US20100137964A1 - Medical electrical lead joints and methods of manufacture - Google Patents
Medical electrical lead joints and methods of manufacture Download PDFInfo
- Publication number
- US20100137964A1 US20100137964A1 US12/627,052 US62705209A US2010137964A1 US 20100137964 A1 US20100137964 A1 US 20100137964A1 US 62705209 A US62705209 A US 62705209A US 2010137964 A1 US2010137964 A1 US 2010137964A1
- Authority
- US
- United States
- Prior art keywords
- layer
- fluoropolymer
- section
- insulative
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/056—Transvascular endocardial electrode systems
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/05—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
- B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined
- B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
- B29C66/324—Avoiding burr formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/52—Joining tubular articles, bars or profiled elements
- B29C66/526—Joining bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5344—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
- B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73115—Melting point
- B29C66/73116—Melting point of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
- B29C66/91933—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined higher than said fusion temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
- B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0216—Two layers
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/007—Forming single grooves or ribs, e.g. tear lines, weak spots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/10—Surface shaping of articles, e.g. embossing; Apparatus therefor by electric discharge treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/10—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
- B29K2027/16—PVDF, i.e. polyvinylidene fluoride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
- B29K2027/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2627/00—Use of polyvinylhalogenides or derivatives thereof for preformed parts, e.g. for inserts
- B29K2627/12—Use of polyvinylhalogenides or derivatives thereof for preformed parts, e.g. for inserts containing fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2627/00—Use of polyvinylhalogenides or derivatives thereof for preformed parts, e.g. for inserts
- B29K2627/12—Use of polyvinylhalogenides or derivatives thereof for preformed parts, e.g. for inserts containing fluorine
- B29K2627/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2023/00—Tubular articles
- B29L2023/005—Hoses, i.e. flexible
- B29L2023/007—Medical tubes other than catheters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3462—Cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/753—Medical equipment; Accessories therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Abstract
A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The insulative sidewall, of the subassembly, and the second section, of the interfacial layer, are each formed from a material that is not a fluoropolymer. A recess is formed in the first section of the interfacial layer and the second section of the interfacial layer extends within the recess.
Description
- This application claims the benefit of U.S. Provisional Application No. 61/118,601, filed on Nov. 29, 2008. The disclosure of the above application is incorporated herein by reference.
- The present disclosure pertains to medical electrical leads and more particularly to joints thereof, which include fluoropolymers.
- Fluoropolymer materials, such as polytetrafluoroethylene (PTFE) and Ethylene Tetrafluoroethylene (ETFE), have been used in the construction of medical electrical leads, for example, to provide lubricious and insulative layers surrounding one or more conductors of the leads. The lubricity of fluoropolymers can provide benefits for both the manufacturing of the leads and for some functional aspects of the leads, as is well known to those skilled in the art. However, fluoropolymer materials can present some challenges for lead construction, for example, in forming sufficiently strong and relatively low profile joints between these materials and other, non-fluoropolymer, materials, which form other insulative members of the leads, for example, included in connector and/or electrode subassemblies of the leads. In U.S. patent application Ser. No. 11/549,284 filed Oct. 13, 2006 discloses one mechanism for providing such joints.
- The invention relates to medical electrical leads of the type comprising an elongate conductor, an inner insulative layer formed from a first material, typically surrounding the conductor, and an insulative sidewall member formed from a second material mounted thereabout. A conductive member such as an electrode or an electrical connector is typically mounted about the insulative sidewall. In the disclosed embodiments, one of the first and second materials is a fluoropolymer and the other is not. The invention comprises methods and mechanisms for providing a joint between the inner insulative layer and the insulative sidewall of the subassembly.
- Like the joint described in the above-cited Boser application, the joint is formed by an interfacial layer extending between an outer surface of the inner insulative layer and an inner surface of the insulative sidewall. In these embodiments, the interfacial layer comprises a first section being formed from a third material and being bonded to the outer surface of the inner insulative layer and a second section extending adjacent the first section and being bonded to the inner surface of the insulative sidewall of the subassembly. One of the third and fourth materials comprises a thermoplastic fluoropolymer, and other does not. The respective fluoropolymer materials are bonded to one another as are the respective non-fluoropolymer materials.
- In the context of the present invention, the first section includes an outer surface, facing the inner surface of the insulative sidewall, and having least one groove formed in the outer surface of the first section. The second section in such embodiments extends within the at least one groove. Bonding according to the invention may comprise any known bonding technique, including adhesive bonding, thermal bonding, and the like.
- In the specific embodiments discussed below, the inner insulative layer and the first section of the interfacial layer are formed of fluoropolymers and the insulative sidewall and the second section of the interfacial layer are formed of non-fluoropolymers. However, the arrangement may also be reversed, with the inner insulative layer and the first section of the interfacial layer formed of non-fluoropolymers and the insulative sidewall and the second section of the interfacial layer formed of fluoropolymers.
- The following drawings are illustrative of particular embodiments and, therefore, do not limit the scope of the invention. The drawings are not to scale (unless so stated) and are intended for use in conjunction with the explanations in the following detailed description. Embodiments will hereinafter be described in conjunction with the appended drawings, wherein like numerals denote like elements.
-
FIG. 1 is a plan view of a medical electrical lead, including cut-away sections showing a joints of the lead, according to the present invention. -
FIGS. 2A-D are schematics outlining a sequence of steps for manufacturing a joint, according to a preferred embodiment of the invention. - The following detailed description is exemplary in nature and is not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the following description provides practical illustrations for implementing exemplary embodiments. Examples of constructions, materials, dimensions, and manufacturing processes are provided for selected elements, and all other elements employ that which is known to those of skill in the field of the disclosure. Those skilled in the art will recognize that many of the examples provided have suitable alternatives that can be utilized.
-
FIG. 1 is a plan view of a medical electrical lead 100, including cut-away sections showing anexemplary joint 170 according to a preferred embodiment.FIG. 1 illustrates lead 100 including a lead body 109 extending between aproximal connector assembly 120 and adistal electrode assembly 130 including an insulativetubular sidewall 132 carryingring electrode 135 and housing anhelix electrode 146. With further reference toFIG. 1 , those skilled in the art will appreciate that aconductor 105couples helix electrode 146 to apin contact 106, which is shown extending proximally fromconnector assembly 120, and that two more conductors (not shown) extend within lead body 109 tocouple electrode 135 and electrode 155 to corresponding conductiveelectrical contacts electrodes -
FIG. 1 further illustratesconductor 105 extending within an innerinsulative layer 110, which, according to some embodiments, is formed from single or multiple layers of a fluoropolymer material, for example, PTFE or ETFE, which are both available in tubing form, for medical device applications, from Zeus Industrial Products, Inc. (Orangeburg, S.C.); innerinsulative layer 110 is joined toelectrode assembly 130, via ajoint 170.Joint 170 is formed by an interfacial layer that extends over a length between an outer surface of innerinsulative layer 110 and an inner surface of the corresponding insulative sidewall ofelectrode head member 132.Insulative sidewall 132 is formed by a material that does not comprise a fluoropolymer, examples of which include, without limitation, implantable medical grade polyurethanes and silicone rubbers, which are well known to those skilled in the art, combinations of polyurethane and silicone, for example, PurSil® available from The Polymer Technology Group, Inc, and implantable grade polyetheretherketone (PEEK) high-performance thermoplastic, for example, Invibio® PEEK-OPTIMA® for the medical industry. The interfacial layer of each ofjoint 170 includes at least two sections, one section compatible for bonding to innerinsulative layer 110 and the other section for bonding to insulative sidewall 122. According to some preferred embodiments, innerinsulative layer 110 is a tubular member, forming a relatively lubricious liner forconductor 105 to be slideable therein, so thatconductor 105 can be used to translate torque frompin contact 106 tohelix electrode 146, in order to extend and retracthelix electrode 146. -
Joint 170 is shown between electrode head assembly and innerinsulative layer 110.FIG. 1 illustrates the interfacial layer that forms joint 170 including afirst section 171, which is bonded to innerinsulative layer 110 and at least onegroove 107 formed in an outer surface thereof;first section 171 is formed from a thermoplastic fluoropolymer material.FIG. 1 further illustrates the interfacial layer including asecond section 172, which extends adjacentfirst section 171 and withingroove 107;second section 172, is formed from a material that may not comprise a fluoropolymer, and is compatible for bonding with the inner surface ofinsulative sidewall 132. According to the preferred embodiments, in which innerinsulative layer 110 is a tubular member,first section 171 extends about a portion of, or an entirety of the circumference of innerinsulative layer 110, andgroove 107 extends likewise, for example, as a single groove, along a helical path about the circumference and along a length offirst section 171, or as a plurality of grooves, extending about the circumference offirst section 171, and being spaced apart from one another along the length offirst section 171. (Groove 107 may be better seen inFIG. 2C .) The walls of the groove or recess may be canted (non-perpendicular to the axis of the lead body) to improve interlock or tensile holding force. This geometry may also improve the seal between the layers. - Suitable commercially available thermoplastic fluoropolymer materials, from which
first section 171 may be formed, include, without limitation, fluorinated ethylene propylene (FEP) and perfluoroalkoxy copolymer (PFA), for example, available from DuPont™ under the trade name Teflon®, polyvinylidene fluoride (PVDF), such as KYNAR® available from Arkema, Inc. (Philadelphia, Pa.), and terpolymer of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride (THV); each of these materials are available in tubing form from Zeus Industrial Products, Inc. (Orangeburg, S.C.). According to some exemplary embodiments,first section 171, is thermally bonded to innerinsulative layer 110, for example, via a heated die, mold or hot air fixturing, but welding methods, such as laser or ultrasonic welding are contemplated forbonding sections 171 to innerinsulative layer 110, as is adhesive bonding. Suitable materials from whichsecond section 172 may be formed, depend upon the material forminginsulative sidewall 132 to whichsecond section 172 is bonded. According to somepreferred embodiments sidewall 132 is formed from a relatively rigid implantable grade polyurethane material, for example, having a 75 D durometer, and the correspondingsecond section 172 is also formed from a polyurethane material.Second section 172 may be bonded tosidewalls 132 via either thermal or adhesive bonding. Bonding methods for bothfirst section 171 andsecond section 172 of the interfacial layer ofjunction 170 are described in greater detail below, in conjunction withFIGS. 2A-D . - Turning now to
FIGS. 2A-D , a method for forming a joint according to joint 170 shown inFIG. 1 will be described.FIGS. 2A-D are schematics outlining a sequence of steps for manufacturing a joint 380, which is formed by an interfacial layer betweeninsulative sidewall 132 ofelectrode subassembly 130 andinner insulative layer 110, according to some embodiments and methods.FIG. 2A illustrates an initial assembly of asection 371 ontoinner insulative layer 110 for thermal bonding thereto.FIG. 2B illustrates the thermally bondedsection 371 within a formingfixture 307, which is shown schematically by the dashed lines.FIG. 2C illustratesfirst section 171 of the interfacial layer, having been formed fromsection 371, via formingfixture 307, to includegroove 107, andsecond section 172 of the interfacial layer being deposited intogroove 107.FIG. 2D illustratesinsulative sidewall 132 ofelectrode subassembly 130 placed about first andsecond sections inner sidewall 110 andsubassembly 130. - With reference to
FIG. 2A , according to some embodiments,section 371 is initially formed as a tube, andinner insulative layer 110, also tubular, is inserted into a lumen ofsection 371, prior to thermal bonding. A temporary containment member, shown by dashed lines ofFIG. 2A , may be employed in the bonding process. With reference toFIG. 2A , according to some embodiments,first section 371 is initially formed as a tube, andinner insulative layer 110, also tubular, is inserted into a lumen offirst section 371, prior to thermal bonding, which bonding is performed by inserting the initial assembly into a die cavity which is subsequently heated to a temperature sufficient to meltfirst section 371, so thatfirst section 371 bonds toinner insulative layer 110. According to some methods, a temporary containment member, shown with dashed lines inFIG. 2A , for example, a band formed from silicone or another suitable material having a melt temperature higher than that offirst section 371, is assembled aroundfirst section 371 oninner insulative layer 110, for the thermal bonding process, in order to contain the molten material offirst section 371, during and/or following thermal bonding. Once the assembly has cooled, the containment member is removed. - According to some exemplary embodiments,
inner insulative layer 110 is a PTFE tube, having a wall thickness between approximately 0.003 inch and approximately 0.004 inch, andfirst section 371 is an FEP tube having a wall thickness between approximately 0.002 inch and approximately 0.004 inch and a length between approximately 0.04 inch and approximately 0.05 inch. A melt temperature for PTFE is approximately 620° F. and a melt temperature for FEP is in the range of approximately 500° F. to approximately 545° F., thus a suitable temperature for thermal bonding, according to these exemplary embodiments, is between approximately 550° F. and approximately 600° F. According to a laboratory method, which was used to prepare evaluation samples, a silicone tube, having an approximately 0.006 inch wall thickness, was employed as the temporary containment member, described above, so that a temperature of a thermal bonding die cavity, was set to approximately 800° F. and held for a time of approximately 16 seconds in order to thermally bond FEP first sections to underlying PTFE tubes. - According to
FIGS. 2B-C , following the thermal bonding,section 371 is transformed intofirst section 171, by forminggroove 107 in an outer surface ofsection 371. With reference toFIG. 2B ,section 371, having been bonded toinner insulative layer 110, is inserted into formingfixture 307, for example, a die whose cavity includes an undulating surface to interface with the outer surface ofsection 371. According to the exemplary embodiments, whereininner insulative layer 110 is formed from PTFE, having a thickness of between approximately 0.003 inch and approximately 0.004 inch, andsection 371 is formed from FEP, having a thickness between approximately 0.002 inch and approximately 0.004 inch, the die offixture 307 is brought to a temperature of approximately 485° F. for a time of approximately 16 seconds to formgroove 107. According to alternate methods, a single heated die, including the undulating surface to formgroove 107, may be used to boththermally bond section 371 toinner insulative layer 110 and to formgroove 107 in the outer surface ofsection 371, for example, by employing those time and temperature parameters described above for the aforementioned exemplary materials and wall thicknesses. - With reference to
FIG. 2C , it may be appreciated thatgroove 107 follows a helical path about a circumference offirst section 171; however, according to alternate embodiments,first section 171 includes a plurality of individual grooves spaced apart from one another along a length of thereof. According to some exemplary embodiments, a length offirst section 171 is between approximately 0.06 inch and approximately 0.08 inch, a depth of groove 107 (or of each groove of the alternate plurality of grooves) is between approximately 0.002 inch and approximately 0.004 inch, and a width ofgroove 107 is between approximately 0.003 inch and approximately 0.007 inch. Either a plasma or corona surface treatment, known to those skilled in the art, or other surface treatments that improve ‘bondability’, may be applied to the outer surface offirst section 171, prior to the dispensing of the material formingsecond section 172, which is illustrated inFIG. 2C . Such a treatment may modify the surface ofgroove 107 to enhance bonding with the material formingsecond section 172. According to the illustrated embodiment,second section 172 is in adhesive form and applied with asyringe 30, after which first andsecond sections second section 172 flush with that offirst section 171 between the turns ofgroove 107, prior to curingsecond section 172. As an alternative to dispensinglayer 172, the layer can also be overmolded intolayer 171. Also, as an option, layer 132 (outer insulation or proximal sleevehead) can be combined and molded or reflowed intolayer 172's groove/recess features. - Once
second section 172 has cured, joint 170 may be completed, as illustrated inFIG. 2D , by applying adhesive 37 between the inner surface ofinsulation sidewall 132 and outer surfaces ofsections sections sidewall 132, prior to applyingadhesive 37. According to some exemplary embodiments, whereinsecond section 172 andsidewall 132 are both formed from a polyurethane material, adhesive 37, and the optional primer, are also formed from a polyurethane material, which forms a relatively strong bond therebetween, and a weaker bond betweenfirst section 171 andsidewall 132. As an alternative to adhesive 37, a thermal bonding method is contemplated for forming a bond betweensecond section 172 of the interfacial layer andinsulative sidewall 132, for example, in a manner previously described; a welding method, either laser or ultrasonic, is also contemplated as an alternative. It should be noted, that for some manufacturing methods, one or more intermediate steps may be taken between the step illustrated byFIG. 2C and that byFIG. 2D . For example, conductors (not shown) forcoupling electrodes 135 and 155 (FIG. 1 ) may be assembled aroundinner insulative layer 110, and at least the conductor forcoupling electrode 135 may be routed throughassembly 130 to meet withelectrode 135, prior to the step illustrated byFIG. 2D . - In the foregoing detailed description, the invention has been described with reference to specific embodiments. However, it may be appreciated that various modifications and changes can be made without departing from the scope of the invention as set forth in the appended claims. For example, the mechanism for providing the joint 170 may also be applied to couple the
inner insulative layer 110 to the outer insulative portion sidewall of theconnector assembly 120 as illustrated inFIG. 1 .
Claims (14)
1. A medical electrical lead, comprising:
an elongate conductor;
an inner insulative layer surrounding the conductor, the inner insulative layer formed from a first material;
a subassembly including an insulative sidewall formed from a second material and a conductive member mounted about the insulative sidewall, and the conductive member including an exposed electrical contact surface; and
a joint between the inner insulative layer and the insulative sidewall of the subassembly, the joint formed by an interfacial layer extending between an outer surface of the inner insulative layer and an inner surface of the insulative sidewall, the interfacial layer comprising:
a first section formed from a third material bonded the outer surface of the inner insulative layer; and
a second section formed from a fourth material and being bonded to the inner surface of the insulative sidewall of the subassembly; and
wherein one of the first and second materials comprises a fluoropolymer and the other does not; wherein one of the third and fourth materials comprises a fluoropolymer; and wherein the one of the third and fourth materials comprising a fluoropolymer is bonded to the one of the first and second materials which comprises a fluoropolymer; and
wherein the first section includes an outer surface facing the inner surface of the insulative sidewall, and at least one recess formed in the outer surface of the first section and the second section extends adjacent the first section and within the at least one recess.
2. The lead of claim 1 , wherein the inner insulative layer comprises a tubular member, the conductor being slideable therein.
3. The lead of claim 1 , wherein the conductive member comprises a connector contact.
4. The lead of claim 1 , wherein the exposed electrical contact surface of the conductive sidewall of the subassembly comprises an electrode.
5. The lead of claim 1 , wherein the second material and the fourth material are substantially the same.
6. The lead of claim 1 , wherein the fourth material forming the second section of the interfacial layer comprises an adhesive.
7. The lead of claim 1 , wherein the recess comprises at least one groove of the first section of the interfacial layer comprises a plurality of recesses.
8. The lead of claim 1 , wherein the recess comprises at least one groove of the first section of the interfacial layer extends along a helical path
9. A method for manufacturing a joint in a medical electrical lead, the joint being between an inner surface of an insulative sidewall of the lead and an outer surface of a fluoropolymer layer, the subassembly comprising a conductive member mounted about the insulative sidewall, and the conductive member including an exposed electrical contact surface; the method comprising:
thermally bonding a thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer;
assembling another material layer over the outer surface of the fluoropolymer layer and adjacent to the thermoplastic fluoropolymer layer; and
adhesively bonding the other material layer to the inner surface of the insulative sidewall of the subassembly;
wherein the other material layer and the insulative sidewall of the subassembly are formed from a material that does not comprise a fluoropolymer.
10. The method of claim 9 , wherein:
the fluoropolymer layer and the other material layer are tubular; and
assembling the other material layer over the outer surface of the fluoropolymer layer comprises inserting the tubular fluoropolymer layer into a lumen of the tubular other material layer such that an edge of the other material layer abuts an edge of the thermally bonded thermoplastic fluoropolymer layer.
11. The method of claim 9 , wherein the fluoropolymer layer and the thermoplastic fluoropolymer layer are tubular and further comprising:
inserting the tubular fluoropolymer layer into a lumen of the tubular thermoplastic fluoropolymer layer, prior to thermally bonding; and
assembling a temporary containment member about the tubular thermoplastic fluoropolymer layer and the tubular fluoropolymer layer, prior to thermally bonding.
12. The method of claim 9 , further comprising:
forming at least one recess in an outer surface of the thermally bonded thermoplastic fluoropolymer layer; and
wherein assembling the other material layer over the outer surface of the fluoropolymer layer and adjacent to the thermoplastic fluoropolymer layer comprises placing the other material layer within the at least one recess.
13. The method of claim 9 , further comprising:
forming at least one recess in an outer surface of the thermoplastic fluoropolymer layer in conjunction with thermally bonding the thermoplastic fluoropolymer layer; and
wherein assembling the other material layer over the outer surface of the fluoropolymer layer and adjacent to the thermoplastic fluoropolymer layer comprises placing the other material layer within the at least one recess.
14. The method of claim 9 , further comprising:
forming at least one recess in an outer surface of the thermoplastic fluoropolymer layer; and
wherein the other material layer comprises an adhesive; and
assembling the other material layer over the outer surface of the fluoropolymer layer and adjacent to the thermoplastic fluoropolymer layer comprises injecting the adhesive into the at least one recess.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/627,052 US20100137964A1 (en) | 2008-11-29 | 2009-11-30 | Medical electrical lead joints and methods of manufacture |
US15/231,485 US10535446B2 (en) | 2008-11-29 | 2016-08-08 | Medical electrical lead joints and methods of manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11860108P | 2008-11-29 | 2008-11-29 | |
US12/627,052 US20100137964A1 (en) | 2008-11-29 | 2009-11-30 | Medical electrical lead joints and methods of manufacture |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/231,485 Continuation US10535446B2 (en) | 2008-11-29 | 2016-08-08 | Medical electrical lead joints and methods of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100137964A1 true US20100137964A1 (en) | 2010-06-03 |
Family
ID=42223519
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/627,052 Abandoned US20100137964A1 (en) | 2008-11-29 | 2009-11-30 | Medical electrical lead joints and methods of manufacture |
US15/231,485 Active 2031-09-21 US10535446B2 (en) | 2008-11-29 | 2016-08-08 | Medical electrical lead joints and methods of manufacture |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/231,485 Active 2031-09-21 US10535446B2 (en) | 2008-11-29 | 2016-08-08 | Medical electrical lead joints and methods of manufacture |
Country Status (1)
Country | Link |
---|---|
US (2) | US20100137964A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110634614A (en) * | 2019-10-30 | 2019-12-31 | 江苏亨通线缆科技有限公司 | Photoelectric composite cable for 5G base station |
US11458300B2 (en) | 2018-12-28 | 2022-10-04 | Heraeus Medical Components Llc | Overmolded segmented electrode |
Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4481953A (en) * | 1981-11-12 | 1984-11-13 | Cordis Corporation | Endocardial lead having helically wound ribbon electrode |
US4549684A (en) * | 1983-02-25 | 1985-10-29 | Telly Gary R | Ultrasonic welding system and method employing a reduced number of power supplies |
US4603705A (en) * | 1984-05-04 | 1986-08-05 | Mieczyslaw Mirowski | Intravascular multiple electrode unitary catheter |
US5105826A (en) * | 1990-10-26 | 1992-04-21 | Medtronic, Inc. | Implantable defibrillation electrode and method of manufacture |
US5174288A (en) * | 1990-11-30 | 1992-12-29 | Medtronic, Inc. | Method and apparatus for cardiac defibrillation |
US5271417A (en) * | 1990-01-23 | 1993-12-21 | Cardiac Pacemakers, Inc. | Defibrillation electrode having smooth current distribution |
US5522872A (en) * | 1994-12-07 | 1996-06-04 | Ventritex, Inc. | Electrode-conductor sleeve joint for cardiac lead |
US5676694A (en) * | 1996-06-07 | 1997-10-14 | Medtronic, Inc. | Medical electrical lead |
US5728149A (en) * | 1995-12-20 | 1998-03-17 | Medtronic, Inc. | Integral spiral band electrode for transvenous defibrillation leads |
US5928277A (en) * | 1998-02-19 | 1999-07-27 | Medtronic, Inc. | One piece defibrillation lead circuit |
US5935159A (en) * | 1996-12-19 | 1999-08-10 | Medtronic, Inc. | Medical electrical lead |
US5957970A (en) * | 1998-02-18 | 1999-09-28 | Medtronic, Inc. | Method of fabricating a medical electrical lead |
US6016436A (en) * | 1997-09-26 | 2000-01-18 | Medtronic, Inc. | Medical electrical lead |
US6038463A (en) * | 1997-09-26 | 2000-03-14 | Medtronic, Inc. | Medical electrical lead |
US6038472A (en) * | 1997-04-29 | 2000-03-14 | Medtronic, Inc. | Implantable defibrillator and lead system |
US6052625A (en) * | 1998-11-09 | 2000-04-18 | Medtronic, Inc. | Extractable implantable medical lead |
US6061595A (en) * | 1999-01-04 | 2000-05-09 | Pacesetter, Inc. | Laser spot weld winding to connector joint |
US6181971B1 (en) * | 1998-12-09 | 2001-01-30 | Pacesetter, Inc. | Joining conductor cables and electrodes on a multi-lumen lead body |
US6259954B1 (en) * | 1999-02-18 | 2001-07-10 | Intermedics Inc. | Endocardial difibrillation lead with strain-relief coil connection |
US6289251B1 (en) * | 1999-11-01 | 2001-09-11 | Medtronic, Inc. | High strength medical electrical lead |
US6615695B1 (en) * | 2000-06-27 | 2003-09-09 | Medtronic, Inc. | Alternative fabrication method for spiral electrodes |
US6697675B1 (en) * | 2001-06-14 | 2004-02-24 | Pacesetter, Inc. | Laser welded joint for implantable lead |
US6704604B2 (en) * | 2000-12-28 | 2004-03-09 | Medtronic, Inc. | System and method for promoting selective tissue in-growth for an implantable medical device |
US6801809B2 (en) * | 2000-02-22 | 2004-10-05 | Medtronic, Inc. | Extractable implantable medical lead |
US6813521B2 (en) * | 2001-04-17 | 2004-11-02 | Medtronic, Inc. | Medical electrical lead |
US6920361B2 (en) * | 2003-02-14 | 2005-07-19 | Medtronic, Inc. | Reverse wound electrodes |
US20050240252A1 (en) * | 2004-04-23 | 2005-10-27 | Medtronic, Inc. | Novel medical device conductor junctions |
US7031777B2 (en) * | 2002-09-27 | 2006-04-18 | Medtronic, Inc. | Cardiac vein lead with flexible anode and method for forming same |
US7130700B2 (en) * | 2002-11-19 | 2006-10-31 | Medtronic, Inc. | Multilumen body for an implantable medical device |
US7277762B2 (en) * | 2000-10-17 | 2007-10-02 | Belden Elisabeth L | Radiopague marking of lead electrode zone in a continuous conductor construction |
US20070276458A1 (en) * | 2004-04-23 | 2007-11-29 | Boser Gregory A | Novel medical device conductor junctions |
US20080057784A1 (en) * | 2006-08-31 | 2008-03-06 | Cardiac Pacemakers, Inc. | Lead assembly including a polymer interconnect and methods related thereto |
US7474924B2 (en) * | 2003-11-20 | 2009-01-06 | Medtronic, Inc. | Junction for medical electrical leads |
US20090012591A1 (en) * | 2007-07-05 | 2009-01-08 | Advanced Bionics Corporation | Lead with contacts formed by coiled conductor and methods of manufacture and use |
US7512447B2 (en) * | 2005-04-25 | 2009-03-31 | Medtronic, Inc. | Medical electrical electrodes with conductive polymer |
US20090318999A1 (en) * | 2008-06-20 | 2009-12-24 | Hall Peter C | Methods and devices for joining cables |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5569218A (en) | 1994-02-14 | 1996-10-29 | Scimed Life Systems, Inc. | Elastic guide catheter transition element |
US6245053B1 (en) | 1998-11-09 | 2001-06-12 | Medtronic, Inc. | Soft tip guiding catheter and method of fabrication |
US6152914A (en) | 1999-01-22 | 2000-11-28 | Medtronic, Inc. | Catheter having a multiple locking mechanism |
US6500285B2 (en) | 1999-08-23 | 2002-12-31 | Scimed Life Systems, Inc. | Method of making a catheter having interlocking ribbed bond regions |
-
2009
- 2009-11-30 US US12/627,052 patent/US20100137964A1/en not_active Abandoned
-
2016
- 2016-08-08 US US15/231,485 patent/US10535446B2/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4481953A (en) * | 1981-11-12 | 1984-11-13 | Cordis Corporation | Endocardial lead having helically wound ribbon electrode |
US4549684A (en) * | 1983-02-25 | 1985-10-29 | Telly Gary R | Ultrasonic welding system and method employing a reduced number of power supplies |
US4603705A (en) * | 1984-05-04 | 1986-08-05 | Mieczyslaw Mirowski | Intravascular multiple electrode unitary catheter |
US5271417A (en) * | 1990-01-23 | 1993-12-21 | Cardiac Pacemakers, Inc. | Defibrillation electrode having smooth current distribution |
US5105826A (en) * | 1990-10-26 | 1992-04-21 | Medtronic, Inc. | Implantable defibrillation electrode and method of manufacture |
US5174288A (en) * | 1990-11-30 | 1992-12-29 | Medtronic, Inc. | Method and apparatus for cardiac defibrillation |
US5522872A (en) * | 1994-12-07 | 1996-06-04 | Ventritex, Inc. | Electrode-conductor sleeve joint for cardiac lead |
US5728149A (en) * | 1995-12-20 | 1998-03-17 | Medtronic, Inc. | Integral spiral band electrode for transvenous defibrillation leads |
US5676694A (en) * | 1996-06-07 | 1997-10-14 | Medtronic, Inc. | Medical electrical lead |
US5935159A (en) * | 1996-12-19 | 1999-08-10 | Medtronic, Inc. | Medical electrical lead |
US6038472A (en) * | 1997-04-29 | 2000-03-14 | Medtronic, Inc. | Implantable defibrillator and lead system |
US6016436A (en) * | 1997-09-26 | 2000-01-18 | Medtronic, Inc. | Medical electrical lead |
US6038463A (en) * | 1997-09-26 | 2000-03-14 | Medtronic, Inc. | Medical electrical lead |
US5957970A (en) * | 1998-02-18 | 1999-09-28 | Medtronic, Inc. | Method of fabricating a medical electrical lead |
US5928277A (en) * | 1998-02-19 | 1999-07-27 | Medtronic, Inc. | One piece defibrillation lead circuit |
US6256542B1 (en) * | 1998-11-09 | 2001-07-03 | Medtronic, Inc. | Extractable implantable medical lead |
US6052625A (en) * | 1998-11-09 | 2000-04-18 | Medtronic, Inc. | Extractable implantable medical lead |
US6181971B1 (en) * | 1998-12-09 | 2001-01-30 | Pacesetter, Inc. | Joining conductor cables and electrodes on a multi-lumen lead body |
US6061595A (en) * | 1999-01-04 | 2000-05-09 | Pacesetter, Inc. | Laser spot weld winding to connector joint |
US6259954B1 (en) * | 1999-02-18 | 2001-07-10 | Intermedics Inc. | Endocardial difibrillation lead with strain-relief coil connection |
US6289251B1 (en) * | 1999-11-01 | 2001-09-11 | Medtronic, Inc. | High strength medical electrical lead |
US6801809B2 (en) * | 2000-02-22 | 2004-10-05 | Medtronic, Inc. | Extractable implantable medical lead |
US6615695B1 (en) * | 2000-06-27 | 2003-09-09 | Medtronic, Inc. | Alternative fabrication method for spiral electrodes |
US7277762B2 (en) * | 2000-10-17 | 2007-10-02 | Belden Elisabeth L | Radiopague marking of lead electrode zone in a continuous conductor construction |
US6704604B2 (en) * | 2000-12-28 | 2004-03-09 | Medtronic, Inc. | System and method for promoting selective tissue in-growth for an implantable medical device |
US6813521B2 (en) * | 2001-04-17 | 2004-11-02 | Medtronic, Inc. | Medical electrical lead |
US6697675B1 (en) * | 2001-06-14 | 2004-02-24 | Pacesetter, Inc. | Laser welded joint for implantable lead |
US7031777B2 (en) * | 2002-09-27 | 2006-04-18 | Medtronic, Inc. | Cardiac vein lead with flexible anode and method for forming same |
US7130700B2 (en) * | 2002-11-19 | 2006-10-31 | Medtronic, Inc. | Multilumen body for an implantable medical device |
US6920361B2 (en) * | 2003-02-14 | 2005-07-19 | Medtronic, Inc. | Reverse wound electrodes |
US7474924B2 (en) * | 2003-11-20 | 2009-01-06 | Medtronic, Inc. | Junction for medical electrical leads |
US20050240252A1 (en) * | 2004-04-23 | 2005-10-27 | Medtronic, Inc. | Novel medical device conductor junctions |
US20070276458A1 (en) * | 2004-04-23 | 2007-11-29 | Boser Gregory A | Novel medical device conductor junctions |
US20090254162A1 (en) * | 2004-04-23 | 2009-10-08 | Gore Enterprise Holdings, Inc. | Novel Medical Device Conductor Junctions |
US7512447B2 (en) * | 2005-04-25 | 2009-03-31 | Medtronic, Inc. | Medical electrical electrodes with conductive polymer |
US20080057784A1 (en) * | 2006-08-31 | 2008-03-06 | Cardiac Pacemakers, Inc. | Lead assembly including a polymer interconnect and methods related thereto |
US20090012591A1 (en) * | 2007-07-05 | 2009-01-08 | Advanced Bionics Corporation | Lead with contacts formed by coiled conductor and methods of manufacture and use |
US20090318999A1 (en) * | 2008-06-20 | 2009-12-24 | Hall Peter C | Methods and devices for joining cables |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11458300B2 (en) | 2018-12-28 | 2022-10-04 | Heraeus Medical Components Llc | Overmolded segmented electrode |
CN110634614A (en) * | 2019-10-30 | 2019-12-31 | 江苏亨通线缆科技有限公司 | Photoelectric composite cable for 5G base station |
Also Published As
Publication number | Publication date |
---|---|
US10535446B2 (en) | 2020-01-14 |
US20160351293A1 (en) | 2016-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10071238B2 (en) | Cardiac or cerebral vessel microlead with electrode ring | |
EP1955724B1 (en) | Medical catheter | |
US9629978B2 (en) | Catheters with intermediate layers and methods for making them | |
US8647323B2 (en) | Catheter shaft with multiple reinforcing layers and method of its manufacture | |
US8567055B2 (en) | Method of assembling an in-line connector terminal | |
US10537706B2 (en) | Method for manufacturing medical instrument, and medical instrument | |
US8734440B2 (en) | Magnetically guided catheter | |
US20070299424A1 (en) | Steerable catheter using flat pull wires and method of making same | |
US20100268196A1 (en) | Braided peelable catheter and method of manufacture | |
US20090082655A1 (en) | Medical electrical leads and conductor assemblies thereof | |
JP2012518487A (en) | Medical device having a laminate coated braid assembly | |
US10535446B2 (en) | Medical electrical lead joints and methods of manufacture | |
US8519300B2 (en) | Method of laser welding a hub to a catheter shaft | |
BR112019007377B1 (en) | MEDICAL DEVICE | |
US9572955B2 (en) | Catheter-to-extension tube assembly and method of making same | |
US7680544B1 (en) | Fatigue resistant design for leads employing multi-strand cables as primary conductors | |
US20150367098A1 (en) | Catheter or sheath assembly | |
WO2009085486A1 (en) | Catheter shaft with multiple reinforcing layers and method of its manufacture | |
US20120310213A1 (en) | Medical Catheter With Bump Tubing Proximal Segment | |
US20190224466A1 (en) | Coupling for Medical Devices | |
US20030199852A1 (en) | Attachment joints with polymer encapsulation | |
US6748277B1 (en) | Medical catheter/lead body design and means of manufacture thereof | |
US11172841B2 (en) | Electrode catheter assembly and method for the manufacture thereof | |
JP2004097278A (en) | Tubular body for medical use and its manufacturing method | |
JP5891770B2 (en) | Medical device and method for manufacturing medical device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MEDTRONIC, INC.,MINNESOTA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SEIFERT, KEVIN R.;GRENZ, KATHLEEN M.;SIGNING DATES FROM 20100209 TO 20100212;REEL/FRAME:023935/0546 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |