US20040207420A1 - Modularized probe card with coaxial transmitters - Google Patents
Modularized probe card with coaxial transmitters Download PDFInfo
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- US20040207420A1 US20040207420A1 US10/417,263 US41726303A US2004207420A1 US 20040207420 A1 US20040207420 A1 US 20040207420A1 US 41726303 A US41726303 A US 41726303A US 2004207420 A1 US2004207420 A1 US 2004207420A1
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- printed circuit
- circuit board
- coaxial
- connector
- probe card
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- 239000000523 sample Substances 0.000 title claims abstract description 76
- 239000004065 semiconductor Substances 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 20
- 238000005476 soldering Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Definitions
- the present invention relates to a probe card for testing semiconductor wafers and, more specifically, to a modularized probe card with coaxial transmitters.
- the test apparatus for chip probing usually comprises a probe card with a plurality of probe needles for contacting with electrodes, such as bond pads or bumps, of a wafer.
- a conventional improved probe card mainly comprises a substrate with a top and a bottom side. Both sides of the substrate are formed with a large ground plane and a plurality of contact points, wherein the ground plane is soldering with outer shields of coaxial cables to provide ground and shielding.
- the contact points provide electrical connections with a tester.
- the top side of the substrate is formed with a plurality of soldering points to solder a plurality of probe needles.
- a plurality of coaxial cables provide electrical connections between probe soldering points and contact points. The coaxial cable provides electrical connection respectively, therefore, it not only acquires more time in manufacturing rectangular probe card, but also comes up with the problem of improper connections or miss wiring between coaxial cables.
- a multipoint microwave coaxial probe card is disclosed.
- a printed circuit board has edge connectors and a mounting ring attached to the surface.
- the mounting ring has a plurality of holes, and each is assembled with a microwave connector.
- These microwave connectors electrically connect to probe needles by coaxial cables.
- a portion of the probe needles are joined to the edge connector by insulated wires allowing both high and low frequency signals to be utilized simultaneously.
- a shield in the form of a flat plate, with a cover encloses the ring and provides RFI and EMI shielding, and allows the coaxial probe card to test the microwave semiconductor wafers.
- non-modularized coaxial probe card is not easily to be detached and assembled, and therefore it is difficult to repair once malfunction occurs.
- a main purpose of the present invention is to supply a modularized probe card with coaxial transmitters.
- At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board.
- the whole probe card can be reused except the probe head.
- a second purpose of the present invention is to supply a modularized probe card with coaxial transmitters with both ends of each coaxial cable connecting to plug-in and pull-away type connectors. These connectors are used to collect and fasten coaxial cables of coaxial transmitters, and to electrically connect with the first and second printed circuit boards. This will eliminate the problem of improper connections for individual coaxial cables, and reduce the assembly time of a probe card.
- a third purpose of the present invention is to supply a modularized probe card with coaxial transmitters installing at least a coaxial cable.
- the coaxial cable is easily to be replaced with new one and thus to ensure that coaxial cable is always in good electrical function. Furthermore, miss wiring could be eliminated and it is easy to repair the probe card once malfunction occurs.
- the modularized probe card with coaxial transmitters comprises at least a coaxial transmitter, a first printed circuit board, a second printed circuit board, and a probe head.
- the coaxial transmitter is composed of a first connector, a second connector and a plurality of coaxial cables. It is modularized and installed between the first and the second printed circuit board, as a transmitting route for probing wafers.
- One ends of the coaxial cables are connected to the first connector, and correspondingly connected to the first connecting devices of first printed circuit board.
- the other ends of the coaxial cables are connected to the second connector, and correspondingly connected to the second connecting devices of second printed circuit board in a plug-in and pull-away type.
- the probe head is mounted and electrically connected to the second printed circuit board, and forming with a plurality of probes for contacting semiconductor wafers.
- FIG. 1 is a cross-sectional view of a modularized probe card with coaxial transmitters in accordance with the first embodiment of the present invention.
- FIG. 2 is a three-dimensional view of the coaxial transmitters in accordance with the first embodiment of the present invention.
- FIG. 3 is a partial amplification of the cross-sectional view of the probe card in accordance with the first embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a modularized probe card with coaxial transmitters in accordance with the second embodiment of the present invention.
- FIG. 5 is a three-dimensional view of the coaxial transmitters in accordance with the second embodiment of the present invention.
- a modularized probe card 100 is used for installing on a test head 170 , and electrically connects to a tester 180 , for electrical contact with semiconductor wafers under test.
- the probe card 100 comprises a first printed circuit board 110 , a second printed circuit board 120 , a probe head 130 , and at least a coaxial transmitter 140 .
- the first printed circuit board 110 is functioned as a connection interface between the test head 170 and the probe card 100 , and is able to connect to the tester 180 .
- a plurality of first connecting devices 111 are mounted on the first printed circuit board 110 to plug in the first connector 141 of coaxial transmitter 140 .
- the inner portion of first printed circuit board 110 has a plurality of circuits (not shown in figure) to provide electrical connections between the first connecting devices 111 and test head 170 .
- the second printed circuit board 120 is functioned as a transmission interface between probe head 130 and the first printed circuit board 110 .
- the second printed circuit board 120 has a plurality of second connecting devices 121 , such as vias and sockets, to plug in the second connector 143 of coaxial transmitter 140 .
- the second connecting devices 121 are vias.
- the arrangement density of the second connecting devices 121 on second printed circuit board 120 is higher than that of the first connecting devices 111 on first printed circuit board 110 .
- second connecting devices 121 are installed around the edge of probe head 130 , which connects to the second printed circuit board 120 .
- the second printed circuit board 120 be arranged with a slot 122 to place and fasten probe head 130 , which may be a silicon substrate or multi-layer ceramic substrate with a plurality of probing points 132 , such as probe needles or bumps, arranging on the surface 131 to contact with bond pads of semiconductor wafers. (not shown in figure).
- probe head 130 may be a silicon substrate or multi-layer ceramic substrate with a plurality of probing points 132 , such as probe needles or bumps, arranging on the surface 131 to contact with bond pads of semiconductor wafers. (not shown in figure).
- a plurality of contact pads 133 which electrically connecting to corresponding probing points 132 , are arranging on the edge of surface 131 of probe head 130 .
- the contact pads 133 are electrically connecting to the second connection devices 121 of second printed circuit board 120 with electrical connecting devices 150 .
- the electrical connecting devices 150 could be bonding wires or flexible printed circuit.
- the electrical connecting device 150 is a flexible printed circuit, mainly comprising a flexible insulation layer 151 , such as polyimide.
- a plurality of metal traces 152 are formed on one surface of the flexible insulation layer 151 for electrically connecting with contact pads 133 of probe head 130 and the second connecting devices 121 of the second printed circuit board 120 .
- the traces 152 on the flexible insulation layer 151 are shielded with a cover layer 153 to strengthen the structure of electrical connecting device 150 .
- a plurality of coaxial transmitters 140 are installed between the first printed circuit board 110 and the second printed circuit board 120 as a transmission route for probe card 100 while proceeding electrical testing.
- Each of coaxial transmitter 140 comprises a first connector 141 , a second connector 143 and a plurality of coaxial cables 145 .
- the first connector 141 or second connector 143 could be a plug-in connector.
- the coaxial cables 145 effectively prevent the signal interferences producing according to the Faraday's law, and completely obstructs cross-talk causing by over-density of circuits or high frequency testing.
- first connector 141 and the second connector 143 are shaping as curves, wherein one surface of first connector 141 is formed with a plurality of pins 142 , which correspondingly connect to coaxial cables 145 with one end fasten to the first connector 141 .
- the second connector 143 also has a plurality of pins 144 , which correspondingly connect to coaxial cables 145 with the other end fasten to the second connector 143 .
- pins 142 or pins 144 be arrayed in zigzag format to allow more of pins 142 and pins 144 be formed on surfaces of the first connector 141 and second connector 143 , and furthermore, the second connector 143 be connected to the second connecting devices 121 of second printed circuit board 120 in a plug-in and pull-away type (not connecting by soldering).
- first pins 142 of coaxial transmitters 140 are corresponding in location to the first connecting devices 111 of first printed circuit board 110
- the second connector 143 is corresponding in location to the second connecting devices 121 , of second printed circuit board 120 ; It is preferable that the first and second printed circuit board 110 , 120 be fastened by a shell 160 while testing semi-conductor wafers.
- Probe card 100 is assembled to have dual functions for testing semi-conductor wafers which have same electrical function yet with different pad distribution.
- the first printed circuit board 110 the second printed circuit board 120 and coaxial transmitters 140 are reusable, and only the probe head 130 corresponding in location to different semi-conductor wafers under test needs to be manufactured.
- the probe head 130 can be pulled away and plugged into the second printed circuit board 120 , and assembled with the first printed circuit board 110 and coaxial transmitter 140 as mentioned above, to produce a probe card for different semi-conductor wafers under test.
- the second connector 143 of coaxial transmitter 140 can be repeatedly pulled away and plugged into the second printed circuit board 120 which makes it more convenient in changing and repairing parts. Also, it does not need to connect coaxial cables one by one, which makes it more easily to assemble, and thus ensures that the coaxial transmitter 140 in correct electrical connection and no miss wiring.
- the coaxial transmitter 140 is modularly installed between the first and second printed circuit board 110 , 120 , and the first connector 141 and second connector 143 are utilized so as to acquire fast assembling. It also makes the repairing and assembling of probe card 100 more easily and quickly because it does not require to assemble individual coaxial cables 145 between the first printed circuit board 110 and second printed circuit board 120 . Furthermore, coaxial cables 145 are positioned by the first connector 141 and second connector 143 , therefore, improper connections or miss wiring between coaxial cables 145 will not occur.
- a modularized probe card 200 is installed on a test head 260 and electrically connecting to a tester 270 for electrically probing a semi-conductor wafer under test.
- Probe card 200 comprises a first printed circuit board 210 , a second printed circuit board 220 , a probe head 230 and at least a coaxial transmitter 240 .
- the first printed circuit board 210 is formed with a plurality of first connecting devices 211 for pluging into the first connector 241 of coaxial transmitter 240 , such as PTH type socket connectors.
- the second printed circuit board 220 is formed with a plurality of second connecting devices 221 , such as slots, for plugging into the second connector 243 of coaxial transmitter 240 .
- probe head 230 is a multi-layer ceramic wiring board connecting to the second printed circuit board through connecting pads 233 .
- a plurality of probing points 232 are arranged on a surface 231 of probe head 230 for probing bonding pads of a semiconductor wafer.
- a coaxial transmitter 240 is installed between the first printed circuit board 210 and second printed circuit board 220 , as an internal transmitting route for probe card 200 .
- the coaxial transmitter 240 comprises a first connector 241 , a second connector 243 and a plurality of coaxial cables 245 .
- the first connector 241 and second connector 243 are shaping as curves, wherein two ends of each coaxial cable 245 are combined with the first connector 241 and second connector 243 .
- the second connector 243 is configured for connecting with the second connecting device 221 of the second printed circuit board 220 in plug-in and pull-away type.
- probe card 200 While assembling probe card 200 , it is to install the first: connector 241 of coaxial transmitter 240 with the first connecting device 211 of first printed circuit board 210 , and to install the second connector 243 with the second connecting device 221 of second printed circuit board 220 . It is preferable that the first printed circuit board 210 and second printed circuit board 220 are fastened by a shell 250 , and then proceed to test semiconductor wafers.
- probe card 200 needs to test different semiconductor wafers with same electrical function yet different pad distribution, its first printed circuit board 210 and the second printed circuit board 220 and coaxial transmitter 240 are interchangeable, and only a probe head 230 corresponding in location to the semiconductor wafer under test needs to be assembled on the second printed circuit board 220 . Therefore, the parts of a modularized probe card are interchangeable and more flexible in assembling probe cards and can be reuse for probing different semiconductor wafers under test.
- coaxial transmitter 240 can be positioning and assembling quickly by the alignment of the first connector 241 and second connector 243 . Therefore, signal disturbances will not happen between electrical connections of the first printed circuit board 210 with second printed circuit board 220 , and neither will improper connections between coaxial cables 245 happen.
Abstract
Description
- The present invention relates to a probe card for testing semiconductor wafers and, more specifically, to a modularized probe card with coaxial transmitters.
- After fabrication, semiconductor devices will need to pass functional test to verify their electrical performance within design specification. The test apparatus for chip probing usually comprises a probe card with a plurality of probe needles for contacting with electrodes, such as bond pads or bumps, of a wafer.
- A conventional improved probe card mainly comprises a substrate with a top and a bottom side. Both sides of the substrate are formed with a large ground plane and a plurality of contact points, wherein the ground plane is soldering with outer shields of coaxial cables to provide ground and shielding. The contact points provide electrical connections with a tester. The top side of the substrate is formed with a plurality of soldering points to solder a plurality of probe needles. A plurality of coaxial cables provide electrical connections between probe soldering points and contact points. The coaxial cable provides electrical connection respectively, therefore, it not only acquires more time in manufacturing rectangular probe card, but also comes up with the problem of improper connections or miss wiring between coaxial cables.
- Furthermore, in U.S. Pat. No. 4,731,577 entitled “COAXIAL PROBE CARD”, a multipoint microwave coaxial probe card is disclosed. A printed circuit board has edge connectors and a mounting ring attached to the surface. The mounting ring has a plurality of holes, and each is assembled with a microwave connector. These microwave connectors electrically connect to probe needles by coaxial cables. A portion of the probe needles are joined to the edge connector by insulated wires allowing both high and low frequency signals to be utilized simultaneously. Furthermore, a shield in the form of a flat plate, with a cover, encloses the ring and provides RFI and EMI shielding, and allows the coaxial probe card to test the microwave semiconductor wafers. However, non-modularized coaxial probe card is not easily to be detached and assembled, and therefore it is difficult to repair once malfunction occurs.
- A main purpose of the present invention is to supply a modularized probe card with coaxial transmitters. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. When it requires to test another semiconductor devices with same electrical function yet different pad distribution, the whole probe card can be reused except the probe head. A new probe head corresponding to the semiconductor devices manufactured and assembled to the second printed circuit board to save the cost of manufacturing a new probe card.
- A second purpose of the present invention is to supply a modularized probe card with coaxial transmitters with both ends of each coaxial cable connecting to plug-in and pull-away type connectors. These connectors are used to collect and fasten coaxial cables of coaxial transmitters, and to electrically connect with the first and second printed circuit boards. This will eliminate the problem of improper connections for individual coaxial cables, and reduce the assembly time of a probe card.
- A third purpose of the present invention is to supply a modularized probe card with coaxial transmitters installing at least a coaxial cable. The coaxial cable is easily to be replaced with new one and thus to ensure that coaxial cable is always in good electrical function. Furthermore, miss wiring could be eliminated and it is easy to repair the probe card once malfunction occurs.
- The modularized probe card with coaxial transmitters according to the present invention comprises at least a coaxial transmitter, a first printed circuit board, a second printed circuit board, and a probe head. Wherein the coaxial transmitter is composed of a first connector, a second connector and a plurality of coaxial cables. It is modularized and installed between the first and the second printed circuit board, as a transmitting route for probing wafers. One ends of the coaxial cables are connected to the first connector, and correspondingly connected to the first connecting devices of first printed circuit board. The other ends of the coaxial cables are connected to the second connector, and correspondingly connected to the second connecting devices of second printed circuit board in a plug-in and pull-away type. The probe head is mounted and electrically connected to the second printed circuit board, and forming with a plurality of probes for contacting semiconductor wafers.
- FIG. 1 is a cross-sectional view of a modularized probe card with coaxial transmitters in accordance with the first embodiment of the present invention.
- FIG. 2 is a three-dimensional view of the coaxial transmitters in accordance with the first embodiment of the present invention.
- FIG. 3 is a partial amplification of the cross-sectional view of the probe card in accordance with the first embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a modularized probe card with coaxial transmitters in accordance with the second embodiment of the present invention.
- FIG. 5 is a three-dimensional view of the coaxial transmitters in accordance with the second embodiment of the present invention.
- Please refer to the drawings attached, the present invention will be described by means of an embodiment below.
- As shown in FIG. 1, in the first embodiment in accordance with present invention a
modularized probe card 100 is used for installing on atest head 170, and electrically connects to atester 180, for electrical contact with semiconductor wafers under test. Theprobe card 100 comprises a first printedcircuit board 110, a second printedcircuit board 120, aprobe head 130, and at least acoaxial transmitter 140. Wherein the firstprinted circuit board 110 is functioned as a connection interface between thetest head 170 and theprobe card 100, and is able to connect to thetester 180. A plurality of first connectingdevices 111, such as vias and connecting sockets, are mounted on the first printedcircuit board 110 to plug in thefirst connector 141 ofcoaxial transmitter 140. The inner portion of first printedcircuit board 110 has a plurality of circuits (not shown in figure) to provide electrical connections between the first connectingdevices 111 andtest head 170. The second printedcircuit board 120 is functioned as a transmission interface betweenprobe head 130 and the firstprinted circuit board 110. The second printedcircuit board 120 has a plurality of second connectingdevices 121, such as vias and sockets, to plug in thesecond connector 143 ofcoaxial transmitter 140. In this embodiment, the second connectingdevices 121 are vias. The arrangement density of the second connectingdevices 121 on second printedcircuit board 120 is higher than that of the first connectingdevices 111 on first printedcircuit board 110. Furthermore, second connectingdevices 121 are installed around the edge ofprobe head 130, which connects to the second printedcircuit board 120. It is preferable that the second printedcircuit board 120 be arranged with aslot 122 to place and fastenprobe head 130, which may be a silicon substrate or multi-layer ceramic substrate with a plurality ofprobing points 132, such as probe needles or bumps, arranging on thesurface 131 to contact with bond pads of semiconductor wafers. (not shown in figure). In this embodiment, as shown in FIG. 3, a plurality ofcontact pads 133, which electrically connecting tocorresponding probing points 132, are arranging on the edge ofsurface 131 ofprobe head 130. Furthermore, thecontact pads 133 are electrically connecting to thesecond connection devices 121 of second printedcircuit board 120 withelectrical connecting devices 150. Theelectrical connecting devices 150 could be bonding wires or flexible printed circuit. In this embodiment, theelectrical connecting device 150 is a flexible printed circuit, mainly comprising aflexible insulation layer 151, such as polyimide. A plurality ofmetal traces 152 are formed on one surface of theflexible insulation layer 151 for electrically connecting withcontact pads 133 ofprobe head 130 and the second connectingdevices 121 of the second printedcircuit board 120. Besides, thetraces 152 on theflexible insulation layer 151 are shielded with acover layer 153 to strengthen the structure ofelectrical connecting device 150. - In this embodiment, as shown in FIGS. 1 and 2, a plurality of
coaxial transmitters 140 are installed between the firstprinted circuit board 110 and the second printedcircuit board 120 as a transmission route forprobe card 100 while proceeding electrical testing. Each ofcoaxial transmitter 140 comprises afirst connector 141, asecond connector 143 and a plurality ofcoaxial cables 145. Thefirst connector 141 orsecond connector 143 could be a plug-in connector. Thecoaxial cables 145 effectively prevent the signal interferences producing according to the Faraday's law, and completely obstructs cross-talk causing by over-density of circuits or high frequency testing. In this embodiment, thefirst connector 141 and thesecond connector 143 are shaping as curves, wherein one surface offirst connector 141 is formed with a plurality ofpins 142, which correspondingly connect tocoaxial cables 145 with one end fasten to thefirst connector 141. Thesecond connector 143 also has a plurality ofpins 144, which correspondingly connect tocoaxial cables 145 with the other end fasten to thesecond connector 143. It is preferable that pins 142 orpins 144 be arrayed in zigzag format to allow more ofpins 142 and pins 144 be formed on surfaces of thefirst connector 141 andsecond connector 143, and furthermore, thesecond connector 143 be connected to the second connectingdevices 121 of second printedcircuit board 120 in a plug-in and pull-away type (not connecting by soldering). Whenprobe card 100 is assembled,first pins 142 ofcoaxial transmitters 140 are corresponding in location to the first connectingdevices 111 of first printedcircuit board 110, and thesecond connector 143 is corresponding in location to the second connectingdevices 121, of second printedcircuit board 120; It is preferable that the first and second printedcircuit board shell 160 while testing semi-conductor wafers. -
Probe card 100 is assembled to have dual functions for testing semi-conductor wafers which have same electrical function yet with different pad distribution. The first printedcircuit board 110 the second printedcircuit board 120 andcoaxial transmitters 140 are reusable, and only theprobe head 130 corresponding in location to different semi-conductor wafers under test needs to be manufactured. Theprobe head 130 can be pulled away and plugged into the second printedcircuit board 120, and assembled with the first printedcircuit board 110 andcoaxial transmitter 140 as mentioned above, to produce a probe card for different semi-conductor wafers under test. Therefore, its assembling parts are interchangeable and more flexible in assemble., Furthermore, thesecond connector 143 ofcoaxial transmitter 140 can be repeatedly pulled away and plugged into the second printedcircuit board 120 which makes it more convenient in changing and repairing parts. Also, it does not need to connect coaxial cables one by one, which makes it more easily to assemble, and thus ensures that thecoaxial transmitter 140 in correct electrical connection and no miss wiring. Thecoaxial transmitter 140 is modularly installed between the first and second printedcircuit board first connector 141 andsecond connector 143 are utilized so as to acquire fast assembling. It also makes the repairing and assembling ofprobe card 100 more easily and quickly because it does not require to assemble individualcoaxial cables 145 between the first printedcircuit board 110 and second printedcircuit board 120. Furthermore,coaxial cables 145 are positioned by thefirst connector 141 andsecond connector 143, therefore, improper connections or miss wiring betweencoaxial cables 145 will not occur. - The second embodiment in accordance with the present invention, as shown in FIG. 4, a
modularized probe card 200 is installed on atest head 260 and electrically connecting to atester 270 for electrically probing a semi-conductor wafer under test.Probe card 200 comprises a first printedcircuit board 210, a second printedcircuit board 220, aprobe head 230 and at least acoaxial transmitter 240. Wherein the first printedcircuit board 210 is formed with a plurality of first connectingdevices 211 for pluging into thefirst connector 241 ofcoaxial transmitter 240, such as PTH type socket connectors. The second printedcircuit board 220 is formed with a plurality of second connectingdevices 221, such as slots, for plugging into thesecond connector 243 ofcoaxial transmitter 240. In this embodiment,probe head 230 is a multi-layer ceramic wiring board connecting to the second printed circuit board through connectingpads 233. A plurality of probingpoints 232 are arranged on asurface 231 ofprobe head 230 for probing bonding pads of a semiconductor wafer. - In this embodiment, as shown in FIGS. 4 and 5, a
coaxial transmitter 240 is installed between the first printedcircuit board 210 and second printedcircuit board 220, as an internal transmitting route forprobe card 200. Thecoaxial transmitter 240 comprises afirst connector 241, asecond connector 243 and a plurality ofcoaxial cables 245. In this embodiment, thefirst connector 241 andsecond connector 243 are shaping as curves, wherein two ends of eachcoaxial cable 245 are combined with thefirst connector 241 andsecond connector 243. Thesecond connector 243 is configured for connecting with the second connectingdevice 221 of the second printedcircuit board 220 in plug-in and pull-away type. While assemblingprobe card 200, it is to install the first:connector 241 ofcoaxial transmitter 240 with the first connectingdevice 211 of first printedcircuit board 210, and to install thesecond connector 243 with the second connectingdevice 221 of second printedcircuit board 220. It is preferable that the first printedcircuit board 210 and second printedcircuit board 220 are fastened by ashell 250, and then proceed to test semiconductor wafers. Whenprobe card 200 needs to test different semiconductor wafers with same electrical function yet different pad distribution, its first printedcircuit board 210 and the second printedcircuit board 220 andcoaxial transmitter 240 are interchangeable, and only aprobe head 230 corresponding in location to the semiconductor wafer under test needs to be assembled on the second printedcircuit board 220. Therefore, the parts of a modularized probe card are interchangeable and more flexible in assembling probe cards and can be reuse for probing different semiconductor wafers under test. - Furthermore,
coaxial transmitter 240 can be positioning and assembling quickly by the alignment of thefirst connector 241 andsecond connector 243. Therefore, signal disturbances will not happen between electrical connections of the first printedcircuit board 210 with second printedcircuit board 220, and neither will improper connections betweencoaxial cables 245 happen. - The above description of embodiments of this invention is intended to be illustrative and not limiting. Other embodiments of this invention will be obvious to those skilled in the art in view of the above disclosure.
Claims (11)
Priority Applications (1)
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US10/417,263 US6812720B1 (en) | 2003-04-17 | 2003-04-17 | Modularized probe card with coaxial transmitters |
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US10/417,263 US6812720B1 (en) | 2003-04-17 | 2003-04-17 | Modularized probe card with coaxial transmitters |
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US20040207420A1 true US20040207420A1 (en) | 2004-10-21 |
US6812720B1 US6812720B1 (en) | 2004-11-02 |
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US20070182431A1 (en) * | 2006-02-03 | 2007-08-09 | Tokyo Electron Limited | Probe card and probe device |
US20100052710A1 (en) * | 2008-08-27 | 2010-03-04 | Cheng-Chin Ni | Probe Card |
EP3745142A1 (en) * | 2019-05-31 | 2020-12-02 | MPI Corporation | Probe card and switch module |
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TWI275812B (en) * | 2005-04-11 | 2007-03-11 | Asustek Comp Inc | Test converting card and test apparatus with test converting card |
KR100791000B1 (en) | 2006-10-31 | 2008-01-03 | 삼성전자주식회사 | Electrical test equipment for high speed test of wafer and testing method thereof |
US7652491B2 (en) * | 2006-11-17 | 2010-01-26 | Suss Microtec Test Systems Gmbh | Probe support with shield for the examination of test substrates under use of probe supports |
US8841931B2 (en) * | 2011-01-27 | 2014-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe card wiring structure |
TW201239365A (en) * | 2011-03-22 | 2012-10-01 | Mpi Corp | High frequency coupling signal adjustment manner and test device thereof |
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TWI665448B (en) * | 2018-07-13 | 2019-07-11 | 中華精測科技股份有限公司 | High frequency probe card device and signal transmission module thereof |
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US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3911361A (en) * | 1974-06-28 | 1975-10-07 | Ibm | Coaxial array space transformer |
US4733172A (en) * | 1986-03-08 | 1988-03-22 | Trw Inc. | Apparatus for testing I.C. chip |
US4731577A (en) * | 1987-03-05 | 1988-03-15 | Logan John K | Coaxial probe card |
US4795977A (en) * | 1987-03-19 | 1989-01-03 | Pacific Western Systems, Inc. | Interface system for interfacing a device tester to a device under test |
US4931726A (en) * | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
US5187431A (en) * | 1990-06-19 | 1993-02-16 | Sgs-Thomson Microelectronics S.R.L. | Universal multicontact connection between an ews probe card and a test card of a "test-on-wafer" station |
US5525911A (en) * | 1993-08-04 | 1996-06-11 | Tokyo Electron Limited | Vertical probe tester card with coaxial probes |
US5906511A (en) * | 1994-10-17 | 1999-05-25 | The Whitaker Corporation | Multi-position coaxial cable connector |
US6547593B1 (en) * | 2000-08-07 | 2003-04-15 | Gore Enterprise Holdings, Inc. | Sub-miniature, high speed coaxial pin interconnection system |
US6621710B1 (en) * | 2002-07-19 | 2003-09-16 | Chipmos Technologies (Bermuda) Ltd. | Modular probe card assembly |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070182431A1 (en) * | 2006-02-03 | 2007-08-09 | Tokyo Electron Limited | Probe card and probe device |
US7692435B2 (en) * | 2006-02-03 | 2010-04-06 | Tokyo Electron Limited | Probe card and probe device for inspection of a semiconductor device |
US20100052710A1 (en) * | 2008-08-27 | 2010-03-04 | Cheng-Chin Ni | Probe Card |
US7772861B2 (en) * | 2008-08-27 | 2010-08-10 | King Yuan Electronics Co., Ltd | Probe card |
EP3745142A1 (en) * | 2019-05-31 | 2020-12-02 | MPI Corporation | Probe card and switch module |
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US6812720B1 (en) | 2004-11-02 |
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