US20080112123A1 - Housing of an electrical card - Google Patents
Housing of an electrical card Download PDFInfo
- Publication number
- US20080112123A1 US20080112123A1 US11/558,018 US55801806A US2008112123A1 US 20080112123 A1 US20080112123 A1 US 20080112123A1 US 55801806 A US55801806 A US 55801806A US 2008112123 A1 US2008112123 A1 US 2008112123A1
- Authority
- US
- United States
- Prior art keywords
- frame
- long slot
- metal cover
- housing
- long
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
Definitions
- the invention relates to the field of a RSMMC (Reduced Size MultiMedia Card) memory card, and more particularly to an improvement of a housing of a memory card.
- RSMMC Reduced Size MultiMedia Card
- the RSMMC memory card is frequently used in a mobile phone and is packaged as follows.
- a plastic housing is provided to fix the RSMMC memory card to a substrate, wherein the plastic housing formed by way of injection molding has to keep a predetermined thickness to keep the structure intensity.
- the space and height in the plastic housing are inevitably reduced.
- the dimension of the control IC is also limited so that the control IC with the large size and the higher speed cannot be used and only the thinned and miniaturized control IC can be used.
- this thinned and miniaturized control IC has to be formed using special package processes, so the cost thereof is relatively high, which is disadvantageous to the reduction of the cost of the RSMMC memory card.
- Taiwan Patent No. M256568 and Taiwan patent No. M283292 to this inventor disclose memory card packages each including a frame body and a metal sheet combined together to from an upper cover.
- the portion of the lower cover is formed by directly combining the substrate with the frame body and then forming golden fingers on the other surface of the substrate.
- the accommodating size of the substrate element can be increased, and the mechanical intensity and the distortion-resisting intensity of the housing can be increased.
- the RSMMC memory card together with the housing have the standard size of 24 mm*18 mm.
- the lateral side only has 20 mm after the corner is cut to form the idiot-proof design.
- the control IC of the substrate is placed at the lateral side of the cut corner, and the frame body is directly formed with a slot near the lateral side to accommodate the integrated circuit device (FLASH IC). As shown in Taiwan patent No.
- the slot at the long side of the cut corner can directly accommodate the integrated circuit device disposed on the substrate when the substrate is inserted.
- the slot is formed by injecting the plastic material to cover the metal cover. So, the metal sheet in the slot tends to be depressed due to the provision of the slot.
- the size of the RSMMC chip may vary according to different capacities of the integrated circuit device adopted therein.
- the slot cannot meet the size of most control chips, and the manufacturing processes are also relatively restricted.
- the invention provides the novel housing of the electrical card in the following description.
- the invention provides a housing of an electrical card, which is a RSMMC memory card, wherein the RSMMC memory card together with the housing has a standard size of 24*18 mm. Due to the provision of the idiot-proof bevel, the original length thereof only has 20 mm left.
- the structure of the invention includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding.
- a long slot for accommodating a control chip is formed at a long frame.
- the long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips.
- the bottom of the long slot is formed with through hole slots to be pressed by push needles when the frame is injected to cover the metal sheet. Thus, the structure intensity of the long slot can be increased.
- the other side opposite to the side of the substrate formed with the IC is sealed and fixed to complete the structure of the invention.
- the housing of the electrical card according to the invention utilizes the long slot having the length ranging from 7 to 9 mm to accommodate various types of control chips.
- the structure utilizes the metal cover in conjunction with the lower cover formed by the substrate, so the inner space in the housing can be increased, and the flexibility of using various IC devices can be increased.
- the housing of the invention has the hole slots, which is formed beside the long slot and to be pressed by the push needles, so the structure intensity of the long slot can be effectively increased.
- the housing of the invention can have the better effect and the higher structure intensity than those of the prior art without modifying the original manufacturing processes. So, the cost effectiveness can be enhanced.
- FIG. 1 is a schematic illustration showing an exterior of a metal cover of a housing of an electrical card according to the invention.
- FIG. 2 is a schematic illustration showing the metal cover combined with a frame of the housing of the electrical card according to the invention.
- FIG. 3 is a schematic illustration showing push needles of the housing of the electrical card, which press the metal cover according to the invention.
- FIG. 4 is an exploded schematic illustration showing the metal cover of the housing of the electrical card, which is to be combined with the substrate according to the invention.
- FIG. 5 is a cross-sectional view taken along a line A-A of FIG. 4 .
- an improved housing of an electrical card of this embodiment is used in conjunction with a RSMMC memory card and includes a metal cover 1 and a substrate 2 .
- the metal cover 1 has a periphery formed with an L-shaped protruding plate 10 bent downward.
- a bevel 11 is formed at a corner of the metal cover 1 .
- the bevel 11 has a long lateral side formed with a notched slot 12 without the L-shaped protruding plate 10 .
- a frame 3 is integrally formed to cover the periphery of the metal cover 1 by way of injection molding.
- a bevel 31 corresponding to the bevel 11 is also formed to provide an idiot-proof design to prevent the user from inserting the card incorrectly.
- the frame 3 is formed with a thinner wall surface 32 corresponding to the notched slot 12 of the metal cover 1 at the long lateral side of the bevel 31 .
- the inner side of the wall surface 32 corresponding to the notched slot 12 of the metal cover 1 is formed with a long slot 33 (see FIG. 2 ) at the frame 3 .
- the long slot 33 has the length ranging from 7 to 9 mm in order to match with and accommodate control chips with different sizes.
- hole slots 34 are formed beside the long slot 33 , as shown in FIG. 3 .
- the hole slots 34 can be pressed by push needles 40 during the injection molding process to prevent the metal cover 1 from being depressed. That is, the invention has to match with different kinds of control chips, so the long slot 33 must have the length ranging from 7 to 9 mm. In order to prevent the longer long slot 33 from encountering the problem of the insufficient structure intensity, the invention can obtain the better injection quality according to the pressing of the push needles 40 .
- the substrate 2 is a circuit board having a circuit layout and includes a first surface 20 and a second surface 21 .
- the first surface 20 is formed with various IC elements for the memory card.
- the IC elements include a control chip and an integrated circuit device 22 .
- the second surface 21 of the substrate 2 is formed with a plurality of golden fingers to be electrically connected to other electrical products.
- the first surface 20 of the substrate 2 is placed into the ladder-like support seat formed in the frame 3 and is combined with the support seat.
Abstract
The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a control chip. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The structure intensity of the long slot can be increased by forming through hole slots to be pressed by push needles at the bottom of the long slot when the frame is injected to cover a metal sheet. Then, the substrate formed with the IC is closed and fixed from the other surface. Thus, it is possible to effectively increase the structure intensity of the long slot to improve the function thereof.
Description
- (1) Field of the Invention
- The invention relates to the field of a RSMMC (Reduced Size MultiMedia Card) memory card, and more particularly to an improvement of a housing of a memory card.
- (2) Description of the Prior Art
- Among the current electrical cards, the RSMMC memory card is frequently used in a mobile phone and is packaged as follows. A plastic housing is provided to fix the RSMMC memory card to a substrate, wherein the plastic housing formed by way of injection molding has to keep a predetermined thickness to keep the structure intensity. Thus, under the limitation of the standard thickness of the memory card, the space and height in the plastic housing are inevitably reduced. Thus, the dimension of the control IC is also limited so that the control IC with the large size and the higher speed cannot be used and only the thinned and miniaturized control IC can be used. However, this thinned and miniaturized control IC has to be formed using special package processes, so the cost thereof is relatively high, which is disadvantageous to the reduction of the cost of the RSMMC memory card.
- Taiwan Patent No. M256568 and Taiwan patent No. M283292 to this inventor disclose memory card packages each including a frame body and a metal sheet combined together to from an upper cover. The portion of the lower cover is formed by directly combining the substrate with the frame body and then forming golden fingers on the other surface of the substrate. Thus, when the memory card is packaged, the accommodating size of the substrate element can be increased, and the mechanical intensity and the distortion-resisting intensity of the housing can be increased.
- However, although the above-mentioned two methods improve the prior art problems of the memory card, they neglect the frequently encountered problems of the size of the RSMMC memory card. First, the RSMMC memory card together with the housing have the standard size of 24 mm*18 mm. However, the lateral side only has 20 mm after the corner is cut to form the idiot-proof design. Thus, in order to provide the sufficient accommodating portion for the integrated circuit device during the package processes, the control IC of the substrate is placed at the lateral side of the cut corner, and the frame body is directly formed with a slot near the lateral side to accommodate the integrated circuit device (FLASH IC). As shown in Taiwan patent No. M293292, the slot at the long side of the cut corner can directly accommodate the integrated circuit device disposed on the substrate when the substrate is inserted. However, the slot is formed by injecting the plastic material to cover the metal cover. So, the metal sheet in the slot tends to be depressed due to the provision of the slot. Furthermore, the size of the RSMMC chip may vary according to different capacities of the integrated circuit device adopted therein. However, in order to prevent the intensity of the slot from being too low under the current consideration of the structure, the slot cannot meet the size of most control chips, and the manufacturing processes are also relatively restricted.
- Although other associated references may have different designs and application considerations on the housing of the electrical card, no adaptive design relating to the size of the housing is discussed.
- In view of this, it is an important subject of the invention to provide a housing of an electrical card satisfying various stand electrical cards and having the good intensity to solve the above-mentioned problems. Thus, the invention provides the novel housing of the electrical card in the following description.
- The invention provides a housing of an electrical card, which is a RSMMC memory card, wherein the RSMMC memory card together with the housing has a standard size of 24*18 mm. Due to the provision of the idiot-proof bevel, the original length thereof only has 20 mm left. The structure of the invention includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long slot for accommodating a control chip is formed at a long frame. The long slot has a length ranging from 7 to 9 mm to accommodate various types of control chips. The bottom of the long slot is formed with through hole slots to be pressed by push needles when the frame is injected to cover the metal sheet. Thus, the structure intensity of the long slot can be increased. Then, the other side opposite to the side of the substrate formed with the IC is sealed and fixed to complete the structure of the invention.
- The following features can be obtained after comparing the invention structure with the prior art structure.
- 1. The housing of the electrical card according to the invention utilizes the long slot having the length ranging from 7 to 9 mm to accommodate various types of control chips. In addition, the structure utilizes the metal cover in conjunction with the lower cover formed by the substrate, so the inner space in the housing can be increased, and the flexibility of using various IC devices can be increased.
- 2. The housing of the invention has the hole slots, which is formed beside the long slot and to be pressed by the push needles, so the structure intensity of the long slot can be effectively increased.
- 3. The housing of the invention can have the better effect and the higher structure intensity than those of the prior art without modifying the original manufacturing processes. So, the cost effectiveness can be enhanced.
- Further aspects, objects, and desirable features of the invention will be better understood from the detailed description and drawings that follow in which various embodiments of the disclosed invention are illustrated by way of examples.
-
FIG. 1 is a schematic illustration showing an exterior of a metal cover of a housing of an electrical card according to the invention. -
FIG. 2 is a schematic illustration showing the metal cover combined with a frame of the housing of the electrical card according to the invention. -
FIG. 3 is a schematic illustration showing push needles of the housing of the electrical card, which press the metal cover according to the invention. -
FIG. 4 is an exploded schematic illustration showing the metal cover of the housing of the electrical card, which is to be combined with the substrate according to the invention. -
FIG. 5 is a cross-sectional view taken along a line A-A ofFIG. 4 . - As shown in
FIGS. 1 , 2 and 5, an improved housing of an electrical card of this embodiment is used in conjunction with a RSMMC memory card and includes ametal cover 1 and asubstrate 2. Themetal cover 1 has a periphery formed with an L-shaped protruding plate 10 bent downward. Abevel 11 is formed at a corner of themetal cover 1. Thebevel 11 has a long lateral side formed with anotched slot 12 without the L-shaped protruding plate 10. - A
frame 3 is integrally formed to cover the periphery of themetal cover 1 by way of injection molding. When theframe 3 is formed, abevel 31 corresponding to thebevel 11 is also formed to provide an idiot-proof design to prevent the user from inserting the card incorrectly. Theframe 3 is formed with athinner wall surface 32 corresponding to thenotched slot 12 of themetal cover 1 at the long lateral side of thebevel 31. The inner side of thewall surface 32 corresponding to thenotched slot 12 of themetal cover 1 is formed with a long slot 33 (seeFIG. 2 ) at theframe 3. Thelong slot 33 has the length ranging from 7 to 9 mm in order to match with and accommodate control chips with different sizes. Also, because the provision of thelong slot 33 is to match with thenotched slot 12, thewall surface 32 is not covered with the L-shaped protruding plate 10 for supporting, and the depressed problem may occur during the manufacturing processes. So, in this embodiment,hole slots 34 are formed beside thelong slot 33, as shown inFIG. 3 . Thehole slots 34 can be pressed bypush needles 40 during the injection molding process to prevent themetal cover 1 from being depressed. That is, the invention has to match with different kinds of control chips, so thelong slot 33 must have the length ranging from 7 to 9 mm. In order to prevent the longerlong slot 33 from encountering the problem of the insufficient structure intensity, the invention can obtain the better injection quality according to the pressing of the push needles 40. - Also, in order to increase the covering intensity of the
long slot 33, the lateral side of thelong slot 33 is additionally formed with a covering layer for covering the plane of themetal cover 1. - As shown in
FIG. 4 , thesubstrate 2 is a circuit board having a circuit layout and includes afirst surface 20 and asecond surface 21. Thefirst surface 20 is formed with various IC elements for the memory card. The IC elements include a control chip and anintegrated circuit device 22. Thesecond surface 21 of thesubstrate 2 is formed with a plurality of golden fingers to be electrically connected to other electrical products. - The
first surface 20 of thesubstrate 2 is placed into the ladder-like support seat formed in theframe 3 and is combined with the support seat. - New characteristics and advantages of the invention covered by this document have been set forth in the foregoing description. It is to be expressly understood, however, that the drawings are for the purpose of illustration only and are not intended as a definition of the limits of the invention. Changes in methods, shapes, structures or devices may be made in details without exceeding the scope of the invention by those who are skilled in the art. The scope of the invention is, of course, defined in the language in which the appended claims are expressed.
Claims (4)
1. A housing for an electrical card, which is an RSMMC memory card, the housing comprising:
a metal cover having a periphery integrally formed with a frame by way of injection molding, wherein one corner of the frame is formed with a bevel for preventing the card from being inserted incorrectly, a long side of the bevel is 20 mm, a long frame of the bevel is formed with a long slot for accommodating a control chip, a length of the long slot ranges from 7 to 9 mm, a bottom of the long slot is formed with through hole slots for pressing push needles when the frame is injected to cover metal sheets, so as to increase a structure integrity of the long slot; and
a substrate comprising a first surface and a second surface, wherein the control chip and a passive device are disposed on the first surface, the first surface is packaged into the metal cover and is positioned with and fixed to the frame of the periphery of the metal cover, and a plurality of electrical contacts is formed on the second surface of the substrate.
2. The housing according to claim 1 , wherein the periphery of the metal cover is formed with an L-shaped protruding plate bent downward to increase a combined integrity of the frame and the metal cover.
3. The housing according to claim 2 , wherein the metal cover is formed with a notched slot at a position corresponding to the long slot of the long frame of the bevel.
4. The housing according to claim 3 , wherein a top surface of the frame is formed with a support seat for supporting the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/558,018 US7367817B1 (en) | 2006-11-09 | 2006-11-09 | Housing of an electrical card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/558,018 US7367817B1 (en) | 2006-11-09 | 2006-11-09 | Housing of an electrical card |
Publications (2)
Publication Number | Publication Date |
---|---|
US7367817B1 US7367817B1 (en) | 2008-05-06 |
US20080112123A1 true US20080112123A1 (en) | 2008-05-15 |
Family
ID=39332307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/558,018 Expired - Fee Related US7367817B1 (en) | 2006-11-09 | 2006-11-09 | Housing of an electrical card |
Country Status (1)
Country | Link |
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US (1) | US7367817B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100265671A1 (en) * | 2009-04-16 | 2010-10-21 | Silitek Electronic (Guangzhou) Co., Ltd. | Package structure of printed circuit board and package method thereof |
US20130258576A1 (en) * | 2012-03-29 | 2013-10-03 | Gadi Ben-Gad | Memory Card |
USD732038S1 (en) * | 2014-05-04 | 2015-06-16 | Pierce Schiller | Memory card component |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100083373A (en) * | 2009-01-13 | 2010-07-22 | 삼성전자주식회사 | Memory card |
USD669479S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD669478S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
CN111696927B (en) * | 2020-05-18 | 2023-12-15 | 蔚冰 | Chip packaging frame and chip packaging method |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5339222A (en) * | 1993-04-06 | 1994-08-16 | The Whitaker Corporation | Shielded printed circuit card holder |
US5912806A (en) * | 1996-03-25 | 1999-06-15 | Mitsubishi Denki Kabushiki Kaisha | IC card of simple structure |
US6166913A (en) * | 1997-07-11 | 2000-12-26 | Hon Hai Precision Ind. Co., Ltd. | Casing for PC card |
US6343707B2 (en) * | 2000-04-20 | 2002-02-05 | Tsung-Kan Cheng | Memory card casing |
US6381143B1 (en) * | 1999-12-17 | 2002-04-30 | Kabushiki Kaisha Toshiba | Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts |
US6580615B1 (en) * | 1999-08-24 | 2003-06-17 | Matsushita Electric Industrial Co., Ltd. | Memory card |
US6628252B2 (en) * | 2000-05-12 | 2003-09-30 | Rohm Co., Ltd. | LED drive circuit |
US6719570B2 (en) * | 2001-05-22 | 2004-04-13 | Murata Manufacturing Co., Ltd. | Card-type portable device |
US20040070952A1 (en) * | 2002-10-09 | 2004-04-15 | Renesas Technology Corp. | IC card and an adapter for the same |
US7026546B2 (en) * | 2003-09-17 | 2006-04-11 | Hon Hai Precision Ind. Co., Ltd. | Printed circuit card kit |
US7032827B2 (en) * | 2004-06-18 | 2006-04-25 | Super Talent Electronics, Inc. | Combination SD/MMC flash memory card with thirteen contact pads |
US7177159B2 (en) * | 2004-05-03 | 2007-02-13 | 3 View Technology Co., Ltd. | Packaging structure of electronic card |
-
2006
- 2006-11-09 US US11/558,018 patent/US7367817B1/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5339222A (en) * | 1993-04-06 | 1994-08-16 | The Whitaker Corporation | Shielded printed circuit card holder |
US5912806A (en) * | 1996-03-25 | 1999-06-15 | Mitsubishi Denki Kabushiki Kaisha | IC card of simple structure |
US6166913A (en) * | 1997-07-11 | 2000-12-26 | Hon Hai Precision Ind. Co., Ltd. | Casing for PC card |
US6580615B1 (en) * | 1999-08-24 | 2003-06-17 | Matsushita Electric Industrial Co., Ltd. | Memory card |
US6381143B1 (en) * | 1999-12-17 | 2002-04-30 | Kabushiki Kaisha Toshiba | Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts |
US6343707B2 (en) * | 2000-04-20 | 2002-02-05 | Tsung-Kan Cheng | Memory card casing |
US6628252B2 (en) * | 2000-05-12 | 2003-09-30 | Rohm Co., Ltd. | LED drive circuit |
US6719570B2 (en) * | 2001-05-22 | 2004-04-13 | Murata Manufacturing Co., Ltd. | Card-type portable device |
US20040070952A1 (en) * | 2002-10-09 | 2004-04-15 | Renesas Technology Corp. | IC card and an adapter for the same |
US7026546B2 (en) * | 2003-09-17 | 2006-04-11 | Hon Hai Precision Ind. Co., Ltd. | Printed circuit card kit |
US7177159B2 (en) * | 2004-05-03 | 2007-02-13 | 3 View Technology Co., Ltd. | Packaging structure of electronic card |
US7032827B2 (en) * | 2004-06-18 | 2006-04-25 | Super Talent Electronics, Inc. | Combination SD/MMC flash memory card with thirteen contact pads |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100265671A1 (en) * | 2009-04-16 | 2010-10-21 | Silitek Electronic (Guangzhou) Co., Ltd. | Package structure of printed circuit board and package method thereof |
US20130258576A1 (en) * | 2012-03-29 | 2013-10-03 | Gadi Ben-Gad | Memory Card |
USD732038S1 (en) * | 2014-05-04 | 2015-06-16 | Pierce Schiller | Memory card component |
Also Published As
Publication number | Publication date |
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US7367817B1 (en) | 2008-05-06 |
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Legal Events
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AS | Assignment |
Owner name: SUN-LIGHT ELECTRONIC TECHNOLOGIES INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, CHIN-CHUN;LIU, SHIH-TUNG;REEL/FRAME:018500/0405 Effective date: 20061109 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20120506 |