US20080042675A1 - Probe station - Google Patents
Probe station Download PDFInfo
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- US20080042675A1 US20080042675A1 US11/975,477 US97547707A US2008042675A1 US 20080042675 A1 US20080042675 A1 US 20080042675A1 US 97547707 A US97547707 A US 97547707A US 2008042675 A1 US2008042675 A1 US 2008042675A1
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- Prior art keywords
- platen
- under test
- probe
- device under
- probe station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Definitions
- the present invention relates to a probe station.
- Probe stations are designed to measure the characteristics of electrical devices such as silicon wafers. Probe stations typically include a chuck that supports the electrical device while it is being probed by needles or contacts on a membrane situated above the chuck. In order to provide a controlled environment to probe the electrical device, many of today's probe stations surround the chuck with an environmental enclosure so that temperature, humidity, etc. may be held within predetermined limits during testing. Environmental enclosures protect the device from spurious air currents that would otherwise affect measurements, and also facilitate thermal testing of electrical devices at other-than-ambient environmental conditions. Environmental conditions within the enclosure are principally controlled by a dry air ventilation system as well as a temperature element, usually located below the chuck, that heats or cools the electrical device being tested through thermal conduction.
- EMI shielding structures within or around the environmental enclosures in order to provide an electrically quiet environment, often essential during high frequency testing where electrical noise from external electromagnetic sources can hinder accurate measurement of the electrical device's characteristics.
- Guarding and EMI shielding structures are well known and discussed extensively in technical literature. See, for example, an article by William Knauer entitled “Fixturing for Low Current/Low Voltage Parametric Testing” appearing in Evaluation Engineering, November, 1990, pages 150-153.
- Probe stations incorporating EMI shielding structures will usually at least partially surround the test signal with a guard signal that closely approximates the test signal, thus inhibiting electromagnetic current leakage from the test signal path to its immediately surrounding environment.
- EMI shielding structures may provide a shield signal to the environmental enclosure surrounding much of the perimeter of the probe station.
- the environmental enclosure is typically connected to earth ground, instrumentation ground, or some other desired potential.
- existing probe stations may include a multistage chuck upon which the electrical device rests when being tested.
- the top stage of the chuck, which supports the electrical device typically comprises a solid, electrically conductive metal plate through which the test signal may be routed.
- a middle stage and a bottom stage of the chuck similarly comprise solid electrically conductive plates through which a guard signal and a shield signal may be routed, respectively. In this fashion, an electrical device resting on such a multistage chuck may be both guarded and shielded from below.
- FIG. 1 shows a generalized schematic of a probe station 10 .
- the probe station 10 includes the chuck 12 that supports the electrical device 14 to be probed by the probe apparatus 16 that extends through an opening in the platen 18 .
- An outer shield box 24 provides sufficient space for the chuck 12 to be moved laterally by a positioner 22 . Because the chuck 12 may freely move within the outer shield box 24 , a suspended member 26 electrically interconnected to a guard potential may be readily positioned above the chuck 12 .
- the suspended guard member 26 defines an opening that is aligned with the opening defined by the platen 18 so that the probe apparatus 16 may extend through the guard member 26 to probe the electrical device 14 .
- the suspended guard member 26 When connected to a guard signal substantially identical to the test signal provided to the probe apparatus 16 , the suspended guard member 26 provides additional guarding for low noise tests.
- Such a design is exemplified by EP 0 505 981 B1, incorporated by reference herein.
- the outer shield box 24 includes a sliding plate assembly 28 that defines a portion of the lower perimeter of the shield box 24 .
- the sliding plate assembly 28 comprises a number of overlapping plate members. Each plate member defines a central opening 30 through which the positioner 22 may extend. Each successively higher plate member is smaller in size and also defines a smaller opening 30 through which the positioner 22 extends.
- the sliding plate assembly 28 is included to permit lateral movement of the positioner 22 , and hence the chuck 12 , while maintaining a substantially closed lower perimeter for the shield box 24 .
- Edge coupled photonics devices are normally arranged within each semiconductor wafer in orthogonal arrays of devices. Typically, the wafers are sliced in thin strips of a plurality individual optical devices, as illustrated in FIG. 3 .
- Edge coupled photonics devices may include, for example, lasers, semiconductor optical amplifiers, optical modulators (e.g., Machzhender, electro-absorption), edge coupled photo-diodes, and passive devices.
- FIG. 4 many such photonics devices provide light output through one side of the device. Normally, the photonics devices receive light through the opposing side of the device from the light output.
- the light provided by the device may be modulated or otherwise modified by changing the input light and/or the electrical signal to the device, or the electrical output may be modulated or otherwise modified by changing the input light.
- other photonics devices are surface coupled where the electrical contact and the light output (or light input) are both on the same face of the device, as illustrated in FIG. 5 .
- On such surface coupled photonics device is a VCSEL laser.
- a typical arrangement to test such photonics devices within a probe station is shown.
- a set of electrical probe positioners 50 are arranged on the platen to provide electrical signals to and from the device under test, as needed.
- one or more optical probe positioners 60 are positioned on the platen to sense the light output from the device under test or provide light to the device under test.
- the number of positioners may be significant thereby potentially resulting in insufficient space on the platen to effectively accommodate all the necessary positioners.
- the opening provided by the platen is normally relatively small so that the space available for extending the probes through the platen is limited. This limited space significantly increases the difficulty in positioning the electrical and optical probes.
- the end of the optical probes typically need to be positioned within 0.10 microns in x/y/z directions which is somewhat awkward from a position on the platen above the chuck.
- the angular orientation of the end portion of the optical probe likewise needs to be very accurate to couple light between the optical probe and the device under test which is similarly difficult.
- extreme positional and angular accuracy is needed to couple the optical waveguide or free space optical path (i.e., optical probe) to a photonics device or another optical waveguide.
- the optical probes frequently tend to be out of alignment requiring manual alignment for each photonics device while probing each of the devices.
- FIG. 1 shows a cross sectional view of an existing probe station.
- FIG. 2 illustrates a wafer with photonics devices thereon.
- FIG. 3 illustrates a strip of photonics devices.
- FIG. 4 illustrates an edge coupled photonics device.
- FIG. 5 illustrates an upper surface coupled photonics device.
- FIG. 6 shows a cross sectional view of the probe station of FIG. 1 with electrical and optical probes.
- FIG. 7 shows a pictorial view of a modified probe station.
- FIG. 8 shows a pictorial view of another modified probe station.
- FIG. 9 shows a pictorial view of yet another modified probe station.
- FIG. 10 shows a pictorial view of the support assembly for the probe station of FIG. 7 .
- FIG. 11 shows a pictorial view of a further modified probe station.
- the end of the optical probes are typically aligned with the edge of the device under test while the electrical probes are typically aligned with the contacts on the upper surface of the device under test, with both the electrical probes and the optical probes being supported by the platen.
- the entire platen is moved in the z-axis direction for selectively contacting the electrical probes on the device under test.
- the chuck is moved in a z-axis direction. The z-axis movement of the platen permits consistent simultaneous relative movement of all the electrical and optical probes.
- Each component of the device under test is successively moved in x and/or y lateral directions relative to the electrical probes using a chuck or other support to a location under the electrical probes.
- the present inventors considered the z-axis movement of the platen or chuck to perform simultaneous probing and came to the realization that normal z-axis movement of the platen typically brings the probes into contact with the device under test with sufficient additional z-axis movement to result in lateral scrubbing of the contact surfaces to provide a good contact.
- This additional z-axis movement for the electrical probes which may vary depending on the particular circuit being probed, different electronic components, the planarity of the devices, and differences in the height of the different contacts between devices, may result in inaccurate alignment of the optical probes which are likewise being moved in the z-axis direction together with the platen or chuck.
- the alignment of the optical inputs and outputs of the devices tends not to vary in the same manner as the contacts, if they vary significantly at all.
- the appropriate z-axis movement of the electrical probes varies depending on the particular device being tested; while the appropriate z-axis movement of the optical probes tends to be at a substantially fixed location with respect to the device under test, which may not be consistent with the z-axis movement provided for the electrical probes.
- the relatively long optical device tends to expand and contract with temperature variations of the environment resulting in additional difficulty properly positioning the optical probe.
- a modified probe station 100 includes a chuck 102 that supports a device under test 104 .
- the device under test 104 in many instances is one or more photonics devices.
- An upper platen 106 defines an opening 108 therein and is positioned above the chuck 102 .
- the opening 108 may be, for example, completely encircled by the upper platen 106 or a cutout of a portion of the upper platen 106 .
- Electrical probes 110 are supported by the upper platen 106 .
- the platen 106 is supported by a plurality of supports 112 a , 112 b , 112 c , and 112 d . Positioned below the supports 112 a - 112 d is a lower platen 114 . The optical probes 116 are supported by the lower platen 114 . A microscope, not shown, may be used to position the device under test 104 relative to the probes 110 and 116 . During probing the upper platen 106 is moved in a z-axis direction to make contact between the electrical probes 110 and the device under test 104 .
- the x and/or y position of the chuck 102 (hence the device under test 104 ) relative to the electrical probes 110 is modified, and thereafter the upper platen 106 is moved in a z-direction to make contact between the electrical probes 110 and the device under test 104 .
- the optical probes 116 are aligned with the edge of the device under test 104 .
- the optical probes 116 may not need to be repositioned for each device being tested. If realignment of the optical probes 116 are necessary, there is a good likelihood that minimal adjustment is necessary. In particular, there is a high likelihood that the elevation of the optical probe 116 is accurate (or nearly so) because the chuck 102 is moving within a horizontal plane for testing the device under test 104 . It may be observed that optical probes 116 are effectively decoupled from the z-axis motion of the upper platen 106 .
- movement of the upper platen 106 for bringing the electrical probes 110 into contact with the device under test 104 does not result in movement of the optical probe 116 with respect to the device under test 104 .
- movement of the optical probes 116 does not result in movement of the electrical probes 110 .
- the lower platen 114 may include at least 70% of its surface area free of other components and structures, such as the chuck and supports, available for the positioning of optical components thereon. More preferably, at least 80%, 85%, 90%, and 95% of the surface area of the lower platen 114 is free of other components and structures.
- the lower platen 114 has preferably 70%, 80%, 85%, 90%, or 95% of the surface area of the upper platen free from other components and structures thereon in any outward direction, such as +x, ⁇ x, +y, or ⁇ y directions.
- This free space more readily permits the attachment of free space optics thereon, which frequently require substantial space and flexibility to set up.
- the size of the upper platen 106 may have less surface area, the same surface area, or greater surface area than the lower platen 114 .
- the lower platen 114 may have a surface area that is 25%, 35%, or 50% or more greater than the upper platen 106 (e.g., non-optical platen).
- This increased surface area of the lower platen 114 relative to the upper platen 106 permits more open access to the lower platen 114 to locate optical components thereon without limitations resulting from the proximity upper platen 106 .
- the lower platen 114 is a single integral member or otherwise a rigidly interconnected set of members. It is of course to be understood that the system may include more than two platens, as desired.
- the electrical components may be located on the lower platen, as desired.
- the optical components may be located on the upper platen, as desired, which may include holes therein for an optical breadboard if desired.
- a set of different upper platens may be provided, each of which is designed to be particularly suitable for a particular test. For example, some upper platens may be small, large, oval, rectangular, thin, thick, etc.
- Another feature that may be included is the capability of removing or otherwise moving the upper platen out of the way for in a controlled manner.
- the movement of the upper platen facilitates the adjustment and installation of the optical components thereunder.
- a mechanical support mechanism may be included that supports the upper platen while the platen is moved with respect to the remainder of the probe station, and in particular the lower platen.
- the upper platen may be displaced such that at least 20% (or at least 30% or at least 40% or at least 50%) of its surface area is laterally displaced beyond its original position on the supports.
- the upper platen may be tilted upwardly.
- the upper platen may be tilted such that it is at least 5 degrees (or at least 10 degrees or at least 20 degrees or at least 45 degrees or at least 75 degrees) of its surface area is tiled with respect to its position when probing, such as horizontal.
- a modified probe station 200 includes an upper platen 206 supported by a set of upper supports 212 a - 212 d .
- the upper supports 212 a - 212 d extend through respective openings 220 a - 220 d in a lower platen 214 and are supported by a base 222 .
- the lower platen 214 is supported by a set of supports 224 a - 224 d which is supported by the base 222 .
- the supports 224 a - 224 d and the supports 212 a - 212 d are preferably adjustable in height.
- the chuck 202 extends through an opening 226 in the lower platen 214 and is supported by the base 222 .
- one or more optical probes 216 supported by the lower platen 214 may be simultaneously moved in the z-axis direction with respect to a device under test 204 supported by the chuck 202 .
- one or more electrical probes 210 may be simultaneously moved in the z-axis direction with respect to a device under test 204 supported by the chuck 202 .
- one or more electrical probes 210 may be simultaneously moved in the z-axis direction with respect to the optical probes 216 , or vise versa, both of which may be moved relative to the device under test 204 . This permits effective realignment of one or more optical probes 216 with respect to the edge of the device under test 204 .
- the lower platen 214 is preferably positioned at a location below the device under test 204 while the upper platen 206 is positioned above the device under test 204 . Also, it is to be understood that the lower platen 214 may be positioned at a location above the device under test 204 while the upper platen 206 is likewise positioned above the device under test 204 . Also, it is to be understood that the lower platen 214 may be positioned at a location below the device under test 204 while the upper platen 206 is likewise positioned below the device under test 204 .
- the range of movement of the supports may permit the upper platen 206 and/or the lower platen 214 to be moved from a position above the device under test 214 to a position below the device under test 214 , or from a position below the device under test 214 to a position above the device under test 214 .
- a modified probe station 300 includes the chuck 202 being supported by the lower platen 214 . In this manner, the chuck 202 and the lower platen 214 will move together in the z-axis. This is beneficial, at least in part, to assist in maintaining the relative alignment between the optical probes and the device under test.
- the lower platen (or the upper platen) may include a set of openings 170 defined therein suitable for engaging an optical device.
- the openings 170 are arranged in an orthogonal array.
- the openings 170 provide a convenient mechanism for interconnection between the lower platen and the optical probes.
- the probe station facilitates the testing of a photonics device that includes an optical test path, which is optimized based upon optical characteristics.
- the probe station facilitates the testing of a photonics device that includes an electrical test path, which is similarly optimized based upon electrical characteristics.
- the probe station includes a structure that brings together optimized electrical test paths and optimized optical test paths together on the device under test.
- the upper platen 106 (or other platens) is supported by a plurality of supports 350 a - 350 d .
- the platen 106 is supported by a set of contacts 352 a - 352 d .
- the contacts 352 a - 352 d are preferably not fixedly interconnected with the upper platen 106 , but rather maintained in contact by the force of gravity free from a fixed interconnection, such as a screw or bolt. Accordingly, the upper platen 106 may be removed from the supports 350 a - 350 d by merely lifting the upper platen 106 .
- a set of interconnecting members 354 , 356 , and 358 may be included to provide increased rigidity to the supports 350 a - 350 d .
- the length of the interconnecting members 354 , 356 , 358 may be adjustable, such as extending through the supports 350 a - 350 d or otherwise including a length adjustment mechanism for the interconnecting members themselves. In this manner the upper platen 106 may be lifted from the supports 350 a - 350 d , the position of the supports 350 a - 350 d and relative spacing thereof modified, and the upper platen 106 repositioned on the supports 350 a - 350 d .
- a mechanical lift mechanism 358 may be included to raise and lower the upper platen 106 .
- the supports 350 a - 350 d may include internal height adjustment for z-axis movement. Further, computer controlled lift control mechanisms may likewise be used. Moreover, it may be observed that the upper platen 106 may be moved in the z-axis direction, and in the x and/or y direction by simply moving the upper platen 106 . In an alternative embodiment, the supports 350 a - 350 d may include horizontal movement structures to move the upper platen 106 in the x and/or y directions. As one example, the horizontal movement structures may be a set of rollers that permit the selective lateral movement of the upper platen 106 .
- a substantially enclosed environment 400 may be provided around the device under test.
- the environment may be electrically connected to an earth ground potential, an instrument ground potential, a guard potential, a shield potential, or otherwise remains floating.
- An optical box 402 may be provided within the lower region of the probe station to provide a substantially light tight environment around the device under test, which may be useful for many applications.
- the optical box 402 preferably includes a plurality of sealable openings to permit access to the optical probes.
- An electrical box 404 may be provided within the upper region of the probe station to provide a substantially noise controlled environment around the electrical probes, which may be useful for many applications.
- the electrical box 404 may be electrically connected to an earth ground potential, an instrument ground potential, a guard potential, a shield potential, or otherwise remains floating.
Abstract
A probe station.
Description
- This application is a continuation of U.S. patent application Ser. No. 10/759,481, filed Jan. 16, 2004, which is a continuation of U.S. patent application Ser. No. 10/285,135, filed Oct. 30, 2002, now U.S. Pat. No. 6,777,964, which claims the benefit of U.S. Provisional App. No. 60/351,844, filed Jan. 25, 2000.
- The present invention relates to a probe station.
- Probe stations are designed to measure the characteristics of electrical devices such as silicon wafers. Probe stations typically include a chuck that supports the electrical device while it is being probed by needles or contacts on a membrane situated above the chuck. In order to provide a controlled environment to probe the electrical device, many of today's probe stations surround the chuck with an environmental enclosure so that temperature, humidity, etc. may be held within predetermined limits during testing. Environmental enclosures protect the device from spurious air currents that would otherwise affect measurements, and also facilitate thermal testing of electrical devices at other-than-ambient environmental conditions. Environmental conditions within the enclosure are principally controlled by a dry air ventilation system as well as a temperature element, usually located below the chuck, that heats or cools the electrical device being tested through thermal conduction.
- Many probe stations also incorporate guarding and electromagnetic interference (EMI) shielding structures within or around the environmental enclosures in order to provide an electrically quiet environment, often essential during high frequency testing where electrical noise from external electromagnetic sources can hinder accurate measurement of the electrical device's characteristics. Guarding and EMI shielding structures are well known and discussed extensively in technical literature. See, for example, an article by William Knauer entitled “Fixturing for Low Current/Low Voltage Parametric Testing” appearing in Evaluation Engineering, November, 1990, pages 150-153.
- Probe stations incorporating EMI shielding structures will usually at least partially surround the test signal with a guard signal that closely approximates the test signal, thus inhibiting electromagnetic current leakage from the test signal path to its immediately surrounding environment. Similarly, EMI shielding structures may provide a shield signal to the environmental enclosure surrounding much of the perimeter of the probe station. The environmental enclosure is typically connected to earth ground, instrumentation ground, or some other desired potential.
- To provide guarding and shielding for systems of the type just described, existing probe stations may include a multistage chuck upon which the electrical device rests when being tested. The top stage of the chuck, which supports the electrical device, typically comprises a solid, electrically conductive metal plate through which the test signal may be routed. A middle stage and a bottom stage of the chuck similarly comprise solid electrically conductive plates through which a guard signal and a shield signal may be routed, respectively. In this fashion, an electrical device resting on such a multistage chuck may be both guarded and shielded from below.
-
FIG. 1 shows a generalized schematic of aprobe station 10. Theprobe station 10 includes thechuck 12 that supports theelectrical device 14 to be probed by theprobe apparatus 16 that extends through an opening in theplaten 18. Anouter shield box 24 provides sufficient space for thechuck 12 to be moved laterally by apositioner 22. Because thechuck 12 may freely move within theouter shield box 24, a suspendedmember 26 electrically interconnected to a guard potential may be readily positioned above thechuck 12. The suspendedguard member 26 defines an opening that is aligned with the opening defined by theplaten 18 so that theprobe apparatus 16 may extend through theguard member 26 to probe theelectrical device 14. When connected to a guard signal substantially identical to the test signal provided to theprobe apparatus 16, the suspendedguard member 26 provides additional guarding for low noise tests. Such a design is exemplified byEP 0 505 981 B1, incorporated by reference herein. - To provide a substantially closed environment, the
outer shield box 24 includes asliding plate assembly 28 that defines a portion of the lower perimeter of theshield box 24. Thesliding plate assembly 28 comprises a number of overlapping plate members. Each plate member defines acentral opening 30 through which thepositioner 22 may extend. Each successively higher plate member is smaller in size and also defines asmaller opening 30 through which thepositioner 22 extends. Thesliding plate assembly 28 is included to permit lateral movement of thepositioner 22, and hence thechuck 12, while maintaining a substantially closed lower perimeter for theshield box 24. - Referring to
FIG. 2 , in many cases the semiconductor wafers that are tested within such a probe station are edge coupled photonics devices. Edge coupled photonics devices are normally arranged within each semiconductor wafer in orthogonal arrays of devices. Typically, the wafers are sliced in thin strips of a plurality individual optical devices, as illustrated inFIG. 3 . Edge coupled photonics devices may include, for example, lasers, semiconductor optical amplifiers, optical modulators (e.g., Machzhender, electro-absorption), edge coupled photo-diodes, and passive devices. Referring toFIG. 4 , many such photonics devices provide light output through one side of the device. Normally, the photonics devices receive light through the opposing side of the device from the light output. On another side of the device one or more electrical contacts are provided. In typical operation, the light provided by the device may be modulated or otherwise modified by changing the input light and/or the electrical signal to the device, or the electrical output may be modulated or otherwise modified by changing the input light. Similarly, other photonics devices are surface coupled where the electrical contact and the light output (or light input) are both on the same face of the device, as illustrated inFIG. 5 . On such surface coupled photonics device is a VCSEL laser. - Referring to
FIG. 6 , a typical arrangement to test such photonics devices within a probe station is shown. A set ofelectrical probe positioners 50 are arranged on the platen to provide electrical signals to and from the device under test, as needed. In addition, one or moreoptical probe positioners 60 are positioned on the platen to sense the light output from the device under test or provide light to the device under test. As it may be observed, when testing devices that include both optical and electrical attributes the number of positioners may be significant thereby potentially resulting in insufficient space on the platen to effectively accommodate all the necessary positioners. In addition, the opening provided by the platen is normally relatively small so that the space available for extending the probes through the platen is limited. This limited space significantly increases the difficulty in positioning the electrical and optical probes. Similarly, the end of the optical probes typically need to be positioned within 0.10 microns in x/y/z directions which is somewhat awkward from a position on the platen above the chuck. Moreover, the angular orientation of the end portion of the optical probe likewise needs to be very accurate to couple light between the optical probe and the device under test which is similarly difficult. In many applications extreme positional and angular accuracy is needed to couple the optical waveguide or free space optical path (i.e., optical probe) to a photonics device or another optical waveguide. Moreover, during the testing of wafers the optical probes frequently tend to be out of alignment requiring manual alignment for each photonics device while probing each of the devices. - What is desired, then, is a probe station that facilitates accurate alignment of electrical and optical probes.
- The foregoing and other objectives, features, and advantages of the invention will be more readily understood upon consideration of the following detailed description of the invention, taken in conjunction with the accompanying drawings.
-
FIG. 1 shows a cross sectional view of an existing probe station. -
FIG. 2 illustrates a wafer with photonics devices thereon. -
FIG. 3 illustrates a strip of photonics devices. -
FIG. 4 illustrates an edge coupled photonics device. -
FIG. 5 illustrates an upper surface coupled photonics device. -
FIG. 6 shows a cross sectional view of the probe station ofFIG. 1 with electrical and optical probes. -
FIG. 7 shows a pictorial view of a modified probe station. -
FIG. 8 shows a pictorial view of another modified probe station. -
FIG. 9 shows a pictorial view of yet another modified probe station. -
FIG. 10 shows a pictorial view of the support assembly for the probe station ofFIG. 7 . -
FIG. 11 shows a pictorial view of a further modified probe station. - During testing, the end of the optical probes are typically aligned with the edge of the device under test while the electrical probes are typically aligned with the contacts on the upper surface of the device under test, with both the electrical probes and the optical probes being supported by the platen. In many cases, the entire platen is moved in the z-axis direction for selectively contacting the electrical probes on the device under test. Alternatively, the chuck is moved in a z-axis direction. The z-axis movement of the platen permits consistent simultaneous relative movement of all the electrical and optical probes. Each component of the device under test is successively moved in x and/or y lateral directions relative to the electrical probes using a chuck or other support to a location under the electrical probes.
- The present inventors considered the z-axis movement of the platen or chuck to perform simultaneous probing and came to the realization that normal z-axis movement of the platen typically brings the probes into contact with the device under test with sufficient additional z-axis movement to result in lateral scrubbing of the contact surfaces to provide a good contact. This additional z-axis movement for the electrical probes, which may vary depending on the particular circuit being probed, different electronic components, the planarity of the devices, and differences in the height of the different contacts between devices, may result in inaccurate alignment of the optical probes which are likewise being moved in the z-axis direction together with the platen or chuck. The alignment of the optical inputs and outputs of the devices tends not to vary in the same manner as the contacts, if they vary significantly at all. In summary, the appropriate z-axis movement of the electrical probes varies depending on the particular device being tested; while the appropriate z-axis movement of the optical probes tends to be at a substantially fixed location with respect to the device under test, which may not be consistent with the z-axis movement provided for the electrical probes. Moreover, the relatively long optical device tends to expand and contract with temperature variations of the environment resulting in additional difficulty properly positioning the optical probe.
- In light of the foregoing realizations the present inventors determined that the traditional probe station should be modified in some manner to facilitate at least partial independent movement or otherwise separation of the optical probes and electrical probes. Referring to
FIG. 7 , a modifiedprobe station 100 includes achuck 102 that supports a device undertest 104. The device undertest 104 in many instances is one or more photonics devices. Anupper platen 106 defines anopening 108 therein and is positioned above thechuck 102. Theopening 108 may be, for example, completely encircled by theupper platen 106 or a cutout of a portion of theupper platen 106.Electrical probes 110 are supported by theupper platen 106. Theplaten 106 is supported by a plurality of supports 112 a, 112 b, 112 c, and 112 d. Positioned below the supports 112 a-112 d is alower platen 114. Theoptical probes 116 are supported by thelower platen 114. A microscope, not shown, may be used to position the device undertest 104 relative to theprobes upper platen 106 is moved in a z-axis direction to make contact between theelectrical probes 110 and the device undertest 104. The x and/or y position of the chuck 102 (hence the device under test 104) relative to theelectrical probes 110 is modified, and thereafter theupper platen 106 is moved in a z-direction to make contact between theelectrical probes 110 and the device undertest 104. During testing theoptical probes 116 are aligned with the edge of the device undertest 104. - In the case that the device under test is moved in a direction perpendicular to the edge of the device under
test 104 being tested, it may be observed that theoptical probes 116 may not need to be repositioned for each device being tested. If realignment of theoptical probes 116 are necessary, there is a good likelihood that minimal adjustment is necessary. In particular, there is a high likelihood that the elevation of theoptical probe 116 is accurate (or nearly so) because thechuck 102 is moving within a horizontal plane for testing the device undertest 104. It may be observed thatoptical probes 116 are effectively decoupled from the z-axis motion of theupper platen 106. Moreover movement of theupper platen 106 for bringing theelectrical probes 110 into contact with the device undertest 104 does not result in movement of theoptical probe 116 with respect to the device undertest 104. Similarly, it may be observed that movement of theoptical probes 116 does not result in movement of theelectrical probes 110. - As illustrated in
FIG. 7 , it may be observed that there is substantial open space on thelower platen 114 to position the optical probes 116. Further, the open space permits operators to access theoptical probes 116 to make adjustments, as necessary. For example, thelower platen 114 may include at least 70% of its surface area free of other components and structures, such as the chuck and supports, available for the positioning of optical components thereon. More preferably, at least 80%, 85%, 90%, and 95% of the surface area of thelower platen 114 is free of other components and structures. Moreover, from a region defined by the perimeter of the supports, thelower platen 114 has preferably 70%, 80%, 85%, 90%, or 95% of the surface area of the upper platen free from other components and structures thereon in any outward direction, such as +x, −x, +y, or −y directions. This free space more readily permits the attachment of free space optics thereon, which frequently require substantial space and flexibility to set up. The size of theupper platen 106 may have less surface area, the same surface area, or greater surface area than thelower platen 114. For example, the lower platen 114 (e.g., optical platen) may have a surface area that is 25%, 35%, or 50% or more greater than the upper platen 106 (e.g., non-optical platen). This increased surface area of thelower platen 114 relative to theupper platen 106 permits more open access to thelower platen 114 to locate optical components thereon without limitations resulting from the proximityupper platen 106. Preferably thelower platen 114 is a single integral member or otherwise a rigidly interconnected set of members. It is of course to be understood that the system may include more than two platens, as desired. In addition, the electrical components may be located on the lower platen, as desired. Also, the optical components may be located on the upper platen, as desired, which may include holes therein for an optical breadboard if desired. Furthermore, with the upper platen being maintained in position principally by gravity, such that it would become detached from the supports if the probe station were turned up side down, a set of different upper platens may be provided, each of which is designed to be particularly suitable for a particular test. For example, some upper platens may be small, large, oval, rectangular, thin, thick, etc. - Another feature that may be included is the capability of removing or otherwise moving the upper platen out of the way for in a controlled manner. The movement of the upper platen facilitates the adjustment and installation of the optical components thereunder. For example, a mechanical support mechanism may be included that supports the upper platen while the platen is moved with respect to the remainder of the probe station, and in particular the lower platen. For example, the upper platen may be displaced such that at least 20% (or at least 30% or at least 40% or at least 50%) of its surface area is laterally displaced beyond its original position on the supports. Alternatively, the upper platen may be tilted upwardly. For example, the upper platen may be tilted such that it is at least 5 degrees (or at least 10 degrees or at least 20 degrees or at least 45 degrees or at least 75 degrees) of its surface area is tiled with respect to its position when probing, such as horizontal.
- Referring to
FIG. 8 , a modifiedprobe station 200 includes anupper platen 206 supported by a set of upper supports 212 a-212 d. The upper supports 212 a-212 d extend through respective openings 220 a-220 d in alower platen 214 and are supported by abase 222. Thelower platen 214 is supported by a set of supports 224 a-224 d which is supported by thebase 222. The supports 224 a-224 d and the supports 212 a-212 d are preferably adjustable in height. Thechuck 202 extends through anopening 226 in thelower platen 214 and is supported by thebase 222. With this structure, one or moreoptical probes 216 supported by thelower platen 214 may be simultaneously moved in the z-axis direction with respect to a device undertest 204 supported by thechuck 202. Also, one or moreelectrical probes 210 may be simultaneously moved in the z-axis direction with respect to a device undertest 204 supported by thechuck 202. Furthermore, one or moreelectrical probes 210 may be simultaneously moved in the z-axis direction with respect to theoptical probes 216, or vise versa, both of which may be moved relative to the device undertest 204. This permits effective realignment of one or moreoptical probes 216 with respect to the edge of the device undertest 204. In this manner, at least a portion of the alignment of theoptical probes 216 may be performed by the probe station, as opposed to the individual positioners attached to the optical probes 116. It is to be understood that thelower platen 214 is preferably positioned at a location below the device undertest 204 while theupper platen 206 is positioned above the device undertest 204. Also, it is to be understood that thelower platen 214 may be positioned at a location above the device undertest 204 while theupper platen 206 is likewise positioned above the device undertest 204. Also, it is to be understood that thelower platen 214 may be positioned at a location below the device undertest 204 while theupper platen 206 is likewise positioned below the device undertest 204. Moreover, the range of movement of the supports may permit theupper platen 206 and/or thelower platen 214 to be moved from a position above the device undertest 214 to a position below the device undertest 214, or from a position below the device undertest 214 to a position above the device undertest 214. - Referring to
FIG. 9 , a modifiedprobe station 300 includes thechuck 202 being supported by thelower platen 214. In this manner, thechuck 202 and thelower platen 214 will move together in the z-axis. This is beneficial, at least in part, to assist in maintaining the relative alignment between the optical probes and the device under test. - Referring to
FIGS. 7-9 , the lower platen (or the upper platen) may include a set ofopenings 170 defined therein suitable for engaging an optical device. Typically theopenings 170 are arranged in an orthogonal array. Theopenings 170 provide a convenient mechanism for interconnection between the lower platen and the optical probes. - The probe station facilitates the testing of a photonics device that includes an optical test path, which is optimized based upon optical characteristics. In addition, the probe station facilitates the testing of a photonics device that includes an electrical test path, which is similarly optimized based upon electrical characteristics. Typically multiple electrical probes are supported and simultaneously brought into contact with the device under test. In this manner, the probe station includes a structure that brings together optimized electrical test paths and optimized optical test paths together on the device under test.
- Referring to
FIG. 10 , the upper platen 106 (or other platens) is supported by a plurality of supports 350 a-350 d. Preferably theplaten 106 is supported by a set of contacts 352 a-352 d. The contacts 352 a-352 d are preferably not fixedly interconnected with theupper platen 106, but rather maintained in contact by the force of gravity free from a fixed interconnection, such as a screw or bolt. Accordingly, theupper platen 106 may be removed from the supports 350 a-350 d by merely lifting theupper platen 106. A set of interconnectingmembers members upper platen 106 may be lifted from the supports 350 a-350 d, the position of the supports 350 a-350 d and relative spacing thereof modified, and theupper platen 106 repositioned on the supports 350 a-350 d. In addition, amechanical lift mechanism 358 may be included to raise and lower theupper platen 106. Also, the supports 350 a-350 d may include internal height adjustment for z-axis movement. Further, computer controlled lift control mechanisms may likewise be used. Moreover, it may be observed that theupper platen 106 may be moved in the z-axis direction, and in the x and/or y direction by simply moving theupper platen 106. In an alternative embodiment, the supports 350 a-350 d may include horizontal movement structures to move theupper platen 106 in the x and/or y directions. As one example, the horizontal movement structures may be a set of rollers that permit the selective lateral movement of theupper platen 106. - Referring to
FIG. 11 , a substantiallyenclosed environment 400 may be provided around the device under test. The environment may be electrically connected to an earth ground potential, an instrument ground potential, a guard potential, a shield potential, or otherwise remains floating. Anoptical box 402 may be provided within the lower region of the probe station to provide a substantially light tight environment around the device under test, which may be useful for many applications. Theoptical box 402 preferably includes a plurality of sealable openings to permit access to the optical probes. Anelectrical box 404 may be provided within the upper region of the probe station to provide a substantially noise controlled environment around the electrical probes, which may be useful for many applications. Theelectrical box 404 may be electrically connected to an earth ground potential, an instrument ground potential, a guard potential, a shield potential, or otherwise remains floating. - The terms and expressions which have been employed in the foregoing specification are used therein as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding equivalents of the features shown and described or portions thereof, it being recognized that the scope of the invention is defined and limited only by the claims which follow.
Claims (25)
1. A method of probing a device under test comprising:
(a) supporting said device under test on a first support;
(b) supporting an electrical probe on a second support;
(c) supporting an optical probe on a third support; and
(d) moving said electrical probe relative to said device under test in a first direction relative to the surface of said device under test to sense electrical characteristics of said device under test while said optical probe remains substantially aligned with the edge of said device under test to sense optical characteristics of said device under test.
2. The method of claim 1 wherein said first support is a chuck.
3. The method of claim 2 wherein said chuck includes a substantially planar upper surface.
4. The method of claim 1 wherein said second support is a platen positioned above said device under test.
5. The method of claim 4 wherein said platen defines an opening therein though which a portion of said electrical probe extends.
6. The method of claim 1 wherein said first support is located between said second support and said third support.
7. The method of claim 1 wherein said second support and said third support remain stationary with respect to each other while said first support moves relative to said device under test while said moving.
8. The method of claim 1 wherein said first direction is a z-axis direction.
9. The method of claim 1 wherein said electrical probe may be moved independently of said optical probe.
10. A probe station for testing a device under test comprising:
(a) a first platen supporting an electrical probe;
(b) a chuck supporting said device under test;
(c) a second platen supporting an optical probe;
(d) said first platen and said second platen positioned at different elevations from one another and different elevations from said chuck;
(e) said second platen movable relative to said chuck in a perpendicular direction, said first platen movable relative to said chuck in a perpendicular direction;
(e) at least 70% of the top surface of said second platen terminating in free space when said optical probe is not supported thereon.
11. The probe station of claim 10 wherein said first platen and said second platen are movable in a perpendicular direction relative to one another.
12. The probe station of claim 10 wherein at least 80% of the top surface of said second platen terminating in free space when said optical probe is not supported thereon.
13. The probe station of claim 10 wherein at least 90% of the top surface of said second platen terminating in free space when said optical probe is not supported thereon.
14. The probe station of claim 10 wherein at least 95% of the top surface of said second platen terminating in free space when said optical probe is not supported thereon.
15. The probe station of claim 10 wherein said second platen has a greater top surface area than said first platen.
16. The probe station of claim 10 wherein said second platen has a smaller top surface area than said first platen.
17. The probe station of claim 10 wherein said first platen is maintained in position with respect to said second platen by gravity such that if said probe station were turned upside down said first platen would freely fall away from said second platen.
18. A probe station for testing a device under test comprising:
(a) a first platen supporting an electrical probe;
(b) a chuck supporting said device under test;
(c) said first platen is positioned at a different elevation than said device under test;
(d) a movement mechanism laterally displacing said first platen in a controlled manner such that at least 20% of the surface area of said first platen is laterally displaced to a spatial region not previously occupied by said first platen prior to said lateral displacement.
19. The probe station of claim 18 wherein said controlled manner is at least 30% of said surface area.
20. The probe station of claim 18 wherein said controlled manner is at least 40% of said surface area.
21. The probe station of claim 18 wherein said controlled manner is at least 50% of said surface area.
22. A probe station for testing a device under test comprising:
(a) a first platen supporting an electrical probe;
(b) a chuck supporting said device under test;
(c) said first platen is positioned at a different elevation than said device under test;
(d) a movement mechanism angularly displacing said first platen in a controlled manner such that said first platen is tilted at an angle of at least 5 degrees with respect to the angle of said first platen when probing said device under test.
23. The probe station of claim 22 wherein said controlled manner is at least 10 degrees.
24. The probe station of claim 22 wherein said controlled manner is at least 45 degrees.
25. The probe station of claim 22 wherein said controlled manner is at least 75 degrees.
Priority Applications (1)
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US11/975,477 Abandoned US20080042675A1 (en) | 2002-01-25 | 2007-10-19 | Probe station |
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US10/759,481 Expired - Fee Related US7368925B2 (en) | 2002-01-25 | 2004-01-16 | Probe station with two platens |
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US7969173B2 (en) | 2000-09-05 | 2011-06-28 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
US20130125793A1 (en) * | 2011-11-22 | 2013-05-23 | Alex K. Deyhim | Two degrees of freedom optical table |
US11906579B2 (en) | 2019-10-25 | 2024-02-20 | Jenoptik Gmbh | Wafer-level test method for optoelectronic chips |
Also Published As
Publication number | Publication date |
---|---|
US20030141861A1 (en) | 2003-07-31 |
DE10297648T5 (en) | 2005-01-27 |
US7368925B2 (en) | 2008-05-06 |
US6777964B2 (en) | 2004-08-17 |
US20050156610A1 (en) | 2005-07-21 |
WO2003065443A3 (en) | 2003-09-04 |
WO2003065443A2 (en) | 2003-08-07 |
JP2005526380A (en) | 2005-09-02 |
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