US20030043681A1 - Dram active termination control - Google Patents
Dram active termination control Download PDFInfo
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- US20030043681A1 US20030043681A1 US09/941,649 US94164901A US2003043681A1 US 20030043681 A1 US20030043681 A1 US 20030043681A1 US 94164901 A US94164901 A US 94164901A US 2003043681 A1 US2003043681 A1 US 2003043681A1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4093—Input/output [I/O] data interface arrangements, e.g. data buffers
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
Definitions
- the present invention relates to the control of an integrated memory circuit to provide active termination of a data bus. More particularly, the invention provides a system to control the active termination required for dynamic random access memory (DRAM) devices.
- DRAM dynamic random access memory
- DRAM dynamic random access memory
- One proposed technique for controlling read/write operations in high speed DRAM devices divides DRAM memory devices into ranks which are turned on or off for data read/write operations via an active termination control signal supplied by a memory controller.
- the active termination control signal determines which rank of memory is being read from or written to.
- an ‘on’ signal enables a particular DRAM memory device to be written to and an ‘off’ signal enables a DRAM memory device to be read.
- this requires two such control signals for each module.
- these proposals require at least one hard-wired active termination control signal for the front side of a memory module (Rank 0) and a separate hard-wired active termination control signal for the back side of a memory module (Rank 1).
- the present invention provides a simplified active termination control technique for each memory module which utilizes: (i) one controller-generated hard-wired active termination control signal per dual sided module which causes the data devices on both sides of the module to transition to an active termination state as a rank and (ii) a wired-OR signal path which causes a read operation at memory devices on either side of the module to disable the active termination control signal for memory devices on both sides of the module.
- Both the singular active termination control signal per module and the wired-OR signal path decrease lag time inefficiencies between the controller circuitry and read-write operations to memory ranks on a module.
- FIG. 1 is a block diagram of a memory system in one exemplary embodiment of the invention
- FIG. 2 is a schematic diagram of the active termination circuitry of a DRAM memory device employed as in FIG. 1;
- FIG. 3 is a schematic showing generation of an active termination control signal and its use in a DRAM memory device in accordance with the invention
- FIG. 4 is a schematic diagram of a portion of the controller illustrated in FIG. 1 showing generation of the active termination control signal at the controller.
- FIG. 5 is a block diagram of the DRAM memory modules illustrated in FIG. 1 showing integration of the memory modules into a computer system.
- FIG. 1 represents a simplified bock diagram for a memory system in accordance with an exemplary embodiment of the invention.
- One active termination control signal 105 ( a ), 105 ( b ) is used for read-write operations of a respective DRAM memory module 102 ( a ), 102 ( b ).
- Each of the memory modules 102 ( a ), 102 ( b ) has a rank of memory devices on each side of the module.
- memory module 102 ( a ) includes a rank of memory formed by memory devices 103 ( e ), 103 ( f ), 103 ( g ), 103 ( h ) on one side of the module and another rank formed by memory devices 104 ( e ), 104 ( f ), 104 ( g ), 104 ( h ) on the other side of the module.
- memory module 102 ( b ) has two ranks of memory devices on opposite sides of the module, one comprised of memory devices 103 ( a ), 103 ( b ), 103 ( c ), 103 ( d ) and the other comprised of memory devices 104 ( a ), 104 ( b ), 104 ( c ), 104 ( d ).
- the number of memory devices employed in each rank is not important as fewer or more memory devices can be used.
- the active termination control signal 105 ( a ), 105 ( b ) determines which module of memory is being read from or written to for a respective module.
- An ‘on’ (or ‘high’) active termination control signal 105 ( a ), 105 ( b ) enables a particular DRAM module 102 ( a ), 102 ( b ) to be written to.
- An ‘off’ (or ‘low’) active termination control signal 105 ( a ), 105 ( b ) enables a DRAM module 102 ( a ), 102 ( b ) to be read.
- FIG. 2 shows an embodiment of the active termination circuitry at each individual DRAM memory device.
- Input line 206 receives the active termination control signal 105 ( a ) or 105 ( b ) through buffer 209 .
- the signal When the signal is high it turns on transistors 205 and 212 to actively terminate a data path 203 with resistors 202 and 204 . As such, input data on data path 203 is properly received by input data buffer 210 .
- Each memory device 201 also includes a control transistor 207 which receives at its gate via signal line 208 an internally generated signal when memory device 201 is performing a read operation.
- the device read signal line 208 going ‘high’ toggles the transistor 207 gate, pulling down the active termination control signal input line 206 to ground through the source to the drain of transistor 207 , causing the active termination control signal input line 206 to go ‘low’, thereby quickly removing line termination during a device read operation when a read operation begins.
- FIG. 3 shows how a pair of memory devices, e.g. 103 ( a ), 104 ( a ), 103 ( h ), 104 ( h ), from respective ranks of memory devices on opposite sides of a memory module, e.g., 102 ( a ) or 102 ( b ), are interconnected on each module.
- the control transistor 207 of a memory device, e.g., 103 ( a ), of one rank is wired in an OR circuit to the input line 206 of a memory device, e.g., 104 ( a ), of the other rank of a memory module, e.g. 102 ( b ).
- Memory module 102 ( b ) is constructed and arranged the same way.
- DRAM memory modules 102 ( a ) or 102 ( b ) transition as a module. This transition is managed either by the controller 101 controlling the high or low state of the active termination control lines 105 ( a ), 105 ( b ) to set the memory devices for a write operation, or by the memory device read signal on lines 208 of memory devices on either side of the memory modules 102 ( a ), 102 ( b ) eliminating the active termination control signal line for a read operation.
- the invention's dual control active termination control signal lines 105 ( a ), 105 ( b ) allow for optimization of memory functions.
- the bus turnaround lag time between controller 101 management of actual read-write operations to memory modules 102 ( a ), 102 ( b ) is reduced, leading to higher speed bus turnarounds between write and read operations.
- FIG. 4 shows a portion of the exemplary memory controller 101 circuit for generating the active termination control signal Act_Term1 and Act_Term2 signals on lines 105 ( a ) and 105 ( b ) for respective memory modules 102 ( a ) and 102 ( b ). These two controller outputs are gated in response to the logic state of four input signals: (i) RD_WR_Mod1, (ii) RD_WR_Mod2, (iii) Term_On, and (iv) 2_Mod.
- RD_WR_Mod1 is ‘high’ when either a read or write operation is to occur at memory module 102 ( a ) and ‘low’ otherwise.
- RD_WR_Mod2 is ‘high’ when either a read or write operation is to occur at 102 ( b ) and ‘low’ otherwise.
- 2_Mod is ‘high’ when both memory slots are populated, that is, when memory modules 102 ( a ) and 102 ( b ) are both present on the bus, and low if only one memory module is present.
- Term_On is normally ‘high’ and is the genesis of the active termination control signals, e.g., Act_Term1 or Act_Term2, regardless of which memory module target is being accessed. Term_On goes ‘low’ during Sleep, Suspend to RAM, or Standby Modes.
- RD_WR_Mod1 or RD_WR Mod2 When either RD_WR_Mod1 or RD_WR Mod2 goes ‘high’, it provides a logic ‘high’ at the output of OR GATE 401 , providing AND GATES 406 and 407 a ‘high’ signal as one of three required inputs. Another logic ‘high’ is provided by the Term_On signal (unless the system is in Standby or Sleep Mode). The final inputs for AND GATES 406 and 407 comes from a respective output of one of the Exclusive OR GATES 402 or 403 .
- Exclusive OR GATE 402 has two inputs. The first input comes from the RD_WR_Mod1 signal, previously discussed as going ‘high’ when indicating a read-write function to memory module 102 ( a ) (FIG. 1). The second input to Exclusive OR GATE 402 comes from the 2_Mod signal, which is ‘high’ when the system is populated with two memory modules. Similarly, Exclusive OR GATE 403 has two inputs. The first comes from the RD_WR_Mod2 signal and the second input comes from the 2_Mod signal.
- the purpose of the 2_Mod signal and Exclusive OR GATES 402 and 403 is to provide a ‘low’ input to AND GATES 406 or 407 when both memory modules 102 ( a ), 102 ( b ) (FIG. 1) slots are occupied and there is an active read-write function being processed by one of the memory modules.
- the RD_WR_Mod1 signal is ‘high’ and 2_Mod is ‘high’ from dual memory module 102 ( a ), 102 ( b ) (FIG. 1) population, then Exclusive OR GATE 402 's output will be ‘low’.
- FIG. 5 illustrates a block diagram of a processor system 500 utilizing the technique as described in FIGS. 1 - 4 in a computer system for active termination control of a signal path.
- the processor-based system 500 may be a computer system or any other processor system.
- the system 500 includes a central processing unit (CPU) 502 , e.g., a microprocessor, that communicates with floppy disk drive 512 , DRAM memory modules, e.g., 102 ( a ), 102 ( b ), and CD ROM drive 514 over a bus 520 .
- the central processing unit 502 (“processor”) may provide the active termination control signal instead of the active termination control signal being provided by the controller 101 .
- bus 520 may be a series of buses and bridges commonly used in a processor-based system, but for convenience purposes only, the bus 520 has been illustrated as a single bus.
- I/O Input/output
- the processor-based system 500 also includes a read-only memory (ROM) 510 which may also be used to store a software program.
- ROM read-only memory
- the present invention provides a simple technique for active termination of memory devices on a memory module which provides a faster turnaround of data on a bus when transitioning from a write to a read operation.
Abstract
Description
- The present invention relates to the control of an integrated memory circuit to provide active termination of a data bus. More particularly, the invention provides a system to control the active termination required for dynamic random access memory (DRAM) devices.
- Modern systems strive to efficiently utilize computer memory in a way which increases speed and optimizes data transfer. This requires specialized techniques for controlling the reading and writing of information from and to memory, such as dynamic random access memory (DRAM), particularly with respect to high speed memory devices.
- One proposed technique for controlling read/write operations in high speed DRAM devices divides DRAM memory devices into ranks which are turned on or off for data read/write operations via an active termination control signal supplied by a memory controller. The active termination control signal determines which rank of memory is being read from or written to. In these proposals, an ‘on’ signal enables a particular DRAM memory device to be written to and an ‘off’ signal enables a DRAM memory device to be read. For double sided memory modules which have a rank of memory on each side of the module, this requires two such control signals for each module. In other words, these proposals require at least one hard-wired active termination control signal for the front side of a memory module (Rank 0) and a separate hard-wired active termination control signal for the back side of a memory module (Rank 1).
- Problems with such configurations include difficulty for the controller circuitry to hand off between reading and writing to/from different sides of modules. Furthermore, having two active termination control signals per module requires the use of two hard-wired active termination control signal paths per module and on the bus. This leads to read-write lag time inefficiencies between the controller circuitry and actual memory devices.
- There is needed, therefore, a simple and inexpensive method of controlling reading and writing to different ranks of memory on a module.
- The present invention provides a simplified active termination control technique for each memory module which utilizes: (i) one controller-generated hard-wired active termination control signal per dual sided module which causes the data devices on both sides of the module to transition to an active termination state as a rank and (ii) a wired-OR signal path which causes a read operation at memory devices on either side of the module to disable the active termination control signal for memory devices on both sides of the module. Both the singular active termination control signal per module and the wired-OR signal path decrease lag time inefficiencies between the controller circuitry and read-write operations to memory ranks on a module.
- These and other advantages and features of the invention will be more clearly understood from the following detailed description of the invention which is presented in conjunction with the accompanying drawings.
- FIG. 1 is a block diagram of a memory system in one exemplary embodiment of the invention;
- FIG. 2 is a schematic diagram of the active termination circuitry of a DRAM memory device employed as in FIG. 1;
- FIG. 3 is a schematic showing generation of an active termination control signal and its use in a DRAM memory device in accordance with the invention;
- FIG. 4 is a schematic diagram of a portion of the controller illustrated in FIG. 1 showing generation of the active termination control signal at the controller.
- FIG. 5 is a block diagram of the DRAM memory modules illustrated in FIG. 1 showing integration of the memory modules into a computer system.
- In the following detailed description, reference is made to various specific embodiments in which the invention may be practiced. These embodiments are described with sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be employed, and that structural, logical, and electrical changes may be made without departing from the spirit or scope of the invention.
- The terms “on”, “off”, “high”, “low”, “logic”, and/or “logic state” are used in the description as exemplary embodiments of the invention. It should be understood that the invention may also be implemented using logic states reversed from those described herein as well known in the art. Further, while various logic circuits are described and illustrated herein using specific logic gate arrangements, it should be understood that the invention may also be implemented with different logic gate configurations.
- FIG. 1 represents a simplified bock diagram for a memory system in accordance with an exemplary embodiment of the invention. One active termination control signal105(a), 105(b) is used for read-write operations of a respective DRAM memory module 102(a), 102(b). Each of the memory modules 102(a), 102(b) has a rank of memory devices on each side of the module. Thus, memory module 102(a) includes a rank of memory formed by memory devices 103(e), 103(f), 103(g), 103(h) on one side of the module and another rank formed by memory devices 104(e), 104(f), 104(g), 104(h) on the other side of the module. Likewise, memory module 102(b) has two ranks of memory devices on opposite sides of the module, one comprised of memory devices 103(a), 103(b), 103(c), 103(d) and the other comprised of memory devices 104(a), 104(b), 104(c), 104(d). The number of memory devices employed in each rank is not important as fewer or more memory devices can be used.
- The active termination control signal105(a), 105(b) determines which module of memory is being read from or written to for a respective module. An ‘on’ (or ‘high’) active termination control signal 105(a), 105(b) enables a particular DRAM module 102(a), 102(b) to be written to. An ‘off’ (or ‘low’) active termination control signal 105(a), 105(b) enables a DRAM module 102(a), 102(b) to be read.
- FIG. 2 shows an embodiment of the active termination circuitry at each individual DRAM memory device.
Input line 206 receives the active termination control signal 105(a) or 105(b) throughbuffer 209. When the signal is high it turns ontransistors data path 203 withresistors data path 203 is properly received byinput data buffer 210. - Each
memory device 201 also includes acontrol transistor 207 which receives at its gate viasignal line 208 an internally generated signal whenmemory device 201 is performing a read operation. The device readsignal line 208 going ‘high’ toggles thetransistor 207 gate, pulling down the active termination controlsignal input line 206 to ground through the source to the drain oftransistor 207, causing the active termination controlsignal input line 206 to go ‘low’, thereby quickly removing line termination during a device read operation when a read operation begins. - FIG. 3 shows how a pair of memory devices, e.g.103(a), 104(a), 103(h), 104(h), from respective ranks of memory devices on opposite sides of a memory module, e.g., 102(a) or 102(b), are interconnected on each module. The
control transistor 207 of a memory device, e.g., 103(a), of one rank is wired in an OR circuit to theinput line 206 of a memory device, e.g., 104(a), of the other rank of a memory module, e.g. 102(b). That is, when either memory device, e.g., 103(a) or 104(a), of the two ranks of module 102(b) receives a ‘high’ signal on the device readsignal line 208, it immediately pulls down the active termination control signal for both memory devices 103(a), 104(a). The same is true for each of the paired memory devices on opposite sides of memory module 102(a), e.g., 103(e) 104(e), 103(f) 104(f), 103(g) 104(g), 103(h) 104(h). Memory module 102(b) is constructed and arranged the same way. - With the invention, DRAM memory modules102(a) or 102(b) transition as a module. This transition is managed either by the
controller 101 controlling the high or low state of the active termination control lines 105(a), 105(b) to set the memory devices for a write operation, or by the memory device read signal onlines 208 of memory devices on either side of the memory modules 102(a), 102(b) eliminating the active termination control signal line for a read operation. Thus, the invention's dual control active termination control signal lines 105(a), 105(b) allow for optimization of memory functions. The bus turnaround lag time betweencontroller 101 management of actual read-write operations to memory modules 102(a), 102(b) is reduced, leading to higher speed bus turnarounds between write and read operations. - FIG. 4 shows a portion of the
exemplary memory controller 101 circuit for generating the active termination control signal Act_Term1 and Act_Term2 signals on lines 105(a) and 105(b) for respective memory modules 102(a) and 102(b). These two controller outputs are gated in response to the logic state of four input signals: (i) RD_WR_Mod1, (ii) RD_WR_Mod2, (iii) Term_On, and (iv) 2_Mod. - RD_WR_Mod1 is ‘high’ when either a read or write operation is to occur at memory module102(a) and ‘low’ otherwise. RD_WR_Mod2 is ‘high’ when either a read or write operation is to occur at 102(b) and ‘low’ otherwise. 2_Mod is ‘high’ when both memory slots are populated, that is, when memory modules 102(a) and 102(b) are both present on the bus, and low if only one memory module is present. Term_On is normally ‘high’ and is the genesis of the active termination control signals, e.g., Act_Term1 or Act_Term2, regardless of which memory module target is being accessed. Term_On goes ‘low’ during Sleep, Suspend to RAM, or Standby Modes.
- When either RD_WR_Mod1 or RD_WR_Mod2 are high as inputs to OR
GATE 401, the output of ORGATE 401 goes high, providing inputs for AND GATES 406 and 407. These AND GATES (406 and 407) each have one input tied to the Term_On signal. ANDGATES GATE 401, and (iii) the outputs of respective Exclusive ORGATE - When either RD_WR_Mod1 or RD_WR Mod2 goes ‘high’, it provides a logic ‘high’ at the output of
OR GATE 401, providing ANDGATES 406 and 407 a ‘high’ signal as one of three required inputs. Another logic ‘high’ is provided by the Term_On signal (unless the system is in Standby or Sleep Mode). The final inputs for ANDGATES Exclusive OR GATES -
Exclusive OR GATE 402 has two inputs. The first input comes from the RD_WR_Mod1 signal, previously discussed as going ‘high’ when indicating a read-write function to memory module 102(a) (FIG. 1). The second input toExclusive OR GATE 402 comes from the 2_Mod signal, which is ‘high’ when the system is populated with two memory modules. Similarly,Exclusive OR GATE 403 has two inputs. The first comes from the RD_WR_Mod2 signal and the second input comes from the 2_Mod signal. - The purpose of the 2_Mod signal and
Exclusive OR GATES GATES Exclusive OR GATE 402's output will be ‘low’. This ‘low’ will toggle the output of AND GATE 406 ‘low’, opening the circuit between the source and the drain oftransistor 411, allowing the active termination control signal Act_Term1 to go ‘high’ in response to the Term_On signal. When ANDGATE 406 goes ‘high’,transistor 411 is ‘on’ and Act_Term1 goes ‘low’. - Similarly, if the RD_WR_Mod2 signal is ‘high’ and 2_Mod is ‘high’ from dual memory module population, then
Exclusive OR GATE 403's output will be ‘low.’ This ‘low’ will toggle the output of AND GATE 407 ‘low’, opening the circuit between the source and the drain oftransistor 413, allowing the active termination control signal Act_Term2 to go ‘high.’ - FIG. 5 illustrates a block diagram of a processor system500 utilizing the technique as described in FIGS. 1-4 in a computer system for active termination control of a signal path. The processor-based system 500 may be a computer system or any other processor system. The system 500 includes a central processing unit (CPU) 502, e.g., a microprocessor, that communicates with
floppy disk drive 512, DRAM memory modules, e.g., 102(a), 102(b), and CD ROM drive 514 over abus 520. In one embodiment of the invention, the central processing unit 502 (“processor”) may provide the active termination control signal instead of the active termination control signal being provided by thecontroller 101. It must be noted that thebus 520 may be a series of buses and bridges commonly used in a processor-based system, but for convenience purposes only, thebus 520 has been illustrated as a single bus. Input/output (I/O) devices, e.g., a monitor and/or network cards, 504, 506 may also be connected to thebus 520, but are not required in order to practice the invention. The processor-based system 500 also includes a read-only memory (ROM) 510 which may also be used to store a software program. - The present invention provides a simple technique for active termination of memory devices on a memory module which provides a faster turnaround of data on a bus when transitioning from a write to a read operation.
- The above description illustrates exemplary embodiments that achieve the features and advantages of the present invention. It is not intended that the present invention be limited to the illustrated embodiments. Modifications and substitutions to specific operations, conditions and logic structures can be made without departing from the spirit and scope of the present invention. Accordingly, the invention is not to be considered as being limited by the foregoing description and drawings, but is only limited by the scope of the appended claims.
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US8599631B2 (en) | 2006-12-21 | 2013-12-03 | Rambus Inc. | On-die termination of address and command signals |
US8947962B2 (en) | 2006-12-21 | 2015-02-03 | Rambus Inc. | On-die termination of address and command signals |
US9299407B2 (en) | 2006-12-21 | 2016-03-29 | Rambus Inc. | On-die termination of address and command signals |
US9570129B2 (en) | 2006-12-21 | 2017-02-14 | Rambus Inc. | On-die termination of address and command signals |
US9721629B2 (en) | 2006-12-21 | 2017-08-01 | Rambus Inc. | On-die termination of address and command signals |
US10115439B2 (en) | 2006-12-21 | 2018-10-30 | Rambus Inc. | On-die termination of address and command signals |
US10510388B2 (en) | 2006-12-21 | 2019-12-17 | Rambus Inc. | On-die termination of address and command signals |
US10720196B2 (en) | 2006-12-21 | 2020-07-21 | Rambus Inc. | On-die termination of address and command signals |
US10971201B2 (en) | 2006-12-21 | 2021-04-06 | Rambus Inc. | On-die termination of address and command signals |
US11468928B2 (en) | 2006-12-21 | 2022-10-11 | Rambus Inc. | On-die termination of address and command signals |
US11688441B2 (en) | 2006-12-21 | 2023-06-27 | Rambus Inc. | On-die termination of address and command signals |
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