US20070144912A1 - Linearly translating agitators for processing microfeature workpieces, and associated methods - Google Patents
Linearly translating agitators for processing microfeature workpieces, and associated methods Download PDFInfo
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- US20070144912A1 US20070144912A1 US11/699,763 US69976307A US2007144912A1 US 20070144912 A1 US20070144912 A1 US 20070144912A1 US 69976307 A US69976307 A US 69976307A US 2007144912 A1 US2007144912 A1 US 2007144912A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Definitions
- the present invention is related to linearly translating agitators for processing microfeature workpieces, and associated methods.
- Such agitators and associated support arrangement provide high mass-transfer rates at the workpiece surface, while maintaining a consistent spacing from the workpiece surface.
- a diffusion layer forms adjacent to a process surface of a workpiece (e.g., a semiconductor wafer).
- the mass-transfer in the diffusion layer is often a significant factor in the efficacy and efficiency of wet chemical processing because the concentration of the material varies over the thickness of the diffusion layer. It is accordingly desirable to control the mass-transfer rate at the workpiece to achieve the desired results. For example, many manufacturers seek to increase the mass-transfer rate to increase the etch rate and/or deposit rate, thereby reducing the time required for processing cycles.
- the mass-transfer rate also plays a significant role in depositing alloys onto microfeature workpieces because the different ion species in the processing solution have different plating properties. Therefore, increasing or otherwise controlling the mass-transfer rate at the surface of the workpiece is important for depositing alloys and other wet chemical processes.
- One technique for increasing or otherwise controlling the mass-transfer rate at the surface of the workpiece is to increase the relative velocity between the processing solution and the surface of the workpiece, and in particular, the relative velocity of flows that impinge upon the workpiece (e.g., non-parallel flows).
- Many electrochemical processing chambers use fluid jets or rotate the workpiece to increase the relative velocity between the processing solution and the workpiece.
- Other types of vessels include paddles that translate or rotate in the processing solution adjacent to the workpiece to create a high-speed, agitated flow at the surface of the workpiece. In electrochemical processing applications, for example, the paddle typically oscillates between the workpiece and an anode in the plating solution.
- One arrangement for agitating the flow adjacent to a workpiece includes oscillating a single paddle back and forth across the diameter of the workpiece.
- U.S. Pat. No. 6,547,937 assigned to the assignee of the present invention and incorporated herein by reference, discloses a single elongated paddle driven at opposing ends by a motor and belt arrangement. Though suitable for many purposes, this arrangement requires relatively high paddle speeds in some instances because it includes only a single paddle. Driving the paddle from both ends can also result in one end or the other binding if the drive mechanism is not precisely synchronized.
- the cantilevered arrangement of the paddle array results in some parts of the paddles (e.g., those near the supported end of the array) maintaining a closer spacing relative to the workpiece than are other parts of the paddles (e.g., those near the unsupported, cantilevered end of the array).
- the present invention provides agitators and associated systems and methods that are capable of providing the desired degree of agitation at the workpiece surface, while maintaining consistent spacing between the agitator and the workpiece.
- the agitators accordingly have one or more elongated agitator elements, with a first support proximate to a first end of the agitator elements and a second support proximate to a second end of the agitator elements.
- a motor is coupled to the first support and not the second support to drive the agitator along a linear path relative to the process location.
- a linear guide is then engaged with the second support.
- the linear guide is positioned to (a) restrict movement of the agitator toward and away from the process location along a first axis, and (b) allow linear translation of the agitator along the linear path, which is aligned with a second axis generally perpendicular to the first.
- the linear guide can also (c) allow for movement of the agitator along a third axis generally perpendicular to both the first and second axes to at least reduce the tendency for the agitator to bind with the linear guide.
- the linear guide can include a U-shaped channel having an upwardly facing opening, and the channel can carry rollers connected to the second support. At least one roller is positioned to be in contact with one of the walls of the channel, while another roller is not, thereby allowing for at least some motion along the third axis.
- a processing fluid is directed upwardly into a vessel toward a microfeature workpiece positioned at a process location.
- the processing fluid is then directed radially outwardly adjacent to the microfeature workpiece and over a weir.
- the processing fluid adjacent to the microfeature workpiece is agitated with an agitator by driving the first support along the linear guidepath and guiding the second support without driving the second support.
- the motion of the agitator toward and away from the process location is at least restricted along the first axis, permitted along a second axis (e.g., a reciprocation axis) generally transverse to the first axis, and permitted along a third axis generally perpendicular to both the first and second axes at least to an extent that reduces or eliminates binding.
- a second axis e.g., a reciprocation axis
- FIG. 1 is a top isometric view of a tool having one or more process chambers with an agitator configured in accordance with an embodiment of the invention.
- FIG. 2A is a cut-away view of one of the process chambers shown in FIG. 1 .
- FIG. 2B is a detailed, cut-away view of a portion of the process chamber shown in FIG. 2A .
- FIG. 3A is a top isometric view of a paddle assembly and associated housing and support arrangement configured in accordance with an embodiment of the invention.
- FIG. 3B is a bottom view of the assembly, housing and support arrangement shown in FIG. 3A .
- FIG. 3C is a cross-sectional illustration of the assembly, housing and support arrangement, taken substantially along line 3 C- 3 C of FIG. 3A .
- FIG. 4 is a top isometric view of the process chamber shown in FIG. 2 , illustrating a motor and linear guide coupled to an agitator in accordance with an embodiment of the invention.
- FIG. 5A is an exploded isometric illustration of the linear guide shown in FIG. 4 .
- FIG. 5B is a cross-sectional illustration of the linear guide shown in FIG. 4 .
- FIG. 5C is a cross-sectional illustration of the linear guide, taken substantially along line 5 C- 5 C of FIG. 5B .
- agitator refers to a device that accelerates, stirs and/or otherwise energizes flow adjacent to a microfeature workpiece.
- microfeature workpiece and “workpiece” refer to substrates on and/or in which micro-devices are formed.
- Typical micro-devices include microelectronic circuits or components, thin-film recording heads, data storage elements, micro-fluidic devices, and other products.
- Micro-machines or micromechanical devices are included within this definition because they are manufactured in much the same manner as are integrated circuits.
- the substrates can be semiconductive pieces (e.g., silicon wafers or gallium arsenide wafers), non-conductive pieces (e.g., various substrates), or conductive pieces (e.g., doped wafers).
- semiconductive pieces e.g., silicon wafers or gallium arsenide wafers
- non-conductive pieces e.g., various substrates
- conductive pieces e.g., doped wafers
- agitators used for processing microfeature workpieces are best understood in light of the environment and equipment in which they can be used. Accordingly, a representative processing tool in which the agitators can be used is described with reference to FIG. 1 . Further details of representative agitators and devices for driving and guiding the agitators are then described with reference to FIGS. 2A-5C .
- FIG. 1 is a partially schematic, isometric illustration of a tool 100 that performs one or more wet chemical or other processes on microfeature workpieces W.
- the tool 100 includes a housing or cabinet (removed for purposes of illustration) that encloses a deck 104 .
- the deck 104 supports a plurality of processing stations 110 , and a transport system 105 .
- the stations 110 can include rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, annealing chambers, or other types of processing chambers.
- At least some individual processing stations 110 include a vessel, reactor, or chamber 130 and a workpiece support 120 (for example, a lift-rotate unit) that supports an individual microfeature workpiece W during processing at the chamber 130 .
- the transport system 105 moves the workpieces W to and from the chambers 130 .
- the transport system 105 includes a transfer device or robot 106 that moves along a linear guidepath 103 to transport individual workpieces W within the tool 100 .
- the tool 100 further includes a workpiece load/unload unit 101 having a plurality of containers for holding the workpieces W as they enter and exit the tool 100 .
- the transfer device 106 includes a first carrier 107 with which it carries the workpieces W from the load/unload unit 101 to the processing stations 110 according to a predetermined work flow schedule within the tool 100 .
- each workpiece W is initially aligned at a pre-aligner station 110 a before it is moved sequentially to the other processing stations 110 .
- the transfer device 106 transfers the workpiece W from the first carrier 107 to a second carrier 121 located at the support 120 .
- the second carrier 121 then carries the workpiece W while the workpiece W is processed at the corresponding process chamber 130 .
- a controller 102 receives inputs from an operator and, based on the inputs, automatically directs the operation of the transfer device 106 , the processing stations 110 , and the load/unload unit 101 .
- FIG. 2 is a cut-away illustration of one of the process chambers 130 shown in FIG. 1 .
- the process chamber 130 generally includes a vessel 131 that contains an electrochemical processing fluid for processing a workpiece W, a cut-away portion of which is shown in dashed lines in FIG. 2A ).
- the vessel 131 has a lower portion 139 a through which the processing fluid enters, and an upper portion 139 b having a horizontal process location P at which the workpiece W is processed.
- the processing fluid enters the vessel 131 through a fluid inlet 134 at the lower portion 139 a and proceeds generally upwardly toward the process location P through a flow control assembly 138 .
- the fluid at the process location P is in fluid and electrical communication with one or more electrodes 133 , three of which are located below the process location P and are identified as first, second and third electrodes 133 a, 133 b and 133 c, respectively. Accordingly, the lower portion 139 a functions as an electrode support.
- Each electrode 133 a - 133 c is housed in an annular chamber 132 having upwardly extending walls that terminate near the process location P.
- the electrodes 133 a - 133 c each of which can be independently controlled, operate as anodes and act at corresponding “virtual anode” locations positioned at the open tops of each electrode chamber 132 .
- a ring contact assembly 122 acts as a cathode and provides a return path for current passing from the electrodes 133 a - 133 c, through the electrochemical fluid and through the workpiece W.
- the return path can be provided by a backside contact, which contacts the upwardly facing, back surface of the workpiece W.
- the workpiece W can be rinsed and spun dry, typically referred to as a spin/rinse/dry or SRD process.
- An SRD lip 137 captures fluid flung from the workpiece W during the SRD process.
- the vessel 131 also includes an agitator 140 positioned just below the workpiece W at the process location P.
- the agitator 140 includes multiple, elongated and spaced-apart agitator elements 142 that reciprocate back and forth as a unit within an agitator housing 141 , as indicated by arrow R.
- the agitator housing 141 includes a first weir 135 over which the processing fluid flows in a radial direction after it passes upwardly through the vessel 131 and outwardly across the surface of the workpiece W.
- the agitator housing 141 defines a portion of an agitator chamber 129 in which the agitator 140 reciprocates, with a lower portion of the agitator chamber 129 formed at least in part by the tops 127 of the electrode chambers 132 , and an upper portion of the chamber formed at least in part by the workpiece W.
- the chamber 130 also includes a magnet assembly 170 , which in turn includes two magnets 171 positioned on opposite sides of the vessel 131 .
- the magnets 171 provide a magnetic field within the vessel 131 that magnetically aligns material in the processing fluid, e.g., as the material is deposited onto the workpiece W.
- the chamber 130 need not include the magnet assembly 170 , while still including other features described herein.
- the overall process chamber 130 further includes a fourth electrode 133 d positioned close to the process location P.
- the fourth electrode 133 d may be coupled to a potential at a polarity opposite that to which the first-third electrodes 133 a - 133 c are coupled (e.g., a cathodic potential). Accordingly, the fourth electrode 133 d may operate as a current thief, thereby attracting material that would otherwise be deposited at the periphery of the workpiece W. In this manner, the fourth electrode 133 d can counteract the “terminal effect,” which typically results when the workpiece (a) is carried by the ring contact assembly 122 and (b) has a relatively high-resistance conductive layer exposed to the processing fluid.
- the fourth electrode 133 d is carried by a second weir 136 over which at least some of the processing fluid may flow. Further details of this arrangement are described below with reference to FIG. 2B , and additional details of the agitator 140 are then described with reference to FIGS. 3A-5C .
- FIG. 2B is an enlarged isometric illustration of the upper portion 139 b of the process chamber 130 shown in FIG. 2A .
- the agitator housing 141 seals against the upper portion 139 b with a seal 128 (e.g., an O-ring seal).
- the ring contact assembly 122 includes a ring contact 123 (shown schematically in FIG. 2B ) having contact elements that make electrical contact with the downwardly facing periphery of the workpiece W carried at the process location P.
- the ring contact 123 is coupled to a cathodic potential, so that the workpiece W is cathodic, but the ring contact 123 may selectively be coupled to an anodic potential as well.
- the ring contact assembly 122 also includes a ring contact seal 124 that protects the interface between the ring contact 123 and the workpiece W.
- the ring contact assembly 122 is carried by the support 120 ( FIG. 1 ) and accordingly moves upwardly and downwardly relative to the vessel 131 to move the workpiece W to and from the process location P.
- each agitator element 142 has a diamond shape, with two oppositely-facing tapered ends, in the illustrated embodiment. In other embodiments, the agitator elements 142 have other shapes (e.g., a tapered shape, with a generally sharp end facing toward the workpiece W and a generally blunt end facing the opposite direction).
- Fluid passing over the first weir 135 contacts the fourth electrode 133 d (e.g., the thief electrode) to provide electrochemical communication between the fourth electrode 133 d and the peripheral region of the workpiece W.
- the close proximity between the fourth electrode 133 d and the peripheral region of the workpiece W is expected to provide greater control over the effects of the fourth electrode 133 d, and additional benefits described in greater detail in pending U.S. application Ser. No. ______ (Attorney Docket No. 291958257US), filed concurrently herewith and incorporated herein by reference.
- the second weir 136 can include castellations or other arrangements of projections and gaps that promote this fluid flow.
- FIG. 3A is a top isometric view of the agitator housing 141 and the agitator 140 shown in FIGS. 2A and 2B .
- the agitator elements 142 are elongated along axis E and arranged generally parallel to each other.
- the agitator elements 142 are separated by fluid-transmissible openings, and in other embodiments, the agitator includes a base (e.g., a solid base), with the agitator elements 142 projecting upwardly from the base to form a plurality of movable compartments that are open to the workpiece above. Further details of such an arrangement are disclosed in pending U.S. application Ser. No. 11/603,940, filed Nov. 22, 2006 and incorporated herein by reference.
- the agitator 140 reciprocates in a direction generally transverse to the elongation axis E, as is indicated by arrow R.
- the agitator 140 is supported toward one end by a first support 143 , and toward the opposite end by a second support 144 .
- the first support 143 is connected to a drive motor, and the second support 144 is connected to a linear guide structure, both of which are described in greater detail below with reference to FIGS. 4-5C .
- the first and second supports 143 , 144 are enclosed at least in part in corresponding splash chambers 145 , which are positioned to contain and dampen fluid splashing and/or sloshing that may result as a consequence of the reciprocating action of the agitator 140 .
- Chamber covers 146 are carried by each of the supports 143 , 144 and move with the supports 143 , 144 relative to the corresponding splash chamber 145 . Accordingly, the chamber covers 146 accommodate the motion of the agitator 140 , and prevent or at least restrict fluid from splashing out of the splash chambers 145 .
- FIG. 3B is a bottom isometric view of the agitator housing 141 and the agitator 140 shown in FIG. 3A .
- the agitator elements 142 are integrally formed with each other from a single piece of machined or cast stock that includes an encircling rim 147 .
- An advantage of this arrangement is that it improves the rigidity of the agitator elements 142 and the agitator 140 overall, resulting in more consistent spacing between the agitator elements 142 and the workpiece adjacent to which they reciprocate.
- Couplings 148 at each end of the agitator 140 connect the agitator 140 to the first support 143 and the second support 144 .
- the agitator housing 141 includes slots 149 that receive the agitator 140 and the couplings 148 and accommodate the reciprocal motion of the agitator 140 while also containing, at least in part, the fluid within the agitator housing 141 . Accordingly, the slots 149 can be small enough to reduce significant splashing, which is further reduced by the presence of the splash chambers 145 .
- FIG. 3C is a cross-sectional illustration of the agitator 140 and agitator housing 141 , taken substantially along line 3 C- 3 C of FIG. 3A .
- FIG. 3C illustrates the agitator 140 positioned within the agitator housing 141 , along with the first support 143 connected toward one end of the agitator 140 with one coupling 148 , and the second support 144 connected toward the opposing end of the agitator 140 with another coupling 148 .
- the couplings 148 and/or the agitator 140 extend through the slots 149 , which accommodate reciprocal motion of the agitator 140 generally transverse to the plane of FIG. 3C .
- the splash chambers 145 extend around the first support 143 and the second support 144 to contain fluid that passes into the splash chamber 145 through the slots 149 .
- the chamber covers 146 restrict or prevent fluid from splashing outside of the splash chambers 145 .
- FIG. 4 is a top isometric illustration of the agitator 140 and the agitator housing 141 installed in a process chamber 130 .
- the first support 143 and the second support 144 extend upwardly above the process location P and out of the corresponding splash chambers 145 .
- the chamber covers 146 FIG. 3C .
- the first support 143 is connected to a linear drive device 151 , which is driven by a motor 150 .
- Drive bellows 152 are positioned around the linear drive device 151 to protect it from the chemical environment within and adjacent to the process chamber 130 , while allowing the motor 150 to drive the agitator 140 back and forth, as indicated by arrow R.
- the second support 144 extends out of the opposing splash chamber 145 , where it is connected to a linear guide 153 .
- the linear guide 153 supports the agitator 140 as the agitator 140 reciprocates, thereby maintaining the agitator elements 142 at a consistent spacing from the process location P.
- the linear guide 153 is not so restrictive as to cause binding when the motor 150 drives the agitator 140 back and forth. Further details of particular arrangements for the linear guide 153 are described below with reference to FIGS. 5A-5C .
- FIG. 5A is an exploded view of the linear guide 153 described above with reference to FIG. 4 .
- the linear guide 153 includes an elongated, generally U-shaped guide rail 154 carried at opposing ends by corresponding mounts 157 .
- a guide carriage 155 slides or rolls along the guide rail 154 and is attached to the second support 144 ( FIG. 4 ) with a bracket 161 .
- Guide bellows 156 are positioned on either side of the guide carriage 155 to protect the guide rail 154 and internal components from the local environment.
- FIG. 5B is a cross-sectional illustration of the linear guide 153 described above with reference to FIG. 5A , after assembly.
- the guide carriage 155 includes multiple rollers 158 that engage with and roll along the guide rail 154 .
- the rollers 158 include three rollers, illustrated as two first rollers 158 a and a second roller 158 b.
- the first rollers 158 a have a fixed relationship relative to the guide rail 154 in a direction transverse to the plane of FIG.
- the second roller 158 b can be adjusted in the transverse direction to have a desired location relative to the guide rail 154 that reduces the tendency for the guide carriage 155 to bind with the guide rail 154 . Further details of this arrangement are described below with reference to FIG. 5C .
- FIG. 5C is a cross-sectional illustration of the linear guide 153 , taken substantially along line 5 C- 5 C of FIG. 5B . Although the section is taken through the second roller 158 b, the following discussion describes aspects of both the first rollers 158 a and the second roller 158 b. Linear guide mechanisms having the following characteristics are available from the Rollon Corporation of Sparta, N.J.
- the guide rail 154 When seen from its end, (as in FIG. 5C ) the guide rail 154 includes an inner side wall 159 a, an opposing outer side wall 159 b, an inner lip 160 a positioned above the inner side wall 159 a, and an outer lip 160 b positioned above the outer side wall 159 b.
- the illustrated roller 158 can make contact with any of these surfaces as it rolls along the guide rail 154 in a direction into and out of the plane of FIG. 5C .
- roller 158 shown in FIG. 5C is one of the first rollers 158 a shown in FIG. 5B
- its lateral position relative to the guide rail 154 is fixed.
- roller 158 corresponds to the second roller 158 b its lateral position can be adjusted using an eccentric adjustment mechanism to move it laterally, as indicated by arrow L, relative to the guide rail 154 . Accordingly, if the first rollers 158 a are in contact with the inner side wall 159 a, the second roller 158 b can be adjusted so as to be spaced apart from both the inner side wall 159 a and the outer side wall 159 b.
- the carriage 155 may bind in the guide rail 154 .
- the second roller 158 b By adjusting the second roller 158 b to allow at least some relative motion in the lateral direction L, the likelihood that the carriage 155 will bind is eliminated or at least reduced.
- the arrangement of the rollers 158 and the guide rail 154 is such that a small amount of motion in the lateral direction L does not create a significant amount of motion in the vertical direction V. In this way, the vertical orientation of the agitator (which is carried by the guide carriage 155 ) remains fixed or at least approximately fixed so that the agitator does not shift upwardly and downwardly relative to the workpiece adjacent to which it reciprocates.
- One manner in which the vertical motion of the carriage 155 is restricted is by virtue of the inner lip 160 a and the outer lip 160 b.
- the two lips 160 a - 160 b are sloped so that if the roller 158 shifts (e.g., from right to left in FIG. 5C ), the outer lip 160 b tends to drive the roller 158 back downwardly by virtue of its sloped orientation. If the roller 158 then moves back to the right, the inner lip 160 a performs the same operation.
- This arrangement reduces the amount of motion in the vertical direction V while allowing at least some motion in the lateral direction L, thus reducing the tendency for the guide carriage 155 to bind.
- the linear guide 153 is positioned to restrict the movement of the agitator 140 toward and away from the process location along a first axis (e.g., as indicated by arrow V in FIG. 5C ).
- the linear guide 153 allows linear translation of the agitator 140 along the reciprocation axis R, which is generally perpendicular to the vertical axis V.
- the linear guide 153 also allows for at least some movement of the agitator 140 along a third orthogonal axis perpendicular to the vertical axis V and the reciprocation axis R, as indicated by arrow L in FIG.
- the agitator 140 is actively driven at one end by the motor 150 and linear drive device 151 , and supported (but not driven) at its opposite end by the linear guide 153 .
- the driving force that reciprocates the agitator 140 is directed through only one end of the agitator and only one end of the agitator elements 142 .
- the agitator 140 is not cantilevered. Because the agitator 140 is not cantilevered, the agitator elements 142 are expected to have a more uniform separation from the workpiece W all across the workpiece W, thereby increasing the uniformity of the agitation produced at the process location P.
- the linear guide 153 is constructed to inhibit motion of the agitator 140 toward and away from the process location P, while allowing at least enough motion along the transverse axis L to prevent the agitator 140 from binding.
- the agitator 140 is integrated into a process chamber 130 that includes a thief or other electrode 133 d that may perform a thieving function.
- the electrode 133 d is positioned close to and above the edge of the workpiece W when the workpiece W is at the process location P.
- the location of the electrode 133 d above the process location P and outside the weir 135 is expected to reduce the likelihood for particulates to enter and contaminate the agitator chamber 129 .
- the radial direction of the flow through and out of the process chamber 129 is further expected to carry particulates away from the agitator chamber 129 rather than into the agitator chamber 129 . Accordingly, while the local flow adjacent to the workpiece W changes direction as a result of the agitator 140 reciprocating within the agitator chamber 129 , the bulk flow is radially outwardly over the weir 135 .
- the linear guide may have arrangements other than the particular roller arrangement described above, while still inhibiting motion of the agitator toward and away from the process location and at the same time allowing reciprocal motion of the agitator and preventing the agitator from binding.
- Certain aspects of the invention described in the context of particular embodiments may be combined or eliminated in other embodiments.
- the agitator may be installed in process chambers having configurations other than that shown in FIG. 2 .
Abstract
Systems and methods for processing microfeature workpieces with agitators are disclosed. A system in accordance with one embodiment includes a vessel configured to receive a processing fluid at a process location, a fluid inlet positioned to direct the processing fluid into the vessel, a weir positioned above the process location and outwardly from the fluid inlet to receive the processing fluid moving radially outwardly from the inlet, and a workpiece support positioned to carry a workpiece at the process location. An agitator has an elongated agitator element positioned proximate to the process location, a first support proximate to a first end of the agitator element, and a second support proximate to an opposite end of the agitator element. A motor is coupled to the first support and not the second support to drive the agitator along a linear path relative to the process location. A linear guide is engaged with the second support to guide the motion of the agitator.
Description
- The present application is a continuation-in-part of pending U.S. application Ser. No. 10/734,098, filed on Dec. 11, 2003, which claims priority to U.S. Provisional Application No. 60/484,603, filed on Jul. 1, 2003, both of which are incorporated herein by reference.
- The present invention is related to linearly translating agitators for processing microfeature workpieces, and associated methods. Such agitators and associated support arrangement provide high mass-transfer rates at the workpiece surface, while maintaining a consistent spacing from the workpiece surface.
- In many wet chemical processes, a diffusion layer forms adjacent to a process surface of a workpiece (e.g., a semiconductor wafer). The mass-transfer in the diffusion layer is often a significant factor in the efficacy and efficiency of wet chemical processing because the concentration of the material varies over the thickness of the diffusion layer. It is accordingly desirable to control the mass-transfer rate at the workpiece to achieve the desired results. For example, many manufacturers seek to increase the mass-transfer rate to increase the etch rate and/or deposit rate, thereby reducing the time required for processing cycles. The mass-transfer rate also plays a significant role in depositing alloys onto microfeature workpieces because the different ion species in the processing solution have different plating properties. Therefore, increasing or otherwise controlling the mass-transfer rate at the surface of the workpiece is important for depositing alloys and other wet chemical processes.
- One technique for increasing or otherwise controlling the mass-transfer rate at the surface of the workpiece is to increase the relative velocity between the processing solution and the surface of the workpiece, and in particular, the relative velocity of flows that impinge upon the workpiece (e.g., non-parallel flows). Many electrochemical processing chambers use fluid jets or rotate the workpiece to increase the relative velocity between the processing solution and the workpiece. Other types of vessels include paddles that translate or rotate in the processing solution adjacent to the workpiece to create a high-speed, agitated flow at the surface of the workpiece. In electrochemical processing applications, for example, the paddle typically oscillates between the workpiece and an anode in the plating solution.
- One arrangement for agitating the flow adjacent to a workpiece includes oscillating a single paddle back and forth across the diameter of the workpiece. For example, U.S. Pat. No. 6,547,937, assigned to the assignee of the present invention and incorporated herein by reference, discloses a single elongated paddle driven at opposing ends by a motor and belt arrangement. Though suitable for many purposes, this arrangement requires relatively high paddle speeds in some instances because it includes only a single paddle. Driving the paddle from both ends can also result in one end or the other binding if the drive mechanism is not precisely synchronized.
- One approach to addressing the foregoing drawbacks is to replace the single paddle with an array of paddles, as is disclosed in U.S. Patent Publication No. US2005-0006241A1, also assigned to the assignee of the present invention and incorporated herein by reference. The array of paddles is carried at one end and cantilevered across the diameter of the workpiece. The array of paddles can be reciprocated over a much shorter stroke than a single paddle while still providing suitable agitation adjacent to the workpiece. However, in some cases, the cantilevered arrangement of the paddle array results in some parts of the paddles (e.g., those near the supported end of the array) maintaining a closer spacing relative to the workpiece than are other parts of the paddles (e.g., those near the unsupported, cantilevered end of the array).
- In light of the foregoing, it would be desirable to provide an apparatus and method for agitating the processing solution adjacent to a workpiece in a manner that provides consistent spacing between the agitator and the workpiece, and that does not require high agitator speeds and/or extended agitator translation distances. It would also be desirable to improve the manner with which fluid is provided to the interface between the agitator and the workpiece.
- The present invention provides agitators and associated systems and methods that are capable of providing the desired degree of agitation at the workpiece surface, while maintaining consistent spacing between the agitator and the workpiece. The agitators accordingly have one or more elongated agitator elements, with a first support proximate to a first end of the agitator elements and a second support proximate to a second end of the agitator elements. A motor is coupled to the first support and not the second support to drive the agitator along a linear path relative to the process location. A linear guide is then engaged with the second support. By not driving the agitator from both ends, the likelihood for binding the agitator is reduced or eliminated. By providing a linear guide opposite the driven end of the agitator, the spacing between the agitator elements and the workpiece is maintained across the surface of the workpiece.
- In particular arrangements, the linear guide is positioned to (a) restrict movement of the agitator toward and away from the process location along a first axis, and (b) allow linear translation of the agitator along the linear path, which is aligned with a second axis generally perpendicular to the first. The linear guide can also (c) allow for movement of the agitator along a third axis generally perpendicular to both the first and second axes to at least reduce the tendency for the agitator to bind with the linear guide. For example, the linear guide can include a U-shaped channel having an upwardly facing opening, and the channel can carry rollers connected to the second support. At least one roller is positioned to be in contact with one of the walls of the channel, while another roller is not, thereby allowing for at least some motion along the third axis.
- In operation, a processing fluid is directed upwardly into a vessel toward a microfeature workpiece positioned at a process location. The processing fluid is then directed radially outwardly adjacent to the microfeature workpiece and over a weir. The processing fluid adjacent to the microfeature workpiece is agitated with an agitator by driving the first support along the linear guidepath and guiding the second support without driving the second support. The motion of the agitator toward and away from the process location is at least restricted along the first axis, permitted along a second axis (e.g., a reciprocation axis) generally transverse to the first axis, and permitted along a third axis generally perpendicular to both the first and second axes at least to an extent that reduces or eliminates binding.
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FIG. 1 is a top isometric view of a tool having one or more process chambers with an agitator configured in accordance with an embodiment of the invention. -
FIG. 2A is a cut-away view of one of the process chambers shown inFIG. 1 . -
FIG. 2B is a detailed, cut-away view of a portion of the process chamber shown inFIG. 2A . -
FIG. 3A is a top isometric view of a paddle assembly and associated housing and support arrangement configured in accordance with an embodiment of the invention. -
FIG. 3B is a bottom view of the assembly, housing and support arrangement shown inFIG. 3A . -
FIG. 3C is a cross-sectional illustration of the assembly, housing and support arrangement, taken substantially alongline 3C-3C ofFIG. 3A . -
FIG. 4 is a top isometric view of the process chamber shown inFIG. 2 , illustrating a motor and linear guide coupled to an agitator in accordance with an embodiment of the invention. -
FIG. 5A is an exploded isometric illustration of the linear guide shown inFIG. 4 . -
FIG. 5B is a cross-sectional illustration of the linear guide shown inFIG. 4 . -
FIG. 5C is a cross-sectional illustration of the linear guide, taken substantially alongline 5C-5C ofFIG. 5B . - The following description discloses the details and features of several embodiments of agitators used for processing microfeature workpieces, and associated methods for making and using such agitators. The term “agitator” refers to a device that accelerates, stirs and/or otherwise energizes flow adjacent to a microfeature workpiece. The terms “microfeature workpiece” and “workpiece” refer to substrates on and/or in which micro-devices are formed. Typical micro-devices include microelectronic circuits or components, thin-film recording heads, data storage elements, micro-fluidic devices, and other products. Micro-machines or micromechanical devices are included within this definition because they are manufactured in much the same manner as are integrated circuits. The substrates can be semiconductive pieces (e.g., silicon wafers or gallium arsenide wafers), non-conductive pieces (e.g., various substrates), or conductive pieces (e.g., doped wafers). It will be appreciated that several of the details set forth below are provided to describe the following embodiments in a manner sufficient to enable a person skilled in the art to make and use the disclosed embodiments. Several of the details and advantages described below, however, may not be necessary to practice certain embodiments of the invention. Accordingly, the invention may also include other embodiments that are also within the scope of the claims, but are not described in detail with reference to
FIGS. 1-5C . - The operation and features of agitators used for processing microfeature workpieces are best understood in light of the environment and equipment in which they can be used. Accordingly, a representative processing tool in which the agitators can be used is described with reference to
FIG. 1 . Further details of representative agitators and devices for driving and guiding the agitators are then described with reference toFIGS. 2A-5C . -
FIG. 1 is a partially schematic, isometric illustration of atool 100 that performs one or more wet chemical or other processes on microfeature workpieces W. Thetool 100 includes a housing or cabinet (removed for purposes of illustration) that encloses adeck 104. Thedeck 104 supports a plurality ofprocessing stations 110, and atransport system 105. Thestations 110 can include rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, annealing chambers, or other types of processing chambers. At least someindividual processing stations 110 include a vessel, reactor, orchamber 130 and a workpiece support 120 (for example, a lift-rotate unit) that supports an individual microfeature workpiece W during processing at thechamber 130. Thetransport system 105 moves the workpieces W to and from thechambers 130. Accordingly, thetransport system 105 includes a transfer device orrobot 106 that moves along alinear guidepath 103 to transport individual workpieces W within thetool 100. Thetool 100 further includes a workpiece load/unloadunit 101 having a plurality of containers for holding the workpieces W as they enter and exit thetool 100. - In operation, the
transfer device 106 includes afirst carrier 107 with which it carries the workpieces W from the load/unloadunit 101 to theprocessing stations 110 according to a predetermined work flow schedule within thetool 100. Typically, each workpiece W is initially aligned at apre-aligner station 110 a before it is moved sequentially to theother processing stations 110. At eachprocessing station 110, thetransfer device 106 transfers the workpiece W from thefirst carrier 107 to asecond carrier 121 located at thesupport 120. Thesecond carrier 121 then carries the workpiece W while the workpiece W is processed at thecorresponding process chamber 130. Acontroller 102 receives inputs from an operator and, based on the inputs, automatically directs the operation of thetransfer device 106, theprocessing stations 110, and the load/unloadunit 101. -
FIG. 2 is a cut-away illustration of one of theprocess chambers 130 shown inFIG. 1 . Theprocess chamber 130 generally includes avessel 131 that contains an electrochemical processing fluid for processing a workpiece W, a cut-away portion of which is shown in dashed lines inFIG. 2A ). Thevessel 131 has alower portion 139 a through which the processing fluid enters, and anupper portion 139 b having a horizontal process location P at which the workpiece W is processed. The processing fluid enters thevessel 131 through afluid inlet 134 at thelower portion 139 a and proceeds generally upwardly toward the process location P through aflow control assembly 138. The fluid at the process location P is in fluid and electrical communication with one ormore electrodes 133, three of which are located below the process location P and are identified as first, second andthird electrodes lower portion 139 a functions as an electrode support. Eachelectrode 133 a-133 c is housed in anannular chamber 132 having upwardly extending walls that terminate near the process location P. Theelectrodes 133 a-133 c, each of which can be independently controlled, operate as anodes and act at corresponding “virtual anode” locations positioned at the open tops of eachelectrode chamber 132. Aring contact assembly 122 acts as a cathode and provides a return path for current passing from theelectrodes 133 a-133 c, through the electrochemical fluid and through the workpiece W. Alternatively, the return path can be provided by a backside contact, which contacts the upwardly facing, back surface of the workpiece W. After processing, the workpiece W can be rinsed and spun dry, typically referred to as a spin/rinse/dry or SRD process. AnSRD lip 137 captures fluid flung from the workpiece W during the SRD process. - The
vessel 131 also includes anagitator 140 positioned just below the workpiece W at the process location P. Theagitator 140 includes multiple, elongated and spaced-apartagitator elements 142 that reciprocate back and forth as a unit within anagitator housing 141, as indicated by arrow R. Theagitator housing 141 includes afirst weir 135 over which the processing fluid flows in a radial direction after it passes upwardly through thevessel 131 and outwardly across the surface of the workpiece W. Theagitator housing 141 defines a portion of anagitator chamber 129 in which theagitator 140 reciprocates, with a lower portion of theagitator chamber 129 formed at least in part by thetops 127 of theelectrode chambers 132, and an upper portion of the chamber formed at least in part by the workpiece W. - The
chamber 130 also includes amagnet assembly 170, which in turn includes twomagnets 171 positioned on opposite sides of thevessel 131. Themagnets 171 provide a magnetic field within thevessel 131 that magnetically aligns material in the processing fluid, e.g., as the material is deposited onto the workpiece W. In other embodiments, thechamber 130 need not include themagnet assembly 170, while still including other features described herein. - The
overall process chamber 130 further includes afourth electrode 133 d positioned close to the process location P. Thefourth electrode 133 d may be coupled to a potential at a polarity opposite that to which the first-third electrodes 133 a-133 c are coupled (e.g., a cathodic potential). Accordingly, thefourth electrode 133 d may operate as a current thief, thereby attracting material that would otherwise be deposited at the periphery of the workpiece W. In this manner, thefourth electrode 133 d can counteract the “terminal effect,” which typically results when the workpiece (a) is carried by thering contact assembly 122 and (b) has a relatively high-resistance conductive layer exposed to the processing fluid. Thefourth electrode 133 d is carried by asecond weir 136 over which at least some of the processing fluid may flow. Further details of this arrangement are described below with reference toFIG. 2B , and additional details of theagitator 140 are then described with reference toFIGS. 3A-5C . -
FIG. 2B is an enlarged isometric illustration of theupper portion 139 b of theprocess chamber 130 shown inFIG. 2A . Theagitator housing 141 seals against theupper portion 139 b with a seal 128 (e.g., an O-ring seal). As shown inFIG. 2B , thering contact assembly 122 includes a ring contact 123 (shown schematically inFIG. 2B ) having contact elements that make electrical contact with the downwardly facing periphery of the workpiece W carried at the process location P. Typically, thering contact 123 is coupled to a cathodic potential, so that the workpiece W is cathodic, but thering contact 123 may selectively be coupled to an anodic potential as well. Thering contact assembly 122 also includes aring contact seal 124 that protects the interface between thering contact 123 and the workpiece W. Thering contact assembly 122 is carried by the support 120 (FIG. 1 ) and accordingly moves upwardly and downwardly relative to thevessel 131 to move the workpiece W to and from the process location P. - While at the process location P, the workpiece W is in contact with the electrochemical fluid proceeding upwardly through openings between neighboring
agitator elements 142, radially outwardly through thevessel 131, and then over thefirst weir 135 and thesecond weir 136. At the same time, theagitator 140 reciprocates back and forth so that theagitator elements 142 agitate the fluid near the workpiece W. Eachagitator element 142 has a diamond shape, with two oppositely-facing tapered ends, in the illustrated embodiment. In other embodiments, theagitator elements 142 have other shapes (e.g., a tapered shape, with a generally sharp end facing toward the workpiece W and a generally blunt end facing the opposite direction). Fluid passing over thefirst weir 135 contacts thefourth electrode 133 d (e.g., the thief electrode) to provide electrochemical communication between thefourth electrode 133 d and the peripheral region of the workpiece W. The close proximity between thefourth electrode 133 d and the peripheral region of the workpiece W is expected to provide greater control over the effects of thefourth electrode 133 d, and additional benefits described in greater detail in pending U.S. application Ser. No. ______ (Attorney Docket No. 291958257US), filed concurrently herewith and incorporated herein by reference. Fluid passing over thesecond weir 136 keeps thesecond weir 136 wet and can thereby prevent the formation of crystals, which may interfere with the proper seating between the ring contact assembly 122 (in particular, the seal 124) and the vessel 131 (in particular, the upper surface of the second weir 136). Accordingly, thesecond weir 136 can include castellations or other arrangements of projections and gaps that promote this fluid flow. -
FIG. 3A is a top isometric view of theagitator housing 141 and theagitator 140 shown inFIGS. 2A and 2B . Theagitator elements 142 are elongated along axis E and arranged generally parallel to each other. In a particular embodiment shown inFIG. 3A , theagitator elements 142 are separated by fluid-transmissible openings, and in other embodiments, the agitator includes a base (e.g., a solid base), with theagitator elements 142 projecting upwardly from the base to form a plurality of movable compartments that are open to the workpiece above. Further details of such an arrangement are disclosed in pending U.S. application Ser. No. 11/603,940, filed Nov. 22, 2006 and incorporated herein by reference. - The
agitator 140 reciprocates in a direction generally transverse to the elongation axis E, as is indicated by arrow R. Theagitator 140 is supported toward one end by afirst support 143, and toward the opposite end by asecond support 144. Thefirst support 143 is connected to a drive motor, and thesecond support 144 is connected to a linear guide structure, both of which are described in greater detail below with reference toFIGS. 4-5C . The first andsecond supports corresponding splash chambers 145, which are positioned to contain and dampen fluid splashing and/or sloshing that may result as a consequence of the reciprocating action of theagitator 140. Chamber covers 146 are carried by each of thesupports supports corresponding splash chamber 145. Accordingly, the chamber covers 146 accommodate the motion of theagitator 140, and prevent or at least restrict fluid from splashing out of thesplash chambers 145. -
FIG. 3B is a bottom isometric view of theagitator housing 141 and theagitator 140 shown inFIG. 3A . In the illustrated arrangement, theagitator elements 142 are integrally formed with each other from a single piece of machined or cast stock that includes anencircling rim 147. An advantage of this arrangement is that it improves the rigidity of theagitator elements 142 and theagitator 140 overall, resulting in more consistent spacing between theagitator elements 142 and the workpiece adjacent to which they reciprocate.Couplings 148 at each end of theagitator 140 connect theagitator 140 to thefirst support 143 and thesecond support 144. Theagitator housing 141 includesslots 149 that receive theagitator 140 and thecouplings 148 and accommodate the reciprocal motion of theagitator 140 while also containing, at least in part, the fluid within theagitator housing 141. Accordingly, theslots 149 can be small enough to reduce significant splashing, which is further reduced by the presence of thesplash chambers 145. -
FIG. 3C is a cross-sectional illustration of theagitator 140 andagitator housing 141, taken substantially alongline 3C-3C ofFIG. 3A .FIG. 3C illustrates theagitator 140 positioned within theagitator housing 141, along with thefirst support 143 connected toward one end of theagitator 140 with onecoupling 148, and thesecond support 144 connected toward the opposing end of theagitator 140 with anothercoupling 148. Thecouplings 148 and/or theagitator 140 extend through theslots 149, which accommodate reciprocal motion of theagitator 140 generally transverse to the plane ofFIG. 3C . Thesplash chambers 145 extend around thefirst support 143 and thesecond support 144 to contain fluid that passes into thesplash chamber 145 through theslots 149. The chamber covers 146 restrict or prevent fluid from splashing outside of thesplash chambers 145. -
FIG. 4 is a top isometric illustration of theagitator 140 and theagitator housing 141 installed in aprocess chamber 130. With theagitator housing 141 installed, thefirst support 143 and thesecond support 144 extend upwardly above the process location P and out of thecorresponding splash chambers 145. For purposes of illustration, the chamber covers 146 (FIG. 3C ) have been removed. Thefirst support 143 is connected to alinear drive device 151, which is driven by amotor 150. Drive bellows 152 are positioned around thelinear drive device 151 to protect it from the chemical environment within and adjacent to theprocess chamber 130, while allowing themotor 150 to drive theagitator 140 back and forth, as indicated by arrow R. Thesecond support 144 extends out of the opposingsplash chamber 145, where it is connected to alinear guide 153. Thelinear guide 153 supports theagitator 140 as theagitator 140 reciprocates, thereby maintaining theagitator elements 142 at a consistent spacing from the process location P. At the same time, thelinear guide 153 is not so restrictive as to cause binding when themotor 150 drives theagitator 140 back and forth. Further details of particular arrangements for thelinear guide 153 are described below with reference toFIGS. 5A-5C . -
FIG. 5A is an exploded view of thelinear guide 153 described above with reference toFIG. 4 . Thelinear guide 153 includes an elongated, generallyU-shaped guide rail 154 carried at opposing ends by correspondingmounts 157. Aguide carriage 155 slides or rolls along theguide rail 154 and is attached to the second support 144 (FIG. 4 ) with abracket 161. Guide bellows 156 are positioned on either side of theguide carriage 155 to protect theguide rail 154 and internal components from the local environment. -
FIG. 5B is a cross-sectional illustration of thelinear guide 153 described above with reference toFIG. 5A , after assembly. In the illustrated arrangement, theguide carriage 155 includesmultiple rollers 158 that engage with and roll along theguide rail 154. In a particular arrangement, therollers 158 include three rollers, illustrated as twofirst rollers 158 a and asecond roller 158 b. In a particular aspect of this arrangement, thefirst rollers 158 a have a fixed relationship relative to theguide rail 154 in a direction transverse to the plane ofFIG. 5B , while thesecond roller 158 b can be adjusted in the transverse direction to have a desired location relative to theguide rail 154 that reduces the tendency for theguide carriage 155 to bind with theguide rail 154. Further details of this arrangement are described below with reference toFIG. 5C . -
FIG. 5C is a cross-sectional illustration of thelinear guide 153, taken substantially alongline 5C-5C ofFIG. 5B . Although the section is taken through thesecond roller 158 b, the following discussion describes aspects of both thefirst rollers 158 a and thesecond roller 158 b. Linear guide mechanisms having the following characteristics are available from the Rollon Corporation of Sparta, N.J. - When seen from its end, (as in
FIG. 5C ) theguide rail 154 includes aninner side wall 159 a, an opposing outer side wall 159 b, aninner lip 160 a positioned above theinner side wall 159 a, and anouter lip 160 b positioned above the outer side wall 159 b. The illustratedroller 158 can make contact with any of these surfaces as it rolls along theguide rail 154 in a direction into and out of the plane ofFIG. 5C . - When the
roller 158 shown inFIG. 5C is one of thefirst rollers 158 a shown inFIG. 5B , its lateral position relative to theguide rail 154 is fixed. When theroller 158 corresponds to thesecond roller 158 b, its lateral position can be adjusted using an eccentric adjustment mechanism to move it laterally, as indicated by arrow L, relative to theguide rail 154. Accordingly, if thefirst rollers 158 a are in contact with theinner side wall 159 a, thesecond roller 158 b can be adjusted so as to be spaced apart from both theinner side wall 159 a and the outer side wall 159 b. Otherwise, if thefirst rollers 158 a are in contact with theinner side wall 159 a, and thesecond roller 158 b is in contact with the outer side wall 159 b, thecarriage 155 may bind in theguide rail 154. By adjusting thesecond roller 158 b to allow at least some relative motion in the lateral direction L, the likelihood that thecarriage 155 will bind is eliminated or at least reduced. At the same time, the arrangement of therollers 158 and theguide rail 154 is such that a small amount of motion in the lateral direction L does not create a significant amount of motion in the vertical direction V. In this way, the vertical orientation of the agitator (which is carried by the guide carriage 155) remains fixed or at least approximately fixed so that the agitator does not shift upwardly and downwardly relative to the workpiece adjacent to which it reciprocates. - One manner in which the vertical motion of the
carriage 155 is restricted is by virtue of theinner lip 160 a and theouter lip 160 b. The two lips 160 a-160 b are sloped so that if theroller 158 shifts (e.g., from right to left inFIG. 5C ), theouter lip 160 b tends to drive theroller 158 back downwardly by virtue of its sloped orientation. If theroller 158 then moves back to the right, theinner lip 160 a performs the same operation. This arrangement reduces the amount of motion in the vertical direction V while allowing at least some motion in the lateral direction L, thus reducing the tendency for theguide carriage 155 to bind. - One feature of the foregoing arrangements described above with reference to
FIGS. 1-5C is that thelinear guide 153 is positioned to restrict the movement of theagitator 140 toward and away from the process location along a first axis (e.g., as indicated by arrow V inFIG. 5C ). At the same time, thelinear guide 153 allows linear translation of theagitator 140 along the reciprocation axis R, which is generally perpendicular to the vertical axis V. Thelinear guide 153 also allows for at least some movement of theagitator 140 along a third orthogonal axis perpendicular to the vertical axis V and the reciprocation axis R, as indicated by arrow L inFIG. 5C , to at least reduce the tendency for theagitator 140 to bind with thelinear guide 155. This arrangement produces a more reliable reciprocation operation, while preventing or at least restricting variations in the distance between theagitator 140 and the workpiece W across the surface of the workpiece W. This in turn is expected to produce more consistent agitation over the surface of the workpiece W, which is expected to produce more consistent process results (e.g., more consistent deposition results) across the surface of the workpiece W. - Another feature of at least some of the foregoing embodiments is that the
agitator 140 is actively driven at one end by themotor 150 andlinear drive device 151, and supported (but not driven) at its opposite end by thelinear guide 153. Put another way, the driving force that reciprocates theagitator 140 is directed through only one end of the agitator and only one end of theagitator elements 142. However, theagitator 140 is not cantilevered. Because theagitator 140 is not cantilevered, theagitator elements 142 are expected to have a more uniform separation from the workpiece W all across the workpiece W, thereby increasing the uniformity of the agitation produced at the process location P. In addition, as discussed above, thelinear guide 153 is constructed to inhibit motion of theagitator 140 toward and away from the process location P, while allowing at least enough motion along the transverse axis L to prevent theagitator 140 from binding. - Still another feature of at least some of the foregoing embodiments is that the
agitator 140 is integrated into aprocess chamber 130 that includes a thief orother electrode 133 d that may perform a thieving function. Theelectrode 133 d is positioned close to and above the edge of the workpiece W when the workpiece W is at the process location P. The location of theelectrode 133 d above the process location P and outside theweir 135 is expected to reduce the likelihood for particulates to enter and contaminate theagitator chamber 129. Furthermore, the radial direction of the flow through and out of theprocess chamber 129 is further expected to carry particulates away from theagitator chamber 129 rather than into theagitator chamber 129. Accordingly, while the local flow adjacent to the workpiece W changes direction as a result of theagitator 140 reciprocating within theagitator chamber 129, the bulk flow is radially outwardly over theweir 135. - From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the invention. For example, the linear guide may have arrangements other than the particular roller arrangement described above, while still inhibiting motion of the agitator toward and away from the process location and at the same time allowing reciprocal motion of the agitator and preventing the agitator from binding. Certain aspects of the invention described in the context of particular embodiments may be combined or eliminated in other embodiments. For example, the agitator may be installed in process chambers having configurations other than that shown in
FIG. 2 . Further, while advantages associated with certain embodiments of the invention have been described in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments need necessarily exhibit such advantages to fall within the scope of the invention. Accordingly, the invention is not limited except as by the appended claims.
Claims (23)
1. A system for processing microfeature workpieces, comprising:
a vessel configured to receive a processing fluid at a process location;
a fluid inlet positioned to direct the processing fluid into the vessel;
a weir positioned above the process location and outwardly from the fluid inlet to receive the processing fluid moving radially outwardly from the fluid inlet;
a workpiece support positioned to carry a microfeature workpiece at the process location;
an agitator having an elongated agitator element proximate to the process location;
a first support carrying the agitator proximate to a first end of the agitator element, and a second support carrying the agitator proximate to a second end of the agitator element opposite the first end;
a motor operatively coupled to the first support and not the second support to drive the agitator along a linear path relative to the process location;
and
a linear guide engaged with the second support.
2. The system of claim 1 wherein the agitator element is one of a plurality of elongated, spaced-apart agitator elements, with fluid-transmissible openings between neighboring agitator elements.
3. The system of claim 1 wherein the linear guide is positioned to (a) restrict movement of the agitator toward and away from the process location along a first axis, (b) allow linear translation of the agitator along the linear path aligned with a second axis generally perpendicular to the first axis, and (c) allow for movement of the agitator along a third axis generally perpendicular to the first and second axes to at least reduce the tendency for the agitator to bind with the linear guide.
4. The system of claim 3 wherein the linear guide includes a generally U-shaped channel having an upwardly facing opening, and wherein the channel carries rollers connected to the second support.
5. The system of claim 4 wherein at least one of the rollers is in contact with a first sidewall of the channel, and wherein none of the remaining rollers contacts a second sidewall facing toward the first sidewall.
6. The method of claim 5 wherein the channel includes lips extending inwardly toward each other from the upper ends of each of the sidewalls to restrict motion of the agitator toward and away from the process location.
7. The system of claim 4 wherein at least one of the rollers has a fixed position relative to the agitator and wherein another of the rollers has an adjustable position relative to the agitator.
8. The system of claim 1 , further comprising first and second magnets positioned on opposite sides of the vessel to orient material applied to a microfeature workpiece at the process location.
9. The system of claim 1 wherein the first and second supports extend upwardly away from the process location, and wherein the vessel includes first and second splash chambers, each extending upwardly from the process location and positioned around one of the first and second supports to contain fluid splashing.
10. The system of claim 1 , further comprising an electrode support positioned below the process location to carry multiple, independently controllable electrodes in fluid communication with the process location.
11. The system of claim 1 wherein the agitator element has a generally pointed upper extremity and a generally pointed lower extremity.
12. The system of claim 1 , further comprising an electrode positioned apart from the workpiece support and above the process location.
13. The system of claim 12 wherein the electrode is one of a plurality of electrodes, the one electrode being coupled to a potential at a first polarity, and wherein a subset of the electrodes are positioned in fluid communication with the process location and are coupled to a potential at a second polarity opposite the first, and wherein the workpiece support carries a contact coupled to a potential at the first polarity and positioned to contact a microfeature workpiece at the process location.
14. The system of claim 1 wherein the weir is a first weir, and wherein the system further comprises a second weir positioned radially outwardly from the first weir, the electrode being positioned between the first weir and the second weir.
15. A method for processing microfeature workpieces, comprising:
directing processing fluid upwardly into a vessel toward a microfeature workpiece positioned at a process location of the vessel;
directing the processing fluid radially outwardly adjacent to the microfeature workpiece and over a weir; and
agitating the processing fluid adjacent to the microfeature workpiece with an agitator having an agitator element by:
driving a first support positioned toward a first end of the agitator element; and
guiding a second support along a linear guide path, without driving the second support, the second support being positioned toward a second end of the agitator element opposite the first end.
16. The method of claim 15 wherein guiding the second support includes:
at least restricting movement of the agitator toward and away from the process location along a first axis;
allowing linear translation of the agitator along the linear path in a direction aligned with a second axis generally perpendicular to the first axis; and
allowing for movement of the agitator along a third axis generally perpendicular to the first and second axes to at least reduce the tendency for the second support to bind.
17. The method of claim 16 wherein allowing linear translation of the agitator along the linear path includes allowing a roller carried by the agitator to roll within a guide channel aligned along the linear path.
18. The method of claim 17 wherein the roller is a first roller that rolls along a first sidewall of a U-shaped channel having an upwardly facing opening, and wherein allowing for movement of the agitator along the third axis includes allowing a second roller carried by the agitator to be out of contact with the first sidewall and a second sidewall of the channel facing toward the first sidewall of the channel.
19. The method of claim 17 wherein the roller rolls along a first sidewall of a U-shaped channel having an upwardly facing opening and a lip extending at least partially across the opening, and wherein at least restricting movement of the agitator toward and away from the process location includes at least restricting motion of the roller via contact with the lip.
20. The method of claim 15 wherein agitating the processing fluid includes agitating the processing fluid with a plurality of elongated, spaced-apart agitator elements having fluid-transmissible openings between neighboring agitator elements.
21. The method of claim 15 , further comprising containing processing fluid agitated by the agitator with a first splash chamber extending upwardly away from the process location around the first support, and with a second splash chamber extending upwardly from the process location around the second support.
22. The method of claim 15 , further comprising orienting material applied to the workpiece via a magnetic field in the vessel formed between first and second magnets positioned on opposite sides of the vessel.
23. The method of claim 15 , further comprising:
depositing material on the workpiece from a plurality of anodes positioned in fluid communication with the workpiece; and
attracting at least some of the material that would otherwise deposit on the workpiece to a cathode positioned apart from the workpiece and above the process location.
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TW97102711A TWI384095B (en) | 2007-01-29 | 2008-01-24 | Apparatus and methods for electrochemical processing of wafers |
PCT/US2008/052104 WO2008094838A2 (en) | 2007-01-29 | 2008-01-25 | Apparatus and methods for electrochemical processing of wafers |
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US11/699,763 US20070144912A1 (en) | 2003-07-01 | 2007-01-29 | Linearly translating agitators for processing microfeature workpieces, and associated methods |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070151844A1 (en) * | 2005-11-23 | 2007-07-05 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
US20130220818A1 (en) * | 2011-08-12 | 2013-08-29 | Trevor Graham Niblock | Complex Alloy Electroplating Method |
US20140061053A1 (en) * | 2012-09-05 | 2014-03-06 | Applied Materials, Inc. | Electroplating systems and methods for high sheet resistance substrates |
US20170058424A1 (en) * | 2015-09-02 | 2017-03-02 | APPLIED Materials.Inc. | Electroplating processor with current thief electrode |
US10227706B2 (en) | 2015-07-22 | 2019-03-12 | Applied Materials, Inc. | Electroplating apparatus with electrolyte agitation |
US20220119979A1 (en) * | 2020-10-15 | 2022-04-21 | Applied Materials, Inc. | Paddle chamber with anti-splashing baffles |
CN114534674A (en) * | 2022-03-04 | 2022-05-27 | 青岛瑞斯凯尔生物科技有限公司 | SA-PE coupling device and method thereof |
US20220267921A1 (en) * | 2021-02-19 | 2022-08-25 | Ebara Corporation | Plating apparatus and plating method |
Citations (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3480522A (en) * | 1966-08-18 | 1969-11-25 | Ibm | Method of making magnetic thin film device |
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4102756A (en) * | 1976-12-30 | 1978-07-25 | International Business Machines Corporation | Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus |
US4120578A (en) * | 1976-09-07 | 1978-10-17 | International Business Machines Corporation | Continuously variable reduction scanning optics drive |
US4428814A (en) * | 1982-08-25 | 1984-01-31 | Sperry Corporation | Electroplating apparatus with constant velocity agitation |
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US4648774A (en) * | 1983-02-28 | 1987-03-10 | Methods, Inc. | Load/unload apparatus for disc-like workpieces |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US4868575A (en) * | 1986-12-04 | 1989-09-19 | Mok Chuck K | Phase slope equalizer for satellite antennas |
US4917421A (en) * | 1988-11-01 | 1990-04-17 | Federal-Hoffman, Inc. | Detachable fastener for electrical enclosures |
US4937998A (en) * | 1988-06-17 | 1990-07-03 | Howard Goldberg | Structural member |
US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5230743A (en) * | 1988-05-25 | 1993-07-27 | Semitool, Inc. | Method for single wafer processing in which a semiconductor wafer is contacted with a fluid |
US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
US5344539A (en) * | 1992-03-30 | 1994-09-06 | Seiko Instruments Inc. | Electrochemical fine processing apparatus |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5402807A (en) * | 1993-07-21 | 1995-04-04 | Moore; David R. | Multi-modular device for wet-processing integrated circuits |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
US5476577A (en) * | 1991-11-28 | 1995-12-19 | May; Hans J. | Device for the electrolytic deposition of metal on metal strips |
US5486282A (en) * | 1994-11-30 | 1996-01-23 | Ibm Corporation | Electroetching process for seed layer removal in electrochemical fabrication of wafers |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US5531874A (en) * | 1994-06-17 | 1996-07-02 | International Business Machines Corporation | Electroetching tool using localized application of channelized flow of electrolyte |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US5567300A (en) * | 1994-09-02 | 1996-10-22 | Ibm Corporation | Electrochemical metal removal technique for planarization of surfaces |
US5635157A (en) * | 1992-04-13 | 1997-06-03 | Mease; Ronnie C. | Synthesis of 4-substituted-trans-1,2-diaminocyclohexyl polyaminocarboxylate metal chelating agents for the preparation of stable radiometal antibody immunoconjugates for therapy and spect and pet imaging |
US5683564A (en) * | 1996-10-15 | 1997-11-04 | Reynolds Tech Fabricators Inc. | Plating cell and plating method with fluid wiper |
US5733024A (en) * | 1995-09-13 | 1998-03-31 | Silicon Valley Group, Inc. | Modular system |
US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
US5925226A (en) * | 1994-09-15 | 1999-07-20 | Tokyo Electron Limited | Apparatus and method for clamping a substrate |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6024856A (en) * | 1997-10-10 | 2000-02-15 | Enthone-Omi, Inc. | Copper metallization of silicon wafers using insoluble anodes |
US6027631A (en) * | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6037790A (en) * | 1997-02-25 | 2000-03-14 | International Business Machines Corporation | In-situ contact resistance measurement for electroprocessing |
US6035804A (en) * | 1997-11-07 | 2000-03-14 | Tokyo Electron Limited | Process chamber apparatus |
US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US6082948A (en) * | 1992-11-06 | 2000-07-04 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
US6132586A (en) * | 1998-06-11 | 2000-10-17 | Integrated Process Equipment Corporation | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6156167A (en) * | 1997-11-13 | 2000-12-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating semiconductor wafers |
US6168695B1 (en) * | 1999-07-12 | 2001-01-02 | Daniel J. Woodruff | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US6181057B1 (en) * | 1997-09-18 | 2001-01-30 | Tdk Corporation | Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |
US6197182B1 (en) * | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6228231B1 (en) * | 1997-05-29 | 2001-05-08 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US6251250B1 (en) * | 1999-09-03 | 2001-06-26 | Arthur Keigler | Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
US6312522B1 (en) * | 1999-12-17 | 2001-11-06 | Xerox Corporation | Immersion coating system |
US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
US6379511B1 (en) * | 1999-09-23 | 2002-04-30 | International Business Machines Corporation | Paddle design for plating bath |
US6391114B1 (en) * | 1998-09-21 | 2002-05-21 | Nissin Electric Co., Ltd. | Vacuum processing apparatus |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6478937B2 (en) * | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US6565662B2 (en) * | 1999-12-22 | 2003-05-20 | Tokyo Electron Limited | Vacuum processing apparatus for semiconductor process |
US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
US6635157B2 (en) * | 1998-11-30 | 2003-10-21 | Applied Materials, Inc. | Electro-chemical deposition system |
US6660137B2 (en) * | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6672820B1 (en) * | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
US20040245094A1 (en) * | 2003-06-06 | 2004-12-09 | Mchugh Paul R. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US20050000817A1 (en) * | 2003-07-01 | 2005-01-06 | Mchugh Paul R. | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US20050034977A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Electrochemical deposition chambers for depositing materials onto microfeature workpieces |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US6875333B2 (en) * | 2002-02-14 | 2005-04-05 | Electroplating Engineers Of Japan Limited | Plating apparatus for wafer |
US6897372B2 (en) * | 2001-08-30 | 2005-05-24 | Tellabs Operations, Inc. | Methods and apparatus for forming a flexible junction |
US20050145499A1 (en) * | 2000-06-05 | 2005-07-07 | Applied Materials, Inc. | Plating of a thin metal seed layer |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20050167275A1 (en) * | 2003-10-22 | 2005-08-04 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
US6955747B2 (en) * | 2002-09-23 | 2005-10-18 | International Business Machines Corporation | Cam driven paddle assembly for a plating cell |
US7018517B2 (en) * | 2002-06-21 | 2006-03-28 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
US7247223B2 (en) * | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
-
2007
- 2007-01-29 US US11/699,763 patent/US20070144912A1/en not_active Abandoned
Patent Citations (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3480522A (en) * | 1966-08-18 | 1969-11-25 | Ibm | Method of making magnetic thin film device |
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4120578A (en) * | 1976-09-07 | 1978-10-17 | International Business Machines Corporation | Continuously variable reduction scanning optics drive |
US4102756A (en) * | 1976-12-30 | 1978-07-25 | International Business Machines Corporation | Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus |
US4428814A (en) * | 1982-08-25 | 1984-01-31 | Sperry Corporation | Electroplating apparatus with constant velocity agitation |
US4648774A (en) * | 1983-02-28 | 1987-03-10 | Methods, Inc. | Load/unload apparatus for disc-like workpieces |
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US4868575A (en) * | 1986-12-04 | 1989-09-19 | Mok Chuck K | Phase slope equalizer for satellite antennas |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
US5230743A (en) * | 1988-05-25 | 1993-07-27 | Semitool, Inc. | Method for single wafer processing in which a semiconductor wafer is contacted with a fluid |
US4937998A (en) * | 1988-06-17 | 1990-07-03 | Howard Goldberg | Structural member |
US4917421A (en) * | 1988-11-01 | 1990-04-17 | Federal-Hoffman, Inc. | Detachable fastener for electrical enclosures |
US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5476577A (en) * | 1991-11-28 | 1995-12-19 | May; Hans J. | Device for the electrolytic deposition of metal on metal strips |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
US5344539A (en) * | 1992-03-30 | 1994-09-06 | Seiko Instruments Inc. | Electrochemical fine processing apparatus |
US5635157A (en) * | 1992-04-13 | 1997-06-03 | Mease; Ronnie C. | Synthesis of 4-substituted-trans-1,2-diaminocyclohexyl polyaminocarboxylate metal chelating agents for the preparation of stable radiometal antibody immunoconjugates for therapy and spect and pet imaging |
US6082948A (en) * | 1992-11-06 | 2000-07-04 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
US5402807A (en) * | 1993-07-21 | 1995-04-04 | Moore; David R. | Multi-modular device for wet-processing integrated circuits |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5614076A (en) * | 1994-06-17 | 1997-03-25 | International Business Machines Corporation | Tool and method for electroetching |
US5531874A (en) * | 1994-06-17 | 1996-07-02 | International Business Machines Corporation | Electroetching tool using localized application of channelized flow of electrolyte |
US5567300A (en) * | 1994-09-02 | 1996-10-22 | Ibm Corporation | Electrochemical metal removal technique for planarization of surfaces |
US5925226A (en) * | 1994-09-15 | 1999-07-20 | Tokyo Electron Limited | Apparatus and method for clamping a substrate |
US5543032A (en) * | 1994-11-30 | 1996-08-06 | Ibm Corporation | Electroetching method and apparatus |
US5486282A (en) * | 1994-11-30 | 1996-01-23 | Ibm Corporation | Electroetching process for seed layer removal in electrochemical fabrication of wafers |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
US5733024A (en) * | 1995-09-13 | 1998-03-31 | Silicon Valley Group, Inc. | Modular system |
US6672820B1 (en) * | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US5683564A (en) * | 1996-10-15 | 1997-11-04 | Reynolds Tech Fabricators Inc. | Plating cell and plating method with fluid wiper |
US6037790A (en) * | 1997-02-25 | 2000-03-14 | International Business Machines Corporation | In-situ contact resistance measurement for electroprocessing |
US6228231B1 (en) * | 1997-05-29 | 2001-05-08 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6139703A (en) * | 1997-09-18 | 2000-10-31 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6181057B1 (en) * | 1997-09-18 | 2001-01-30 | Tdk Corporation | Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |
US6322674B1 (en) * | 1997-09-18 | 2001-11-27 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6024856A (en) * | 1997-10-10 | 2000-02-15 | Enthone-Omi, Inc. | Copper metallization of silicon wafers using insoluble anodes |
US6035804A (en) * | 1997-11-07 | 2000-03-14 | Tokyo Electron Limited | Process chamber apparatus |
US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
US6027631A (en) * | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6156167A (en) * | 1997-11-13 | 2000-12-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating semiconductor wafers |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6132586A (en) * | 1998-06-11 | 2000-10-17 | Integrated Process Equipment Corporation | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
US6391114B1 (en) * | 1998-09-21 | 2002-05-21 | Nissin Electric Co., Ltd. | Vacuum processing apparatus |
US6635157B2 (en) * | 1998-11-30 | 2003-10-21 | Applied Materials, Inc. | Electro-chemical deposition system |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6482300B2 (en) * | 1999-03-23 | 2002-11-19 | Electroplating Engineers Of Japan Limited | Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6991711B2 (en) * | 1999-03-23 | 2006-01-31 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
US6660137B2 (en) * | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US6197182B1 (en) * | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
US6168695B1 (en) * | 1999-07-12 | 2001-01-02 | Daniel J. Woodruff | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US6251250B1 (en) * | 1999-09-03 | 2001-06-26 | Arthur Keigler | Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
US6379511B1 (en) * | 1999-09-23 | 2002-04-30 | International Business Machines Corporation | Paddle design for plating bath |
US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
US6312522B1 (en) * | 1999-12-17 | 2001-11-06 | Xerox Corporation | Immersion coating system |
US6565662B2 (en) * | 1999-12-22 | 2003-05-20 | Tokyo Electron Limited | Vacuum processing apparatus for semiconductor process |
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US20040134774A1 (en) * | 2000-01-03 | 2004-07-15 | Daniel Woodruff | Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
US6773559B2 (en) * | 2000-01-03 | 2004-08-10 | Semitool, Inc. | Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US7294244B2 (en) * | 2000-01-03 | 2007-11-13 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US20050145499A1 (en) * | 2000-06-05 | 2005-07-07 | Applied Materials, Inc. | Plating of a thin metal seed layer |
US6478937B2 (en) * | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
US6897372B2 (en) * | 2001-08-30 | 2005-05-24 | Tellabs Operations, Inc. | Methods and apparatus for forming a flexible junction |
US6875333B2 (en) * | 2002-02-14 | 2005-04-05 | Electroplating Engineers Of Japan Limited | Plating apparatus for wafer |
US7247223B2 (en) * | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US7018517B2 (en) * | 2002-06-21 | 2006-03-28 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
US6955747B2 (en) * | 2002-09-23 | 2005-10-18 | International Business Machines Corporation | Cam driven paddle assembly for a plating cell |
US20050035046A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20040245094A1 (en) * | 2003-06-06 | 2004-12-09 | Mchugh Paul R. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US20050034977A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Electrochemical deposition chambers for depositing materials onto microfeature workpieces |
US20050061438A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US20050006241A1 (en) * | 2003-07-01 | 2005-01-13 | Mchugh Paul R. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
US20050000817A1 (en) * | 2003-07-01 | 2005-01-06 | Mchugh Paul R. | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US20050167275A1 (en) * | 2003-10-22 | 2005-08-04 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7931786B2 (en) | 2005-11-23 | 2011-04-26 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
US20070151844A1 (en) * | 2005-11-23 | 2007-07-05 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
US20130220818A1 (en) * | 2011-08-12 | 2013-08-29 | Trevor Graham Niblock | Complex Alloy Electroplating Method |
US20140061053A1 (en) * | 2012-09-05 | 2014-03-06 | Applied Materials, Inc. | Electroplating systems and methods for high sheet resistance substrates |
US9222195B2 (en) * | 2012-09-05 | 2015-12-29 | Applied Materials, Inc. | Electroplating systems and methods for high sheet resistance substrates |
US10227706B2 (en) | 2015-07-22 | 2019-03-12 | Applied Materials, Inc. | Electroplating apparatus with electrolyte agitation |
US10577712B2 (en) | 2015-07-22 | 2020-03-03 | Applied Materials, Inc. | Electroplating apparatus with electrolyte agitation |
US9765443B2 (en) * | 2015-09-02 | 2017-09-19 | Applied Materials, Inc. | Electroplating processor with current thief electrode |
US20170058424A1 (en) * | 2015-09-02 | 2017-03-02 | APPLIED Materials.Inc. | Electroplating processor with current thief electrode |
US20220119979A1 (en) * | 2020-10-15 | 2022-04-21 | Applied Materials, Inc. | Paddle chamber with anti-splashing baffles |
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US20220267921A1 (en) * | 2021-02-19 | 2022-08-25 | Ebara Corporation | Plating apparatus and plating method |
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