US20070147080A1 - Backlight module with a heat conductive block - Google Patents
Backlight module with a heat conductive block Download PDFInfo
- Publication number
- US20070147080A1 US20070147080A1 US11/433,093 US43309306A US2007147080A1 US 20070147080 A1 US20070147080 A1 US 20070147080A1 US 43309306 A US43309306 A US 43309306A US 2007147080 A1 US2007147080 A1 US 2007147080A1
- Authority
- US
- United States
- Prior art keywords
- bezel
- backlight module
- conductive block
- heat conductive
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Definitions
- the present invention relates to a backlight module, and more particularly, to a backlight module capable of arising heat dissipation.
- a backlight module is a key component of a liquid crystal display (LCD).
- the purpose of the backlight module is to provide a sufficient-brightness and an even-distribution of light on surface to the LCD panel. Because the LCD is widely used in various electronic products such as monitors for notebook computers, digital cameras, and projectors, the demand for the backlight module has increased tremendously.
- FIG. 1 shows a prior art backlight module 10 having a plurality of light emitting diodes disposed on a bezel.
- the plurality of LEDs 12 are disposed at the sides of bezel 16 and emit light beams upon receiving driving signals from a driver (not shown) via a pin 18 .
- An arrow A indicates a direction of light axis of the LED 12 .
- a greater power LED emits higher brightness and generates more heat as well.
- MCPCB metal core printed circuit board
- both the metal core printed circuit board (MCPCB) 14 and bezel 16 are made of metal with high thermal conductivity.
- a backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel.
- the backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.
- An advantage of the present invention is to provide a heat conductive block positioned between the LED and the bezel, which serves as a heat-transferring bridge between the LED and the bezel. For the LED at the corner of the bezel, since the heat conductive block contacts the edge and the bottom surfaces of the bezel, heat generated by the LED is able to be dissipated quickly through the heat conductive block.
- FIG. 1 shows a prior art backlight module having a plurality of light emitting diodes disposed on a bezel.
- FIG. 2 shows a diagram of a backlight module according to the present invention.
- FIG. 3 is a partially enlarged diagram of the backlight module depicted in FIG. 2 .
- FIG. 2 shows a diagram of a backlight module 20 according to the present invention
- FIG. 3 is a partially enlarged diagram of the backlight module 20 depicted in FIG. 2
- the backlight module 20 comprises a bezel 26 and a plurality of light emitting diodes (LEDs) 22 disposed at the corners of the bezel 26 .
- a bottom surface 32 of the bezel 26 is used for positioning such optical components as a light guide plate, a diffusion sheet, and a brightness enhancement film, for simplicity, not shown in FIG. 2 .
- the plurality of light emitting diodes (LEDs) 22 is disposed on a circuit board 24 .
- a heat conductive block 30 is positioned between the circuit board 24 and the bezel 26 . Both the heat conductive block 30 and the bezel 26 are made of metal (e.g. aluminum) or other materials having high thermal conductivity.
- the circuit board 24 is a flexible print circuit board (PCB) capable of being laid on the bezel 26 .
- PCB flexible print circuit board
- LED 22 is positioned at the corner of the bezel 26 , and is neither vertical nor parallel to the edges of the bezel 26 .
- the light axis B of the LED 22 is neither vertical nor parallel to the edges of the bezel 26 where the light axis indicates a median of the maximum luminance region of the LED. In doing so, a fewer number of the LED 22 positioned at the corner of the bezel 26 is sufficient for providing the required brightness for the visible active area of a liquid crystal display.
- the solid heat conductive block 30 is made of a metal with high thermal conductivity, and is not shaped as rectangular.
- the heat conductive block 30 is affixed and attached to the bezel 26 to minimize the gap between the heat conductive block 30 and bezel 26 .
- the heat conductive block 30 , the circuit board 24 , and the bezel 26 are adhered with a high polymer having high thermal conductivity eliminating air gap therebetween.
- the present invention backlight module is for use in liquid crystal displays that use the LED as a light source.
- the LED of the present invention backlight module is arranged at the edge of the bezel, and the alignment of the LED is neither vertical nor parallel to the edge of the bezel.
- the present backlight module invention uses a heat conductive block positioned between the LED and the bezel to increase the contact areas between the bezel and the heat conductive block, thereby causing better heat dissipating efficiency.
- heat-dissipating efficiency is improved because of the heat conductive block directly contacting the edge surfaces and bottom surface of the bezel.
- the present invention has been explained by the embodiments shown in the drawings described above, it should be understood to the ordinary skilled person in the art that the invention is not limited to the embodiments.
- the number of LEDs used depends on the design demand, and two or more LEDs which are not parallel or vertical to either edges of the bezel are also allowed.
- the present invention has been explained by the embodiments shown in the drawings described above, it should be understood to the ordinary skilled person in the art that the invention is not limited to the embodiments, but rather the various changes or modifications thereof are possible without departing from the spirit of the invention.
- the bezel and the circuit board are also made of any material with high thermal conductivity.
Abstract
A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.
Description
- 1. Field of the Invention
- The present invention relates to a backlight module, and more particularly, to a backlight module capable of arising heat dissipation.
- 2. Description of the Related Art
- A backlight module is a key component of a liquid crystal display (LCD). The purpose of the backlight module is to provide a sufficient-brightness and an even-distribution of light on surface to the LCD panel. Because the LCD is widely used in various electronic products such as monitors for notebook computers, digital cameras, and projectors, the demand for the backlight module has increased tremendously.
- In addition to cold cathode fluorescent lamps (CCFLs), light emitting diodes are increasingly used in medium and large size liquid crystal displays. Please refer to
FIG. 1 , which shows a prior art backlight module 10 having a plurality of light emitting diodes disposed on a bezel. Conventionally, the plurality ofLEDs 12 are disposed at the sides ofbezel 16 and emit light beams upon receiving driving signals from a driver (not shown) via apin 18. An arrow A indicates a direction of light axis of theLED 12. A greater power LED emits higher brightness and generates more heat as well. In order to promptly dissipate generated heat, a traditional way is to position theLED 12 on a metal core printed circuit board (MCPCB) 14. The generated heat is rapidly transferred tobezel 16 and is therefore dissipated by means of air convection. In addition, for more efficient heat dissipation, both the metal core printed circuit board (MCPCB) 14 andbezel 16 are made of metal with high thermal conductivity. - With a rapid development of LED manufacturing, maximum luminance provided for new LEDs is greater. Certainly, using new LEDs can reduce the number of LEDs used in a backlight module, thereby reducing the cost. Nevertheless, luminance of the LED is inverse proportion to its operating temperature and thus shortens the life span of the LED, and how to improve the heat dissipation in order to lower operating temperature of the LED is a main goal for backlight module manufacturers.
- It is therefore an objective of the claimed invention to provide a backlight module utilizing a heat conductive block positioned between a bezel and an LED to increase LED's contact area against the bezel, conducive to heat dissipation.
- Briefly summarized, a backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.
- An advantage of the present invention is to provide a heat conductive block positioned between the LED and the bezel, which serves as a heat-transferring bridge between the LED and the bezel. For the LED at the corner of the bezel, since the heat conductive block contacts the edge and the bottom surfaces of the bezel, heat generated by the LED is able to be dissipated quickly through the heat conductive block.
- These and other objectives of the claimed invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
-
FIG. 1 shows a prior art backlight module having a plurality of light emitting diodes disposed on a bezel. -
FIG. 2 shows a diagram of a backlight module according to the present invention. -
FIG. 3 is a partially enlarged diagram of the backlight module depicted inFIG. 2 . - Please refer to
FIGS. 2 and 3 .FIG. 2 shows a diagram of abacklight module 20 according to the present invention, andFIG. 3 is a partially enlarged diagram of thebacklight module 20 depicted inFIG. 2 . Thebacklight module 20 comprises abezel 26 and a plurality of light emitting diodes (LEDs) 22 disposed at the corners of thebezel 26. Abottom surface 32 of thebezel 26 is used for positioning such optical components as a light guide plate, a diffusion sheet, and a brightness enhancement film, for simplicity, not shown inFIG. 2 . Also, the plurality of light emitting diodes (LEDs) 22 is disposed on acircuit board 24. A heatconductive block 30 is positioned between thecircuit board 24 and thebezel 26. Both the heatconductive block 30 and thebezel 26 are made of metal (e.g. aluminum) or other materials having high thermal conductivity. - When the
LED 22 emitting light triggered by a driver (not shown) via apin 28, heat is generated. The emitted light is guided by a patterned surface of a light guide plate (not shown) to a liquid crystal panel, while the generated heat is transferred tobezel 26 via acircuit board 24 and a heatconductive block 30. In addition, thebezel 26 contacting the heatconductive block 30 inareas surface 32 ofbezel 26 and the heatconductive block 30. Compared with the prior art backlight module ofFIG. 1 , heat generated from theLED 22 is more quickly dissipated by air convection through larger contact areas between thebezel 26 and the heatconductive block 30. - Preferably, the
circuit board 24 is a flexible print circuit board (PCB) capable of being laid on thebezel 26. -
LED 22 is positioned at the corner of thebezel 26, and is neither vertical nor parallel to the edges of thebezel 26. In other words, the light axis B of theLED 22 is neither vertical nor parallel to the edges of thebezel 26 where the light axis indicates a median of the maximum luminance region of the LED. In doing so, a fewer number of theLED 22 positioned at the corner of thebezel 26 is sufficient for providing the required brightness for the visible active area of a liquid crystal display. - Preferably, the solid heat
conductive block 30 is made of a metal with high thermal conductivity, and is not shaped as rectangular. For better heat dissipating efficiency, the heatconductive block 30 is affixed and attached to thebezel 26 to minimize the gap between the heatconductive block 30 andbezel 26. Furthermore, the heatconductive block 30, thecircuit board 24, and thebezel 26, are adhered with a high polymer having high thermal conductivity eliminating air gap therebetween. - The present invention backlight module is for use in liquid crystal displays that use the LED as a light source.
- To sum up, the LED of the present invention backlight module is arranged at the edge of the bezel, and the alignment of the LED is neither vertical nor parallel to the edge of the bezel. In addition, the present backlight module invention uses a heat conductive block positioned between the LED and the bezel to increase the contact areas between the bezel and the heat conductive block, thereby causing better heat dissipating efficiency. As to the LED disposed at the corner of the bezel, heat-dissipating efficiency is improved because of the heat conductive block directly contacting the edge surfaces and bottom surface of the bezel.
- Although the present invention has been explained by the embodiments shown in the drawings described above, it should be understood to the ordinary skilled person in the art that the invention is not limited to the embodiments. For example, the number of LEDs used depends on the design demand, and two or more LEDs which are not parallel or vertical to either edges of the bezel are also allowed.
- Although the present invention has been explained by the embodiments shown in the drawings described above, it should be understood to the ordinary skilled person in the art that the invention is not limited to the embodiments, but rather the various changes or modifications thereof are possible without departing from the spirit of the invention. For example, in addition to the metal used in the aforementioned invention, the bezel and the circuit board are also made of any material with high thermal conductivity.
- The present invention has been described with reference to certain preferred and alternative embodiments which are intended to be exemplary only and not limited to the full scope of the present invention as set forth in the appended claims. Accordingly, the scope of the invention shall be determined only by the appended claims and their equivalents.
Claims (8)
1. A backlight module, comprising:
a bezel having at least one edge;
a circuit board;
one or more light emitting diodes connected to the circuit board, each light emitting diode comprising a light axis, wherein the light axis of each light emitting diode is neither parallel nor vertical to the edge of the bezel; and
a non-rectangle heat conductive block disposed between the bezel and the light emitting diode, for transferring heat generated by the light emitting diode to the bezel.
2. The backlight module of claim 1 , wherein the bezel is made of metal.
3. The backlight module of claim 1 , wherein the circuit board is a flexible print circuit board.
4. The backlight module of claim 1 , wherein the non-rectangle heat conductive block is made of metal.
5. The backlight module of claim 1 , wherein the non-rectangle heat conductive block, the circuit board, and the bezel are adhered with a high polymer having high thermal conductivity.
6. The backlight module of claim 1 , wherein the non-rectangle heat conductive block is attached to the bezel.
7. A liquid crystal display incorporating the backlight module of claim 1 .
8. The backlight module of claim 1 , further comprising a light guide plate with a patterned surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/881,145 US8194208B2 (en) | 2005-12-23 | 2010-09-13 | Backlight module with a heat conductive block |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094146287A TWI298410B (en) | 2005-12-23 | 2005-12-23 | Backlight module |
TW094146287 | 2005-12-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/881,145 Continuation US8194208B2 (en) | 2005-12-23 | 2010-09-13 | Backlight module with a heat conductive block |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070147080A1 true US20070147080A1 (en) | 2007-06-28 |
Family
ID=38193478
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/433,093 Abandoned US20070147080A1 (en) | 2005-12-23 | 2006-05-12 | Backlight module with a heat conductive block |
US12/881,145 Active US8194208B2 (en) | 2005-12-23 | 2010-09-13 | Backlight module with a heat conductive block |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/881,145 Active US8194208B2 (en) | 2005-12-23 | 2010-09-13 | Backlight module with a heat conductive block |
Country Status (2)
Country | Link |
---|---|
US (2) | US20070147080A1 (en) |
TW (1) | TWI298410B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090237588A1 (en) * | 2008-03-19 | 2009-09-24 | Hitachi Displays, Ltd. | Liquid crystal display device |
US20110267818A1 (en) * | 2007-08-31 | 2011-11-03 | Chimei Innolux Corporation | Light source assembly |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI366046B (en) * | 2008-04-03 | 2012-06-11 | Chimei Innolux Corp | Backlight module and liquid crystal display |
TWI398215B (en) * | 2009-12-14 | 2013-06-01 | Pegatron Corp | Casing and manufacturing method thereof |
TWM381089U (en) | 2009-12-25 | 2010-05-21 | Coretronic Corp | Backlight module |
KR101784520B1 (en) * | 2011-03-09 | 2017-10-11 | 엘지디스플레이 주식회사 | Back Light Unit and Liquid Crystal Display Device using the same |
KR101835529B1 (en) * | 2011-08-09 | 2018-03-08 | 삼성디스플레이 주식회사 | Display apparutus and light source package for the same |
KR20140020014A (en) | 2012-08-07 | 2014-02-18 | 삼성디스플레이 주식회사 | Backlight device, display device including the same and manufacturing method for backlight device |
KR102569966B1 (en) * | 2016-08-02 | 2023-08-23 | 삼성디스플레이 주식회사 | Light emitting module and a display device comprises the same |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453855A (en) * | 1992-12-15 | 1995-09-26 | Koito Manufacturing Co., Ltd. | Liquid crystal display device backlit by LED's coupled to printed circuit board |
US6441943B1 (en) * | 1997-04-02 | 2002-08-27 | Gentex Corporation | Indicators and illuminators using a semiconductor radiation emitter package |
US6697130B2 (en) * | 2001-01-16 | 2004-02-24 | Visteon Global Technologies, Inc. | Flexible led backlighting circuit |
US6741301B2 (en) * | 2002-01-10 | 2004-05-25 | Casio Computer Co., Ltd. | Liquid crystal display apparatus having display panels on both upper and lower surfaces |
US20040136189A1 (en) * | 2003-01-13 | 2004-07-15 | Vanderschuit Carl R. | Mood-enhancing illumination apparatus |
US6808302B2 (en) * | 2001-12-20 | 2004-10-26 | Fujitsu Display Technologies Corporation | Backlight device |
US6880947B2 (en) * | 2002-08-16 | 2005-04-19 | Au Optronics Corp. | Direct-type backlight unit for flat panel liquid crystal displays |
US20050180142A1 (en) * | 2004-02-17 | 2005-08-18 | Yi-Shiuan Tsai | Backlight module and heat dissipation structure thereof |
US20050243576A1 (en) * | 2004-05-03 | 2005-11-03 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode array module for providing backlight and backlight unit having the same |
US20070008457A1 (en) * | 2005-07-08 | 2007-01-11 | Yoshiaki Takahashi | Liquid crystal display device and backlight |
US7344279B2 (en) * | 2003-12-11 | 2008-03-18 | Philips Solid-State Lighting Solutions, Inc. | Thermal management methods and apparatus for lighting devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1254708C (en) | 2002-11-13 | 2006-05-03 | 友达光电股份有限公司 | Liquid crystal display |
CN100352072C (en) | 2005-03-02 | 2007-11-28 | 友达光电股份有限公司 | Light emitting diode light source module |
CN100388079C (en) | 2005-06-28 | 2008-05-14 | 友达光电股份有限公司 | Backlight module |
-
2005
- 2005-12-23 TW TW094146287A patent/TWI298410B/en active
-
2006
- 2006-05-12 US US11/433,093 patent/US20070147080A1/en not_active Abandoned
-
2010
- 2010-09-13 US US12/881,145 patent/US8194208B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453855A (en) * | 1992-12-15 | 1995-09-26 | Koito Manufacturing Co., Ltd. | Liquid crystal display device backlit by LED's coupled to printed circuit board |
US6441943B1 (en) * | 1997-04-02 | 2002-08-27 | Gentex Corporation | Indicators and illuminators using a semiconductor radiation emitter package |
US6697130B2 (en) * | 2001-01-16 | 2004-02-24 | Visteon Global Technologies, Inc. | Flexible led backlighting circuit |
US6808302B2 (en) * | 2001-12-20 | 2004-10-26 | Fujitsu Display Technologies Corporation | Backlight device |
US6741301B2 (en) * | 2002-01-10 | 2004-05-25 | Casio Computer Co., Ltd. | Liquid crystal display apparatus having display panels on both upper and lower surfaces |
US6880947B2 (en) * | 2002-08-16 | 2005-04-19 | Au Optronics Corp. | Direct-type backlight unit for flat panel liquid crystal displays |
US20040136189A1 (en) * | 2003-01-13 | 2004-07-15 | Vanderschuit Carl R. | Mood-enhancing illumination apparatus |
US7344279B2 (en) * | 2003-12-11 | 2008-03-18 | Philips Solid-State Lighting Solutions, Inc. | Thermal management methods and apparatus for lighting devices |
US20050180142A1 (en) * | 2004-02-17 | 2005-08-18 | Yi-Shiuan Tsai | Backlight module and heat dissipation structure thereof |
US20050243576A1 (en) * | 2004-05-03 | 2005-11-03 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode array module for providing backlight and backlight unit having the same |
US20070008457A1 (en) * | 2005-07-08 | 2007-01-11 | Yoshiaki Takahashi | Liquid crystal display device and backlight |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110267818A1 (en) * | 2007-08-31 | 2011-11-03 | Chimei Innolux Corporation | Light source assembly |
US8240905B2 (en) * | 2007-08-31 | 2012-08-14 | Innocom Technology (Shenzhen) Co., Ltd. | Light source assembly |
US20090237588A1 (en) * | 2008-03-19 | 2009-09-24 | Hitachi Displays, Ltd. | Liquid crystal display device |
Also Published As
Publication number | Publication date |
---|---|
US8194208B2 (en) | 2012-06-05 |
US20110007521A1 (en) | 2011-01-13 |
TW200725095A (en) | 2007-07-01 |
TWI298410B (en) | 2008-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8194208B2 (en) | Backlight module with a heat conductive block | |
US7488104B2 (en) | Backlight unit and liquid crystal display device having the same | |
KR101777527B1 (en) | Backlight module and liquid crystal display module using same | |
KR101472131B1 (en) | backlight unit | |
US20070063338A1 (en) | Bottom lighting type backlight module | |
JP2006267936A (en) | Liquid crystal display device | |
KR20070076879A (en) | Liquid crystal display device module | |
JP2006011242A (en) | Liquid crystal display device | |
US20120099045A1 (en) | Liquid crystal display apparatus | |
JP2009037212A (en) | Liquid crystal display device | |
JP4632720B2 (en) | Light source device and liquid crystal display device | |
US9229155B2 (en) | Side-edge backlight module | |
KR20060104081A (en) | Liquid crystal display | |
US7427148B1 (en) | Light modules | |
TW200923514A (en) | Backlight unit and liquid crystal display device having the same | |
JP2006098500A (en) | Liquid crystal display device | |
JP4534897B2 (en) | Illumination light source device | |
TW201426128A (en) | Light source module, backlight module and liquid crystal display device | |
WO2011052259A1 (en) | Lighting device, and display device | |
JP2009152146A (en) | Surface light source device and display device | |
JP2009169204A (en) | Liquid crystal display | |
JP5098778B2 (en) | LIGHTING DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND ELECTRONIC DEVICE | |
TWI385449B (en) | Backlight module and display module | |
KR101729776B1 (en) | Backlgiht unit and liquid crystal display device the same | |
JP2008216406A (en) | Heat radiation structure and liquid crystal display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: AU OPTRONICS CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WU, MENG-CHAI;LO, CHI-CHUNG;HSIEH, CHIN-KUN;AND OTHERS;REEL/FRAME:017895/0446 Effective date: 20060503 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |