US20110100612A1 - Liquid cooling device - Google Patents
Liquid cooling device Download PDFInfo
- Publication number
- US20110100612A1 US20110100612A1 US12/647,385 US64738509A US2011100612A1 US 20110100612 A1 US20110100612 A1 US 20110100612A1 US 64738509 A US64738509 A US 64738509A US 2011100612 A1 US2011100612 A1 US 2011100612A1
- Authority
- US
- United States
- Prior art keywords
- heat
- absorbing
- cooling device
- liquid cooling
- absorbing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure generally relates to liquid cooling devices, and more particularly to a liquid cooling device for dissipating heat from heat-generating electronic components such as processors of computers.
- CPUs central processing units
- computers are capable of operating at a higher frequency and speed.
- the heat generated by the CPUs during normal operation is commensurately increased. If the generated heat can not be quickly removed away from the CPUs, the CPUs will be overheated, and eventually the workability and stability of the CPUs will be affected.
- cooling devices In order to remove the heat of the CPUs, cooling devices often need to be provided to the CPUs to dissipate heat therefrom.
- heat sinks combined with electric fans are usually used for this heat dissipation purpose.
- These conventional cooling devices are sufficient for CPUs with low operating frequencies, but are unsatisfactory for cooling the CPUs with high operating frequencies.
- a typical liquid cooling device generally includes a heat-absorbing member for absorbing heat from the CPU, a heat-dissipating member for dissipating the heat to the surrounding environment, a pump for driving a coolant to circulate between the heat-absorbing member and the heat-dissipating member, and a plurality of tubes for connecting the heat-absorbing member, the pump and the heat-dissipating member in a loop.
- the heat-absorbing member is maintained in thermal contact with the CPU for absorbing heat generated by the CPU.
- the coolant is driven by the pump to circulate between the heat-absorbing member and the heat-dissipating member to continuously bring the heat absorbed by the heat-absorbing member to the heat-dissipating member where the heat is dissipated away.
- the heat-absorbing member is generally a solid metal block and a liquid flow channel is defined in the heat-absorbing member for passage of the coolant.
- the heat of the CPU is absorbed by the coolant.
- the liquid flow channel has a relatively small heat exchange surface with the coolant and thereby the heat-absorbing member cannot exchange heat efficiently with the coolant. As a result, the heat of the CPU can not be adequately transferred to the coolant of the heat-absorbing member and timely taken away by the liquid cooling device.
- FIG. 1 schematically shows a liquid cooling device in accordance with an embodiment of the present disclosure.
- FIG. 2 is an exploded view of a heat-absorbing member of the liquid cooling device of FIG. 1 .
- FIG. 3 is similar to FIG. 2 , but shown from an inverted aspect.
- FIG. 4 is a partially assembled view of the heat-absorbing member of FIG. 2 .
- the liquid cooling device 100 includes a heat-absorbing member 10 , a heat-dissipating member 20 and a driving member 30 .
- the driving member 30 may be a pump. These individual components (i.e., the heat-absorbing member 10 , the heat-dissipating member 20 and the driving member 30 ) are connected together via a plurality of connecting tubes 40 so as to form a heat transfer loop. A coolant such as water is filled in the heat transfer loop and driven by the driving member 30 to circulate through the heat-absorbing member 10 and the heat-dissipating member 20 .
- the heat-absorbing member 10 includes a heat-absorbing plate 12 , a heat sink 18 on the heat-absorbing plate 12 , a heat pipe 16 interconnecting the heat sink 18 and the heat-absorbing plate 12 , and a cover 14 covered on and hermetically connected to the heat-absorbing plate 12 .
- the heat-absorbing plate 12 is made of a material having a good heat conductive property, such as copper.
- the heat-absorbing plate 12 has a planar top surface 122 and an opposite bottom surface 124 .
- a rectangular contact surface 126 protrudes out from the bottom surface 124 .
- Four mounting holes 128 are defined at four corners of the heat-absorbing plate 12 , respectively.
- the heat sink 18 includes a plurality of fins 180 stacked together with one above another along a bottom-to-top direction.
- the fins 180 are parallel to the heat-absorbing plate 12 .
- Two through holes 182 are defined in and extend through the heat sink 18 .
- the heat pipe 16 is U-shaped and includes a central evaporating section 162 and two condensing sections 164 extending upwardly from two opposite ends of the evaporating section 162 , respectively.
- the evaporating section 162 is fixed to the top surface 122 of the heat-absorbing plate 12 .
- the two condensing sections 164 are fixed in the two through holes 182 of the heat sink 18 , whereby the heat pipe 16 thermally connects the heat-absorbing plate 12 with the heat sink 18 .
- the cover 14 includes a sealing plate 141 and a sidewall 142 extending downwardly from an outer periphery of the sealing plate 141 .
- a top of the cover 14 is sealed by the sealing plate 141 .
- An cavity 145 is provided at a bottom of the cover 14 .
- a receiving chamber 140 is defined between the cover 14 and the heat-absorbing plate 12 .
- An annular groove 146 is defined in a bottom of an inner surface of the sidewall 142 and surrounds the cavity 145 .
- a waterproof ring 143 is disposed in the groove 146 to hermetically connect the cover 14 to the heat-absorbing plate 12 .
- mounting holes 144 corresponding to the four mounting holes 128 of the heat-absorbing plate 12 are defined at four corners of the cover 14 , respectively.
- An inlet hole 148 and an outlet hole 149 are provided at two opposite sides of the cover 14 , respectively.
- the inlet hole 148 and the outlet hole 149 each are defined through the sidewall 142 of the cover 14 and communicated with the receiving chamber 140 .
- the heat sink 18 is thermally connected to the heat-absorbing plate 12 via the heat pipe 16 .
- the heat pipe 16 is fixed to the heat-absorbing plate 12 at a position just corresponding to the contact surface 126 .
- the cover 14 is covered on the heat-absorbing plate 12 .
- Four fasteners 80 such as screws extend sequentially through the four mounting holes 144 of the cover 14 and the four mounting holes 128 of the heat-absorbing plate 12 to hermetically connect the cover 14 to the heat-absorbing plate 12 .
- the inlet hole 148 is connected with a connector 90 .
- the outlet hole 149 is connected with another connector 90 .
- the heat-absorbing member 10 is then connected with the connecting tubes 40 via the connectors 90 to form the heat transfer loop.
- the heat sink 18 together with the heat pipe 16 is received in the receiving chamber 140 of the heat-absorbing member 10 and immersed in the coolant filled in the receiving chamber 140 .
- the heat-absorbing member 10 is maintained in thermal contact with a heat-generating electronic component (not shown) such a CPU of a computer.
- a heat-generating electronic component such as a CPU of a computer.
- the contact surface 126 of the heat-absorbing plate 12 is brought to contact with the CPU.
- Heat generated by the CPU is transferred to and absorbed by the heat-absorbing plate 12 .
- a portion of the heat absorbed by the heat-absorbing plate 12 is transferred to the heat pipe 16 and then from the heat pipe 16 to the heat sink 18 .
- the coolant received in the receiving chamber 140 of the heat-absorbing member 10 exchanges heat with the heat sink 18 , and the heat sink 18 releases the heat to the coolant.
- another portion of the heat absorbed by the heat-absorbing plate 12 is directly released from the heat-absorbing plate 12 to the coolant.
- the coolant After the coolant receives the heat generated by the CPU, the coolant is driven by the driving member 30 to move towards the heat-dissipating member 20 where the heat is dissipated to the ambient environment. After releasing the heat in the heat-dissipating member 20 , the coolant is brought back to the heat-absorbing member 10 again by the driving member 30 , thus continuously taking the heat away from the CPU.
- the total heat exchange surface with the coolant of the heat sink 18 in the heat-absorbing member 10 greatly increases. Because the heat sink 18 is immersed in the coolant and can exchange heat rapidly and efficiently with the coolant, the heat of the CPU can be quickly and efficiently moved away by the coolant.
Abstract
Description
- 1. Technical Field
- The present disclosure generally relates to liquid cooling devices, and more particularly to a liquid cooling device for dissipating heat from heat-generating electronic components such as processors of computers.
- 2. Description of Related Art
- Along with fast developments in electronic information industries, electronic components such as central processing units (CPUs) of computers are capable of operating at a higher frequency and speed. As a result, the heat generated by the CPUs during normal operation is commensurately increased. If the generated heat can not be quickly removed away from the CPUs, the CPUs will be overheated, and eventually the workability and stability of the CPUs will be affected.
- In order to remove the heat of the CPUs, cooling devices often need to be provided to the CPUs to dissipate heat therefrom. Conventionally, heat sinks combined with electric fans are usually used for this heat dissipation purpose. These conventional cooling devices are sufficient for CPUs with low operating frequencies, but are unsatisfactory for cooling the CPUs with high operating frequencies.
- Liquid cooling devices with high heat dissipation efficiencies are used for dissipating heat generated by high operating frequency CPUs. A typical liquid cooling device generally includes a heat-absorbing member for absorbing heat from the CPU, a heat-dissipating member for dissipating the heat to the surrounding environment, a pump for driving a coolant to circulate between the heat-absorbing member and the heat-dissipating member, and a plurality of tubes for connecting the heat-absorbing member, the pump and the heat-dissipating member in a loop. In use, the heat-absorbing member is maintained in thermal contact with the CPU for absorbing heat generated by the CPU. The coolant is driven by the pump to circulate between the heat-absorbing member and the heat-dissipating member to continuously bring the heat absorbed by the heat-absorbing member to the heat-dissipating member where the heat is dissipated away.
- In the typical liquid cooling device, the heat-absorbing member is generally a solid metal block and a liquid flow channel is defined in the heat-absorbing member for passage of the coolant. As the coolant flows through the liquid flow channel, the heat of the CPU is absorbed by the coolant. However, the liquid flow channel has a relatively small heat exchange surface with the coolant and thereby the heat-absorbing member cannot exchange heat efficiently with the coolant. As a result, the heat of the CPU can not be adequately transferred to the coolant of the heat-absorbing member and timely taken away by the liquid cooling device.
- What is desired, therefore, is a liquid cooling device which can overcome the above described shortcoming.
-
FIG. 1 schematically shows a liquid cooling device in accordance with an embodiment of the present disclosure. -
FIG. 2 is an exploded view of a heat-absorbing member of the liquid cooling device ofFIG. 1 . -
FIG. 3 is similar toFIG. 2 , but shown from an inverted aspect. -
FIG. 4 is a partially assembled view of the heat-absorbing member ofFIG. 2 . - Reference will now be made to the drawing figures to describe the present liquid cooling device in detail.
- Referring to
FIG. 1 , aliquid cooling device 100 according an embodiment of the present disclosure is shown. Theliquid cooling device 100 includes a heat-absorbingmember 10, a heat-dissipatingmember 20 and adriving member 30. Thedriving member 30 may be a pump. These individual components (i.e., the heat-absorbingmember 10, the heat-dissipatingmember 20 and the driving member 30) are connected together via a plurality of connectingtubes 40 so as to form a heat transfer loop. A coolant such as water is filled in the heat transfer loop and driven by thedriving member 30 to circulate through the heat-absorbingmember 10 and the heat-dissipatingmember 20. - Referring to
FIGS. 2-4 , the heat-absorbingmember 10 includes a heat-absorbingplate 12, aheat sink 18 on the heat-absorbingplate 12, aheat pipe 16 interconnecting theheat sink 18 and the heat-absorbingplate 12, and acover 14 covered on and hermetically connected to the heat-absorbingplate 12. The heat-absorbingplate 12 is made of a material having a good heat conductive property, such as copper. The heat-absorbingplate 12 has a planartop surface 122 and anopposite bottom surface 124. Arectangular contact surface 126 protrudes out from thebottom surface 124. Fourmounting holes 128 are defined at four corners of the heat-absorbingplate 12, respectively. - The
heat sink 18 includes a plurality offins 180 stacked together with one above another along a bottom-to-top direction. Thefins 180 are parallel to the heat-absorbingplate 12. Two throughholes 182 are defined in and extend through theheat sink 18. - The
heat pipe 16 is U-shaped and includes acentral evaporating section 162 and twocondensing sections 164 extending upwardly from two opposite ends of theevaporating section 162, respectively. Theevaporating section 162 is fixed to thetop surface 122 of the heat-absorbingplate 12. The twocondensing sections 164 are fixed in the two throughholes 182 of theheat sink 18, whereby theheat pipe 16 thermally connects the heat-absorbingplate 12 with theheat sink 18. - The
cover 14 includes asealing plate 141 and asidewall 142 extending downwardly from an outer periphery of thesealing plate 141. A top of thecover 14 is sealed by thesealing plate 141. Ancavity 145 is provided at a bottom of thecover 14. Thus, when thecover 14 is coupled to the heat-absorbingplate 12, areceiving chamber 140 is defined between thecover 14 and the heat-absorbingplate 12. Anannular groove 146 is defined in a bottom of an inner surface of thesidewall 142 and surrounds thecavity 145. Awaterproof ring 143 is disposed in thegroove 146 to hermetically connect thecover 14 to the heat-absorbingplate 12. Fourmounting holes 144 corresponding to the fourmounting holes 128 of the heat-absorbingplate 12 are defined at four corners of thecover 14, respectively. Aninlet hole 148 and anoutlet hole 149 are provided at two opposite sides of thecover 14, respectively. Theinlet hole 148 and theoutlet hole 149 each are defined through thesidewall 142 of thecover 14 and communicated with thereceiving chamber 140. - In assembly of the heat-absorbing
member 10, theheat sink 18 is thermally connected to the heat-absorbingplate 12 via theheat pipe 16. Theheat pipe 16 is fixed to the heat-absorbingplate 12 at a position just corresponding to thecontact surface 126. Thecover 14 is covered on the heat-absorbingplate 12. Fourfasteners 80 such as screws extend sequentially through the fourmounting holes 144 of thecover 14 and the fourmounting holes 128 of the heat-absorbingplate 12 to hermetically connect thecover 14 to the heat-absorbingplate 12. Theinlet hole 148 is connected with aconnector 90. Theoutlet hole 149 is connected with anotherconnector 90. The heat-absorbingmember 10 is then connected with the connectingtubes 40 via theconnectors 90 to form the heat transfer loop. The heat sink 18 together with theheat pipe 16 is received in thereceiving chamber 140 of the heat-absorbingmember 10 and immersed in the coolant filled in thereceiving chamber 140. - In operation, the heat-absorbing
member 10 is maintained in thermal contact with a heat-generating electronic component (not shown) such a CPU of a computer. Thecontact surface 126 of the heat-absorbingplate 12 is brought to contact with the CPU. Heat generated by the CPU is transferred to and absorbed by the heat-absorbingplate 12. A portion of the heat absorbed by the heat-absorbingplate 12 is transferred to theheat pipe 16 and then from theheat pipe 16 to theheat sink 18. The coolant received in the receivingchamber 140 of the heat-absorbingmember 10 exchanges heat with theheat sink 18, and theheat sink 18 releases the heat to the coolant. On the other hand, another portion of the heat absorbed by the heat-absorbingplate 12 is directly released from the heat-absorbingplate 12 to the coolant. After the coolant receives the heat generated by the CPU, the coolant is driven by the drivingmember 30 to move towards the heat-dissipatingmember 20 where the heat is dissipated to the ambient environment. After releasing the heat in the heat-dissipatingmember 20, the coolant is brought back to the heat-absorbingmember 10 again by the drivingmember 30, thus continuously taking the heat away from the CPU. - In the present
liquid cooling device 100, the total heat exchange surface with the coolant of theheat sink 18 in the heat-absorbingmember 10 greatly increases. Because theheat sink 18 is immersed in the coolant and can exchange heat rapidly and efficiently with the coolant, the heat of the CPU can be quickly and efficiently moved away by the coolant. - It is to be understood, however, that even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiment, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309150.X | 2009-10-30 | ||
CN200910309150XA CN102056459A (en) | 2009-10-30 | 2009-10-30 | Liquid-cooling heat radiating device |
Publications (1)
Publication Number | Publication Date |
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US20110100612A1 true US20110100612A1 (en) | 2011-05-05 |
Family
ID=43924160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/647,385 Abandoned US20110100612A1 (en) | 2009-10-30 | 2009-12-24 | Liquid cooling device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110100612A1 (en) |
CN (1) | CN102056459A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170215301A1 (en) * | 2014-08-01 | 2017-07-27 | Beijing Deepcool Industries., Ltd. | Water block for water-cooling cpu radiator |
US9795058B2 (en) * | 2015-06-11 | 2017-10-17 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
US20170367217A1 (en) * | 2015-11-12 | 2017-12-21 | Apaltek Co., Ltd. | Liquid Cooling Radiation System and Liquid Radiator Thereof |
USD829183S1 (en) * | 2017-06-15 | 2018-09-25 | Shenzhen Gaoyu Electronic Technology Co., Ltd. | Graphic card radiator |
CN108803851A (en) * | 2018-08-29 | 2018-11-13 | 南昌大学 | A kind of novel C PU heat-pipe radiators |
US10299406B2 (en) * | 2016-01-19 | 2019-05-21 | Cooler Master Co., Ltd. | Liquid cooling heat sink device |
CN110430738A (en) * | 2019-08-28 | 2019-11-08 | 福建晋江热电有限公司 | Cooling device |
US20200166976A1 (en) * | 2018-11-22 | 2020-05-28 | Cooler Master Co.,Ltd. | External liquid cooling device |
US11297735B2 (en) * | 2019-04-23 | 2022-04-05 | In Win Development Inc. | Heat exchange device and liquid cooling system having the same |
US20220229475A1 (en) * | 2019-11-20 | 2022-07-21 | Beijing Deepcool Industries Co., Ltd. | Water block of double-layered radiating water-cooling radiator |
USD997109S1 (en) * | 2022-10-31 | 2023-08-29 | Dtg Neo Scientific Limited | Graphics card GPU support cooler |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104869785B (en) * | 2014-02-20 | 2021-01-15 | 联想(北京)有限公司 | Electronic equipment |
CN105704989B (en) * | 2016-04-26 | 2018-09-28 | 广东申菱环境系统股份有限公司 | Server cabinet with liquid cooling system |
CN110230938A (en) * | 2018-03-06 | 2019-09-13 | 山东豪迈化工技术有限公司 | A kind of heat-exchanger rig and microreactor |
CN108681192A (en) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | It can be applied to the liquid-cooling type radiator of dmd chip heat dissipation |
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Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170215301A1 (en) * | 2014-08-01 | 2017-07-27 | Beijing Deepcool Industries., Ltd. | Water block for water-cooling cpu radiator |
US10136552B2 (en) * | 2014-08-01 | 2018-11-20 | Beijing Deepcool Industries Co., Ltd. | Water block for water-cooling CPU radiator |
US9795058B2 (en) * | 2015-06-11 | 2017-10-17 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
US20170367217A1 (en) * | 2015-11-12 | 2017-12-21 | Apaltek Co., Ltd. | Liquid Cooling Radiation System and Liquid Radiator Thereof |
US10609841B2 (en) * | 2015-11-12 | 2020-03-31 | Shenzhen APALTEK Co., Ltd. | Liquid cooling radiation system and liquid radiator thereof |
US10299406B2 (en) * | 2016-01-19 | 2019-05-21 | Cooler Master Co., Ltd. | Liquid cooling heat sink device |
USD829183S1 (en) * | 2017-06-15 | 2018-09-25 | Shenzhen Gaoyu Electronic Technology Co., Ltd. | Graphic card radiator |
CN108803851A (en) * | 2018-08-29 | 2018-11-13 | 南昌大学 | A kind of novel C PU heat-pipe radiators |
US20200166976A1 (en) * | 2018-11-22 | 2020-05-28 | Cooler Master Co.,Ltd. | External liquid cooling device |
US10976787B2 (en) * | 2018-11-22 | 2021-04-13 | Cooler Master Co., Ltd. | External liquid cooling device |
US11297735B2 (en) * | 2019-04-23 | 2022-04-05 | In Win Development Inc. | Heat exchange device and liquid cooling system having the same |
CN110430738A (en) * | 2019-08-28 | 2019-11-08 | 福建晋江热电有限公司 | Cooling device |
US20220229475A1 (en) * | 2019-11-20 | 2022-07-21 | Beijing Deepcool Industries Co., Ltd. | Water block of double-layered radiating water-cooling radiator |
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