US20050178668A1 - Method for depositing nickel- and chromium (VI) -free metal matte layers - Google Patents
Method for depositing nickel- and chromium (VI) -free metal matte layers Download PDFInfo
- Publication number
- US20050178668A1 US20050178668A1 US10/994,537 US99453704A US2005178668A1 US 20050178668 A1 US20050178668 A1 US 20050178668A1 US 99453704 A US99453704 A US 99453704A US 2005178668 A1 US2005178668 A1 US 2005178668A1
- Authority
- US
- United States
- Prior art keywords
- layer
- matte
- electrolyte
- chromium
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/343—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the present invention relates generally to a method for depositing nickel- and chromium(VI)-free metal matte layers on substrates.
- Metal matte layers are used for functional or decorative surface refinement in various areas.
- surfaces are coated with appropriate matte layers for aesthetic reasons.
- surfaces are often equipped with matte layers for decorative reasons.
- the matte layers previously known in the state of the art are deposited from nickel-containing electrolytes, mostly chromium(VI)-containing electrolytes, and form a cover layer containing nickel.
- chromium(VI) is not detectable in the end layer with a careful operation, in particular, when rinsing after chrome-plating, there is some concern about layers which have been deposited from such electrolytes.
- Nickel can lead to allergenic reactions with intensive skin contact or with the intake of nickel traces via foods. In the case of jewelry, it is precisely close skin contact and the nickel desorption promoted by sweat and moisture which lead to strong skin irritations. In the case of household appliances and food preparation facilities or apparatuses, contacting food with matte surfaces may, under certain circumstances, lead to the dissolving out of nickel, since the chromium layer does not always sufficiently cover the underlying microstructural surface.
- the problem addressed by this invention is the provision of a method for the deposition of matte nickel- and chromium(VI)-free metal layers.
- the invention is directed to a method for depositing a matte layer free of nickel and chromium(VI) onto a substrate.
- the method comprises coating the substrate with a first matte metal layer that is free of nickel; and metallizing the first matte metal layer with a second metal layer that is free of nickel and chromium(VI), which assumes the matte effect of the first matte metal layer.
- the first matte metal layer comprises at least one metal selected from the group consisting of copper, silver, tin, zinc, or an alloy that does not contain nickel.
- the second metal layer comprises at least one metal selected from the group consisting of copper, tin, zinc, chromium(III), silver, gold, ruthenium, platinum, palladium, or an alloy of these metals.
- the invention is also directed to a method for imparting a decorative matte finish to a surface of an article comprising coating the surface with a first matte layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, silver, zinc, and metal alloys, and b) is substantially nickel-free; and depositing a second matte layer over the first matte layer, which second matte layer is a layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, zinc, chromium, silver, gold, ruthenium, platinum, palladium, and metal alloys of the foregoing, b) is substantially free of nickel, c) is deposited from a composition which is substantially free of chromium (VI), and d) has a matte appearance.
- a first matte layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, silver, zinc, and metal alloys, and b) is substantially nickel-free; and depositing
- a method for the deposition of nickel- and chromium(VI)-free metal matte layers comprising the following steps:
- the term “matte” refers to a dull, non-glare, or pearl surface finish.
- matte copper layers as a first matte metal layer turns out to be particularly suitable with the method of the invention.
- Such copper layers are obtained with the method of galvanic or chemical metallization, known in the state of the art.
- a second metal layer assuming the matte effect of the first metal layer using copper-tin alloys, such as white bronzes proves to be particularly favorable.
- Such second metal layers impart the aesthetic impression of chromed matte nickel layers, but exhibit no allergenic potential and have sufficient mechanical stability and corrosion resistance.
- the proposal is made to metallize a third metal layer onto the second metal layer, which assumes the matte effect of the first metal layer, the third layer having corresponding mechanical characteristics.
- a chromium or chromium alloy layer such as chromium alloys comprising vanadium, molybdenum, carbon, phosphorous, or tungsten from chromium(III)-containing electrolytes have proved to be suitable.
- hard layers applied by a CVD or PVD such as chromium carbide, titanium nitride/carbide, zirconium nitride/carbide, silicon dioxide, or DLC (diamond-like carbon) or combinations of these layers, have also proved to be suitable.
- each layer is at least about 3 ⁇ m, for example, each layer is between about 5 ⁇ m and about 30 ⁇ m thick. In one such embodiment, the layers are about 10 ⁇ m thick.
- an electrolyte suitable for carrying out the method of the invention is prepared with an acidic matte copper electrolyte, which produces matte layers by employing additives.
- one electrolyte comprises the additive Cuprostar LP1, which is an additive commercially available from Enthone Inc.
- Such an electrolyte is applied to a substrate by applying a current.
- Other examples for electrolytes which can be used in the method of the invention for the deposition of matte copper layers are currentless copper electrolytes, such as ENPLATE CU 872, commercially available from Enthone Inc.
- a first matte copper layer obtained by means of a copper electrolyte according to this invention can be metallized with a copper-tin alloy in the next method step.
- An advantageous electrolyte for the galvanic deposition of copper-tin alloys such as white bronzes, comprises tin and copper ions in the form of cyanides, as well as suitable additives such as alkali liquor and free cyanide.
- Alkylsulfonic acid electrolytes comprising an aromatic, nonionic wetting agent can also be used.
- the electrolyte may optionally comprise additional stabilizers and/or anionic and/or nonionic complexing agents, aliphatic wetting agents, antioxidation agents, and other metal salts.
- the metals tin and copper which are introduced into the electrolytes mainly for the deposition of bronzes, can be present predominantly as cyanides.
- they can be present as salts of alkylsulfonic acids, preferably as methane sulfonates, or as salts of mineral acids, preferably as sulfates.
- the tin salt tin methane sulfonate is used in the electrolyte. It is advantageously added to the electrolyte in a quantity of about 5-195 g/L of electrolyte. This corresponds to a use of about 2-75 g/L divalent tin ions.
- the copper salt copper methane sulfonate is used in the electrolyte. It is advantageously added to the electrolyte in a quantity of about 8-280 g/L. This corresponds to a use of about 2-70 g/L divalent copper ions.
- an acid preferably a mineral and/or an alkylsulfonic acid
- methanesulfonic acid is particularly advantageous, since it both causes an advantageous solubility of the metal salts and simultaneously, as a result of its acid strength, specifies or facilitates the setting of the pH value needed for the method.
- the methanesulfonic acid has the advantageous characteristic of substantially contributing to the stability of the bath.
- An electrolyte was prepared comprising, by approximate composition:
- Cuprostar LP1 is an additive commercially available from Enthone Inc.
- the electrolyte was used to coat a substrate at a temperature range of between about 18° C. and 35° C.
- the electrolyte was used to coat a substrate by applying a current density between about 1 A/dm 2 and 5 A/dm 2 .
- An electrolyte was prepared comprising, by approximate composition:
- An electrolyte was prepared comprising, by approximate composition:
- An electrolyte was prepared comprising, by approximate composition:
- the electrolyte of this example has a pH value of between about 12.4-12.9. It was applied to a substrate by applying a current density between about 2 and 4 A/dm 2 while holding the electrolyte in a temperature range between about 50° C. and about 60° C.
- An electrolyte was prepared comprising, by approximate composition:
- the electrolyte of this example has a pH value of between about 13.2-13.6. It was applied to a substrate by applying a current density between about 0.3 A/dm 2 and 0.7 A/dm 2 while holding the electrolyte in a temperature range between about 39.0° C. and 45.0° C.
Abstract
A method for depositing metal matte layers free of nickel and chromium(VI).
Description
- The present invention relates generally to a method for depositing nickel- and chromium(VI)-free metal matte layers on substrates.
- Metal matte layers are used for functional or decorative surface refinement in various areas. Thus, for example, in the area of jewelry production, surfaces are coated with appropriate matte layers for aesthetic reasons. In the area of household appliances or food preparation apparatuses or facilities, surfaces are often equipped with matte layers for decorative reasons.
- The matte layers previously known in the state of the art are deposited from nickel-containing electrolytes, mostly chromium(VI)-containing electrolytes, and form a cover layer containing nickel. Although chromium(VI) is not detectable in the end layer with a careful operation, in particular, when rinsing after chrome-plating, there is some concern about layers which have been deposited from such electrolytes.
- Nickel can lead to allergenic reactions with intensive skin contact or with the intake of nickel traces via foods. In the case of jewelry, it is precisely close skin contact and the nickel desorption promoted by sweat and moisture which lead to strong skin irritations. In the case of household appliances and food preparation facilities or apparatuses, contacting food with matte surfaces may, under certain circumstances, lead to the dissolving out of nickel, since the chromium layer does not always sufficiently cover the underlying microstructural surface.
- For the aforementioned reasons, great efforts are being made, especially in the jewelry industry and in the area of the production of household appliances and food preparation apparatuses or facilities, to avoid such surface coatings.
- However, since matted surfaces have a great aesthetic effect, corresponding surfaces in the aforementioned areas are currently used widely in spite of their disadvantages.
- Taking into consideration what has been said in the preceding, the problem addressed by this invention is the provision of a method for the deposition of matte nickel- and chromium(VI)-free metal layers.
- Among the objects of the invention, therefore, is the provision of a method to deposit matte surface layer free of nickel and chromium(VI) on substrates.
- Briefly, therefore, the invention is directed to a method for depositing a matte layer free of nickel and chromium(VI) onto a substrate. The method comprises coating the substrate with a first matte metal layer that is free of nickel; and metallizing the first matte metal layer with a second metal layer that is free of nickel and chromium(VI), which assumes the matte effect of the first matte metal layer. The first matte metal layer comprises at least one metal selected from the group consisting of copper, silver, tin, zinc, or an alloy that does not contain nickel. The second metal layer comprises at least one metal selected from the group consisting of copper, tin, zinc, chromium(III), silver, gold, ruthenium, platinum, palladium, or an alloy of these metals.
- The invention is also directed to a method for imparting a decorative matte finish to a surface of an article comprising coating the surface with a first matte layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, silver, zinc, and metal alloys, and b) is substantially nickel-free; and depositing a second matte layer over the first matte layer, which second matte layer is a layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, zinc, chromium, silver, gold, ruthenium, platinum, palladium, and metal alloys of the foregoing, b) is substantially free of nickel, c) is deposited from a composition which is substantially free of chromium (VI), and d) has a matte appearance.
- Other objects and features of this invention will be in part apparent and in part pointed out hereinafter.
- This application claims priority from German application number 103 54 760.6, the entire disclosure of which is explicitly incorporated by reference.
- In accordance with this invention, a method for the deposition of nickel- and chromium(VI)-free metal matte layers is provided, the method comprising the following steps:
-
- a) coating a substrate with a first matte layer;
- b) metallizing the first matte metal layer with a second metal layer that assumes the matte effect of the first metal layer to obtain a coated substrate with a matted surface. According to the invention, the first matte metal layer is nickel-free and the second metal layer is free from nickel and chromium(VI). The metal used to produce the first matte metal layer comprises at least one metal of the group consisting of copper, silver, tin, zinc, or an alloy that does not contain nickel. The metal used to produce the second metal layer comprises at least one metal of the group consisting of copper, tin, zinc, chromium(III), silver, gold, ruthenium, platinum, palladium, or an alloy of these metals.
- In the context of this invention, the term “matte” refers to a dull, non-glare, or pearl surface finish.
- In one aspect, the use of matte copper layers as a first matte metal layer turns out to be particularly suitable with the method of the invention. Such copper layers are obtained with the method of galvanic or chemical metallization, known in the state of the art.
- In another aspect according to the invention, a second metal layer assuming the matte effect of the first metal layer using copper-tin alloys, such as white bronzes, proves to be particularly favorable. Such second metal layers impart the aesthetic impression of chromed matte nickel layers, but exhibit no allergenic potential and have sufficient mechanical stability and corrosion resistance.
- In another aspect of the invention, if the mechanical stability is to be increased for technical application reasons, the proposal is made to metallize a third metal layer onto the second metal layer, which assumes the matte effect of the first metal layer, the third layer having corresponding mechanical characteristics. Here, the deposition of a chromium or chromium alloy layer, such as chromium alloys comprising vanadium, molybdenum, carbon, phosphorous, or tungsten from chromium(III)-containing electrolytes have proved to be suitable. Likewise, hard layers applied by a CVD or PVD, such as chromium carbide, titanium nitride/carbide, zirconium nitride/carbide, silicon dioxide, or DLC (diamond-like carbon) or combinations of these layers, have also proved to be suitable.
- In one embodiment, the thickness of each layer is at least about 3 μm, for example, each layer is between about 5 μm and about 30 μm thick. In one such embodiment, the layers are about 10 μm thick.
- With regard to the first matte metal layer, in one exemplary embodiment, an electrolyte suitable for carrying out the method of the invention is prepared with an acidic matte copper electrolyte, which produces matte layers by employing additives. For example, one electrolyte comprises the additive Cuprostar LP1, which is an additive commercially available from Enthone Inc. Such an electrolyte is applied to a substrate by applying a current. Other examples for electrolytes which can be used in the method of the invention for the deposition of matte copper layers are currentless copper electrolytes, such as ENPLATE CU 872, commercially available from Enthone Inc.
- With regard to the second metal layer, in one embodiment according to this invention, a first matte copper layer obtained by means of a copper electrolyte according to this invention can be metallized with a copper-tin alloy in the next method step. An advantageous electrolyte for the galvanic deposition of copper-tin alloys, such as white bronzes, comprises tin and copper ions in the form of cyanides, as well as suitable additives such as alkali liquor and free cyanide. Alkylsulfonic acid electrolytes comprising an aromatic, nonionic wetting agent can also be used. The electrolyte may optionally comprise additional stabilizers and/or anionic and/or nonionic complexing agents, aliphatic wetting agents, antioxidation agents, and other metal salts.
- The metals tin and copper, which are introduced into the electrolytes mainly for the deposition of bronzes, can be present predominantly as cyanides. In the case of the acidic electrolytes, they can be present as salts of alkylsulfonic acids, preferably as methane sulfonates, or as salts of mineral acids, preferably as sulfates. In one preferred embodiment, the tin salt tin methane sulfonate is used in the electrolyte. It is advantageously added to the electrolyte in a quantity of about 5-195 g/L of electrolyte. This corresponds to a use of about 2-75 g/L divalent tin ions. In another preferred embodiment, possibly coupled with the preceding preferred embodiment, the copper salt copper methane sulfonate is used in the electrolyte. It is advantageously added to the electrolyte in a quantity of about 8-280 g/L. This corresponds to a use of about 2-70 g/L divalent copper ions.
- Since the deposition rate in the acidic medium is clearly higher, an acid, preferably a mineral and/or an alkylsulfonic acid, is added to the electrolyte in quantities of about 140-382 g/L of electrolyte. The use of methanesulfonic acid is particularly advantageous, since it both causes an advantageous solubility of the metal salts and simultaneously, as a result of its acid strength, specifies or facilitates the setting of the pH value needed for the method. In addition, the methanesulfonic acid has the advantageous characteristic of substantially contributing to the stability of the bath.
- In the following examples, which are given by way of illustration and are not limiting on the invention, electrolytes are described which are suitable for carrying out the method of the invention.
- This is an acidic matte copper electrolyte, which can be used to produce the first matte metal layer by additives. An electrolyte was prepared comprising, by approximate composition:
-
- 18-25 g/L Cu2+
- 180-210 g/L H2SO4
- 30-80 mg/L Cl−
- 1-10 mL/L Cuprostar LP1
- Cuprostar LP1 is an additive commercially available from Enthone Inc. The electrolyte was used to coat a substrate at a temperature range of between about 18° C. and 35° C. The electrolyte was used to coat a substrate by applying a current density between about 1 A/dm2 and 5 A/dm2.
- For purposes of illustration, the following examples describe electrolytes suitable for use depositing the second metal layer.
- An electrolyte was prepared comprising, by approximate composition:
-
- 5 g/L Sn2+
- 10 g/L Cu2+
- 240 g/L Methane sulfonic acid
- 32.2 g/L Aromatic, nonionic wetting agent
- 2 g/L Antioxidation agent
- 25 g/L Stabilizer/complexing agent
- An electrolyte was prepared comprising, by approximate composition:
-
- 18 g/L Sn2+
- 2 g/L Cu2+
- 258 g/L Methane sulfonic acid
- 9 g/L Aromatic, nonionic wetting agent
- An electrolyte was prepared comprising, by approximate composition:
-
- 17.0-25.0 g/L Sn2+
- 10.0-15.0 g/L Cu2+
- 1.3-1.9 g/L Zn2+
- 45.0-60.0 g/L KCN
- 0.5-2 mL/L Wetting agent
- 0.1-1 mL/L Gloss additive
- The electrolyte of this example has a pH value of between about 12.4-12.9. It was applied to a substrate by applying a current density between about 2 and 4 A/dm2 while holding the electrolyte in a temperature range between about 50° C. and about 60° C.
- An electrolyte was prepared comprising, by approximate composition:
-
- 8.0-12.0 g/L Sn2+
- 5.0-10.0 g/L Cu2+
- 1.0-3.0 g/L Zn2
- 23.0-30.0 g/L KCN
- 0.1-2 mL/L ATC solution No. 4 from Enthone Inc.
- 0.1-2 mL/L BRONZEX WMF Brightener NG from Enthone Inc.
- The electrolyte of this example has a pH value of between about 13.2-13.6. It was applied to a substrate by applying a current density between about 0.3 A/dm2 and 0.7 A/dm2 while holding the electrolyte in a temperature range between about 39.0° C. and 45.0° C.
- When introducing elements of the present invention or the preferred embodiment(s) thereof, the articles “a,” “an,” “the,” and “said” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements.
- In view of the above, it will be seen that the several objects of the invention are achieved and other advantageous results attained.
- As various changes could be made in the above methods and products without departing from the scope of the invention, it is intended that all matter contained in the above description and shown in any accompanying drawings shall be interpreted as illustrative and not in a limiting sense.
Claims (37)
1. A method for depositing a matte layer free of nickel and chromium(VI) onto a substrate, the method comprising:
(a) coating the substrate with a first matte metal layer that is free of nickel;
(b) metallizing the first matte metal layer with a second metal layer that is free of nickel and chromium(VI), which assumes the matte effect of the first matte metal layer;
wherein the first matte metal layer comprises at least one metal selected from the group consisting of copper, silver, tin, zinc, or an alloy that does not contain nickel; and
wherein the second metal layer comprises at least one metal selected from the group consisting of copper, tin, zinc, chromium(III), silver, gold, ruthenium, platinum, palladium, or an alloy of these metals.
2. The method of claim 1 , wherein the first matte metal layer is deposited chemically.
3. The method of claim 1 , wherein the first matte metal layer is electrolytically deposited.
4. The method of claim 1 , wherein the second metal layer is chemically deposited.
5. The method of claim 1 , wherein the second metal layer is deposited electrolytically.
6. The method of claim 1 further comprising coating the second metal layer with a third layer.
7. The method of claim 6 , wherein the third layer comprises chromium.
8. The method of claim 6 , wherein the third layer comprises chromium alloyed with at least one element selected from the group consisting of vanadium, molybdenum, carbon, phosphorous, tungsten, and mixtures thereof.
9. The method of claim 1 , the method further comprising coating the second metal layer with a third layer and at least one hard layer applied by CVD or PVD.
10. The method of claim 9 , wherein the hard layer comprises a material selected from the group consisting of chromium carbide, titanium nitride, titanium carbide, zirconium nitride, zirconium carbide, silicon dioxide, diamond-like carbon, and combinations thereof.
11. The method of claim 9 wherein the third layer comprises chromium.
12. The method of claim 9 , wherein the third layer comprises chromium alloyed with at least one element selected from the group consisting of vanadium, molybdenum, carbon, phosphorous, tungsten, and mixtures thereof.
13. A method for imparting a decorative matte finish to a surface of an article comprising:
coating the surface with a first matte layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, silver, zinc, and metal alloys, and b) is substantially nickel-free; and
depositing a second matte layer over the first matte layer, which second matte layer is a layer of metal which a) contains at least one metallic material selected from the group consisting of copper, tin, zinc, chromium, silver, gold, ruthenium, platinum, palladium, and metal alloys of the foregoing, b) is substantially free of nickel, c) is deposited from a composition which is substantially free of chromium (VI), and d) has a matte appearance.
14. The method of claim 13 further comprising depositing a third layer over the second metal layer, wherein the third layer comprises chromium, wherein the depositing the third layer is by a process employing a chromium-containing composition which is substantially free of chromium (VI).
15. The method of claim 14 , wherein the third layer comprises chromium alloyed with at least one element selected from the group consisting of vanadium, molybdenum, carbon, phosphorous, tungsten, and mixtures thereof.
16. The method of claim 13 further comprising depositing a third layer over the second metal layer and a hard layer over the second metal layer by CVD or PVD.
17. The method of claim 16 , wherein the hard layer comprises a material selected from the group consisting of chromium carbide, titanium nitride, titanium carbide, zirconium nitride, zirconium carbide, silicon dioxide, diamond-like carbon, and combinations thereof.
18. The method of claim 16 wherein the third layer comprises chromium.
19. The method of claim 18 , wherein the third layer comprises chromium alloyed with at least one element selected from the group consisting of vanadium, molybdenum, carbon, phosphorous, tungsten, and mixtures thereof.
20. The method of claim 13 wherein the coating the surface with the first matte layer of metal comprises immersing the surface in an electrolyte comprising Cu ions and applying an external source of electrical current to the electrolyte to electrolytically deposit a Cu-based layer as the first matte layer.
21. The method of claim 20 wherein the electrolyte comprises, by approximate composition:
18-25 g/L Cu2+
180-210 g/L H2SO4
30-80 mg/L Cl−.
22. The method of claim 21 wherein the electrical current has a current density between about 1 A/dm2 and 5 A/dm2 and the electrolyte has a temperature in a range between about 18° C. and 35° C.
23. The method of claim 13 wherein the second matte layer comprises tin and the depositing the second matte layer comprises immersing the surface in an electrolyte comprising Sn ions and applying an external source of electrical current to the electrolyte to electrolytically deposit a Sn-based layer as the second matte layer.
24. The method of claim 23 wherein the second matte layer is deposited using an electrolyte comprising, by approximate composition:
g/L Sn2+
10 g/L Cu2+
240 g/L methanesulfonic acid
32.2 g/L aromatic, nonionic wetting agent
2 g/L antioxidation agent
25 g/L stabilizer/complexing agent.
25. The method of claim 23 wherein the second matte layer is deposited using an electrolyte comprising, by approximate composition:
18 g/L Sn2+
2 g/L Cu2+
258 g/L methanesulfonic acid
9 g/L aromatic, nonionic wetting agent.
26. The method of claim 23 wherein the second matte layer is deposited using an electrolyte comprising, by approximate composition:
17.0-25.0 g/L Sn2+
10.0-15.0 g/L Cu2+
1.3-1.9 g/L Zn2+
45.0-60.0 g/L KCN
0.5-2 mL/L wetting agent
0.1-1 mL/L gloss additive.
27. The method of claim 26 wherein the electrolyte has a pH value of between about 12.4 and about 12.9.
28. The method of claim 26 wherein the second matte layer is deposited at a temperature range of between about 50° C. and 60° C. and with a current density of between about 2 A/dm2 and about 4 A/dm2.
29. The method of claim 13 , wherein the second matte layer is deposited using an electrolyte comprising, by approximate composition:
8.0-12.0 g/L Sn2+
5.0-10.0 g/L Cu2+
1.0-3.0 g/L Zn2
23.0-30.0 g/L KCN
30. The method of claim 29 , wherein the electrolyte has a pH value of between about 13.2 and about 13.6.
31. The method of claim 29 , wherein the second matte layer is deposited at a temperature range of between about 39° C. and 45° C. and with a current density of between about 0.3 A/dm2 and 0.7 A/dm2.
32. The method of claim 13 , wherein the first matte metal layer comprises copper.
33. The method of claim 13 , wherein the second matte layer comprises tin and copper.
34. The method of claim 13 , wherein the second matte layer comprises tin, copper, and zinc.
35. The method of claim 32 , wherein the first matte metal layer is between about 5 μm and about 30 μm thick.
36. The method of claim 35 , wherein the second matte layer is between about 5 μm and about 30 μm thick.
37. A method for imparting a decorative matte finish to a surface of an article comprising:
immersing the surface in a first electrolyte comprising Cu ions and applying an external source of electrical current to the first electrolyte to electrolytically deposit a Cu-based layer as a first matte layer, wherein the first electrolyte is substantially nickel-free; and
depositing a second matte layer over the first matte layer by immersing the surface in a second electrolyte comprising Sn ions and applying an external source of electrical current to the second electrolyte to electrolytically deposit a Sn-based layer as the second matte layer, wherein the second electrolyte is substantially free of nickel and is substantially free of chromium (VI).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10354760A DE10354760A1 (en) | 2003-11-21 | 2003-11-21 | Process for depositing nickel and chromium (VI) free metallic matte layers |
DE10354760.6 | 2003-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050178668A1 true US20050178668A1 (en) | 2005-08-18 |
Family
ID=34428874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/994,537 Abandoned US20050178668A1 (en) | 2003-11-21 | 2004-11-22 | Method for depositing nickel- and chromium (VI) -free metal matte layers |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050178668A1 (en) |
EP (1) | EP1533397A3 (en) |
JP (1) | JP2005154902A (en) |
KR (1) | KR100734969B1 (en) |
CN (1) | CN100400710C (en) |
DE (1) | DE10354760A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10011913B2 (en) | 2010-12-23 | 2018-07-03 | Coventya S.P.A. | Substrate with a corrosion resistant coating and method of production thereof |
US10329682B2 (en) * | 2012-06-26 | 2019-06-25 | Cromatura Staff S.A.S. Di Manera Giovanbattista & C. | Process for the production of a component of valves, fittings or tap assemblies, and component |
US11555252B2 (en) | 2018-11-07 | 2023-01-17 | Coventya, Inc. | Satin copper bath and method of depositing a satin copper layer |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100906008B1 (en) * | 2004-09-24 | 2009-07-06 | 자덴 징크 프로덕츠, 인코포레이티드 | Electroplated metals with silvery-white appearance and method of making |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
JP4872257B2 (en) * | 2005-07-19 | 2012-02-08 | 住友金属鉱山株式会社 | Two-layer plated substrate and manufacturing method thereof |
CN101096769A (en) | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | Electroplating method |
EP2460908A1 (en) * | 2010-12-03 | 2012-06-06 | Grohe AG | Sanitary item |
EP2620529B1 (en) * | 2012-01-25 | 2014-04-30 | Atotech Deutschland GmbH | Method for producing matt copper deposits |
DE102012008544A1 (en) * | 2012-05-02 | 2013-11-07 | Umicore Galvanotechnik Gmbh | Chromed composites without nickel coating |
DE102014006739B3 (en) | 2014-05-12 | 2015-06-25 | Albert-Ludwigs-Universität Freiburg | Process for coating surfaces with nanostructures, component produced by the process and use of the component |
CN108517520A (en) * | 2018-06-15 | 2018-09-11 | 北京铂阳顶荣光伏科技有限公司 | A kind of diamond laminated film and its preparation method and application |
CN110938851A (en) * | 2019-11-20 | 2020-03-31 | 长泰科美厨卫科技有限公司 | Preparation method of fingerprint-resistant matte gold composite coating |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3280736A (en) * | 1964-06-08 | 1966-10-25 | Metalgamica S A | Multi-metal planographic printing plates |
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
US3868248A (en) * | 1971-10-06 | 1975-02-25 | Foseco Int | Deoxidising molten non-ferrous metals |
US4143210A (en) * | 1977-09-30 | 1979-03-06 | Whyco Chromium Company, Inc. | Multi-layer plating for improved corrosion resistance |
US4330352A (en) * | 1977-08-19 | 1982-05-18 | Stauffer Chemical Company | Method of forming a metallized decorative film laminate |
US4612091A (en) * | 1982-06-30 | 1986-09-16 | Asociation Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels | Chromium electroplating trivalent chrominum bath therefore and method of making such bath |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
US5266771A (en) * | 1991-12-05 | 1993-11-30 | Amf Irrevocable Trust | Ornament having patterned ornamental indicia thereon, and method and apparatus for fabricating same |
US6132851A (en) * | 1994-06-28 | 2000-10-17 | Ga-Tek Inc. | Adhesive compositions and copper foils and copper clad laminates using same |
US6248401B1 (en) * | 1994-04-22 | 2001-06-19 | Shiuh-Kao Chiang | Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
US6309528B1 (en) * | 1999-10-15 | 2001-10-30 | Faraday Technology Marketing Group, Llc | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
US6316734B1 (en) * | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
US20020114963A1 (en) * | 1999-06-02 | 2002-08-22 | Ronald Petkie | Brazeable metallizations for diamond components |
US6452247B1 (en) * | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8333752D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Matte surface on metal layer |
JPH0247285A (en) * | 1988-08-08 | 1990-02-16 | C Uyemura & Co Ltd | Production of chromium-molybdenum alloy film having high corrosion resistance |
NL8902886A (en) * | 1989-11-22 | 1991-06-17 | Akzo Nv | LAMINATE FOR THE PROCESS OF STREAMLESS METALLIZATION, A PRINTED CIRCUIT PROVIDED THEREOF, AND A METHOD OF MANUFACTURING SUCH LAMINATE. |
JPH06306641A (en) * | 1993-04-21 | 1994-11-01 | Sumitomo Metal Mining Co Ltd | Suspension fork pipe |
JP2915305B2 (en) * | 1994-11-04 | 1999-07-05 | 有限会社カネヒロ・メタライジング | Matting plating method and matting plating method for meter reader |
US5972526A (en) * | 1995-12-07 | 1999-10-26 | Citizen Watch Co., Ltd. | Decorative member |
JP3470795B2 (en) * | 2000-03-24 | 2003-11-25 | 東京特殊電線株式会社 | Copper coated aluminum wire |
JP3621874B2 (en) * | 2000-08-08 | 2005-02-16 | 河口湖精密株式会社 | Watch exterior parts |
JP2003073886A (en) * | 2001-09-05 | 2003-03-12 | Kawaguchiko Seimitsu Co Ltd | Exterior parts for watch |
JP3969296B2 (en) * | 2001-12-13 | 2007-09-05 | セイコーエプソン株式会社 | Surface treatment method for ornaments, ornaments and watches |
JP2003268568A (en) * | 2002-01-09 | 2003-09-25 | Citizen Watch Co Ltd | Ornament with white film, and its manufacturing method |
-
2003
- 2003-11-21 DE DE10354760A patent/DE10354760A1/en not_active Withdrawn
-
2004
- 2004-11-06 EP EP04026400A patent/EP1533397A3/en not_active Withdrawn
- 2004-11-19 JP JP2004335226A patent/JP2005154902A/en active Pending
- 2004-11-19 KR KR1020040095214A patent/KR100734969B1/en active IP Right Grant
- 2004-11-22 CN CNB2004100952608A patent/CN100400710C/en active Active
- 2004-11-22 US US10/994,537 patent/US20050178668A1/en not_active Abandoned
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3280736A (en) * | 1964-06-08 | 1966-10-25 | Metalgamica S A | Multi-metal planographic printing plates |
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
US3868248A (en) * | 1971-10-06 | 1975-02-25 | Foseco Int | Deoxidising molten non-ferrous metals |
US4330352A (en) * | 1977-08-19 | 1982-05-18 | Stauffer Chemical Company | Method of forming a metallized decorative film laminate |
US4143210A (en) * | 1977-09-30 | 1979-03-06 | Whyco Chromium Company, Inc. | Multi-layer plating for improved corrosion resistance |
US4612091A (en) * | 1982-06-30 | 1986-09-16 | Asociation Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels | Chromium electroplating trivalent chrominum bath therefore and method of making such bath |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
US5266771A (en) * | 1991-12-05 | 1993-11-30 | Amf Irrevocable Trust | Ornament having patterned ornamental indicia thereon, and method and apparatus for fabricating same |
US6248401B1 (en) * | 1994-04-22 | 2001-06-19 | Shiuh-Kao Chiang | Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer |
US6132851A (en) * | 1994-06-28 | 2000-10-17 | Ga-Tek Inc. | Adhesive compositions and copper foils and copper clad laminates using same |
US20020114963A1 (en) * | 1999-06-02 | 2002-08-22 | Ronald Petkie | Brazeable metallizations for diamond components |
US6309528B1 (en) * | 1999-10-15 | 2001-10-30 | Faraday Technology Marketing Group, Llc | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
US6452247B1 (en) * | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
US6316734B1 (en) * | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10011913B2 (en) | 2010-12-23 | 2018-07-03 | Coventya S.P.A. | Substrate with a corrosion resistant coating and method of production thereof |
US10329682B2 (en) * | 2012-06-26 | 2019-06-25 | Cromatura Staff S.A.S. Di Manera Giovanbattista & C. | Process for the production of a component of valves, fittings or tap assemblies, and component |
US11555252B2 (en) | 2018-11-07 | 2023-01-17 | Coventya, Inc. | Satin copper bath and method of depositing a satin copper layer |
Also Published As
Publication number | Publication date |
---|---|
DE10354760A1 (en) | 2005-06-23 |
EP1533397A3 (en) | 2005-06-29 |
KR100734969B1 (en) | 2007-07-03 |
CN1619012A (en) | 2005-05-25 |
KR20050049404A (en) | 2005-05-25 |
CN100400710C (en) | 2008-07-09 |
JP2005154902A (en) | 2005-06-16 |
EP1533397A2 (en) | 2005-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4169171A (en) | Bright electroless plating process and plated articles produced thereby | |
US20050178668A1 (en) | Method for depositing nickel- and chromium (VI) -free metal matte layers | |
JP4642317B2 (en) | Decorative article with white coating | |
JP2014500404A (en) | SUBSTRATE HAVING CORROSION-RESISTANT COATING AND METHOD FOR PRODUCING THE SAME | |
JP5436569B2 (en) | Precious metal-containing layer continuum for decorative articles | |
WO2017055553A1 (en) | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate | |
KR100366248B1 (en) | Accessory having colored coating and manufacturing method thereof | |
JPS6179799A (en) | Chromium plating method and plated article | |
US6528185B2 (en) | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles | |
US4917967A (en) | Multiple-layered article and method of making same | |
Malathy | Critical review on alloy plating: A viable alternative to conventional plating | |
US4560623A (en) | Specular product of bronze-like tone | |
GB2218111A (en) | Coating metallic substrates by the PVD process | |
JPS5811795A (en) | Surface treated steel material which is excellent in corrosion resistance and water resistant adhesive property after coating | |
KR100804502B1 (en) | Surface Treating and Multi-layer Composite Plating Methods for Preventing Metal Allergy and Multi-layer Composite Plating Structures Thereof | |
JP2003013282A (en) | Ornament and manufacturing method therefor | |
JP3216341B2 (en) | Manufacturing method of precious metal plating | |
JPH04333587A (en) | Method and bath for electroforming and plating platinum or platinum alloy and its electro-formed and plated article | |
JPH0598454A (en) | Electroless nickel plating method for zinc-aluminum alloy, composition for catalyzing treatment, composition for activation and composition electroless nickel striking | |
JP2560842B2 (en) | Method for manufacturing corrosion resistant film | |
JP7350965B1 (en) | Chrome plated parts and their manufacturing method | |
US6528184B2 (en) | Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings | |
WO2010039323A1 (en) | Novel cyanide-free electroplating process for zinc and zinc alloy die-cast components | |
WO2008023339A2 (en) | Method and composition for the deposition of palladium layers and palladium alloy layers | |
JPH0718484A (en) | Gold alloy plating solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ENTHONE INC., CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOBIUS, ANDREAS;PIES, PETER;SCHAAF, HANS-PAUL;AND OTHERS;REEL/FRAME:015940/0448;SIGNING DATES FROM 20050204 TO 20050214 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |