking the finished product for 5 to 15.5 hours, depending on the package type, at 125° C.+/−5° C. While baking, the product is contained in the product carriers (provided the carrier is made of material that can withstand the high temperature) or aluminum trays or tubes. Within50 hours after baking, the product is sealed in a dry pack bag under a partial vacuum.
- An exemplary dry pack bag (i.e., moisture barrier bag) is designed with three layers. The inner layer is a low-density polyethylene, which has a static-dissipative coating. A second layer is 400 angstroms aluminum metallized to 92-guage polyester. The third layer is 400 angstrom aluminum metallized to 92-guage polyester, which has a static-dissipative coating. ESD protection is provided by the inner layer of antistatic polyethylene and the second layer of aluminum metallized polyester.
- The bag is sealed using an impulse heat sealer at a seal time of about 1.0 to about 1.5 seconds; and a seal pressure of about 40 to about 50 psi; and a temperature range of about 191 to about 232° C.
- Included in each dry pack bag is a card that has humidity sensitive elements which turn from blue to pink whenever the specific RH level is exceeded.
- Labels may also be applied to the outside of the dry pack bag. For example, a standard product label, which identifies the contents by manufacturing lot number, product part number, and the product date code(s) and quantity per date code. Also, a dry pack caution label, which identifies the date the bag was sealed, the dry pack expiration date (which is 12 months later)), as well as product handling guidelines. A small moisture-sensitivity caution label may also be applied to the outside of the box in which the dry packed parts are packed.
- Described has been an apparatus and method for manufacturing an apparatus that is a carrier for semiconductor devices. An advantage of the invention is that it can easily be implemented and is both efficient and cost-effective in reducing the number of steps required to package and ship a semiconductor device. Another advantage of the invention is that it is readily fabricated and customized to various semiconductor devices. In this disclosure, there is shown and described only certain preferred embodiments of the invention, but, as aforementioned, it is to be understood that the invention is capable of use in various other combinations and environments and is capable of changes or modifications within the scope of the inventive concept as expressed herein.
Claims (15)
1. A carrier for a semiconductor device, the carrier comprising:
a material containing a desiccant embedded therein; and
a holding region for the semiconductor device.
2. The carrier of claim 1 , wherein the desiccant is montmorillonite (bentonite) clay.
3. The carrier of claim 1 , wherein the material can withstand temperatures from about −125° C. to about 150° C.
4. The carrier of claim 1 , comprising:
at least two layers of material.
5. The carrier of claim 1 , wherein the material comprises about 5% to about 30% recycled materials.
6. The carrier of claim 1 , wherein the carrier is selected from the group consisting of a tube, a tray, a reel, and a jewel box.
7. The carrier of claim 1 , wherein the carrier is configured to accommodate a single semiconductor device.
8. A method for manufacturing a carrier for a semiconductor device, the method comprising the steps of:
mixing a desiccant with molten plastic;
molding the mixture into a product carrier.
loading a device into the product carrier; and
dry packing the loaded product carrier in a bag.
9. The method of claim 8 , comprising:
mixing sufficient desiccant with the molten plastic such that the dry packed product carrier comprises from about 32 grams of desiccant to about 64 grams of desiccant.
10. The method of claim 8 , comprising:
mixing sufficient desiccant with the molten plastic such that an environment within the dry packed bag is maintained at no greater than about 20 percent relative humidity for about 12 months.
11. The method of claim 8 , comprising:
molding the product carrier into a form selected from the group consisting of a tube, a tray, a reel and a jewel box.
12. The method of claim 8 , comprising:
molding the product carrier into a form configured for holding one semiconductor device.
13. The method of claim 8 , comprising:
molding the product carrier into a form configured for holding a plurality of semiconductor devices.
14. The method of claim 8 , further comprising the step of:
including a card comprising a humidity sensitive element in the dry packed bag.
15. The method of claim 8 , further comprising:
labeling an outside of the dry pack bag;
packing the dry pack bag in a box; and
labeling an outside of the box with a moisture-sensitivity caution label.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US09/543,346 US20020185409A1 (en) | 2000-04-05 | 2000-04-05 | Desiccant containing product carrier |
PCT/US2000/030730 WO2001078113A1 (en) | 2000-04-05 | 2000-11-08 | Desiccant containing product carrier |
TW089124449A TW480559B (en) | 2000-04-05 | 2000-11-18 | Desiccant containing product carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US09/543,346 US20020185409A1 (en) | 2000-04-05 | 2000-04-05 | Desiccant containing product carrier |
Publications (1)
Publication Number | Publication Date |
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US20020185409A1 true US20020185409A1 (en) | 2002-12-12 |
Family
ID=24167614
Family Applications (1)
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US09/543,346 Abandoned US20020185409A1 (en) | 2000-04-05 | 2000-04-05 | Desiccant containing product carrier |
Country Status (3)
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US (1) | US20020185409A1 (en) |
TW (1) | TW480559B (en) |
WO (1) | WO2001078113A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573200B2 (en) * | 2001-01-18 | 2003-06-03 | Advanced Micro Devices, Inc. | Automatic printing of caution labels for moisture-sensitive devices |
US20040074211A1 (en) * | 2002-10-18 | 2004-04-22 | Kawasaki Microelectronics, Inc. | Method of making package containing semiconductor devices and desiccant |
US20050098475A1 (en) * | 2000-08-28 | 2005-05-12 | Sud-Chemie, Inc. | Apparatus for packaging electronic components |
US20100122470A1 (en) * | 2008-11-18 | 2010-05-20 | Davis Bradley C | Dehumidifier for water damaged electronic devices |
US20130062243A1 (en) * | 2011-09-08 | 2013-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention and methods thereof |
US11952196B1 (en) * | 2014-05-15 | 2024-04-09 | SAVR Pak, LLC | Devices to force moisture removal inside a food container |
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US4081397A (en) * | 1969-12-22 | 1978-03-28 | P. R. Mallory & Co. Inc. | Desiccant for electrical and electronic devices |
US4681218A (en) * | 1982-03-15 | 1987-07-21 | Becton, Dickinson And Company | Moisture-controlled glass microscope slide package |
KR960015106B1 (en) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | Surface package type semiconductor package |
US5911937A (en) * | 1995-04-19 | 1999-06-15 | Capitol Specialty Plastics, Inc. | Desiccant entrained polymer |
US5709065A (en) * | 1996-07-31 | 1998-01-20 | Empak, Inc. | Desiccant substrate package |
-
2000
- 2000-04-05 US US09/543,346 patent/US20020185409A1/en not_active Abandoned
- 2000-11-08 WO PCT/US2000/030730 patent/WO2001078113A1/en active Application Filing
- 2000-11-18 TW TW089124449A patent/TW480559B/en not_active IP Right Cessation
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050098475A1 (en) * | 2000-08-28 | 2005-05-12 | Sud-Chemie, Inc. | Apparatus for packaging electronic components |
US7389877B2 (en) * | 2000-08-28 | 2008-06-24 | Sud-Chemie Inc. | Apparatus for packaging electronic components including a reel entrained with desiccating material |
US6573200B2 (en) * | 2001-01-18 | 2003-06-03 | Advanced Micro Devices, Inc. | Automatic printing of caution labels for moisture-sensitive devices |
US20040074211A1 (en) * | 2002-10-18 | 2004-04-22 | Kawasaki Microelectronics, Inc. | Method of making package containing semiconductor devices and desiccant |
US20100122470A1 (en) * | 2008-11-18 | 2010-05-20 | Davis Bradley C | Dehumidifier for water damaged electronic devices |
US20130062243A1 (en) * | 2011-09-08 | 2013-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention and methods thereof |
US8925290B2 (en) * | 2011-09-08 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention and methods thereof |
US9527649B2 (en) | 2011-09-08 | 2016-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention |
US11952196B1 (en) * | 2014-05-15 | 2024-04-09 | SAVR Pak, LLC | Devices to force moisture removal inside a food container |
Also Published As
Publication number | Publication date |
---|---|
WO2001078113A1 (en) | 2001-10-18 |
TW480559B (en) | 2002-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ADVANCED MICRO DEVICES, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MORROW, ANTHONY B.;REEL/FRAME:010746/0677 Effective date: 20000330 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |