US20050271835A1 - Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same - Google Patents

Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same Download PDF

Info

Publication number
US20050271835A1
US20050271835A1 US11/192,172 US19217205A US2005271835A1 US 20050271835 A1 US20050271835 A1 US 20050271835A1 US 19217205 A US19217205 A US 19217205A US 2005271835 A1 US2005271835 A1 US 2005271835A1
Authority
US
United States
Prior art keywords
substrate
glass substrate
protective layer
lcd
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/192,172
Inventor
Woong Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Display Co Ltd
Original Assignee
LG Philips LCD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Philips LCD Co Ltd filed Critical LG Philips LCD Co Ltd
Priority to US11/192,172 priority Critical patent/US20050271835A1/en
Publication of US20050271835A1 publication Critical patent/US20050271835A1/en
Assigned to LG DISPLAY CO., LTD. reassignment LG DISPLAY CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: LG.PHILIPS LCD CO., LTD.
Abandoned legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/051Inorganic, e.g. glass or silicon oxide
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055Epoxy
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/06Substrate layer characterised by chemical composition
    • C09K2323/061Inorganic, e.g. ceramic, metallic or glass
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31518Next to glass or quartz

Definitions

  • the present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having glass substrates uniformly and smoothly formed on its outer surface to increase the mechanical strength thereof and method of making the same.
  • CRT cathode ray tube
  • the flat panel display devices such as LCD(liquid crystal display), PDP(plasma display panel), ELD(electroluminescent display), and VFD(vacuum fluorescent display) have been introduced recently.
  • LCD liquid crystal display
  • PDP plasma display panel
  • ELD electroluminescent display
  • VFD vacuum fluorescent display
  • the LCD has been dominantly researched for the good picture quality and low power consumption.
  • the LCD-applied portable television and notebook computer are on the market resent, but there are also problems to be solved in this LCD yet.
  • the size and weight are important factor of the LCD investigation because of the apparatus have to be in hands of user.
  • the light glass substrate means thin glass substrate.
  • the thin glass substrate causes the damage and the surface roughness, so that the mechanical strength is weakened and the image quality of LCD is deteriorated.
  • etching methods of reducing the thickness of the glass substrate it is representative that the substrate is etched in a case which was filled with etchant. In this etching method, however, because of impurities created in etching process, the substrate is not uniformly etched.
  • the substrate is etched removing the impurities created in etching process by bubbles through a porous plate after a substrate is arranged.
  • An object of the present invention is to provide the LCD having thin glass substrate which is light and its surface is smooth and strong from mechanical impulse.
  • the LCD according to present invention includes a first substrate and a second substrate, two protective layers including at least one layer formed on outer surface of the first and second substrates, a transparent electrode formed on inner surface of the first substrate or the second substrate, an alignment layer formed on the transparent electrode, and two polarizers attached on the first and second substrates.
  • Each the protective layer material may be an inorganic matter having a compressive stress or an organic matter having a low viscosity coefficient, further the protective layer may be one layer including an inorganic layer or an organic layer, or a plurality of layers composed of same matter or different matter.
  • the inorganic layer is formed by a thin layer depositing method on the substrate, while the organic layer is formed by irradiating the light such as ultraviolet, visible ray, etc., onto a thermosetting resin deposited on the substrate and curing that.
  • FIGS. 1 a, b are drawings showing a glass substrate having a protective layer in accordance with present invention
  • FIG. 1 a represents a protective layer on which bubbles appear
  • FIG. 1 b represents a protective layer on which cracks occur.
  • FIG. 2 is a drawing showing a liquid crystal display device having the glass substrate of the FIGS. 1 a, b.
  • FIGS. 1 a, b are drawings showing a glass substrate 1 having the protective layer, as shown in FIG. 1 a, a bubble, which is formed in process of manufacturing glass and its diameter is several um—several ten um, is appeared on the thin substrate which is etched less than 0.7 mm. Further, since the thickness of the glass substrate 1 is very thin, a crack may be occured by fine mechanical impulse as shown in FIG. 1 b.
  • a transparent protective layer 8 formed on the substrate 1 includes a plurality of layer having an inorganic matter or an organic matter, or an inorganic matter and an organic matter, then a refractive index of each layer is 1.4 - 1.6.
  • the inorganic layer 8 is formed on the substrate 1 by general thin layer deposition method such as sputtering method, CVD(chemical vapor deposition) method, and evaporation method.
  • organic layer 8 is formed by irradiating the light such as ultraviolet, visible ray, etc., onto a thermosetting resin deposited on the substrate and curing that. At this time the inorganic matter having the compressive stress and the organic matter having the low viscosity coefficient(about several cp—several ten cp).
  • the protective layer 8 is formed on the bubble as well as the surface of substrate 1 , diameters of the bubbles are minimized from micrometer to angstrom. Accordingly when the substrate 1 is applied to a LCD, it is possible to prevent decreasing of an image quality by small scattering of the light in that region.
  • the substrate 1 is brokendown slowly according to passing of time in manufacturing process of the LCD. Further an impurity inserted in the crack cause to decrease quality of the LCD. While the inorganic layer prevent transmission of the crack by the compressive stress, and the cured organic layer also prevent transmission of the crack, thereby a strong glass substrate for mechanical impulse can be achieved.
  • the protective layer 8 may be one layer with an inorganic layer or an organic layer, or a plurality of layers composed of same matter or different matter.
  • FIG. 2 is a drawing showing a liquid crystal display device having two glass substrates including the protective layers.
  • a transparent electrode 12 made of such as ITO(indium tin oxide) is formed on the first substrate.
  • the transparent electrode 12 is formed on the first substrate, it is possible that the transparent electrode 12 is formed on the second substrate.
  • Further alignment layers 13 a, 13 b including polyimide or photo alignment material are formed on the transparent electrode 12 , then an alignment direction of the alignment layer is determined by using a mechanical or optical method.
  • a liquid crystal layer 15 is formed between the first and second substrates.
  • the protective layer 18 a, 18 b are an inorganic layers or an organic layers, or a plurality of layers composed of same matter or different matter and formed on outside surface of both the first substrate 10 a and the second substrate 10 b. Continually a first polarizer 14 a and a second polarizer 14 b are formed on the protective layers 18 a, 18 b.
  • TFTs thin film transisters
  • a color filter layer is formed on the second substrate.
  • the protective layers 18 a, 18 b are formed on that, and the transparent electrode 12 is formed on the protective layer 18 a, 18 b by the sputtering method.
  • the substrate 10 a, 10 b after the passivation layers 18 a, 18 b are formed on each the glass.
  • the TFTs(not illustrated) are formed on the first substrate 10 a by depositing and photoetching a metal layer, and the alignment layer 13 a, 13 b are formed by mechanical depositing or injecting the alignment material.
  • the protective layer includes an inorganic or an organic matter, the thin glass substrate through etching is bearable from a mechanical impulse.
  • the protective layer prevent transmission of the crack thereby the substrate is not brokendown.
  • the present invention provides the good quality LCD having thin glass substrate light and its surface is smooth and strong from mechanical impulse.

Abstract

The LCD according to present invention includes a first substrate and a second substrate, two protective layers including at least one layer formed on outer surface of the first and second substrates, a transparent electrode formed on inner surface of the first substrate or the second substrate, an alignment layer formed on the transparent electrode, and two polarizers attached on the first and second substrates.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having glass substrates uniformly and smoothly formed on its outer surface to increase the mechanical strength thereof and method of making the same.
  • As a display device of a television and a personal computer, etc., a large size cathode ray tube(CRT) display device has been used. However, since the screen must be separated from the electron gun more than predetermined distance for large size screen CRT, the volume is increased. Thus, this CRT cannot be applied to the thin weight, small size, and low power consumption electronic device such as a wall-mounted television, a portable television and a notebook computer, etc.
  • According to the purpose of display device, the flat panel display devices such as LCD(liquid crystal display), PDP(plasma display panel), ELD(electroluminescent display), and VFD(vacuum fluorescent display) have been introduced recently. Among above flat panel display device, the LCD has been dominantly researched for the good picture quality and low power consumption. The LCD-applied portable television and notebook computer are on the market resent, but there are also problems to be solved in this LCD yet. Particularly, the size and weight are important factor of the LCD investigation because of the apparatus have to be in hands of user.
  • For small size and light LCD, there are several methods of reducing the size and weight of the LCD element. However, the driving circuit and the thin film transistor, which are necessary element of the LCD, are so thin that the weight cannot be reduced. On the other hand, it is possible to reduce the weight of the glass substrate which is a basic element of the LCD. Specially, since the glass substrate is most heavy element of the LCD, the method of reducing the weight of the glass substrate has been continuously researched.
  • The light glass substrate means thin glass substrate. However, the thin glass substrate causes the damage and the surface roughness, so that the mechanical strength is weakened and the image quality of LCD is deteriorated.
  • In several etching methods of reducing the thickness of the glass substrate, it is representative that the substrate is etched in a case which was filled with etchant. In this etching method, however, because of impurities created in etching process, the substrate is not uniformly etched.
  • Therefore in proposed another etching method, the substrate is etched removing the impurities created in etching process by bubbles through a porous plate after a substrate is arranged.
  • In this method, however, bubbles appear on the substrate, or cracks occur by mechanical impulse, the bubbles were created in process of manufacturing glass and diameters of several um—several ten um. In case that the substrate applied to a LCD desirable image quality can not be achieved because of scattering of the light in a bubble region. Further if the cracks occur on the substrate by an etching process of the glass or mechanical impulse, impurities pass into the substrate in manufacturing process of the LCD thereby a quality of the LCD is down. In addition, since the crack is intensified according to passing of time, thereby the substrate is brokendown.
  • Accordingly in order to decrease weight of the LCD by etching the substrate, it is very important to decrease a fault on the substrate as well as an etching method.
  • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide the LCD having thin glass substrate which is light and its surface is smooth and strong from mechanical impulse.
  • In order to achieve this object, the LCD according to present invention includes a first substrate and a second substrate, two protective layers including at least one layer formed on outer surface of the first and second substrates, a transparent electrode formed on inner surface of the first substrate or the second substrate, an alignment layer formed on the transparent electrode, and two polarizers attached on the first and second substrates.
  • Each the protective layer material may be an inorganic matter having a compressive stress or an organic matter having a low viscosity coefficient, further the protective layer may be one layer including an inorganic layer or an organic layer, or a plurality of layers composed of same matter or different matter. The inorganic layer is formed by a thin layer depositing method on the substrate, while the organic layer is formed by irradiating the light such as ultraviolet, visible ray, etc., onto a thermosetting resin deposited on the substrate and curing that.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1 a, b are drawings showing a glass substrate having a protective layer in accordance with present invention, FIG. 1 a represents a protective layer on which bubbles appear, FIG. 1 b represents a protective layer on which cracks occur.
  • FIG. 2 is a drawing showing a liquid crystal display device having the glass substrate of the FIGS. 1 a, b.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.
  • FIGS. 1 a, b are drawings showing a glass substrate 1 having the protective layer, as shown in FIG. 1 a, a bubble, which is formed in process of manufacturing glass and its diameter is several um—several ten um, is appeared on the thin substrate which is etched less than 0.7 mm. Further, since the thickness of the glass substrate 1 is very thin, a crack may be occured by fine mechanical impulse as shown in FIG. 1 b.
  • A transparent protective layer 8 formed on the substrate 1 includes a plurality of layer having an inorganic matter or an organic matter, or an inorganic matter and an organic matter, then a refractive index of each layer is 1.4-1.6. the inorganic layer 8 is formed on the substrate 1 by general thin layer deposition method such as sputtering method, CVD(chemical vapor deposition) method, and evaporation method. While organic layer 8 is formed by irradiating the light such as ultraviolet, visible ray, etc., onto a thermosetting resin deposited on the substrate and curing that. At this time the inorganic matter having the compressive stress and the organic matter having the low viscosity coefficient(about several cp—several ten cp).
  • When bubbles appear on the surface of substrate 1 as shown in FIG. 1 a, an desirable image quality can not be achived because of scattering of the light in a bubble region.
  • Since the protective layer 8 is formed on the bubble as well as the surface of substrate 1, diameters of the bubbles are minimized from micrometer to angstrom. Accordingly when the substrate 1 is applied to a LCD, it is possible to prevent decreasing of an image quality by small scattering of the light in that region.
  • Additionally if cracks occur on the substrate 1 as shown in FIG. 1 b, the substrate 1 is brokendown slowly according to passing of time in manufacturing process of the LCD. Further an impurity inserted in the crack cause to decrease quality of the LCD. While the inorganic layer prevent transmission of the crack by the compressive stress, and the cured organic layer also prevent transmission of the crack, thereby a strong glass substrate for mechanical impulse can be achieved.
  • The protective layer 8 may be one layer with an inorganic layer or an organic layer, or a plurality of layers composed of same matter or different matter.
  • FIG. 2 is a drawing showing a liquid crystal display device having two glass substrates including the protective layers.
  • Each thickness of a first substrate 10 a and a second substrate 10 b is less than 0.7 mm, a transparent electrode 12 made of such as ITO(indium tin oxide) is formed on the first substrate. In present embodiment, although, the transparent electrode 12 is formed on the first substrate, it is possible that the transparent electrode 12 is formed on the second substrate. Further alignment layers 13 a, 13 b including polyimide or photo alignment material are formed on the transparent electrode 12, then an alignment direction of the alignment layer is determined by using a mechanical or optical method. On the other hand a liquid crystal layer 15 is formed between the first and second substrates. The protective layer 18 a, 18 b are an inorganic layers or an organic layers, or a plurality of layers composed of same matter or different matter and formed on outside surface of both the first substrate 10 a and the second substrate 10 b. Continually a first polarizer 14 a and a second polarizer 14 b are formed on the protective layers 18 a, 18 b.
  • Although not showing with drawing, TFTs(thin film transisters) are formed on the first substrate 10 a, and a color filter layer is formed on the second substrate.
  • After etching, grinding and scribing two glasses by general etching method, the protective layers 18 a, 18 b are formed on that, and the transparent electrode 12 is formed on the protective layer 18 a, 18 b by the sputtering method. At this time, also it is possible to make the substrate 10 a, 10 b after the passivation layers 18 a, 18 b are formed on each the glass. Further the TFTs(not illustrated) are formed on the first substrate 10 a by depositing and photoetching a metal layer, and the alignment layer 13 a, 13 b are formed by mechanical depositing or injecting the alignment material. Thereafter a plurality of spacers(not illustrated) are dispersed to maintain a gap between the first and second substrate 10 a, 10 b. After pouring the liquid crystal into a region between the first and second substrates and the two substrates are sealed, and thereby the LCD according to the present invention is completed.
  • In the above-discussed structure, since the protective layer includes an inorganic or an organic matter, the thin glass substrate through etching is bearable from a mechanical impulse.
  • Further in etching process, since the inorganic or organic matter have diameters of the bubbles which a quality of the LCD is down by that decreased, it is possible to achieve the good quality LCD having soft and uniform surface.
  • When cracks occur on the substrate, the protective layer prevent transmission of the crack thereby the substrate is not brokendown.
  • As a result, the present invention provides the good quality LCD having thin glass substrate light and its surface is smooth and strong from mechanical impulse.
  • Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

Claims (7)

1-16. (canceled)
17. A method of manufacturing a thin glass substrate of a liquid crystal display device, comprising the steps of:
providing a glass;
forming a substrate by processing the glass; and
forming a protective layer on the glass substrate.
18-19. (canceled)
20. The method according to claim 17, wherein the step of forming the protective layer includes the step of irradiating the light after depositing an organic matter on the glass substrate.
21. The method according to claim 20, wherein the light is an ultraviolet or a visible ray.
22. The method according to claim 17, wherein the step of forming the protective layer includes the step of coating an inorganic matter on the glass substrate.
23-27. (canceled)
US11/192,172 1997-10-20 2005-07-29 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same Abandoned US20050271835A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/192,172 US20050271835A1 (en) 1997-10-20 2005-07-29 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/954,124 US6327011B2 (en) 1997-10-20 1997-10-20 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US09/964,739 US6955840B2 (en) 1997-10-20 2001-09-28 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US11/192,172 US20050271835A1 (en) 1997-10-20 2005-07-29 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/964,739 Division US6955840B2 (en) 1997-10-20 2001-09-28 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

Publications (1)

Publication Number Publication Date
US20050271835A1 true US20050271835A1 (en) 2005-12-08

Family

ID=25494963

Family Applications (3)

Application Number Title Priority Date Filing Date
US08/954,124 Expired - Lifetime US6327011B2 (en) 1997-10-20 1997-10-20 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US09/964,739 Expired - Lifetime US6955840B2 (en) 1997-10-20 2001-09-28 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US11/192,172 Abandoned US20050271835A1 (en) 1997-10-20 2005-07-29 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US08/954,124 Expired - Lifetime US6327011B2 (en) 1997-10-20 1997-10-20 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US09/964,739 Expired - Lifetime US6955840B2 (en) 1997-10-20 2001-09-28 Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same

Country Status (1)

Country Link
US (3) US6327011B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7532274B2 (en) 2005-12-26 2009-05-12 Hitachi Displays, Ltd. Liquid crystal display and display
US20200096673A1 (en) * 2018-09-26 2020-03-26 Innolux Corporation Method for manufacturing electronic device

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327011B2 (en) * 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US7808479B1 (en) 2003-09-02 2010-10-05 Apple Inc. Ambidextrous mouse
JP3773723B2 (en) * 1999-01-29 2006-05-10 シャープ株式会社 Liquid crystal display
KR100652041B1 (en) * 2000-12-29 2006-11-30 엘지.필립스 엘시디 주식회사 Liquid Crystal Display Device and Method for Manufacturing the same
US7109653B2 (en) * 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
US7656393B2 (en) 2005-03-04 2010-02-02 Apple Inc. Electronic device having display and surrounding touch sensitive bezel for user interface and control
US11275405B2 (en) 2005-03-04 2022-03-15 Apple Inc. Multi-functional hand-held device
JP4128910B2 (en) * 2003-06-11 2008-07-30 日本アイ・ビー・エム株式会社 Liquid crystal display cell and method of manufacturing liquid crystal display cell
KR100599704B1 (en) * 2003-10-21 2006-07-12 삼성에스디아이 주식회사 Plasma display panel
US7812827B2 (en) 2007-01-03 2010-10-12 Apple Inc. Simultaneous sensing arrangement
US8493331B2 (en) 2007-06-13 2013-07-23 Apple Inc. Touch detection using multiple simultaneous frequencies
CN101178501B (en) * 2007-10-16 2010-12-15 长兴化学工业股份有限公司 Optical thin sheet with reinforced structur
TWI354153B (en) * 2007-11-19 2011-12-11 Au Optronics Corp Flat display panel having strength enhancing struc
TWI327103B (en) * 2007-11-21 2010-07-11 Au Optronics Corp Thin substrate, manufacturing process thereof, and manufacturing process of display panel applying the same
US8673163B2 (en) 2008-06-27 2014-03-18 Apple Inc. Method for fabricating thin sheets of glass
US7810355B2 (en) 2008-06-30 2010-10-12 Apple Inc. Full perimeter chemical strengthening of substrates
US10031549B2 (en) * 2008-07-10 2018-07-24 Apple Inc. Transitioning between modes of input
US20100006350A1 (en) * 2008-07-11 2010-01-14 Elias John G Stylus Adapted For Low Resolution Touch Sensor Panels
US8300019B2 (en) 2008-07-15 2012-10-30 Apple Inc. Capacitive sensor coupling correction
US9335868B2 (en) * 2008-07-31 2016-05-10 Apple Inc. Capacitive sensor behind black mask
US8743091B2 (en) * 2008-07-31 2014-06-03 Apple Inc. Acoustic multi-touch sensor panel
US9348451B2 (en) * 2008-09-10 2016-05-24 Apple Inc. Channel scan architecture for multiple stimulus multi-touch sensor panels
US8659556B2 (en) 2008-09-10 2014-02-25 Apple Inc. Advanced receive channel architecture
US8237667B2 (en) 2008-09-10 2012-08-07 Apple Inc. Phase compensation for multi-stimulus controller
US9189048B2 (en) * 2008-09-10 2015-11-17 Apple Inc. Circuit having a low power mode
US9606663B2 (en) * 2008-09-10 2017-03-28 Apple Inc. Multiple stimulation phase determination
US8592697B2 (en) 2008-09-10 2013-11-26 Apple Inc. Single-chip multi-stimulus sensor controller
US7978281B2 (en) * 2008-09-16 2011-07-12 General Dynamics Land Systems Low stress mounting support for ruggedized displays
US20100066683A1 (en) * 2008-09-17 2010-03-18 Shih-Chang Chang Method for Transferring Thin Film to Substrate
US20100215873A1 (en) * 2008-10-10 2010-08-26 Tpo Displays Corp. System for display images and fabrication method of display panels
US9063605B2 (en) 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
US7918019B2 (en) * 2009-01-09 2011-04-05 Apple Inc. Method for fabricating thin touch sensor panels
JP5616907B2 (en) 2009-03-02 2014-10-29 アップル インコーポレイテッド Technology to strengthen the glass cover of portable electronic devices
US20110006998A1 (en) * 2009-07-10 2011-01-13 Sunggu Kang Patterning of thin film conductive and passivation layers
US8654524B2 (en) 2009-08-17 2014-02-18 Apple Inc. Housing as an I/O device
US8475872B2 (en) * 2009-08-19 2013-07-02 Apple Inc. Patterning of thin film layers
KR101618157B1 (en) * 2009-12-21 2016-05-09 삼성디스플레이 주식회사 Display device and method for manufacturing the display device
US9778685B2 (en) 2011-05-04 2017-10-03 Apple Inc. Housing for portable electronic device with reduced border region
US9213451B2 (en) 2010-06-04 2015-12-15 Apple Inc. Thin glass for touch panel sensors and methods therefor
US10189743B2 (en) 2010-08-18 2019-01-29 Apple Inc. Enhanced strengthening of glass
US8824140B2 (en) 2010-09-17 2014-09-02 Apple Inc. Glass enclosure
US20120075252A1 (en) 2010-09-23 2012-03-29 Microsoft Corporation Ruggedized display device
US8950215B2 (en) 2010-10-06 2015-02-10 Apple Inc. Non-contact polishing techniques for reducing roughness on glass surfaces
US9725359B2 (en) 2011-03-16 2017-08-08 Apple Inc. Electronic device having selectively strengthened glass
US10781135B2 (en) 2011-03-16 2020-09-22 Apple Inc. Strengthening variable thickness glass
US9128666B2 (en) 2011-05-04 2015-09-08 Apple Inc. Housing for portable electronic device with reduced border region
US9944554B2 (en) 2011-09-15 2018-04-17 Apple Inc. Perforated mother sheet for partial edge chemical strengthening and method therefor
US9516149B2 (en) 2011-09-29 2016-12-06 Apple Inc. Multi-layer transparent structures for electronic device housings
US10144669B2 (en) 2011-11-21 2018-12-04 Apple Inc. Self-optimizing chemical strengthening bath for glass
US10133156B2 (en) 2012-01-10 2018-11-20 Apple Inc. Fused opaque and clear glass for camera or display window
US8773848B2 (en) 2012-01-25 2014-07-08 Apple Inc. Fused glass device housings
KR101881000B1 (en) 2012-04-27 2018-07-24 삼성전자주식회사 Portable terminal with crack prevention structure for display device
US9176604B2 (en) 2012-07-27 2015-11-03 Apple Inc. Stylus device
US9946302B2 (en) 2012-09-19 2018-04-17 Apple Inc. Exposed glass article with inner recessed area for portable electronic device housing
US9459661B2 (en) 2013-06-19 2016-10-04 Apple Inc. Camouflaged openings in electronic device housings
KR102083987B1 (en) * 2013-06-20 2020-03-04 삼성디스플레이 주식회사 Back palne of flat panel display and method for manufacturing the same
US8988390B1 (en) 2013-07-03 2015-03-24 Apple Inc. Frequency agile touch processing
WO2015034538A1 (en) * 2013-09-09 2015-03-12 Empire Technology Development Llc Strengthened glass substrates for polarizers and color filters
TWI510574B (en) 2013-11-18 2015-12-01 Eternal Materials Co Ltd Organic-inorganic composite resin, coating composition containing the same and application thereof
US9886062B2 (en) 2014-02-28 2018-02-06 Apple Inc. Exposed glass article with enhanced stiffness for portable electronic device housing
US10671222B2 (en) 2015-09-30 2020-06-02 Apple Inc. Touch sensor pattern for edge input detection
US11036318B2 (en) 2015-09-30 2021-06-15 Apple Inc. Capacitive touch or proximity detection for crown
WO2018023080A2 (en) 2016-07-29 2018-02-01 Apple Inc. Methodology and application of acoustic touch detection
US11157115B2 (en) 2017-03-31 2021-10-26 Apple Inc. Composite cover material for sensitivity improvement of ultrasonic touch screens
US10606418B2 (en) 2017-03-31 2020-03-31 Apple Inc. Ultrasonic touch detection on stylus
WO2018218080A1 (en) 2017-05-24 2018-11-29 Apple Inc. System and method for acoustic touch and force sensing
US11334196B2 (en) 2017-05-24 2022-05-17 Apple Inc. System and method for acoustic touch and force sensing
US11144158B2 (en) 2017-05-24 2021-10-12 Apple Inc. Differential acoustic touch and force sensing
US10949030B2 (en) 2017-09-26 2021-03-16 Apple Inc. Shear-poled curved piezoelectric material
US10802651B2 (en) 2018-01-30 2020-10-13 Apple Inc. Ultrasonic touch detection through display
US11366552B2 (en) 2018-02-06 2022-06-21 Apple, Inc. Ultrasonic polarizer
US10725573B2 (en) 2018-08-06 2020-07-28 Apple Inc. Annular piezoelectric structure for ultrasonic touch sensing

Citations (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689333A (en) * 1970-08-24 1972-09-05 Tasope Ltd Etching machine and method for making printing plates
US3756898A (en) * 1969-07-14 1973-09-04 Buckbee Mears Co Resistant system suitable for controlling etching without the aid of an etchant
US3869313A (en) * 1973-05-21 1975-03-04 Allied Chem Apparatus for automatic chemical processing of workpieces, especially semi-conductors
US4125594A (en) * 1976-12-22 1978-11-14 Corning Glass Works Purification of hydrofluoric acid etching solutions with weak anion exchange resins
US4147581A (en) * 1976-03-29 1979-04-03 Philip A. Hunt Chemical Corp. Etching of metal
US4240880A (en) * 1978-07-25 1980-12-23 Sumitomo Metal Mining Co., Ltd. Method and apparatus for selectively plating a material
US4332649A (en) * 1979-12-07 1982-06-01 Saelzle Erich Method of polishing glass ware with sulfuric acid and hydrofluoric acid
US4341841A (en) * 1978-11-13 1982-07-27 Nhk Spring Co., Ltd. Multi-layer coating protective film form
US4431683A (en) * 1981-04-24 1984-02-14 Hitachi, Ltd. Process for producing transparent electroconductive film
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US4501636A (en) * 1983-12-28 1985-02-26 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for etching vertical junction solar cell wafers
US4624729A (en) * 1984-10-30 1986-11-25 Vitreal Specchi S.P.A. Machine for continuously etching a surface of glass sheets
US4671814A (en) * 1985-03-08 1987-06-09 Central Glass Company Method of strengthening glass article formed of float glass by ion exchange
US4715686A (en) * 1984-11-16 1987-12-29 Seiko Epson Corporation Light-passive display device and method of manufacturing same
US4826556A (en) * 1987-10-01 1989-05-02 Nippon Scientific Co., Ltd. Plastic mold decapsuling apparatus
US4846868A (en) * 1986-09-05 1989-07-11 Central Glass Company, Limited Chemically strengthened glass article and method of producing same
US4886590A (en) * 1987-11-02 1989-12-12 Man-Gill Chemical Company Chemical process control system
US4953952A (en) * 1985-05-02 1990-09-04 Sumitomo Chemical Company, Ltd. Color liquid crystal displaying panels
US4980017A (en) * 1988-10-01 1990-12-25 Nisso Engineering Company, Ltd. Method for recirculating high-temperature etching solution
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
US5002627A (en) * 1988-08-12 1991-03-26 International Business Machines Corporation Spray etching apparatus with automatic individually controllable etching jets
US5034061A (en) * 1990-03-15 1991-07-23 General Electric Company Transparent shatter-resistant silicone coating
US5082518A (en) * 1990-10-29 1992-01-21 Submicron Systems, Inc. Sparger plate for ozone gas diffusion
US5112437A (en) * 1990-02-20 1992-05-12 Dainippon Screen Mfg. Co., Ltd. Oxide film removing apparatus and removing method thereof using azeotropic vapor mixture
US5112453A (en) * 1990-10-31 1992-05-12 Behr Omri M Method and apparatus for producing etched plates for graphic printing
US5159787A (en) * 1989-01-20 1992-11-03 Nkk Corporation Method for lapping two surfaces of a titanium disk
US5164018A (en) * 1992-03-18 1992-11-17 Barcelona Jr Russell L Water-spot remover containing hydrofluoric acid, ammonium fluoride, and an alcohol
US5246540A (en) * 1992-04-01 1993-09-21 Tru Vue, Inc. Apparatus and method for etching glass
US5251980A (en) * 1990-12-14 1993-10-12 Anritsu Corporation Sensing system for measuring specific value of substance to be measured by utilizing change in thermal resistance
US5260174A (en) * 1989-02-17 1993-11-09 Dai Nippon Insatsu Kabushiki Kaisha Method and apparatus for forming a coating of a viscous liquid on an object
US5260157A (en) * 1989-10-20 1993-11-09 Mita Industrial Co., Ltd. Electrophotographic photosensitive element comprising a surface protective layer comprising an etherified melamine-formaldehyde resin
US5277715A (en) * 1992-06-04 1994-01-11 Micron Semiconductor, Inc. Method of reducing particulate concentration in process fluids
US5319479A (en) * 1990-09-04 1994-06-07 Ricoh Company, Ltd. Deposited multi-layer device with a plastic substrate having an inorganic thin film layer
US5371619A (en) * 1992-04-30 1994-12-06 Apple Computer, Inc. Optically coupled liquid crystal cell with grease
US5378308A (en) * 1992-11-09 1995-01-03 Bmc Industries, Inc. Etchant distribution apparatus
US5389148A (en) * 1993-01-28 1995-02-14 Nordson Corporation Spray apparatus utilizing porous sheet
US5403616A (en) * 1992-10-27 1995-04-04 Matsushita Electric Industrial Co., Ltd. Method for forming patterned transparent conducting film
US5424876A (en) * 1991-10-31 1995-06-13 Asahi Kogaku Kogyo Kabushiki Kaisha Surface reflecting mirror having a silicon dioxide under layer
US5429711A (en) * 1992-09-18 1995-07-04 Mitsubishi Materials Corporation Method for manufacturing wafer
US5434433A (en) * 1992-08-19 1995-07-18 Seiko Instruments Inc. Semiconductor device for a light wave
US5437896A (en) * 1993-07-06 1995-08-01 U.S. Philips Corporation Method of preparing a composite material of silica network and chains of a polyhydroxy compound and a liquid crystal display device incorporating such composite material
US5505804A (en) * 1993-12-24 1996-04-09 Sharp Kabushiki Kaisha Method of producing a condenser lens substrate
US5514850A (en) * 1992-06-30 1996-05-07 Sharp Kabushiki Kaisha Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam
US5540784A (en) * 1994-09-23 1996-07-30 United Laboratories, Inc. Pressurized closed flow cleaning system
US5543181A (en) * 1993-12-16 1996-08-06 Degussa Aktiengesellschaft Process and device for defined impregnation of honeycomb structures with parallel flow channels
US5606438A (en) * 1994-06-11 1997-02-25 Motorola, Inc. Rugged liquid crystal display and method of manufacture
US5637353A (en) * 1990-09-27 1997-06-10 Monsanto Company Abrasion wear resistant coated substrate product
US5654057A (en) * 1994-12-28 1997-08-05 Hoya Corporation Sheet glass flattening method, method of manufacturing glass substrate for an information recording disk using flattened glass, method of manufacturing a magnetic recording disk using glass substrate, and magnetic recording medium
US5701165A (en) * 1994-07-05 1997-12-23 Sharp Kabushiki Kaisha Projection-type liquid crystal display with a liquid crystal panel having a reflection-reducing coating layer
US5715022A (en) * 1989-07-19 1998-02-03 Sharp Kabushiki Kaisha Image display apparatus
US5721601A (en) * 1994-09-29 1998-02-24 Sanyo Electric Co., Ltd. Display units having two insolating films and a planarizing film and process for producing the same
US5767931A (en) * 1995-10-24 1998-06-16 Lucent Technologies Inc. Composite for plastic liquid crystal display
US5766493A (en) * 1995-07-06 1998-06-16 Lg Electronics Inc. Method of fabricating a liquid crystal display substrate
US5781255A (en) * 1992-06-08 1998-07-14 Hitachi, Ltd. Active matrix display device using aluminum alloy in scanning signal line or video signal line
US5784137A (en) * 1995-02-17 1998-07-21 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
US5788871A (en) * 1995-12-26 1998-08-04 Lg Semicon Co., Ltd. Etch-ending point measuring method for wet-etch process
US5808715A (en) * 1997-03-27 1998-09-15 Industrial Technology Research Institute Liquid crystal display devices having undercoat and overcoat made of TiO2 --SiO2 composite material
US5818559A (en) * 1995-09-26 1998-10-06 Fuji Photo Film Co., Ltd. Liquid crystal display having different linear expansion coefficients among the materials of the display
US5819434A (en) * 1996-04-25 1998-10-13 Applied Materials, Inc. Etch enhancement using an improved gas distribution plate
US5835176A (en) * 1997-07-29 1998-11-10 Lg Electronics, Inc. Method for planarizing a substrate of a liquid crystal display
US5917571A (en) * 1996-06-03 1999-06-29 Sharp Kabushiki Kaisha Active matrix substrate having benzocyclobutene-containing interlayer insulating film and method for fabricating same
US6327011B2 (en) * 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US6614493B1 (en) * 1996-11-27 2003-09-02 Lg. Philips Lcd Co., Ltd. Liquid crystal display and method of manufacturing the same
US6853433B2 (en) * 2002-11-11 2005-02-08 Lg. Philips Lcd Co., Ltd. Liquid crystal display device having soda-lime glass and method of fabricating the same
US6873391B2 (en) * 2000-10-23 2005-03-29 Lg. Philips Lcd Co., Ltd. LCD panel and method for fabricating the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1200180A (en) 1957-02-18 1959-12-18 Corning Glass Works Process for the regeneration of glass etching baths
GB829605A (en) 1957-02-18 1960-03-02 Corning Glass Works Method of regenerating a glass etching bath
DE1920009B2 (en) 1969-04-19 1971-11-11 Dunchen, Hannes, 3340 Wolfen buttel METHOD AND DEVICE FOR TREATMENT OF SOLID POLISHING ACID
JPS60163435A (en) 1984-02-03 1985-08-26 Toshiba Corp Semiconductor wafer cleaning device
GB2178894B (en) 1985-08-06 1988-07-27 Gen Electric Co Plc Preparation of fragile devices
GB2178895B (en) 1985-08-06 1988-11-23 Gen Electric Co Plc Improved preparation of fragile devices
DE3611387A1 (en) 1986-04-04 1987-10-15 Semax Gmbh Prozesstechnik Installation and method for producing integrated circuits or the like from silicon or from gallium arsenide wafers or the like
JPH0630351B2 (en) 1987-03-31 1994-04-20 株式会社東芝 Cleaning end point determination method for semiconductor manufacturing equipment
JPH01189631A (en) 1988-01-26 1989-07-28 Seiko Epson Corp Production of liquid crystal panel electrode
JPH02138459A (en) 1988-11-16 1990-05-28 Raimuzu:Kk Laminated hard material and production thereof
JP2786865B2 (en) 1988-11-24 1998-08-13 大日本印刷株式会社 Manufacturing method of color filter
JP2678044B2 (en) 1989-01-25 1997-11-17 松下電器産業株式会社 Active matrix substrate manufacturing method
JPH0679512B2 (en) 1989-06-20 1994-10-05 シャープ株式会社 Method for manufacturing thin film EL panel
US6067062A (en) 1990-09-05 2000-05-23 Seiko Instruments Inc. Light valve device
JP2722798B2 (en) 1990-09-07 1998-03-09 カシオ計算機株式会社 Method for manufacturing thin liquid crystal display element
JP2963529B2 (en) 1990-10-29 1999-10-18 シャープ株式会社 Active matrix display device
JPH0561011A (en) 1991-09-03 1993-03-12 Rohm Co Ltd Method for manufacturing liquid crystal display element
JP2678325B2 (en) 1992-03-06 1997-11-17 カシオ計算機株式会社 Manufacturing method of liquid crystal display element
JP2678326B2 (en) 1992-03-06 1997-11-17 カシオ計算機株式会社 Manufacturing method of liquid crystal display element
KR950011951B1 (en) * 1992-12-04 1995-10-12 삼성전관주식회사 Liquid crystal display and its manufacturing method
JPH07168172A (en) 1993-12-16 1995-07-04 Canon Inc Liquid crystal display and its production
US5990992A (en) * 1997-03-18 1999-11-23 Nippon Sheet Glass Co., Ltd. Image display device with plural planar microlens arrays

Patent Citations (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756898A (en) * 1969-07-14 1973-09-04 Buckbee Mears Co Resistant system suitable for controlling etching without the aid of an etchant
US3689333A (en) * 1970-08-24 1972-09-05 Tasope Ltd Etching machine and method for making printing plates
US3869313A (en) * 1973-05-21 1975-03-04 Allied Chem Apparatus for automatic chemical processing of workpieces, especially semi-conductors
US4147581A (en) * 1976-03-29 1979-04-03 Philip A. Hunt Chemical Corp. Etching of metal
US4125594A (en) * 1976-12-22 1978-11-14 Corning Glass Works Purification of hydrofluoric acid etching solutions with weak anion exchange resins
US4240880A (en) * 1978-07-25 1980-12-23 Sumitomo Metal Mining Co., Ltd. Method and apparatus for selectively plating a material
US4341841A (en) * 1978-11-13 1982-07-27 Nhk Spring Co., Ltd. Multi-layer coating protective film form
US4332649A (en) * 1979-12-07 1982-06-01 Saelzle Erich Method of polishing glass ware with sulfuric acid and hydrofluoric acid
US4431683A (en) * 1981-04-24 1984-02-14 Hitachi, Ltd. Process for producing transparent electroconductive film
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US4501636A (en) * 1983-12-28 1985-02-26 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for etching vertical junction solar cell wafers
US4624729A (en) * 1984-10-30 1986-11-25 Vitreal Specchi S.P.A. Machine for continuously etching a surface of glass sheets
US4715686A (en) * 1984-11-16 1987-12-29 Seiko Epson Corporation Light-passive display device and method of manufacturing same
US4671814A (en) * 1985-03-08 1987-06-09 Central Glass Company Method of strengthening glass article formed of float glass by ion exchange
US4953952A (en) * 1985-05-02 1990-09-04 Sumitomo Chemical Company, Ltd. Color liquid crystal displaying panels
US4846868A (en) * 1986-09-05 1989-07-11 Central Glass Company, Limited Chemically strengthened glass article and method of producing same
US4826556A (en) * 1987-10-01 1989-05-02 Nippon Scientific Co., Ltd. Plastic mold decapsuling apparatus
US4886590A (en) * 1987-11-02 1989-12-12 Man-Gill Chemical Company Chemical process control system
US5002627A (en) * 1988-08-12 1991-03-26 International Business Machines Corporation Spray etching apparatus with automatic individually controllable etching jets
US4980017A (en) * 1988-10-01 1990-12-25 Nisso Engineering Company, Ltd. Method for recirculating high-temperature etching solution
US5159787A (en) * 1989-01-20 1992-11-03 Nkk Corporation Method for lapping two surfaces of a titanium disk
US5260174A (en) * 1989-02-17 1993-11-09 Dai Nippon Insatsu Kabushiki Kaisha Method and apparatus for forming a coating of a viscous liquid on an object
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
US5715022A (en) * 1989-07-19 1998-02-03 Sharp Kabushiki Kaisha Image display apparatus
US5260157A (en) * 1989-10-20 1993-11-09 Mita Industrial Co., Ltd. Electrophotographic photosensitive element comprising a surface protective layer comprising an etherified melamine-formaldehyde resin
US5112437A (en) * 1990-02-20 1992-05-12 Dainippon Screen Mfg. Co., Ltd. Oxide film removing apparatus and removing method thereof using azeotropic vapor mixture
US5034061A (en) * 1990-03-15 1991-07-23 General Electric Company Transparent shatter-resistant silicone coating
US5319479A (en) * 1990-09-04 1994-06-07 Ricoh Company, Ltd. Deposited multi-layer device with a plastic substrate having an inorganic thin film layer
US5637353A (en) * 1990-09-27 1997-06-10 Monsanto Company Abrasion wear resistant coated substrate product
US5082518A (en) * 1990-10-29 1992-01-21 Submicron Systems, Inc. Sparger plate for ozone gas diffusion
US5112453A (en) * 1990-10-31 1992-05-12 Behr Omri M Method and apparatus for producing etched plates for graphic printing
US5251980A (en) * 1990-12-14 1993-10-12 Anritsu Corporation Sensing system for measuring specific value of substance to be measured by utilizing change in thermal resistance
US5424876A (en) * 1991-10-31 1995-06-13 Asahi Kogaku Kogyo Kabushiki Kaisha Surface reflecting mirror having a silicon dioxide under layer
US5164018A (en) * 1992-03-18 1992-11-17 Barcelona Jr Russell L Water-spot remover containing hydrofluoric acid, ammonium fluoride, and an alcohol
US5246540A (en) * 1992-04-01 1993-09-21 Tru Vue, Inc. Apparatus and method for etching glass
US5371619A (en) * 1992-04-30 1994-12-06 Apple Computer, Inc. Optically coupled liquid crystal cell with grease
US5277715A (en) * 1992-06-04 1994-01-11 Micron Semiconductor, Inc. Method of reducing particulate concentration in process fluids
US5781255A (en) * 1992-06-08 1998-07-14 Hitachi, Ltd. Active matrix display device using aluminum alloy in scanning signal line or video signal line
US5514850A (en) * 1992-06-30 1996-05-07 Sharp Kabushiki Kaisha Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam
US5434433A (en) * 1992-08-19 1995-07-18 Seiko Instruments Inc. Semiconductor device for a light wave
US5429711A (en) * 1992-09-18 1995-07-04 Mitsubishi Materials Corporation Method for manufacturing wafer
US5403616A (en) * 1992-10-27 1995-04-04 Matsushita Electric Industrial Co., Ltd. Method for forming patterned transparent conducting film
US5378308A (en) * 1992-11-09 1995-01-03 Bmc Industries, Inc. Etchant distribution apparatus
US5389148A (en) * 1993-01-28 1995-02-14 Nordson Corporation Spray apparatus utilizing porous sheet
US5437896A (en) * 1993-07-06 1995-08-01 U.S. Philips Corporation Method of preparing a composite material of silica network and chains of a polyhydroxy compound and a liquid crystal display device incorporating such composite material
US5543181A (en) * 1993-12-16 1996-08-06 Degussa Aktiengesellschaft Process and device for defined impregnation of honeycomb structures with parallel flow channels
US5505804A (en) * 1993-12-24 1996-04-09 Sharp Kabushiki Kaisha Method of producing a condenser lens substrate
US5606438A (en) * 1994-06-11 1997-02-25 Motorola, Inc. Rugged liquid crystal display and method of manufacture
US5701165A (en) * 1994-07-05 1997-12-23 Sharp Kabushiki Kaisha Projection-type liquid crystal display with a liquid crystal panel having a reflection-reducing coating layer
US5540784A (en) * 1994-09-23 1996-07-30 United Laboratories, Inc. Pressurized closed flow cleaning system
US5721601A (en) * 1994-09-29 1998-02-24 Sanyo Electric Co., Ltd. Display units having two insolating films and a planarizing film and process for producing the same
US5654057A (en) * 1994-12-28 1997-08-05 Hoya Corporation Sheet glass flattening method, method of manufacturing glass substrate for an information recording disk using flattened glass, method of manufacturing a magnetic recording disk using glass substrate, and magnetic recording medium
US5784137A (en) * 1995-02-17 1998-07-21 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
US5766493A (en) * 1995-07-06 1998-06-16 Lg Electronics Inc. Method of fabricating a liquid crystal display substrate
US5818559A (en) * 1995-09-26 1998-10-06 Fuji Photo Film Co., Ltd. Liquid crystal display having different linear expansion coefficients among the materials of the display
US5767931A (en) * 1995-10-24 1998-06-16 Lucent Technologies Inc. Composite for plastic liquid crystal display
US5788871A (en) * 1995-12-26 1998-08-04 Lg Semicon Co., Ltd. Etch-ending point measuring method for wet-etch process
US5819434A (en) * 1996-04-25 1998-10-13 Applied Materials, Inc. Etch enhancement using an improved gas distribution plate
US5917571A (en) * 1996-06-03 1999-06-29 Sharp Kabushiki Kaisha Active matrix substrate having benzocyclobutene-containing interlayer insulating film and method for fabricating same
US6614493B1 (en) * 1996-11-27 2003-09-02 Lg. Philips Lcd Co., Ltd. Liquid crystal display and method of manufacturing the same
US5808715A (en) * 1997-03-27 1998-09-15 Industrial Technology Research Institute Liquid crystal display devices having undercoat and overcoat made of TiO2 --SiO2 composite material
US5835176A (en) * 1997-07-29 1998-11-10 Lg Electronics, Inc. Method for planarizing a substrate of a liquid crystal display
US6327011B2 (en) * 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US6873391B2 (en) * 2000-10-23 2005-03-29 Lg. Philips Lcd Co., Ltd. LCD panel and method for fabricating the same
US6853433B2 (en) * 2002-11-11 2005-02-08 Lg. Philips Lcd Co., Ltd. Liquid crystal display device having soda-lime glass and method of fabricating the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793299B2 (en) 2005-12-26 2017-10-17 Japan Display Inc. Display device and hand-held electronic device
US20090213306A1 (en) * 2005-12-26 2009-08-27 Koichi Fukuda Liquid Crystal Display and Display
US8045101B2 (en) 2005-12-26 2011-10-25 Hitachi Displays, Ltd. Liquid crystal display and display
US8164717B2 (en) 2005-12-26 2012-04-24 Hitachi Displays, Ltd. Liquid crystal display and display
US9013653B2 (en) 2005-12-26 2015-04-21 Japan Display Inc. Display device and hand-held electronic device
CN104865727A (en) * 2005-12-26 2015-08-26 株式会社日立显示器 Display
US7532274B2 (en) 2005-12-26 2009-05-12 Hitachi Displays, Ltd. Liquid crystal display and display
US10332915B2 (en) 2005-12-26 2019-06-25 Japan Display Inc. Display device and hand-held electronic device
US10831048B2 (en) 2005-12-26 2020-11-10 Japan Display Inc. Display device and hand-held electronic device
US20200096673A1 (en) * 2018-09-26 2020-03-26 Innolux Corporation Method for manufacturing electronic device
US10809422B2 (en) * 2018-09-26 2020-10-20 Innolux Corporation Method for manufacturing electronic device
US20200408962A1 (en) * 2018-09-26 2020-12-31 Innolux Corporation Method for manufacturing electronic device
US11899166B2 (en) * 2018-09-26 2024-02-13 Innolux Corporation Method for manufacturing electronic device

Also Published As

Publication number Publication date
US6327011B2 (en) 2001-12-04
US20010012083A1 (en) 2001-08-09
US6955840B2 (en) 2005-10-18
US20020015806A1 (en) 2002-02-07

Similar Documents

Publication Publication Date Title
US6955840B2 (en) Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
US9431467B2 (en) Flexible display panel comprising first and second etching stop layers and electro-optical device
US7961262B2 (en) Liquid crystal display and manufacturing method thereof
US7456927B2 (en) Liquid crystal display device and method of fabricating the same
US20150323821A1 (en) Display panel
US20170200750A1 (en) Method for manufacturing array substrate
US20050195347A1 (en) Transflective LCD device
US20120266450A1 (en) Method of manufacturing in-plane switching mode liquid crystal display
US7420640B2 (en) In-plane switching mode liquid crystal device and method for manufacturing the same
US20090103031A1 (en) Liquid Crystal Display Device
KR100252650B1 (en) Liquid crystal display device
KR100211633B1 (en) A thin glass substrate having passivation layer of lcd and method for manufacturing thereof
JPH08248428A (en) Thin-film liquid-crystal display element panel and its manufacture
US6930748B2 (en) Liquid crystal display device and method for manufacturing the same
US7405778B2 (en) Liquid crystal display and fabrication method thereof
GB2283123A (en) Liquid crystal display
KR20040025472A (en) In plane switching mode liquid crystal display device
KR100978251B1 (en) In plane switching mode liquid crystal display device having multi black matrix
US20100230044A1 (en) Bubbleless packaging method
KR100848553B1 (en) A method of fabricating liquid crystal display device without damage of gate pad
KR100841614B1 (en) An in plane switching mode liquid crystal display device and a method of fabricating thereof
KR100899626B1 (en) In plane switching mode liquid crystal display device and method of fabricating thereof
US6961109B2 (en) Liquid crystal displays
KR20040035181A (en) Liquid crystal display device and method of fabricating thereof
KR20010097927A (en) Method for manufacturing InPlane Switching - Thin Film Transistor - Liquid Crystal Display

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: LG DISPLAY CO., LTD., KOREA, REPUBLIC OF

Free format text: CHANGE OF NAME;ASSIGNOR:LG.PHILIPS LCD CO., LTD.;REEL/FRAME:021147/0009

Effective date: 20080319

Owner name: LG DISPLAY CO., LTD.,KOREA, REPUBLIC OF

Free format text: CHANGE OF NAME;ASSIGNOR:LG.PHILIPS LCD CO., LTD.;REEL/FRAME:021147/0009

Effective date: 20080319