US20040149490A1 - Coaxial via hole and process of fabricating the same - Google Patents
Coaxial via hole and process of fabricating the same Download PDFInfo
- Publication number
- US20040149490A1 US20040149490A1 US10/762,482 US76248204A US2004149490A1 US 20040149490 A1 US20040149490 A1 US 20040149490A1 US 76248204 A US76248204 A US 76248204A US 2004149490 A1 US2004149490 A1 US 2004149490A1
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- via hole
- coaxial via
- shaped conductor
- conductor
- carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Definitions
- the invention relates in general to a structure of a coaxial via hole, and more particularly to a coaxial via hole, which can be applied as a capacitor or a resistor and has the function of signal shielding.
- capacitor is fixed on the circuit board by Surface Mounted Technique (SMT), as shown in FIG. 1.
- SMT Surface Mounted Technique
- the capacitor 102 is fixed on the pad 104 and the pad 104 is fixed on the circuit board (not shown).
- Trace 106 connects the pad 104 and via 108 on the circuit board.
- capacitor 102 fixed by SMT occupies large surface area, which is against the aim of size shrinking.
- FIG. 2A shows the structure of the via capacitor within the multi-layer substrate
- FIG. 2B is the cross-sectional view of the structure in FIG. 2A
- FIG. 2C is the equivalent circuit of the capacitor at multi-layer substrate.
- the circuit board contains substrates L 1 , L 2 , L 3 , L 4 and L 5 .
- a via 203 is formed in the substrate L 3 and the via 203 is filled with dielectric.
- the conductive trace 204 above the via 203 , the conductive trace 206 below the via 203 and the via 203 itself together form a capacitor.
- the capacitance C thereof is a function of the thickness of the substrate L 3 , the diameter of the via 203 and the dielectric constant of the dielectric.
- FIGS. 3A to 3 C another structure of the conventional inter-layer capacitor is disclosed in U.S. Pat. No. 5,972,231, which contains two conductive plates 302 , 304 of polygonal shape on top and bottom of the substrate 306 .
- the conductive plates 302 , 304 are coupled to surrounding circuitry at the polygonal vertices through conductive traces 308 , 310 , respectively.
- the inter-layer capacitor can be further extended to be a capacitor between multi-layer substrates by using via holes.
- a coaxial via hole used in a carrier includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor, and an insulating fill.
- the outer cylinder-shaped conductor extends along the first direction.
- the inner cylinder-shaped conductor is in the outer cylinder-shaped conductor and extends along the first direction.
- the insulating fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor. It is therefore another object of the invention to provide a method of manufacturing a coaxial via hole. First, the first hole is formed in a carrier. A process to make the first hole become conduct electricity is then performed to form an outer cylinder-shaped conductor on the interior of the first hole.
- an insulating material is placed in the outer cylinder-shaped conductor to form an insulating fill.
- the second hole in the insulating fill is then formed.
- the second hole has a diameter smaller than the diameter of the first hole.
- a process to make the second hole become conduct electricity is performed to form an inner cylinder-shaped conductor on the interior of the second hole.
- the coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an electrical-resistant fill.
- the outer cylinder-shaped conductor extends along the first direction.
- the inner cylinder-shaped conductor is in the outer cylinder-shaped conductor and extends along the first direction.
- the electrical-resistant fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.
- the first hole is formed in a PCB.
- a process to set hole become conduct electricity is then performed to form an outer cylinder-shaped conductor on the interior of the first hole.
- an electrical-resistant material is placed in the outer cylinder-shaped conductor to form an electrical-resistant fill.
- the second hole in the electrical-resistant fill is then formed.
- the second hole has a diameter smaller than the diameter of the first hole.
- a process to set hole become conduct electricity is performed to form an inner cylinder-shaped conductor on the interior of the second hole.
- FIG. 1 (Prior Art) illustrates a conventional SMT capacitor
- FIG. 2A shows the structure of the via capacitor within the multi-layer substrate
- FIG. 2B (Prior Art) is the cross-sectional view of the structure in FIG. 2 A;
- FIG. 2C (Prior Art) is the equivalent circuit of the capacitor at multi-layer substrate
- FIGS. 3A to 3 C show another structure of the conventional inter-layer capacitor disclosed in U.S. Pat. No. 5,972,231;
- FIGS. 4A to 4 B show a pillar-shaped capacitor according to a preferred embodiment of the invention
- FIG. 4A is the three-dimensional drawing of the pillar-shaped capacitor and FIG. 4B is the top view of the pillar-shaped capacitor;
- FIG. 5 is a three-dimensional view of a PCB with via holes
- FIG. 6A shows a coaxial via holes according to a preferred embodiment of the invention
- FIG. 6B shows another coaxial via holes according to a preferred embodiment of the invention.
- FIG. 7A is the cross-sectional view showing the coaxial via hole in FIG. 6 while it is used as a capacitor
- FIG. 7B is the equivalent capacitor symbol of the capacitor shown in FIG. 7A;
- FIG. 8 shows how the coaxial via hole according to a preferred embodiment of the invention is applied to a coaxial PCB
- FIG. 9A shows a conventional capacitor used by a component on a PCB
- FIG. 9B shows a capacitor of the invention used by a component on a PCB
- FIG. 10A shows a conventional conductive trace having the function of noise shielding
- FIG. 10B shows a conductive trace having the function of noise shielding according to a preferred embodiment of the invention
- FIG. 10C is the horizontal cross section of the conductive trace shown in FIG. 10B;
- FIG. 11 is the lateral view of a computer system structure, which uses the coaxial via hole of the invention as a capacitor;
- FIG. 12 (Prior Art) is the top view of a conventional module board
- FIG. 13 is the top view of a module board with the coaxial via hole type capacitor according to a preferred embodiment of the invention.
- FIG. 14 (Prior Art) is the cross section of a conventional connector
- FIG. 15 is the top view of the conventional pin arrangement of a high frequency circuit
- FIG. 16 is the cross section of a connector having the coaxial via hole structure according to a preferred embodiment of the invention.
- FIG. 17 shows a resistor having the coaxial via hole structure according to a preferred embodiment of the invention.
- FIGS. 4A to 4 B show a pillar-shaped capacitor according to a preferred embodiment of the invention
- FIG. 4A is the three-dimensional drawing of the pillar-shaped capacitor
- FIG. 4B is the top view of the pillar-shaped capacitor.
- Dielectric is filled in between the conductor 402 and the conductor 404 to form an insulating fill 406 .
- the insulating fill 406 , conductor 402 and conductor 404 together form a pillar-shaped capacitor 400 .
- the conductor 402 and conductor 404 can be both coaxially cylinder-shaped and with different diameters.
- the capacitance is in proportion to the dielectric constant and conductor surface and is in inverse proportion to the distance between two conductors.
- the configuration of the pillar-shaped capacitor can be modified when needed but is not limited to the shape shown in the drawings.
- FIG. 5 A three-dimensional view of a PCB with via holes is shown in FIG. 5.
- the PCB 500 contains a number substrate layers. Signal is transmitted between different substrate layers by a via hole 510 .
- the via hole 510 connects the conductive trace 504 of the first layer 502 and the conductive trace 508 of another substrate layer 506 .
- the function of the via hole 510 can be further extended so that a combined structure of a via hole and a pillar-shaped capacitor is proposed.
- FIGS. 6A and 6B show two coaxial via holes according to a preferred embodiment of the invention, which can be formed by the following procedure.
- a hole 604 is formed through a substrate 602 .
- To make the interior of the hole 604 become conduct electricity is then performed to form a relatively large diameter cylinder-shaped conductor 606 .
- dielectric with high dielectric constant is placed in the cylinder-shaped conductor 606 to form an insulating fill 608 .
- Another hole 610 with smaller diameter than the hole 604 is then formed in the insulating fill 608 .
- the interior of the hole 610 is then made conduct electricity to form a cylinder-shaped conductor with a relatively small diameter.
- the process to make the interior of the holes 604 , 610 become conduct electricity is preferrably by plating or placing conductive paste.
- Holes 604 , 610 are preferrably formed by photo formation or drill formation, such as mechanically drilling, laser-drilling ablation or plasma ablation.
- the process to make the interior of the holes 604 , 606 become conduct electricity can be completed by plating or placing conductive paste.
- high dielectric constant insulating material can be placed in the outer cylinder-shaped conductor 606 by plugging or laminating insulating material.
- the coaxial via hole with the outer cylinder-shaped conductor 606 , the inner cylinder-shaped conductor 612 and the insulating fill 608 therebetween is then formed.
- the outer cylinder-shaped conductor 606 extends along the Z-axis, which is vertical to substrate 602 .
- the inner cylinder-shaped conductor 612 also extends along the Z-axis can is disposed in the outer cylinder-shaped conductor 606 .
- the insulating fill 608 is between the two cylinder-shaped conductors 606 , 612 and separates the two. While multi layers of substrate are used, the coaxial via hole of the invention can be also applied to connect more than one layer of substrate.
- cylinder-shaped conductors are taken as examples of the inner and outer conductors 404 , 402 .
- the coaxial via hole of the invention is not limited thereto.
- the inner and outer conductors can be in any shape only if the two conductors extend along with the Z-axis and are completely separated by an insulating fill. Therefore, any configurations of the two conductors with cross sections shaped in, for example, circle, oval, rectangle are within the scope of the invention.
- the configuration and the cross-section of the inner and outer conductors can be different from each other.
- the conductor 614 connected to the outer cylinder-shaped conductor 606 as shown in FIG. 6A and FIG. 6B is formed along with the fabrication process mentioned above. Also, a similar conductor 620 connected to the inner cylinder-shaped conductor 612 as shown in FIG. 6B is formed. Electrical trace can be therefore connected to the inner and outer conductor via the conductor 620 , 612 , 606 or 614 .
- the inner conductor 612 is cylinder-shaped while it is formed by plating. However, the inner conductor 612 is solid pillar-shaped while it is formed by filling conductive paste (referring to FIG. 8). It is there clear to people who are skilled in the art that the two shapes and fabricating processes are both within the scope of the invention.
- Material of the insulating fill 608 greatly influences the performance of the coaxial via hole of the invention, particularly while the coaxial via hole is used as a capacitor. Because the equivalent capacitance of a capacitor is in proportion to the dielectric constant of the insulating material between the two conductive layers, insulating material with high dielectric constant is preferred. Insulating materials such as ceramic powder and mixture of polymer with dielectric constant up to 60 are produced by DuPont and HADCO and are preferred for using in the coaxial via hole of the invention.
- FIG. 7A is the cross-sectional view showing the coaxial via hole in FIG. 6 while it is used as a capacitor and FIG. 7B is the equivalent capacitor symbol thereof.
- the inner conductor 612 is connected to the conductor P 1 , which is connected to a positive voltage source (VCC) at the other end.
- the outer conductor 606 is connected to the conductor P 2 , which is connected to a negative voltage source (GND). To function as a capacitor, the inner conductor 612 and the outer conductor 606 are charged differently.
- the capacitance of the capacitor of the invention is also determined by the configuration and size of the inner conductor 612 and the outer conductor 606 , besides the dielectric constant of the insulating fill 608 .
- the conductor P 1 , P 2 are connected to the inner and outer conductor layers are also criteria of the capacitance, while the cross sections of the conductors are not symmetrical.
- more than two capacitors with the coaxial via hole structure of the invention can be connected in parallel to adjust the capacitance when needed.
- FIG. 8 shows how the coaxial via hole according to a preferred embodiment of the invention is applied to a multi-layer PCB.
- the PCB 800 includes 8 conductive layers L 1 ⁇ L 8 .
- the coaxial via hole of the invention penetrates through the conductive layer L 3 to L 6 .
- the inner conductor 612 is connected to the conductive trace 808 ; the outer conductor 606 is connected to the conductive trace 810 .
- the insulating fill 812 would be the same material with insulating fill 608 or conventional dielectric material.
- the inner conductor 612 and the outer conductor 606 are separated by the insulating fill 608 .
- the conductive trace 808 is connected to a source of positive voltage and the conductive trace 810 is connected to a source of negative voltage.
- the coaxial via hole disposed between conductive layer L 3 and L 6 is only an example.
- the coaxial via hole of the invention can be configured to penetrate either a portion of the PCB 800 , such as through layer L 3 to L 6 , or to penetrate the PCB 800 , i.e. through all the 8 conductive layers.
- the conductive trace 808 may be connected to negative voltage source and the conductive trace 810 may be connected to positive voltage source when needed.
- FIG. 9A shows a conventional capacitor used by a component on a PCB
- FIG. 9B shows a capacitor of the invention used by a component on a PCB
- the component 902 on the PCB (not shown) includes a number of pins (not shown).
- Pad 904 of the pin is connected to a positive power source.
- the pin of the component 902 which is connected to power source, is usually connected to a bypass capacitor via the pad 904 .
- the pin 904 is connected to the first inner plane (not shown) through the conductive trace 906 and the via hole 908 ;
- the capacitor 910 is connected to the first inner plane (not shown) through the conductive trace 912 and the via hole 914 .
- the other end of the capacitor 910 is connected to the second inner plane(not shown) through the conductive trace 916 and the via hole 918 .
- the pin 904 is connected to the capacitor 922 , the structure of which is made according to the coaxial via hole of the invention, through the conductive trace 920 .
- the coaxial via hole type capacitor 922 is directly connected to the second inner plane.
- the path of energy flow from the capacitor 910 to the component 902 includes the capacitor 910 , the conductive trace 912 , the via hole 914 , the via hole 908 , the conductive trace 906 , and the pin 904 .
- energy stored in the capacitor 922 can be transmitted to the component 902 simply by passing through the conductive trace 920 and the pad 904 of the pin. Therefore, the speed of energy transmission between the capacitor 922 of the invention and the component 902 is highly increased. Consequently, the component 902 using the capacitor 922 of the invention is able to switch voltage level more rapidly than the conventional one. So the component 902 performs normally even at high frequency. It is therefore obvious that circuit using a capacitor with the coaxial via hole structure is more suitable, than the conventional one, to the rapid voltage level switch high frequency system.
- the coaxial via hole structure according to a preferred embodiment of the invention further has the function of noise shielding.
- FIG. 10A shows a conventional conductive trace having the function of noise shielding;
- FIG. 10B shows a conductive trace having the function of noise shielding according to a preferred embodiment of the invention;
- FIG. 10C is the horizontal cross section of the conductive trace shown in FIG. 10B.
- grounded trace 1003 is usually used to coil around a sensitive conductive trace 1001 so that noise can be shielded and the resistance of the conductive trace 1001 can be under control.
- the grounded trace 1003 prevents the conductive trace 1001 from be interrupted by the environmental noise and also avoids the noise of the conductive trace 1001 to interrupt the environment.
- the conventional grounded trace 1003 only provides the function of noise shielding to conductive traces on the same layer of substrate. However, while the conductive trace may extend through a via hole to another layer of the substrate, there is no protection of the conductive trace at the via hole.
- the inner cylinder-shaped conductor layer 1002 is connected to the conductor P 1 ; the outer cylinder-shaped conductor layer 1004 is connected to the conductor P 2 , as shown in FIG. 10B.
- the conductor P 2 is grounded and the conductor P 1 is connected to a general signal trace.
- FIG. 10C the whole structure of the coaxial via hole is configured like a co-axial electric cable. Consequently, the outer cylinder-shaped conductor layer 1004 provides the protection of noise shielding for the inner cylinder-shaped conductor 1002 . Also, the resistance can be properly designed to be consistent.
- the insulating fill between the two conductor layers is not limited to high dielectric constant material while the coaxial via hole of the invention is used to provide the function of noise shielding.
- the coaxial via hole of the invention is used in a PCB. How, PCB is only an example of various carriers. It is apparent that the coaxial via hole according to a preferred embodiment of the invention can also be applied in an IC socket, adapter, a connector, heat sink or the like. Two of the carriers are taken as examples for illustration.
- FIG. 11 is the lateral view of a computer system structure, which uses the coaxial via hole of the invention as a capacitor.
- the computer system in FIG. 11 includes Central Process Unit (CPU) 1102 , north bridge IC 1104 and south bridge 1106 .
- CPU 1102 is disposed on the IC socket 1108 .
- the IC socket 1108 is connected to the adapter 1112 through a number of solder balls 1110 .
- the adapter 1112 , north bridge IC 1104 , and south bridge IC 1106 are connected to the module board 1114 through solder balls 1110 .
- the standoff board 1116 is connected to the module board 1114 and the carrier board 1118 .
- FIG. 12 is the top view of a conventional module board 1114 as shown in FIG. 11.
- the module board 1114 includes a component welding region 1202 for connecting with the adapter 1112 .
- the soldering region 1202 contains a number of pads 1204 corresponding to the pins connected to VCC at CPU 1102 .
- each pin connected to VCC needs a capacitor.
- the pin is connected to a capacitor 1208 through a pad 1204 and a via hole 1206 .
- the capacitor is typically a Surface Mounted Device (SMD) capacitor 1208 .
- SMD Surface Mounted Device
- FIG. 13 is the top view of a module board with the coaxial via hole type capacitor according to a preferred embodiment of the invention.
- the module board 1300 includes a soldering region 1302 for connecting with the adapter 1112 .
- the soldering region contains a number of pads 1304 corresponding to pins connected to VCC at CPU 1102 .
- the via hole 1306 which the pad 1304 is connected to, can be configured to have the structure and function of the coaxial via hole type capacitor according to a preferred embodiment of the invention.
- less area of the module board is used for the capacitor and more area of the module board can be used for other component.
- the coaxial via hole of the invention can be used not only in the via hole on the module board but also the adapter 1112 and the IC socket 1108 so that the adapter 1112 and the IC socket 1108 can have the advantages of more area for other components.
- FIG. 14 is the cross section of a conventional connector.
- the connector in FIG. 14 includes a male connector 1402 and a female connector 1404 .
- the pin 1406 of the male connector 1402 is inserted into the contact 1408 of the female connector 1404 .
- the contact 1408 fixes the connector 1404 at the PCB 1410 .
- the screw 1412 can fix the connector 1404 and the PCB 1410 together.
- FIG. 15 is the top view of the preferred pin assignment for a high frequency circuit.
- Symbol S represents signal pin of the connector 1402 , which outputs signals;
- symbol G represents grounded pin of the connector 1402 .
- Signal pins S are designed to be surrounded by grounded pins G so that noise can be isolated from the signal pins and higher signal quality can be obtained.
- the grounded pins. G occupy large area of the connector, which is against the goal of size minimization.
- FIG. 16 is the cross section of a connector having the coaxial via hole structure according to a preferred embodiment of the invention.
- the connector 1604 includes a contact 1608 of a capacitor 1606 having a coaxial via hole structure according to a preferred embodiment of the invention and contacts 1618 , 1620 , 1622 , and 1624 of the coaxial via holes 1610 , 1612 , 1614 , and 1616 which functions as signal shielding.
- the screw 1628 connects the negative power source 1630 and the negative power source 1632 together.
- the contact 1626 is connected to the grounded pin of the connector 1602 , so the contact 1626 does not need to configure as the coaxial via hole of the invention in order to have the function of signal shielding.
- the contact 1608 is connected to the power pin of the connector 1602 and the positive power source 1634 . To keep the voltage steady, the connect 1608 is also connected to the capacitor 1606 .
- the outer cylinder-shaped conductor 1636 of the capacitor 1606 is connected to the negative power source 1632 and the inner cylinder-shaped conductor 1638 of the capacitor 1606 is connected to the positive power source 1634 along the contact 1608 .
- An insulating fill 1640 with high dielectric constant is between the inner cylinder-shaped conductor 1638 and the outer cylinder-shaped conductor 1636 .
- the outer cylinder-shaped conductors, such as the conductor 1642 , of the coaxial via holes 1610 , 1612 , 1614 , and 1616 are connected to a negative power source 1632 in order to have the function of signal shielding.
- the contacts 1618 , 1620 , 1622 , and 1624 are prevented from the noise interference. Consequently, the pin number of the connector 1602 and the connect number of the connector 1604 are both reduced and the area which the connector 1602 and the connector 1604 occupy are greatly reduced.
- the coaxial via hole of the invention can also be applied in an IC socket, to which an IC with a number of pins are fixed.
- the structure is as shown in FIG. 16.
- the insulating fill of the coaxial via hole structure of the invention can be replaced by an electrical-resistant material to form a resistor. Desired resistance can be obtained by choosing electrical-resistant material with different resistivity, modifying the diameters or the depth of the via hole. That is because the resistance is in proportion to the resistivity and length of the material and is in inverse proportion to the cross sectional area of the material.
- FIG. 17 shows a resistor having the coaxial via hole structure according to a preferred embodiment of the invention.
- the resistor with the coaxial via hole structure of the invention penetrates through the substrate 1704 .
- the inner cylinder-shaped conductor 1712 is connected to the conductive trace 1708 .
- the conductive trace 1708 is further connected to the signal trace, the positive voltage source or the negative voltage source.
- the outer cylinder-shaped conductor 1714 is connected to the conductive trace 1710 .
- the conductive trace 1710 is further connected to the signal trace, the positive voltage source or the negative voltage source.
- the electrical-resistant material 1716 is between the inner cylinder-shaped conductor 1712 and the outer cylinder-shaped conductor 1714 .
- the insulating fill 1718 and the insulating fill 1720 separates the inner cylinder-shaped conductor 1724 and the outer cylinder-shaped conductor 1714 .
- the resistor has the same function with discrete resistor component. Each cylinder-shaped conductor 1714 , 1712 would be individually connected to a positive voltage source, a negative voltage source or a signal net.
- the resistor in circuit would be a pull down resistor, while the outer cylinder-shaped conductor 1714 is connected to the signal net through the conductive trace 1710 and the inner cylinder-shaped conductor 1712 is connected to the negative voltage source conductor 1708 .
- the resistor in circuit would be a pull up resistor, while the inner cylinder-shaped conductor 1712 is connected to the positive voltage source through the conductor 1708 .
- the resistor would be a terminator, while the inner cylinder-shaped conductor 1712 is connected to the signal net through the conductor 1708 .
- the resistor with the coaxial via hole structure according to a preferred embodiment of the invention can also be applied in PCB, substrate, IC socket, adapter, connector, heat sink of other carrier so that the objective of using less area can be achieved.
- a carrier with a substrate 1704 is taken as an example to illustrate the manufacturing process of a coaxial via hole as a resistor.
- a hole 1722 is formed through the substrate 1704 .
- the interior of the hole 1722 is then set to become conduct electricity to form an outer cylinder-shaped conductor 1714 .
- the interior of the outer cylinder-shaped conductor 1714 is then formed with a resistant material to form a resistant fill 1716 .
- Another hole 1724 with smaller diameter than the hole 1722 is then formed to penetrate through the resistant layer 1716 .
- the interior of the hole 1724 is then set to become conduct electricity to form a inner cylinder-shaped conductor 1712 .
- the capacitor with the coaxial via hole structure according to a preferred embodiment of the invention has the following advantages superior to the conventional SMD capacitor.
- the capacitor with the coaxial via hole structure of the invention can be used in inner layers of a PCB but the SMD capacitor can be only used on the surface layers of PCB.
- the capacitor with the coaxial via hole structure of the invention can be built in the substrate but the SMD capacitor can not be applied inside the multi-layer substrate.
- the capacitor with the coaxial via hole structure of the invention is more suitable for the high frequency circuit than the conventional SMD capacitor; and the capacitor of the invention can also function as signal shielding.
- the resistor with the coaxial via hole structure according to a preferred embodiment of the invention has the following advantages prior to the conventional SMD resistor.
- the resistor with the coaxial via hole structure of the invention can be used in inner layers of a PCB but the SMD resistor can be only used on the surface layers of PCB.
- the resistor with the coaxial via hole structure of the invention can be buried in the substrate but the SMD resistor can not be applied inside the multi-layer substrate.
- the capacitor or resistor with the via hole structure of the invention has the advantages of occupying much less surface of the substrate or intra-layer surface, being able to be built in the substrate or other carrier without extra discrete capacitor, resistor and the cost thereof, and also functioning as signal shielding.
Abstract
A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.
Description
- This application incorporates by reference Taiwanese application Serial No. 089116185, Filed Aug. 11, 2000.
- 1. Field of the Invention
- The invention relates in general to a structure of a coaxial via hole, and more particularly to a coaxial via hole, which can be applied as a capacitor or a resistor and has the function of signal shielding.
- 2. Description of the Related Art
- The development and progress of the IC (Integrated Circuit) integration and fabrication and the advance of device package and circuit design is always aimed to be smaller and lighter.
- Conventionally, capacitor is fixed on the circuit board by Surface Mounted Technique (SMT), as shown in FIG. 1. The
capacitor 102 is fixed on thepad 104 and thepad 104 is fixed on the circuit board (not shown). Trace 106 connects thepad 104 and via 108 on the circuit board. However,capacitor 102 fixed by SMT occupies large surface area, which is against the aim of size shrinking. - Via capacitors within substrate is proposed, with the development of high dielectric constant material. A typical one is disclosed in a U.S. Pat. No. 5,055,966. FIG. 2A shows the structure of the via capacitor within the multi-layer substrate; FIG. 2B is the cross-sectional view of the structure in FIG. 2A; FIG. 2C is the equivalent circuit of the capacitor at multi-layer substrate. The circuit board contains substrates L1, L2, L3, L4 and L5. A
via 203 is formed in the substrate L3 and thevia 203 is filled with dielectric. Theconductive trace 204 above thevia 203, theconductive trace 206 below thevia 203 and thevia 203 itself together form a capacitor. The capacitance C thereof is a function of the thickness of the substrate L3, the diameter of thevia 203 and the dielectric constant of the dielectric. - Referring to FIGS. 3A to3C, another structure of the conventional inter-layer capacitor is disclosed in U.S. Pat. No. 5,972,231, which contains two
conductive plates substrate 306. Theconductive plates conductive traces - The two conventional capacitors mentioned-above occupy smaller horizontal surface but more substrate layers. However, increasing number of substrate layer is not acceptable for some Printed Circuit Boards (PCBs) with high device density. Similar problems also occur in the resistor structure.
- It is therefore an object of the invention to provide a coaxial via hole used in a carrier, includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor, and an insulating fill. The outer cylinder-shaped conductor extends along the first direction. The inner cylinder-shaped conductor is in the outer cylinder-shaped conductor and extends along the first direction. The insulating fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor. It is therefore another object of the invention to provide a method of manufacturing a coaxial via hole. First, the first hole is formed in a carrier. A process to make the first hole become conduct electricity is then performed to form an outer cylinder-shaped conductor on the interior of the first hole. Next, an insulating material is placed in the outer cylinder-shaped conductor to form an insulating fill. The second hole in the insulating fill is then formed. The second hole has a diameter smaller than the diameter of the first hole. Next, a process to make the second hole become conduct electricity is performed to form an inner cylinder-shaped conductor on the interior of the second hole.
- It is therefore another object of the invention to provide a coaxial via hole used in a carrier. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an electrical-resistant fill. The outer cylinder-shaped conductor extends along the first direction. The inner cylinder-shaped conductor is in the outer cylinder-shaped conductor and extends along the first direction. The electrical-resistant fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.
- It is therefore a further object of the invention to provide a method of manufacturing a coaxial via hole. First, the first hole is formed in a PCB. A process to set hole become conduct electricity is then performed to form an outer cylinder-shaped conductor on the interior of the first hole. Next, an electrical-resistant material is placed in the outer cylinder-shaped conductor to form an electrical-resistant fill. The second hole in the electrical-resistant fill is then formed. The second hole has a diameter smaller than the diameter of the first hole. Next, a process to set hole become conduct electricity is performed to form an inner cylinder-shaped conductor on the interior of the second hole.
- Other objects, features, and advantages of the invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The description is made with reference to the accompanying drawings in which:
- FIG. 1 (Prior Art) illustrates a conventional SMT capacitor;
- FIG. 2A (Prior Art) shows the structure of the via capacitor within the multi-layer substrate;
- FIG. 2B (Prior Art) is the cross-sectional view of the structure in FIG.2A;
- FIG. 2C (Prior Art) is the equivalent circuit of the capacitor at multi-layer substrate;
- FIGS. 3A to3C (Prior Art) show another structure of the conventional inter-layer capacitor disclosed in U.S. Pat. No. 5,972,231;
- FIGS. 4A to4B show a pillar-shaped capacitor according to a preferred embodiment of the invention;
- FIG. 4A is the three-dimensional drawing of the pillar-shaped capacitor and FIG. 4B is the top view of the pillar-shaped capacitor;
- FIG. 5 (Prior Art) is a three-dimensional view of a PCB with via holes;
- FIG. 6A shows a coaxial via holes according to a preferred embodiment of the invention;
- FIG. 6B shows another coaxial via holes according to a preferred embodiment of the invention;
- FIG. 7A is the cross-sectional view showing the coaxial via hole in FIG. 6 while it is used as a capacitor;
- FIG. 7B is the equivalent capacitor symbol of the capacitor shown in FIG. 7A;
- FIG. 8 shows how the coaxial via hole according to a preferred embodiment of the invention is applied to a coaxial PCB;
- FIG. 9A (Prior Art) shows a conventional capacitor used by a component on a PCB;
- FIG. 9B (Prior Art) shows a capacitor of the invention used by a component on a PCB;
- FIG. 10A (Prior Art) shows a conventional conductive trace having the function of noise shielding;
- FIG. 10B shows a conductive trace having the function of noise shielding according to a preferred embodiment of the invention;
- FIG. 10C is the horizontal cross section of the conductive trace shown in FIG. 10B;
- FIG. 11 is the lateral view of a computer system structure, which uses the coaxial via hole of the invention as a capacitor;
- FIG. 12 (Prior Art) is the top view of a conventional module board;
- FIG. 13 is the top view of a module board with the coaxial via hole type capacitor according to a preferred embodiment of the invention;
- FIG. 14 (Prior Art) is the cross section of a conventional connector;
- FIG. 15 (Prior Art) is the top view of the conventional pin arrangement of a high frequency circuit;
- FIG. 16 is the cross section of a connector having the coaxial via hole structure according to a preferred embodiment of the invention; and
- FIG. 17 shows a resistor having the coaxial via hole structure according to a preferred embodiment of the invention.
- FIGS. 4A to4B show a pillar-shaped capacitor according to a preferred embodiment of the invention; FIG. 4A is the three-dimensional drawing of the pillar-shaped capacitor and FIG. 4B is the top view of the pillar-shaped capacitor. Dielectric is filled in between the
conductor 402 and theconductor 404 to form an insulatingfill 406. The insulatingfill 406,conductor 402 andconductor 404 together form a pillar-shapedcapacitor 400. Theconductor 402 andconductor 404 can be both coaxially cylinder-shaped and with different diameters. The capacitance is in proportion to the dielectric constant and conductor surface and is in inverse proportion to the distance between two conductors. The configuration of the pillar-shaped capacitor can be modified when needed but is not limited to the shape shown in the drawings. - A three-dimensional view of a PCB with via holes is shown in FIG. 5. The
PCB 500 contains a number substrate layers. Signal is transmitted between different substrate layers by a viahole 510. The viahole 510 connects theconductive trace 504 of thefirst layer 502 and theconductive trace 508 of anothersubstrate layer 506. According to a preferred embodiment of the invention, the function of the viahole 510 can be further extended so that a combined structure of a via hole and a pillar-shaped capacitor is proposed. - FIGS. 6A and 6B show two coaxial via holes according to a preferred embodiment of the invention, which can be formed by the following procedure. First, a
hole 604 is formed through asubstrate 602. To make the interior of thehole 604 become conduct electricity is then performed to form a relatively large diameter cylinder-shapedconductor 606. Then, dielectric with high dielectric constant is placed in the cylinder-shapedconductor 606 to form an insulatingfill 608. Anotherhole 610 with smaller diameter than thehole 604 is then formed in the insulatingfill 608. The interior of thehole 610 is then made conduct electricity to form a cylinder-shaped conductor with a relatively small diameter. The process to make the interior of theholes -
Holes holes conductor 606 by plugging or laminating insulating material. - According to the process mentioned above, the coaxial via hole with the outer cylinder-shaped
conductor 606, the inner cylinder-shapedconductor 612 and the insulatingfill 608 therebetween is then formed. The outer cylinder-shapedconductor 606 extends along the Z-axis, which is vertical tosubstrate 602. The inner cylinder-shapedconductor 612 also extends along the Z-axis can is disposed in the outer cylinder-shapedconductor 606. The insulatingfill 608 is between the two cylinder-shapedconductors - As shown in the drawings of FIG. 4A and FIG. 4B, cylinder-shaped conductors are taken as examples of the inner and
outer conductors - The
conductor 614 connected to the outer cylinder-shapedconductor 606 as shown in FIG. 6A and FIG. 6B is formed along with the fabrication process mentioned above. Also, asimilar conductor 620 connected to the inner cylinder-shapedconductor 612 as shown in FIG. 6B is formed. Electrical trace can be therefore connected to the inner and outer conductor via theconductor - The
inner conductor 612 is cylinder-shaped while it is formed by plating. However, theinner conductor 612 is solid pillar-shaped while it is formed by filling conductive paste (referring to FIG. 8). It is there clear to people who are skilled in the art that the two shapes and fabricating processes are both within the scope of the invention. - Material of the insulating
fill 608 greatly influences the performance of the coaxial via hole of the invention, particularly while the coaxial via hole is used as a capacitor. Because the equivalent capacitance of a capacitor is in proportion to the dielectric constant of the insulating material between the two conductive layers, insulating material with high dielectric constant is preferred. Insulating materials such as ceramic powder and mixture of polymer with dielectric constant up to 60 are produced by DuPont and HADCO and are preferred for using in the coaxial via hole of the invention. - FIG. 7A is the cross-sectional view showing the coaxial via hole in FIG. 6 while it is used as a capacitor and FIG. 7B is the equivalent capacitor symbol thereof. The
inner conductor 612 is connected to the conductor P1, which is connected to a positive voltage source (VCC) at the other end. Theouter conductor 606 is connected to the conductor P2, which is connected to a negative voltage source (GND). To function as a capacitor, theinner conductor 612 and theouter conductor 606 are charged differently. - The capacitance of the capacitor of the invention is also determined by the configuration and size of the
inner conductor 612 and theouter conductor 606, besides the dielectric constant of the insulatingfill 608. To where the conductor P1, P2 are connected to the inner and outer conductor layers are also criteria of the capacitance, while the cross sections of the conductors are not symmetrical. Moreover, more than two capacitors with the coaxial via hole structure of the invention can be connected in parallel to adjust the capacitance when needed. - FIG. 8 shows how the coaxial via hole according to a preferred embodiment of the invention is applied to a multi-layer PCB. The
PCB 800 includes 8 conductive layers L1˜L8. In FIG. 8, the coaxial via hole of the invention penetrates through the conductive layer L3 to L6. Theinner conductor 612 is connected to theconductive trace 808; theouter conductor 606 is connected to theconductive trace 810. The insulatingfill 812 would be the same material with insulatingfill 608 or conventional dielectric material. Theinner conductor 612 and theouter conductor 606 are separated by the insulatingfill 608. Theconductive trace 808 is connected to a source of positive voltage and theconductive trace 810 is connected to a source of negative voltage. The coaxial via hole disposed between conductive layer L3 and L6 is only an example. On the contrary, the coaxial via hole of the invention can be configured to penetrate either a portion of thePCB 800, such as through layer L3 to L6, or to penetrate thePCB 800, i.e. through all the 8 conductive layers. Moreover, theconductive trace 808 may be connected to negative voltage source and theconductive trace 810 may be connected to positive voltage source when needed. - FIG. 9A shows a conventional capacitor used by a component on a PCB and FIG. 9B shows a capacitor of the invention used by a component on a PCB. The
component 902 on the PCB (not shown) includes a number of pins (not shown).Pad 904 of the pin is connected to a positive power source. To keep the voltage steady and eliminate the influence of the noise produced by power source, the pin of thecomponent 902, which is connected to power source, is usually connected to a bypass capacitor via thepad 904. Referring to FIG. 9A, thepin 904 is connected to the first inner plane (not shown) through theconductive trace 906 and the viahole 908; thecapacitor 910 is connected to the first inner plane (not shown) through theconductive trace 912 and the viahole 914. The other end of thecapacitor 910 is connected to the second inner plane(not shown) through theconductive trace 916 and the viahole 918. - In FIG. 9B, the
pin 904 is connected to thecapacitor 922, the structure of which is made according to the coaxial via hole of the invention, through theconductive trace 920. The coaxial viahole type capacitor 922 is directly connected to the second inner plane. - Conventionally, referring to FIG. 9A, the path of energy flow from the
capacitor 910 to thecomponent 902 includes thecapacitor 910, theconductive trace 912, the viahole 914, the viahole 908, theconductive trace 906, and thepin 904. According to a preferred embodiment of the invention, energy stored in thecapacitor 922 can be transmitted to thecomponent 902 simply by passing through theconductive trace 920 and thepad 904 of the pin. Therefore, the speed of energy transmission between thecapacitor 922 of the invention and thecomponent 902 is highly increased. Consequently, thecomponent 902 using thecapacitor 922 of the invention is able to switch voltage level more rapidly than the conventional one. So thecomponent 902 performs normally even at high frequency. It is therefore obvious that circuit using a capacitor with the coaxial via hole structure is more suitable, than the conventional one, to the rapid voltage level switch high frequency system. - The coaxial via hole structure according to a preferred embodiment of the invention further has the function of noise shielding. FIG. 10A shows a conventional conductive trace having the function of noise shielding; FIG. 10B shows a conductive trace having the function of noise shielding according to a preferred embodiment of the invention; and FIG. 10C is the horizontal cross section of the conductive trace shown in FIG. 10B.
- In a conventional circuit system, grounded
trace 1003 is usually used to coil around a sensitiveconductive trace 1001 so that noise can be shielded and the resistance of theconductive trace 1001 can be under control. The groundedtrace 1003 prevents theconductive trace 1001 from be interrupted by the environmental noise and also avoids the noise of theconductive trace 1001 to interrupt the environment. The conventional groundedtrace 1003 only provides the function of noise shielding to conductive traces on the same layer of substrate. However, while the conductive trace may extend through a via hole to another layer of the substrate, there is no protection of the conductive trace at the via hole. - According to a preferred embodiment of the invention, the inner cylinder-shaped
conductor layer 1002 is connected to the conductor P1; the outer cylinder-shapedconductor layer 1004 is connected to the conductor P2, as shown in FIG. 10B. The conductor P2 is grounded and the conductor P1 is connected to a general signal trace. As shown in FIG. 10C, the whole structure of the coaxial via hole is configured like a co-axial electric cable. Consequently, the outer cylinder-shapedconductor layer 1004 provides the protection of noise shielding for the inner cylinder-shapedconductor 1002. Also, the resistance can be properly designed to be consistent. - It is apparent for people who are skilled in the art that the insulating fill between the two conductor layers is not limited to high dielectric constant material while the coaxial via hole of the invention is used to provide the function of noise shielding.
- In the above description, the coaxial via hole of the invention is used in a PCB. How, PCB is only an example of various carriers. It is apparent that the coaxial via hole according to a preferred embodiment of the invention can also be applied in an IC socket, adapter, a connector, heat sink or the like. Two of the carriers are taken as examples for illustration.
- FIG. 11 is the lateral view of a computer system structure, which uses the coaxial via hole of the invention as a capacitor. The computer system in FIG. 11 includes Central Process Unit (CPU)1102,
north bridge IC 1104 andsouth bridge 1106.CPU 1102 is disposed on theIC socket 1108. TheIC socket 1108 is connected to theadapter 1112 through a number ofsolder balls 1110. Theadapter 1112,north bridge IC 1104, andsouth bridge IC 1106 are connected to themodule board 1114 throughsolder balls 1110. Thestandoff board 1116 is connected to themodule board 1114 and thecarrier board 1118. - FIG. 12 is the top view of a
conventional module board 1114 as shown in FIG. 11. Themodule board 1114 includes acomponent welding region 1202 for connecting with theadapter 1112. Thesoldering region 1202 contains a number of pads 1204 corresponding to the pins connected to VCC atCPU 1102. Ideally, atCPU 1102, each pin connected to VCC needs a capacitor. Conventionally, the pin is connected to a capacitor 1208 through a pad 1204 and a via hole 1206. The capacitor is typically a Surface Mounted Device (SMD) capacitor 1208. However, as shown in FIG. 12, these SMD capacitors 1208 occupies large usable area of themodule board 1114, which consequently limits the application of themodule board 1114. - FIG. 13 is the top view of a module board with the coaxial via hole type capacitor according to a preferred embodiment of the invention. The
module board 1300 includes asoldering region 1302 for connecting with theadapter 1112. The soldering region contains a number ofpads 1304 corresponding to pins connected to VCC atCPU 1102. The viahole 1306, which thepad 1304 is connected to, can be configured to have the structure and function of the coaxial via hole type capacitor according to a preferred embodiment of the invention. Thus, less area of the module board is used for the capacitor and more area of the module board can be used for other component. - The coaxial via hole of the invention can be used not only in the via hole on the module board but also the
adapter 1112 and theIC socket 1108 so that theadapter 1112 and theIC socket 1108 can have the advantages of more area for other components. - FIG. 14 is the cross section of a conventional connector. The connector in FIG. 14 includes a
male connector 1402 and afemale connector 1404. Thepin 1406 of themale connector 1402 is inserted into thecontact 1408 of thefemale connector 1404. Thecontact 1408 fixes theconnector 1404 at thePCB 1410. Thescrew 1412 can fix theconnector 1404 and thePCB 1410 together. - FIG. 15 is the top view of the preferred pin assignment for a high frequency circuit. Symbol S represents signal pin of the
connector 1402, which outputs signals; symbol G represents grounded pin of theconnector 1402. Signal pins S are designed to be surrounded by grounded pins G so that noise can be isolated from the signal pins and higher signal quality can be obtained. However, the grounded pins. G occupy large area of the connector, which is against the goal of size minimization. - FIG. 16 is the cross section of a connector having the coaxial via hole structure according to a preferred embodiment of the invention. The
connector 1604 includes acontact 1608 of acapacitor 1606 having a coaxial via hole structure according to a preferred embodiment of the invention andcontacts holes screw 1628 connects thenegative power source 1630 and thenegative power source 1632 together. Thecontact 1626 is connected to the grounded pin of theconnector 1602, so thecontact 1626 does not need to configure as the coaxial via hole of the invention in order to have the function of signal shielding. Thecontact 1608 is connected to the power pin of theconnector 1602 and thepositive power source 1634. To keep the voltage steady, theconnect 1608 is also connected to thecapacitor 1606. The outer cylinder-shapedconductor 1636 of thecapacitor 1606 is connected to thenegative power source 1632 and the inner cylinder-shapedconductor 1638 of thecapacitor 1606 is connected to thepositive power source 1634 along thecontact 1608. An insulatingfill 1640 with high dielectric constant is between the inner cylinder-shapedconductor 1638 and the outer cylinder-shapedconductor 1636. The outer cylinder-shaped conductors, such as theconductor 1642, of the coaxial viaholes negative power source 1632 in order to have the function of signal shielding. Thus, thecontacts connector 1602 and the connect number of theconnector 1604 are both reduced and the area which theconnector 1602 and theconnector 1604 occupy are greatly reduced. - The coaxial via hole of the invention can also be applied in an IC socket, to which an IC with a number of pins are fixed. The structure is as shown in FIG. 16.
- Further more, the insulating fill of the coaxial via hole structure of the invention can be replaced by an electrical-resistant material to form a resistor. Desired resistance can be obtained by choosing electrical-resistant material with different resistivity, modifying the diameters or the depth of the via hole. That is because the resistance is in proportion to the resistivity and length of the material and is in inverse proportion to the cross sectional area of the material. Please refer to FIG. 17, which shows a resistor having the coaxial via hole structure according to a preferred embodiment of the invention. The resistor with the coaxial via hole structure of the invention penetrates through the
substrate 1704. The inner cylinder-shapedconductor 1712 is connected to theconductive trace 1708. Theconductive trace 1708 is further connected to the signal trace, the positive voltage source or the negative voltage source. The outer cylinder-shapedconductor 1714 is connected to theconductive trace 1710. Theconductive trace 1710 is further connected to the signal trace, the positive voltage source or the negative voltage source. The electrical-resistant material 1716 is between the inner cylinder-shapedconductor 1712 and the outer cylinder-shapedconductor 1714. The insulatingfill 1718 and the insulatingfill 1720 separates the inner cylinder-shapedconductor 1724 and the outer cylinder-shapedconductor 1714. The resistor has the same function with discrete resistor component. Each cylinder-shapedconductor conductor 1714 is connected to the signal net through theconductive trace 1710 and the inner cylinder-shapedconductor 1712 is connected to the negativevoltage source conductor 1708. The resistor in circuit would be a pull up resistor, while the inner cylinder-shapedconductor 1712 is connected to the positive voltage source through theconductor 1708. The resistor would be a terminator, while the inner cylinder-shapedconductor 1712 is connected to the signal net through theconductor 1708. More over, the resistor with the coaxial via hole structure according to a preferred embodiment of the invention can also be applied in PCB, substrate, IC socket, adapter, connector, heat sink of other carrier so that the objective of using less area can be achieved. - Herein, a carrier with a
substrate 1704 is taken as an example to illustrate the manufacturing process of a coaxial via hole as a resistor. First, ahole 1722 is formed through thesubstrate 1704. The interior of thehole 1722 is then set to become conduct electricity to form an outer cylinder-shapedconductor 1714. The interior of the outer cylinder-shapedconductor 1714 is then formed with a resistant material to form aresistant fill 1716. Anotherhole 1724 with smaller diameter than thehole 1722 is then formed to penetrate through theresistant layer 1716. The interior of thehole 1724 is then set to become conduct electricity to form a inner cylinder-shapedconductor 1712. - The capacitor with the coaxial via hole structure according to a preferred embodiment of the invention has the following advantages superior to the conventional SMD capacitor.
- (1) The capacitor with the coaxial via hole structure occupies much less surface area than the conventional SMD capacitor.
- (2) The capacitor with the coaxial via hole structure of the invention can be used in inner layers of a PCB but the SMD capacitor can be only used on the surface layers of PCB.
- (3) The capacitor with the coaxial via hole structure of the invention can be built in the substrate but the SMD capacitor can not be applied inside the multi-layer substrate.
- (4) The capacitor with the coaxial via hole structure of the invention is more suitable for the high frequency circuit than the conventional SMD capacitor; and the capacitor of the invention can also function as signal shielding.
- The resistor with the coaxial via hole structure according to a preferred embodiment of the invention has the following advantages prior to the conventional SMD resistor.
- (1) The resistor with the coaxial via hole structure occupies much less surface area than the conventional SMD resistor.
- (2) The resistor with the coaxial via hole structure of the invention can be used in inner layers of a PCB but the SMD resistor can be only used on the surface layers of PCB.
- (3) The resistor with the coaxial via hole structure of the invention can be buried in the substrate but the SMD resistor can not be applied inside the multi-layer substrate.
- (4) The resistor with the coaxial via hole structure of the invention effectively shortens the trace path and reduces signal loss and delay, which is superior to the conventional SMD resistor in terms of electrical characteristics.
- To sum up, the capacitor or resistor with the via hole structure of the invention has the advantages of occupying much less surface of the substrate or intra-layer surface, being able to be built in the substrate or other carrier without extra discrete capacitor, resistor and the cost thereof, and also functioning as signal shielding.
- While the invention has been described by way of example and in terms of the preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment. To the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims (50)
1. A coaxial via hole used in a carrier, comprising:
an outer cylinder-shaped conductor extending along a first direction;
an inner cylinder-shaped conductor in the outer cylinder-shaped conductor, wherein the inner cylinder-shaped conductor extends along the first direction; and
an insulating fill between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.
2. The coaxial via hole as claimed in claim 1 , wherein the first direction is vertical to a direction along which the carrier extends.
3. The coaxial via hole as claimed in claim 1 , wherein the carrier is a printed circuit board (PCB).
4. The coaxial via hole as claimed in claim 1 , wherein the carrier is a substrate.
5. The coaxial via hole as claimed in claim 1 , wherein the carrier is an Integrated Circuit (IC) socket.
6. The coaxial via hole as claimed in claim 1 , wherein the carrier is an adapter.
7. The coaxial via hole as claimed in claim 1 , wherein the carrier is a connector.
8. The coaxial via hole as claimed in claim 1 , wherein the carrier is a heat sink.
9. The coaxial via hole as claimed in claim 1 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates a portion of the carrier.
10. The coaxial via hole as claimed in claim 1 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates the carrier.
11. The coaxial via hole as claimed in claim 1 , wherein a cross section, in a direction vertical to the first direction, of the outer cylinder-shaped conductor can shape as any configuration and wherein a cross section, in the direction vertical to the first direction, of the inner cylinder-shaped conductor can shape as any configuration.
12. The coaxial via hole as claimed in claim 1 , the inner cylinder-shaped conductor is connected to a negative voltage source.
13. The coaxial via hole as claimed in claim 1 , the inner cylinder-shaped conductor is connected to a positive voltage source.
14. The coaxial via hole as claimed in claim 1 , the inner cylinder-shaped conductor is connected to a signal conductor.
15. The coaxial via hole as claimed in claim 1 , the outer cylinder-shaped conductor is connected to a negative voltage source.
16. The coaxial via hole as claimed in claim 1 , the outer cylinder-shaped conductor is connected to a positive voltage source.
17. The coaxial via hole as claimed in claim 1 , the outer cylinder-shaped conductor is connected to a signal conductor.
18. The coaxial via hole as claimed in claim 1 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a negative voltage source.
19. The coaxial via hole as claimed in claim 1 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a positive voltage source.
20. The coaxial via hole as claimed in claim 1 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a signal conductor.
21. The coaxial via hole as claimed in claim 1 , further comprising
a conductor which is connected to the outer cylinder-shaped conductor and is connected to a negative voltage source .
22. The coaxial via hole as claimed in claim 1 , further comprising
a conductor which is connected to the outer cylinder-shaped conductor and is connected to a positive voltage source.
23. The coaxial via hole as claimed in claim 1 , further comprising
a conductor which is connected to the outer cylinder-shaped conductor and is connected to a signal conductor.
24. The coaxial via hole as claimed in claim 1 , wherein the insulating fill is made of a material with high dielectric constant.
25. A method of manufacturing a coaxial via hole, comprising:
(a) forming a first hole in a carrier;
(b) making the interior of the first hole conduct electricity to form an outer cylinder-shaped conductor;
(c) placing an insulating material in the outer cylinder-shaped conductor to form an insulating fill;
(d) forming a second hole in the insulating fill, wherein the second hole has a diameter smaller than the diameter of the first hole; and
(e) making the interior of the second hole conduct electricity to form an inner cylinder-shaped conductor.
26. The method of manufacturing a coaxial via hole as claimed in claim 25 , wherein in said step (b), making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor by plating.
27. The method of manufacturing a coaxial via hole as claimed in claim 25 or 26, wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by plating.
28. The method of manufacturing a coaxial via hole as claimed in claim 25 or 26, wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by placing conductive paste.
29. The method of manufacturing a coaxial via hole as claimed in claim 25 , wherein in said step (c), the insulating material is filled in the outer cylinder-shaped conductor by plugging.
30. The method of manufacturing a coaxial via hole as claimed in claim 25 , wherein in said step (c), the insulating material is filled in the outer cylinder-shaped conductor by laminating.
31. A coaxial via hole used in a carrier, comprising:
an outer cylinder-shaped conductor extending along a first direction;
an inner cylinder-shaped conductor in the outer cylinder-shaped conductor, wherein the inner cylinder-shaped conductor extends along the first direction; and
an electrical-resistant fill between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.
32. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the outer cylinder-shaped conductor and is connected to a signal conductor.
33. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the outer cylinder-shaped conductor and is connected to positive voltage source.
34. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the outer cylinder-shaped conductor and is connected to a negative source.
35. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a signal conductor.
36. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a positive voltage source.
37. The coaxial via hole as claimed in claim 31 , further comprising:
a conductor which is connected to the inner cylinder-shaped conductor and is connected to a negative voltage source.
38. The coaxial via hole as claimed in claim 31 , wherein the carrier is a PCB.
39. The coaxial via hole as claimed in claim 31 , wherein the carrier is a substrate.
40. The coaxial via hole as claimed in claim 31 , wherein the carrier is an IC socket.
41. The coaxial via hole as claimed in claim 31 , wherein the carrier is an adapter.
42. The coaxial via hole as claimed in claim 31 , wherein the carrier is a connector.
43. The coaxial via hole as claimed in claim 31 , wherein the carrier is a heat sink.
44. The coaxial via hole as claimed in claim 31 , wherein the first direction is vertical to a direction along which the carrier extends.
45. The coaxial via hole as claimed in claim 31 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates a portion of the carrier.
46. The coaxial via hole as claimed in claim 31 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates the carrier.
47. A method of manufacturing a coaxial via hole, comprising:
(a) forming a first hole in a carrier;
(b) making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor;
(c) placing an electrical-resistant material in the outer cylinder-shaped conductor to form an electrical-resistant fill;
(d) forming a second hole in the electrical-resistant region, wherein the second hole has a diameter smaller than the diameter of the first hole; and
(e) making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor.
48. The method of manufacturing a coaxial via hole as claimed in claim 47 , wherein in said step (b), making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor by plating.
49. The method of manufacturing a coaxial via hole as claimed in claim 47 or 48, wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by plating.
50. The method of manufacturing a coaxial via hole as claimed in claim 47 or 48, wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by placing conductive paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/762,482 US20040149490A1 (en) | 2000-08-11 | 2004-01-23 | Coaxial via hole and process of fabricating the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89116185 | 2000-08-11 | ||
TW089116185A TW525417B (en) | 2000-08-11 | 2000-08-11 | Composite through hole structure |
US09/809,310 US6717071B2 (en) | 2000-08-11 | 2001-03-16 | Coaxial via hole and process of fabricating the same |
US10/762,482 US20040149490A1 (en) | 2000-08-11 | 2004-01-23 | Coaxial via hole and process of fabricating the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/809,310 Division US6717071B2 (en) | 2000-08-11 | 2001-03-16 | Coaxial via hole and process of fabricating the same |
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US20040149490A1 true US20040149490A1 (en) | 2004-08-05 |
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US09/809,310 Expired - Lifetime US6717071B2 (en) | 2000-08-11 | 2001-03-16 | Coaxial via hole and process of fabricating the same |
US10/762,482 Abandoned US20040149490A1 (en) | 2000-08-11 | 2004-01-23 | Coaxial via hole and process of fabricating the same |
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Application Number | Title | Priority Date | Filing Date |
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US09/809,310 Expired - Lifetime US6717071B2 (en) | 2000-08-11 | 2001-03-16 | Coaxial via hole and process of fabricating the same |
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US20120091567A1 (en) * | 2009-03-13 | 2012-04-19 | Stats Chippac, Ltd. | Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVs in Peripheral Region of the Die |
US20120168960A1 (en) * | 2010-12-31 | 2012-07-05 | Samsung Electro-Mechanics Co., Ltd. | Multi chip package |
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Families Citing this family (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7870013B1 (en) * | 2001-06-29 | 2011-01-11 | Versata Development Group, Inc. | Automated system and method for managing goals |
TW556452B (en) * | 2003-01-30 | 2003-10-01 | Phoenix Prec Technology Corp | Integrated storage plate with embedded passive components and method for fabricating electronic device with the plate |
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WO2005036644A2 (en) * | 2003-10-10 | 2005-04-21 | Koninklijke Philips Electronics N.V. | Electronic device and carrier substrate |
US7253516B2 (en) * | 2003-10-10 | 2007-08-07 | Nxp B.V. | Electronic device and carrier substrate for same |
US7634328B2 (en) * | 2004-01-20 | 2009-12-15 | Masoud Medizade | Method, system and computer program product for monitoring and optimizing fluid extraction from geologic strata |
US7275316B2 (en) * | 2004-03-31 | 2007-10-02 | Intel Corporation | Method of embedding passive component within via |
US7310243B2 (en) * | 2004-06-10 | 2007-12-18 | International Business Machines Corporation | Method and components for implementing EMC shielded resonance damping |
US20050286238A1 (en) * | 2004-06-24 | 2005-12-29 | Joy Stephen C | Device and method of manufacture of an interconnection structure for printed circuit boards |
KR100856450B1 (en) * | 2004-07-06 | 2008-09-04 | 도쿄엘렉트론가부시키가이샤 | Method for manufacturing through substrate |
EP1775761A4 (en) * | 2004-07-06 | 2007-08-29 | Tokyo Electron Ltd | Through substrate and interposer, and method for manufacturing through substrate |
SG135065A1 (en) * | 2006-02-20 | 2007-09-28 | Micron Technology Inc | Conductive vias having two or more elements for providing communication between traces in different substrate planes, semiconductor device assemblies including such vias, and accompanying methods |
US7129567B2 (en) * | 2004-08-31 | 2006-10-31 | Micron Technology, Inc. | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
US7310036B2 (en) * | 2005-01-10 | 2007-12-18 | International Business Machines Corporation | Heat sink for integrated circuit devices |
US7538032B2 (en) * | 2005-06-23 | 2009-05-26 | Teledyne Scientific & Imaging, Llc | Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method |
CN101142860B (en) | 2005-03-23 | 2010-12-08 | 富士通株式会社 | Printed circuit board |
US7781886B2 (en) | 2005-06-14 | 2010-08-24 | John Trezza | Electronic chip contact structure |
US7786592B2 (en) | 2005-06-14 | 2010-08-31 | John Trezza | Chip capacitive coupling |
US7851348B2 (en) * | 2005-06-14 | 2010-12-14 | Abhay Misra | Routingless chip architecture |
US7838997B2 (en) * | 2005-06-14 | 2010-11-23 | John Trezza | Remote chip attachment |
US8456015B2 (en) * | 2005-06-14 | 2013-06-04 | Cufer Asset Ltd. L.L.C. | Triaxial through-chip connection |
US7560813B2 (en) | 2005-06-14 | 2009-07-14 | John Trezza | Chip-based thermo-stack |
US7534722B2 (en) * | 2005-06-14 | 2009-05-19 | John Trezza | Back-to-front via process |
US20060281303A1 (en) * | 2005-06-14 | 2006-12-14 | John Trezza | Tack & fuse chip bonding |
US7687400B2 (en) * | 2005-06-14 | 2010-03-30 | John Trezza | Side stacking apparatus and method |
US7521806B2 (en) * | 2005-06-14 | 2009-04-21 | John Trezza | Chip spanning connection |
US7767493B2 (en) * | 2005-06-14 | 2010-08-03 | John Trezza | Post & penetration interconnection |
US7989958B2 (en) * | 2005-06-14 | 2011-08-02 | Cufer Assett Ltd. L.L.C. | Patterned contact |
JP2007027451A (en) | 2005-07-19 | 2007-02-01 | Shinko Electric Ind Co Ltd | Circuit board and its manufacturing method |
US7633167B2 (en) * | 2005-09-29 | 2009-12-15 | Nec Electronics Corporation | Semiconductor device and method for manufacturing same |
US20070230150A1 (en) * | 2005-11-29 | 2007-10-04 | International Business Machines Corporation | Power supply structure for high power circuit packages |
US7404250B2 (en) * | 2005-12-02 | 2008-07-29 | Cisco Technology, Inc. | Method for fabricating a printed circuit board having a coaxial via |
US7470863B2 (en) * | 2006-01-24 | 2008-12-30 | International Business Machines Corporation | Microelectronic device with mixed dielectric |
US7687397B2 (en) | 2006-06-06 | 2010-03-30 | John Trezza | Front-end processed wafer having through-chip connections |
US20070281460A1 (en) * | 2006-06-06 | 2007-12-06 | Cubic Wafer, Inc. | Front-end processed wafer having through-chip connections |
US7781889B2 (en) * | 2006-06-29 | 2010-08-24 | Intel Corporation | Shielded via |
US7751205B2 (en) * | 2006-07-10 | 2010-07-06 | Ibiden Co., Ltd. | Package board integrated with power supply |
US7989915B2 (en) * | 2006-07-11 | 2011-08-02 | Teledyne Licensing, Llc | Vertical electrical device |
WO2008048925A2 (en) * | 2006-10-17 | 2008-04-24 | Cufer Asset Ltd. L.L.C. | Wafer via formation |
US8153906B2 (en) * | 2007-01-10 | 2012-04-10 | Hsu Hsiuan-Ju | Interconnection structure for improving signal integrity |
US8084695B2 (en) * | 2007-01-10 | 2011-12-27 | Hsu Hsiuan-Ju | Via structure for improving signal integrity |
US7670874B2 (en) * | 2007-02-16 | 2010-03-02 | John Trezza | Plated pillar package formation |
US8653625B2 (en) | 2007-03-14 | 2014-02-18 | Microntechnology, Inc. | Interposer structure with embedded capacitor structure, and methods of making same |
US20080245555A1 (en) * | 2007-04-04 | 2008-10-09 | Ati Technologies Ulc | Circuit substrate with plated through hole structure and method |
US7850060B2 (en) * | 2007-04-05 | 2010-12-14 | John Trezza | Heat cycle-able connection |
US7748116B2 (en) * | 2007-04-05 | 2010-07-06 | John Trezza | Mobile binding in an electronic connection |
US20080261392A1 (en) * | 2007-04-23 | 2008-10-23 | John Trezza | Conductive via formation |
US7960210B2 (en) * | 2007-04-23 | 2011-06-14 | Cufer Asset Ltd. L.L.C. | Ultra-thin chip packaging |
US7829462B2 (en) | 2007-05-03 | 2010-11-09 | Teledyne Licensing, Llc | Through-wafer vias |
KR100861619B1 (en) * | 2007-05-07 | 2008-10-07 | 삼성전기주식회사 | Radiant heat printed circuit board and fabricating method of the same |
US8669658B2 (en) * | 2007-07-24 | 2014-03-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Crosstalk-free WLCSP structure for high frequency application |
EP2071621A1 (en) * | 2007-12-11 | 2009-06-17 | ABB Research Ltd. | Semiconductor switching device with gate connection |
TWI373118B (en) | 2007-12-21 | 2012-09-21 | Ind Tech Res Inst | Through hole capacitor and method of manufacturing the same |
CN103177873A (en) * | 2007-12-28 | 2013-06-26 | 财团法人工业技术研究院 | Through-hole capacitor and manufacturing method thereof |
KR20090096174A (en) * | 2008-03-07 | 2009-09-10 | 주식회사 하이닉스반도체 | Circuit substrate and semiconductor package using the circuit substrate |
US20100001378A1 (en) * | 2008-07-01 | 2010-01-07 | Teledyne Scientific & Imaging, Llc | Through-substrate vias and method of fabricating same |
US8088667B2 (en) * | 2008-11-05 | 2012-01-03 | Teledyne Scientific & Imaging, Llc | Method of fabricating vertical capacitors in through-substrate vias |
US8107254B2 (en) * | 2008-11-20 | 2012-01-31 | International Business Machines Corporation | Integrating capacitors into vias of printed circuit boards |
US7906404B2 (en) | 2008-11-21 | 2011-03-15 | Teledyne Scientific & Imaging, Llc | Power distribution for CMOS circuits using in-substrate decoupling capacitors and back side metal layers |
US20100159193A1 (en) * | 2008-12-18 | 2010-06-24 | Palo Alto Research Center Incorporated | Combined electrical and fluidic interconnect via structure |
TWI393490B (en) | 2008-12-31 | 2013-04-11 | Ind Tech Res Inst | Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof |
JP2011049664A (en) * | 2009-08-25 | 2011-03-10 | Seiko Instruments Inc | Method for manufacturing package, method for manufacturing piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
US8242384B2 (en) | 2009-09-30 | 2012-08-14 | International Business Machines Corporation | Through hole-vias in multi-layer printed circuit boards |
US8432027B2 (en) * | 2009-11-11 | 2013-04-30 | International Business Machines Corporation | Integrated circuit die stacks with rotationally symmetric vias |
US8258619B2 (en) | 2009-11-12 | 2012-09-04 | International Business Machines Corporation | Integrated circuit die stacks with translationally compatible vias |
US8310841B2 (en) | 2009-11-12 | 2012-11-13 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same |
US8315068B2 (en) | 2009-11-12 | 2012-11-20 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same |
US9646947B2 (en) * | 2009-12-22 | 2017-05-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Integrated circuit with inductive bond wires |
US8487195B2 (en) * | 2010-03-04 | 2013-07-16 | Broadcom Corporation | Via structure for multi-gigahertz signaling |
US8693163B2 (en) * | 2010-09-01 | 2014-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cylindrical embedded capacitors |
JP2012174874A (en) * | 2011-02-21 | 2012-09-10 | Fujitsu Ltd | Manufacturing method of printed wiring board and the printed wiring board |
US8519515B2 (en) * | 2011-04-13 | 2013-08-27 | United Microlectronics Corp. | TSV structure and method for forming the same |
US8546243B2 (en) | 2011-05-24 | 2013-10-01 | International Business Machines Corporation | Dual contact trench resistor and capacitor in shallow trench isolation (STI) and methods of manufacture |
JP5788850B2 (en) * | 2012-09-27 | 2015-10-07 | 株式会社東芝 | Data analysis support device |
CN103731971A (en) * | 2012-10-12 | 2014-04-16 | 昆山华扬电子有限公司 | Shielding structure and method for PCB metal holes |
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US10111343B2 (en) * | 2013-11-19 | 2018-10-23 | Finisar Corporation | Method of forming micro via in printed circuit board |
TWI484876B (en) | 2013-12-20 | 2015-05-11 | Ind Tech Res Inst | Circuit board having via and manufacturing method thereof |
US9911689B2 (en) * | 2013-12-23 | 2018-03-06 | Intel Corporation | Through-body-via isolated coaxial capacitor and techniques for forming same |
US9384883B2 (en) | 2014-01-14 | 2016-07-05 | Qualcomm Incorporated | Nested through glass via transformer |
WO2015116093A1 (en) * | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Printed circuit board with co-axial vias |
US9741553B2 (en) | 2014-05-15 | 2017-08-22 | Excelitas Technologies Corp. | Elliptical and dual parabolic laser driven sealed beam lamps |
CN104093266B (en) * | 2014-07-24 | 2017-01-11 | 西华大学 | Impedance matching and signal shielding device used for printed circuit board via hole |
US9686862B2 (en) * | 2014-09-23 | 2017-06-20 | Finisar Corporation | Capacitors for multilayer printed circuit boards |
GB2531348B (en) * | 2014-10-17 | 2019-04-24 | Murata Manufacturing Co | Compact embedded isolation transformer device and method of making the same |
US9969001B2 (en) | 2014-12-10 | 2018-05-15 | Washington State University | Three-dimensional passive components |
US10008378B2 (en) | 2015-05-14 | 2018-06-26 | Excelitas Technologies Corp. | Laser driven sealed beam lamp with improved stability |
US10057973B2 (en) | 2015-05-14 | 2018-08-21 | Excelitas Technologies Corp. | Electrodeless single low power CW laser driven plasma lamp |
US9576785B2 (en) | 2015-05-14 | 2017-02-21 | Excelitas Technologies Corp. | Electrodeless single CW laser driven xenon lamp |
TWI576026B (en) | 2015-07-17 | 2017-03-21 | 財團法人工業技術研究院 | Circuit structure |
US10910329B2 (en) * | 2017-05-23 | 2021-02-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
TWI656172B (en) | 2017-09-18 | 2019-04-11 | 台燿科技股份有限公司 | Solvent-free resin composition and uses of the same |
US10109473B1 (en) | 2018-01-26 | 2018-10-23 | Excelitas Technologies Corp. | Mechanically sealed tube for laser sustained plasma lamp and production method for same |
TWI698484B (en) | 2018-10-12 | 2020-07-11 | 台燿科技股份有限公司 | Solvent-free resin composition and uses of the same |
KR102636487B1 (en) | 2018-10-26 | 2024-02-14 | 삼성전자주식회사 | Signal transfer line for a test equipment and an automatic test equipment for testing semiconductor devices using the same |
CN110444971B (en) * | 2019-08-14 | 2020-11-24 | 中国电子科技集团公司第十三研究所 | Micro-coaxial vertical interconnection structure and preparation method thereof |
US11304298B2 (en) * | 2020-09-02 | 2022-04-12 | Timothy Leigh LeClair | Coaxial thru-via conductor configurations in electronic packaging substrates |
US11785707B2 (en) * | 2021-01-21 | 2023-10-10 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof and electronic device |
US11792918B2 (en) | 2021-01-28 | 2023-10-17 | Unimicron Technology Corp. | Co-axial via structure |
US20220240375A1 (en) * | 2021-01-28 | 2022-07-28 | Unimicron Technology Corp. | Co-axial via structure and manufacturing method of the same |
CN115135000A (en) * | 2022-08-09 | 2022-09-30 | 生益电子股份有限公司 | Printed circuit board and preparation method |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
US4675788A (en) * | 1984-07-17 | 1987-06-23 | Schroff Gesellschaft Mit Beschrankter Haftung | Multi-layer circuit board |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
US5257452A (en) * | 1991-05-27 | 1993-11-02 | Hitachi, Ltd. | Methods of recovering a multi-layer printed circuit board |
US5374788A (en) * | 1992-10-09 | 1994-12-20 | International Business Machines Corporation | Printed wiring board and manufacturing method therefor |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
US5689091A (en) * | 1996-09-19 | 1997-11-18 | Vlsi Technology, Inc. | Multi-layer substrate structure |
US5834705A (en) * | 1994-03-04 | 1998-11-10 | Silicon Graphics, Inc. | Arrangement for modifying eletrical printed circuit boards |
US5949030A (en) * | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
US6353999B1 (en) * | 1999-03-09 | 2002-03-12 | Unimicron Taiwan Corp. | Method of making mechanical-laser structure |
US6365844B2 (en) * | 1997-08-20 | 2002-04-02 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
US6479764B1 (en) * | 2000-05-10 | 2002-11-12 | International Business Machines Corporation | Via structure with dual current path |
-
2000
- 2000-08-11 TW TW089116185A patent/TW525417B/en not_active IP Right Cessation
-
2001
- 2001-03-16 US US09/809,310 patent/US6717071B2/en not_active Expired - Lifetime
-
2004
- 2004-01-23 US US10/762,482 patent/US20040149490A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
US4675788A (en) * | 1984-07-17 | 1987-06-23 | Schroff Gesellschaft Mit Beschrankter Haftung | Multi-layer circuit board |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
US5257452A (en) * | 1991-05-27 | 1993-11-02 | Hitachi, Ltd. | Methods of recovering a multi-layer printed circuit board |
US5374788A (en) * | 1992-10-09 | 1994-12-20 | International Business Machines Corporation | Printed wiring board and manufacturing method therefor |
US5834705A (en) * | 1994-03-04 | 1998-11-10 | Silicon Graphics, Inc. | Arrangement for modifying eletrical printed circuit boards |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
US5689091A (en) * | 1996-09-19 | 1997-11-18 | Vlsi Technology, Inc. | Multi-layer substrate structure |
US6365844B2 (en) * | 1997-08-20 | 2002-04-02 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
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US20020017399A1 (en) | 2002-02-14 |
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