US20060105596A1 - Two piece mid-plane - Google Patents
Two piece mid-plane Download PDFInfo
- Publication number
- US20060105596A1 US20060105596A1 US10/988,029 US98802904A US2006105596A1 US 20060105596 A1 US20060105596 A1 US 20060105596A1 US 98802904 A US98802904 A US 98802904A US 2006105596 A1 US2006105596 A1 US 2006105596A1
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- US
- United States
- Prior art keywords
- circuit board
- printed circuit
- mid
- plane
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Definitions
- the present invention relates to a mid-plane printed circuit board. Specifically, the present invention relates to a mid-plane circuit board having a two piece construction.
- Printed circuit boards are thin plates in which chips and other electronic devices are placed. The chips and other electronic devices are then electrically connected to each other using conductive traces on the circuit board.
- mid-plane printed circuit boards have electrical devices attached to both faces or surfaces of the board and have between one and sixteen conductive layers laminated or glued together. As mid-plane boards become more and more complicated, additional conductive layers are needed. In turn, the additional conductive layers require the mid-plane to become thicker and thicker.
- the vias in the mid-plane that connect the electrical modules on the surface of the mid-plane to the traces on the various layers in the mid-plane become deeper.
- the thickness of printed circuit boards may become an issue when a via must be plated to meet a particular aspect ratio (the ratio of the thickness of the printed circuit board to the diameter of the via).
- Typical guidelines from printed circuit board manufacturers are that the aspect ratio should be below 8-12.
- the maximum mid-plane thickness for a press fit via that employs a 0.6 mm drill and having an aspect ratio of 10 would be 6 mm.
- “deep” vias become increasingly more difficult to plate effectively and any electrical communication that occurs through the via may become compromised. Additionally, the “deep” vias may require that the mid-plane be back drilled.
- One purpose of backdrilling is to reduce the length of the via which improves high speed signal characteristics. Long vias act as capacitive stubs which degrade signals as transmission speeds increase. As a result, the manufacturing time and costs associated with thicker mid-planes may increase.
- the present invention overcomes the aforementioned issues by providing, among other things, a two piece mid-plane construction.
- manufacturing time and costs may be reduced because the vias in the mid-plane may be plated more efficiently.
- back-drilling the mid-planes may be eliminated.
- a two piece mid-plane construction may create internal or blind vias using conventional printed circuit board construction techniques rather than current high risk, experimental blind via construction techniques.
- a mid-plane can be, and preferably is, made of a two piece construction.
- the mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector.
- the first circuit board also has a plurality of unplated clearance holes adapted to receive tails attached to a second connector.
- the mid-plane also includes a second printed circuit board having a plurality of plated vias adapted to receive tails attached to the second connector and having a plurality of unplated clearance adapted to receive tails attached to the first connector.
- FIG. 1 shows a typical mid-plane having two connectors attached thereto
- FIG. 2 shows one embodiment of a two piece mid-plane according to the invention
- FIG. 3 shows a cross sectional view of the two piece mid-plane of FIG. 2 ;
- FIG. 4 shows a reverse cross sectional view of the two piece mid-plane of FIG. 2 .
- FIG. 1 shows a typical mid-plane 100 having two connectors attached thereto.
- connector 105 and connector 115 are attached to the mid-plane 110 .
- connector 105 is attached to one surface 106 of mid-plane 110 and connector 115 is connected to another surface 108 of mid-plane 110 .
- Conductive pins 107 on connector 105 extend into mid-plane 110 such that electrical communication is established between the connector 105 and the mid-plane 110 .
- conductive pins 117 on connector 115 extend into mid-plane 110 such that electrical communication can be established between the connector 115 and the mid-plane 110 .
- Plated vias (not shown) are typically used to establish electrical connection between the connectors 105 and 115 and the mid-plane 110 .
- FIG. 2 shows one embodiment of a two piece mid-plane according to the invention.
- the mid-plane 200 according to the invention is comprised of two pieces.
- the mid-plane 200 includes printed circuit board A 220 and printed circuit board B 215 .
- Conductive pins 212 on connector 210 extend into mid-plane 200 such that electrical communication can be established between the connector 210 and the mid-plane 200 .
- conductive pins 207 on connector 205 extend into mid-plane 200 such that electrical communication can be established between the connector 205 and the mid-plane 200 .
- FIG. 1 shows one embodiment of a two piece mid-plane according to the invention.
- the mid-plane 200 is comprised of two pieces.
- the mid-plane 200 includes printed circuit board A 220 and printed circuit board B 215 .
- Conductive pins 212 on connector 210 extend into mid-plane 200 such that electrical communication can be established between the connector 210 and the mid-plane 200 .
- an electrically conductive material such as copper sheet 271
- an electrically conductive material between the printed circuit boards may or may not be used without departing from the scope of invention.
- an adhesive material (not shown) may be used between the printed circuit board A 220 and printed circuit board B 215 .
- no adhesive material may be used without departing from the invention.
- FIG. 3 shows a cross sectional view of the two piece mid-plane of FIG. 2 .
- the mid-plane 200 includes printed circuit board A 220 and printed circuit board B 215 .
- Conductive pins 207 on connector 205 extend into mid-plane 200 such that electrical communication can be established between the connector 205 and the mid-plane 200 .
- conductive pins 212 on connector 210 extend into mid-plane 200 such that electrical communication can be established between the connector 210 and the mid-plane 200 .
- printed circuit board 215 includes vias 245 that are plated with a conductive material such that electrical communication can be established with printed circuit board A 215 of mid-plane 200 .
- Conductive pins 212 also extend through clearance holes 270 drilled through printed circuit board B 220 of mid-plane 200 .
- clearance holes 270 in printed circuit board B 220 are not plated with a conductive material and therefore no electrical communication is established between board 220 and connector 210 .
- clearance holes 270 in printed circuit board B 220 are plated with a conductive material and therefore an electrical communication can be established between board 220 and connector 210
- conductive pins 212 can include terminal tails 275 .
- terminal tails 275 of conductive pins 212 may be press fit tails.
- any kind of pin tail may be used without departing from the invention.
- solder tails using pin-in-paste or double sided solder reflow methods may be used without departing from the invention.
- an electrically conductive material such as copper sheet 271 , can be inserted between the two printed circuit boards to carry high and low current or act as an electrical ground.
- FIG. 4 shows a reverse cross sectional view of the two piece mid-plane of FIG. 2 .
- the mid-plane 200 includes printed circuit board A 220 and printed circuit board B 215 .
- Conductive pins 212 on connector 210 extend into mid-plane 200 such that electrical communication can be established between the connector 210 and the mid-plane 200 .
- conductive pins 207 on connector 205 extend into mid-plane 200 such that electrical communication can be established between the connector 205 and the mid-plane 200 .
- printed circuit board 220 includes vias 222 that are plated with a conductive material such that electrical communication can be established with printed circuit board 220 of mid-plane 200 .
- Conductive pins 207 also extend through clearance holes 290 drilled through printed circuit board 215 of mid-plane 200 .
- clearance holes 290 in printed circuit board A 215 are not plated with a conductive material and therefore no electrical communication is established between board 215 and connector 205 .
- clearance holes 290 in printed circuit board A 215 are plated with a conductive material and therefore an electrical communication can be established between board 215 and connector 205 .
- conductive pins 207 can include a terminal tails 292 .
- terminal tail 292 of conductive pins 207 may be press fit tails.
- any kind of pin tail may be used without departing from the invention.
- solder tails using pin-in-paste or double sided solder reflow methods may be used without departing from the invention.
- an electrically conductive material such as copper sheet 271 , can be inserted between the two printed circuit boards to carry high and low current or act as an electrical ground.
- the depth of the vias on each of the two pieces of the mid-plane are effectively reduced by half.
- the vias may be more easily and effectively plated which allows for better electrical communication between any electrical device in communication with the via. Additionally, be reducing the depth of the via, back-drilling may be eliminated.
- conductive pins 212 and 207 may be used to secure printed circuit board A 215 and printed circuit board B 220 together.
- clearance holes and vias in printed circuit board A 215 and printed circuit board B 220 may be dimensioned such that an interference fit occurs between the conductive pins 212 and 207 and the printed circuit boards 215 and 220 .
- the aforementioned adhesive material need not be used to secure printed circuit board A 215 and printed circuit board B 220 together.
Abstract
Description
- The present invention relates to a mid-plane printed circuit board. Specifically, the present invention relates to a mid-plane circuit board having a two piece construction.
- Printed circuit boards are thin plates in which chips and other electronic devices are placed. The chips and other electronic devices are then electrically connected to each other using conductive traces on the circuit board. Typically, mid-plane printed circuit boards have electrical devices attached to both faces or surfaces of the board and have between one and sixteen conductive layers laminated or glued together. As mid-plane boards become more and more complicated, additional conductive layers are needed. In turn, the additional conductive layers require the mid-plane to become thicker and thicker.
- Consequently, the vias in the mid-plane that connect the electrical modules on the surface of the mid-plane to the traces on the various layers in the mid-plane become deeper. The thickness of printed circuit boards may become an issue when a via must be plated to meet a particular aspect ratio (the ratio of the thickness of the printed circuit board to the diameter of the via). Typical guidelines from printed circuit board manufacturers are that the aspect ratio should be below 8-12. For example, the maximum mid-plane thickness for a press fit via that employs a 0.6 mm drill and having an aspect ratio of 10 would be 6 mm.
- As a result of thicker mid-planes, “deep” vias become increasingly more difficult to plate effectively and any electrical communication that occurs through the via may become compromised. Additionally, the “deep” vias may require that the mid-plane be back drilled. One purpose of backdrilling is to reduce the length of the via which improves high speed signal characteristics. Long vias act as capacitive stubs which degrade signals as transmission speeds increase. As a result, the manufacturing time and costs associated with thicker mid-planes may increase.
- Consequently, there is a need for a low cost mid-plane that can be efficiently and effectively manufactured.
- The present invention overcomes the aforementioned issues by providing, among other things, a two piece mid-plane construction. By providing a two piece mid-plane, manufacturing time and costs may be reduced because the vias in the mid-plane may be plated more efficiently. Additionally, back-drilling the mid-planes may be eliminated. Furthermore, a two piece mid-plane construction may create internal or blind vias using conventional printed circuit board construction techniques rather than current high risk, experimental blind via construction techniques.
- In one embodiment of the invention, a mid-plane can be, and preferably is, made of a two piece construction. In this manner, the mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector. The first circuit board also has a plurality of unplated clearance holes adapted to receive tails attached to a second connector. The mid-plane also includes a second printed circuit board having a plurality of plated vias adapted to receive tails attached to the second connector and having a plurality of unplated clearance adapted to receive tails attached to the first connector.
- The invention is further described in the detailed description that follows, by reference to the noted drawings by way of non-limiting illustrative embodiments of the invention, in which like reference numerals represent similar parts throughout the drawings, and wherein:
-
FIG. 1 shows a typical mid-plane having two connectors attached thereto; -
FIG. 2 shows one embodiment of a two piece mid-plane according to the invention; -
FIG. 3 shows a cross sectional view of the two piece mid-plane ofFIG. 2 ; and -
FIG. 4 shows a reverse cross sectional view of the two piece mid-plane ofFIG. 2 . -
FIG. 1 shows atypical mid-plane 100 having two connectors attached thereto. As shown,connector 105 andconnector 115 are attached to the mid-plane 110. Particularly,connector 105 is attached to onesurface 106 of mid-plane 110 andconnector 115 is connected toanother surface 108 of mid-plane 110.Conductive pins 107 onconnector 105 extend into mid-plane 110 such that electrical communication is established between theconnector 105 and the mid-plane 110. Also,conductive pins 117 onconnector 115 extend into mid-plane 110 such that electrical communication can be established between theconnector 115 and the mid-plane 110. Plated vias (not shown) are typically used to establish electrical connection between theconnectors -
FIG. 2 shows one embodiment of a two piece mid-plane according to the invention. Unlike the typical mid-plane shown inFIG. 1 , the mid-plane 200 according to the invention is comprised of two pieces. As shown, themid-plane 200 includes printed circuit board A 220 and printedcircuit board B 215.Conductive pins 212 onconnector 210 extend into mid-plane 200 such that electrical communication can be established between theconnector 210 and the mid-plane 200. Also,conductive pins 207 onconnector 205 extend into mid-plane 200 such that electrical communication can be established between theconnector 205 and the mid-plane 200. As shown inFIG. 2 , in one embodiment, an electrically conductive material, such ascopper sheet 271, can be inserted between the two printed circuit boards to carry high and low current or act as an electrical ground. However, an electrically conductive material between the printed circuit boards may or may not be used without departing from the scope of invention. - In one embodiment of the invention, an adhesive material (not shown) may be used between the printed circuit board A 220 and printed
circuit board B 215. However, no adhesive material may be used without departing from the invention. -
FIG. 3 shows a cross sectional view of the two piece mid-plane ofFIG. 2 . As shown, like inFIG. 2 , themid-plane 200 includes printed circuit board A 220 and printedcircuit board B 215.Conductive pins 207 onconnector 205 extend into mid-plane 200 such that electrical communication can be established between theconnector 205 and the mid-plane 200. - As can be seen in
FIG. 3 ,conductive pins 212 onconnector 210 extend into mid-plane 200 such that electrical communication can be established between theconnector 210 and the mid-plane 200. Specifically, printedcircuit board 215 includesvias 245 that are plated with a conductive material such that electrical communication can be established with printed circuit board A 215 of mid-plane 200.Conductive pins 212 also extend throughclearance holes 270 drilled through printedcircuit board B 220 of mid-plane 200. In one embodiment of the invention,clearance holes 270 in printedcircuit board B 220 are not plated with a conductive material and therefore no electrical communication is established betweenboard 220 andconnector 210. However, in another embodiment of the invention,clearance holes 270 in printedcircuit board B 220 are plated with a conductive material and therefore an electrical communication can be established betweenboard 220 andconnector 210 - In one embodiment of the invention, as can be seen in
FIG. 3 ,conductive pins 212 can includeterminal tails 275. Specifically, as shown, in one embodiment,terminal tails 275 ofconductive pins 212 may be press fit tails. However, any kind of pin tail may be used without departing from the invention. For example, solder tails using pin-in-paste or double sided solder reflow methods may be used without departing from the invention. Also as shown in the embodiment shown inFIG. 3 , an electrically conductive material, such ascopper sheet 271, can be inserted between the two printed circuit boards to carry high and low current or act as an electrical ground. -
FIG. 4 shows a reverse cross sectional view of the two piece mid-plane ofFIG. 2 . LikeFIG. 2 , the mid-plane 200 includes printed circuit board A 220 and printedcircuit board B 215.Conductive pins 212 onconnector 210 extend intomid-plane 200 such that electrical communication can be established between theconnector 210 and the mid-plane 200. - As can be seen in
FIG. 4 ,conductive pins 207 onconnector 205 extend intomid-plane 200 such that electrical communication can be established between theconnector 205 and the mid-plane 200. Specifically, printedcircuit board 220 includesvias 222 that are plated with a conductive material such that electrical communication can be established with printedcircuit board 220 ofmid-plane 200.Conductive pins 207 also extend throughclearance holes 290 drilled through printedcircuit board 215 ofmid-plane 200. In one embodiment of the invention,clearance holes 290 in printedcircuit board A 215 are not plated with a conductive material and therefore no electrical communication is established betweenboard 215 andconnector 205. However, in another embodiment of the invention,clearance holes 290 in printedcircuit board A 215 are plated with a conductive material and therefore an electrical communication can be established betweenboard 215 andconnector 205. - In one embodiment of the invention, as can be seen in
FIG. 4 ,conductive pins 207 can include aterminal tails 292. Specifically, as shown, in one embodiment,terminal tail 292 ofconductive pins 207 may be press fit tails. However, any kind of pin tail may be used without departing from the invention. For example, solder tails using pin-in-paste or double sided solder reflow methods may be used without departing from the invention. Also as shown in the embodiment shown inFIG. 4 , an electrically conductive material, such ascopper sheet 271, can be inserted between the two printed circuit boards to carry high and low current or act as an electrical ground. - As can be seen from
FIG. 3 andFIG. 4 , by providing a mid-plane having a two piece construction, the depth of the vias on each of the two pieces of the mid-plane are effectively reduced by half. In this manner, the vias may be more easily and effectively plated which allows for better electrical communication between any electrical device in communication with the via. Additionally, be reducing the depth of the via, back-drilling may be eliminated. - In another embodiment of the invention,
conductive pins circuit board A 215 and printedcircuit board B 220 together. In this manner, clearance holes and vias in printedcircuit board A 215 and printedcircuit board B 220 may be dimensioned such that an interference fit occurs between theconductive pins circuit boards circuit board A 215 and printedcircuit board B 220 together. - It is to be understood that the foregoing illustrative embodiments have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the invention. Words which have been used herein are words of description and illustration, rather than words of limitation. Further, although the invention has been described herein with reference to particular structure, materials and/or embodiments, the invention is not intended to be limited to the particulars disclosed herein. Rather, the invention extends to all functionally equivalent structures, methods and uses, such as are within the scope of the appended claims. Those skilled in the art, having the benefit of the teachings of this specification, may affect numerous modifications thereto and changes may be made without departing from the scope and spirit of the invention in its aspects.
Claims (20)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/988,029 US7052288B1 (en) | 2004-11-12 | 2004-11-12 | Two piece mid-plane |
AT05812154T ATE431067T1 (en) | 2004-11-12 | 2005-10-17 | CENTER LEVEL IN TWO PIECES |
PCT/US2005/037183 WO2006055147A1 (en) | 2004-11-12 | 2005-10-17 | Two piece mid-plane |
DE602005014376T DE602005014376D1 (en) | 2004-11-12 | 2005-10-17 | CENTER LEVEL IN TWO PIECES |
CNB2005800385395A CN100511874C (en) | 2004-11-12 | 2005-10-17 | Two component type middle plate and electric piece comprising the same |
EP05812154A EP1813001B1 (en) | 2004-11-12 | 2005-10-17 | Two piece mid-plane |
JP2007541200A JP2008520098A (en) | 2004-11-12 | 2005-10-17 | Two piece intermediate plate |
KR1020077010682A KR20070084174A (en) | 2004-11-12 | 2005-10-17 | Two piece mid-plane |
TW094139306A TWI292644B (en) | 2004-11-12 | 2005-11-09 | Two piece mid-plane |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/988,029 US7052288B1 (en) | 2004-11-12 | 2004-11-12 | Two piece mid-plane |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060105596A1 true US20060105596A1 (en) | 2006-05-18 |
US7052288B1 US7052288B1 (en) | 2006-05-30 |
Family
ID=36386961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/988,029 Expired - Fee Related US7052288B1 (en) | 2004-11-12 | 2004-11-12 | Two piece mid-plane |
Country Status (9)
Country | Link |
---|---|
US (1) | US7052288B1 (en) |
EP (1) | EP1813001B1 (en) |
JP (1) | JP2008520098A (en) |
KR (1) | KR20070084174A (en) |
CN (1) | CN100511874C (en) |
AT (1) | ATE431067T1 (en) |
DE (1) | DE602005014376D1 (en) |
TW (1) | TWI292644B (en) |
WO (1) | WO2006055147A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4047351B2 (en) * | 2005-12-12 | 2008-02-13 | キヤノン株式会社 | Multilayer printed circuit board |
US7540744B1 (en) | 2008-01-08 | 2009-06-02 | Fci Americas Technology, Inc. | Shared hole orthogonal footprint with backdrilled vias |
CN101730383B (en) * | 2008-10-23 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board |
US8060682B1 (en) * | 2008-11-14 | 2011-11-15 | Qlogic, Corporation | Method and system for multi-level switch configuration |
WO2016115205A1 (en) * | 2015-01-15 | 2016-07-21 | Fci Asia Pte. Ltd | Separator for electrical assembly |
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- 2005-10-17 DE DE602005014376T patent/DE602005014376D1/en active Active
- 2005-10-17 EP EP05812154A patent/EP1813001B1/en not_active Not-in-force
- 2005-10-17 JP JP2007541200A patent/JP2008520098A/en active Pending
- 2005-10-17 CN CNB2005800385395A patent/CN100511874C/en not_active Expired - Fee Related
- 2005-10-17 KR KR1020077010682A patent/KR20070084174A/en not_active Application Discontinuation
- 2005-10-17 WO PCT/US2005/037183 patent/WO2006055147A1/en active Application Filing
- 2005-10-17 AT AT05812154T patent/ATE431067T1/en not_active IP Right Cessation
- 2005-11-09 TW TW094139306A patent/TWI292644B/en not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
JP2008520098A (en) | 2008-06-12 |
EP1813001A1 (en) | 2007-08-01 |
EP1813001A4 (en) | 2007-12-12 |
WO2006055147A1 (en) | 2006-05-26 |
TWI292644B (en) | 2008-01-11 |
DE602005014376D1 (en) | 2009-06-18 |
CN101057377A (en) | 2007-10-17 |
CN100511874C (en) | 2009-07-08 |
KR20070084174A (en) | 2007-08-24 |
TW200635152A (en) | 2006-10-01 |
EP1813001B1 (en) | 2009-05-06 |
ATE431067T1 (en) | 2009-05-15 |
US7052288B1 (en) | 2006-05-30 |
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