US20040262038A1 - Perimeter matrix ball grid array circuit package with a populated center - Google Patents

Perimeter matrix ball grid array circuit package with a populated center Download PDF

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Publication number
US20040262038A1
US20040262038A1 US09/925,835 US92583501A US2004262038A1 US 20040262038 A1 US20040262038 A1 US 20040262038A1 US 92583501 A US92583501 A US 92583501A US 2004262038 A1 US2004262038 A1 US 2004262038A1
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package
contact pads
substrate
array
integrated circuit
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Abandoned
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US09/925,835
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Michael Barrow
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Application filed by Individual filed Critical Individual
Priority to US09/925,835 priority Critical patent/US20040262038A1/en
Publication of US20040262038A1 publication Critical patent/US20040262038A1/en
Priority to US11/298,267 priority patent/US20060180345A1/en
Priority to US11/926,540 priority patent/US7543377B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Definitions

  • the present invention relates to an integrated circuit package.
  • Integrated circuits are typically mounted to a package that is soldered to a printed circuit board.
  • One such type of integrated circuit package is a ball grid array (“BGA”) package.
  • BGA packages have a plurality of solder balls located on a bottom external surface of a package substrate. The solder balls are reflowed to attach the package to the printed circuit board.
  • the integrated circuit is mounted to a top surface of the package substrate, and electrically coupled to the solder balls by internal routing within the package.
  • FIG. 1 shows a solder ball array of a prior art BGA package 2 .
  • the solder balls 4 are arranged in a two-dimensional pattern across the bottom surface of the package.
  • the integrated circuit 6 is centrally located on the opposite side of the package 2 .
  • the package 2 is typically constructed from a material which has a coefficient of thermal expansion that is different than the thermal expansion coefficient of the integrated circuit. It has been found that the differential thermal expansion between the integrated circuit and the package will induce temperature related stresses that fail solder joints in an area which corresponds to the outer edges of the circuit die.
  • FIG. 2 shows a BGA package 2 of the prior art which has an outer two dimensional array of solder balls 4 .
  • the solder balls 4 are located away from the package area that is beneath the integrated circuit 6 . Locating the solder balls 4 away from the integrated circuit 6 reduces the thermal stresses on the solder joints created by the differential expansion between the package and the integrated circuit. Although effective in reducing solder failure the outer array pattern limits the input/output (I/O) of the package. Additionally, the integrated circuit generates heat which conducts through the solder balls and into the printed circuit board. Locating the solder balls at the outer perimeter of the package increases the thermal path through the package substrate. The longer path increases the thermal impedance of the package and the junction temperature of the integrated circuit. It would be desirable provide a BGA package that has a longer product life, lower thermal impedance and higher I/O than BGA packages of the prior art.
  • the present invention is a ball grid array (“BGA”) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate.
  • the solder balls are typically reflowed to mount the package to a printed circuit board.
  • Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package.
  • the outer array of solder balls are located outside the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate.
  • the center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.
  • FIG. 1 is a bottom view of a ball grid array integrated circuit package of the prior art
  • FIG. 2 is a bottom view of a ball grid array integrated circuit package of the prior art
  • FIG. 3 is a side cross-sectional view of a ball grid array package of the present invention.
  • FIG. 4 is a bottom view of the package shown in FIG. 3;
  • FIG. 5 is a bottom view of an alternate ball grid array package.
  • FIGS. 3 and 4 shows a ball grid array (“BGA”) integrated circuit package 10 of the present invention.
  • the package 10 includes a substrate 12 that has a top surface 14 and an opposite bottom surface 16 . Mounted to the top surface 14 of the substrate 12 is an integrated circuit 16 .
  • the integrated circuit 18 is typically a microprocessor. Although a microprocessor is described, it is to be understood that the package 10 may contain any electrical device(s).
  • the top surface 14 of the substrate 12 has a plurality of bond pads 20 and a ground bus 22 .
  • the substrate 12 may also have a separate power bus 23 concentrically located about the integrated circuit 18 and ground pad 22 .
  • the integrated circuit 18 is coupled to the bond pads 20 and busses 22 and 23 by bond wires 24 .
  • the integrated circuit 16 is typically enclosed by an encapsulant 26 .
  • bond wires 24 are shown and described, the integrated circuit 18 can be mounted and coupled to the substrate with solder balls located on the bottom surface of the circuit die in a package and process commonly referred to as “C 4 ” or “flip chip” packaging.
  • the bottom surface 16 of the substrate 12 has a plurality of contact pads 28 .
  • the contact pads 28 are coupled to the bond pads 20 and busses 22 and 23 by vias 30 and internal routing 32 within the substrate 12 .
  • the substrate can be constructed with conventional printed circuit board, or co-fired ceramic, packaging processes known in the art.
  • solder balls 34 are attached to the contact pads 28 with known ball grid array processes.
  • the solder balls 34 are typically reflowed to attach the package 10 to a printed circuit board (not shown).
  • the contact pads 28 are arranged in an outer two-dimensional array 36 and a center two-dimensional array 38 .
  • Each array contains a plurality of contact pads 28 that are separated from each other by a number of dielectric spaces 40 .
  • the outer array 36 is separated from the center array 38 by a dielectric area 42 .
  • the outer array 38 is preferably located outside of the outer dimensional profile of the integrated circuit 18 . In this manner the solder joints of the outer array 38 are not subjected to stresses created by the difference in the coefficient of thermal expansion of the integrated circuit 18 and the expansion coefficient of the substrate 12 .
  • the center array 38 is located near the origin of the integrated circuit 16 in an area that does not undergo as much thermal expansion as the outer edges of the circuit die. Therefore the solder stresses created by the differential thermal expansion is minimal in the area of the center array 38 .
  • the separated arrays provide a pattern that minimizes the stresses on the solder joints.
  • the outer array 36 is typically coupled to the signal lines of the integrated circuit 16 .
  • the center array 38 is preferably coupled to the ground bus 20 and power bus 23 of the substrate 12 .
  • the vias 30 that couple the busses 22 and 23 to the center contact pads 38 provide a direct thermal path through the substrate. The direct path lowers the thermal impedance of the package 10 and the junction temperature of the integrated circuit 18 . Additionally, the short electrical path lowers the self-inductance and reduces the switching noise of the integrated circuit 18 .
  • the package 10 contains 292 contact pads 28 on a 27 by 27 millimeter (mm) wide substrate 12 , or 352 contact pads 28 on a 35 by 35 mm substrate 12 .
  • the dielectric space 40 between the contact pads 28 is typically 1.27 mm.
  • the package 10 typically has a height of approximately 2.5 mm.
  • the package 10 is assembled by attaching the solder balls 34 to the contact pads 28 .
  • the integrated circuit 18 is mounted and coupled to the substrate 12 .
  • the integrated circuit 18 is then enclosed by the encapsulant 26 .
  • the BGA package 10 is typically shipped to an end user that mounts the package 10 to a printed circuit board by reflowing the solder balls 34 .
  • FIG. 5 shows an alternate embodiment of a package 10 ′ which has five or six rows of contact pads 28 in the outer array 36 ′ of the substrate 12 ′.
  • the additional pads 28 increase the input/output (I/O) of the package 10 .
  • the outer array 36 ′ is preferably outside the outer dimensional profile of the integrated circuit 18 to minimize the stresses on the solder joints.
  • the package 10 ′ may provide 324 contact pads 28 on a 27 by 27 mm substrate 10 .
  • the longer rows of the package 60 provide the approximate I/O of a 35 by 35 mm package, within the footprint of a 27 by 27 mm package.

Abstract

A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to an integrated circuit package. [0002]
  • 2. Description of Related Art [0003]
  • Integrated circuits are typically mounted to a package that is soldered to a printed circuit board. One such type of integrated circuit package is a ball grid array (“BGA”) package. BGA packages have a plurality of solder balls located on a bottom external surface of a package substrate. The solder balls are reflowed to attach the package to the printed circuit board. The integrated circuit is mounted to a top surface of the package substrate, and electrically coupled to the solder balls by internal routing within the package. [0004]
  • FIG. 1 shows a solder ball array of a prior [0005] art BGA package 2. The solder balls 4 are arranged in a two-dimensional pattern across the bottom surface of the package. The integrated circuit 6 is centrally located on the opposite side of the package 2. The package 2 is typically constructed from a material which has a coefficient of thermal expansion that is different than the thermal expansion coefficient of the integrated circuit. It has been found that the differential thermal expansion between the integrated circuit and the package will induce temperature related stresses that fail solder joints in an area which corresponds to the outer edges of the circuit die.
  • FIG. 2 shows a [0006] BGA package 2 of the prior art which has an outer two dimensional array of solder balls 4. The solder balls 4 are located away from the package area that is beneath the integrated circuit 6. Locating the solder balls 4 away from the integrated circuit 6 reduces the thermal stresses on the solder joints created by the differential expansion between the package and the integrated circuit. Although effective in reducing solder failure the outer array pattern limits the input/output (I/O) of the package. Additionally, the integrated circuit generates heat which conducts through the solder balls and into the printed circuit board. Locating the solder balls at the outer perimeter of the package increases the thermal path through the package substrate. The longer path increases the thermal impedance of the package and the junction temperature of the integrated circuit. It would be desirable provide a BGA package that has a longer product life, lower thermal impedance and higher I/O than BGA packages of the prior art.
    • SUMMARY OF THE INVENTION
  • The present invention is a ball grid array (“BGA”) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located outside the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board. [0007]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, wherein: [0008]
  • FIG. 1 is a bottom view of a ball grid array integrated circuit package of the prior art; [0009]
  • FIG. 2 is a bottom view of a ball grid array integrated circuit package of the prior art; [0010]
  • FIG. 3 is a side cross-sectional view of a ball grid array package of the present invention; [0011]
  • FIG. 4 is a bottom view of the package shown in FIG. 3; [0012]
  • FIG. 5 is a bottom view of an alternate ball grid array package. [0013]
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to the drawings more particularly by reference numbers, FIGS. 3 and 4 shows a ball grid array (“BGA”) [0014] integrated circuit package 10 of the present invention. The package 10 includes a substrate 12 that has a top surface 14 and an opposite bottom surface 16. Mounted to the top surface 14 of the substrate 12 is an integrated circuit 16. The integrated circuit 18 is typically a microprocessor. Although a microprocessor is described, it is to be understood that the package 10 may contain any electrical device(s).
  • The [0015] top surface 14 of the substrate 12 has a plurality of bond pads 20 and a ground bus 22. The substrate 12 may also have a separate power bus 23 concentrically located about the integrated circuit 18 and ground pad 22. The integrated circuit 18 is coupled to the bond pads 20 and busses 22 and 23 by bond wires 24. The integrated circuit 16 is typically enclosed by an encapsulant 26. Although bond wires 24 are shown and described, the integrated circuit 18 can be mounted and coupled to the substrate with solder balls located on the bottom surface of the circuit die in a package and process commonly referred to as “C4” or “flip chip” packaging.
  • The [0016] bottom surface 16 of the substrate 12 has a plurality of contact pads 28. The contact pads 28 are coupled to the bond pads 20 and busses 22 and 23 by vias 30 and internal routing 32 within the substrate 12. The substrate can be constructed with conventional printed circuit board, or co-fired ceramic, packaging processes known in the art.
  • A plurality of [0017] solder balls 34 are attached to the contact pads 28 with known ball grid array processes. The solder balls 34 are typically reflowed to attach the package 10 to a printed circuit board (not shown).
  • The [0018] contact pads 28 are arranged in an outer two-dimensional array 36 and a center two-dimensional array 38. Each array contains a plurality of contact pads 28 that are separated from each other by a number of dielectric spaces 40. The outer array 36 is separated from the center array 38 by a dielectric area 42. The outer array 38 is preferably located outside of the outer dimensional profile of the integrated circuit 18. In this manner the solder joints of the outer array 38 are not subjected to stresses created by the difference in the coefficient of thermal expansion of the integrated circuit 18 and the expansion coefficient of the substrate 12. The center array 38 is located near the origin of the integrated circuit 16 in an area that does not undergo as much thermal expansion as the outer edges of the circuit die. Therefore the solder stresses created by the differential thermal expansion is minimal in the area of the center array 38. The separated arrays provide a pattern that minimizes the stresses on the solder joints.
  • The [0019] outer array 36 is typically coupled to the signal lines of the integrated circuit 16. The center array 38 is preferably coupled to the ground bus 20 and power bus 23 of the substrate 12. The vias 30 that couple the busses 22 and 23 to the center contact pads 38 provide a direct thermal path through the substrate. The direct path lowers the thermal impedance of the package 10 and the junction temperature of the integrated circuit 18. Additionally, the short electrical path lowers the self-inductance and reduces the switching noise of the integrated circuit 18.
  • In the preferred embodiment, the [0020] package 10 contains 292 contact pads 28 on a 27 by 27 millimeter (mm) wide substrate 12, or 352 contact pads 28 on a 35 by 35 mm substrate 12. The dielectric space 40 between the contact pads 28 is typically 1.27 mm. The package 10 typically has a height of approximately 2.5 mm.
  • The [0021] package 10 is assembled by attaching the solder balls 34 to the contact pads 28. The integrated circuit 18 is mounted and coupled to the substrate 12. The integrated circuit 18 is then enclosed by the encapsulant 26. The BGA package 10 is typically shipped to an end user that mounts the package 10 to a printed circuit board by reflowing the solder balls 34.
  • FIG. 5 shows an alternate embodiment of a [0022] package 10′ which has five or six rows of contact pads 28 in the outer array 36′ of the substrate 12′. The additional pads 28 increase the input/output (I/O) of the package 10. The outer array 36′ is preferably outside the outer dimensional profile of the integrated circuit 18 to minimize the stresses on the solder joints. The package 10′ may provide 324 contact pads 28 on a 27 by 27 mm substrate 10. The longer rows of the package 60 provide the approximate I/O of a 35 by 35 mm package, within the footprint of a 27 by 27 mm package.
  • While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that this invention not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art. [0023]

Claims (16)

What is claimed is:
1. A ball grid array package, comprising:
a substrate which has a top surface and an opposite bottom surface, said bottom surface having an outer array of contact pads each separated from each other by a first distance, and a center array of contact pads each separated from each other by a second distance, said center array of contact pads being separated from said outer array of contact pads by a third distance which is larger than the first and second distances; and,
a plurality of solder balls attached to said contact pads of said substrate.
2. The package as recited in claim 1, wherein said top surface of said substrate has a plurality of bond pads.
3. The package as recited in claim 2, wherein said top surface of said substrate has a ground bus that is connected to said center array of contact pads by a plurality of vias that extend through said substrate.
4. The package as recited in claim 3, wherein said outer array of contact pads has at least five rows of contact pads.
5. The package as recited in claim 4, wherein said top surface of said substrate has a power bus that is connected to said center array of contact pads by a plurality of vias that extend through said substrate.
6. The package as recited in claim 5, wherein said center array of contact pads is arranged in a four by four matrix.
7. A ball grid array integrated circuit package, comprising:
a substrate which has a top surface and an opposite bottom surface, said top surface having a plurality of bond pads, said bottom surface having an outer array of contact pads each separated from each other by a first distance, and a center array of contact pads each separated from each other by a second distance, said center array of contact pads being separated from said outer array of contact pads by a third distance which is larger than the first and second distances;
a plurality of solder balls attached to said contact pads of said substrate; and,
an integrated circuit that is mounted to said substrate and coupled to said bond pads.
8. The package as recited in claim 7, wherein said top surface of said substrate has a ground bus that is coupled to said integrated circuit and connected to said center array of contact pads by a plurality of vias that extend through said substrate.
9. The package as recited in claim 8, wherein said outer array of contact pads has at least five rows of contact pads.
10. The package as recited in claim 9, wherein said top surface of said substrate has a power bus that is connected to said center array of contact pads by a plurality of vias that extend through said substrate.
11. The package as recited in claim 10, wherein said center array of contact pads is arranged in a four by four matrix.
12. The package as recited in claim 11, wherein said integrated circuit is enclosed by an encapsulant.
13. The package as recited in claim 7, wherein said outer array of contact pads is located outside an outer dimensional profile of said integrated circuit.
14. A method for assembling a ball grid array integrated circuit package, comprising the steps of:
a) providing a substrate which has a top surface and an opposite bottom surface, said bottom surface having an outer array of contact pads each separated from each other by a first distance, and a center array of contact pads each separated from each other by a second distance, said center array of contact pads being separated from said outer array of contact pads by a third distance which is larger than the first and second distances;
b) mounting an integrated circuit to said top surface of said substrate; and,
c) attaching a plurality of said solder balls to said contact pads.
15. The method as recited in claim 14, further comprising the step of encapsulating said integrated circuit.
16. The method as recited in claim 15, further comprising the step of coupling said integrated circuit to said substrate with a plurality of bond wires.
US09/925,835 1996-03-28 2001-08-07 Perimeter matrix ball grid array circuit package with a populated center Abandoned US20040262038A1 (en)

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US09/925,835 US20040262038A1 (en) 1996-03-28 2001-08-07 Perimeter matrix ball grid array circuit package with a populated center
US11/298,267 US20060180345A1 (en) 1996-03-28 2005-12-09 Perimeter matrix ball grid array circuit package with a populated center
US11/926,540 US7543377B2 (en) 1996-03-28 2007-10-29 Perimeter matrix ball grid array circuit package with a populated center

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US62335596A 1996-03-28 1996-03-28
US08/959,546 US5894410A (en) 1996-03-28 1997-10-24 Perimeter matrix ball grid array circuit package with a populated center
US09/274,430 US6747362B2 (en) 1996-03-28 1999-03-22 Perimeter matrix ball grid array circuit package with a populated center
US09/925,835 US20040262038A1 (en) 1996-03-28 2001-08-07 Perimeter matrix ball grid array circuit package with a populated center

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US11/298,267 Continuation US20060180345A1 (en) 1996-03-28 2005-12-09 Perimeter matrix ball grid array circuit package with a populated center
US11/926,540 Continuation US7543377B2 (en) 1996-03-28 2007-10-29 Perimeter matrix ball grid array circuit package with a populated center

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US20040262038A1 true US20040262038A1 (en) 2004-12-30

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US09/274,430 Expired - Lifetime US6747362B2 (en) 1996-03-28 1999-03-22 Perimeter matrix ball grid array circuit package with a populated center
US09/925,835 Abandoned US20040262038A1 (en) 1996-03-28 2001-08-07 Perimeter matrix ball grid array circuit package with a populated center
US11/298,267 Abandoned US20060180345A1 (en) 1996-03-28 2005-12-09 Perimeter matrix ball grid array circuit package with a populated center
US11/926,540 Expired - Fee Related US7543377B2 (en) 1996-03-28 2007-10-29 Perimeter matrix ball grid array circuit package with a populated center

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US09/274,430 Expired - Lifetime US6747362B2 (en) 1996-03-28 1999-03-22 Perimeter matrix ball grid array circuit package with a populated center

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US11/926,540 Expired - Fee Related US7543377B2 (en) 1996-03-28 2007-10-29 Perimeter matrix ball grid array circuit package with a populated center

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EP0835600A4 (en) 2000-01-12
MY123146A (en) 2006-05-31
CN1112086C (en) 2003-06-18
JP2011160009A (en) 2011-08-18
JPH11506274A (en) 1999-06-02
EP1482773A1 (en) 2004-12-01
JP2014187410A (en) 2014-10-02
US20020057558A1 (en) 2002-05-16
US20060180345A1 (en) 2006-08-17
US7543377B2 (en) 2009-06-09
EP0835600B1 (en) 2005-01-05
AU2070197A (en) 1997-10-17
EP0835600A1 (en) 1998-04-15
DE69732166D1 (en) 2005-02-10
IL122107A (en) 2003-10-31
JP2008252152A (en) 2008-10-16
DE69732166T2 (en) 2005-12-15
KR19990014736A (en) 1999-02-25
IL122107A0 (en) 1998-04-05
KR100288065B1 (en) 2001-05-02
US20080064138A1 (en) 2008-03-13
CN1185892A (en) 1998-06-24
US5894410A (en) 1999-04-13
WO1997036466A1 (en) 1997-10-02
US6747362B2 (en) 2004-06-08
JP5247281B2 (en) 2013-07-24

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