US20120160462A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20120160462A1
US20120160462A1 US12/981,438 US98143810A US2012160462A1 US 20120160462 A1 US20120160462 A1 US 20120160462A1 US 98143810 A US98143810 A US 98143810A US 2012160462 A1 US2012160462 A1 US 2012160462A1
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US
United States
Prior art keywords
dissipation device
heat dissipation
centrifugal fan
heat sink
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/981,438
Inventor
Zhi-Bin Guan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUAN, Zhi-bin
Publication of US20120160462A1 publication Critical patent/US20120160462A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to heat dissipation, and particularly to a heat dissipation device with low noise.
  • Electronic components such as memory banks comprise numerous circuits operating at high speeds and generating substantial amount of heat. Under most circumstances, it is necessary to cool the memory banks to maintain safe operating conditions and assure that the memory banks function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a fan is provided to the casing where the memory banks are disposed, which generates airflow towards the memory banks. However, in use, the fan may make a lot of noise.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of FIG. 1 .
  • the heat dissipation device dissipates heat from an electronic component (not shown) mounted on a printed circuit board (not shown).
  • the heat dissipation device comprises a heat sink 10 , a centrifugal fan 20 disposed on the heat sink 10 , and a cover board 30 covering the heat sink 10 and located above the centrifugal fan 20 .
  • the heat sink 10 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof.
  • the heat sink 10 comprises a base 12 and a plurality of fins 14 extending upwardly from a top face of the base 12 .
  • the base 12 is a flat, circular plate.
  • a bottom face of the base 12 is attached to the electronic component.
  • a circular receiving portion 16 is defined by the top face of the base 12 and inner circumferential peripheries of the fins 14 .
  • the fins 14 are arranged radially relative to the receiving portion 16 .
  • the fins 14 are generally perpendicular to the base 12 .
  • the fins 14 are spaced from each other.
  • a passage (not labeled) is defined between every two neighboring fins 14 for an airflow flowing through.
  • the centrifugal fan 20 comprises a rotation axis 22 , a magnetic member 24 mounted on the rotation axis 22 , a mounting ring 26 , and an impeller 28 rotatably engaging with the rotation axis 22 .
  • the centrifugal fan 20 is received in the receiving portion 16 of the heat sink 10 .
  • a height of the centrifugal fan 20 is slightly less than that of each fin 14 of the heat sink 10 .
  • the rotation axis 22 is perpendicular to the base 12 of the heat sink 10 .
  • the cover board 30 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof.
  • the cover board 30 is circular, flat, and thin.
  • a circular hole 32 is defined at a center of the cover board 30 .
  • a plurality of through holes 34 are defined in the cover board 30 .
  • the through holes 34 are correspondingly located above the impeller 28 of the centrifugal fan 20 .
  • the through holes 34 are spaced from each other, and arranged evenly relative to the center of the cover board 30 . In this embodiment, the through holes 34 are arranged radially relative to the center of the cover board 30 .
  • the cover board 30 is attached to top faces of the fins 14 of the heat sink 10 .
  • the through holes 34 act as air-intakes of the centrifugal fan 20 , and airflow generated by the centrifugal fan 20 directly flow through the passages of the fins 14 of the heat sink 10 .
  • the through holes 34 arranged around the circular hole 32 can effectively reduce noise generated by the impeller 28 , whereby the heat dissipation device has a quiet working status.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device for dissipating heat from an electronic component, includes a heat sink, a centrifugal fan disposed on the heat sink, and a cover board covering the heat sink and located above the centrifugal fan. The cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation, and particularly to a heat dissipation device with low noise.
  • 2. Description of Related Art
  • Electronic components, such as memory banks comprise numerous circuits operating at high speeds and generating substantial amount of heat. Under most circumstances, it is necessary to cool the memory banks to maintain safe operating conditions and assure that the memory banks function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a fan is provided to the casing where the memory banks are disposed, which generates airflow towards the memory banks. However, in use, the fan may make a lot of noise.
  • What is needed, therefore, is a heat dissipation device with low noise.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
  • FIG. 2 is an exploded view of FIG. 1.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 1-2, a heat dissipation device in accordance with an exemplary embodiment of the disclosure is disclosed. The heat dissipation device dissipates heat from an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a heat sink 10, a centrifugal fan 20 disposed on the heat sink 10, and a cover board 30 covering the heat sink 10 and located above the centrifugal fan 20.
  • The heat sink 10 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof. The heat sink 10 comprises a base 12 and a plurality of fins 14 extending upwardly from a top face of the base 12. The base 12 is a flat, circular plate. A bottom face of the base 12 is attached to the electronic component. A circular receiving portion 16 is defined by the top face of the base 12 and inner circumferential peripheries of the fins 14. The fins 14 are arranged radially relative to the receiving portion 16. The fins 14 are generally perpendicular to the base 12. The fins 14 are spaced from each other. A passage (not labeled) is defined between every two neighboring fins 14 for an airflow flowing through.
  • The centrifugal fan 20 comprises a rotation axis 22, a magnetic member 24 mounted on the rotation axis 22, a mounting ring 26, and an impeller 28 rotatably engaging with the rotation axis 22. The centrifugal fan 20 is received in the receiving portion 16 of the heat sink 10. A height of the centrifugal fan 20 is slightly less than that of each fin 14 of the heat sink 10. The rotation axis 22 is perpendicular to the base 12 of the heat sink 10.
  • The cover board 30 is integrally made of a material with high heat conductivity, such as copper, aluminum or an alloy thereof. The cover board 30 is circular, flat, and thin. A circular hole 32 is defined at a center of the cover board 30. A plurality of through holes 34 are defined in the cover board 30. The through holes 34 are correspondingly located above the impeller 28 of the centrifugal fan 20. The through holes 34 are spaced from each other, and arranged evenly relative to the center of the cover board 30. In this embodiment, the through holes 34 are arranged radially relative to the center of the cover board 30. The cover board 30 is attached to top faces of the fins 14 of the heat sink 10. In use, the through holes 34 act as air-intakes of the centrifugal fan 20, and airflow generated by the centrifugal fan 20 directly flow through the passages of the fins 14 of the heat sink 10. The through holes 34 arranged around the circular hole 32 can effectively reduce noise generated by the impeller 28, whereby the heat dissipation device has a quiet working status.
  • It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (15)

1. A heat dissipation device comprising:
a heat sink;
a centrifugal fan disposed on the heat sink; and
a cover board covering the heat sink and located above the centrifugal fan; wherein
the cover board defines a plurality of through holes acting as air-intakes of the centrifugal fan.
2. The heat dissipation device of claim 1, wherein the heat sink comprises a base and a plurality of fins extending upwardly from a top face of the base.
3. The heat dissipation device of claim 2, wherein a receiving portion is defined by the top face of the base and inner circumferential peripheries of the fins.
4. The heat dissipation device of claim 3, wherein the fan is received in the receiving portion.
5. The heat dissipation device of claim 4, wherein a height of the centrifugal fan is less than that of each fin of the heat sink.
6. The heat dissipation device of claim 3, wherein the fins are arranged radially relative to the receiving portion.
7. The heat dissipation device of claim 2, wherein the fins are spaced from each other, and a passage is defined between every two neighboring fins.
8. The heat dissipation device of claim 7, wherein airflow generated by the centrifugal fan directly flow through the passages of the fins.
9. The heat dissipation device of claim 1, wherein the centrifugal fan comprises a rotation axis, a magnetic member mounted on the rotation axis, a mounting ring, and an impeller rotatably engaging with the rotation axis.
10. The heat dissipation device of claim 9, wherein the rotation axis is perpendicular to the base of the heat sink.
11. The heat dissipation device of claim 1, wherein the through holes are located above the centrifugal fan.
12. The heat dissipation device of claim 1, wherein the through holes are spaced from each other.
13. The heat dissipation device of claim 1, wherein the through holes are arranged radially relative to a center of the cover board.
14. The heat dissipation device of claim 1, wherein a circular hole is defined at a center of the cover board.
15. The heat dissipation device of claim 1, wherein the cover board is attached to a top side of the heat sink.
US12/981,438 2010-12-27 2010-12-29 Heat dissipation device Abandoned US20120160462A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099146014A TW201227244A (en) 2010-12-27 2010-12-27 Heat dissipation device
TW99146014 2010-12-27

Publications (1)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378417A (en) * 2013-04-26 2016-03-02 酷奇普科技股份有限公司 Kinetic heat sink with stationary fins
US10285303B2 (en) * 2017-07-14 2019-05-07 Apple Inc. Electronic device with integrated passive and active cooling
US10375853B2 (en) 2016-09-06 2019-08-06 Apple Inc. Electronic device with cooling fan
US11384999B2 (en) * 2019-05-31 2022-07-12 Cooler Master Co., Ltd. Heat dissipation device
US20230070319A1 (en) * 2021-09-08 2023-03-09 Dell Products L.P. Fan covering with high recycle content and high thermal conductivity

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107816455B (en) * 2016-09-14 2020-01-21 宏碁股份有限公司 Fan module and electronic device using same
DE102020207966A1 (en) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Cooling arrangement for electronic components of a motor vehicle

Citations (9)

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Publication number Priority date Publication date Assignee Title
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5559674A (en) * 1993-03-19 1996-09-24 Fujitsu Limited Heat sink and mounting structure for heat sink
US5707282A (en) * 1996-02-28 1998-01-13 Hewlett-Packard Company Fan diffuser
US5928076A (en) * 1997-09-25 1999-07-27 Hewlett Packard Company EMI-attenuating air ventilation panel
US20030026074A1 (en) * 2001-07-31 2003-02-06 Clements Bradley E. Externally mounted on-line replaceable fan module
US6659169B1 (en) * 1999-12-09 2003-12-09 Advanced Rotary Systems, Llc Cooler for electronic devices
US6826048B1 (en) * 2003-09-18 2004-11-30 Hewlett-Packard Development Company, L.P. Method and apparatus for securing a fan within a device
US7333340B2 (en) * 2005-04-14 2008-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Mounting device for heat dissipating apparatus
US20090008067A1 (en) * 2007-07-04 2009-01-08 Foxconn Technology Co., Ltd. Heat dissipation device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559674A (en) * 1993-03-19 1996-09-24 Fujitsu Limited Heat sink and mounting structure for heat sink
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5707282A (en) * 1996-02-28 1998-01-13 Hewlett-Packard Company Fan diffuser
US5928076A (en) * 1997-09-25 1999-07-27 Hewlett Packard Company EMI-attenuating air ventilation panel
US5928076C1 (en) * 1997-09-25 2001-04-24 Hewlett Packard Co Emi-attenuating air ventilation panel
US6659169B1 (en) * 1999-12-09 2003-12-09 Advanced Rotary Systems, Llc Cooler for electronic devices
US20030026074A1 (en) * 2001-07-31 2003-02-06 Clements Bradley E. Externally mounted on-line replaceable fan module
US6690576B2 (en) * 2001-07-31 2004-02-10 Hewlett Packard Development Company, L.P. Externally mounted on-line replaceable fan module
US6826048B1 (en) * 2003-09-18 2004-11-30 Hewlett-Packard Development Company, L.P. Method and apparatus for securing a fan within a device
US7333340B2 (en) * 2005-04-14 2008-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Mounting device for heat dissipating apparatus
US20090008067A1 (en) * 2007-07-04 2009-01-08 Foxconn Technology Co., Ltd. Heat dissipation device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378417A (en) * 2013-04-26 2016-03-02 酷奇普科技股份有限公司 Kinetic heat sink with stationary fins
EP2989404A4 (en) * 2013-04-26 2016-10-12 Coolchip Technologies Inc Kinetic heat sink with stationary fins
US10375853B2 (en) 2016-09-06 2019-08-06 Apple Inc. Electronic device with cooling fan
US10285303B2 (en) * 2017-07-14 2019-05-07 Apple Inc. Electronic device with integrated passive and active cooling
US11384999B2 (en) * 2019-05-31 2022-07-12 Cooler Master Co., Ltd. Heat dissipation device
US11732981B2 (en) 2019-05-31 2023-08-22 Cooler Master Co., Ltd. Heat dissipation device
US20230070319A1 (en) * 2021-09-08 2023-03-09 Dell Products L.P. Fan covering with high recycle content and high thermal conductivity

Also Published As

Publication number Publication date
TW201227244A (en) 2012-07-01

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Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GUAN, ZHI-BIN;REEL/FRAME:025566/0639

Effective date: 20101223

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION