US20110036538A1 - Method and device for cooling a heat generating component - Google Patents
Method and device for cooling a heat generating component Download PDFInfo
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- US20110036538A1 US20110036538A1 US12/676,398 US67639808A US2011036538A1 US 20110036538 A1 US20110036538 A1 US 20110036538A1 US 67639808 A US67639808 A US 67639808A US 2011036538 A1 US2011036538 A1 US 2011036538A1
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- heat
- chamber
- heat dissipation
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- cooling fluid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
- F28D1/0417—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids with particular circuits for the same heat exchange medium, e.g. with the heat exchange medium flowing through sections having different heat exchange capacities or for heating/cooling the heat exchange medium at different temperatures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooling arrangement, an integrated heat spreader and a method for cooling a heat generating component. More particularly, the invention relates to a cooling arrangement comprising a heat spreader comprising a first surface, a second surface, at least one heat absorption chamber and at least one heat dissipation chamber, the at least one heat absorption chamber being in thermal contact with the first surface and the at least one heat dissipation chamber being in thermal contact with the second surface and hydraulically coupled to the at least one heat absorption chamber.
- Cooling of heat generation components in general and semiconductor circuits in particular has been an important issue for many years. With continuous increases in transistor density and power consumption of microprocessors, the need for lower cost and more compact microprocessor cooling arrangements has become more desirable to further performance advancements.
- One problem, in particular in microprocessors, is that heat is generated in a limited physical space. Consequently, for effective cooling, the heat needs to be spread over a much larger area for more efficient cooling.
- cooling heat generating components is forced air convection.
- many processors of current computer systems are cooled by a heat spreader, which distributes the heat generated by the processor over a larger surface which is then cooled by forced air convection using an electric fan.
- Patent application US 2007/0017659 A1 discloses a heat spreader having a fluid sealed between two plates and a pumping mechanism to actuate a multi-phase flow of the fluid in a planar surface. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.
- a cooling arrangement comprising a heat spreader comprising a first surface, a second surface, at least one heat absorption chamber and at least one heat dissipation chamber, the at least one heat absorption chamber being in thermal contact with the first surface and the at least one heat dissipation chamber being in thermal contact with the second surface and hydraulically coupled to the at least one heat absorption chamber.
- the cooling arrangement further comprises at least one heat generating component arranged in thermal contact with the first surface of the heat spreader, a cooling fluid, filling at least part of the heat absorption chamber and the heat dissipation chamber, at least one actuator for driving the cooling fluid, and a controller for generating at least one control signal for the at least one actuator, such that the cooling fluid can be driven through the at least one heat absorption chamber using a plurality of flow patterns.
- a controlled flow of the cooling fluid through the heat absorption chamber is generated.
- Having a separate heat absorption chamber and heat dissipation chamber reduces the volume of cooling fluid contained in the heat spreader, thus giving a possibility to avoid reduced pump to heat spreader volume ratios, and may prevent a reduction of the temperature of the fluid on its way to the heat dissipation chamber. Having these components separate also gives more flexibility in manufacturing and integration by implementing them with modular components.
- the cooling fluid oscillates between the at least one heat absorption and the at least one heat dissipation chamber.
- the heat spreader comprises two heat dissipation chambers and at least two actuators
- the controller is adapted to drive the cooling fluid using two different flow patterns, wherein, in a first flow pattern, a flow from the first heat dissipation chamber through the at least one heat absorption chamber to the second heat dissipation chamber is created, and, in a second flow pattern, a flow from the second heat dissipation chamber through the at least one heat absorption chamber to the first heat dissipation chamber is created.
- the cooling fluid oscillates between the two heat dissipation chambers, transporting heat to either one in alternating turns, while the heat absorption chamber is cooled continuously.
- the heat spreader preferably comprises four heat dissipation chambers and at least two actuators and the controller is adapted to drive the cooling fluid using four different flow patterns, wherein, in a first flow pattern, a flow from the first heat dissipation chamber through the at least one heat absorption chamber to the third heat dissipation chamber is created, in a second flow pattern, a flow from the second heat dissipation chamber through the at least one heat absorption chamber to the fourth heat dissipation chamber is created, in a third flow pattern, the flow from the third heat dissipation chamber through the at least one heat absorption chamber to the first heat dissipation chamber is created, and, in a fourth flow pattern, a flow from the fourth heat dissipation chamber through the at least one heat absorption chamber to the second heat dissipation chamber is created.
- the cooling fluid is pumped through the heat absorption chamber in alternate turns from the first and third heat dissipation chamber and the second and fourth heat dissipation chamber, respectively. Consequently, while a constant flow through the heat absorption chamber is generated, part of the cooling fluid is always at rest in at least one heat dissipation chamber, where it dissipates its energy.
- the heat spreader preferably comprises a multiplicity of heat dissipation chambers, having a multiplicity of actuators arranged around the at least one heat absorption chamber in a substantially radial arrangement and the controller is adapted for driving the cooling fluid using a multiplicity of different flow patterns, creating a substantially radial oscillation of a flow of the cooling fluid through the at least one heat absorption chamber.
- the center of the heat absorption chamber is always cooled by a constant flow of cooling fluid, while part of the cooling fluid stored in one of the multiplicity of heat dissipation chambers is at rest and dissipates the heat transferred from the heat absorption chamber.
- the heat spreader comprises a network of hydraulically interconnected chambers, comprising the at least one heat absorption chamber and at least two heat dissipation chambers, the network comprising multiple flow paths, each flow path connected to at least one actuator, and the controller is adapted to drive the cooling fluid using at least two different flow paths of the network using the plurality of flow patterns.
- heat is transferred using multiple flows through the network between the chambers as desired for more efficient cooling.
- heat can be distributed to alternative heat dissipation chambers in alternating turns associated with the plurality of flow patterns.
- the at least one heat dissipation chamber comprises at least one membrane coupled to the at least one actuator for actuating the at least one membrane in order to drive the cooling fluid from or to the at least one heat dissipation chamber.
- the at least one heat dissipation chamber acts as a pump for driving the cooling fluid to and from the heat dissipation chamber.
- the cooling arrangement comprises at least one first temperature sensor for sensing the temperature of the heat generating component, the at least one first temperature sensor is coupled to the controller, and the controller is adapted to generate the at least one control signal based on the sensed temperature of the heat generating component.
- the cooling arrangement preferably further comprises at least one second temperature sensor for sensing the temperature of the at least one heat dissipation chamber, the at least one second temperature sensor is coupled to the controller, and the controller is adapted to generate the at least one control signal based on the sensed temperature of the at least one heat dissipation chamber.
- the cooling performance of the cooling arrangement can be adapted to the actual temperature difference between the heat generating component and the heat dissipation chamber.
- the heat generating component comprises a plurality of areas and associated temperature sensors, the plurality of temperature sensors are coupled to the controller, and the controller is adapted to identify at least one hot spot corresponding to at least one area of the plurality of areas, the at least one hot spot being characterized in that is has a temperature above an average temperature of the plurality of areas, and the controller is further adapted to generate the at least one control signal based on the at least one identified hot spot, such that a flow of cooling fluid is directed to the at least one hot spot in at least one flow pattern.
- a spatial distribution of heat generated by the heat generating component can be considered by the controller, such that a flow pattern directed to a hot spot is created by the controller.
- the heat spreader comprises a plurality of regions and associated temperature sensors, the plurality of temperature sensors are coupled to the controller, and the controller is adapted to identify at least one cold region of the heat spreader, the at least one cold region being characterized in that it has a temperature below an average temperature of the plurality of regions, and the controller is further adapted to generate at least one control signal based on the at least one identified cold region, such that the flow of cooling fluid is sourced from the at least one cold region in at least one flow pattern.
- a spatial distribution of heat dissipation of the heat spreader can be considered by the controller, such that a flow pattern sourced from a cold region is created by the controller.
- the heat spreader comprises at least two physically separated flow paths for the cooling fluid and, in a first flow pattern, cooling fluid is driven through the heat absorption chamber using the first flow path and, in a second flow pattern, cooling fluid is driven through the heat absorption chamber using the second flow path.
- cooling fluid used in a particular flow pattern does not mix with cooling fluid of a separate flow pattern, improving heat distribution in networks of interconnected heat dissipation and heat absorption chambers.
- an integrated heat spreader comprises at least one heat absorption chamber having a first surface for interfacing with a heat generating component and at least one heat dissipation chamber having a second surface for interfacing with an external coolant, the second surface being larger than the first surface.
- the integrated heat spreader further comprises a cooling fluid filling, at least partially, the at least one heat absorption chamber and the at least one heat dissipation chamber, at least one fluid interconnection between the at least one heat absorption chamber and the at least one heat dissipation chamber, and at least one pump element for creating a plurality of flow patterns between the at least one heat absorption chamber and the at least one heat dissipation chamber using a forced movement of the cooling fluid.
- an integrated heat spreader comprising at least one heat absorption chamber, at least one heat dissipation chamber, a cooling fluid, at least one fluid interconnection and at least one pump element for creating different flow patterns between the chambers, a self-contained cooling system for a heat generating component is created.
- At least one pump element comprises at least one membrane arranged in the at least one heat dissipation chamber.
- the at least one heat absorption chamber or heat dissipation chamber comprises at least one chamber wall having a surface enhancement feature for an increased heat exchange between the chamber wall and the cooling fluid.
- a chamber wall having a surface enhancement feature, such as a mesh structure, for example, increases the thermal flow through the heat spreader.
- the heat absorption chamber comprises at least two physically separated flow paths for the cooling fluid.
- the heat absorption chamber comprises at least four ports for at least four fluid interconnections, each port hydraulically connected to one further port of the at least four ports of the heat absorption chamber.
- a method for cooling a heat generating component being in thermal contact with a first surface of a heat spreader having a plurality of chambers comprising a cooling fluid comprises the steps of:
- an efficient cooling of a hot spot of a heat generating component may be achieved.
- the cooling fluid passes the mapped location of the hot spot in alternating turns with the first flow pattern.
- a continuous cooling of the hot spot may be achieved.
- the method further comprises determining at least one chamber of the plurality of chambers having a temperature below the determined average temperature, wherein, in the step of generating the at least one first control signal, the first flow pattern of the cooling fluid is sourced from the at least one chamber determined to have an below average temperature.
- the heat source is cooled to the lowest possible temperature.
- FIG. 1 a cross-section through a cooling arrangement according to an embodiment of the present invention
- FIG. 2 a cross-section through an integrated heat spreader from above according to an embodiment of the present invention
- FIG. 3A to FIG. 3D different flow patterns through a heat absorption chamber according to different embodiments of the present invention
- FIG. 4 a blade module comprising several heat generating components and a cooling arrangement according to an embodiment of the present invention
- FIG. 5 a cross-section through a blade system comprising multiple blades
- FIG. 6 a cross-section through a blade system comprising multiple thin form factor blades
- FIG. 7 a thermal network comprising multiple heat generating components
- FIG. 8 a heat dissipation chamber having two separate flow paths according to an embodiment of the invention
- FIG. 9 a heat dissipation chamber having four separate flow paths according to an embodiment of the invention.
- FIG. 10 a cooling arrangement using the heat dissipation chamber of FIG. 8 according to an embodiment of the invention.
- FIG. 1 shows a cross-section through a cooling arrangement comprising a processor 1 , a heat spreader 2 and two actuators 3 a and 3 b .
- the actuators 3 are connected to and driven by a controller 19 , which may be an integral part of the heat cooling arrangement or the processor 1 , or separate therefrom.
- the processor 1 is mounted in a socket 4 , which also comprises electrical contacts for providing the processor 1 with electrical energy and data.
- the processor 1 will comprise a large number of contacts, for example hundreds of contacts arranged in a so-called ball grid array (BGA).
- BGA ball grid array
- Processor 1 may also be mounted directly or indirectly on a printed circuit board (PCB) by any other known technology.
- PCB printed circuit board
- the processor 1 has a top surface 5 , which is used to dissipate energy created by the transistors and other circuitry comprised in the processor 1 .
- the top surface 5 of the processor 1 is in direct physical and thermal contact with a first surface 6 of the heat spreader 2 .
- the top surface 5 and the first surface 6 roughly match in size and may have an area of roughly 1 cm 2 , for example.
- the heat spreader 2 also comprises a multiplicity of air fins 7 , which together provide a second surface 8 .
- the second surface 8 is much larger than the first surface 6 .
- the second surface 8 may comprise an area of roughly 1000 cm 2 with the heat spreader footprint being approximately 100 cm 2 .
- the second surface 8 may be cooled by a cooling fan not shown in FIG. 1 .
- the heat spreader 2 comprises a heat absorption chamber 9 and two heat dissipation chambers 10 a and 10 b .
- the heat absorption chamber 9 and the heat dissipation chambers 10 a and 10 b are hydraulically connected by fluid interconnections 11 a and 11 b .
- Actuator 3 a and actuator 3 b can generate a flow from the heat dissipation chamber 10 a through the heat absorption chamber 9 to the heat dissipation chamber 10 b , for example. As can be seen in FIG.
- the heat absorption chamber 9 is preferably located in physical proximity to the heat generating component, the processor 1 in this case, in order to reduce the thermal resistance there between.
- the heat absorption chamber 9 is separated from the top surface 5 of the processor 1 by a relatively thin chamber wall.
- the actuator 3 a will create an overpressure while actuator 3 b will create a low-pressure in a cooling fluid 13 , filling at least in part the heat absorption chamber 9 and the heat dissipation chambers 10 , resulting in a flow from left to right in the cooling arrangement depicted in FIG. 1 .
- the actuator 3 b may create an overpressure while the actuator 3 a creates a low-pressure such that the cooling fluid 13 flows back from the heat dissipation chamber 10 b through the heat absorption chamber 9 to the heat dissipation chamber 10 a .
- FIG. 1 depicts a cooling arrangement comprising two heat dissipation chambers 10 a and 10 b
- a single heat dissipation chamber 10 connected to the heat absorption chamber 9 may be used.
- a membrane may separate hot and cold cooling fluid 13 within a single heat dissipation chamber 10 pumped from and to the heat absorption chamber 9 using two fluid interconnections 11 a and 11 b simultaneously.
- a single actuator 3 and one or more vents may be used to create two or more different flow patterns through the heat absorption chamber 9 .
- both the heat absorption chamber 9 and the heat dissipation chambers 10 a and 10 b comprise a mesh structure 12 which increases the internal surface of the chambers and increases the fluid structure interaction.
- the mesh structure 12 may be adapted to the shape and characteristics of each chamber. For example, a high density mesh structure 12 may be employed in a relatively small heat absorption chamber 9 , while a lower density mesh structure 12 may be employed in a larger heat dissipation chamber 10 .
- a solid part 14 of the heat spreader 2 helps to spread further heat from the first surface 6 to the second surface 8 .
- a cooling of the processor 1 can be achieved by heat conduction from the first surface 6 to the air fins 7 arranged in a central area of the heat spreader 2 .
- FIG. 2 shows a cross-section through an integrated heat spreader 2 from above.
- the heat spreader 2 comprises one heat absorption chamber 9 in the center and four heat dissipation chambers 10 a to 10 d .
- the heat absorption chamber 9 is connected to the four heat dissipation chambers 10 a to 10 d by means of fluid interconnections 11 a to 11 d .
- Each fluid interconnection 11 comprises an integrated channel structure 15 and a tube section 16 .
- the channel structures 15 a to 15 d may be etched or stamped into the solid part 14 of the heat spreader 2 .
- the tube section 16 may be bonded to the solid part 14 and the heat dissipation chambers 10 a to 10 d.
- the different parts of the heat spreader 2 may be comprised in a single plate as shown in FIG. 1 or in three separate plates, two upper plates 17 a and 17 b for heat dissipation and a lower plate 18 for heat absorption as shown in FIG. 2 . That is, the heat spreader 2 may be a single, integrated physical assembly or a system comprising two or more physically separate but interconnected units.
- the fluid interconnections 11 a to 11 d between the heat absorption chamber 9 of the lower plate 18 and the four heat dissipation chambers 10 a to 10 d of the upper plates 17 a and 17 b may achieve an effective heat conductivity which is forty times greater than that of solid copper, creating a thermal short circuit between the first surface 6 , which is in contact with the top surface 5 of a processor 1 or any other heat generating component, and the second surface 8 , for example, fins 7 attached to the upper plates 17 a and 17 b cooled by forced air convection.
- a lower resistance transport of heat to the outermost regions of the heat spreader 2 i.e. away from the heat generating component, may be obtained.
- a mesh structure 12 may be etched, plated, molded or stamped into the heat absorption chamber 9 .
- mesh structures 12 may be formed in each one of the heat dissipation chambers 10 a to 10 d .
- the mesh structure 12 integrated into the heat absorption chamber 9 may physically connect two opposing walls of that chamber, thus creating an additional heat conduction path from the first surface 6 to the air fins 7 .
- Such and similar mesh structures 12 also referred to as surface enhancement features, are described in further detail in US 2007/0017659 A1, which is incorporated herein by reference.
- each of the heat dissipation chambers 10 a to 10 d comprises a membrane 20 which is connected to an internal or external actuator 3 by means of a piston like element.
- an over- or low-pressure can be created in that heat dissipation chamber. If, for example, an overpressure is created in the heat dissipation chamber 10 a and an low-pressure is created in the heat dissipation chamber 10 c , the flow of cooling fluid 13 from the heat dissipation chamber 10 a through the fluid interconnection 11 a , the heat absorption chamber 9 and the fluid interconnection 11 c to the heat dissipation chamber 10 c is created.
- the membranes 20 or other pumping elements may also be located in a separate component from the heat dissipation chambers 10 .
- a first flow of cooling fluid 13 is created which arrives at first surface 6 very rapidly, i.e. using only moderate pump displacement and thus power, and without heating up significantly on its way.
- the use of moderate pump displacement is achieved due to the low surface to volume ratio of interconnect 11 a , which is not meshed, in contrast with the heat exchanging regions 10 a and 9 with a low surface to volume ratio interconnect 11 a .
- the cooling fluid 13 which will be heated up in the heat absorption chamber 9 to a relatively high temperature, is transported very effectively to the heat dissipation chamber 10 c without a substantial temperature drop along the narrow fluid interconnection 11 c . Because of the large differences in temperature between the heat absorption chamber 9 and the relatively cool cooling fluid 13 and, inversely, between the relatively warm cooling fluid 13 and the heat dissipation chamber 10 c , heat is transported away from the first surface 6 very rapidly and effectively.
- the heated up cooling fluid 13 may remain at the heat dissipation chamber 10 c temporarily, while a second flow is created from the heat dissipation chamber 10 b to the heat dissipation chamber 10 d , for example.
- Using multiple flow patterns has the advantage that, while part of the cooling fluid 13 may rest in one heat dissipation chamber, like heat dissipation chamber 10 c for example, an uninterrupted flow of cooling fluid 13 through the heat absorption chamber 9 can be maintained, thus constantly cooling the first surface 6 of the heat spreader 2 .
- the designs of the heat spreaders 2 presented in FIG. 1 and FIG. 2 comprise a relatively large solid part 14 and relatively narrow fluid interconnections 11 .
- the solid part 14 occupies a larger area of the presented cross-section of the lower plate 18 than the fluid interconnections 11 .
- a processor 1 comprises an arithmetic logical unit or processor core and a relatively large cache memory, occupying a larger area than the processor core.
- the processor 1 will generate considerably more heat in the area corresponding to the processor core than in the area corresponding to the cache memory.
- the cache memory will occupy most of the area of the top surface 5 to be cooled.
- a heat generating component may comprise one or several so-called “hot spots”, whose temperature is above the average temperature of the heat generating component.
- an arithmetic mean of several temperatures measured in different areas of the top surface 5 may be determined.
- one or several maximum values of a temperature distribution may be determined.
- FIG. 3A to FIG. 3D show different flow patterns through a heat absorption chamber 9 which may be used to create effective cooling flows for a number of hot spots.
- FIG. 3A shows a heat absorption chamber 9 arranged in the area of a first surface 6 .
- the first surface 6 may correspond, for example, to the die size of a semiconductor chip mounted on the first to surface 6 .
- Fluid interconnections 11 a to 11 d serve as inlets and outlets to the heat absorption chamber 9 and are coupled to actuators 3 a to 3 d respectively, although this is not shown in FIG. 3A to FIG. 3D .
- solid parts 14 separate different flow paths within the heat absorption chamber 9 and also act as heat conductor and surface enhancement features.
- a first flow pattern from fluid interconnections 11 a and 11 b , acting as fluid inlets, to fluid interconnections 11 c to 11 d , acting as fluid outlet, is created.
- a second flow pattern which is not shown in FIG. 3A , is the inverse of the fluid pattern presented, i.e. the fluid interconnection 11 c and 11 d serve as fluid inlets and the fluid interconnections 11 a and 11 b serve as fluid outlets.
- first surface 6 On the first surface 6 , two hot spots 21 a and 21 b are present. Due to the central solid part 14 and the pressure distribution profile within the cooling fluid 13 in the heat absorption chamber 9 , a relatively fast first flow of cooling fluid 13 across the hot spots 21 a and 21 b is created.
- the first flow has a flow velocity which is above the average flow velocity of the cooling fluid 13 within the heat absorption chamber 9 .
- Relatively cool areas, arranged, for example, between the left, central and right solid parts 14 receive a second flow of cooling fluid having a lower flow velocity than the first flow and are not cooled as efficiently by the flow patterns described. In contrast, a much higher pump power would have to be implemented for cooling all areas of the first surface 6 equally, resulting in a less effective overall cooling system.
- FIG. 3B shows a different configuration of a first surface 6 having four hot spots 21 a to 21 d .
- a different flow pattern is used to cool the hot spots 21 .
- two opposing fluid interconnections 11 a and 11 d act as fluid inlet, while the remaining fluid interconnections 11 b and 11 c serve as fluid outlets.
- the flows of cooling fluid 13 are bifurcated by the central solid part 14 and, in consequence, flows of the cooling fluid 13 across all hot spots 21 a to 21 d are created in a first phase. In a second phase, the direction of the flows indicated in FIG.
- the axis of the oscillation may be altered with time, resulting in a rotating and oscillating flow pattern.
- the axis of oscillation may change from a first diagonal direction via a horizontal direction and a second diagonal direction to a vertical direction and so on.
- FIG. 3C shows a further configuration of a first surface 6 having four hot spots 21 a to 21 d .
- the solid part 14 arranged in the central area of the heat absorption chamber 9 creates internal channels 22 a to 22 d .
- the a first internal channel 22 a guides cooling fluid 13 across two hot spots 21 a and 21 b while a second internal channel 22 b guides cooling fluid 13 across the hot spots 21 c and 21 d.
- cooling fluid 13 is pumped from the left to the right.
- the flow of the cooling fluid 13 is reversed, i.e. a flow from the right to the left is created.
- the hot spots 21 a and 21 c are cooled more efficiently, as they are closest to the fluid inlet.
- the hot spots 21 b and 21 d are cooled less efficiently, because by the time the cooling fluid 13 arrives at their location, it has already been pre-heated by the hot spots 21 a and 21 c , reducing its capacity to further absorb heat.
- the hot spots 21 b and 21 d are cooled more efficiently, as they are closest to the fluid inlets.
- FIG. 3D shows a further configuration of a heat absorption chamber 9 with the first surface 6 comprising eight hot spots 21 .
- the first surface 6 comprising eight hot spots 21 .
- two hot spots 21 are present in each one of the internal channels 22 .
- the internal channels 22 are narrower in places of the hot spots 21 than in other places, resulting in an accelerated flow across the hot spots 21 .
- the flow pattern used to cool all of the hot spots 21 are similar to the ones described with reference to FIG. 3B .
- a density of a mesh structure 12 may be increased in areas close to a hot spot 21 and reduced in cooler areas of the first surface. In this way the flow rate of the cooling fluid 13 may be adapted to varying cooling requirements of a heat generating component.
- FIG. 3A and FIG. 3B The physical arrangement of the heat absorption chamber 9 and the fluid interconnections 11 of FIG. 3A and FIG. 3B and those shown in FIGS. 3C and 3D are identical.
- a controller 19 connected to a cooling arrangement may switch from one flow pattern, for example a linear flow pattern, to another, for example a radial flow pattern, by adapting one or several control signals provided to actuators 3 .
- the situations depicted in FIG. 3A and FIG. 3B , or FIG. 3C and FIG. 3D may be used for operating the same heat generating components in different operating modes.
- a processor 1 having multiple processor cores may not use all processor cores at all times, resulting in different heat distributions at its top surface 5 .
- a method for operating the cooling arrangement may be used to compute control signals for the actuators 3 that create different flows of cooling fluid 13 within the heat spreader 2 . Such a method can be used to adapt the configuration of the cooling arrangement on demand.
- the method may be implemented in hard- or software or a combination thereof, e.g. a purpose designed controller 19 or a universal processor 1 executing a computer code loaded from some storage medium, like a RAM, ROM or magnetic storage medium.
- one or several heat sensors are comprised in the heat generating components, for example on or close to a die of a processor 1 , which sense the temperature of the first surface 6 .
- This information may be provided to the controller 19 providing signals to the actuators 3 , thus controlling the flow patterns through the heat absorption chamber 9 .
- a controller 19 identifies that the hot spot 21 a shown in the configuration presented in FIG. 3A is considerably hotter than the hot spot 21 b in the lower part, a relatively higher pump drive signal may be provided to the actuators 3 a and 3 c compared with the pump drive signal provided to the actuators 3 b and 3 d , thus adapting the overall flow patterns used to the current requirements.
- temperature sensors may also be provided on or in the heat spreader 2 , the heat absorption chamber 9 or the heat dissipation chamber 10 . Temperature information provided to the controller 19 may be used to identify cooler regions of the heat spreader 2 , which may be used as a source of cooling fluid 13 for cooling hot spots 21 . In this way, the controller may determine an optimal configuration automatically, for example by determining the side of the heat spreader from which cool air or liquid for secondary cooling is provided.
- FIG. 4 shows a top view and a cross-section of a so-called blade 26 , which is a printed circuit computer board having a particularly thin form factor of roughly 30 mm height.
- FIG. 4 shows a possible configuration of a heat spreader 2 which is particularly suited for cooling heat generating components of the blade 26 .
- an upper plate 17 comprising a heat dissipation chamber 10 is arranged on a cooling plate 23 opposite to a printed circuit board 24 carrying one or several heat generating components.
- the cooling plate 23 serves as a heat dissipation area for the arrangement shown in FIG. 4 , i.e.
- the upper plate 17 extends over a large area with respect to the dimension of the printed circuit board 24 and has a vertical clearance over the highest surface of components mounted on the printed circuit board 24 .
- a central processor 1 arranged in the center of the heat spreader 2 is in thermal contact with a first surface 6 in an area of a heat absorption chamber 9 of the heat spreader 2 .
- the heat absorption chamber 9 is thermally coupled to the cooling plate 23 using a four fluid interconnects 11 .
- secondary heat sources 25 such as logic chips, are in thermal contact with air fins 7 made from a heat conductive material, for example copper, which couple the secondary heat sources 25 to the upper plate 17 .
- Membranes 20 and actuators 3 are arranged on the periphery of the cooling plate 23 and can create an oscillating and optionally azimuthally rotating flow pattern within the upper plate 17 .
- the fluid interconnections 11 create channels between the upper plate 17 and the lower plate 18 comprising the heat absorption chamber 9 in the area of the processor 1 . In this way, hot spots present on a top surface 5 of the processor 1 can be cooled very effectively with a relatively fast flow of cooling fluid 13 , while spreading the heat across the extent of the cooling plate 23 having a much larger cross sectional area results in a slower flow there.
- cooling may be affected by different means or a combination thereof.
- the blade 26 shown in FIG. 4 may be cooled by an air flow 30 through the air fins 7 .
- the air flow 30 is also used to cool a tertiary heat source 31 having a separate finned air cooler and memory modules 32 .
- cooling may be performed by heat conduction or radiation from the cooling plate 23 , which may be arranged on a chassis part of a blade cage or a further heat exchanger, for example.
- FIG. 5 shows a configuration of a computer system comprising several blades 26 .
- the cooling plates 23 of blades 26 are arranged top-to-top separated by a cold plate 27 of a blade cage 28 .
- the cold plate 27 of the blade cage 28 comprises a secondary cooling circuit, for example a water cooling system.
- the cold plate 27 comprises a coolant having a temperature below the temperature of the cooling plate 23 , which transports heat away from the cooling plates 23 of the heat spreader of the blades 26 to an external cooler.
- there is no need for a fluid connection between the blade cage 28 and the blades 26 allowing straightforward insertion and removal of individual blades 26 .
- a computer system comprising a large number of blades 26 can be built and cooled efficiently.
- the blades could be arranged bottom-to-top or with higher power dissipation components on both sides of the printed circuit board in order to increase integration density even further.
- FIG. 6 shows another blade system comprising a plurality of so-called thin form factor blades 26 .
- Thin form factor blades are less than 30 mm in height, such that an arrangement as shown in FIG. 5 may not be used for partial air cooling.
- practically all the heat dissipated on the printed circuit board 24 is transferred by the cooling fluid 13 from the heat generating components to the cold plate 27 directly, i.e. not using a separate lower plate 18 or air fins 7 .
- a high density mesh 12 a is used in its area, acting as a heat absorption chamber 9
- a lower density mesh 12 b is used in another area, acting as a heat dissipation chamber 10 .
- the absorption chamber 9 and the dissipation chambers 10 are combined in one thermal spreader plane that distributes the heat load evenly so that it can effectively be transferred across the thermal interface between the spreader and the cold plate 27 .
- blade components and blade pitch can be vertically compressed to approximately 5 mm per printed circuit board with components and thermal spreader planes mounted on both sides.
- FIG. 7 shows a thermal network comprising multiple heat sources.
- multiple heat absorption chambers 9 and heat dissipation chambers 10 may be interconnected by a multiplicity of fluid interconnections 11 .
- Multiple membrane pumps 29 are connected to the thermal network and allow creating a multiplicity of flow patterns through the network.
- an array-like structure of heat absorption chambers 9 and heat dissipation chambers 10 may be controlled effectively in order to spread the heat generated by a number of heat generating components such as processors 1 and secondary heat sources 25 over a relatively large area.
- the heat may be spread uniformly over the entire thermal network or, alternatively, directed to areas with increased cooling capabilities. For example, higher volumes of cooling fluid 13 may be pumped into a heat dissipating chamber 10 close to a cooling air inlet.
- a first column comprising the membrane pump 29 a , the heat dissipation chambers 10 a and 10 c and the heat absorption chamber 9 a
- a second column comprising the membrane pump 29 b , the heat dissipation chambers 10 b and 10 d and the heat absorption chamber 9 b
- cooling fluid 13 is pumped from the heat dissipation chamber 10 a to the heat dissipation chamber 10 c via a first heat absorption chamber 9 a
- cooling fluid 13 is also pumped from the heat dissipation chamber 10 d to the heat dissipation chamber 10 b via a second heat absorption chamber 9 b.
- a further flow pattern corresponding to the row of the network may be generated by membrane pumps 29 c and 29 d .
- This will cool the two processors 1 and the two secondary heat sources 25 arranged in that row.
- the heat absorption chambers 9 c and 9 d may be configured differently than the heat absorption chambers 9 a and 9 b , in order to adapt them to the thermal requirements of the secondary heat sources 25 . In the example presented, they are connected to two fluid interconnections 11 , while each one of the heat absorption chambers 9 a and 9 b is connected to four fluid interconnections 11 .
- the heat dissipation chambers 10 g and 10 h are smaller than the other heat dissipation chambers 10 shown in FIG. 7 , due to the reduced heat generation of the secondary heat sources 25 .
- the amount of cooling fluid 13 pumped through the heat absorption chambers 9 or heat dissipation chambers may be adapted in different flow patterns with a controller 19 .
- FIG. 8 shows an alternative design for a heat absorption chamber 9 .
- the heat absorption chamber 9 according to FIG. 8 comprises two separate flow paths 33 a and 33 b , which are physically separated from each other, yet both in thermal contact with a hot spot 21 of the heat absorption chamber 9 .
- the hot spot 21 may be arranged in a central area, where the flow paths 33 a and 33 b converge.
- the heat absorption chamber 9 comprises four fluid ports 34 a to 34 d , which serve as fluid inlet and fluid outlets to the first and second flow paths 33 a and 33 b , respectively.
- FIG. 9 shows a further embodiment of a heat absorption chamber 9 according to an embodiment of the invention.
- the heat absorption chamber 9 according to FIG. 9 comprises four separate areas 35 a to 35 d that are physically separated from one another by means of partitioning walls 36 .
- Each area 35 a to 35 d comprises two fluid ports 34 , which serve as an inlet and outlet to the particular area.
- the embodiment of the heat absorption chamber 9 shown in FIG. 9 represents an eight-port radial absorber with four isolated flow paths 33 .
- the flow paths 33 according to FIG. 9 are both radially and horizontally distributed. For example, a first and third flow along the flow paths 33 a and 33 c may be affected in a first flow pattern, whereas a second and a fourth flow of cooling fluid 13 may be affected in a second flow pattern along flow path 33 b and 33 d.
- each area 35 a to 35 d may be provided with cooling fluid 13 sequentially around the chamber in phases.
- the first and third areas 35 a and 35 c of the heat absorption chamber 9 may be provided with a cooling fluid 13 in a first direction in a first phase, followed by the provision of the cooling fluid 13 to the second and the fourth area 35 b and 35 d in a second phase.
- the flow pattern of the first and the second phase are repeated with the inverse orientation of the flow of the cooling fluid 13 .
- FIG. 10 shows a cooling arrangement using the heat absorption chamber 9 according to FIG. 8 .
- the four fluid ports 34 a to 34 d of the heat absorption chamber 9 are connected to four heat dissipation chambers 10 a to 10 d .
- actuators 3 a to 3 d connected with the heat dissipation chambers 10 a to 10 d in effect a periodic radial spreading of heat from the heat absorption chamber 9 is implemented by driving the actuators 3 a and 3 c in alternating terms with the actuators 3 b and 3 d.
- cooling arrangements described above were described with reference to a single plane architecture for reasons of representational simplicity, the same or similar techniques may be applied to multi-level design, wherein several heat generating components are stacked on top of each other, separated by cooling plates comprising one or several heat absorption chambers 9 .
Abstract
Description
- The present invention relates to a cooling arrangement, an integrated heat spreader and a method for cooling a heat generating component. More particularly, the invention relates to a cooling arrangement comprising a heat spreader comprising a first surface, a second surface, at least one heat absorption chamber and at least one heat dissipation chamber, the at least one heat absorption chamber being in thermal contact with the first surface and the at least one heat dissipation chamber being in thermal contact with the second surface and hydraulically coupled to the at least one heat absorption chamber.
- Cooling of heat generation components in general and semiconductor circuits in particular has been an important issue for many years. With continuous increases in transistor density and power consumption of microprocessors, the need for lower cost and more compact microprocessor cooling arrangements has become more desirable to further performance advancements. One problem, in particular in microprocessors, is that heat is generated in a limited physical space. Consequently, for effective cooling, the heat needs to be spread over a much larger area for more efficient cooling.
- An example of cooling heat generating components is forced air convection. For example, many processors of current computer systems are cooled by a heat spreader, which distributes the heat generated by the processor over a larger surface which is then cooled by forced air convection using an electric fan.
- Patent application US 2007/0017659 A1 discloses a heat spreader having a fluid sealed between two plates and a pumping mechanism to actuate a multi-phase flow of the fluid in a planar surface. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.
- Although improved heat flow from a heat generating component to a much larger surface is obtained with the aforementioned technique, a challenge exists to provide even better methods and devices for cooling a heat generating component. In particular, it is desirable that the cooling efficiency of a heat spreader is increased in order that the cooling of even more powerful heat generating components is possible. Conversely, the energy used by a cooling arrangement of a given heat generating component should be reduced in order to improve the overall energy efficiency. In addition, it is a challenge to provide methods and devices for cooling systems comprising a plurality or network of heat sources with variable loads.
- According to an embodiment of one aspect of the present invention, a cooling arrangement is provided. The cooling arrangement comprises a heat spreader comprising a first surface, a second surface, at least one heat absorption chamber and at least one heat dissipation chamber, the at least one heat absorption chamber being in thermal contact with the first surface and the at least one heat dissipation chamber being in thermal contact with the second surface and hydraulically coupled to the at least one heat absorption chamber. The cooling arrangement further comprises at least one heat generating component arranged in thermal contact with the first surface of the heat spreader, a cooling fluid, filling at least part of the heat absorption chamber and the heat dissipation chamber, at least one actuator for driving the cooling fluid, and a controller for generating at least one control signal for the at least one actuator, such that the cooling fluid can be driven through the at least one heat absorption chamber using a plurality of flow patterns.
- By providing a heat spreader having a heat absorption chamber and a heat dissipation chamber separate therefrom, the chambers being hydraulically coupled to one another, and at least one actuator for driving the cooling fluid, a controlled flow of the cooling fluid through the heat absorption chamber is generated. Having a separate heat absorption chamber and heat dissipation chamber reduces the volume of cooling fluid contained in the heat spreader, thus giving a possibility to avoid reduced pump to heat spreader volume ratios, and may prevent a reduction of the temperature of the fluid on its way to the heat dissipation chamber. Having these components separate also gives more flexibility in manufacturing and integration by implementing them with modular components.
- According to an embodiment of the first aspect, the cooling fluid oscillates between the at least one heat absorption and the at least one heat dissipation chamber. By having the cooling fluid oscillate between the heat absorption chamber and the heat dissipation chamber, a controlled movement and exchange of the cooling fluid between the two chambers is implemented, thus transporting heat from the first surface to the second surface. In this case, it is preferable that the heat spreader comprises two heat dissipation chambers and at least two actuators, and the controller is adapted to drive the cooling fluid using two different flow patterns, wherein, in a first flow pattern, a flow from the first heat dissipation chamber through the at least one heat absorption chamber to the second heat dissipation chamber is created, and, in a second flow pattern, a flow from the second heat dissipation chamber through the at least one heat absorption chamber to the first heat dissipation chamber is created. In this way, the cooling fluid oscillates between the two heat dissipation chambers, transporting heat to either one in alternating turns, while the heat absorption chamber is cooled continuously.
- Alternatively, the heat spreader preferably comprises four heat dissipation chambers and at least two actuators and the controller is adapted to drive the cooling fluid using four different flow patterns, wherein, in a first flow pattern, a flow from the first heat dissipation chamber through the at least one heat absorption chamber to the third heat dissipation chamber is created, in a second flow pattern, a flow from the second heat dissipation chamber through the at least one heat absorption chamber to the fourth heat dissipation chamber is created, in a third flow pattern, the flow from the third heat dissipation chamber through the at least one heat absorption chamber to the first heat dissipation chamber is created, and, in a fourth flow pattern, a flow from the fourth heat dissipation chamber through the at least one heat absorption chamber to the second heat dissipation chamber is created.
- By using four heat dissipation chambers and four flow patterns, the cooling fluid is pumped through the heat absorption chamber in alternate turns from the first and third heat dissipation chamber and the second and fourth heat dissipation chamber, respectively. Consequently, while a constant flow through the heat absorption chamber is generated, part of the cooling fluid is always at rest in at least one heat dissipation chamber, where it dissipates its energy.
- As a further alternative, the heat spreader preferably comprises a multiplicity of heat dissipation chambers, having a multiplicity of actuators arranged around the at least one heat absorption chamber in a substantially radial arrangement and the controller is adapted for driving the cooling fluid using a multiplicity of different flow patterns, creating a substantially radial oscillation of a flow of the cooling fluid through the at least one heat absorption chamber.
- By creating a radial oscillation in the at least one heat absorption chamber, the center of the heat absorption chamber is always cooled by a constant flow of cooling fluid, while part of the cooling fluid stored in one of the multiplicity of heat dissipation chambers is at rest and dissipates the heat transferred from the heat absorption chamber.
- According to a further embodiment of the first aspect, the heat spreader comprises a network of hydraulically interconnected chambers, comprising the at least one heat absorption chamber and at least two heat dissipation chambers, the network comprising multiple flow paths, each flow path connected to at least one actuator, and the controller is adapted to drive the cooling fluid using at least two different flow paths of the network using the plurality of flow patterns.
- By arranging a number of hydraulically interconnected chambers in a network, such as an array, heat is transferred using multiple flows through the network between the chambers as desired for more efficient cooling. In particular, by using at least two different heat dissipation chambers, heat can be distributed to alternative heat dissipation chambers in alternating turns associated with the plurality of flow patterns.
- According to a further embodiment of the first aspect, the at least one heat dissipation chamber comprises at least one membrane coupled to the at least one actuator for actuating the at least one membrane in order to drive the cooling fluid from or to the at least one heat dissipation chamber. By using a membrane coupled to an actuator, the at least one heat dissipation chamber acts as a pump for driving the cooling fluid to and from the heat dissipation chamber.
- According to a further embodiment of the first aspect, the cooling arrangement comprises at least one first temperature sensor for sensing the temperature of the heat generating component, the at least one first temperature sensor is coupled to the controller, and the controller is adapted to generate the at least one control signal based on the sensed temperature of the heat generating component. By providing and using a first temperature sensor for providing feedback from the heat generating component to the controller, the cooling performance of the cooling arrangement can be adapted to the actual temperature of the heat generating component.
- In this case, the cooling arrangement preferably further comprises at least one second temperature sensor for sensing the temperature of the at least one heat dissipation chamber, the at least one second temperature sensor is coupled to the controller, and the controller is adapted to generate the at least one control signal based on the sensed temperature of the at least one heat dissipation chamber. By providing and using a second temperature sensor for providing feedback from the heat dissipation chamber to the controller, the cooling performance of the cooling arrangement can be adapted to the actual temperature difference between the heat generating component and the heat dissipation chamber.
- According to a further embodiment of the first aspect, the heat generating component comprises a plurality of areas and associated temperature sensors, the plurality of temperature sensors are coupled to the controller, and the controller is adapted to identify at least one hot spot corresponding to at least one area of the plurality of areas, the at least one hot spot being characterized in that is has a temperature above an average temperature of the plurality of areas, and the controller is further adapted to generate the at least one control signal based on the at least one identified hot spot, such that a flow of cooling fluid is directed to the at least one hot spot in at least one flow pattern.
- By using a multiplicity of temperature sensors for identifying hot spots, a spatial distribution of heat generated by the heat generating component can be considered by the controller, such that a flow pattern directed to a hot spot is created by the controller.
- According to a further embodiment of the first aspect, the heat spreader comprises a plurality of regions and associated temperature sensors, the plurality of temperature sensors are coupled to the controller, and the controller is adapted to identify at least one cold region of the heat spreader, the at least one cold region being characterized in that it has a temperature below an average temperature of the plurality of regions, and the controller is further adapted to generate at least one control signal based on the at least one identified cold region, such that the flow of cooling fluid is sourced from the at least one cold region in at least one flow pattern.
- By using a multiplicity of temperature sensors for identifying cold regions of the heat spreader, a spatial distribution of heat dissipation of the heat spreader can be considered by the controller, such that a flow pattern sourced from a cold region is created by the controller.
- According to a further embodiment of the first aspect, the heat spreader comprises at least two physically separated flow paths for the cooling fluid and, in a first flow pattern, cooling fluid is driven through the heat absorption chamber using the first flow path and, in a second flow pattern, cooling fluid is driven through the heat absorption chamber using the second flow path.
- By using physically separate cooling paths for the cooling fluid, associated with different flow patterns, cooling fluid used in a particular flow pattern does not mix with cooling fluid of a separate flow pattern, improving heat distribution in networks of interconnected heat dissipation and heat absorption chambers.
- According to an embodiment of a second aspect of the present invention, an integrated heat spreader is provided. The integrated heat spreader comprises at least one heat absorption chamber having a first surface for interfacing with a heat generating component and at least one heat dissipation chamber having a second surface for interfacing with an external coolant, the second surface being larger than the first surface. The integrated heat spreader further comprises a cooling fluid filling, at least partially, the at least one heat absorption chamber and the at least one heat dissipation chamber, at least one fluid interconnection between the at least one heat absorption chamber and the at least one heat dissipation chamber, and at least one pump element for creating a plurality of flow patterns between the at least one heat absorption chamber and the at least one heat dissipation chamber using a forced movement of the cooling fluid.
- By providing an integrated heat spreader comprising at least one heat absorption chamber, at least one heat dissipation chamber, a cooling fluid, at least one fluid interconnection and at least one pump element for creating different flow patterns between the chambers, a self-contained cooling system for a heat generating component is created.
- According to a further embodiment of the second aspect, at least one pump element comprises at least one membrane arranged in the at least one heat dissipation chamber. By providing a membrane in the at least one heat dissipation chamber, a pump mechanism internal to the integrated heat spreader is implemented.
- According to a further embodiment of the second aspect, the at least one heat absorption chamber or heat dissipation chamber comprises at least one chamber wall having a surface enhancement feature for an increased heat exchange between the chamber wall and the cooling fluid. A chamber wall having a surface enhancement feature, such as a mesh structure, for example, increases the thermal flow through the heat spreader.
- According to a further embodiment of the second aspect, the heat absorption chamber comprises at least two physically separated flow paths for the cooling fluid. By providing at least two physically separated flow paths in the at least one absorption chamber, unintended mixing of cooling fluid of different flow patterns may be reduced.
- According to a further embodiment of the second aspect, the heat absorption chamber comprises at least four ports for at least four fluid interconnections, each port hydraulically connected to one further port of the at least four ports of the heat absorption chamber. By connecting each port of a multi-port heat absorption chamber with only one other port, a plurality of physically separated flow paths through the heat absorption chamber is provided.
- According to an embodiment of a third aspect of the present invention, a method for cooling a heat generating component being in thermal contact with a first surface of a heat spreader having a plurality of chambers comprising a cooling fluid is provided. The method comprises the steps of:
-
- determining an average temperature of the first surface or of the heat generating component,
- determining the position of at least one hot spot of the heat generating component, the at least one hot spot having a temperature above the determined average temperature,
- mapping the determined position of the at least one hot spot to a location on the first surface of the heat spreader,
- generating at least one first control signal for generating a first flow pattern of the cooling fluid through the plurality of chambers passing the mapped location, and
- generating at least one second control signal in alternating turns with the at least first control signal for generating a second flow pattern of the cooling fluid through the plurality of chambers, returning the cooling fluid back to its initial location.
- By performing the method steps in accordance with the third aspect, an efficient cooling of a hot spot of a heat generating component may be achieved.
- According to a further embodiment of the third aspect, in the second flow pattern the cooling fluid passes the mapped location of the hot spot in alternating turns with the first flow pattern. By also passing the location mapped to the at least one hot spot in the second flow pattern, a continuous cooling of the hot spot may be achieved.
- According to a further embodiment of the third aspect, the method further comprises determining at least one chamber of the plurality of chambers having a temperature below the determined average temperature, wherein, in the step of generating the at least one first control signal, the first flow pattern of the cooling fluid is sourced from the at least one chamber determined to have an below average temperature. By sourcing the first flow pattern from a chamber having a below average temperature, the heat source is cooled to the lowest possible temperature.
- The invention and its embodiments will be more fully appreciated by reference to the following detailed description of presently preferred but nonetheless illustrative embodiments in accordance with the present invention when taken in conjunction with the accompanying drawings.
- The figures are illustrating:
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FIG. 1 , a cross-section through a cooling arrangement according to an embodiment of the present invention, -
FIG. 2 , a cross-section through an integrated heat spreader from above according to an embodiment of the present invention, -
FIG. 3A toFIG. 3D , different flow patterns through a heat absorption chamber according to different embodiments of the present invention, -
FIG. 4 , a blade module comprising several heat generating components and a cooling arrangement according to an embodiment of the present invention, -
FIG. 5 , a cross-section through a blade system comprising multiple blades, -
FIG. 6 , a cross-section through a blade system comprising multiple thin form factor blades, -
FIG. 7 , a thermal network comprising multiple heat generating components, -
FIG. 8 , a heat dissipation chamber having two separate flow paths according to an embodiment of the invention, -
FIG. 9 , a heat dissipation chamber having four separate flow paths according to an embodiment of the invention, and -
FIG. 10 , a cooling arrangement using the heat dissipation chamber ofFIG. 8 according to an embodiment of the invention. - In the drawings, the common reference signs are used to refer to like elements in different embodiments. In addition, added postfixes in the form of characters are used to distinguish individual elements of a group of similar elements. In cases where no such distinction is made in the corresponding description, any element of that group may be referred to.
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FIG. 1 shows a cross-section through a cooling arrangement comprising aprocessor 1, aheat spreader 2 and twoactuators actuators 3 are connected to and driven by acontroller 19, which may be an integral part of the heat cooling arrangement or theprocessor 1, or separate therefrom. Theprocessor 1 is mounted in asocket 4, which also comprises electrical contacts for providing theprocessor 1 with electrical energy and data. Typically, theprocessor 1 will comprise a large number of contacts, for example hundreds of contacts arranged in a so-called ball grid array (BGA).Processor 1 may also be mounted directly or indirectly on a printed circuit board (PCB) by any other known technology. - The
processor 1 has a top surface 5, which is used to dissipate energy created by the transistors and other circuitry comprised in theprocessor 1. The top surface 5 of theprocessor 1 is in direct physical and thermal contact with afirst surface 6 of theheat spreader 2. The top surface 5 and thefirst surface 6 roughly match in size and may have an area of roughly 1 cm2, for example. Theheat spreader 2 also comprises a multiplicity ofair fins 7, which together provide asecond surface 8. Thesecond surface 8 is much larger than thefirst surface 6. For example, thesecond surface 8 may comprise an area of roughly 1000 cm2 with the heat spreader footprint being approximately 100 cm2. Thesecond surface 8 may be cooled by a cooling fan not shown inFIG. 1 . - In order to allow fast and efficient heat transfer from the
first surface 6 to thesecond surface 8, theheat spreader 2 comprises aheat absorption chamber 9 and twoheat dissipation chambers heat absorption chamber 9 and theheat dissipation chambers fluid interconnections Actuator 3 a andactuator 3 b can generate a flow from theheat dissipation chamber 10 a through theheat absorption chamber 9 to theheat dissipation chamber 10 b, for example. As can be seen inFIG. 1 , theheat absorption chamber 9 is preferably located in physical proximity to the heat generating component, theprocessor 1 in this case, in order to reduce the thermal resistance there between. In the presented example, theheat absorption chamber 9 is separated from the top surface 5 of theprocessor 1 by a relatively thin chamber wall. - In one example, the
actuator 3 a will create an overpressure whileactuator 3 b will create a low-pressure in a coolingfluid 13, filling at least in part theheat absorption chamber 9 and theheat dissipation chambers 10, resulting in a flow from left to right in the cooling arrangement depicted inFIG. 1 . In a subsequent time period, theactuator 3 b may create an overpressure while theactuator 3 a creates a low-pressure such that the coolingfluid 13 flows back from theheat dissipation chamber 10 b through theheat absorption chamber 9 to theheat dissipation chamber 10 a. By moving the coolingfluid 13 from oneheat dissipation chamber 10 a to the otherheat dissipation chamber 10 b, heat can be transferred with desirable effect from thefirst surface 6 to thesecond surface 8. - Although
FIG. 1 depicts a cooling arrangement comprising twoheat dissipation chambers heat dissipation chamber 10 connected to theheat absorption chamber 9 may be used. For example, a membrane may separate hot andcold cooling fluid 13 within a singleheat dissipation chamber 10 pumped from and to theheat absorption chamber 9 using twofluid interconnections actuators single actuator 3 and one or more vents may be used to create two or more different flow patterns through theheat absorption chamber 9. - In the arrangement presented in
FIG. 1 , both theheat absorption chamber 9 and theheat dissipation chambers mesh structure 12 which increases the internal surface of the chambers and increases the fluid structure interaction. In consequence, a heat transfer from the solid part of theheat spreader 2, in particular thefirst surface 6, to the coolingfluid 13 and from the coolingfluid 13 to thesecond surface 8 is greatly increased. Themesh structure 12 may be adapted to the shape and characteristics of each chamber. For example, a highdensity mesh structure 12 may be employed in a relatively smallheat absorption chamber 9, while a lowerdensity mesh structure 12 may be employed in a largerheat dissipation chamber 10. - In addition, a
solid part 14 of theheat spreader 2 helps to spread further heat from thefirst surface 6 to thesecond surface 8. In particular in cases where the flow of the coolingfluid 13 is blocked or reduced, a cooling of theprocessor 1 can be achieved by heat conduction from thefirst surface 6 to theair fins 7 arranged in a central area of theheat spreader 2. -
FIG. 2 shows a cross-section through anintegrated heat spreader 2 from above. Theheat spreader 2 comprises oneheat absorption chamber 9 in the center and fourheat dissipation chambers 10 a to 10 d. Theheat absorption chamber 9 is connected to the fourheat dissipation chambers 10 a to 10 d by means offluid interconnections 11 a to 11 d. Eachfluid interconnection 11 comprises an integrated channel structure 15 and atube section 16. Thechannel structures 15 a to 15 d may be etched or stamped into thesolid part 14 of theheat spreader 2. Thetube section 16 may be bonded to thesolid part 14 and theheat dissipation chambers 10 a to 10 d. - The different parts of the
heat spreader 2 may be comprised in a single plate as shown inFIG. 1 or in three separate plates, twoupper plates lower plate 18 for heat absorption as shown inFIG. 2 . That is, theheat spreader 2 may be a single, integrated physical assembly or a system comprising two or more physically separate but interconnected units. - The
fluid interconnections 11 a to 11 d between theheat absorption chamber 9 of thelower plate 18 and the fourheat dissipation chambers 10 a to 10 d of theupper plates first surface 6, which is in contact with the top surface 5 of aprocessor 1 or any other heat generating component, and thesecond surface 8, for example,fins 7 attached to theupper plates fluid interconnections 11, a lower resistance transport of heat to the outermost regions of theheat spreader 2, i.e. away from the heat generating component, may be obtained. - In order to facilitate improved heat transfer from the
first surface 6 to a coolingfluid 13, amesh structure 12 may be etched, plated, molded or stamped into theheat absorption chamber 9. Equally,mesh structures 12 may be formed in each one of theheat dissipation chambers 10 a to 10 d. Themesh structure 12 integrated into theheat absorption chamber 9 may physically connect two opposing walls of that chamber, thus creating an additional heat conduction path from thefirst surface 6 to theair fins 7. Such andsimilar mesh structures 12, also referred to as surface enhancement features, are described in further detail in US 2007/0017659 A1, which is incorporated herein by reference. - In the example presented in
FIG. 2 , each of theheat dissipation chambers 10 a to 10 d comprises amembrane 20 which is connected to an internal orexternal actuator 3 by means of a piston like element. By moving themembrane 20 within aheat dissipation chamber 10 up or down, an over- or low-pressure can be created in that heat dissipation chamber. If, for example, an overpressure is created in theheat dissipation chamber 10 a and an low-pressure is created in theheat dissipation chamber 10 c, the flow of cooling fluid 13 from theheat dissipation chamber 10 a through thefluid interconnection 11 a, theheat absorption chamber 9 and thefluid interconnection 11 c to theheat dissipation chamber 10 c is created. Alternatively, themembranes 20 or other pumping elements may also be located in a separate component from theheat dissipation chambers 10. - Assuming that the cooling
fluid 13 present at theheat dissipation chamber 10 a is relatively cool, in particular has a temperature below a temperature of the coolingfluid 13 in other regions of theheat spreader 2, a first flow of coolingfluid 13 is created which arrives atfirst surface 6 very rapidly, i.e. using only moderate pump displacement and thus power, and without heating up significantly on its way. The use of moderate pump displacement is achieved due to the low surface to volume ratio ofinterconnect 11 a, which is not meshed, in contrast with theheat exchanging regions volume ratio interconnect 11 a. Additionally, the coolingfluid 13, which will be heated up in theheat absorption chamber 9 to a relatively high temperature, is transported very effectively to theheat dissipation chamber 10 c without a substantial temperature drop along thenarrow fluid interconnection 11 c. Because of the large differences in temperature between theheat absorption chamber 9 and the relatively cool coolingfluid 13 and, inversely, between the relativelywarm cooling fluid 13 and theheat dissipation chamber 10 c, heat is transported away from thefirst surface 6 very rapidly and effectively. - In the example described above, the heated up cooling
fluid 13 may remain at theheat dissipation chamber 10 c temporarily, while a second flow is created from theheat dissipation chamber 10 b to theheat dissipation chamber 10 d, for example. Using multiple flow patterns has the advantage that, while part of the coolingfluid 13 may rest in one heat dissipation chamber, likeheat dissipation chamber 10 c for example, an uninterrupted flow of coolingfluid 13 through theheat absorption chamber 9 can be maintained, thus constantly cooling thefirst surface 6 of theheat spreader 2. - The designs of the
heat spreaders 2 presented inFIG. 1 andFIG. 2 comprise a relatively largesolid part 14 and relativelynarrow fluid interconnections 11. In particular, thesolid part 14 occupies a larger area of the presented cross-section of thelower plate 18 than thefluid interconnections 11. This has the added advantage that even if the flow of coolingfluid 13 is blocked, for example because one or several of theactuators 3 is deactivated or fails, because a part of the coolingfluid 13 has escaped from theintegrated heat spreader 2 or because one of thefluid interconnections 11 is blocked, heat dissipation from thefirst surface 6 may still take place by means of heat conduction within thesolid part 14. Thus, while the overall effectiveness of theheat spreader 2 will be greatly reduced in such cases, limited cooling is still provided for a heat generating component arranged on thefirst surface 6. - So far, heat dissipation from a heat source spread over a relatively large
first surface 6 of theheat absorption chamber 9 was described. However, in practice, many heat generating devices have a non-uniform heat distribution along their top surface 5. For example, aprocessor 1 comprises an arithmetic logical unit or processor core and a relatively large cache memory, occupying a larger area than the processor core. Theprocessor 1 will generate considerably more heat in the area corresponding to the processor core than in the area corresponding to the cache memory. In contrast, the cache memory will occupy most of the area of the top surface 5 to be cooled. In consequence, a heat generating component may comprise one or several so-called “hot spots”, whose temperature is above the average temperature of the heat generating component. For example, an arithmetic mean of several temperatures measured in different areas of the top surface 5 may be determined. An area having a temperature which lies above the determined arithmetic mean by a predefined absolute or relative amount, for example 5 degrees centigrade or a determined standard deviation of the measure temperatures, is identified as a hot spot. Alternatively, one or several maximum values of a temperature distribution may be determined. -
FIG. 3A toFIG. 3D show different flow patterns through aheat absorption chamber 9 which may be used to create effective cooling flows for a number of hot spots. In particular,FIG. 3A shows aheat absorption chamber 9 arranged in the area of afirst surface 6. Thefirst surface 6 may correspond, for example, to the die size of a semiconductor chip mounted on the first to surface 6.Fluid interconnections 11 a to 11 d serve as inlets and outlets to theheat absorption chamber 9 and are coupled toactuators 3 a to 3 d respectively, although this is not shown inFIG. 3A toFIG. 3D . In addition,solid parts 14 separate different flow paths within theheat absorption chamber 9 and also act as heat conductor and surface enhancement features. - In the example shown in
FIG. 3A a first flow pattern fromfluid interconnections fluid interconnections 11 c to 11 d, acting as fluid outlet, is created. A second flow pattern, which is not shown inFIG. 3A , is the inverse of the fluid pattern presented, i.e. thefluid interconnection fluid interconnections heat absorption chamber 9 is created. - On the
first surface 6, twohot spots solid part 14 and the pressure distribution profile within the coolingfluid 13 in theheat absorption chamber 9, a relatively fast first flow of coolingfluid 13 across thehot spots fluid 13 within theheat absorption chamber 9. Relatively cool areas, arranged, for example, between the left, central and rightsolid parts 14, receive a second flow of cooling fluid having a lower flow velocity than the first flow and are not cooled as efficiently by the flow patterns described. In contrast, a much higher pump power would have to be implemented for cooling all areas of thefirst surface 6 equally, resulting in a less effective overall cooling system. -
FIG. 3B shows a different configuration of afirst surface 6 having fourhot spots 21 a to 21 d. Here, a different flow pattern is used to cool thehot spots 21. In the flow pattern example presented, two opposingfluid interconnections fluid interconnections fluid 13 are bifurcated by the centralsolid part 14 and, in consequence, flows of the coolingfluid 13 across allhot spots 21 a to 21 d are created in a first phase. In a second phase, the direction of the flows indicated inFIG. 3B is reversed, such thatfluid inlets fluid interconnections FIG. 3B , the axis of the oscillation may be altered with time, resulting in a rotating and oscillating flow pattern. For example, the axis of oscillation may change from a first diagonal direction via a horizontal direction and a second diagonal direction to a vertical direction and so on. -
FIG. 3C shows a further configuration of afirst surface 6 having fourhot spots 21 a to 21 d. In this configuration, thesolid part 14 arranged in the central area of theheat absorption chamber 9 createsinternal channels 22 a to 22 d. In the configuration shown, the a firstinternal channel 22 aguides cooling fluid 13 across twohot spots internal channel 22 b guides coolingfluid 13 across thehot spots - In a first flow pattern, which is similar to the flow pattern presented in
FIG. 3A , coolingfluid 13 is pumped from the left to the right. In a second flow pattern, the flow of the coolingfluid 13 is reversed, i.e. a flow from the right to the left is created. Thus, in the first phase, thehot spots hot spots fluid 13 arrives at their location, it has already been pre-heated by thehot spots hot spots -
FIG. 3D shows a further configuration of aheat absorption chamber 9 with thefirst surface 6 comprising eighthot spots 21. In the configuration shown inFIG. 3D , twohot spots 21 are present in each one of theinternal channels 22. In addition, theinternal channels 22 are narrower in places of thehot spots 21 than in other places, resulting in an accelerated flow across thehot spots 21. The flow pattern used to cool all of thehot spots 21 are similar to the ones described with reference toFIG. 3B . - Instead of forming discrete
internal channels 22 as shown inFIG. 3C andFIG. 3D , a density of amesh structure 12 may be increased in areas close to ahot spot 21 and reduced in cooler areas of the first surface. In this way the flow rate of the coolingfluid 13 may be adapted to varying cooling requirements of a heat generating component. - The physical arrangement of the
heat absorption chamber 9 and thefluid interconnections 11 ofFIG. 3A andFIG. 3B and those shown inFIGS. 3C and 3D are identical. This means that acontroller 19 connected to a cooling arrangement may switch from one flow pattern, for example a linear flow pattern, to another, for example a radial flow pattern, by adapting one or several control signals provided toactuators 3. More particularly, the situations depicted inFIG. 3A andFIG. 3B , orFIG. 3C andFIG. 3D may be used for operating the same heat generating components in different operating modes. For example, aprocessor 1 having multiple processor cores may not use all processor cores at all times, resulting in different heat distributions at its top surface 5. - A method for operating the cooling arrangement may be used to compute control signals for the
actuators 3 that create different flows of coolingfluid 13 within theheat spreader 2. Such a method can be used to adapt the configuration of the cooling arrangement on demand. The method may be implemented in hard- or software or a combination thereof, e.g. a purpose designedcontroller 19 or auniversal processor 1 executing a computer code loaded from some storage medium, like a RAM, ROM or magnetic storage medium. - According to an advanced embodiment, one or several heat sensors are comprised in the heat generating components, for example on or close to a die of a
processor 1, which sense the temperature of thefirst surface 6. This information may be provided to thecontroller 19 providing signals to theactuators 3, thus controlling the flow patterns through theheat absorption chamber 9. If, for example, acontroller 19 identifies that thehot spot 21 a shown in the configuration presented inFIG. 3A is considerably hotter than thehot spot 21 b in the lower part, a relatively higher pump drive signal may be provided to theactuators actuators - Alternatively, or in addition, temperature sensors may also be provided on or in the
heat spreader 2, theheat absorption chamber 9 or theheat dissipation chamber 10. Temperature information provided to thecontroller 19 may be used to identify cooler regions of theheat spreader 2, which may be used as a source of coolingfluid 13 for coolinghot spots 21. In this way, the controller may determine an optimal configuration automatically, for example by determining the side of the heat spreader from which cool air or liquid for secondary cooling is provided. -
FIG. 4 shows a top view and a cross-section of a so-calledblade 26, which is a printed circuit computer board having a particularly thin form factor of roughly 30 mm height.FIG. 4 shows a possible configuration of aheat spreader 2 which is particularly suited for cooling heat generating components of theblade 26. In this configuration, anupper plate 17 comprising aheat dissipation chamber 10 is arranged on acooling plate 23 opposite to a printedcircuit board 24 carrying one or several heat generating components. The coolingplate 23 serves as a heat dissipation area for the arrangement shown inFIG. 4 , i.e. during operation of theblade 26, heat is transferred from the heat generating components to thecooling plate 23, the heat generating components having a higher temperature than the coolingplate 23. Theupper plate 17 extends over a large area with respect to the dimension of the printedcircuit board 24 and has a vertical clearance over the highest surface of components mounted on the printedcircuit board 24. - In the example presented in
FIG. 4 , only acentral processor 1 arranged in the center of theheat spreader 2 is in thermal contact with afirst surface 6 in an area of aheat absorption chamber 9 of theheat spreader 2. Theheat absorption chamber 9 is thermally coupled to thecooling plate 23 using a fourfluid interconnects 11. In addition,secondary heat sources 25, such as logic chips, are in thermal contact withair fins 7 made from a heat conductive material, for example copper, which couple thesecondary heat sources 25 to theupper plate 17. -
Membranes 20 andactuators 3 are arranged on the periphery of the coolingplate 23 and can create an oscillating and optionally azimuthally rotating flow pattern within theupper plate 17. In addition, thefluid interconnections 11 create channels between theupper plate 17 and thelower plate 18 comprising theheat absorption chamber 9 in the area of theprocessor 1. In this way, hot spots present on a top surface 5 of theprocessor 1 can be cooled very effectively with a relatively fast flow of coolingfluid 13, while spreading the heat across the extent of the coolingplate 23 having a much larger cross sectional area results in a slower flow there. - In addition, cooling may be affected by different means or a combination thereof. In particular, the
blade 26 shown inFIG. 4 may be cooled by anair flow 30 through theair fins 7. In the example presented, theair flow 30 is also used to cool atertiary heat source 31 having a separate finned air cooler andmemory modules 32. In addition or alternatively, cooling may be performed by heat conduction or radiation from the coolingplate 23, which may be arranged on a chassis part of a blade cage or a further heat exchanger, for example. -
FIG. 5 shows a configuration of a computer system comprisingseveral blades 26. As can be seen inFIG. 5 , the coolingplates 23 ofblades 26 are arranged top-to-top separated by acold plate 27 of ablade cage 28. Thecold plate 27 of theblade cage 28 comprises a secondary cooling circuit, for example a water cooling system. Thecold plate 27 comprises a coolant having a temperature below the temperature of the coolingplate 23, which transports heat away from the coolingplates 23 of the heat spreader of theblades 26 to an external cooler. At the same time, there is no need for a fluid connection between theblade cage 28 and theblades 26, allowing straightforward insertion and removal ofindividual blades 26. In this way, a computer system comprising a large number ofblades 26 can be built and cooled efficiently. Optionally the blades could be arranged bottom-to-top or with higher power dissipation components on both sides of the printed circuit board in order to increase integration density even further. -
FIG. 6 shows another blade system comprising a plurality of so-called thinform factor blades 26. Thin form factor blades are less than 30 mm in height, such that an arrangement as shown inFIG. 5 may not be used for partial air cooling. Thus, according toFIG. 5 , practically all the heat dissipated on the printedcircuit board 24 is transferred by the coolingfluid 13 from the heat generating components to thecold plate 27 directly, i.e. not using a separatelower plate 18 orair fins 7. In order to optimize the heat flux from theprocessor 1, ahigh density mesh 12 a is used in its area, acting as aheat absorption chamber 9, while alower density mesh 12 b is used in another area, acting as aheat dissipation chamber 10. Theabsorption chamber 9 and thedissipation chambers 10 are combined in one thermal spreader plane that distributes the heat load evenly so that it can effectively be transferred across the thermal interface between the spreader and thecold plate 27. With this arrangement, blade components and blade pitch can be vertically compressed to approximately 5 mm per printed circuit board with components and thermal spreader planes mounted on both sides. -
FIG. 7 shows a thermal network comprising multiple heat sources. In such an arrangement, multipleheat absorption chambers 9 andheat dissipation chambers 10 may be interconnected by a multiplicity offluid interconnections 11. Multiple membrane pumps 29 are connected to the thermal network and allow creating a multiplicity of flow patterns through the network. In this way, an array-like structure ofheat absorption chambers 9 andheat dissipation chambers 10 may be controlled effectively in order to spread the heat generated by a number of heat generating components such asprocessors 1 andsecondary heat sources 25 over a relatively large area. The heat may be spread uniformly over the entire thermal network or, alternatively, directed to areas with increased cooling capabilities. For example, higher volumes of coolingfluid 13 may be pumped into aheat dissipating chamber 10 close to a cooling air inlet. - Depending on the actual layout of the array, separate membrane pumps 29 need not be implemented for each
heat dissipation chamber 10. For example, a first column, comprising themembrane pump 29 a, theheat dissipation chambers heat absorption chamber 9 a, and a second column, comprising themembrane pump 29 b, theheat dissipation chambers heat absorption chamber 9 b, are operated together, sharing the two membrane pumps 29 a and 29 b. This is achieved by connecting the lowerheat dissipation chambers fluid interconnection 11, in particular atube section 16. In this way, while coolingfluid 13 is pumped from theheat dissipation chamber 10 a to theheat dissipation chamber 10 c via a firstheat absorption chamber 9 a, coolingfluid 13 is also pumped from theheat dissipation chamber 10 d to theheat dissipation chamber 10 b via a secondheat absorption chamber 9 b. - At the same time, or alternating with this flow of cooling
fluid 13, a further flow pattern corresponding to the row of the network may be generated by membrane pumps 29 c and 29 d. This will cool the twoprocessors 1 and the twosecondary heat sources 25 arranged in that row. Theheat absorption chambers 9 c and 9 d may be configured differently than theheat absorption chambers fluid interconnections 11, while each one of theheat absorption chambers fluid interconnections 11. In addition, theheat dissipation chambers heat dissipation chambers 10 shown inFIG. 7 , due to the reduced heat generation of the secondary heat sources 25. In general, instead or additional to adapting the flow path used by the coolingfluid 13 in different flow patterns, the amount of coolingfluid 13 pumped through theheat absorption chambers 9 or heat dissipation chambers may be adapted in different flow patterns with acontroller 19. -
FIG. 8 shows an alternative design for aheat absorption chamber 9. In particular, theheat absorption chamber 9 according toFIG. 8 comprises twoseparate flow paths hot spot 21 of theheat absorption chamber 9. Thehot spot 21 may be arranged in a central area, where theflow paths heat absorption chamber 9 comprises fourfluid ports 34 a to 34 d, which serve as fluid inlet and fluid outlets to the first andsecond flow paths - By actuating the first flow along the
first flow path 33 a alternating with a second flow along thesecond flow path 33 b, a radial distribution of heat from thehot spot 21 is achieved. That is, although the first and second flows are alternating, thehot spot 21 is cooled continuously. -
FIG. 9 shows a further embodiment of aheat absorption chamber 9 according to an embodiment of the invention. In particular, theheat absorption chamber 9 according toFIG. 9 comprises fourseparate areas 35 a to 35 d that are physically separated from one another by means of partitioningwalls 36. Eacharea 35 a to 35 d comprises twofluid ports 34, which serve as an inlet and outlet to the particular area. - The embodiment of the
heat absorption chamber 9 shown inFIG. 9 represents an eight-port radial absorber with four isolated flow paths 33. The flow paths 33 according toFIG. 9 are both radially and horizontally distributed. For example, a first and third flow along theflow paths fluid 13 may be affected in a second flow pattern alongflow path - Alternative control signals may be used to implement more complicated flow patterns through the
heat absorption chamber 9 shown inFIG. 9 . For example, in a first four-phase flow pattern, eacharea 35 a to 35 d may be provided with cooling fluid 13 sequentially around the chamber in phases. In an alternative four-phase flow pattern, the first andthird areas heat absorption chamber 9 may be provided with a coolingfluid 13 in a first direction in a first phase, followed by the provision of the coolingfluid 13 to the second and thefourth area fluid 13. -
FIG. 10 shows a cooling arrangement using theheat absorption chamber 9 according toFIG. 8 . The fourfluid ports 34 a to 34 d of theheat absorption chamber 9 are connected to fourheat dissipation chambers 10 a to 10 d. Usingactuators 3 a to 3 d connected with theheat dissipation chambers 10 a to 10 d, in effect a periodic radial spreading of heat from theheat absorption chamber 9 is implemented by driving theactuators actuators - Although different aspects and features of cooling arrangements were described with reference to different embodiments above, a person skilled in the art may combine any feature disclosed herein with any other feature or combination thereof. In particular, flow patterns described with reference to a single
heat absorption chamber 9 may also be used in a network or array interconnecting a plurality ofheat absorption chambers 9 and vice versa. - In addition, although the cooling arrangements described above were described with reference to a single plane architecture for reasons of representational simplicity, the same or similar techniques may be applied to multi-level design, wherein several heat generating components are stacked on top of each other, separated by cooling plates comprising one or several
heat absorption chambers 9.
Claims (20)
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EP07115962 | 2007-09-07 | ||
PCT/IB2008/053547 WO2009031100A1 (en) | 2007-09-07 | 2008-09-02 | Method and device for cooling a heat generating component |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140307390A1 (en) * | 2013-04-12 | 2014-10-16 | International Business Machines Corporation | Integrated circuit package for heat dissipation |
US20140334103A1 (en) * | 2009-05-27 | 2014-11-13 | Rogers Germany Gmbh | Cooled electric unit |
WO2016172030A1 (en) * | 2015-04-21 | 2016-10-27 | Varian Semiconductor Equipment Associates, Inc. | Semiconductor manufacturing device with embedded fluid conduits |
WO2017151386A1 (en) * | 2016-03-03 | 2017-09-08 | Coolanyp, LLC | Self-organizing thermodynamic system |
US9807909B1 (en) * | 2014-09-01 | 2017-10-31 | Enplas Corporation | Socket for electric component |
US10191521B2 (en) * | 2017-05-25 | 2019-01-29 | Coolanyp, LLC | Hub-link liquid cooling system |
US10330400B2 (en) | 2015-03-17 | 2019-06-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Self-assembled or reconfigurable structures for heat flow control devices |
US20220008997A1 (en) * | 2018-11-22 | 2022-01-13 | Siemens Energy Global GmbH & Co. KG | Regulation method for additive manufacturing |
US11467637B2 (en) * | 2018-07-31 | 2022-10-11 | Wuxi Kalannipu Thermal Management Technology Co., Ltd. | Modular computer cooling system |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090294117A1 (en) * | 2008-05-28 | 2009-12-03 | Lucent Technologies, Inc. | Vapor Chamber-Thermoelectric Module Assemblies |
EP3220418B1 (en) * | 2016-03-18 | 2021-03-03 | Mitsubishi Electric R&D Centre Europe B.V. | Power module comprising a heat sink and a substrate to which a power die is attached and method for manufacturing the power module |
CN105955434A (en) * | 2016-06-30 | 2016-09-21 | 华为技术有限公司 | Flexible heat exchange unit, liquid cooling device and liquid cooling system |
CN108407722A (en) * | 2018-03-15 | 2018-08-17 | 斑马网络技术有限公司 | The temperature control method of intelligent back vision mirror, device and system |
CN109612599B (en) * | 2019-01-04 | 2021-02-26 | 佛山市格轶电器有限公司 | Built-in self-protection temperature sensor |
US11270925B2 (en) | 2020-05-28 | 2022-03-08 | Google Llc | Heat distribution device with flow channels |
CN112191032A (en) * | 2020-10-19 | 2021-01-08 | 夏建设 | Self-suction chemical waste gas extraction equipment |
WO2023039021A1 (en) * | 2021-09-08 | 2023-03-16 | Ryan Robert C | Methods, systems, and devices for cooling with minimal surfaces |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5694295A (en) * | 1995-05-30 | 1997-12-02 | Fujikura Ltd. | Heat pipe and process for manufacturing the same |
JP2001339026A (en) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | Plate-shaped heat pipe |
US20020062648A1 (en) * | 2000-11-30 | 2002-05-30 | Ghoshal Uttam Shyamalindu | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
US6672370B2 (en) * | 2000-03-14 | 2004-01-06 | Intel Corporation | Apparatus and method for passive phase change thermal management |
US20040182088A1 (en) * | 2002-12-06 | 2004-09-23 | Nanocoolers, Inc. | Cooling of electronics by electrically conducting fluids |
US6889756B1 (en) * | 2004-04-06 | 2005-05-10 | Epos Inc. | High efficiency isothermal heat sink |
US20060098411A1 (en) * | 2004-11-11 | 2006-05-11 | Taiwan Microloops Corp. | Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
US20070017659A1 (en) * | 2005-06-29 | 2007-01-25 | International Business Machines Corporation | Heat spreader |
US7169650B2 (en) * | 2002-03-12 | 2007-01-30 | Intel Corporation | Semi-solid metal injection methods for electronic assembly thermal interface |
US20070139889A1 (en) * | 2005-12-21 | 2007-06-21 | Sun Microsystems, Inc. | Feedback controlled magneto-hydrodynamic heat sink |
US7246655B2 (en) * | 2004-12-17 | 2007-07-24 | Fujikura Ltd. | Heat transfer device |
US7310231B2 (en) * | 2005-12-21 | 2007-12-18 | Sun Microsystems, Inc. | Heat sink having magnet array for magneto-hydrodynamic hot spot cooling |
US7483770B2 (en) * | 2003-02-20 | 2009-01-27 | Koninklijke Philips Electronics N.V. | Cooling assembly comprising micro-jets |
US7770630B2 (en) * | 2001-09-20 | 2010-08-10 | Intel Corporation | Modular capillary pumped loop cooling system |
US8051905B2 (en) * | 2006-08-15 | 2011-11-08 | General Electric Company | Cooling systems employing fluidic jets, methods for their use and methods for cooling |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4047561A (en) * | 1974-10-18 | 1977-09-13 | General Electric Company | Cooling liquid de-gassing system |
JP2001070889A (en) | 1999-09-07 | 2001-03-21 | Toshiba Corp | Sorting machine and sorting method |
WO2002046677A1 (en) * | 2000-12-04 | 2002-06-13 | Fujitsu Limited | Cooling system and heat absorbing device |
JP3815239B2 (en) | 2001-03-13 | 2006-08-30 | 日本電気株式会社 | Semiconductor device mounting structure and printed wiring board |
US6628522B2 (en) * | 2001-08-29 | 2003-09-30 | Intel Corporation | Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations |
DE10319367A1 (en) * | 2003-04-29 | 2004-11-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for creating a hydraulic network for optimized heat transfer and mass transfer |
CN1572456A (en) * | 2003-05-14 | 2005-02-02 | 陈敬义 | High efficiency heat conducting module and its making method |
EP1702360A2 (en) * | 2003-12-08 | 2006-09-20 | Noise Limit ApS | A cooling system with a bubble pump |
JP2005252056A (en) * | 2004-03-05 | 2005-09-15 | Sony Corp | Integrated circuit device and its manufacturing method |
US7870893B2 (en) * | 2006-04-06 | 2011-01-18 | Oracle America, Inc. | Multichannel cooling system with magnetohydrodynamic pump |
-
2008
- 2008-09-02 US US12/676,398 patent/US20110036538A1/en not_active Abandoned
- 2008-09-02 CN CN2008801057495A patent/CN101796635B/en not_active Expired - Fee Related
- 2008-09-02 EP EP08807504.9A patent/EP2188837B1/en not_active Not-in-force
- 2008-09-02 KR KR1020107003934A patent/KR101127354B1/en not_active IP Right Cessation
- 2008-09-02 WO PCT/IB2008/053547 patent/WO2009031100A1/en active Application Filing
- 2008-09-02 JP JP2010523618A patent/JP5425782B2/en not_active Expired - Fee Related
- 2008-09-03 TW TW097133731A patent/TW200925540A/en unknown
-
2015
- 2015-02-26 US US14/632,194 patent/US10278306B2/en active Active
- 2015-02-26 US US14/632,180 patent/US10091909B2/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5694295A (en) * | 1995-05-30 | 1997-12-02 | Fujikura Ltd. | Heat pipe and process for manufacturing the same |
US6672370B2 (en) * | 2000-03-14 | 2004-01-06 | Intel Corporation | Apparatus and method for passive phase change thermal management |
JP2001339026A (en) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | Plate-shaped heat pipe |
US20020062648A1 (en) * | 2000-11-30 | 2002-05-30 | Ghoshal Uttam Shyamalindu | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
US7770630B2 (en) * | 2001-09-20 | 2010-08-10 | Intel Corporation | Modular capillary pumped loop cooling system |
US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
US7169650B2 (en) * | 2002-03-12 | 2007-01-30 | Intel Corporation | Semi-solid metal injection methods for electronic assembly thermal interface |
US20040182088A1 (en) * | 2002-12-06 | 2004-09-23 | Nanocoolers, Inc. | Cooling of electronics by electrically conducting fluids |
US7483770B2 (en) * | 2003-02-20 | 2009-01-27 | Koninklijke Philips Electronics N.V. | Cooling assembly comprising micro-jets |
US6889756B1 (en) * | 2004-04-06 | 2005-05-10 | Epos Inc. | High efficiency isothermal heat sink |
US20060098411A1 (en) * | 2004-11-11 | 2006-05-11 | Taiwan Microloops Corp. | Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
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Also Published As
Publication number | Publication date |
---|---|
KR101127354B1 (en) | 2012-03-30 |
CN101796635A (en) | 2010-08-04 |
TW200925540A (en) | 2009-06-16 |
EP2188837B1 (en) | 2015-10-28 |
CN101796635B (en) | 2012-07-04 |
US20150195955A1 (en) | 2015-07-09 |
JP5425782B2 (en) | 2014-02-26 |
WO2009031100A1 (en) | 2009-03-12 |
US10278306B2 (en) | 2019-04-30 |
US10091909B2 (en) | 2018-10-02 |
EP2188837A1 (en) | 2010-05-26 |
JP2010538487A (en) | 2010-12-09 |
KR20100051077A (en) | 2010-05-14 |
US20150176911A1 (en) | 2015-06-25 |
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