US20030201055A1 - Method for manufacturing laminated LC filter - Google Patents
Method for manufacturing laminated LC filter Download PDFInfo
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- US20030201055A1 US20030201055A1 US10/164,701 US16470102A US2003201055A1 US 20030201055 A1 US20030201055 A1 US 20030201055A1 US 16470102 A US16470102 A US 16470102A US 2003201055 A1 US2003201055 A1 US 2003201055A1
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- layers
- capacitor
- inductor
- magnetic layers
- dielectric
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000003990 capacitor Substances 0.000 claims abstract description 32
- 238000005245 sintering Methods 0.000 claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 18
- 229910052681 coesite Inorganic materials 0.000 claims description 16
- 229910052906 cristobalite Inorganic materials 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052682 stishovite Inorganic materials 0.000 claims description 16
- 229910052905 tridymite Inorganic materials 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 229910020615 PbO—SiO2 Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 20
- 230000032798 delamination Effects 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 89
- 239000000463 material Substances 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 3
- 229910002974 CaO–SiO2 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Definitions
- the present invention relates to a method for manufacturing a laminated LC filter, and more particularly to a method for manufacturing a laminated LC filter, which is capable of resolving problems generated due to the sintering shrinkage by primarily sintering two layers made of different kinds of materials, that is, dielectric and magnetic layers, separately, bonding the two layers and then secondarily sintering the bonded layer at a low temperature.
- Laminated LC filters include a laminated structure with an inductor part consisting of a plurality of magnetic layers and a capacitor part consisting of a plurality of dielectric layers. On main surfaces of the respective dielectric and magnetic layers are formed internal electrodes constituting capacitance elements and coils constituting inductance elements. Also, the internal electrode and the coil formed at each layer extend to connect to external terminals formed on lateral surfaces of the laminated structure, respectively.
- such a laminated LC filter is manufactured by forming conductive patterns at corresponding main surfaces of respective dielectric and magnetic layers, laminating these layers, sintering the laminated structure and then forming external terminals at lateral surfaces of the sintered structure.
- the LC filter thus obtained, there occur very different sintering shrinkage and thermal expansion between the dielectric and magnetic layers, as well as there being low affinity between the layers.
- the LC filter has problems in that it undergoes undesired changes in its physical and electrical properties, that is, changes in the dielectric constant and magnetic permeability, and deformations of size and shape during the co-sintering process.
- a buffer layer has been conventionally used in the manufacture of LC filters to reduce the difference in shrinkages between dielectric and magnetic layers.
- the deformation problem caused by the difference in shrinkages of different materials is difficult to completely solve by the use of only one buffer layer.
- the deterioration of electrical characteristics of parts is caused by the reduction of resistance based on buffer layer materials used (especially in case of including Ni and so on).
- FIG. 1 illustrates an LC filter 10 manufactured by the method proposed in the above publication in cross-sectional view.
- a first buffer layer 3 adjacent to a dielectric layer constituting the capacitor part 1 and a second buffer layer 4 adjacent to a magnetic layer constituting the inductor part 2 are further included between a capacitor part 1 and an inductor part 2 .
- Those two buffer layers 3 and 4 have compositions similar to those of the adjacent layers, that is, the dielectric layer and the magnetic layer, respectively, without including Ni. Accordingly, it is possible to prevent the reduction of resistance occurring due to segregation while more effectively reducing shrinkage.
- dielectric layers can be made of materials selected from various materials including oxides such as TiO 2 , NiO, CuO, Mn 3 O 4 and so on
- magnetic layers can be also made of various materials such as oxides including Cu and/or Fe and Ni—Zn based ferrite and so on.
- respective compositions of the buffer layers have to be selected considering the compositions of the associated capacitor and inductor parts made of different materials. Accordingly, the above method has a difficulty in determining the composition of buffer layers. Furthermore, on occasion (for example, in case that there is a large difference in composition between dielectric and magnetic layers, and particular elements such as Ni are not included in buffer layers), the selection of materials constituting dielectric or magnetic layers is limited.
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide a method for manufacturing a laminated LC filter, which involves the steps of laminating dielectric and magnetic layers separately, sintering each laminated structure separately and then assembling two sintered resultants using a adhesive layer without use of a buffer layer having a particular composition.
- step d) forming, on an outer surface of the resultant structure obtained from the step c) at least one external terminal connected to the internal electrodes extending to the lateral sides of the dielectric layers and/or to the coil patterns extending to the lateral sides of the magnetic layers.
- the step of bonding the capacitor part and inductor part may comprises the steps of:
- c-2) arranging the capacitor and inductor parts such that their bonding surfaces face to each other and pressing the two parts together while heating the two parts at a desired temperature.
- the glass-based adhesive may be made of at least one composition selected from the group consisting of MgO—B 2 O 3 —SiO 2 , CaO—B 2 O 3 —SiO 2 , SnO—ZnO—P 2 O 5 , PbO—ZnO—B 2 O 3 , Bi 2 O 3 —B 2 O 3 , PbO—SiO 2 , PbO—B 2 O—SiO 2 and Al 2 O 3 —B 2 O 3 —SiO 2 .
- the use of the above glass-based adhesive makes it possible to bond the capacitor and inductor parts by heating at 400 to 650° C. while resolving the problems of shrinkage occurring during the high temperature process.
- the present invention is characterized in that capacitor and inductor parts are made through separate sintering processes and then bonded using a glass-based adhesive, so that the products thus manufactured avoid problems caused by the difference in shrinkages between the dielectric layer constituting the capacitor part and the magnetic layer constituting the inductor part occurring during a co-sintering process of the two layers. Accordingly, the present invention has advantages in that it can solve the problems of delamination and shape deformation occurring between dielectric and magnetic layers consisting of different materials, and simultaneously allow the compositions of the dielectric and magnetic layers to be freely designed without considering composition of a buffer layer, because of non-use of buffer layer limited in its composition.
- FIG. 1 is a perspective view of a conventional laminated LC filter manufactured using a buffer layer
- FIG. 2 is a flow chart illustrating a manufacturing method of a laminated LC filter according to the present invention.
- FIG. 2 is a flow chart illustrating a manufacturing method of a laminated LC filter according to the present invention.
- a plurality of dielectric and magnetic layers, each formed in the form of a green sheet, are prepared.
- the dielectric and magnetic layers are subjected to printing processes for printing internal electrodes and coil patterns, respectively (step 110 ).
- the internal electrodes constitute capacitance elements, and the coil patterns constitute inductance elements. At this time, the internal electrodes and coil patterns are formed such that they extend to at least a part of the layers to be connected to external terminals to be formed in a subsequent process.
- the dielectric and magnetic layers are laminated, pressed, debinded and then sintered to form capacitor and inductor parts through separate processes.
- the dielectric layers are laminated (step 112 a ).
- the laminated dielectric layers are pressed (step 114 a ).
- the pressed layers are sintered to form a sintered body corresponding to the capacitor part (step 116 a ).
- the magnetic layers are laminated (step 112 b ).
- the laminated magnetic layers are pressed (step 114 b ).
- the pressed layers are sintered to form a sintered body corresponding to the inductor part (step 116 b ).
- the sintering temperature is generally about 1350° C., but the temperature can be selected in a range of about 1100 to 1500° C. based on materials constituting the dielectric and magnetic layers.
- the capacitor part and the inductor part are bonded using a glass-based adhesive.
- a glass-based adhesive there has been no conventional method which bonds the capacitor and inductor parts after separately sintering these two laminated parts made using green sheets.
- the method using buffer layers cannot be a fundamental solution and has wide limitations for determining compositions of the dielectric and the magnetic layers let alone the buffer layers. Therefore, the present invention uses the process of separately sintering the dielectric and magnetic layers, and bonding the capacitor and inductor parts obtained from respective sintering processes by an extra bonding process to fundamentally solve those problems.
- a glass-based adhesive is applied on at least one of the bonding surfaces of the capacitor and inductor parts (step 120 ). Thereafter, the capacitor and inductor parts are arranged so that their bonding surfaces face each other, and the two parts are pressed together while being heated at a desired temperature (step 122 ). In this way, the capacitor and inductor parts are bonded using a glass-based adhesive.
- the adhesive is cured at a low temperature of about 400 to 850° C., it is possible to reduce problems caused by shrinkage generated at the sintering temperature of the dielectric and magnetic layers.
- the glass-based adhesive may includes a PbO—B 2 O—CaO—SiO 2 based glass adhesive, an Al 2 O 3 —B 2 O 3 —CaO—SiO 2 based glass adhesive or so on. More preferably, a glass-based adhesive capable of being cured at a temperature of 650° C. or less can be used for minimizing problems by shrinkage of dielectric and magnetic layers.
- the glass-based adhesive may be made of at least one composition selected from the group consisting of MgO—B 2 O 3 —SiO 2 , CaO—B 2 O 3 —SiO 2 , SnO—ZnO—P 2 O 5 , PbO—ZnO—B 2 O 3 , Bi 2 O 3 —B 2 O 3 , PbO—SiO 2 , PbO—B 2 O—SiO 2 and Al 2 O 3 —B 2 O 3 —SiO 2 .
- Table 1 shows adhesives usable in the present invention and conditions of heating process (temperature and time) for curing the adhesives.
- TABLE 1 Composition Heating temp. (° C.) Heating time (min.) MaO—B 2 O 3 —SiO 2 600 10 CaO—B 2 O 3 —SiO 2 600 10 SnO—ZnO—P 2 O 5 490 10 PbO—ZnO—B 2 O 3 550 5 Bi 2 O 3 —B 2 O 3 460 30 PbO—SiO 2 550 5 PbO—B 2 O—SiO 2 650 15 Al 2 O 3 —B 2 O 3 —SiO 2 510 5
- the present invention is not limited to the above compositions, and those skilled in the art will appreciate that adhesives usable as a binder at a low temperature can be sufficiently used as the adhesive of the present invention.
- external terminals are formed on the lateral surfaces of the resultant structure obtained from the bonding process (step 124 ).
- the formation position of the external terminals can be defined by appropriately designing portions of the internal electrodes and coil patterns, which extend to the lateral surfaces of the printed silver paste.
- the external terminals are formed by printing silver (Ag) paste on the corresponding surfaces of the bonded structure and then sintering the bonded structure. At this time, the sintering is performed at a low temperature (about, 680° C.), so that it dose not adversely affect the configuration and structure of the sintered structure.
- dielectric and magnetic layers are sintered through separate processes, and then bonded to each other, without using a co-sintering process carried out at a high temperature, so that it is possible to essentially prevent delamination and distortion phenomena occurring due to the difference in shrinkages.
- the LC filter manufacturing method according to the present invention involves the steps of forming capacitor and inductor parts through separate sintering processes, and then bonding the two parts using a glass-based adhesive. Accordingly, the present invention can solve problems of delamination and shape deformation caused by the difference in shrinkages occurring during a co-sintering process of the dielectric layers constituting the capacitor part and the magnetic layers constituting the inductor part. Also, since the present invention does not use any extra buffer layer, there is no need to consider the shrinkage reduction and the composition of the buffer layer, and so the compositions of the dielectric and magnetic layers can be freely designed.
Abstract
Disclosed is a method for manufacturing a laminated LC filter, the method involving the steps of forming capacitor and inductor parts through separate sintering processes and then bonding the two parts using a glass-based adhesive. The use of the present method can solve problems of delamination and shape deformation caused by the difference in shrinkages occurring during a co-sintering process of the dielectric layer constituting the capacitor part and the magnetic layer constituting the inductor part. Also, since the method dose not use any extra buffer layer, there is no need to consider the shrinkage reduction and the composition of the buffer layer, and so the compositions of the dielectric and magnetic layers can be freely designed.
Description
- 1. Field of the Invention
- The present invention relates to a method for manufacturing a laminated LC filter, and more particularly to a method for manufacturing a laminated LC filter, which is capable of resolving problems generated due to the sintering shrinkage by primarily sintering two layers made of different kinds of materials, that is, dielectric and magnetic layers, separately, bonding the two layers and then secondarily sintering the bonded layer at a low temperature.
- 2. Description of the Related Art
- Laminated LC filters include a laminated structure with an inductor part consisting of a plurality of magnetic layers and a capacitor part consisting of a plurality of dielectric layers. On main surfaces of the respective dielectric and magnetic layers are formed internal electrodes constituting capacitance elements and coils constituting inductance elements. Also, the internal electrode and the coil formed at each layer extend to connect to external terminals formed on lateral surfaces of the laminated structure, respectively.
- Generally, such a laminated LC filter is manufactured by forming conductive patterns at corresponding main surfaces of respective dielectric and magnetic layers, laminating these layers, sintering the laminated structure and then forming external terminals at lateral surfaces of the sintered structure.
- However, in the LC filter thus obtained, there occur very different sintering shrinkage and thermal expansion between the dielectric and magnetic layers, as well as there being low affinity between the layers. As a result, the LC filter has problems in that it undergoes undesired changes in its physical and electrical properties, that is, changes in the dielectric constant and magnetic permeability, and deformations of size and shape during the co-sintering process.
- To resolve those problems, a buffer layer has been conventionally used in the manufacture of LC filters to reduce the difference in shrinkages between dielectric and magnetic layers. However, the deformation problem caused by the difference in shrinkages of different materials is difficult to completely solve by the use of only one buffer layer. Furthermore, the deterioration of electrical characteristics of parts is caused by the reduction of resistance based on buffer layer materials used (especially in case of including Ni and so on).
- In this regard, as an improved method using buffer layers, a method using two buffer layers is disclosed in Japanese Patent Laid-Open Publication No. Heisei 6-176967. FIG. 1 illustrates an
LC filter 10 manufactured by the method proposed in the above publication in cross-sectional view. - Referring to FIG. 1, between a capacitor part1 and an
inductor part 2, are further included afirst buffer layer 3 adjacent to a dielectric layer constituting the capacitor part 1 and asecond buffer layer 4 adjacent to a magnetic layer constituting theinductor part 2. Those twobuffer layers - However, in the above method, there is a problem in that it is difficult to form two buffer layers for reducing the difference in shrinkages between the capacitor and inductor parts during sintering. More clearly, dielectric layers can be made of materials selected from various materials including oxides such as TiO2, NiO, CuO, Mn3O4 and so on, and magnetic layers can be also made of various materials such as oxides including Cu and/or Fe and Ni—Zn based ferrite and so on. Also, respective compositions of the buffer layers have to be selected considering the compositions of the associated capacitor and inductor parts made of different materials. Accordingly, the above method has a difficulty in determining the composition of buffer layers. Furthermore, on occasion (for example, in case that there is a large difference in composition between dielectric and magnetic layers, and particular elements such as Ni are not included in buffer layers), the selection of materials constituting dielectric or magnetic layers is limited.
- Also, since in the conventional manufacture of LC filter, the dielectric and magnetic layers are still sintered at a high temperature of 1300° C. or more through a co-sintering method, diffusion of elements may occur between the dielectric layer and one buffer layer or between the magnetic layer and the other buffer layer. As a result, conventional methods have a problem in that such diffusion causes an undesired change in the dielectric constant of the dielectric layer and in the magnetic permeability of the magnetic layer, thereby leading to the deterioration of electrical characteristics of parts.
- Therefore, in this technical field, a new laminated LC filter manufacturing method is required which is capable of preventing the structural distortion and the deterioration of electrical characteristics caused by shrinkage occurring during a co-sintering process without use of the buffer layer limited in its composition.
- Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a method for manufacturing a laminated LC filter, which involves the steps of laminating dielectric and magnetic layers separately, sintering each laminated structure separately and then assembling two sintered resultants using a adhesive layer without use of a buffer layer having a particular composition.
- In accordance with the present invention, the above and other objects can be accomplished by the provision of a method for manufacturing a laminated LC filter, comprising the steps of:
- a) forming internal electrodes on a plurality of dielectric layers such that the internal electrodes extend to respective lateral sides of the dielectric layers, and forming coil patterns on a plurality of magnetic layers such that the coil patterns extend to respective lateral sides of the magnetic layers;
- b) performing, in an arbitrary order, formation of a capacitor part by laminating the plurality of dielectric layers, pressing the laminated dielectric layers, and then sintering the pressed dielectric layers to form a capacitor part, and formation of an inductor part by laminating the plurality of magnetic layers, pressing the laminated magnetic layers, and then sintering the pressed magnetic layers to form an inductor part;
- c) bonding the capacitor part and inductor part using a glass-based adhesive; and
- d) forming, on an outer surface of the resultant structure obtained from the step c) at least one external terminal connected to the internal electrodes extending to the lateral sides of the dielectric layers and/or to the coil patterns extending to the lateral sides of the magnetic layers.
- Preferably, the step of bonding the capacitor part and inductor part may comprises the steps of:
- c-1) applying the glass-based adhesive on at least one of bonding surfaces of the capacitor and inductor parts; and
- c-2) arranging the capacitor and inductor parts such that their bonding surfaces face to each other and pressing the two parts together while heating the two parts at a desired temperature.
- Preferably, the glass-based adhesive may be made of at least one composition selected from the group consisting of MgO—B2O3—SiO2, CaO—B2O3—SiO2, SnO—ZnO—P2O5, PbO—ZnO—B2O3, Bi2O3—B2O3, PbO—SiO2, PbO—B2O—SiO2 and Al2O3—B2O3—SiO2. The use of the above glass-based adhesive makes it possible to bond the capacitor and inductor parts by heating at 400 to 650° C. while resolving the problems of shrinkage occurring during the high temperature process.
- The present invention is characterized in that capacitor and inductor parts are made through separate sintering processes and then bonded using a glass-based adhesive, so that the products thus manufactured avoid problems caused by the difference in shrinkages between the dielectric layer constituting the capacitor part and the magnetic layer constituting the inductor part occurring during a co-sintering process of the two layers. Accordingly, the present invention has advantages in that it can solve the problems of delamination and shape deformation occurring between dielectric and magnetic layers consisting of different materials, and simultaneously allow the compositions of the dielectric and magnetic layers to be freely designed without considering composition of a buffer layer, because of non-use of buffer layer limited in its composition.
- The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
- FIG. 1 is a perspective view of a conventional laminated LC filter manufactured using a buffer layer; and
- FIG. 2 is a flow chart illustrating a manufacturing method of a laminated LC filter according to the present invention.
- The present invention will hereinafter be described in more detail in reference to the accompanying drawings.
- FIG. 2 is a flow chart illustrating a manufacturing method of a laminated LC filter according to the present invention. First, a plurality of dielectric and magnetic layers, each formed in the form of a green sheet, are prepared. The dielectric and magnetic layers are subjected to printing processes for printing internal electrodes and coil patterns, respectively (step110).
- The internal electrodes constitute capacitance elements, and the coil patterns constitute inductance elements. At this time, the internal electrodes and coil patterns are formed such that they extend to at least a part of the layers to be connected to external terminals to be formed in a subsequent process.
- Next, the dielectric and magnetic layers are laminated, pressed, debinded and then sintered to form capacitor and inductor parts through separate processes. In more detail, the dielectric layers are laminated (
step 112 a). The laminated dielectric layers are pressed (step 114 a). The pressed layers are sintered to form a sintered body corresponding to the capacitor part (step 116 a). Meanwhile, the magnetic layers are laminated (step 112 b). The laminated magnetic layers are pressed (step 114 b). The pressed layers are sintered to form a sintered body corresponding to the inductor part (step 116 b). At this time, it does not matter which part is made first. Also, the sintering temperature is generally about 1350° C., but the temperature can be selected in a range of about 1100 to 1500° C. based on materials constituting the dielectric and magnetic layers. - Thereafter, the capacitor part and the inductor part are bonded using a glass-based adhesive. Meanwhile, there has been no conventional method which bonds the capacitor and inductor parts after separately sintering these two laminated parts made using green sheets. As a result, during the co-sintering process of the dielectric and magnetic layers, there occurred problems caused by the difference in shrinkages between the two layers. Also, as described above, the method using buffer layers cannot be a fundamental solution and has wide limitations for determining compositions of the dielectric and the magnetic layers let alone the buffer layers. Therefore, the present invention uses the process of separately sintering the dielectric and magnetic layers, and bonding the capacitor and inductor parts obtained from respective sintering processes by an extra bonding process to fundamentally solve those problems.
- According to the bonding process of the present invention, first, a glass-based adhesive is applied on at least one of the bonding surfaces of the capacitor and inductor parts (step120). Thereafter, the capacitor and inductor parts are arranged so that their bonding surfaces face each other, and the two parts are pressed together while being heated at a desired temperature (step 122). In this way, the capacitor and inductor parts are bonded using a glass-based adhesive. At this time, since the adhesive is cured at a low temperature of about 400 to 850° C., it is possible to reduce problems caused by shrinkage generated at the sintering temperature of the dielectric and magnetic layers. The glass-based adhesive may includes a PbO—B2O—CaO—SiO2 based glass adhesive, an Al2O3—B2O3—CaO—SiO2 based glass adhesive or so on. More preferably, a glass-based adhesive capable of being cured at a temperature of 650° C. or less can be used for minimizing problems by shrinkage of dielectric and magnetic layers. The glass-based adhesive may be made of at least one composition selected from the group consisting of MgO—B2O3—SiO2, CaO—B2O3—SiO2, SnO—ZnO—P2O5, PbO—ZnO—B2O3, Bi2O3—B2O3, PbO—SiO2, PbO—B2O—SiO2 and Al2O3—B2O3—SiO2.
- Table 1 shows adhesives usable in the present invention and conditions of heating process (temperature and time) for curing the adhesives.
TABLE 1 Composition Heating temp. (° C.) Heating time (min.) MaO—B2O3—SiO2 600 10 CaO—B2O3—SiO2 600 10 SnO—ZnO—P2O5 490 10 PbO—ZnO—B2O3 550 5 Bi2O3—B2O3 460 30 PbO—SiO2 550 5 PbO—B2O—SiO2 650 15 Al2O3—B2O3—SiO2 510 5 - The present invention is not limited to the above compositions, and those skilled in the art will appreciate that adhesives usable as a binder at a low temperature can be sufficiently used as the adhesive of the present invention.
- Thereafter, external terminals are formed on the lateral surfaces of the resultant structure obtained from the bonding process (step124). The formation position of the external terminals can be defined by appropriately designing portions of the internal electrodes and coil patterns, which extend to the lateral surfaces of the printed silver paste. The external terminals are formed by printing silver (Ag) paste on the corresponding surfaces of the bonded structure and then sintering the bonded structure. At this time, the sintering is performed at a low temperature (about, 680° C.), so that it dose not adversely affect the configuration and structure of the sintered structure.
- As described above, in accordance with the present invention, dielectric and magnetic layers are sintered through separate processes, and then bonded to each other, without using a co-sintering process carried out at a high temperature, so that it is possible to essentially prevent delamination and distortion phenomena occurring due to the difference in shrinkages.
- As apparent from the above description, the LC filter manufacturing method according to the present invention involves the steps of forming capacitor and inductor parts through separate sintering processes, and then bonding the two parts using a glass-based adhesive. Accordingly, the present invention can solve problems of delamination and shape deformation caused by the difference in shrinkages occurring during a co-sintering process of the dielectric layers constituting the capacitor part and the magnetic layers constituting the inductor part. Also, since the present invention does not use any extra buffer layer, there is no need to consider the shrinkage reduction and the composition of the buffer layer, and so the compositions of the dielectric and magnetic layers can be freely designed.
- Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (6)
1. A method for manufacturing a laminated LC filter, comprising the steps of;
a) forming internal electrodes on a plurality of dielectric layers such that the internal electrodes extend to respective lateral sides of the dielectric layers, and forming coil patterns on a plurality of magnetic layers such that the coil patterns extend to respective lateral sides of the magnetic layers;
b) performing, in an arbitrary order, formation of a capacitor part by laminating the plurality of dielectric layers, pressing the laminated dielectric layers, and then sintering the pressed dielectric layers to form a capacitor part, and formation of an inductor part by laminating the plurality of magnetic layers, pressing the laminated magnetic layers, and then sintering the pressed magnetic layers to form an inductor part;
c) bonding the capacitor part and inductor part using a glass-based adhesive; and
d) forming, on an outer surface of the resultant structure obtained from the step c) at least one external terminal connected to the internal electrodes extending to the lateral sides of the dielectric layers and/or to the coil patterns extending to the lateral sides of the magnetic layers.
2. The method as set forth in claim 1 , wherein the step c) comprises the steps of:
c-1) applying the glass-based adhesive on at least one of bonding surfaces of the capacitor and inductor parts; and
c-2) arranging the capacitor and inductor parts such that their bonding surfaces face to each other and pressing the two parts together while heating the two parts at a desired temperature.
3. The method as set forth in claim 1 or 2, wherein, the glass-based adhesive is made of at least one composition selected from the group consisting of MgO—B2O3—SiO2, CaO—B2O3—SiO2, SnO—ZnO—P2O5, PbO—ZnO—B2O3, Bi2O3—B2O3, PbO—SiO2, PbO—B2O—SiO2 and Al2O3—B2O3—SiO2.
4. The method as set forth in claim 3 , wherein the capacitor and inductor parts are heated at a temperature of about 400 to 650° C. such that they are bonded to each other.
5. The method as set forth in claim 1 , wherein the sintering at the step b) is performed at a temperature of about 1100 to 1500° C.
6. The method as set forth in claim 1 , wherein the formation of the external terminal at the step d) is carried out by printing silver (Ag) paste at an external terminal forming region which is located at la lateral surface of the resultant structure obtained from the step c).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020023365A KR20030085190A (en) | 2002-04-29 | 2002-04-29 | Method of producing a laminated lc filter |
KR2002-23365 | 2002-04-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030201055A1 true US20030201055A1 (en) | 2003-10-30 |
Family
ID=29244803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/164,701 Abandoned US20030201055A1 (en) | 2002-04-29 | 2002-06-10 | Method for manufacturing laminated LC filter |
Country Status (4)
Country | Link |
---|---|
US (1) | US20030201055A1 (en) |
JP (1) | JP2003324025A (en) |
KR (1) | KR20030085190A (en) |
CN (1) | CN1455423A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100101702A1 (en) * | 2008-10-28 | 2010-04-29 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing multilayer ceramic substrate |
US20130154767A1 (en) * | 2011-12-19 | 2013-06-20 | Yong Suk Kim | Filter for removing noise |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005227566A (en) * | 2004-02-13 | 2005-08-25 | Seiko Instruments Inc | Lighting device and display device equipped with the same |
KR100755603B1 (en) * | 2005-06-30 | 2007-09-06 | 삼성전기주식회사 | Embeddied thin film type capacitor, laminated structure and methods of fabricating the same |
KR100614258B1 (en) * | 2006-03-31 | 2006-08-22 | (주) 래트론 | LC filter |
JP5581145B2 (en) * | 2009-08-11 | 2014-08-27 | 日本碍子株式会社 | Manufacturing method of composite electronic component |
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US3920781A (en) * | 1971-04-02 | 1975-11-18 | Sprague Electric Co | Method of forming a ceramic dielectric body |
US4746557A (en) * | 1985-12-09 | 1988-05-24 | Murata Manufacturing Co., Ltd. | LC composite component |
US5001014A (en) * | 1988-05-23 | 1991-03-19 | General Electric Company | Ferrite body containing metallization |
US5405466A (en) * | 1992-09-11 | 1995-04-11 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer ceramic electronic component |
US5714239A (en) * | 1993-03-15 | 1998-02-03 | Murata Manufacturing Co., Ltd. | Composite component |
US6036798A (en) * | 1992-05-28 | 2000-03-14 | Murata Manufacturing Co., Ltd. | Process for producing electronic part with laminated substrates |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04117808A (en) * | 1990-09-07 | 1992-04-17 | Murata Mfg Co Ltd | Lc filter |
JPH04279014A (en) * | 1991-03-07 | 1992-10-05 | Murata Mfg Co Ltd | Composite parts |
JPH06310372A (en) * | 1993-04-26 | 1994-11-04 | Murata Mfg Co Ltd | Electronic part |
JPH06325977A (en) * | 1993-05-14 | 1994-11-25 | Mitsubishi Materials Corp | Pi lc filter and pi lc filter array |
-
2002
- 2002-04-29 KR KR1020020023365A patent/KR20030085190A/en not_active Application Discontinuation
- 2002-06-10 US US10/164,701 patent/US20030201055A1/en not_active Abandoned
- 2002-06-11 JP JP2002169411A patent/JP2003324025A/en active Pending
- 2002-06-18 CN CN02122607A patent/CN1455423A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US3920781A (en) * | 1971-04-02 | 1975-11-18 | Sprague Electric Co | Method of forming a ceramic dielectric body |
US4746557A (en) * | 1985-12-09 | 1988-05-24 | Murata Manufacturing Co., Ltd. | LC composite component |
US5001014A (en) * | 1988-05-23 | 1991-03-19 | General Electric Company | Ferrite body containing metallization |
US6036798A (en) * | 1992-05-28 | 2000-03-14 | Murata Manufacturing Co., Ltd. | Process for producing electronic part with laminated substrates |
US5405466A (en) * | 1992-09-11 | 1995-04-11 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer ceramic electronic component |
US5714239A (en) * | 1993-03-15 | 1998-02-03 | Murata Manufacturing Co., Ltd. | Composite component |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100101702A1 (en) * | 2008-10-28 | 2010-04-29 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing multilayer ceramic substrate |
US7871482B2 (en) * | 2008-10-28 | 2011-01-18 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing multilayer ceramic substrate |
US20130154767A1 (en) * | 2011-12-19 | 2013-06-20 | Yong Suk Kim | Filter for removing noise |
US9035723B2 (en) * | 2011-12-19 | 2015-05-19 | Samsung Electro-Mechanics Co., Ltd. | Filter for removing noise |
Also Published As
Publication number | Publication date |
---|---|
JP2003324025A (en) | 2003-11-14 |
CN1455423A (en) | 2003-11-12 |
KR20030085190A (en) | 2003-11-05 |
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Legal Events
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AS | Assignment |
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHO, SEONG WON;REEL/FRAME:013207/0879 Effective date: 20020531 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |