US20070230120A1 - Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components - Google Patents

Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components Download PDF

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Publication number
US20070230120A1
US20070230120A1 US11/741,507 US74150707A US2007230120A1 US 20070230120 A1 US20070230120 A1 US 20070230120A1 US 74150707 A US74150707 A US 74150707A US 2007230120 A1 US2007230120 A1 US 2007230120A1
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United States
Prior art keywords
heat
display unit
electronic apparatus
unit
radiating
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Abandoned
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US11/741,507
Inventor
Yukihiko Hata
Kentaro Tomioka
Mitsuyoshi Tanimoto
Hiroyuki Kusaka
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Individual
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Individual
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Priority to US11/741,507 priority Critical patent/US20070230120A1/en
Publication of US20070230120A1 publication Critical patent/US20070230120A1/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1615Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/203Heat conductive hinge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an electronic apparatus having heat-generating components such as a semiconductor package and a chip set. Particularly, the invention relates to a structure that cools heat-generating components.
  • a CPU is incorporated in, for example, notebook-type portable computers.
  • the heat that the CPU generates while operating increases as its data-processing speed rises or as it performs more and more functions.
  • cooling system of liquid cooling type have been developed in recent years.
  • the cooling system uses a liquid coolant having a larger thermal conductivity constant than air.
  • Jpn. Pat. Appln. KOKAI Publication No. 7-142886 discloses a cooling system of liquid cooling type, configured for use in portable computers that comprises a main unit and a display unit.
  • the cooling system comprises a heat-receiving header, heat-radiating header, and two tubes.
  • the heat-receiving header is provided in the main unit and thermally connected to the CPU incorporated in the main unit.
  • the heat-radiating header is provided in the display unit or in the main unit along with the heat-receiving header. If the heat-radiating header is provided in the display unit, the heat-radiating header lies adjacent to the display device incorporated in the display unit.
  • Both tubes extend from the main unit to the display unit to circulate the liquid coolant between the heat-receiving header and the heat-radiating header.
  • the liquid coolant absorbs the heat of the CPU in the heat-receiving header.
  • the liquid coolant is heated in the heat-receiving header.
  • the heated liquid coolant is supplied to the heat-radiating header via the first tube.
  • the coolant passes through the heat-radiating header, it releases the heat of the CPU. That is, the liquid coolant is cooled in the heat-radiating header.
  • the cooled coolant is supplied back to the heat-receiving header via the second tube and absorbs the heat of the CPU.
  • heat is transferred from the CPU to the heat-radiating header, which radiates the heat.
  • the heat is released from the display unit or the main unit.
  • the heat-radiating header that radiates the heat of the CPU is provided in the display unit, the heat-radiating header is adjacent to the display device incorporated in the display unit.
  • the heat emanating from the heat-radiating header inevitably heats the display device. Consequently, the temperature of the display device may rise above the maximum use temperature. If this happens, the images that display device displays will be degraded in quality.
  • the heat-radiating header may be provided in the main unit. If this is the case, the heat emanating from the heat-radiating header accumulates in the main unit. When the temperature in the main unit rises, the circuit components and the disk drive, which are provided in the main unit, will be heated to high temperatures. The temperature of the circuit components, for example, may rise above their maximum thermal threshold. If this occurs, the circuit components may be degraded in performance or may undergo thermal breakdown.
  • U.S. Pat. No. 6,519,147 discloses a liquid-cooling system for use in portable computers having a body part and a display part.
  • the cooling system comprises a heat-receiving head and a tube.
  • the heat-receiving head is incorporated in the body part of the computer and connected to heat-generating components such as a CPU and a chip set.
  • the tube is filled with liquid coolant and connected to the heat-receiving head.
  • the tube extending between the body part and the display part.
  • the display part has a liquid crystal display panel and a housing containing the panel.
  • the tube extends into the housing and lies in the gap between the liquid crystal display panel and the back of the housing.
  • the tube meanders on the back of the housing, thus contacting the housing.
  • the liquid coolant is heated as heat exchange is performed in the heat-receiving head.
  • the liquid coolant heated flows in the tube toward the display part.
  • the liquid coolant transmits the heat of the heat-generating components to the housing. Therefore, the heat diffuses in the housing and is radiated from the entire back of the housing.
  • the liquid coolant heated in the heat-receiving header is led into the tube, raising the surface temperature of the tube.
  • the tube is made of material having high heat-radiating property because it transmits the heat of the liquid coolant to the housing.
  • the liquid crystal panel is liable to the heat emanating from the tube. When the panel is heated to high temperatures, the liquid crystal molecules cannot be oriented as is desired. In consequence, the images that the liquid crystal panel displays will be degraded in quality.
  • FIG. 1 is a perspective view of an exemplary portable computer according to an embodiment of this invention, showing the display unit rotated to the is second position;
  • FIG. 2 is a perspective view of the portable computer of FIG. 1 , depicting the positional relation the display unit has with the support unit when it is rotated to the second position;
  • FIG. 3 is a perspective view of the portable computer of FIG. 1 , showing the display unit rotated to the third position;
  • FIG. 4 is a perspective view of the portable computer of FIG. 1 , depicting the positional relation the display unit has with the support unit while it is rotated to the third position;
  • FIG. 5 is a perspective view of the portable computer of FIG. 1 , representing the positional relation the display unit has with the support unit when it is moved to the third position;
  • FIG. 6 is a side view of the portable computer of FIG. 1 , illustrating the positional relation the display unit has with the support unit when it is moved to the third position;
  • FIG. 7 is a perspective view of the portable computer of FIG. 1 , showing the display unit rotated to the first position;
  • FIG. 8 is a sectional view of the portable computer, illustrating the positional relation between the heat-receiving portion provided in the main unit, the heat-radiating portion provided in the support unit and the circulation path for circulating liquid coolant between the heat-receiving and heat-radiating headers;
  • FIG. 9 is a plan view of an exemplary rotary pump incorporated in the portable computer.
  • FIG. 10 is a sectional view representing the positional relation that the rotary pump and the CPU have in the portable computer;
  • FIG. 11 is a plan view the cooling unit incorporated in the portable computer
  • FIG. 12 is a plan view showing an exemplary cooling unit incorporated in the third housing
  • FIG. 13 is a graph showing a relation between the size of the opening of a discharge port and the amount and pressure in and at which cooling air is applied through discharge port, said opening extending around the axis of rotation of an impeller;
  • FIG. 14 is a sectional view of the reserve tank provided in the portable computer according to the embodiment of this invention.
  • FIGS. 1-7 illustrate a portable computer 1 , or an electronic apparatus according to the present invention.
  • the portable computer 1 comprises a main unit 2 and a display unit 3 .
  • the main unit 2 has a first housing 4 that is shaped like a flat box.
  • the first housing 4 supports a keyboard 5 .
  • the front half of the upper surface of the first housing 4 is a palm rest 6 , on which the user or the computer 1 may place his or her palms while operating the keyboard 5 .
  • the rear edge of the first housing 4 has a coupling seat 7 .
  • the coupling seat 7 extends in the widthwise direction of the first housing 4 and protrudes upwards to a level higher than the upper surface of the first housing 4 and the keyboard 5 .
  • Three hollow projections 8 a, 8 b and 5 c are formed integral with the coupling seat 7 .
  • the first hollow projection 8 a projects upwards from one end of the seat 7 .
  • the second hollow projection 8 b projects upwards from the other end of the seat 7 .
  • the third hollow projection 8 c projects upwards from the middle part of the seat 7 and is located between the first and second hollow projections 8 a and 8 b.
  • the first housing 4 contains a printed circuit board 10 .
  • the printed circuit board 10 has a CPU 11 on its upper surface.
  • the CPU 11 which is a heat-generating component deployed within a BGA-type semiconductor package for example.
  • the CPU 11 Located in the rear part of the first housing 4 , the CPU 11 has a base substrate 12 and an IC chip 13 .
  • the IC chip 13 is mounted on the center part of the base substrate 12 . In general, the amount of heat produced by the CPU 11 is correlated to its operational speed. Therefore, the IC chip 13 should be cooled to maintain operational stability.
  • the display unit 3 is an independent component, separated from the main unit 2 .
  • the display unit 3 comprises a display device (e.g., liquid crystal display panel) 14 and a second housing 15 .
  • the liquid crystal display panel 14 or any other type of display device, has a screen 14 a that displays images.
  • the second housing 15 is shaped like a flat box and has almost the same size as the first housing 4 .
  • the second housing 15 contains the liquid crystal display panel 14 . It has a rectangular opening 16 in its front. Through the opening 16 , the screen 14 a of the liquid crystal display panel 14 is exposed outside the second housing 15 .
  • the second housing 15 has a back plate 17 .
  • the back plate 17 is provided on the back of the liquid crystal display panel 14 .
  • the back plate 17 has a pair of hollow parts 17 a and 17 b. Both hollow parts 17 a and 17 b lie at a level higher than the midpoint of the second housing 15 , They are spaced apart in the widthwise direction of the second housing 15 and project toward the back of the second housing 15 .
  • the portable computer 1 has a support unit 20 .
  • the support unit 20 has a third housing 21 .
  • the third housing 21 is shaped like a flat box, comprising a top wall 21 a, a bottom wall 21 b, left and right side walls 21 c and 21 d, and a pair of end walls 21 e and 21 f.
  • the top wall 21 a and the bottom wall 21 b are opposite of each other.
  • the side walls 21 c and 21 d and the end walls 21 e and 21 f connect the four edges of the top wall 21 a to the corresponding edges of the bottom wall 21 b.
  • the third housing 21 has a smaller width than the first and second housings 4 and 15 .
  • one horizontal edge of the third housing 21 has three recesses 22 a, 22 b and 22 c.
  • the first and second recesses 22 a and 22 b are spaced apart in the widthwise direction of the third housing 21 and aligned with the first and second hollow projections 8 a and 8 b, respectively.
  • the first and second hollow projections 8 a and 8 b protrude into the first and second recesses 22 a and 22 b.
  • the third recess 22 c lies between the first and second recesses 22 a and 22 b, aligned with the third hollow projection 8 c.
  • the third hollow projection 8 c protrudes into the third recess 22 c.
  • a pair of first hinges 23 a and 23 b couple the horizontal edge of the third housing 21 to the coupling seat 7 of the first housing 4 .
  • One of the first hinges, 23 a extends between the first hollow projection Sa of the seat 7 and the third housing 21 .
  • the other first hinge 23 b extends between the second hollow projection 8 b of the seat 7 and the third housing 21 .
  • the first hinges 23 a and 23 b have a common horizontal axis X 1 that extends in the widthwise direction of the first housing 4 .
  • the horizontal edge of the third housing 21 can rotate around the axis X 1 with respect to the coupling seat 7 of the first housing 4 .
  • the other horizontal edge of the third housing 21 has two recesses 25 a and 25 b. These recesses 25 a and 25 b are spaced in the widthwise direction of the third housing 21 and aligned with the hollow projections 17 a and 17 b of the second housing 15 . The hollow projections 17 a and 17 b protrude into the recesses 25 a and 25 b.
  • a pair of second hinges 26 a and 26 b couple the other horizontal edge of the third housing 21 to the back plate 17 of the second housing 15 .
  • One of the second hinges, 26 a extends between the hollow projection 17 a of the second housing 15 and the third housing 21 .
  • the other second hinge 26 b extends between the hollow projection 17 b of the second housing 15 and the third housing 21 .
  • the second hinges 26 a and 26 b have a common horizontal axis X 2 that extends in the widthwise direction of the third housing 21 .
  • the other horizontal edge of the third housing 21 can rotate around the axis X 2 with respect to the back plate 17 of the second housing 15 .
  • the third housing 21 can rotate between a position where it overlaps the back plate 17 of the second housing 15 and a position where it is remote from the back plate 17 .
  • the third housing 21 can be held at these positions, owing to the braking forces of the second hinges 26 a and 26 b.
  • the support unit 20 couples the display unit 3 to the main unit 20 allowing the display unit 3 to rotate independently of the support unit 20 . More specifically, the display unit 3 can rotate between the first and second positions, while overlapping the support unit 20 .
  • FIG. 7 shows the display unit 3 rotated to the first position. As seen from FIG. 7 , the display unit 3 lies on the main unit 2 , covering the keyboard 5 and palm rest 6 from above, as long as it remains at the first position.
  • FIG. 1 shows the display unit 3 rotated to the second position. At the second position, the display unit 3 stands upright at the rear edge of the main unit 2 , exposing the keyboard 5 , palm rest 6 and screen 14 a.
  • the user of the computer 1 may rotate the display unit 3 upwards to any position between the first and second position.
  • the back plate 17 of the second housing 15 moves away from the support unit 20 .
  • the display unit 3 moves to a third position as is illustrated in FIG. 6 .
  • the display unit 3 stands up, more forwards a little than at the second position.
  • the display unit 3 can be moved in a generally lateral direction over the main unit 2 by changing the angle at which the support unit 20 stands.
  • the support unit generally remains in a raised orientation at the back of the display unit 3 when in the second or third positions.
  • the portable computer 1 incorporates a cooling unit 30 that Is designed to cool the CPU 11 with liquid coolant.
  • the cooling unit 30 comprises a rotary pump 31 , a heat-radiating portion 32 , and a circulation path 33 .
  • the rotary pump 31 functions as heat-receiving portion as well, to receiving the heat that the CPU 11 generates while operating.
  • the pump 31 is provided in the first housing 4 and mounted on the upper surface of the printed circuit board 10 .
  • the rotary pump 31 comprises an impeller 34 , a pump housing 35 and a flat motor 36 .
  • the flat motor 36 starts driving the impeller 34 when the power switch on the portable computer 1 is turned on or when the temperature of the CPU 11 rises to a preset thermal threshold value.
  • the pump housing 35 has an inlet port 39 and an outlet port 40
  • the ports 39 and 40 open to the pump chamber 38 and protrude From one of the side walls 37 c toward the back of the first housing 4 .
  • the pump housing 35 has four legs 43 .
  • the legs 43 are provided at the four corners of the pump housing 34 and project downwards from the heat-receiving surface 42 .
  • Screws 44 fasten the legs 43 to the upper surface of the printed circuit board 10 . Since the legs 43 are so fastened to the board 10 , the pump housing 35 overlaps the CPU 11 and the center part of the heat-receiving surface 42 is thermally coupled to the IC chip 13 of the CPU 11 .
  • the third housing 21 of the support unit 20 contains the heat-radiating portion 32 of the cooling unit 30 .
  • the heat-radiating portion 32 comprises an electric fan 50 , first to third heat-radiating blocks 51 a, 51 b and 51 c, and a tube 52 .
  • the electric fan 50 has a fan case 53 and a centrifugal impeller 54 .
  • the fan case 53 is made of material with a high thermal conductivity constant, such as aluminum alloy.
  • the fan case 53 comprises a rectangular main part 55 and a cover 56 .
  • the main part 55 has a side wall 58 and a pair of bosses 59 a and 59 b.
  • the side wall 58 rises from one edge of the main part 55 .
  • the bosses 59 a and 59 b are provided at the opposite edge of the main part 55 .
  • the cover 56 is secured to the side wall 58 and bosses 59 a and 59 b and extends between the top of the side wall 58 and the tops of bosses 59 a and 59 b.
  • the main part 55 supports the impeller 54 , which is interposed between the main part 55 and the cover 56 .
  • a flat motor (not shown) starts driving the impeller 54 when the power switch on the portable computer 1 is turned on or when the temperature of the CPU 11 rises to a preset thermal threshold value.
  • the fan case 53 has two suction ports 61 a and 61 b and first to third discharge ports 62 a, 62 b and 62 c.
  • the suction ports 61 a and 61 b are made, each in the cover 56 and the main part 55 . They oppose each other, across the impeller 54 .
  • the first discharge port 62 a lies between one boss 59 a, on the one hand, and the side wall 58 of the main part 55 , on the other.
  • the second discharge port 62 b lies between the bosses 59 a and 59 b.
  • the third discharge port 62 c lies between the one boss 59 b, on the one hand, and side wall 58 of the main part 55 , on the other.
  • the first discharge port 62 a and the third discharge port 62 c are positioned on opposite sides of the impeller 54
  • the second discharge port 62 b faces the side wall 58 across the impeller 54 .
  • the first to third discharge ports 62 a, 62 b and 62 c surround the periphery of the impeller 54 .
  • the discharge ports 62 a, 62 b and 62 c opens in three directions, each extending in three lines that meet at the axis 01 of rotation of the impeller 54 .
  • the ports 62 a, 62 b and 62 c define an elongate opening that extends around the axis 01 through a larger angle of rotation than in the conventional cooling systems.
  • FIG. 13 illustrates a relation between the size of the opening of a discharge port and the amount and pressure in and at which cooling air is applied through discharge port, said opening extending around the axis of rotation of an impeller.
  • line A shows, the pressure at which the cooling air is applied through the discharge port remains unchanged, regardless of the size of the opening of the port.
  • line B indicates, the amount in which the cooling air is applied through the discharge port increases in proportion to the size of the opening of the port.
  • the electric fan 50 has three discharge ports 62 a, 62 b and 62 c, which are made in the three sides of the fan case 53 .
  • the fan 50 can apply cooling air through the ports 62 a, 62 b and 62 c In a sufficient amount.
  • cooling air may be applied in a sufficient amount and at a sufficient pressure when the ports 62 a to 62 c define an elongate opening extending around the axis 01 of rotation of the impeller 54 through an angle equal to or greater than 190°.
  • the top wall 21 a and bottom wall 21 b of the third housing 21 have intake ports 63 a and 63 h, respectively.
  • the intake ports 63 a and 63 b oppose the suction ports 61 a and 61 b of the fan case 53 and have a larger opening than the suction ports 61 a and 61 b.
  • Two mesh guards 64 cover the intake ports 63 a and 63 b, respectively, to prevent foreign matter, such as clips, from entering the intake ports 63 a and 63 b.
  • the first and third discharge ports 62 a and 62 c of the fan case 53 oppose the side walls 21 c and 21 d of the third housing 21 , respectively.
  • the second discharge port 62 b of the fan case 53 opposes the end wall 21 e of the third housing 21 .
  • the side walls 21 c and 21 d of the third housing 21 have a plurality of exhaust ports 65 .
  • the exhaust ports 65 are arranged in a row, each spaced apart from another, and located at the back of the display unit 3 .
  • the first to third heat-radiating blocks 51 a, 51 b and 51 c are provided, respectively, in the first to third discharge ports 62 a, 62 b and 62 c of the fan case 53 .
  • the blocks 51 a, 51 b and 51 c have heat-radiating fins 67 each.
  • the fins 67 are shaped like a flat plate.
  • the fins 67 are made of metal that excels in thermal conductivity, such as aluminum alloy.
  • the heat-radiating fins 67 are arranged are spaced apart, extending parallel to one another.
  • the fins 67 are secured to the rims of the first to third discharge ports 62 a, 62 b and 62 c of the fan case 53 .
  • the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c oppose the exhaust ports 65 of the third housing 21 .
  • the first to third heat-radiating blocks 51 a, 51 b and 51 c are arranged, surrounding the impeller 54 of the electric fan 50 at three sides of the fan case 53 .
  • the cooling air discharged through the first to third discharge ports 62 a, 62 b and 62 c flows, passing through the gaps between the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c.
  • the circulation path 33 of the cooling unit 30 have two connection tubes 71 a and 71 b.
  • the first connection tube 71 a connects the outlet port 40 of the rotary pump 31 and the coolant inlet port 68 of the heat-radiating portion 32 .
  • the first connection tube 71 a first extends from the rotary pump 31 to the third hollow projection 8 c of the first housing 4 , then passes through the junction between the projection 8 c and the third housing 21 , and further extends into the coolant inlet port 68 of the heat-radiating portion 32 .
  • the second connection tube 71 b connects the inlet port 39 of the rotary pump 31 and the coolant outlet port 69 of the heat-radiating portion 32 .
  • the second connection tube 71 b first extends from the rotary pump 31 to the third hollow projection 8 c of the first housing 4 , then passes through the junction between the projection 8 c and the third housing 21 , and finally extends into the coolant outlet port 69 of the heat-radiating portion 32 .
  • the first and second connection tubes 71 a and 71 b are flexible, both made of rubber or synthetic resin. Therefore, they can deform to absorb the twisting of the circulation path 33 , which takes place when the positional relation between the rotary pump 31 and the heat-radiating portion 32 changes as the third housing 21 is rotated.
  • the liquid coolant fills the pump chamber 38 of the rotary pump 31 , the tube 52 of the heat-radiating portion 32 , and the circulation path 33 .
  • the liquid coolant is, for example, an antifreeze liquid prepared by adding ethylene glycol solution and, if necessary, corrosion inhibitor to water.
  • the liquid coolant absorbs heat from the IC chip 13 as it flows in the pump chamber 38 of the rotary pump 31 .
  • the liquid coolant acts as a medium that transfers the heat of the IC chip 13 to the heat-radiating portion 32 in the present embodiment.
  • the tube 52 of the heat-radiating portion 32 is composed of an upstream tube 73 a and a downstream tube 73 b.
  • the upstream tube 73 a comprises the coolant inlet port 68 at one end and an outlet port 74 at the other end.
  • the upstream tube 73 a is bent in the form of L, passing through the heat-radiating fins 67 of the first heat-radiating block 51 a and through the heat-radiating fins 67 of the second heat-radiating block 51 b.
  • the downstream tube 73 b comprises the coolant outlet port 69 at one end and an inlet port 75 at the other end.
  • the downstream tube 73 b extends substantially straight, passing through the heat-radiating fins 67 of the third heat-radiating block 51 c.
  • a reserve tank 80 is provided between the upstream tube 73 a and the downstream tube 73 b, to temporarily contain the liquid coolant.
  • the reserve tank 80 is incorporated in the third housing 21 and located between the second heat-radiating block 51 b of the heat-radiating portion 32 and the end wall 21 f of the third housing 21 .
  • the tank 80 is rectangular shaped like a flat box, generally extending in the widthwise direction of the third housing 21 .
  • the reserve tank 80 is secured to the bottom wall 21 b of the third housing 21 or the heat-radiating portion 32 .
  • the outlet port 74 of the upstream tube 73 a and the inlet port 75 of the downstream tube 73 b open to the interior of the reserve tank 80 .
  • the liquid coolant contained in the reserve tank 80 can flow into the inlet port 75 of the downstream tube 73 b.
  • the inlet port 75 of the downstream tube 73 b is positioned at the center part of the reserve tank 80 .
  • the inlet port 75 of the downstream tube 73 b is located near the intersection P of two diagonals G 1 and G 2 , each connecting the opposite corners of the tank 80 .
  • the inlet port 75 therefore lies below the surface level L of the liquid coolant stored in the reserve tank 80 and remains immersed in the liquid coolant.
  • the liquid crystal display panel 14 provided in the second housing 15 is electrically connected by a cable 83 to the printed circuit board 10 incorporated in the first housing 4 .
  • the cable 83 extends from the liquid crystal display panel 14 , passes through the junction between the hollow projection 17 a of the second housing 15 and the recess 25 a of the third housing 21 , and extends into the third housing 21 .
  • the cable 83 passes between the first heat-radiating block 51 a and side wall 21 c and extends into the first housing 4 through the junction between the first recess 22 a of the third housing 21 and the first hollow projection 8 a of the first housing 4 .
  • IC chip 13 of the CPU 11 generates heat while the portable computer 1 is being used.
  • the heat that the IC chip 13 generates is transmitted to the pump housing 35 because the IC chip 13 is thermally connected to the heat-receiving surface 42 of the pump housing 35 .
  • the pump housing 35 has the pump chamber 38 , which is filled with the liquid coolant. The liquid coolant absorbs most of the heat provided to the pump housing 35 from the IC chip 13 .
  • the liquid coolant When the impeller 34 of the rotary pump 31 rotates, the liquid coolant is forced from the pump chamber 38 through the outlet port 40 . The coolant flows into the heat-radiating portion 32 through the first connection tube 71 a. Thus, the liquid coolant circulates between the pump chamber 38 and the heat-radiating portion 32 .
  • the liquid coolant heated by virtue of the heat exchange in the pump chamber 38 is supplied to the upstream tube 73 a of the heat-radiating portion 32 .
  • the liquid coolant flows through the upstream tube 73 a.
  • the coolant heated further flows from the outlet port 74 of the upstream tube 73 a into the reserve tank 80 .
  • the liquid coolant flowing through the upstream tube 73 a may contain bubbles. In this case, the bubbles are removed from the coolant in the reserve tank 80 .
  • the liquid coolant that is temporarily stored in the reserve tank 80 is drawn into the inlet port 75 of the downstream tube 73 b.
  • the liquid coolant then flows from the downstream tube 73 b into the second connection tube 71 b.
  • the upstream tube 73 a and downstream tube 73 b, in which the liquid coolant flows, are thermally connected to the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c.
  • the heat of the IC chip 13 absorbed in the liquid coolant, is therefore transmitted to the heat-radiating fins 67 as the liquid coolant flows through the upstream tube 73 a and downstream tube 73 b.
  • the first to third heat-radiating blocks 51 a, 51 b and 51 c are located at the three discharge ports 62 a, 62 b and 62 c of the electric fan 50 , respectively, and surround the impeller 54 at three sides of the fan case 53 .
  • the cooling air discharged via the discharge ports 62 a, 62 b and 62 c passes between the heat-radiating fins 67 .
  • the cooling air is then applied to the first and second tubes 73 a and 71 b. As a result, the cooling air takes away the heat transmitted from the IC chip 13 to the heat-radiating fins 67 and the first and second tubes 73 a and 73 b.
  • the liquid coolant is cooled because of the heat exchange performed in the heat-radiating portion 32 .
  • the coolant thus cooled flows back into the pump chamber 38 of the rotary pump 31 through the second connection tube 71 b.
  • the coolant repeats absorption of the heat of the IC chip 13 . It is then supplied to the heat-radiating portion 32 .
  • the liquid coolant transfers the heat of the IC chip 13 to the heat-radiating portion 32 .
  • the heat is released outside the portable computer 1 , from the heat-radiating portion 32 .
  • the heat-radiating portion 32 is provided in the support unit 20 coupling the display unit 3 to the main unit 2 . Namely, the heat-radiating portion 32 is remote from the main unit 2 and the display unit 3 . Therefore, the heat released from the heat-radiating portion 32 does not accumulate in either the first housing 4 of the main unit 2 or the second housing 15 of the display unit 2 . This controls the increase in the temperature in the first housing 4 and second housing 15 .
  • the printed circuit board 10 and liquid crystal display panel 14 which are provided in the first and second housing 4 and 15 , respectively, experience minor thermal influences.
  • the printed circuit board 10 can be prevented from being deformed, and the liquid crystal display panel 14 is prevented from being degraded in performance.
  • the third housing 21 having the heat-radiating portion 32 gradually inclines as it is moved forward from the rear edge of the first housing 4 after the display unit 3 has been rotated to the third position.
  • the back plate 17 of the second housing 15 moves away from the bottom wall 21 b of the third housing 21 , opening the intake port 63 b ( FIG. 12 ) made in the bottom plate 21 b.
  • Both intake ports 63 a and 63 b of the third housing 21 are thereby exposed. Air can therefore flow into the electric fan 50 through the intake ports 63 a and 63 b.
  • the first to third heat-radiating blocks 51 a, 51 b and 51 c can therefore be cooled with the cooling air at high efficiency.
  • the third housing 21 of the support unit 20 solely supports the display unit 2 .
  • a greater part of the third housing 21 provides a space for accommodating the cooling unit 30 . Therefore, the electric fan 50 can be a large one that excels in air-supplying ability, and first to third heat-radiating blocks 51 a, 51 b and 51 c can be large enough to increase the heat-radiating area of each fin 67 ( FIG. 8 ). This can enhance the efficiency of cooling the CPU 11 and ultimately achieves more reliable cooling of the CPU 11 .
  • a heat-receiving portion may be provided, independently of the rotary pump, though the rotary pump 31 functions as heat-receiving portion as well in the above-described embodiment.
  • the medium for transferring heat is not limited to a liquid that circulates between the heat-receiving portion and the heat-radiating portion.
  • at least one heat pipe may transfer the heat of the heat-generating component directly to the heat-radiating portion.

Abstract

An electronic apparatus includes a main unit, display unit and support unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The display unit is separated from the main unit. The support unit is coupled to the main unit and display unit. The support unit includes a heat-radiating portion to cool a liquid coolant, and a reserve tank to temporarily store the liquid coolant. The liquid coolant absorbs heat produced by the heat-generating component and transferred by the heat-receiving portion. The liquid coolant is circulated between the heat-receiving portion and the heat-radiating portion.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2003-147805, filed May 26, 2003, the entire contents of which are incorporated herein by reference.
  • BACKGROUND
  • 1. Field
  • The present invention relates to an electronic apparatus having heat-generating components such as a semiconductor package and a chip set. Particularly, the invention relates to a structure that cools heat-generating components.
  • 2. Description of the Related Art
  • A CPU is incorporated in, for example, notebook-type portable computers. The heat that the CPU generates while operating increases as its data-processing speed rises or as it performs more and more functions. The higher the temperature of the CPU, the less efficiently it operates. To cool the CPU, so-called “cooling system of liquid cooling type” have been developed in recent years. The cooling system uses a liquid coolant having a larger thermal conductivity constant than air.
  • Jpn. Pat. Appln. KOKAI Publication No. 7-142886 discloses a cooling system of liquid cooling type, configured for use in portable computers that comprises a main unit and a display unit. The cooling system comprises a heat-receiving header, heat-radiating header, and two tubes. The heat-receiving header is provided in the main unit and thermally connected to the CPU incorporated in the main unit. The heat-radiating header is provided in the display unit or in the main unit along with the heat-receiving header. If the heat-radiating header is provided in the display unit, the heat-radiating header lies adjacent to the display device incorporated in the display unit. Both tubes extend from the main unit to the display unit to circulate the liquid coolant between the heat-receiving header and the heat-radiating header.
  • In this cooling system, the liquid coolant absorbs the heat of the CPU in the heat-receiving header. In other words, the liquid coolant is heated in the heat-receiving header. The heated liquid coolant is supplied to the heat-radiating header via the first tube. As the coolant passes through the heat-radiating header, it releases the heat of the CPU. That is, the liquid coolant is cooled in the heat-radiating header. The cooled coolant is supplied back to the heat-receiving header via the second tube and absorbs the heat of the CPU. As the liquid coolant circulates, heat is transferred from the CPU to the heat-radiating header, which radiates the heat. Thus, the heat is released from the display unit or the main unit.
  • If the heat-radiating header that radiates the heat of the CPU is provided in the display unit, the heat-radiating header is adjacent to the display device incorporated in the display unit. The heat emanating from the heat-radiating header inevitably heats the display device. Consequently, the temperature of the display device may rise above the maximum use temperature. If this happens, the images that display device displays will be degraded in quality.
  • The heat-radiating header may be provided in the main unit. If this is the case, the heat emanating from the heat-radiating header accumulates in the main unit. When the temperature in the main unit rises, the circuit components and the disk drive, which are provided in the main unit, will be heated to high temperatures. The temperature of the circuit components, for example, may rise above their maximum thermal threshold. If this occurs, the circuit components may be degraded in performance or may undergo thermal breakdown.
  • U.S. Pat. No. 6,519,147 discloses a liquid-cooling system for use in portable computers having a body part and a display part. The cooling system comprises a heat-receiving head and a tube. The heat-receiving head is incorporated in the body part of the computer and connected to heat-generating components such as a CPU and a chip set. The tube is filled with liquid coolant and connected to the heat-receiving head. The tube extending between the body part and the display part.
  • The display part has a liquid crystal display panel and a housing containing the panel. The tube extends into the housing and lies in the gap between the liquid crystal display panel and the back of the housing. The tube meanders on the back of the housing, thus contacting the housing.
  • In this liquid-cooling system, the liquid coolant is heated as heat exchange is performed in the heat-receiving head. The liquid coolant heated flows in the tube toward the display part. As the liquid coolant flows through the tube, it transmits the heat of the heat-generating components to the housing. Therefore, the heat diffuses in the housing and is radiated from the entire back of the housing.
  • In the cooling systems, the liquid coolant heated in the heat-receiving header is led into the tube, raising the surface temperature of the tube. The tube is made of material having high heat-radiating property because it transmits the heat of the liquid coolant to the housing. The liquid crystal panel is liable to the heat emanating from the tube. When the panel is heated to high temperatures, the liquid crystal molecules cannot be oriented as is desired. In consequence, the images that the liquid crystal panel displays will be degraded in quality.
  • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
  • The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate presently preferred embodiments of the invention, and together with the general description given above and the detailed description of the preferred embodiments given below, serve to explain the principles of the invention.
  • FIG. 1 is a perspective view of an exemplary portable computer according to an embodiment of this invention, showing the display unit rotated to the is second position;
  • FIG. 2 is a perspective view of the portable computer of FIG. 1, depicting the positional relation the display unit has with the support unit when it is rotated to the second position;
  • FIG. 3 is a perspective view of the portable computer of FIG. 1, showing the display unit rotated to the third position;
  • FIG. 4 is a perspective view of the portable computer of FIG. 1, depicting the positional relation the display unit has with the support unit while it is rotated to the third position;
  • FIG. 5 is a perspective view of the portable computer of FIG. 1, representing the positional relation the display unit has with the support unit when it is moved to the third position;
  • FIG. 6 is a side view of the portable computer of FIG. 1, illustrating the positional relation the display unit has with the support unit when it is moved to the third position;
  • FIG. 7 is a perspective view of the portable computer of FIG. 1, showing the display unit rotated to the first position;
  • FIG. 8 is a sectional view of the portable computer, illustrating the positional relation between the heat-receiving portion provided in the main unit, the heat-radiating portion provided in the support unit and the circulation path for circulating liquid coolant between the heat-receiving and heat-radiating headers;
  • FIG. 9 is a plan view of an exemplary rotary pump incorporated in the portable computer;
  • FIG. 10 is a sectional view representing the positional relation that the rotary pump and the CPU have in the portable computer;
  • FIG. 11 is a plan view the cooling unit incorporated in the portable computer;
  • FIG. 12 is a plan view showing an exemplary cooling unit incorporated in the third housing;
  • FIG. 13 is a graph showing a relation between the size of the opening of a discharge port and the amount and pressure in and at which cooling air is applied through discharge port, said opening extending around the axis of rotation of an impeller; and
  • FIG. 14 is a sectional view of the reserve tank provided in the portable computer according to the embodiment of this invention.
  • DETAILED DESCRIPTION
  • An embodiment of this invention will be described, with reference to FIGS. 1 to 14.
  • FIGS. 1-7 illustrate a portable computer 1, or an electronic apparatus according to the present invention. The portable computer 1 comprises a main unit 2 and a display unit 3. The main unit 2 has a first housing 4 that is shaped like a flat box. The first housing 4 supports a keyboard 5. The front half of the upper surface of the first housing 4 is a palm rest 6, on which the user or the computer 1 may place his or her palms while operating the keyboard 5.
  • The rear edge of the first housing 4 has a coupling seat 7. The coupling seat 7 extends in the widthwise direction of the first housing 4 and protrudes upwards to a level higher than the upper surface of the first housing 4 and the keyboard 5. Three hollow projections 8 a, 8 b and 5 c are formed integral with the coupling seat 7. The first hollow projection 8 a projects upwards from one end of the seat 7. The second hollow projection 8 b projects upwards from the other end of the seat 7. The third hollow projection 8 c projects upwards from the middle part of the seat 7 and is located between the first and second hollow projections 8 a and 8 b.
  • As illustrated in FIGS. 1, 6 and 8, the first housing 4 contains a printed circuit board 10. The printed circuit board 10 has a CPU 11 on its upper surface. The CPU 11, which is a heat-generating component deployed within a BGA-type semiconductor package for example. Located in the rear part of the first housing 4, the CPU 11 has a base substrate 12 and an IC chip 13. The IC chip 13 is mounted on the center part of the base substrate 12. In general, the amount of heat produced by the CPU 11 is correlated to its operational speed. Therefore, the IC chip 13 should be cooled to maintain operational stability.
  • The display unit 3 is an independent component, separated from the main unit 2. The display unit 3 comprises a display device (e.g., liquid crystal display panel) 14 and a second housing 15. The liquid crystal display panel 14, or any other type of display device, has a screen 14 a that displays images. The second housing 15 is shaped like a flat box and has almost the same size as the first housing 4. The second housing 15 contains the liquid crystal display panel 14. It has a rectangular opening 16 in its front. Through the opening 16, the screen 14 a of the liquid crystal display panel 14 is exposed outside the second housing 15.
  • As FIGS. 2 and 6 depicts, the second housing 15 has a back plate 17. The back plate 17 is provided on the back of the liquid crystal display panel 14. As FIG. 8 shows, the back plate 17 has a pair of hollow parts 17 a and 17 b. Both hollow parts 17 a and 17 b lie at a level higher than the midpoint of the second housing 15, They are spaced apart in the widthwise direction of the second housing 15 and project toward the back of the second housing 15.
  • As is illustrated in FIGS. 4 to 8, the portable computer 1 has a support unit 20. The support unit 20 has a third housing 21. The third housing 21 is shaped like a flat box, comprising a top wall 21 a, a bottom wall 21 b, left and right side walls 21 c and 21 d, and a pair of end walls 21 e and 21 f. The top wall 21 a and the bottom wall 21 b are opposite of each other. The side walls 21 c and 21 d and the end walls 21 e and 21 f connect the four edges of the top wall 21 a to the corresponding edges of the bottom wall 21 b. The third housing 21 has a smaller width than the first and second housings 4 and 15.
  • As seen from FIGS. 7 and 8, one horizontal edge of the third housing 21 has three recesses 22 a, 22 b and 22 c. The first and second recesses 22 a and 22 b are spaced apart in the widthwise direction of the third housing 21 and aligned with the first and second hollow projections 8 a and 8 b, respectively. The first and second hollow projections 8 a and 8 b protrude into the first and second recesses 22 a and 22 b. The third recess 22 c lies between the first and second recesses 22 a and 22 b, aligned with the third hollow projection 8 c. The third hollow projection 8 c protrudes into the third recess 22 c.
  • A pair of first hinges 23 a and 23 b couple the horizontal edge of the third housing 21 to the coupling seat 7 of the first housing 4. One of the first hinges, 23 a, extends between the first hollow projection Sa of the seat 7 and the third housing 21. The other first hinge 23 b extends between the second hollow projection 8 b of the seat 7 and the third housing 21. The first hinges 23 a and 23 b have a common horizontal axis X1 that extends in the widthwise direction of the first housing 4. The horizontal edge of the third housing 21 can rotate around the axis X1 with respect to the coupling seat 7 of the first housing 4.
  • As FIG. 8 shows, the other horizontal edge of the third housing 21 has two recesses 25 a and 25 b. These recesses 25 a and 25 b are spaced in the widthwise direction of the third housing 21 and aligned with the hollow projections 17 a and 17 b of the second housing 15. The hollow projections 17 a and 17 b protrude into the recesses 25 a and 25 b.
  • A pair of second hinges 26 a and 26 b couple the other horizontal edge of the third housing 21 to the back plate 17 of the second housing 15. One of the second hinges, 26 a, extends between the hollow projection 17 a of the second housing 15 and the third housing 21. The other second hinge 26 b extends between the hollow projection 17 b of the second housing 15 and the third housing 21. The second hinges 26 a and 26 b have a common horizontal axis X2 that extends in the widthwise direction of the third housing 21. The other horizontal edge of the third housing 21 can rotate around the axis X2 with respect to the back plate 17 of the second housing 15.
  • That is, the third housing 21 can rotate between a position where it overlaps the back plate 17 of the second housing 15 and a position where it is remote from the back plate 17. The third housing 21 can be held at these positions, owing to the braking forces of the second hinges 26 a and 26 b.
  • Thus, the support unit 20 couples the display unit 3 to the main unit 20 allowing the display unit 3 to rotate independently of the support unit 20. More specifically, the display unit 3 can rotate between the first and second positions, while overlapping the support unit 20. FIG. 7 shows the display unit 3 rotated to the first position. As seen from FIG. 7, the display unit 3 lies on the main unit 2, covering the keyboard 5 and palm rest 6 from above, as long as it remains at the first position. FIG. 1 shows the display unit 3 rotated to the second position. At the second position, the display unit 3 stands upright at the rear edge of the main unit 2, exposing the keyboard 5, palm rest 6 and screen 14 a.
  • The user of the computer 1 may rotate the display unit 3 upwards to any position between the first and second position. In this case, the back plate 17 of the second housing 15 moves away from the support unit 20. As a result, the display unit 3 moves to a third position as is illustrated in FIG. 6. At the third position, the display unit 3 stands up, more forwards a little than at the second position. Thus, the display unit 3 can be moved in a generally lateral direction over the main unit 2 by changing the angle at which the support unit 20 stands. The support unit generally remains in a raised orientation at the back of the display unit 3 when in the second or third positions. Once the display unit 3 has reached the third position, the housing of the support unit 20, i.e., third housing 21, gradually inclines upwards as it moves forward from the rear edge of the first housing 4.
  • As is depicted in FIGS. 4 and 8, the portable computer 1 incorporates a cooling unit 30 that Is designed to cool the CPU 11 with liquid coolant. The cooling unit 30 comprises a rotary pump 31, a heat-radiating portion 32, and a circulation path 33.
  • The rotary pump 31 functions as heat-receiving portion as well, to receiving the heat that the CPU 11 generates while operating. The pump 31 is provided in the first housing 4 and mounted on the upper surface of the printed circuit board 10. As FIG. 10 shows, the rotary pump 31 comprises an impeller 34, a pump housing 35 and a flat motor 36. The flat motor 36 starts driving the impeller 34 when the power switch on the portable computer 1 is turned on or when the temperature of the CPU 11 rises to a preset thermal threshold value.
  • The pump housing 35 contains the impeller 34. The pump housing 35 is shaped like a flat box and larger than the CPU 11. It is made of material excelling in thermal conductivity, such as aluminum alloy. The pump housing 35 has a bottom wall 37 a, a top wall 37 b, and four side walls 37 c. The wails 37 a, 37 b and 37 c define a pump chamber 38, in which the impeller 34 is located. The lower surface of the bottom wall 37 a of the pump housing 35 is flat, serving as heat-receiving surface 42. The heat-receiving surface 42 is large, covering the CPU 11 from above.
  • As illustrated in FIG. 9, the pump housing 35 has an inlet port 39 and an outlet port 40 The ports 39 and 40 open to the pump chamber 38 and protrude From one of the side walls 37 c toward the back of the first housing 4.
  • The pump housing 35 has four legs 43. The legs 43 are provided at the four corners of the pump housing 34 and project downwards from the heat-receiving surface 42. Screws 44 fasten the legs 43 to the upper surface of the printed circuit board 10. Since the legs 43 are so fastened to the board 10, the pump housing 35 overlaps the CPU 11 and the center part of the heat-receiving surface 42 is thermally coupled to the IC chip 13 of the CPU 11.
  • The third housing 21 of the support unit 20 contains the heat-radiating portion 32 of the cooling unit 30. As FIGS. 8, 11 and 12 shows, the heat-radiating portion 32 comprises an electric fan 50, first to third heat-radiating blocks 51 a, 51 b and 51 c, and a tube 52.
  • The electric fan 50 has a fan case 53 and a centrifugal impeller 54. The fan case 53 is made of material with a high thermal conductivity constant, such as aluminum alloy. The fan case 53 comprises a rectangular main part 55 and a cover 56. The main part 55 has a side wall 58 and a pair of bosses 59 a and 59 b. The side wall 58 rises from one edge of the main part 55. The bosses 59 a and 59 b are provided at the opposite edge of the main part 55. The cover 56 is secured to the side wall 58 and bosses 59 a and 59 b and extends between the top of the side wall 58 and the tops of bosses 59 a and 59 b.
  • The main part 55 supports the impeller 54, which is interposed between the main part 55 and the cover 56. A flat motor (not shown) starts driving the impeller 54 when the power switch on the portable computer 1 is turned on or when the temperature of the CPU 11 rises to a preset thermal threshold value.
  • The fan case 53 has two suction ports 61 a and 61 b and first to third discharge ports 62 a, 62 b and 62 c. The suction ports 61 a and 61 b are made, each in the cover 56 and the main part 55. They oppose each other, across the impeller 54.
  • As seen from FIG. 8, the first discharge port 62 a lies between one boss 59 a, on the one hand, and the side wall 58 of the main part 55, on the other. The second discharge port 62 b lies between the bosses 59 a and 59 b. The third discharge port 62 c lies between the one boss 59 b, on the one hand, and side wall 58 of the main part 55, on the other. Stated in another way, the first discharge port 62 a and the third discharge port 62 c are positioned on opposite sides of the impeller 54, and the second discharge port 62 b faces the side wall 58 across the impeller 54.
  • Made in three sides of the fan case 53, the first to third discharge ports 62 a, 62 b and 62 c surround the periphery of the impeller 54. Hence, the discharge ports 62 a, 62 b and 62 c opens in three directions, each extending in three lines that meet at the axis 01 of rotation of the impeller 54. Thus, the ports 62 a, 62 b and 62 c define an elongate opening that extends around the axis 01 through a larger angle of rotation than in the conventional cooling systems.
  • When the impeller 54 is driven, air flows into the fan case 53 through the suction ports 61 a and 61 b. In the fan case 53, the air flows to the center part of the impeller 54 and further flows from the periphery of the impeller 54. Finally, the air is expelled from the fan case 53 through the first to third discharge ports 62 a, 62 b and 62 c. Therefore, the cooling air is applied in three directions from the fan case 53 of the electric fan 50.
  • FIG. 13 illustrates a relation between the size of the opening of a discharge port and the amount and pressure in and at which cooling air is applied through discharge port, said opening extending around the axis of rotation of an impeller. As line A shows, the pressure at which the cooling air is applied through the discharge port remains unchanged, regardless of the size of the opening of the port. As line B indicates, the amount in which the cooling air is applied through the discharge port increases in proportion to the size of the opening of the port.
  • As specified above and shown in FIG. 8, the electric fan 50 has three discharge ports 62 a, 62 b and 62 c, which are made in the three sides of the fan case 53. Hence, the fan 50 can apply cooling air through the ports 62 a, 62 b and 62 c In a sufficient amount. For instance, cooling air may be applied in a sufficient amount and at a sufficient pressure when the ports 62 a to 62 c define an elongate opening extending around the axis 01 of rotation of the impeller 54 through an angle equal to or greater than 190°.
  • As shown in FIGS. 8 and 12, screws fasten the fan case 53 of the electric fan 50 to the bottom wall 21 b of the third housing 21. The top wall 21 a and bottom wall 21 b of the third housing 21 have intake ports 63 a and 63h, respectively. The intake ports 63 a and 63 b oppose the suction ports 61 a and 61 b of the fan case 53 and have a larger opening than the suction ports 61 a and 61 b. Two mesh guards 64 cover the intake ports 63 a and 63 b, respectively, to prevent foreign matter, such as clips, from entering the intake ports 63 a and 63 b.
  • As illustrated in detail in FIG. 8, the first and third discharge ports 62 a and 62 c of the fan case 53 oppose the side walls 21 c and 21 d of the third housing 21, respectively. The second discharge port 62 b of the fan case 53 opposes the end wall 21e of the third housing 21. The side walls 21 c and 21 d of the third housing 21 have a plurality of exhaust ports 65. The exhaust ports 65 are arranged in a row, each spaced apart from another, and located at the back of the display unit 3.
  • The first to third heat-radiating blocks 51 a, 51 b and 51 c are provided, respectively, in the first to third discharge ports 62 a, 62 b and 62 c of the fan case 53. The blocks 51 a, 51 b and 51 c have heat-radiating fins 67 each. The fins 67 are shaped like a flat plate. The fins 67 are made of metal that excels in thermal conductivity, such as aluminum alloy. The heat-radiating fins 67 are arranged are spaced apart, extending parallel to one another. The fins 67 are secured to the rims of the first to third discharge ports 62 a, 62 b and 62 c of the fan case 53. The heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c oppose the exhaust ports 65 of the third housing 21.
  • The first to third heat-radiating blocks 51 a, 51 b and 51 c are arranged, surrounding the impeller 54 of the electric fan 50 at three sides of the fan case 53. The cooling air discharged through the first to third discharge ports 62 a, 62 b and 62 c flows, passing through the gaps between the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c.
  • The tube 52 of the heat-radiating portion 32 is made of metal that excels in thermal conductivity, such as aluminum alloy. As seen from FIGS. 8 and 11, the tube 52 extends through the center parts of the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c and is thermally connected to the heat-radiating fins 67. The tube 52 has a coolant inlet port 68 and a coolant outlet port 69. The ports 68 and 69 are located near the junction between the first housing 4 and the third housing 21.
  • As FIGS. 8-12 depict, the circulation path 33 of the cooling unit 30 have two connection tubes 71 a and 71 b. The first connection tube 71 a connects the outlet port 40 of the rotary pump 31 and the coolant inlet port 68 of the heat-radiating portion 32. The first connection tube 71 a first extends from the rotary pump 31 to the third hollow projection 8 c of the first housing 4, then passes through the junction between the projection 8 c and the third housing 21, and further extends into the coolant inlet port 68 of the heat-radiating portion 32.
  • The second connection tube 71 b connects the inlet port 39 of the rotary pump 31 and the coolant outlet port 69 of the heat-radiating portion 32. The second connection tube 71 b first extends from the rotary pump 31 to the third hollow projection 8 c of the first housing 4, then passes through the junction between the projection 8 c and the third housing 21, and finally extends into the coolant outlet port 69 of the heat-radiating portion 32.
  • The first and second connection tubes 71 a and 71 b are flexible, both made of rubber or synthetic resin. Therefore, they can deform to absorb the twisting of the circulation path 33, which takes place when the positional relation between the rotary pump 31 and the heat-radiating portion 32 changes as the third housing 21 is rotated.
  • The liquid coolant fills the pump chamber 38 of the rotary pump 31, the tube 52 of the heat-radiating portion 32, and the circulation path 33. The liquid coolant is, for example, an antifreeze liquid prepared by adding ethylene glycol solution and, if necessary, corrosion inhibitor to water. The liquid coolant absorbs heat from the IC chip 13 as it flows in the pump chamber 38 of the rotary pump 31. Thus, the liquid coolant acts as a medium that transfers the heat of the IC chip 13 to the heat-radiating portion 32 in the present embodiment.
  • As illustrated in FIGS. 8 and 11, the tube 52 of the heat-radiating portion 32 is composed of an upstream tube 73 a and a downstream tube 73 b. The upstream tube 73 a comprises the coolant inlet port 68 at one end and an outlet port 74 at the other end. The upstream tube 73 a is bent in the form of L, passing through the heat-radiating fins 67 of the first heat-radiating block 51 a and through the heat-radiating fins 67 of the second heat-radiating block 51 b. The downstream tube 73 b comprises the coolant outlet port 69 at one end and an inlet port 75 at the other end. The downstream tube 73 b extends substantially straight, passing through the heat-radiating fins 67 of the third heat-radiating block 51 c.
  • A reserve tank 80 is provided between the upstream tube 73 a and the downstream tube 73 b, to temporarily contain the liquid coolant. The reserve tank 80 is incorporated in the third housing 21 and located between the second heat-radiating block 51 b of the heat-radiating portion 32 and the end wall 21 f of the third housing 21. According to one embodiment, the tank 80 is rectangular shaped like a flat box, generally extending in the widthwise direction of the third housing 21. The reserve tank 80 is secured to the bottom wall 21 b of the third housing 21 or the heat-radiating portion 32.
  • The outlet port 74 of the upstream tube 73 a and the inlet port 75 of the downstream tube 73 b open to the interior of the reserve tank 80. Thus, the liquid coolant contained in the reserve tank 80 can flow into the inlet port 75 of the downstream tube 73 b. The inlet port 75 of the downstream tube 73 b is positioned at the center part of the reserve tank 80. Hence, as shown in FIG. 14, the inlet port 75 of the downstream tube 73 b is located near the intersection P of two diagonals G1 and G2, each connecting the opposite corners of the tank 80. The inlet port 75 therefore lies below the surface level L of the liquid coolant stored in the reserve tank 80 and remains immersed in the liquid coolant.
  • As FIG. 8 shows, the liquid crystal display panel 14 provided in the second housing 15 is electrically connected by a cable 83 to the printed circuit board 10 incorporated in the first housing 4. The cable 83 extends from the liquid crystal display panel 14, passes through the junction between the hollow projection 17 a of the second housing 15 and the recess 25 a of the third housing 21, and extends into the third housing 21. In the third housing 21, the cable 83 passes between the first heat-radiating block 51 a and side wall 21 c and extends into the first housing 4 through the junction between the first recess 22 a of the third housing 21 and the first hollow projection 8 a of the first housing 4.
  • In summary, as shown in FIGS. 8-12, IC chip 13 of the CPU 11 generates heat while the portable computer 1 is being used. The heat that the IC chip 13 generates is transmitted to the pump housing 35 because the IC chip 13 is thermally connected to the heat-receiving surface 42 of the pump housing 35. The pump housing 35 has the pump chamber 38, which is filled with the liquid coolant. The liquid coolant absorbs most of the heat provided to the pump housing 35 from the IC chip 13.
  • When the impeller 34 of the rotary pump 31 rotates, the liquid coolant is forced from the pump chamber 38 through the outlet port 40. The coolant flows into the heat-radiating portion 32 through the first connection tube 71 a. Thus, the liquid coolant circulates between the pump chamber 38 and the heat-radiating portion 32.
  • More specifically, the liquid coolant heated by virtue of the heat exchange in the pump chamber 38 is supplied to the upstream tube 73 a of the heat-radiating portion 32. The liquid coolant flows through the upstream tube 73 a. The coolant heated further flows from the outlet port 74 of the upstream tube 73 a into the reserve tank 80. The liquid coolant flowing through the upstream tube 73 a may contain bubbles. In this case, the bubbles are removed from the coolant in the reserve tank 80. The liquid coolant that is temporarily stored in the reserve tank 80 is drawn into the inlet port 75 of the downstream tube 73 b. The liquid coolant then flows from the downstream tube 73 b into the second connection tube 71 b.
  • The upstream tube 73 a and downstream tube 73 b, in which the liquid coolant flows, are thermally connected to the heat-radiating fins 67 of the first to third heat-radiating blocks 51 a, 51 b and 51 c. The heat of the IC chip 13, absorbed in the liquid coolant, is therefore transmitted to the heat-radiating fins 67 as the liquid coolant flows through the upstream tube 73 a and downstream tube 73 b.
  • The first to third heat-radiating blocks 51 a, 51 b and 51 c are located at the three discharge ports 62 a, 62 b and 62 c of the electric fan 50, respectively, and surround the impeller 54 at three sides of the fan case 53. When the impeller 54 rotates, the cooling air discharged via the discharge ports 62 a, 62 b and 62 c passes between the heat-radiating fins 67. The cooling air is then applied to the first and second tubes 73 a and 71 b. As a result, the cooling air takes away the heat transmitted from the IC chip 13 to the heat-radiating fins 67 and the first and second tubes 73 a and 73 b.
  • The liquid coolant is cooled because of the heat exchange performed in the heat-radiating portion 32. The coolant thus cooled flows back into the pump chamber 38 of the rotary pump 31 through the second connection tube 71 b. The coolant repeats absorption of the heat of the IC chip 13. It is then supplied to the heat-radiating portion 32. Thus, the liquid coolant transfers the heat of the IC chip 13 to the heat-radiating portion 32. The heat is released outside the portable computer 1, from the heat-radiating portion 32.
  • As shown in FIGS. 4 and 5, for this embodiment of the portable computer 1, the heat-radiating portion 32 is provided in the support unit 20 coupling the display unit 3 to the main unit 2. Namely, the heat-radiating portion 32 is remote from the main unit 2 and the display unit 3. Therefore, the heat released from the heat-radiating portion 32 does not accumulate in either the first housing 4 of the main unit 2 or the second housing 15 of the display unit 2. This controls the increase in the temperature in the first housing 4 and second housing 15.
  • Hence, the printed circuit board 10 and liquid crystal display panel 14, which are provided in the first and second housing 4 and 15, respectively, experience minor thermal influences. The printed circuit board 10 can be prevented from being deformed, and the liquid crystal display panel 14 is prevented from being degraded in performance.
  • Further, no space needs to be provided in either the first housing 4 or the second housing 15 to accommodate for the cooling unit 30. This helps to render the first and second housing 4 and 15 thin and small.
  • With the configuration described above, the third housing 21 having the heat-radiating portion 32 gradually inclines as it is moved forward from the rear edge of the first housing 4 after the display unit 3 has been rotated to the third position. As a result, the back plate 17 of the second housing 15 moves away from the bottom wall 21 b of the third housing 21, opening the intake port 63 b (FIG. 12) made in the bottom plate 21 b. Both intake ports 63 a and 63 b of the third housing 21 are thereby exposed. Air can therefore flow into the electric fan 50 through the intake ports 63 a and 63 b.
  • This increases the amount of air supplied through the discharge ports 62 a, 62 b and 62 c of the electric fan 50 (FIG. 8). The first to third heat-radiating blocks 51 a, 51 b and 51 c can therefore be cooled with the cooling air at high efficiency.
  • In addition, according to this embodiment of the invention, the third housing 21 of the support unit 20 solely supports the display unit 2. Thus, a greater part of the third housing 21 provides a space for accommodating the cooling unit 30. Therefore, the electric fan 50 can be a large one that excels in air-supplying ability, and first to third heat-radiating blocks 51 a, 51 b and 51 c can be large enough to increase the heat-radiating area of each fin 67 (FIG. 8). This can enhance the efficiency of cooling the CPU 11 and ultimately achieves more reliable cooling of the CPU 11.
  • The present invention is not limited to the embodiment described above. Various changes and modifications can be made, without departing from the scope and spirit of the invention. For example, a heat-receiving portion may be provided, independently of the rotary pump, though the rotary pump 31 functions as heat-receiving portion as well in the above-described embodiment.
  • Furthermore, the medium for transferring heat is not limited to a liquid that circulates between the heat-receiving portion and the heat-radiating portion. Moreover, at least one heat pipe, for example, may transfer the heat of the heat-generating component directly to the heat-radiating portion.
  • Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

Claims (19)

1-20. (canceled)
21. An electronic apparatus comprising:
a main unit including a heat-generating component and a heat-receiving portion thermally connected to the heat-generating component;
a display unit separated from the main unit, the display unit having a display device; and
a support unit including a first edge coupled to the main unit and a second edge coupled to the display unit, the support unit comprising a heat-radiating portion to radiate heat from a liquid coolant received from the main unit and a reserve tank to temporarily store the liquid coolant, the liquid coolant to absorb heat produced by the heat-generating component and transferred by the heat-receiving portion, the liquid coolant being adapted to circulate between the heat-receiving portion and the heat-radiating portion.
22. The electronic apparatus according to claim 21, wherein the heat-radiating portion of the support unit comprises (i) a tube to convey the liquid coolant heated at the heat-receiving portion, and (ii) a plurality of heat-radiating fins coupled to the tube.
23. The electronic apparatus according to claim 22, wherein the heat-radiating portion of the support unit further comprises a fan adapted to apply cooling air to the heat-radiating fins.
24. The electronic apparatus according to claim 23, wherein the fan comprises a fan case and an impeller provided in the fan case, the fan case includes (i) a plurality of suction ports placed on opposite sides of the impeller, and (ii) a plurality of discharge ports.
25. The electronic apparatus according to claim 24, wherein the plurality of heat-radiating fins are arranged at the discharge ports of the fan case.
26. The electronic apparatus according to claim 21, wherein the heat-receiving portion includes a pump to convey the heated liquid coolant to the heat-radiating portion.
27. The electronic apparatus according to claim 21, wherein the support unit includes a bottom wall, a top wall, and a pair of side walls extending between edges of the bottom wall and edges of the top wall, and the heat-radiating portion is provided in a region defined by the bottom wall, top wall and side walls.
28. The electronic apparatus according to claim 24, wherein the support unit includes a bottom wall, a top wall each having an intake port being opposite one of the plurality of suction ports, and a pair of side walls extending between edges of the bottom wall and edges of the top wall, at least one of the side walls has a plurality of exhaust ports.
29. The electronic apparatus according to claim 28, wherein the display unit is able to move between a first position where the display unit covers the main unit from above, a second position where the display unit is supporting in an upright orientation, and a third position where the display unit lies closer to the front of the main unit than at the second position, the support unit is in a raised orientation at the back of the display unit while the display unit remains at either the second position or the third position.
30. The electronic apparatus according to claim 29, wherein the support unit inclines forward from the rear edge of the main unit and the intake ports of the support unit are exposed while the display unit is in the third position.
31. The electronic apparatus according to claim 21, wherein the support unit contains the heat-radiating portion and the reserve tank.
32. An electronic apparatus comprising:
a main unit including a heat-generating component and a heat-receiving portion;
a display unit separated from the main unit, the display unit including a display device; and
a support unit including a first edge coupled to the main unit and a second edge coupled to the display unit, the support unit including (i) a heat-radiating portion to radiate heat from a liquid coolant received from the main unit and (ii) a reserve tank to store the liquid coolant, the liquid coolant to absorb heat produced by the heat-generating component and transferred by the heat-receiving portion, the liquid coolant being adapted to circulate between the heat-receiving portion and the heat-radiating portion.
33. The electronic apparatus according to claim 32, wherein the heat-radiating portion of the support unit comprises (i) a tube to convey the liquid coolant heated at the heat-receiving portion, and (ii) a plurality of heat-radiating fins coupled to the tube.
34. The electronic apparatus according to claim 33, wherein the heat-radiating portion of the support unit further comprises a fan adapted to apply cooling air to the heat-radiating fins.
35. The electronic apparatus according to claim 32, wherein the heat-radiating portion of the support unit further comprises a fan.
36. The electronic apparatus according to claim 35, wherein the fan comprises a fan case and an impeller provided in the fan case, the fan case includes (i) a plurality of suction ports placed on opposite sides of the impeller, and (ii) a plurality of discharge ports.
37. The electronic apparatus according to claim 33, wherein the heat-receiving portion includes a pump to convey the heated liquid coolant to the heat-radiating portion.
38. The electronic apparatus according to claim 32, wherein the display unit is able to move between a first position where the display unit covers the main unit from above, a second position where the display unit is supporting in an upright orientation, and a third position where the display unit lies closer to a front portion of the main unit than at the second position, the support unit is in a raised orientation at a back portion of the display unit while the display unit remains at either the second position or the third position.
US11/741,507 2003-05-26 2007-04-27 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components Abandoned US20070230120A1 (en)

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US10/854,311 US7273089B2 (en) 2003-05-26 2004-05-26 Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US11/741,507 US20070230120A1 (en) 2003-05-26 2007-04-27 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070084709A1 (en) * 2005-10-13 2007-04-19 Polymatech Co., Ltd. Key sheet
US20120322357A1 (en) * 2011-06-15 2012-12-20 Hon Hai Precision Industry Co., Ltd. Enclosure
CN103209567A (en) * 2012-01-13 2013-07-17 鸿富锦精密工业(深圳)有限公司 Closed type control device
US20140293525A1 (en) * 2013-03-26 2014-10-02 Sony Corporation Electronic apparatus
US20140347816A1 (en) * 2013-05-24 2014-11-27 Funai Electric Co., Ltd. Display Device
US20160299533A1 (en) * 2013-09-27 2016-10-13 Hewlett-Packard Development Company, L.P. Detachable display member with support member
US20170347498A1 (en) * 2016-05-27 2017-11-30 Advanced Micro Devices, Inc. Multi-compartment computing device with shared cooling device
US20190250674A1 (en) * 2018-02-13 2019-08-15 Asustek Computer Inc. Electronic device

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004348650A (en) * 2003-05-26 2004-12-09 Toshiba Corp Electronic device
JP2005107122A (en) * 2003-09-30 2005-04-21 Toshiba Corp Electronic equipment
JP4387777B2 (en) * 2003-11-28 2009-12-24 株式会社東芝 Electronics
JP2005190316A (en) * 2003-12-26 2005-07-14 Toshiba Corp Electronic device
JP4234635B2 (en) * 2004-04-28 2009-03-04 株式会社東芝 Electronics
JP2005317796A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump, cooling device, and electronic apparatus
JP2005315158A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump, cooling system and electronic equipment
JP2005317797A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump, electronic equipment and cooling device
JP2005315156A (en) 2004-04-28 2005-11-10 Toshiba Corp Pump and electronic equipment having pump
JP4343032B2 (en) 2004-05-31 2009-10-14 株式会社東芝 Cooling structure and projection type image display device
JP2005344562A (en) * 2004-06-01 2005-12-15 Toshiba Corp Pump, cooling device and electronic apparatus including cooling device
JP2006049382A (en) * 2004-07-30 2006-02-16 Toshiba Corp Cooling device and electronic equipment
KR100630956B1 (en) * 2004-08-17 2006-10-02 삼성전자주식회사 Portable computer
CN101036374A (en) 2004-10-01 2007-09-12 夏普株式会社 Mobile information terminal
US20060238980A1 (en) * 2005-04-21 2006-10-26 Bhattacharyya Rabindra K Increased cooling electronics case
TWI259522B (en) * 2005-08-02 2006-08-01 Quanta Comp Inc Electronic device
CN100399249C (en) * 2005-08-05 2008-07-02 乐金电子(惠州)有限公司 Touch screen with heat radiation structure
WO2007032059A1 (en) * 2005-09-13 2007-03-22 Fujitsu Limited Electronic apparatus
US7365982B2 (en) * 2005-11-01 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Liquid cooling device
CN1980559B (en) * 2005-12-06 2011-02-02 鸿富锦精密工业(深圳)有限公司 Radiating system
US8240359B2 (en) * 2006-04-17 2012-08-14 Gerald Garrett Liquid storage and cooling computer case
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
US20080017355A1 (en) * 2006-05-16 2008-01-24 Hardcore Computer, Inc. Case for a liquid submersion cooled electronic device
JP4167700B2 (en) * 2006-05-31 2008-10-15 株式会社東芝 Electronics
JP4781929B2 (en) * 2006-07-25 2011-09-28 富士通株式会社 Electronics
US7898805B2 (en) * 2006-12-30 2011-03-01 Intel Corporation Central pressuring fan with bottom inlets for notebook cooling
KR101112667B1 (en) * 2007-03-27 2012-02-16 후지쯔 가부시끼가이샤 Electronic apparatus
JP2008292691A (en) * 2007-05-23 2008-12-04 Sony Corp Display device
TWM328754U (en) * 2007-09-19 2008-03-11 Micro Star Int Co Ltd Release gear without screw
US20090080157A1 (en) * 2007-09-20 2009-03-26 Krishnakumar Varadarajan Method, apparatus and computer system for air mover lid cooling
JP4607170B2 (en) * 2007-12-17 2011-01-05 富士通株式会社 Electronics
TWM342531U (en) * 2008-01-15 2008-10-11 Sonnenschein Industry Co Ltd Heat-dissipation device for water-cooling notebook
US7969730B1 (en) 2008-02-08 2011-06-28 Motion Computer, Inc. Portable computer with thermal control and power source shield
US7821782B2 (en) * 2008-02-08 2010-10-26 Motion Computing, Inc. Ergonomic solvent resistant portable computer
US8152071B2 (en) * 2008-02-08 2012-04-10 Motion Computing, Inc. Multi-purpose portable computer with integrated devices
CA2957078C (en) * 2009-06-30 2019-04-30 Lifescan, Inc Analyte testing methods and device for calculating basal insulin therapy
TWI458418B (en) * 2012-02-06 2014-10-21 Wistron Corp Flat cable arranging structure and slider electronic apparatus therewith
TWM434422U (en) * 2012-03-13 2012-07-21 Wistron Corp Supporting device and electronic device having supporting device
TWI492024B (en) * 2012-07-24 2015-07-11 Quanta Comp Inc Integrated mechanism for an electronic device and an adaptor
US9715251B2 (en) * 2012-08-28 2017-07-25 Samsung Electronics Co., Ltd. Portable device
JP5978942B2 (en) * 2012-11-16 2016-08-24 ブラザー工業株式会社 Image reading device
TW201431477A (en) * 2013-01-29 2014-08-01 Hon Hai Prec Ind Co Ltd Heat dissipating apparatus for extending base
JP2014232385A (en) * 2013-05-28 2014-12-11 ソニー株式会社 Electronic device
US10545546B2 (en) 2018-02-23 2020-01-28 Intel Corporation Reversible direction thermal cooling system
CN110377127B (en) * 2018-04-13 2024-03-22 宏碁股份有限公司 Heat dissipation device
EP3628872B1 (en) 2018-09-27 2023-01-25 INTEL Corporation Volumetric resistance blowers
JP6872085B6 (en) * 2018-10-04 2021-06-23 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカPanasonic Intellectual Property Corporation of America Equipment control device and equipment control method
TWI718841B (en) * 2020-01-13 2021-02-11 恆顥科技股份有限公司 Portable electronic apparatus with display and input functions

Citations (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US5648889A (en) * 1993-06-07 1997-07-15 Melcher, Ag Attachment device for semiconductor circuit elements
US5731952A (en) * 1995-04-28 1998-03-24 Kabushiki Kaisha Toshiba Portable electronic apparatus having the heat radiation device for circuit module
US5770478A (en) * 1996-12-03 1998-06-23 International Business Machines Corporation Integral mesh flat plate cooling method
US5901035A (en) * 1994-12-06 1999-05-04 Digital Equipment Corporation Rotating battery hinge for a notebook computer
US6005767A (en) * 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
US6141214A (en) * 1997-10-02 2000-10-31 Samsung Electronics Co., Ltd. Cooling apparatus for electronic systems and computer systems with such apparatus
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
US6333847B1 (en) * 1998-02-04 2001-12-25 Fujitsu Limited Outside panel for an electronic device
US20020018337A1 (en) * 2000-06-29 2002-02-14 Hiroshi Nakamura Electronic apparatus having heat sink for cooling heat generating component
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US6473296B2 (en) * 2000-05-09 2002-10-29 Sony Corporation Information processing device
US6477871B1 (en) * 1999-03-27 2002-11-12 International Business Machines Corporation Lid restraint for portable computer
US6483445B1 (en) * 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
US6519147B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Notebook computer having a liquid cooling device
US6519143B1 (en) * 1999-09-17 2003-02-11 Nec Corporation Docking station
US20030039097A1 (en) * 2001-08-22 2003-02-27 Takeshi Igarashi Method of cooling system for a personal computer and personal computer
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6594149B2 (en) * 2001-09-18 2003-07-15 Hitachi, Ltd. Liquid cooled circuit device
US20030142474A1 (en) * 2002-01-28 2003-07-31 International Business Machines Corporation Personal computer device having constant tilt display with adjustable height
US20030151892A1 (en) * 2002-02-08 2003-08-14 Hitachi, Ltd. Liquid cooling system with structure for liquid supply and electric device
US6625022B2 (en) * 2000-09-29 2003-09-23 Intel Corporation Direct heatpipe attachment to die using center point loading
US6625024B2 (en) * 2001-07-06 2003-09-23 Alstom Power converter enclosure
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US6654234B2 (en) * 2001-07-24 2003-11-25 Hewlett-Packard Development Company, L.P. Multifunctional foldable computer
US6652223B1 (en) * 2002-05-30 2003-11-25 Sunonwealth Electric Machine Industry Fan structure having horizontal convection
US6656770B2 (en) * 1998-03-31 2003-12-02 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US20040001310A1 (en) * 2002-06-27 2004-01-01 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US20040008475A1 (en) * 2001-09-07 2004-01-15 Shigeo Ohashi Electronic apparatus
US20040027800A1 (en) * 2002-08-07 2004-02-12 Kabushiki Kaisha Toshiba Electronic apparatus with a pump to force out liquid coolant
US20040042176A1 (en) * 2002-05-15 2004-03-04 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US6702007B1 (en) * 2003-04-30 2004-03-09 Kuan-Da Pan Heat sink structure
US20040057197A1 (en) * 2002-09-24 2004-03-25 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US6728102B2 (en) * 2000-09-21 2004-04-27 Kabushiki Kaisha Toshiba Electronic apparatus including a cooling unit for cooling a heat generating component
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
US6752201B2 (en) * 2002-11-27 2004-06-22 International Business Machines Corporation Cooling mechanism for an electronic device
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
US6755626B2 (en) * 2001-07-18 2004-06-29 Matsushita Electric Industrial Co., Ltd. Miniature pump, cooling system and portable equipment
US6768637B1 (en) * 1999-05-19 2004-07-27 Sony Corporation Information processing unit and batteries
US6774870B2 (en) * 1996-04-05 2004-08-10 Fakespace Labs, Inc. Gimbal-mounted virtual reality display system
US6779894B2 (en) * 1997-06-20 2004-08-24 Hitachi, Ltd. Display device and display optical system unit
US6785128B1 (en) * 1999-06-11 2004-08-31 Samsung Electronics Co., Ltd Portable computer having cover support means
US6804115B2 (en) * 2002-11-28 2004-10-12 Quanta Computer Inc. Heat dissipation apparatus
US6809930B2 (en) * 2002-11-08 2004-10-26 Agilent Technologies Inc. Cooling a microchip on a circuit board
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US6829139B1 (en) * 2002-10-01 2004-12-07 Danger, Inc. Adjustable data processing display
US20050007739A1 (en) * 2003-05-26 2005-01-13 Yukihiko Hata Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US20050011190A1 (en) * 2003-07-05 2005-01-20 Marcus Bitter Hydraulic active boom suspension for a telehandler
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US20050052833A1 (en) * 2003-09-04 2005-03-10 Toshiyuki Tanaka Interlocking mechanism for a display
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US20050068732A1 (en) * 2003-09-30 2005-03-31 Hiroyuki Tsuji Electronic apparatus with air cooling unit
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US20050117298A1 (en) * 2002-05-15 2005-06-02 Matsushita Electric Industrial, Co., Ltd. Cooling device and an electronic apparatus including the same
US20050164624A1 (en) * 2003-12-26 2005-07-28 Kenichi Hisamatsu Electronic apparatus
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
US6927978B2 (en) * 2003-02-10 2005-08-09 Kabushiki Kaisha Toshiba Electronic apparatus and method of cooling the electronic apparatus
US6983789B2 (en) * 2002-03-22 2006-01-10 Intel Corporation System and method for providing cooling systems with heat exchangers
US7016195B2 (en) * 2002-11-28 2006-03-21 Kabushiki Kaisha Toshiba Cooling fluid pump and electric apparatus, such as personal computer, provided with the pump
US7054158B2 (en) * 2002-06-12 2006-05-30 Robert Bosch Gmbh Cooling body
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
US7077189B1 (en) * 2005-01-21 2006-07-18 Delphi Technologies, Inc. Liquid cooled thermosiphon with flexible coolant tubes
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674565A (en) * 1985-07-03 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe wick
US4980848A (en) * 1988-10-31 1990-12-25 Zenith Data Systems Corporation Heat-exchange panel for portable computer
US5229757A (en) * 1989-10-18 1993-07-20 Sharp Kabushiki Kaisha Computer device having detachable keyboard mounted on a rotatable display
JPH04169917A (en) * 1990-05-07 1992-06-17 Toshiba Corp Portable electronic apparatus
JPH0635565A (en) * 1992-07-13 1994-02-10 Fujitsu Ltd Portable information equipment
AU6496594A (en) * 1993-03-26 1994-10-24 Khalil S. Zaidan Hinge assembly for electronic devices
JP3385482B2 (en) * 1993-11-15 2003-03-10 株式会社日立製作所 Electronics
US5612852A (en) * 1994-03-02 1997-03-18 Sun Microsystems, Inc. Compact housing for a computer workstation
US5634351A (en) * 1994-03-24 1997-06-03 Aavid Laboratories, Inc. Two-phase cooling system for a laptop computer lid
US5953052A (en) * 1995-09-20 1999-09-14 Videotronic Systems Reflected display teleconferencing eye contact terminal
US5729429A (en) * 1996-02-20 1998-03-17 Margaritis; Georgios Ergonomic laptop computer having display positioning supports
US6243261B1 (en) * 1996-08-23 2001-06-05 Speculative Incorporated Thermally efficient computer incorporating deploying CPU module
JPH1139058A (en) 1997-07-14 1999-02-12 Ricoh Co Ltd Pen input type electronic unit
JPH1154036A (en) * 1997-07-30 1999-02-26 Dainippon Printing Co Ltd Formation of fluorescent surface for plasma display panel and filling device for it
TW445386B (en) * 1998-03-16 2001-07-11 Hitachi Ltd Thin-type display
US6256193B1 (en) * 1998-09-22 2001-07-03 Speck Product Design, Inc. Vertical docking and positioning apparatus for a portable computer
US6175493B1 (en) * 1998-10-16 2001-01-16 Dell Usa, Lp Heat transfer from base to display portion of a portable computer
US6353529B1 (en) * 1998-11-12 2002-03-05 Thomas Cies Z-configuration structure for computers, scanners, and communications and video devices
JP2000216575A (en) * 1999-01-22 2000-08-04 Toshiba Corp Cooler and electronic apparatus incorporating it
JP3778409B2 (en) 1999-08-10 2006-05-24 セイコーインスツル株式会社 Portable measuring device
US6266241B1 (en) * 1999-09-29 2001-07-24 Hewlett-Packard Company Notebook computer with ergonomic stand
US6341061B1 (en) * 1999-12-28 2002-01-22 International Business Machines Corporation Standup notebook computer
JP2002009356A (en) 2000-04-20 2002-01-11 Tokin Ceramics Corp Multilayer piezoelectric actuator element
JP3556578B2 (en) * 2000-06-29 2004-08-18 株式会社東芝 Portable electronic device and cooling device used for this electronic device
JP2002151638A (en) 2000-11-08 2002-05-24 Hitachi Ltd Cooler for electronic equipment
JP3594900B2 (en) * 2000-12-19 2004-12-02 株式会社日立製作所 Display integrated computer
US6798429B2 (en) 2001-03-29 2004-09-28 Intel Corporation Intuitive mobile device interface to virtual spaces
JP2002344186A (en) 2001-05-15 2002-11-29 Sharp Corp Electronic equipment
US6487076B1 (en) * 2001-10-01 2002-11-26 Auras Technology, Ltd. Compact heat sink module
JP3961843B2 (en) 2002-02-08 2007-08-22 株式会社日立製作所 A small computer with a liquid cooling system.
US7312985B2 (en) * 2002-03-08 2007-12-25 Lg Electronics Inc. Cooler of notebook personal computer and fabrication method thereof
EP1353262A1 (en) * 2002-04-10 2003-10-15 SFC Smart Fuel Cell GmbH Heat dissipation for device with internal power supply
JP2003324174A (en) * 2002-04-30 2003-11-14 Toshiba Corp Electronic instrument
JP2003331575A (en) * 2002-05-15 2003-11-21 Mitsubishi Electric Corp Control circuit for nonvolatile memory which can access randomly at high speed
JP3431024B1 (en) 2003-01-15 2003-07-28 松下電器産業株式会社 Cooling system
JP3452059B1 (en) 2002-05-15 2003-09-29 松下電器産業株式会社 Cooling device and electronic equipment equipped with it
KR100461185B1 (en) * 2002-06-07 2004-12-13 삼성전자주식회사 Monitor
JP3629257B2 (en) * 2002-08-30 2005-03-16 株式会社東芝 Electronics
JP3600606B2 (en) * 2002-09-20 2004-12-15 株式会社東芝 Electronics
JP2004139187A (en) * 2002-10-15 2004-05-13 Toshiba Corp Electronic device
TWI231894B (en) * 2004-02-25 2005-05-01 Tatung Co Ltd Height adjustment structure for a portable information display device

Patent Citations (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5594619A (en) * 1990-04-27 1997-01-14 Kabushiki Kaisha Toshiba Portable computer comprising keyboard and coordinate input tablet hingedly connected to a main body case through a junction base having a cylindrical element defining a linear groove therethrough
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5648889A (en) * 1993-06-07 1997-07-15 Melcher, Ag Attachment device for semiconductor circuit elements
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5901035A (en) * 1994-12-06 1999-05-04 Digital Equipment Corporation Rotating battery hinge for a notebook computer
US5731952A (en) * 1995-04-28 1998-03-24 Kabushiki Kaisha Toshiba Portable electronic apparatus having the heat radiation device for circuit module
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US6774870B2 (en) * 1996-04-05 2004-08-10 Fakespace Labs, Inc. Gimbal-mounted virtual reality display system
US5770478A (en) * 1996-12-03 1998-06-23 International Business Machines Corporation Integral mesh flat plate cooling method
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
US6779894B2 (en) * 1997-06-20 2004-08-24 Hitachi, Ltd. Display device and display optical system unit
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
US6141214A (en) * 1997-10-02 2000-10-31 Samsung Electronics Co., Ltd. Cooling apparatus for electronic systems and computer systems with such apparatus
US6005767A (en) * 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US6333847B1 (en) * 1998-02-04 2001-12-25 Fujitsu Limited Outside panel for an electronic device
US6656770B2 (en) * 1998-03-31 2003-12-02 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6483445B1 (en) * 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
US6477871B1 (en) * 1999-03-27 2002-11-12 International Business Machines Corporation Lid restraint for portable computer
US6768637B1 (en) * 1999-05-19 2004-07-27 Sony Corporation Information processing unit and batteries
US6785128B1 (en) * 1999-06-11 2004-08-31 Samsung Electronics Co., Ltd Portable computer having cover support means
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
US6519143B1 (en) * 1999-09-17 2003-02-11 Nec Corporation Docking station
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6831836B2 (en) * 1999-12-29 2004-12-14 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6473296B2 (en) * 2000-05-09 2002-10-29 Sony Corporation Information processing device
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
US20020018337A1 (en) * 2000-06-29 2002-02-14 Hiroshi Nakamura Electronic apparatus having heat sink for cooling heat generating component
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US6728102B2 (en) * 2000-09-21 2004-04-27 Kabushiki Kaisha Toshiba Electronic apparatus including a cooling unit for cooling a heat generating component
US6625022B2 (en) * 2000-09-29 2003-09-23 Intel Corporation Direct heatpipe attachment to die using center point loading
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
US6519147B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Notebook computer having a liquid cooling device
US6519148B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Liquid cooling system for notebook computer
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
US6625024B2 (en) * 2001-07-06 2003-09-23 Alstom Power converter enclosure
US6755626B2 (en) * 2001-07-18 2004-06-29 Matsushita Electric Industrial Co., Ltd. Miniature pump, cooling system and portable equipment
US6654234B2 (en) * 2001-07-24 2003-11-25 Hewlett-Packard Development Company, L.P. Multifunctional foldable computer
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US20030039097A1 (en) * 2001-08-22 2003-02-27 Takeshi Igarashi Method of cooling system for a personal computer and personal computer
US6809927B2 (en) * 2001-09-07 2004-10-26 Hitachi, Ltd. Liquid circulation cooling system for electronic apparatus
US20040008475A1 (en) * 2001-09-07 2004-01-15 Shigeo Ohashi Electronic apparatus
US6594149B2 (en) * 2001-09-18 2003-07-15 Hitachi, Ltd. Liquid cooled circuit device
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US20030142474A1 (en) * 2002-01-28 2003-07-31 International Business Machines Corporation Personal computer device having constant tilt display with adjustable height
US20030151892A1 (en) * 2002-02-08 2003-08-14 Hitachi, Ltd. Liquid cooling system with structure for liquid supply and electric device
US6983789B2 (en) * 2002-03-22 2006-01-10 Intel Corporation System and method for providing cooling systems with heat exchangers
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US20050117298A1 (en) * 2002-05-15 2005-06-02 Matsushita Electric Industrial, Co., Ltd. Cooling device and an electronic apparatus including the same
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US20040042176A1 (en) * 2002-05-15 2004-03-04 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6652223B1 (en) * 2002-05-30 2003-11-25 Sunonwealth Electric Machine Industry Fan structure having horizontal convection
US7054158B2 (en) * 2002-06-12 2006-05-30 Robert Bosch Gmbh Cooling body
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US20040001310A1 (en) * 2002-06-27 2004-01-01 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
US6870736B2 (en) * 2002-07-26 2005-03-22 Intel Corporation Heat sink and package surface design
US20040027800A1 (en) * 2002-08-07 2004-02-12 Kabushiki Kaisha Toshiba Electronic apparatus with a pump to force out liquid coolant
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US20040057197A1 (en) * 2002-09-24 2004-03-25 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6829139B1 (en) * 2002-10-01 2004-12-07 Danger, Inc. Adjustable data processing display
US6809930B2 (en) * 2002-11-08 2004-10-26 Agilent Technologies Inc. Cooling a microchip on a circuit board
US6752201B2 (en) * 2002-11-27 2004-06-22 International Business Machines Corporation Cooling mechanism for an electronic device
US7016195B2 (en) * 2002-11-28 2006-03-21 Kabushiki Kaisha Toshiba Cooling fluid pump and electric apparatus, such as personal computer, provided with the pump
US6804115B2 (en) * 2002-11-28 2004-10-12 Quanta Computer Inc. Heat dissipation apparatus
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
US6927978B2 (en) * 2003-02-10 2005-08-09 Kabushiki Kaisha Toshiba Electronic apparatus and method of cooling the electronic apparatus
US6702007B1 (en) * 2003-04-30 2004-03-09 Kuan-Da Pan Heat sink structure
US20050007739A1 (en) * 2003-05-26 2005-01-13 Yukihiko Hata Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
US20050011190A1 (en) * 2003-07-05 2005-01-20 Marcus Bitter Hydraulic active boom suspension for a telehandler
US20050052833A1 (en) * 2003-09-04 2005-03-10 Toshiyuki Tanaka Interlocking mechanism for a display
US20050068732A1 (en) * 2003-09-30 2005-03-31 Hiroyuki Tsuji Electronic apparatus with air cooling unit
US20050164624A1 (en) * 2003-12-26 2005-07-28 Kenichi Hisamatsu Electronic apparatus
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate
US7077189B1 (en) * 2005-01-21 2006-07-18 Delphi Technologies, Inc. Liquid cooled thermosiphon with flexible coolant tubes

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070084709A1 (en) * 2005-10-13 2007-04-19 Polymatech Co., Ltd. Key sheet
US7485822B2 (en) * 2005-10-13 2009-02-03 Polymatech Co., Ltd. Key sheet
US20120322357A1 (en) * 2011-06-15 2012-12-20 Hon Hai Precision Industry Co., Ltd. Enclosure
CN103209567A (en) * 2012-01-13 2013-07-17 鸿富锦精密工业(深圳)有限公司 Closed type control device
US9952623B2 (en) 2013-03-26 2018-04-24 Sony Corporation Electronic apparatus
US9280181B2 (en) * 2013-03-26 2016-03-08 Sony Corporation Electronic apparatus
US9552014B2 (en) 2013-03-26 2017-01-24 Sony Corporation Electronic apparatus
US20140293525A1 (en) * 2013-03-26 2014-10-02 Sony Corporation Electronic apparatus
US20140347816A1 (en) * 2013-05-24 2014-11-27 Funai Electric Co., Ltd. Display Device
US9491893B2 (en) * 2013-05-24 2016-11-08 Funai Electric Co., Ltd. Display device
USRE47914E1 (en) * 2013-05-24 2020-03-17 Funai Electric Co., Ltd. Display device
US20160299533A1 (en) * 2013-09-27 2016-10-13 Hewlett-Packard Development Company, L.P. Detachable display member with support member
US10698450B2 (en) * 2013-09-27 2020-06-30 Hewlett-Packard Development Company, L.P. Detachable display member with support member
US20170347498A1 (en) * 2016-05-27 2017-11-30 Advanced Micro Devices, Inc. Multi-compartment computing device with shared cooling device
US9848515B1 (en) * 2016-05-27 2017-12-19 Advanced Micro Devices, Inc. Multi-compartment computing device with shared cooling device
US20190250674A1 (en) * 2018-02-13 2019-08-15 Asustek Computer Inc. Electronic device
US10627874B2 (en) * 2018-02-13 2020-04-21 Asustek Computer Inc. Electronic device

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US20070227705A1 (en) 2007-10-04

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