US20060205113A1 - Radio frequency identification (RFID) tag lamination process - Google Patents
Radio frequency identification (RFID) tag lamination process Download PDFInfo
- Publication number
- US20060205113A1 US20060205113A1 US11/079,143 US7914305A US2006205113A1 US 20060205113 A1 US20060205113 A1 US 20060205113A1 US 7914305 A US7914305 A US 7914305A US 2006205113 A1 US2006205113 A1 US 2006205113A1
- Authority
- US
- United States
- Prior art keywords
- adhesive
- integrated circuit
- protective layer
- circuit chip
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
Description
- Radio Frequency Identification (RFID) tags are typically small objects that can be attached to or incorporated into a product. RFID tags contain antenna to enable them to receive and respond to radio-frequency queries from an RFID tranciever. The RFID tags are used in a host of industries for purposes such as inventory control, security, personal identification and the like.
- The RFID tags can be passive or active. Active devices have their own power supply. Passive devices rely on energization from the RFID tranciever. Passive and active RFID tags can use integrated circuit chips to modulate the identification response.
- The construction of RFID units can consist of the attachment of a chip module to a substrate with an antenna unit. The chip module is typically attached to the substrate with an electrically conductive adhesive and then the combined unit can be further processed after the adhesive sets.
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FIG. 1 is a cross sectional view of an RFID unit of one embodiment. -
FIG. 2 is a top view of an RFID unit of one embodiment. -
FIG. 3 is a diagram of an apparatus to construct an RFID unit of one embodiment. - One embodiment of the present invention comprises a method of constructing an RFID unit. The method comprises attaching an integrated circuit chip to a substrate with an antenna unit using an adhesive; and laminating a protective layer over at least a portion of the integrated circuit chip while the adhesive has not yet fully set.
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FIG. 1 illustrates a cross section diagram of anRFID unit 100 of one embodiment. In this embodiment, theintegrated circuit 102 is part of a module 104 which also includeslead frame elements substrate 110 includingantenna elements conductive adhesive 116. Theconductive adhesive 116 can be a conventional isotropic conductive adhesive, and anisotropic conductive adhesive or even solder such as solder paste. -
FIG. 2 illustrates a top view wheremodule 202 withIC 204 andlead frame antenna unit 210 to form theRFID unit 200. - Looking again at
FIG. 1 , theprotective layer 120 can be laminated over the module 104 including the integratedcircuit 102. Theprotective layer 120 can hold themodule 102 in place while theconductive adhesive 116 sets. - The laminating protective layer can be made of many type of materials including thermoplastic material, thermoset material, polyester, polystyrene, polypropylene, polyethylene. The protective layer may have an adhesive layer. In one embodiment, the protective layer is relatively stretchy and will conform the shape of the module or integrated circuit chip. In one embodiment, since the lamination is done before the adhesive is fully set, there does not have to be any dwell time between attaching and laminating steps. In one embodiment, the dwell time can be reduced below a minute. The attachment step can be done at a high rate due to the lack of requirement for the conductive adhesive to fully set. In one embodiment, the attachment is done at a rate of one attachment per second or greater. The conductive adhesive can be of such that it takes a long time to fully set since the protective layer holds the module in place. Thus, the conductive adhesive can take over a day to fully set, which can greatly increase the pot time of the adhesive in the apparatus to produce the RFID units.
- The protective layer can have a radiation or heat curable adhesive. In one embodiment, the protective layer has an ultra violet (UV) curable adhesive that can be cured in a later step.
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FIG. 3 illustrates an apparatus of one embodiment. In this embodiment, the laminating protective layer is held in a strip onroll 302. If the protective layer has a liner it can be removed ontoroll 304. Aroll 305 containing a strip with chip modules can feed to device 307 which can attached the chip module up side down on theprotective layer 308. The antenna material can be a strip on roll 310. The conductive adhesive can be provided by anadhesive dispenser 314 to dispense upon module, such as on the leadframe of the module. Anattachment unit 316 attaches theprotective layer 308 with modules to theantenna material strip 309.Dancers protective layer 308. Alamination unit 322 can later be used to laminate the protective layer over the integrated circuit chip module. The finished material can be rolled up into aroll 324 which can be held for later processing. The later processing can include cure step which can be done at a separate location from theapparatus 300. The laminatingunit 322 can use hot rollers. The attachingunit 316 can operate at a rate greater than one attachment per second or greater. - In the example of
FIG. 3 , the integrated circuit chip (as part of the chip module) is attached to the protective layer before the attaching unit. This need not be the case, but it can allow the chips to be spaced on a strip such that the chips will register in position with the substrate strip having the antenna unit. In an alternate embodiment, the integrated circuit chip, as part of the chip module, is attached to the substrate with antenna first followed by the lamination of the protective layer. - One embodiment of the present invention is a method of constructing an RFID unit comprising using a conductive adhesive to attach an integrated circuit chip module to a substrate with an antenna unit; and laminating a protective layer over at least a part of the integrated circuit chip module while the conductive adhesive has not yet fully set.
- One embodiment of the present invention is a method of constructing an RFID unit comprising placing a integrated circuit chip module on a protective layer, wherein the protective layer includes an adhesive to hold the integrated circuit module; placing a conductive adhesive on at least portions of the integrated circuit chip module; and attaching the integrated circuit chip module to a substrate with an antenna unit.
- One embodiment of the present invention is an RFID unit comprising a substrate with an antenna unit; an integrated circuit chip to the substrate with an antenna unit using an adhesive; and a protective layer laminated over at least a part of the integrated circuit chip while the adhesive has not yet fully set.
- The chip module can be a single chip attached to a lead frame or suitable substrate with appropriate electrical connections for attachment to the antenna-examples of chip modules are offered by Philips Electronics, Netherlands (FCP package) and Alien Technologies of Morgan Hill Calif. (Alien Strap) The lead frame can terminates in two pads, which are intended to attach to the RFID circuit by a conductive adhesive. Chip modules can be utilized in order to alleviate the difficulties that normally arise when placing a small integrated circuits (typical integrated circuits are <1 mm square, and the areal density of integrated circuits are typically very low, <0.25 units/square inch). In traditional application, the mounting of small integrated circuits without a leadframe leads to low process throughput owing to the time delay inherent in locating and placing such a small integrated circuit.
- The disadvantages of previous processes relate to process throughput and reliability. Application of non-conductive epoxy under the integrated circuit and conductive epoxy to the outer leads results in a mechanically and electrically reliable assembly, however the dwell time for the circuit, i.e. that time that the circuit must be immobilized while the adhesives cure is typically several minutes. This may be decreased by using faster curing epoxy resins however the inherent chemical instability of so-called snap cure resins makes handling difficult and leads to excessive yield loss or high material wastage. Anisotropic adhesives, either tapes or pastes offer increased throughput with respect to epoxy adhesives however the dwell time per attachment is typically several seconds and during the dwell time the module must be held immobile on the substrate using considerable pressure to effect a reliable electrical connection. The use of a laminated protective layer can produce a throughput in excess of one attachment per second that insures mechanical stability of the device. The equipment can be relatively simple to maintain a very low cost of ownership of the overall process. This can be as low as $0.01 or less per attachment when considering the overall cost of materials and equipment amortization.
- In one embodiment, a traditional conductive adhesive can be placed over the terminals of the circuit to which the module is to be attached or placed on the terminals of the module prior to assembly.
- The module can be placed on the substrate with contact of the terminals of the module on the appropriate terminal of the circuit. Alternatively, the module may be temporarily attached to a tape which is subsequently laminated to the circuit.
- A protective layer can be laminated over the module of a tape which holds the module in place while the adhesive is cured (partially or fully). The tape may held in place by a variety of adhesives including an adhesive selected from any of a number of adhesive types; hot melt, pressure sensitive, UV cure, thermoset etc. This laminate may cover the module fully or partially or it may be advantageous to use a segmented or multiple adhesives for specific uses.
- A curing step can be done to set, such as cure, the conductive adhesive. This step may be of a type that initiates cure of the adhesive which proceeds after the circuit has been removed from the immediate vicinity of the attachment and/or curing station.
- The protective layer can form a protective cover for the module, particularly if the laminate conforms closely to the shape of the module after lamination. There is no requirement for dwell time in the placement equipment. This means that parts with a partially cured adhesive can be safely rolled up and stored while the curing process takes place. This has the dual benefit of increasing process throughput and reducing material waste costs. Tape lamination equipment presently available can be modified to suit this application. The throughput of exiting equipment is sufficient to meet the imperative of a low cost high throughput process for placement and attachment of the module.
- In alternate embodiments, a curable adhesive can be placed over the module contemporaneously with the conductive adhesive; an anisotropic adhesive can be used rather than traditional conductive adhesive; and/or an anisotropic adhesive can be used in place of both the traditional conductive adhesive and a laminating adhesive.
- An alternate embodiment is a method for constructing a flexible circuit comprising attaching an integrated circuit chip to a substrate with an circuit traces using an adhesive; and laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.
- The foregoing description of preferred embodiments of the present invention has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications that are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (18)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/079,143 US20060205113A1 (en) | 2005-03-14 | 2005-03-14 | Radio frequency identification (RFID) tag lamination process |
US11/284,761 US7456506B2 (en) | 2005-03-14 | 2005-11-22 | Radio frequency identification (RFID) tag lamination process using liner |
PCT/US2006/007283 WO2006098879A1 (en) | 2005-03-14 | 2006-03-01 | Radio frequency identification (rfid) tag lamination process using liner |
BRPI0608463-0A BRPI0608463A2 (en) | 2005-03-14 | 2006-03-01 | radiofrequency identification tag (rfid) lamination process using coating |
TW095108632A TW200703550A (en) | 2005-03-14 | 2006-03-14 | Radio frequency identification (RFID) tag lamination process using liner |
US12/187,143 US7674649B2 (en) | 2005-03-14 | 2008-08-06 | Radio frequency identification (RFID) tag lamination process using liner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/079,143 US20060205113A1 (en) | 2005-03-14 | 2005-03-14 | Radio frequency identification (RFID) tag lamination process |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/284,761 Continuation-In-Part US7456506B2 (en) | 2005-03-14 | 2005-11-22 | Radio frequency identification (RFID) tag lamination process using liner |
US12/187,143 Continuation US7674649B2 (en) | 2005-03-14 | 2008-08-06 | Radio frequency identification (RFID) tag lamination process using liner |
Publications (1)
Publication Number | Publication Date |
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US20060205113A1 true US20060205113A1 (en) | 2006-09-14 |
Family
ID=36971527
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/079,143 Abandoned US20060205113A1 (en) | 2005-03-14 | 2005-03-14 | Radio frequency identification (RFID) tag lamination process |
US12/187,143 Expired - Fee Related US7674649B2 (en) | 2005-03-14 | 2008-08-06 | Radio frequency identification (RFID) tag lamination process using liner |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/187,143 Expired - Fee Related US7674649B2 (en) | 2005-03-14 | 2008-08-06 | Radio frequency identification (RFID) tag lamination process using liner |
Country Status (4)
Country | Link |
---|---|
US (2) | US20060205113A1 (en) |
BR (1) | BRPI0608463A2 (en) |
TW (1) | TW200703550A (en) |
WO (1) | WO2006098879A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080117057A1 (en) * | 2006-11-21 | 2008-05-22 | Rcd Technology Inc. | Radio frequency identification (rfid) tag lamination process |
ITUB20154206A1 (en) * | 2015-10-07 | 2017-04-07 | Mecstar S R L | APPARATUS, METHOD AND DEVICE FOR THE REALIZATION OF INCORPORATING PRODUCTS A RFid |
US10455705B2 (en) | 2015-10-07 | 2019-10-22 | Mecstar S.R.L. | Apparatus, method and device for making products incorporating an RFid |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7737513B2 (en) * | 2007-05-30 | 2010-06-15 | Tessera, Inc. | Chip assembly including package element and integrated circuit chip |
US10049319B2 (en) | 2014-12-16 | 2018-08-14 | Avery Dennison Retail Information Services, Llc | Method of assembly using moving substrates, including creating RFID inlays |
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US5463377A (en) * | 1993-10-08 | 1995-10-31 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for detecting the presence of a liquid |
US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US5629981A (en) * | 1994-07-29 | 1997-05-13 | Texas Instruments Incorporated | Information management and security system |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US5874902A (en) * | 1996-07-29 | 1999-02-23 | International Business Machines Corporation | Radio frequency identification transponder with electronic circuit enabling/disabling capability |
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US20020053735A1 (en) * | 2000-09-19 | 2002-05-09 | Neuhaus Herbert J. | Method for assembling components and antennae in radio frequency identification devices |
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US20020140608A1 (en) * | 2001-04-02 | 2002-10-03 | Zaghloul Amir Ibrahim | Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
US6514790B1 (en) * | 1998-09-03 | 2003-02-04 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method for handling a plurality of circuit chips |
US20030116790A1 (en) * | 2000-06-21 | 2003-06-26 | Yuji Kikuchi | Semiconductor chip and semiconductor device using the semiconductor chip |
US6696952B2 (en) * | 2000-08-04 | 2004-02-24 | Hei, Inc. | Structures and assembly methods for radio-frequency-identification modules |
US20040070510A1 (en) * | 2002-10-15 | 2004-04-15 | Yimin Zhang | Radio frequency wetness detection system |
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US6849936B1 (en) * | 2002-09-25 | 2005-02-01 | Lsi Logic Corporation | System and method for using film deposition techniques to provide an antenna within an integrated circuit package |
US20050128086A1 (en) * | 2003-12-08 | 2005-06-16 | 3M Innovative Properties Company | Durable radio frequency indentification label and methods of manufacturing the same |
US20050252605A1 (en) * | 2002-01-18 | 2005-11-17 | Alan Green | RFID label technique |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0903805B1 (en) | 1997-09-19 | 2003-08-06 | Peter Vernon | Planar antenna device |
US7456506B2 (en) * | 2005-03-14 | 2008-11-25 | Rcd Technology Inc. | Radio frequency identification (RFID) tag lamination process using liner |
-
2005
- 2005-03-14 US US11/079,143 patent/US20060205113A1/en not_active Abandoned
-
2006
- 2006-03-01 WO PCT/US2006/007283 patent/WO2006098879A1/en active Application Filing
- 2006-03-01 BR BRPI0608463-0A patent/BRPI0608463A2/en not_active IP Right Cessation
- 2006-03-14 TW TW095108632A patent/TW200703550A/en unknown
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2008
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Cited By (8)
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US20080117057A1 (en) * | 2006-11-21 | 2008-05-22 | Rcd Technology Inc. | Radio frequency identification (rfid) tag lamination process |
WO2008063785A2 (en) * | 2006-11-21 | 2008-05-29 | Rcd Technology Inc. | Radio frequency identification (rfid) tag lamination process |
WO2008063785A3 (en) * | 2006-11-21 | 2008-07-31 | Rcd Technology Inc | Radio frequency identification (rfid) tag lamination process |
US7884719B2 (en) | 2006-11-21 | 2011-02-08 | Rcd Technology Inc. | Radio frequency identification (RFID) tag lamination process |
ITUB20154206A1 (en) * | 2015-10-07 | 2017-04-07 | Mecstar S R L | APPARATUS, METHOD AND DEVICE FOR THE REALIZATION OF INCORPORATING PRODUCTS A RFid |
EP3154328A1 (en) | 2015-10-07 | 2017-04-12 | Mecstar S.r.l. | Apparatus, method and device for making products incorporating an rfid |
US10455705B2 (en) | 2015-10-07 | 2019-10-22 | Mecstar S.R.L. | Apparatus, method and device for making products incorporating an RFid |
US10628719B2 (en) | 2015-10-07 | 2020-04-21 | Mecstar S.R.L. | Apparatus, method and device for making products incorporating an RFid |
Also Published As
Publication number | Publication date |
---|---|
US7674649B2 (en) | 2010-03-09 |
TW200703550A (en) | 2007-01-16 |
BRPI0608463A2 (en) | 2010-01-12 |
US20080311704A1 (en) | 2008-12-18 |
WO2006098879A1 (en) | 2006-09-21 |
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