US20070004324A1 - Polishing apparatus - Google Patents
Polishing apparatus Download PDFInfo
- Publication number
- US20070004324A1 US20070004324A1 US10/534,507 US53450703A US2007004324A1 US 20070004324 A1 US20070004324 A1 US 20070004324A1 US 53450703 A US53450703 A US 53450703A US 2007004324 A1 US2007004324 A1 US 2007004324A1
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- United States
- Prior art keywords
- polishing
- elastic sheet
- fluid
- holding mechanism
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 318
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 239000012530 fluid Substances 0.000 claims description 82
- 230000004044 response Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 30
- 239000000758 substrate Substances 0.000 abstract description 30
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 11
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000000087 stabilizing effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002390 adhesive tape Substances 0.000 description 10
- 239000002344 surface layer Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 230000007261 regionalization Effects 0.000 description 5
- 239000002356 single layer Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
- B24D9/08—Circular back-plates for carrying flexible material
- B24D9/085—Devices for mounting sheets on a backing plate
Definitions
- the present invention relates to a chemical/mechanical polishing (CMP) apparatus for use, for example, in planarization of a substrate to be polished, e.g. a semiconductor wafer in particular, and in formation of wiring patterns.
- CMP chemical/mechanical polishing
- a double-layer pad is frequently used as a polishing member bonded to a surface of a table of a chemical/mechanical polishing (CMP) apparatus of the type described above [for example, see Japanese Patent Application Unexamined Publication (KOKAI) No. Hei 6-21028].
- CMP chemical/mechanical polishing
- a pad of high hardness is only slightly deformable and hence allows contact pressure to concentrate on convex-areas on a substrate to be polished. Therefore, the high-hardness pad exhibits a superior ability to flatten steps of wiring patterns, etc. present on a semiconductor wafer or the like. On the other hand, the high-hardness pad is readily influenceable by a large undulation or warpage, thickness variation, etc. that may be present over the whole semiconductor wafer surface. This exerts adverse effects on the intrawafer polishing rate uniformity.
- a pad of low hardness is deformable to a large extent and hence capable of easily following the configuration of an object to be polished. Therefore, the low-hardness pad is not readily influenceable by a large undulation or warpage, thickness variation, etc. in the wafer surface, and allows the intrawafer polishing rate uniformity to be obtained relatively easily.
- the low-hardness pad is inferior in the ability of flattening steps of wiring patterns, etc.
- a double-layer pad is used as a polishing pad to solve the problems experienced with a high- or low-hardness polishing pad when used alone, as stated above. More specifically, a pad of relatively high hardness is used as a surface-layer pad member of the double-layer pad, and a pad of low hardness is used as an underlayer pad member of the double-layer pad, thereby allowing the two pad members to compensate for each other's disadvantages, and thus realizing polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a semiconductor wafer without losing the ability to flatten steps of wiring patterns, etc. on the wafer surface.
- the conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus is supplied in a state where the two different types of pad members are bonded to each other and is therefore higher in cost than single-layer polishing pads. Further, when the polishing pad as an expendable article is to be replaced with a new one, it is necessary to change not only the surface-layer pad member, which contributes to the actual polishing process, but also the underlayer pad member at the same time. This causes an increase in the cost of chemical/mechanical polishing (CMP) process.
- the intrawafer polishing rate uniformity changes when the elasticity of a pad used as an underlayer pad member varies. Therefore, it is necessary to use double-layer pads having underlayer pad members with minimized variation in elasticity. In this regard, however, every time a double-layer pad is replaced with a new one, a variable factor such as a difference among individual underlayer pad members is introduced.
- an object of the present invention is to provide a polishing apparatus particularly suitable for planarization of an insulator film formed on a semiconductor wafer and for formation of wiring patterns and contacts. That is, a table of a chemical/mechanical polishing (CMP) apparatus is arranged to have the function of the underlayer pad member of the double-layer polishing pad that has heretofore frequently been used in the chemical/mechanical polishing (CMP) apparatus, thereby enabling cost reduction of chemical/mechanical polishing (CMP) process and allowing stabilization of process performance, such as polishing rate uniformity within a substrate surface to be polished.
- CMP chemical/mechanical polishing
- the present invention provides a polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface.
- the polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table.
- an elastic sheet is stretched over the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the elastic sheet preferably has a plurality of projections on a surface thereof.
- an elastic sheet (preferably having a plurality of projections) is stretched over the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the elastic sheet has a function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one.
- the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- a polishing apparatus includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface.
- the polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table.
- a recess is provided on the upper surface of the table, and the opening of the recess is covered with an elastic sheet to form a fluid chamber.
- the fluid chamber is filled with a fluid under a predetermined pressure.
- a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- a recess is provided on the upper surface of the table, and the opening of the recess is covered with an elastic sheet to form a fluid chamber.
- the fluid chamber is filled with a fluid under a predetermined pressure.
- a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the elastic sheet has a function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one. Thus, it becomes possible to achieve cost reduction of the polishing process and to stabilize process performance such as polishing rate uniformity within an object to be polished.
- the polishing apparatus according to the second aspect is provided with a fluid supply section that supplies the fluid to the fluid chamber.
- the elastic sheet is deformable according to the supply pressure of the fluid supplied from the fluid supply section.
- the polishing apparatus is provided with a fluid supply section that supplies the fluid to the fluid chamber, and the elastic sheet is deformable according to the supply pressure of the fluid supplied from the fluid supply section. Consequently, the amount of deformation of the elastic sheet can be adjusted by controlling the supply pressure of the fluid supplied to the fluid chamber. Accordingly, the polishing apparatus is capable of polishing suitable for the characteristics of each individual object to be polished.
- the fluid supply section of the polishing apparatus includes a fluid path and a fluid source for supplying the fluid.
- the fluid source has a control part that controls the supply pressure of the fluid.
- the fluid supply section includes a fluid path and a fluid source for supplying the fluid, and the fluid source has a control part that controls the supply pressure of the fluid.
- the pressure in the fluid chamber can be controlled as desired, and hence the amount of deformation of the elastic sheet can be adjusted as desired. Therefore, the polishing apparatus is capable of polishing suitable for the characteristics of each individual object to be polished.
- the table of the polishing apparatus has a plurality of pistons between the elastic sheet and the polishing pad, and further has a piston guide plate that limits the direction of movement of the pistons.
- the pistons are guided by the piston guide plate so as to move in a direction perpendicular to the polishing surface of the polishing pad in response to the deformation of the elastic sheet.
- the table has a plurality of pistons between the elastic sheet and the polishing pad, and the piston guide plate limits the direction of movement of the pistons. Therefore, the amount of movement of the multiplicity of pistons in the perpendicular direction can be adjusted by controlling the pressure in the fluid chamber. Accordingly, it is possible to perform polishing even more suitable for the characteristics of each individual object to be polished.
- a polishing apparatus includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface.
- the polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table.
- an elastic sheet having a plurality of recesses is stretched over the upper surface of the table so that a fluid is sealed in between the elastic sheet and the upper surface of the table.
- a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- an elastic sheet having a plurality of recesses is stretched over the upper surface of the table so that a fluid is sealed in between the elastic sheet and the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the elastic sheet having a plurality of recesses with the fluid sealed therein performs the function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one.
- the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- a polishing apparatus includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface.
- the polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table.
- the table is formed by a belt suspended between pulleys. An elastic sheet is stretched over the upper surface of the belt. A polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the table is formed by a belt suspended between pulleys, and an elastic sheet is stretched over the upper surface of the belt. Further, a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- the elastic sheet performs the function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one.
- the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- FIG. 1 is a sectional side view showing a structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 2 is a sectional side view showing another structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 3 is an enlarged view of part A in FIG. 2 , in which FIGS. 3 ( a ) and ( b ) are enlarged views of the part A, and FIG. 3 ( c ) is a B-B sectional view of FIGS. 3 ( a ) and ( b ).
- FIG. 4 is a sectional side view showing still another structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 5 is a sectional side view showing a further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 6 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 7 is an A-A sectional view of FIG. 6 .
- FIG. 8 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 9 is an enlarged view of part A in FIG. 8 , in which FIG. 9 ( a ) is a side view of the part A, and FIGS. 9 ( b ) and ( c ) are sectional views in the direction of the arrow B-B in FIG. 9 ( a ).
- FIG. 10 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- CMP chemical/mechanical polishing
- FIG. 1 is a sectional side view showing a structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- a turntable 10 has an elastic sheet 11 A secured to the surface thereof as an underlayer member, and a polishing pad 16 is bonded to the surface of the elastic sheet 11 A.
- the elastic sheet 11 A is deformable according to the pressure applied thereto, e.g. a nonwoven fabric or a porous resin sheet.
- the elastic sheet 11 A is secured to the surface of the turntable 10 by the following method.
- the elastic sheet 11 A is secured with a plurality of bolts 13 through a ring-shaped retaining member 12 .
- the elastic sheet 11 A is secured with a bolt 15 through a disk-shaped retaining member 14 . It should be noted that the method of securing the elastic sheet 11 A to the surface of the turntable 10 is not necessarily limited to the above.
- the elastic sheet 11 A may be bonded to the surface of the turntable 10 by using double-sided adhesive tape or an adhesive, or by jointly using the double-sided adhesive tape or adhesive and the combinations of the ring-shaped retaining member 12 and the bolts 13 and the disk-shaped retaining member 14 and the bolt 15 .
- the elastic sheet 11 A is made sufficiently smooth at the upper side thereof so that the polishing pad 16 is removably bondable thereto with double-sided adhesive tape.
- the polishing pad 16 is basically a single-layer polishing pad of relatively high hardness (e.g. a polyurethane foam pad) having a polishing surface excellent in step-removing ability.
- the polishing pad 16 is removably bonded to the surface of the elastic sheet 11 A by using double-sided adhesive tape or an adhesive. It should be noted that the polishing pad 16 is not necessarily limited to such a single-layer pad but may be a double-layer polishing pad.
- the turntable 10 is rotatable in a predetermined direction by a motor 17 .
- An annular zonal portion of the upper surface of the polishing pad 16 exclusive of the ring-shaped retaining member 12 and the disk-shaped retaining member 14 , defines a polishing area 18 .
- a substrate to be polished that is held by a substrate holding mechanism (not shown) is pressed against a polishing surface on the upper side of the polishing pad 16 in the polishing area 18 and polished by relative movement between the polishing pad 16 and the substrate to be polished caused by the rotation of the turntable 10 and the rotation of the substrate holding mechanism (including a top ring, etc.).
- an abrasive liquid (not shown) is supplied onto the surface of the polishing pad 16 .
- the polishing pad 16 of relatively high hardness is used as a surface-layer member, and the elastic sheet 11 A of low hardness is used as an underlayer member, thereby allowing the polishing pad 16 of relatively high hardness and the elastic sheet 11 A of low hardness to compensate for each other's disadvantages; thus realizing polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished while exhibiting the ability to flatten steps of wiring patterns, etc. on the substrate surface.
- the polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation. When the polishing ability of the polishing pad 16 has weakened, the polishing pad 16 is removed from the elastic sheet 11 A, and only the polishing pad 16 is replaced with a new one.
- FIGS. 2 and 3 show another structural example of the table part of the chemical/mechanical polishing (CMP) apparatus according to the present invention.
- FIG. 2 is a sectional side view.
- FIGS. 3 ( a ) and ( b ) are enlarged views of part A in FIG. 2 .
- FIG. 3 ( c ) is a B-B sectional view of FIGS. 3 ( a ) and ( b ).
- the same reference numerals as those in FIG. 1 denote the same members or portions as those shown in FIG. 1 . The same shall apply in the other drawings.
- a rubber sheet having a multiplicity of projections (circular columnar projections in the illustrated example) 11 a provided on a surface thereof is used as an elastic sheet 11 B.
- the projections 11 a of the elastic sheet 11 B may be provided to project either toward the polishing pad 16 as shown in FIG. 3 ( a ) or toward the turntable 10 as shown in FIG. 3 ( b ).
- Provision of the projections 11 a allows a space to be formed between the elastic sheet 11 B and the polishing pad 16 or the turntable 10 .
- the space serves as a relief space. That is, the space permits locally applied pressure to be dispersed to the surroundings and hence allows the elastic projections 11 a to be deformed easily.
- the polishing pad 16 is effectively deformable to provide even more excellent followability.
- the use of a rubber sheet having a multiplicity of projections 11 a provided on a surface thereof as the elastic sheet 11 B is advantageous as follows. Because the hardness of the rubber sheet serving as an underlayer member is lower than the hardness of the polishing pad 16 as a surface-layer member, the polishing pad 16 and the elastic sheet 11 B can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface, in the same way as the above.
- the polishing pad 16 is removably bonded to the surface of the elastic sheet 11 B with double-sided adhesive tape, an adhesive, etc.
- the polishing ability of the polishing pad 16 has weakened, only the polishing pad 16 is replaced with a new one.
- FIG. 4 is a sectional side view showing still another structural example of the table part of the chemical/mechanical polishing (CMP) apparatus according to the present invention.
- the surface of the turntable 10 is provided with an annular zonal recess 20 a .
- the opening of the recess 20 a is covered with a sheet layer 19 formed of an elastic film or a thin metal sheet to form a fluid chamber 20 .
- the fluid chamber 20 is filled with a gas or fluid under a predetermined pressure.
- the turntable 10 is provided with a recess 20 a , and the opening of the recess 20 a is covered with a sheet layer 19 to form a fluid chamber 20 . Consequently, the amount of deformation with respect to applied pressure is larger at the sheet layer 19 as an underlayer member than at the polishing pad 16 as a surface-layer member. Accordingly, the polishing pad 16 and the sheet layer 19 can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface, in the same way as the above.
- the polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation.
- the polishing pad 16 is removably bonded to the surface of the sheet layer 19 with double-sided adhesive tape, an adhesive, etc. When the polishing ability of the polishing pad 16 has weakened, only the polishing pad 16 is replaced with a new one.
- FIG. 5 is a sectional side view showing a further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- the chemical/mechanical polishing (CMP) apparatus shown in FIG. 5 differs from that shown in FIG. 4 in that a fluid path 21 is connected to the fluid chamber 20 to supply a pressure fluid thereto, thereby using the fluid chamber 20 as a pressurizing chamber.
- the fluid path 21 extends through the center of the motor 17 and is connected to a pressure fluid source 23 through a rotary joint 22 .
- the pressure in the fluid chamber 20 that is, the pressurizing chamber, can be adjusted by controlling the pressure at which the fluid is supplied from the pressure fluid source 23 .
- a fluid path 21 is connected to the fluid chamber 20 in the turntable 10 to supply a pressure fluid thereto, so that the fluid chamber 20 is used as a pressurizing chamber.
- the polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation, as in the case of FIG. 4 .
- the polishing pad 16 is removably bonded to the surface of the sheet layer 19 with double-sided adhesive tape or an adhesive.
- the polishing ability of the polishing pad 16 has weakened, only the polishing pad 16 is replaced with a new one.
- FIGS. 6 and 7 show a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- FIG. 6 is a sectional side view
- FIG. 7 is an A-A sectional view of FIG. 6 .
- the chemical/mechanical polishing (CMP) apparatus shown in FIGS. 6 and 7 differs from that shown in FIG. 5 in that a multiplicity of pistons 24 are provided between the sheet layer 19 and the polishing pad 16 .
- the pistons 24 are pressed by the sheet layer 19 to move up and down.
- the pistons 24 are guided vertically through a piston stroke PS by a piston guide plate 25 .
- the sheet layer 19 is secured to the upper end surface of the turntable 10 with a plurality of bolts 27 through a ring-shaped retaining member 26 .
- the piston guide plate 25 is secured to the upper surface of the ring-shaped retaining member 26 with bolts 28 .
- a multiplicity of pistons 24 are provided on the upper surface of the sheet layer 19 in such a manner as to be guided vertically through a piston stroke PS by a piston guide plate 25 .
- the amount of deformation of the sheet layer 19 can be adjusted by the pressure in the fluid chamber 20 , and consequently the amount of vertical movement of the pistons 24 can also be adjusted. Accordingly, it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface.
- the polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation.
- the polishing pad 16 is removably bonded to the pistons 24 and to the surface of the piston guide plate 25 with double-sided adhesive tape, an adhesive, etc.
- the polishing ability of the polishing pad 16 has weakened, only the polishing pad 16 is replaced with a new one.
- FIGS. 8 and 9 show a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- FIG. 8 is a sectional side view.
- FIG. 9 ( a ) is an enlarged view of part A in FIG. 8 .
- FIGS. 9 ( b ) and ( c ) are sectional views in the direction of the arrow B-B in FIG. 9 ( a ).
- a rubber sheet having a multiplicity of recesses (circular or pentagonal recesses in the illustrated example) 11 b provided on a surface thereof is used as an elastic sheet 11 C.
- the opening portions of the recesses 11 b of the elastic sheet 11 C are bonded to the upper end surface of the turntable 10 with an adhesive. A fluid is sealed in each recess 11 b.
- a rubber sheet provided on a surface thereof with a multiplicity of recesses 11 b each having a fluid sealed therein is used as an elastic sheet 11 C. Consequently, the hardness of the elastic sheet 11 C serving as an underlayer member is lower than that of the polishing pad 16 as a surface-layer member (the hardness of the elastic sheet 11 C is adjustable by the pressure of the fluid sealed in the recesses 11 b ). Accordingly, the polishing pad 16 and the elastic sheet 11 C can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface.
- the polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation.
- the polishing pad 16 is removably bonded to the surface of the elastic sheet 11 C with double-sided adhesive tape, an adhesive, etc. When the polishing ability of the polishing pad 16 has weakened, only the polishing pad 16 is replaced with a new one.
- FIG. 10 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.
- the table of this polishing apparatus is formed by a belt 31 suspended between pulleys 29 and 30 .
- An elastic sheet 11 D is bonded to the upper surface of the belt 31 .
- a polishing pad 16 is removably bonded to the upper surface of the elastic sheet 11 D with double-sided adhesive tape, an adhesive, etc.
- As the elastic sheet 11 D an elastic sheet having the same structure as those shown in FIGS. 3 and 9 can be used.
- the pulley 29 is driven to rotate in the direction of the arrow C by a motor (not shown), and the belt 31 travels in the direction of the arrow D.
- a substrate W to be polished that is held by a substrate holding mechanism (including a top ring, etc.) 32 is pressed against the polishing pad 16 bonded to the upper surface of the belt 31 through the elastic sheet 11 D as is stated above, and the substrate holding mechanism 32 is rotated in the direction of the arrow D, thereby polishing the substrate W.
- the table part of the chemical/mechanical polishing (CMP) apparatus may be of a belt type (linear type). The linear table also offers the same operational advantages as those obtained by the above-described turntable 10 .
- the embodiments shown in FIGS. 1, 2 , 3 , 8 , 9 and 10 use the pressure-deformable elastic sheet 11 ( 11 A to 1 D) as an underlayer member.
- the embodiments shown in FIGS. 4, 5 , 6 and 7 use as an underlayer mechanism the sheet layer 19 displaceable by the pressure in the fluid chamber 20 (pressurizing chamber) or a combination of the sheet layer 19 and the pistons 24 .
- the table is arranged to have the function that has heretofore been performed by the underlayer pad member of the conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus.
- CMP chemical/mechanical polishing
- the present invention is not necessarily limited to the foregoing embodiments. It is essential only that the polishing apparatus have a polishing pad bonded over a pressure-deformable underlayer member or underlayer mechanism provided over the upper surface of a table, and that the polishing pad be replaceable from the underlayer member or the underlayer mechanism.
- the polishing apparatus may have any structure, provided that the table has the function that has heretofore been performed by the underlayer pad member of the conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus, and when the polishing ability of the polishing pad has weakened, the polishing pad is replaceable with a new one.
- CMP chemical/mechanical polishing
Abstract
A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. An elastic sheet 11 is stretched over the upper surface of the table, and a polishing pad 16 having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet 11. Thus, the function performed by an underlayer pad member of a double-layer polishing pad that has heretofore frequently been used in a chemical/mechanical polishing (CMP) apparatus is imparted to the table of the chemical/mechanical polishing (CMP) apparatus, thereby achieving cost reduction of chemical/mechanical polishing (CMP) process and stabilizing process performance such as polishing rate uniformity within a substrate surface to be polished.
Description
- The present invention relates to a chemical/mechanical polishing (CMP) apparatus for use, for example, in planarization of a substrate to be polished, e.g. a semiconductor wafer in particular, and in formation of wiring patterns.
- Conventionally, a double-layer pad is frequently used as a polishing member bonded to a surface of a table of a chemical/mechanical polishing (CMP) apparatus of the type described above [for example, see Japanese Patent Application Unexamined Publication (KOKAI) No. Hei 6-21028]. This is because polishing pads are required to simultaneously possess two essential qualities, i.e. planarizing ability to flatten steps of wiring patterns, etc. present on a surface of a semiconductor wafer or the like, and ability to maintain the polishing rate uniformity within a wafer surface (intrawafer polishing rate uniformity).
- A pad of high hardness is only slightly deformable and hence allows contact pressure to concentrate on convex-areas on a substrate to be polished. Therefore, the high-hardness pad exhibits a superior ability to flatten steps of wiring patterns, etc. present on a semiconductor wafer or the like. On the other hand, the high-hardness pad is readily influenceable by a large undulation or warpage, thickness variation, etc. that may be present over the whole semiconductor wafer surface. This exerts adverse effects on the intrawafer polishing rate uniformity.
- Meanwhile, a pad of low hardness is deformable to a large extent and hence capable of easily following the configuration of an object to be polished. Therefore, the low-hardness pad is not readily influenceable by a large undulation or warpage, thickness variation, etc. in the wafer surface, and allows the intrawafer polishing rate uniformity to be obtained relatively easily. However, the low-hardness pad is inferior in the ability of flattening steps of wiring patterns, etc.
- Conventionally, a double-layer pad is used as a polishing pad to solve the problems experienced with a high- or low-hardness polishing pad when used alone, as stated above. More specifically, a pad of relatively high hardness is used as a surface-layer pad member of the double-layer pad, and a pad of low hardness is used as an underlayer pad member of the double-layer pad, thereby allowing the two pad members to compensate for each other's disadvantages, and thus realizing polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a semiconductor wafer without losing the ability to flatten steps of wiring patterns, etc. on the wafer surface.
- The conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus is supplied in a state where the two different types of pad members are bonded to each other and is therefore higher in cost than single-layer polishing pads. Further, when the polishing pad as an expendable article is to be replaced with a new one, it is necessary to change not only the surface-layer pad member, which contributes to the actual polishing process, but also the underlayer pad member at the same time. This causes an increase in the cost of chemical/mechanical polishing (CMP) process.
- Further, the intrawafer polishing rate uniformity changes when the elasticity of a pad used as an underlayer pad member varies. Therefore, it is necessary to use double-layer pads having underlayer pad members with minimized variation in elasticity. In this regard, however, every time a double-layer pad is replaced with a new one, a variable factor such as a difference among individual underlayer pad members is introduced.
- The present invention was made in view of the above-described circumstances. Accordingly, an object of the present invention is to provide a polishing apparatus particularly suitable for planarization of an insulator film formed on a semiconductor wafer and for formation of wiring patterns and contacts. That is, a table of a chemical/mechanical polishing (CMP) apparatus is arranged to have the function of the underlayer pad member of the double-layer polishing pad that has heretofore frequently been used in the chemical/mechanical polishing (CMP) apparatus, thereby enabling cost reduction of chemical/mechanical polishing (CMP) process and allowing stabilization of process performance, such as polishing rate uniformity within a substrate surface to be polished.
- To solve the above-described problem, according to a first aspect thereof, the present invention provides a polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. In the polishing apparatus, an elastic sheet is stretched over the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- The elastic sheet preferably has a plurality of projections on a surface thereof.
- As is stated above, an elastic sheet (preferably having a plurality of projections) is stretched over the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet. Thus, the elastic sheet has a function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one. Thus, the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- A polishing apparatus according to a second aspect of the present invention includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. In the polishing apparatus, a recess is provided on the upper surface of the table, and the opening of the recess is covered with an elastic sheet to form a fluid chamber. The fluid chamber is filled with a fluid under a predetermined pressure. A polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- As is stated above, a recess is provided on the upper surface of the table, and the opening of the recess is covered with an elastic sheet to form a fluid chamber. The fluid chamber is filled with a fluid under a predetermined pressure. A polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet. Thus, the elastic sheet has a function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one. Thus, it becomes possible to achieve cost reduction of the polishing process and to stabilize process performance such as polishing rate uniformity within an object to be polished.
- According to a third aspect of the present invention, the polishing apparatus according to the second aspect is provided with a fluid supply section that supplies the fluid to the fluid chamber. The elastic sheet is deformable according to the supply pressure of the fluid supplied from the fluid supply section.
- As is stated above, the polishing apparatus is provided with a fluid supply section that supplies the fluid to the fluid chamber, and the elastic sheet is deformable according to the supply pressure of the fluid supplied from the fluid supply section. Consequently, the amount of deformation of the elastic sheet can be adjusted by controlling the supply pressure of the fluid supplied to the fluid chamber. Accordingly, the polishing apparatus is capable of polishing suitable for the characteristics of each individual object to be polished.
- According to a fourth aspect of the present invention, the fluid supply section of the polishing apparatus according to the third aspect includes a fluid path and a fluid source for supplying the fluid. The fluid source has a control part that controls the supply pressure of the fluid.
- As is stated above, the fluid supply section includes a fluid path and a fluid source for supplying the fluid, and the fluid source has a control part that controls the supply pressure of the fluid. Thus, the pressure in the fluid chamber can be controlled as desired, and hence the amount of deformation of the elastic sheet can be adjusted as desired. Therefore, the polishing apparatus is capable of polishing suitable for the characteristics of each individual object to be polished.
- According to a fifth aspect of the present invention, the table of the polishing apparatus according to the fourth aspect has a plurality of pistons between the elastic sheet and the polishing pad, and further has a piston guide plate that limits the direction of movement of the pistons. The pistons are guided by the piston guide plate so as to move in a direction perpendicular to the polishing surface of the polishing pad in response to the deformation of the elastic sheet.
- As is stated above, the table has a plurality of pistons between the elastic sheet and the polishing pad, and the piston guide plate limits the direction of movement of the pistons. Therefore, the amount of movement of the multiplicity of pistons in the perpendicular direction can be adjusted by controlling the pressure in the fluid chamber. Accordingly, it is possible to perform polishing even more suitable for the characteristics of each individual object to be polished.
- A polishing apparatus according to a sixth aspect of the present invention includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. In the polishing apparatus, an elastic sheet having a plurality of recesses is stretched over the upper surface of the table so that a fluid is sealed in between the elastic sheet and the upper surface of the table. A polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- As is stated above, an elastic sheet having a plurality of recesses is stretched over the upper surface of the table so that a fluid is sealed in between the elastic sheet and the upper surface of the table, and a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet. Thus, the elastic sheet having a plurality of recesses with the fluid sealed therein performs the function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one. Thus, the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- A polishing apparatus according to a seventh aspect of the present invention includes a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. In the polishing apparatus, the table is formed by a belt suspended between pulleys. An elastic sheet is stretched over the upper surface of the belt. A polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet.
- As is stated above, the table is formed by a belt suspended between pulleys, and an elastic sheet is stretched over the upper surface of the belt. Further, a polishing pad having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet. Thus, the elastic sheet performs the function that has heretofore been performed by the underlayer pad member of the conventional double-layer pad. Therefore, when the polishing ability of the polishing pad has weakened, the polishing tool can be renewed by replacing only the polishing pad with a new one. Thus, the polishing apparatus is capable of reducing the cost of the polishing process and of stabilizing process performance such as polishing rate uniformity within an object to be polished.
- The above and other objects of the invention of this application will become apparent from the following embodiments, which are described with reference to the accompanying drawings.
-
FIG. 1 is a sectional side view showing a structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 2 is a sectional side view showing another structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 3 is an enlarged view of part A inFIG. 2 , in which FIGS. 3(a) and (b) are enlarged views of the part A, andFIG. 3 (c) is a B-B sectional view of FIGS. 3(a) and (b). -
FIG. 4 is a sectional side view showing still another structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 5 is a sectional side view showing a further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 6 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 7 is an A-A sectional view ofFIG. 6 . -
FIG. 8 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. -
FIG. 9 is an enlarged view of part A inFIG. 8 , in whichFIG. 9 (a) is a side view of the part A, and FIGS. 9(b) and (c) are sectional views in the direction of the arrow B-B inFIG. 9 (a). -
FIG. 10 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. - Preferred embodiments of the polishing apparatus according to the present invention will be described below with reference to the accompanying drawings.
-
FIG. 1 is a sectional side view showing a structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. As is illustrated in the figure, aturntable 10 has anelastic sheet 11A secured to the surface thereof as an underlayer member, and apolishing pad 16 is bonded to the surface of theelastic sheet 11A. - The
elastic sheet 11A is deformable according to the pressure applied thereto, e.g. a nonwoven fabric or a porous resin sheet. Theelastic sheet 11A is secured to the surface of theturntable 10 by the following method. At the outer edge portion of theturntable 10, theelastic sheet 11A is secured with a plurality ofbolts 13 through a ring-shaped retainingmember 12. At the center of theturntable 10, theelastic sheet 11A is secured with abolt 15 through a disk-shaped retainingmember 14. It should be noted that the method of securing theelastic sheet 11A to the surface of theturntable 10 is not necessarily limited to the above. Theelastic sheet 11A may be bonded to the surface of theturntable 10 by using double-sided adhesive tape or an adhesive, or by jointly using the double-sided adhesive tape or adhesive and the combinations of the ring-shaped retainingmember 12 and thebolts 13 and the disk-shaped retainingmember 14 and thebolt 15. Theelastic sheet 11A is made sufficiently smooth at the upper side thereof so that thepolishing pad 16 is removably bondable thereto with double-sided adhesive tape. - The
polishing pad 16 is basically a single-layer polishing pad of relatively high hardness (e.g. a polyurethane foam pad) having a polishing surface excellent in step-removing ability. Thepolishing pad 16 is removably bonded to the surface of theelastic sheet 11A by using double-sided adhesive tape or an adhesive. It should be noted that thepolishing pad 16 is not necessarily limited to such a single-layer pad but may be a double-layer polishing pad. - The
turntable 10 is rotatable in a predetermined direction by amotor 17. An annular zonal portion of the upper surface of thepolishing pad 16, exclusive of the ring-shaped retainingmember 12 and the disk-shaped retainingmember 14, defines a polishingarea 18. A substrate to be polished that is held by a substrate holding mechanism (not shown) is pressed against a polishing surface on the upper side of thepolishing pad 16 in the polishingarea 18 and polished by relative movement between the polishingpad 16 and the substrate to be polished caused by the rotation of theturntable 10 and the rotation of the substrate holding mechanism (including a top ring, etc.). It should be noted that an abrasive liquid (not shown) is supplied onto the surface of thepolishing pad 16. - As is stated above, the
polishing pad 16 of relatively high hardness is used as a surface-layer member, and theelastic sheet 11A of low hardness is used as an underlayer member, thereby allowing thepolishing pad 16 of relatively high hardness and theelastic sheet 11A of low hardness to compensate for each other's disadvantages; thus realizing polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished while exhibiting the ability to flatten steps of wiring patterns, etc. on the substrate surface. The polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation. When the polishing ability of thepolishing pad 16 has weakened, thepolishing pad 16 is removed from theelastic sheet 11A, and only thepolishing pad 16 is replaced with a new one. -
FIGS. 2 and 3 show another structural example of the table part of the chemical/mechanical polishing (CMP) apparatus according to the present invention.FIG. 2 is a sectional side view. FIGS. 3(a) and (b) are enlarged views of part A inFIG. 2 .FIG. 3 (c) is a B-B sectional view of FIGS. 3(a) and (b). InFIGS. 2 and 3 , the same reference numerals as those inFIG. 1 denote the same members or portions as those shown inFIG. 1 . The same shall apply in the other drawings. In this structural example, a rubber sheet having a multiplicity of projections (circular columnar projections in the illustrated example) 11 a provided on a surface thereof is used as anelastic sheet 11B. Theprojections 11 a of theelastic sheet 11B may be provided to project either toward thepolishing pad 16 as shown inFIG. 3 (a) or toward theturntable 10 as shown inFIG. 3 (b). Provision of theprojections 11 a allows a space to be formed between theelastic sheet 11B and thepolishing pad 16 or theturntable 10. The space serves as a relief space. That is, the space permits locally applied pressure to be dispersed to the surroundings and hence allows theelastic projections 11 a to be deformed easily. Thus, thepolishing pad 16 is effectively deformable to provide even more excellent followability. - The use of a rubber sheet having a multiplicity of
projections 11 a provided on a surface thereof as theelastic sheet 11B is advantageous as follows. Because the hardness of the rubber sheet serving as an underlayer member is lower than the hardness of thepolishing pad 16 as a surface-layer member, thepolishing pad 16 and theelastic sheet 11B can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface, in the same way as the above. In this case also, thepolishing pad 16 is removably bonded to the surface of theelastic sheet 11B with double-sided adhesive tape, an adhesive, etc. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. -
FIG. 4 is a sectional side view showing still another structural example of the table part of the chemical/mechanical polishing (CMP) apparatus according to the present invention. As is illustrated in the figure, the surface of theturntable 10 is provided with an annularzonal recess 20 a. The opening of therecess 20 a is covered with asheet layer 19 formed of an elastic film or a thin metal sheet to form afluid chamber 20. Thefluid chamber 20 is filled with a gas or fluid under a predetermined pressure. - As is stated above, the
turntable 10 is provided with arecess 20 a, and the opening of therecess 20 a is covered with asheet layer 19 to form afluid chamber 20. Consequently, the amount of deformation with respect to applied pressure is larger at thesheet layer 19 as an underlayer member than at thepolishing pad 16 as a surface-layer member. Accordingly, thepolishing pad 16 and thesheet layer 19 can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface, in the same way as the above. The polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation. In this case also, thepolishing pad 16 is removably bonded to the surface of thesheet layer 19 with double-sided adhesive tape, an adhesive, etc. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. -
FIG. 5 is a sectional side view showing a further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. The chemical/mechanical polishing (CMP) apparatus shown inFIG. 5 differs from that shown inFIG. 4 in that afluid path 21 is connected to thefluid chamber 20 to supply a pressure fluid thereto, thereby using thefluid chamber 20 as a pressurizing chamber. Thefluid path 21 extends through the center of themotor 17 and is connected to apressure fluid source 23 through a rotary joint 22. The pressure in thefluid chamber 20, that is, the pressurizing chamber, can be adjusted by controlling the pressure at which the fluid is supplied from thepressure fluid source 23. - As is stated above, a
fluid path 21 is connected to thefluid chamber 20 in theturntable 10 to supply a pressure fluid thereto, so that thefluid chamber 20 is used as a pressurizing chamber. With this arrangement, it is possible to adjust the amount of deformation of thesheet layer 19 with respect to applied pressure. Therefore, it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface. The polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation, as in the case ofFIG. 4 . In this case also, thepolishing pad 16 is removably bonded to the surface of thesheet layer 19 with double-sided adhesive tape or an adhesive. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. -
FIGS. 6 and 7 show a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.FIG. 6 is a sectional side view, andFIG. 7 is an A-A sectional view ofFIG. 6 . The chemical/mechanical polishing (CMP) apparatus shown inFIGS. 6 and 7 differs from that shown inFIG. 5 in that a multiplicity ofpistons 24 are provided between thesheet layer 19 and thepolishing pad 16. When thesheet layer 19 is pressed by the action of the fluid chamber 20 (pressurizing chamber), thepistons 24 are pressed by thesheet layer 19 to move up and down. - The
pistons 24 are guided vertically through a piston stroke PS by apiston guide plate 25. Thesheet layer 19 is secured to the upper end surface of theturntable 10 with a plurality ofbolts 27 through a ring-shaped retainingmember 26. Thepiston guide plate 25 is secured to the upper surface of the ring-shaped retainingmember 26 withbolts 28. - As is stated above, a multiplicity of
pistons 24 are provided on the upper surface of thesheet layer 19 in such a manner as to be guided vertically through a piston stroke PS by apiston guide plate 25. With this arrangement, the amount of deformation of thesheet layer 19 can be adjusted by the pressure in thefluid chamber 20, and consequently the amount of vertical movement of thepistons 24 can also be adjusted. Accordingly, it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface. The polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation. In this case also, thepolishing pad 16 is removably bonded to thepistons 24 and to the surface of thepiston guide plate 25 with double-sided adhesive tape, an adhesive, etc. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. -
FIGS. 8 and 9 show a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention.FIG. 8 is a sectional side view.FIG. 9 (a) is an enlarged view of part A inFIG. 8 . FIGS. 9(b) and (c) are sectional views in the direction of the arrow B-B inFIG. 9 (a). InFIGS. 8 and 9 , a rubber sheet having a multiplicity of recesses (circular or pentagonal recesses in the illustrated example) 11 b provided on a surface thereof is used as anelastic sheet 11C. As is shown inFIG. 9 (a), the opening portions of therecesses 11 b of theelastic sheet 11C are bonded to the upper end surface of theturntable 10 with an adhesive. A fluid is sealed in eachrecess 11 b. - As is stated above, a rubber sheet provided on a surface thereof with a multiplicity of
recesses 11 b each having a fluid sealed therein is used as anelastic sheet 11C. Consequently, the hardness of theelastic sheet 11C serving as an underlayer member is lower than that of thepolishing pad 16 as a surface-layer member (the hardness of theelastic sheet 11C is adjustable by the pressure of the fluid sealed in therecesses 11 b). Accordingly, thepolishing pad 16 and theelastic sheet 11C can compensate for each other's disadvantages, and it is possible to realize polishing capable of smoothly following an undulation or warpage, thickness variation, etc. that may be present over the whole surface of a substrate to be polished without losing the ability to flatten steps of wiring patterns, etc. on the substrate surface. The polishing apparatus is particularly suitable for flattening a substrate, e.g. a semiconductor wafer, and for wiring pattern formation. In this case also, thepolishing pad 16 is removably bonded to the surface of theelastic sheet 11C with double-sided adhesive tape, an adhesive, etc. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. -
FIG. 10 is a sectional side view showing a still further structural example of the table part of a chemical/mechanical polishing (CMP) apparatus according to the present invention. The table of this polishing apparatus is formed by abelt 31 suspended betweenpulleys elastic sheet 11D is bonded to the upper surface of thebelt 31. Further, apolishing pad 16 is removably bonded to the upper surface of theelastic sheet 11D with double-sided adhesive tape, an adhesive, etc. As theelastic sheet 11D, an elastic sheet having the same structure as those shown inFIGS. 3 and 9 can be used. Thepulley 29 is driven to rotate in the direction of the arrow C by a motor (not shown), and thebelt 31 travels in the direction of the arrow D. - A substrate W to be polished that is held by a substrate holding mechanism (including a top ring, etc.) 32 is pressed against the
polishing pad 16 bonded to the upper surface of thebelt 31 through theelastic sheet 11D as is stated above, and thesubstrate holding mechanism 32 is rotated in the direction of the arrow D, thereby polishing the substrate W. In this case also, when the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. Thus, the table part of the chemical/mechanical polishing (CMP) apparatus may be of a belt type (linear type). The linear table also offers the same operational advantages as those obtained by the above-describedturntable 10. - As has been stated above, the embodiments shown in
FIGS. 1, 2 , 3, 8, 9 and 10 use the pressure-deformable elastic sheet 11 (11A to 1D) as an underlayer member. The embodiments shown inFIGS. 4, 5 , 6 and 7 use as an underlayer mechanism thesheet layer 19 displaceable by the pressure in the fluid chamber 20 (pressurizing chamber) or a combination of thesheet layer 19 and thepistons 24. Thus, the table is arranged to have the function that has heretofore been performed by the underlayer pad member of the conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus. When the polishing ability of thepolishing pad 16 has weakened, only thepolishing pad 16 is replaced with a new one. Accordingly, it is possible to achieve cost reduction of chemical/mechanical polishing (CMP) process and to stabilize process performance such as polishing rate uniformity within a substrate surface to be polished. - It should be noted that the present invention is not necessarily limited to the foregoing embodiments. It is essential only that the polishing apparatus have a polishing pad bonded over a pressure-deformable underlayer member or underlayer mechanism provided over the upper surface of a table, and that the polishing pad be replaceable from the underlayer member or the underlayer mechanism. In other words, the polishing apparatus may have any structure, provided that the table has the function that has heretofore been performed by the underlayer pad member of the conventional double-layer polishing pad used in chemical/mechanical polishing (CMP) apparatus, and when the polishing ability of the polishing pad has weakened, the polishing pad is replaceable with a new one.
Claims (11)
1. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
wherein an elastic sheet is stretched over an upper surface of said table, and a polishing pad having a polishing surface on an upper side thereof is replaceably stretched over said elastic sheet.
2. A polishing apparatus according to claim 1 , wherein said elastic sheet has a plurality of projections on a surface thereof.
3. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
wherein a recess is provided on an upper surface of said table, and an opening of said recess is covered with an elastic sheet to form a fluid chamber, said fluid chamber being filled with a fluid under a predetermined pressure, and a polishing pad having a polishing surface on an upper side thereof is replaceably stretched over said elastic sheet.
4. A polishing apparatus according to claim 3 , which is provided with a fluid supply section that supplies the fluid to said fluid chamber, wherein said elastic sheet is deformable according to a supply pressure of the fluid supplied from said fluid supply section.
5. A polishing apparatus according to claim 4 , wherein said fluid supply section includes a fluid path and a fluid source for supplying the fluid, said fluid source having a control part that controls the supply pressure of the fluid.
6. A polishing apparatus according to claim 5 , wherein said table has a plurality of pistons between said elastic sheet and said polishing pad, and a piston guide plate that limits a direction of movement of said pistons, said pistons being guided by said piston guide plate so as to move in a direction perpendicular to the polishing surface of said polishing pad in response to deformation of said elastic sheet.
7. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
wherein an elastic sheet having a plurality of recesses is stretched over an upper surface of said table so that a fluid is sealed in between said elastic sheet and the upper surface of said table, and a polishing pad having a polishing surface on an upper side thereof is replaceably stretched over said elastic sheet.
8. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
wherein said table is formed by a belt suspended between pulleys, and wherein an elastic sheet is stretched over an upper surface of said belt, and a polishing pad having a polishing surface on an upper side thereof is replaceably stretched over said elastic sheet.
9. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
said polishing apparatus comprising:
an elastic sheet placed over an upper surface of said table;
a retaining member for securing said elastic sheet; and
a polishing pad placed over said elastic sheet, said polishing pad having a polishing surface on an upper side thereof.
10. A polishing apparatus according to claim 9 , wherein said retaining member is disposed at an outer edge portion and a central portion of said table.
11. A polishing apparatus including a polishing object holding mechanism for holding a polishing object to be polished, and a table having a polishing surface, wherein the polishing object held by said polishing object holding mechanism is pressed against the polishing surface of said table and polished by relative movement between the polishing object held by said polishing object holding mechanism and the polishing surface of said table,
said polishing apparatus comprising:
a recess-shaped fluid chamber provided annularly on an upper surface of said table;
a fluid path for supplying a fluid to said fluid chamber:
a rotary joint for supplying a pressure fluid to said fluid path;
an elastic sheet provided over said fluid chamber, said elastic sheet being deformable according to a supply pressure of the fluid supplied from said fluid path; and
a polishing pad placed over said elastic sheet, said polishing pad having a polishing surface on an upper side thereof.
Applications Claiming Priority (3)
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JP2002-327416 | 2002-11-11 | ||
JP2002327416A JP2004160573A (en) | 2002-11-11 | 2002-11-11 | Polishing device |
PCT/JP2003/013628 WO2004043648A1 (en) | 2002-11-11 | 2003-10-24 | Polishing apparatus |
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US20070004324A1 true US20070004324A1 (en) | 2007-01-04 |
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Application Number | Title | Priority Date | Filing Date |
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US10/534,507 Abandoned US20070004324A1 (en) | 2002-11-11 | 2003-10-24 | Polishing apparatus |
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US (1) | US20070004324A1 (en) |
JP (1) | JP2004160573A (en) |
AU (1) | AU2003275653A1 (en) |
TW (1) | TW200414966A (en) |
WO (1) | WO2004043648A1 (en) |
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CN106684016A (en) * | 2015-11-11 | 2017-05-17 | 三星电子株式会社 | A laminating apparatus and a system for fabricating a semiconductor device |
CN109671648A (en) * | 2017-10-16 | 2019-04-23 | 细美事有限公司 | Substrate processing apparatus and substrate processing method using same |
US11433502B2 (en) | 2017-06-06 | 2022-09-06 | Ebara Corporation | Polishing table and polishing apparatus having ihe same |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20110143539A1 (en) * | 2008-05-15 | 2011-06-16 | Rajeev Bajaj | Polishing pad with endpoint window and systems and methods using the same |
WO2009158665A1 (en) | 2008-06-26 | 2009-12-30 | 3M Innovative Properties Company | Polishing pad with porous elements and method of making and using the same |
SG181678A1 (en) | 2009-12-30 | 2012-07-30 | 3M Innovative Properties Co | Polishing pads including phase-separated polymer blend and method of making and using the same |
CN102884612B (en) * | 2011-01-03 | 2017-02-15 | 应用材料公司 | Pressure controlled polishing platen |
CN102990535A (en) * | 2012-11-27 | 2013-03-27 | 无锡市彩云机械设备有限公司 | Polishing pad |
CN115805523A (en) * | 2022-12-29 | 2023-03-17 | 西安奕斯伟材料科技有限公司 | Fixed plate, polishing device and polishing method |
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- 2003-10-24 AU AU2003275653A patent/AU2003275653A1/en not_active Abandoned
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CN106684016A (en) * | 2015-11-11 | 2017-05-17 | 三星电子株式会社 | A laminating apparatus and a system for fabricating a semiconductor device |
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CN109671648A (en) * | 2017-10-16 | 2019-04-23 | 细美事有限公司 | Substrate processing apparatus and substrate processing method using same |
Also Published As
Publication number | Publication date |
---|---|
AU2003275653A1 (en) | 2004-06-03 |
WO2004043648A1 (en) | 2004-05-27 |
TW200414966A (en) | 2004-08-16 |
JP2004160573A (en) | 2004-06-10 |
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