US20090255659A1 - Protective cap for thermal grease of heat sink - Google Patents

Protective cap for thermal grease of heat sink Download PDF

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Publication number
US20090255659A1
US20090255659A1 US12/206,966 US20696608A US2009255659A1 US 20090255659 A1 US20090255659 A1 US 20090255659A1 US 20696608 A US20696608 A US 20696608A US 2009255659 A1 US2009255659 A1 US 2009255659A1
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US
United States
Prior art keywords
heat sink
cover plate
thermal grease
protective cap
strengthening ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/206,966
Inventor
Li-Fu Xu
Ning-Yu Wang
Zhi-Guo Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, NING-YU, XU, LI-FU, ZHANG, Zhi-guo
Publication of US20090255659A1 publication Critical patent/US20090255659A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/02—Safety or protection arrangements; Arrangements for preventing malfunction in the form of screens or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the present invention relates to a heat sink having a removable protective cap for enclosing thermal grease on the heat sink.
  • a heat sinks is typically used to dissipate heat generated by a central processing unit (CPU).
  • Thermal grease may be applied to a bottom surface of the heat sink before being mounted to a CPU module to improve heat conductivity between the heat sink and the CPU module.
  • thermal grease cannot be directly applied to the heat sink in advance because it is not solid at ambient temperature, may contaminate surrounding articles, or be contaminated by dust or foreign particles before the heat sink is mounted to the CPU module.
  • a removable protective cap for enclosing thermal grease disclosed in U.S. Pat. No. 6,049,458, includes a periphery removably attached to a bottom surface of a heat sink around the thermal grease, and a middle protrusion defining a cavity receiving the thermal grease.
  • the protective caps are commonly made of plastic and may twist under pressure, and press against the thermal grease, affecting the heat conductivity between the heat sink and the CPU module.
  • FIG. 1 is an isometric view of an embodiment of a protective cap for enclosing thermal grease on a heat sink;
  • FIG. 2 is an assembled, isometric view of the protective cap mounted on the heat sink of FIG. 1 ;
  • FIG. 3 is a sectional view of the protective cap enclosing thermal grease on the heat sink of FIG. 1 , taken along line III-III.
  • FIG. 1 is an isometric view of an embodiment of a protective cap 30 for thermal grease 15 applied on a heat sink 10 .
  • the heat sink 10 includes a metallic base plate 11 and a plurality of metallic heat dissipating fins 14 positioned on a top face of the base plate 11 .
  • a bottom face 113 is configured to contact a heat source.
  • the thermal grease 15 is spread on a middle portion of the bottom face 113 . Corners of the base plate 11 have no thermal grease.
  • Two heat pipes 13 are positioned between the base plate 11 and the heat dissipating fins 14 .
  • the protective cap 30 includes a cover plate 31 having a shape similar to a shape of the bottom face 113 .
  • a side plate 32 extends from the perimeter of the cover plate 31 .
  • the cover plate 31 and the side plate 32 cooperatively form a cavity to cover the base plate 11 .
  • a plurality of strengthening ribs 33 are formed at corners of the cover plate 31 and extend to an inside space of the cavity to connect with the side plate 32 .
  • the strengthening ribs 33 are configured to contact the bottom face 113 to prevent the thermal grease 15 from being pressed against the cover plate 31 .
  • a plurality of cutouts 321 is defined in the sidewall to allow the protective cap 30 to fit over heat pipes 13 positioned between the base plate 11 and the heat dissipating fins.
  • two cutouts are defined in two opposite walls of the side plate 32 corresponding to the heat pipes 13 .
  • a height of the strengthening ribs 33 is larger than a height of the thermal grease 15
  • a width of the cutouts 321 is slightly less than a width of the heat pipes 13 .
  • the protective cap 30 is pressed onto the base plate 11 until the heat pipes 13 are received in the cutouts 321 and the strengthening ribs 33 resist the bottom face 113 .
  • the strengthening ribs 33 prevent the thermal grease 15 from being pressed against the cover plate 31 .

Abstract

A protective cap for use with a heat sink, includes a cover plate for enclosing thermal grease on the heat sink, and a plurality of strengthening ribs positioned on the cover plate. The strengthening ribs resist the heat sink to prevent the thermal grease from being pressed against the cover plate.

Description

    BACKGROUND
  • 1. Technical Field
  • The present invention relates to a heat sink having a removable protective cap for enclosing thermal grease on the heat sink.
  • 2. Description of Related Art
  • A heat sinks is typically used to dissipate heat generated by a central processing unit (CPU). Thermal grease may be applied to a bottom surface of the heat sink before being mounted to a CPU module to improve heat conductivity between the heat sink and the CPU module. However, thermal grease cannot be directly applied to the heat sink in advance because it is not solid at ambient temperature, may contaminate surrounding articles, or be contaminated by dust or foreign particles before the heat sink is mounted to the CPU module. A removable protective cap for enclosing thermal grease, disclosed in U.S. Pat. No. 6,049,458, includes a periphery removably attached to a bottom surface of a heat sink around the thermal grease, and a middle protrusion defining a cavity receiving the thermal grease. The protective caps are commonly made of plastic and may twist under pressure, and press against the thermal grease, affecting the heat conductivity between the heat sink and the CPU module.
  • Therefore, a new protective cap for thermal grease of a heat sink is desired to overcome the above-described deficiencies.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of an embodiment of a protective cap for enclosing thermal grease on a heat sink;
  • FIG. 2 is an assembled, isometric view of the protective cap mounted on the heat sink of FIG. 1; and
  • FIG. 3 is a sectional view of the protective cap enclosing thermal grease on the heat sink of FIG. 1, taken along line III-III.
    •  DETAILED DESCRIPTION OF THE EMBODIMENTS
  • FIG. 1 is an isometric view of an embodiment of a protective cap 30 for thermal grease 15 applied on a heat sink 10. The heat sink 10 includes a metallic base plate 11 and a plurality of metallic heat dissipating fins 14 positioned on a top face of the base plate 11. A bottom face 113 is configured to contact a heat source. The thermal grease 15 is spread on a middle portion of the bottom face 113. Corners of the base plate 11 have no thermal grease. Two heat pipes 13 are positioned between the base plate 11 and the heat dissipating fins 14.
  • The protective cap 30 includes a cover plate 31 having a shape similar to a shape of the bottom face 113. A side plate 32 extends from the perimeter of the cover plate 31. The cover plate 31 and the side plate 32 cooperatively form a cavity to cover the base plate 11. A plurality of strengthening ribs 33 are formed at corners of the cover plate 31 and extend to an inside space of the cavity to connect with the side plate 32. The strengthening ribs 33 are configured to contact the bottom face 113 to prevent the thermal grease 15 from being pressed against the cover plate 31. In one embodiment, a plurality of cutouts 321 is defined in the sidewall to allow the protective cap 30 to fit over heat pipes 13 positioned between the base plate 11 and the heat dissipating fins. In the illustrated embodiment, two cutouts are defined in two opposite walls of the side plate 32 corresponding to the heat pipes 13. In one embodiment, a height of the strengthening ribs 33 is larger than a height of the thermal grease 15, and a width of the cutouts 321 is slightly less than a width of the heat pipes 13.
  • Referring also to FIGS. 2 and 3, the protective cap 30 is pressed onto the base plate 11 until the heat pipes 13 are received in the cutouts 321 and the strengthening ribs 33 resist the bottom face 113. The strengthening ribs 33 prevent the thermal grease 15 from being pressed against the cover plate 31.
  • It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (10)

1. A protective cap for enclosing thermal grease spread on a base plate of a heat sink, comprising:
a cover plate; and
a plurality of strengthening ribs formed on the cover plate to resist the heat sink for preventing the thermal grease from being pressed against the cover plate.
2. The protective cap of claim 1, wherein a side plate extends from a perimeter of the cover plate, the cover plate and the side plate cooperatively form a cavity to cover the base plate; the strengthening ribs extend to an inside space of the cavity.
3. The protective cap of claim 2, wherein the strengthening ribs extend to connect with the side plate.
4. The protective cap of claim 1, wherein the strengthening ribs are positioned at corners of the cover plate.
5. A heat sink for dissipating heat generated by a heat source, comprising:
a base plate having a bottom face and configured to contact the heat source;
thermal grease applied on the bottom face; and
a protective cap for enclosing thermal grease comprising a cover plate and a plurality of strengthening ribs positioned on the cover plate to resist the bottom face for preventing the thermal grease from being pressed against the cover plate.
6. The heat sink of claim 5, wherein a side plate extends from a perimeter of the cover plate, the cover plate and the side plate cooperatively form a cavity to cover the base plate; the strengthening ribs extend to an inside space of the cavity.
7. The heat sink of claim 6, wherein the strengthening ribs extend to connect with the side plate.
8. The heat sink of claim 6, further comprising a plurality of heat pipes positioned on a top face of the base plate; the side plate comprises a plurality of cutouts corresponding to the plurality of heat pipes; the plurality of heat pipes are received in the cutouts to fix the protective cap onto the heat sink.
9. The heat sink of claim 5, wherein the cover plate has a shape similar to a shape of the bottom face, the strengthening ribs are positioned at corners of the cover plate; the thermal grease is spread in a middle portion of the bottom face.
10. The heat sink of claim 5, wherein a height of the strengthening ribs is larger than a height of the thermal grease.
US12/206,966 2008-04-14 2008-09-09 Protective cap for thermal grease of heat sink Abandoned US20090255659A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008103011286A CN101562964B (en) 2008-04-14 2008-04-14 Heat-conducting medium protecting cover and heating abstractor with the protecting cover
CN200810301128.6 2008-04-14

Publications (1)

Publication Number Publication Date
US20090255659A1 true US20090255659A1 (en) 2009-10-15

Family

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Family Applications (1)

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US (1) US20090255659A1 (en)
CN (1) CN101562964B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116107A1 (en) * 2006-11-22 2008-05-22 Cooler Master Co., Ltd. Protective cover
US20090231814A1 (en) * 2008-03-11 2009-09-17 Tai-Sol Electronics Co., Ltd. Protective cap for thermal grease
US20090321048A1 (en) * 2008-06-25 2009-12-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20140008050A1 (en) * 2011-03-25 2014-01-09 Koninklijke Philips N.V. Thermal interface pad material with perforated liner
US20220361363A1 (en) * 2017-05-18 2022-11-10 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111263552B (en) * 2020-02-05 2020-12-29 环胜电子(深圳)有限公司 Adapter card module with protective cover

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US5549411A (en) * 1993-09-24 1996-08-27 Csr Limited Manhole cover frame spacing arrangement
US5897917A (en) * 1996-06-21 1999-04-27 Thermalloy, Inc. Pre-application of grease to heat sinks with a protective coating
US6029740A (en) * 1997-12-19 2000-02-29 Hon Hai Precision Ind. Co., Ltd. Protective cap for heat conducting medium
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US20020163076A1 (en) * 2001-04-05 2002-11-07 Jin-Wen Tzeng Isolated thermal interface
US6935420B1 (en) * 2004-06-16 2005-08-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20060042787A1 (en) * 2004-08-25 2006-03-02 Foxconn Technology Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon
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US20080137301A1 (en) * 2006-12-09 2008-06-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7589969B2 (en) * 2006-04-12 2009-09-15 Inventec Corporation Folding protective cover for heat-conductive medium
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US7813132B2 (en) * 2008-04-28 2010-10-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US7918267B2 (en) * 2007-05-23 2011-04-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon
US7980297B2 (en) * 2007-09-06 2011-07-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having protective device for thermal interface material spread thereon

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CN2678129Y (en) * 2004-02-04 2005-02-09 珍通科技股份有限公司 Protection device for heat conduction medium of radiator
CN2800705Y (en) * 2005-05-29 2006-07-26 富准精密工业(深圳)有限公司 Protective cover and heat radiator with same
CN2884533Y (en) * 2005-12-16 2007-03-28 英业达股份有限公司 Heat conductive medium protective cap with reinforced structure
CN200990753Y (en) * 2006-10-26 2007-12-12 讯凯国际股份有限公司 Thermal conducting medium protection cover

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* Cited by examiner, † Cited by third party
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US5549411A (en) * 1993-09-24 1996-08-27 Csr Limited Manhole cover frame spacing arrangement
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US5897917A (en) * 1996-06-21 1999-04-27 Thermalloy, Inc. Pre-application of grease to heat sinks with a protective coating
US6049458A (en) * 1997-12-01 2000-04-11 Hon Hai Precision Ind. Co., Ltd. Protective cap for thermal grease of heat sink
US6029740A (en) * 1997-12-19 2000-02-29 Hon Hai Precision Ind. Co., Ltd. Protective cap for heat conducting medium
US20020163076A1 (en) * 2001-04-05 2002-11-07 Jin-Wen Tzeng Isolated thermal interface
US7051790B2 (en) * 2003-12-19 2006-05-30 Asia Vital Component Co., Ltd. Protect cover for a radiator
US7068514B2 (en) * 2004-02-18 2006-06-27 Cpumate Inc. Protection structure for thermal conducting medium of heat dissipation device
US6935420B1 (en) * 2004-06-16 2005-08-30 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
US20060042787A1 (en) * 2004-08-25 2006-03-02 Foxconn Technology Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon
US7063136B2 (en) * 2004-08-25 2006-06-20 Hon Hai Precision Industry Co., Ltd Heat dissipation device having cap for protecting thermal interface material thereon
US20060124643A1 (en) * 2004-12-15 2006-06-15 Markert Brooks R Dispensing cover with tear strip and living hinge
US20060232936A1 (en) * 2005-04-15 2006-10-19 Chung Wu Protective cover for heat-conductive material of heat sink
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US7365983B2 (en) * 2005-05-24 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Grease protecting apparatus for heat sink
US20070006992A1 (en) * 2005-07-08 2007-01-11 Tay-Jian Liu Loop-type heat exchange module
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US20070012421A1 (en) * 2005-07-15 2007-01-18 Yeu-Lih Lin Grease protecting apparatus for heat sink
US20070217161A1 (en) * 2006-03-16 2007-09-20 Foxconn Technology Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US7554807B2 (en) * 2006-03-16 2009-06-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US7319592B2 (en) * 2006-04-11 2008-01-15 Inventec Corporation Recyclable protective cover for a heat-conductive medium
US7589969B2 (en) * 2006-04-12 2009-09-15 Inventec Corporation Folding protective cover for heat-conductive medium
US7623350B2 (en) * 2006-07-31 2009-11-24 Compal Electronics, Inc. Thermal conducting medium protector
US20080105411A1 (en) * 2006-11-08 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080137301A1 (en) * 2006-12-09 2008-06-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7394656B1 (en) * 2006-12-09 2008-07-01 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US7918267B2 (en) * 2007-05-23 2011-04-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon
US7980297B2 (en) * 2007-09-06 2011-07-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having protective device for thermal interface material spread thereon
US7813132B2 (en) * 2008-04-28 2010-10-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116107A1 (en) * 2006-11-22 2008-05-22 Cooler Master Co., Ltd. Protective cover
US20090231814A1 (en) * 2008-03-11 2009-09-17 Tai-Sol Electronics Co., Ltd. Protective cap for thermal grease
US20090321048A1 (en) * 2008-06-25 2009-12-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20140008050A1 (en) * 2011-03-25 2014-01-09 Koninklijke Philips N.V. Thermal interface pad material with perforated liner
US10049959B2 (en) * 2011-03-25 2018-08-14 Philips Lighting Holding B.V. Thermal interface pad material with perforated liner
US20220361363A1 (en) * 2017-05-18 2022-11-10 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine
US11882669B2 (en) 2017-05-18 2024-01-23 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine
US11895802B2 (en) * 2017-05-18 2024-02-06 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine

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Publication number Publication date
CN101562964B (en) 2013-01-09
CN101562964A (en) 2009-10-21

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AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XU, LI-FU;WANG, NING-YU;ZHANG, ZHI-GUO;REEL/FRAME:021500/0465

Effective date: 20080902

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XU, LI-FU;WANG, NING-YU;ZHANG, ZHI-GUO;REEL/FRAME:021500/0465

Effective date: 20080902

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION