US20080271914A1 - Printed wiring board and information processing apparatus - Google Patents
Printed wiring board and information processing apparatus Download PDFInfo
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- US20080271914A1 US20080271914A1 US12/168,508 US16850808A US2008271914A1 US 20080271914 A1 US20080271914 A1 US 20080271914A1 US 16850808 A US16850808 A US 16850808A US 2008271914 A1 US2008271914 A1 US 2008271914A1
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- overlapping
- wiring board
- printed wiring
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip, second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip, and interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region.
Description
- This application is a continuation of co-pending U.S. application Ser. No. 11/404,771, filed Apr. 17, 2006, and for which priority is claimed under 35 U.S.C. § 120. This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2005-119579, filed Apr. 18, 2005, the entire contents of both applications are incorporated herein by reference in their entireties.
- 1. Field
- One embodiment of the invention relates to a printed wiring board capable of mounting semiconductor chips on each side thereof, and an information processing apparatus with the printed wiring board.
- 2. Description of the Related Art
- Attention has recently been paid to techniques for mounting electronic components, such as a semiconductor chip and resistor, on a printed circuit. In accordance with the development of size reduction of information processing apparatuses, printed wiring boards for mounting thereon electronic components, such as a semiconductor chip and resistor, have been reduced in size. To reduce the size of the printed wiring boards, electronic components have been subjected to size reduction and/or highly integrated. Further, a double-sided mounting technique for mounting electronic components on both sides of a printed wiring board to further reduce the size of the board has been proposed (see Jpn. Pat. Appln. KOKAI Publication No. 2001-339037).
- A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.
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FIG. 1 is an exemplary schematic perspective view illustrating a personal computer according to an embodiment of the invention; -
FIG. 2 is an exemplary block diagram illustrating the circuit configuration of the personal computer of the embodiment; -
FIG. 3 is an exemplary plan view illustrating the backside of a CPU employed in the embodiment; -
FIG. 4 is an exemplary plan view illustrating the backside of a north bridge employed in the embodiment; -
FIG. 5 is an exemplary view illustrating a state in which the CPU and north bridge are mounted on the respective sides of a printed wiring board; -
FIG. 6 is an exemplary sectional view illustrating a first overlapping region OL_R1 on the printed wiring board, in which the CPU and north bridge overlap with each other; -
FIG. 7 is an exemplary plan view illustrating the backside of a south bridge employed in the embodiment; -
FIG. 8 is an exemplary view illustrating a state in which the south bridge and north bridge are mounted on the respective sides of a printed wiring board; -
FIG. 9 is an exemplary sectional view illustrating a second overlapping region OL_R2 on the printed wiring board, in which the south bridge and north bridge overlap with each other; -
FIG. 10 is an exemplary view illustrating a state in which a connector, into which a memory module is inserted, overlaps with the north bridge; and -
FIG. 11 is an exemplary view illustrating a state in which first and second radiation mechanisms are mounted on the CPU and north bridge, respectively. - Various embodiments according to the invention will be described hereinafter with reference to the accompanying drawings. In general, according to one embodiment of the invention, a printed wiring board comprises, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer; first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip; and interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region.
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FIG. 1 shows an exemplary notebook personal computer as an information processing apparatus according to the embodiment of the invention. - As shown, the personal computer comprises a computer proper 12 and
display unit 14. - The
display unit 14 is attached to the computer proper 12 by hinges (support sections) 18 provided on the rear end of the computer proper 12. Thedisplay unit 14 can pivot about the hinges between a closed position in which it covers the upper surface of the computer proper 12, and an open position in which the upper surface of the computer proper 12 is exposed. Thedisplay unit 14 incorporates a liquid crystal display (LCD)panel 16 for displaying, on its display area, an image in accordance with a panel-driving signal. - The computer proper 12 has a box-shaped case, and a
keyboard 20 is provided at the central portion of the upper surface of the case. A palm rest is provided at the front portion of the upper surface of the case. Amouse pointer 22 andcontrol button 26 for moving a pointer displayed on theLCD 16 are provided on the substantially central portion of the palm rest. Apower button 28 for turning on/off the computer proper 12 is provided on the lower frame portion of thedisplay unit 14. - As shown in
FIG. 2 , the personal computer comprises a central processing unit (CPU) 102,north bridge 104,main memory 114,graphics controller 108, BIOS-ROM 136, hard disk drive (HDD) 126 and embedded-controller/keyboard-controller IC (EC/KBC) 112. - The
CPU 102 is a processor for controlling the operation of the computer proper 12, and is configured to execute an operating system (OS) and various application programs read from the HDD 126 and loaded into themain memory 114. - Further, the
CPU 102 reads a basic input output system (BIOS) from the BIOS-ROM 136, then loads it into themain memory 114, and executes it. The system BIOS is a program for hardware control. - The
north bridge 104 is a bride device that connects the local bus of theCPU 102 to thesouth bridge 106. Thenorth bridge 104 also incorporates a memory controller for controlling access to themain memory 114. Thenorth bridge 104 also has a function for communicating with thegraphics controller 108 via, for example, a bus. - The
graphics controller 108 is a display controller for controlling theLCD 16 used as the display monitor of the computer. Thegraphics controller 108 includes a video memory (VRAM), and generates a video signal, indicating a display image to be displayed on theLCD 16, from display data stored in the video memory using the OS/application program. The video signal generated by thegraphics controller 108 is output to aline 1. - The EC/KBC 112 performs control for turning on/off the computer in accordance with the
power button 28. The EC/KBC 112 controls the keyboard (KB) 20,mouth point 22 andcontrol button 26 under the control of theCPU 102. - A Packaging of the
CPU 102,north bridge 104 and southbridge 106 is ball grid array package with solder balls. When theCPU 102, for example, is mounted on a printed wiring board, theCPU 102 is placed on pads arranged two-dimensionally on the printed wiring board, and then fixed thereon using the solder balls melted and re-solidified by reflowing. - More specifically, as shown in
FIG. 3 , a packaging of theCPU 102 is a ball grid array package with solder balls (terminals) 102A that are arranged two-dimensionally. Further, as shown inFIG. 4 , a packaging of thenorth bridge 104 is a ball grid array package with solder balls (terminals) 104A that are arranged two-dimensionally. - Part of the
solder balls 102A of theCPU 102 shown inFIG. 3 are connected to part of thesolder balls 104A of thenorth bridge 104 shown inFIG. 4 via a special high-speed bus (not shown). In the embodiment, theCPU 102 is mounted on the obverse side of a printedwiring board 200 in a first region R1 defined thereon, and thenorth bridge 104 is mounted on the reverse side of the printedwiring board 200 in a second region R2 defined thereon and overlapping with the first region R1, as is shown inFIG. 5 . To shorten the length of the high-speed bus (wiring) connecting theCPU 102 to thenorth bridge 104, at least part of thesolder balls 102A of theCPU 102 and at least part of thesolder balls 104A of thenorth bridge 104 are located within a first overlapping region OL_R1 in which the first and second regions R1 and R2 overlap with each other. - Since at least part of the
solder balls 102A for connection and at least part of thesolder balls 104A for connection are thus located in the first overlapping region OL_R1, the wiring can be shortened. In general, to prevent signal delay, a high-speed bus including a plurality of signal lines needs to be subjected to wiring length matching for making the lengths of the wires fall within an allowable range. If the CPU and north bridge do not overlap with each other, the matching reference wiring length is 100 mm, and the matching allowable range is ±10 mm. Accordingly, the lengths of the wires must be adjusted to 90 to 110 mm. In general, the wires must be adjusted for wiring length matching, which inevitably increases the area required for wiring. - In the embodiment, since the wires have short lengths, the matching reference wiring length is 10 mm. If the matching allowable range is set to the same value, i.e., ±10 mm, as in the case where the matching reference wiring length is 100 mm, it is sufficient if the lengths of the wires are adjusted to 0 to 20 mm. Thus, the required wiring area and hence the required printed wiring board area can be reduced.
- To reduce the wiring area, it is preferable to mount the
CPU 102 andnorth bridge 104 so that at least part of thesolder balls 102A overlap with at least part of thesolder balls 104A. -
FIG. 6 shows the cross section of the first overlapping area OL_R1. TheCPU 102 is mounted, via thesolder balls 102A, on a plurality offirst pads 201 provided on the printedwiring board 200, whereby thesolder balls 102A are electrically connected to thefirst pads 201. A first wiring layer (surface wiring layer) 202 is provided on the surface of the printedwiring board 200. Thefirst pads 201 are electrically connected to portions of thefirst wiring layer 202. Thefirst pads 201 andfirst wiring layer 202 are formed on afirst insulation substrate 203. - The
first insulation substrate 203 contains first blind via plugs (first interlayer wiring) 204 connected to thefirst pads 201 orfirst wiring layer 202. Thefirst insulation substrate 203 is formed on asecond insulation substrate 205. A second wiring layer (first interlayer wiring) 206 is interposed between thefirst insulation substrate 203 and thesecond insulation substrate 205. Portions of thesecond wiring layer 206 are connected to the first blind viaplugs 204. - First buried via plugs (first interlayer wiring) 207 connected to the
second wiring layer 206 are formed in thesecond insulation substrate 205. Thesecond insulation substrate 205 is provided on abase insulation substrate 208 with a third wiring layer (first interlayer wiring) 209 interposed therebetween. Part of thethird wiring layer 209 is connected to the first buried viaplugs 207. A fourth wiring layer (first interlayer wiring) 210 is provided on the reveres surface of thebase insulation substrate 208. Base via plugs (first interlayer wiring) 211 that connect thethird wiring layer 209 to thefourth wiring layer 210 are provided in thebase insulation substrate 208. Thebase insulation substrate 208 is provided on athird insulation substrate 212. - Second buried via plugs (first interlayer wiring) 213 connected to portions of the
fourth wiring layer 210 are provided in thethird insulation substrate 212. A fifth wiring layer (first interlayer wiring) 214 is provided on the reverse side of thethird insulation substrate 212. Portions of thefifth wiring layer 214 are connected to the second buried viaplugs 213. Thethird insulation layer 212 is provided on afourth insulation substrate 215 with thefifth wiring layer 214 interposed therebetween. - Second blind via plugs (first interlayer wiring) 216 are formed in the
fourth insulation substrate 215. The second blind viaplugs 216 are connected to portions of thefifth wiring layer 214. A plurality ofsecond pads 217 and a sixth wiring layer (reverse wiring layer) 218 are provided on the reverse side of thefourth insulation substrate 215. Thenorth bridge 104 are mounted on thesecond pads 217. First and second coating layers 219 and 220 are provided on the obverse and reverse sides of the printedwiring board 200, respectively. - As shown in
FIG. 6 , in the first overlapping region OL_R1, at least part of thefirst pads 201 are electrically connected to at least part of thesecond pads 217 via thefirst wiring layer 202, first blind viaplugs 204,second wiring layer 206, first buried viaplugs 207,third wiring layer 209, base viaplugs 211,fourth wiring layer 210,fifth wiring layer 209, second buried viaplugs 213,fifth wiring layer 214, second blind viaplugs 216 andsixth wiring layer 218. - Further, at least in the overlapping region OL_R1, the
first pads 201 are connected to the first blind viaplugs 204 directly or via thefirst wiring layer 202, and connected to no through via plugs. Similarly, at least in the overlapping region OL_R1, thesecond pads 217 are connected to the second blind viaplugs 216 directly or via thesixth wiring layer 218, and connected to no through via plugs. - As shown in
FIG. 6 , the printed wiring board of the embodiment has a stacked structure. In a conventional printed wiring board using through via plugs, semiconductor chips of different pitches cannot be mounted on the respective sides of a board so that they overlap with each other. In contrast, in the embodiment using the printedwiring board 200 of a stacked structure, semiconductor chips of different pitches can be mounted on the respective sides of the board so that they overlap with each other. - A description will now be given of a structure for further reducing the required area of the printed
wiring board 200. - The
north bridge 104 is connected to thesouth bridge 106 as shown inFIG. 2 . More specifically, part ofsolder balls 106A provided two-dimensionally on the reverse side of the south bridge (third semiconductor chip) 106 and shown inFIG. 7 are electrically connected via a dedicated high-speed bus to part of thesolder balls 104A of thenorth bridge 104 shown inFIG. 4 . Subsequently, thesouth bridge 106 is mounted on the printedwiring board 200 in a third region R3 defined thereon and overlapping with thenorth bridge 104, as is shown inFIG. 8 . To reduce the length of a high-speed bus (wiring) connecting the north andsouth bridges solder balls 104A of thenorth bridge 104 and at least part of thesolder balls 106A of thesouth bridge 106 are located in a second overlapping region OL_R2 in which the second and third regions R2 and R3 overlap with each other. By virtue of this structure, the lengths of the wires can be reduced. -
FIG. 9 shows the cross section of the second overlapping area OL_R2. InFIGS. 6 and 9 , like reference numeral denote like elements, and no detailed description is given thereof. - As shown in
FIG. 9 , thesouth bridge 106 is connected via thesolder balls 106A tothird pads 231 provided on the printed wiring board. In the second overlapping region OL_R2, at least part of thefirst pads 201 are electrically connected to at least part of thethird pads 231 via thefirst wiring layer 202, first blind viaplugs 204,second wiring layer 206, first buried viaplugs 207,third wiring layer 209, base viaplugs 211,fourth wiring layer 210,fifth wiring layer 209, second buried viaplugs 213,fifth wiring layer 214, second blind viaplugs 216 andsixth wiring layer 218. - Further, as shown in
FIG. 2 , thenorth bridge 104 is electrically connected to themain memory 114. Themain memory 114 is formed of a memory module acquired by mounting a memory chip on the board. When the memory module is inserted in a connector mounted on the printedwiring board 200, it is electrically connected to the north bridge. - As shown in
FIG. 10 , aconnector 300, into which the memory module is inserted, is mounted on the printedwiring board 200 in a fourth region R4 that overlaps with the second region R2 of thenorth bridge 104. In a third overlapping region OL_R3 in which thenorth bridge 104 overlaps with theconnector 300, at least part of thesolder balls 104A of thenorth bridge 104 are electrically connected to at least part of the terminals of theconnector 300. By virtue of this structure, the wires can be shortened. -
FIG. 11 shows a case where afirst radiation mechanism 401 andsecond radiation mechanism 402 are attached to theCPU 102 andnorth bridge 104 that have high calorific power, respectively. The printedwiring board 200 has afirst attachment hole 403 for attaching thefirst radiation mechanism 401, asecond attachment hole 403 for attaching thesecond radiation mechanism 402, and athird attachment hole 405 for attaching the first andsecond radiation mechanisms third attachment hole 405 is a common hole for fixing the first andsecond radiation mechanisms second radiation mechanisms - While certain embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (18)
1. A printed wiring board comprising:
a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer;
first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip and with a first pitch;
second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip and with a second pitch that differs from the first pitch; and
interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region.
2. The printed wiring board according to claim 1 , wherein the interlayer wiring is formed of blind via plugs.
3. The printed wiring board according to claim 1 , further comprising a connector provided on the obverse side in a third region defined thereon and overlapping the second region, another printed wiring board with a fourth semiconductor chip mounted thereon being inserted in the connector.
4. The printed wiring board according to claim 1 , wherein:
first and second semiconductor chips are ball grid array packages; and
the first semiconductor chip is connected to the first pads, and the second semiconductor chip is connected to the second pads.
5. An information processing apparatus comprising:
a processing unit including first terminals arranged with a first pitch;
a bridge circuit chip including second terminals arranged with a second pitch that differs from second pitch; and
a printed wiring board,
the printed wiring board including:
a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer;
first pads provided on the obverse side in a first region and to be connected to the first terminals arranged on a surface of the processing unit;
second pads provided on the reverse side in a second region overlapping with the first region, and to be connected to the second terminals arranged on a surface of the bridge circuit chip; and
interlayer wiring electrically connecting those ones of the first pads, which are located in an overlapping region, to those ones of the second pads which are located in the overlapping region.
6. The information processing apparatus according to claim 5 , wherein the main body has a stacked structure.
7. The information processing apparatus according to claim 5 , wherein the interlayer wiring is formed of blind via plugs.
8. The information processing apparatus according to claim 5 , further comprising a connector provided on the obverse side in a third region defined thereon and overlapping the second region, a memory module being inserted in the connector.
9. The information processing apparatus according to claim 5 , wherein the processing unit and bridge circuit chip are ball grid array packages.
10. A printed wiring board comprising:
a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer;
first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip;
second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip;
interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region;
third pads provided on the reverse side in a third region defined thereof and overlapping with the first region, the third pads to be connected to terminals arranged on a lower surface of a third semiconductor chip; and
other interlayer wiring electrically connecting those of the second pads, which are located in another overlapping region, to those of the third pads which are located in said another overlapping region, the second and third regions overlapping with each other in said another overlapping region.
11. The printed wiring board according to claim 10 , further comprising a connector provided on the obverse side in a fourth region defined thereon and overlapping the second region, another printed wiring board with a fourth semiconductor chip mounted thereon being inserted in the connector.
12. The printed wiring board according to claim 10 , wherein the interlayer wiring is formed of blind via plugs.
13. The printed wiring board according to claim 10 , wherein:
first and second semiconductor chips are ball grid array packages; and
the first semiconductor chip is connected to the first pads, and the second semiconductor chip is connected to the second pads.
14. An information processing apparatus comprising:
a processing unit including first terminals;
a bridge circuit chip including second terminals; and
a printed wiring board,
the printed wiring board including:
a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer;
first pads provided on the obverse side in a first region and to be connected to the first terminals arranged on a surface of the processing unit;
second pads provided on the reverse side in a second region overlapping with the first region, and to be connected to the second terminals arranged on a surface of the bridge circuit chip;
interlayer wiring electrically connecting those ones of the first pads, which are located in an overlapping region, to those ones of the second pads which are located in the overlapping region;
another bridge circuit chip including third terminals;
third pads provided on the reverse side in a third region defined thereof and overlapping with the first region, the third pads to be connected to the third terminals of said another bridge circuit chip; and
other interlayer wiring electrically connecting those of the second pads, which are located in another overlapping region, to those of the third pads which are located in said another overlapping region, the second and third regions overlapping with each other in said another overlapping region.
15. The information processing apparatus according to claim 14 , further comprising a connector provided on the obverse side in a fourth region defined thereon and overlapping the second region, a memory module being inserted in the connector.
16. The information processing apparatus according to claim 14 , wherein the main body has a stacked structure.
17. The information processing apparatus according to claim 14 , wherein the interlayer wiring is formed of blind via plugs.
18. The information processing apparatus according to claim 14 , wherein the processing unit and bridge circuit chip are ball grid array packages.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/168,508 US20080271914A1 (en) | 2005-04-18 | 2008-07-07 | Printed wiring board and information processing apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005119579A JP2006303003A (en) | 2005-04-18 | 2005-04-18 | Printed board and information processing apparatus |
JP2005-119579 | 2005-04-18 | ||
US11/404,771 US7453704B2 (en) | 2005-04-18 | 2006-04-17 | Printed wiring board and information processing apparatus |
US12/168,508 US20080271914A1 (en) | 2005-04-18 | 2008-07-07 | Printed wiring board and information processing apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/404,771 Continuation US7453704B2 (en) | 2005-04-18 | 2006-04-17 | Printed wiring board and information processing apparatus |
Publications (1)
Publication Number | Publication Date |
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US20080271914A1 true US20080271914A1 (en) | 2008-11-06 |
Family
ID=37107708
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/404,771 Expired - Fee Related US7453704B2 (en) | 2005-04-18 | 2006-04-17 | Printed wiring board and information processing apparatus |
US12/168,508 Abandoned US20080271914A1 (en) | 2005-04-18 | 2008-07-07 | Printed wiring board and information processing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/404,771 Expired - Fee Related US7453704B2 (en) | 2005-04-18 | 2006-04-17 | Printed wiring board and information processing apparatus |
Country Status (2)
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US (2) | US7453704B2 (en) |
JP (1) | JP2006303003A (en) |
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Also Published As
Publication number | Publication date |
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JP2006303003A (en) | 2006-11-02 |
US20060231912A1 (en) | 2006-10-19 |
US7453704B2 (en) | 2008-11-18 |
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