US2315695A - Method of polishing metals - Google Patents

Method of polishing metals Download PDF

Info

Publication number
US2315695A
US2315695A US241976A US24197638A US2315695A US 2315695 A US2315695 A US 2315695A US 241976 A US241976 A US 241976A US 24197638 A US24197638 A US 24197638A US 2315695 A US2315695 A US 2315695A
Authority
US
United States
Prior art keywords
metal
metals
polishing
sulfuric acid
polish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US241976A
Inventor
Charles L Faust
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Memorial Institute Inc
Original Assignee
Battelle Memorial Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Memorial Institute Inc filed Critical Battelle Memorial Institute Inc
Priority to US241976A priority Critical patent/US2315695A/en
Priority claimed from US290493A external-priority patent/US2315696A/en
Application granted granted Critical
Publication of US2315695A publication Critical patent/US2315695A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/16Polishing
    • C25F3/22Polishing of heavy metals

Definitions

  • This invention relates to a method of polishing metals. to impart thereto a lustrous,- mirrorlike polish.
  • the surfaces exhibit a tendency to pile, with the result that the polished surfaces so produced are cold worked and strained.
  • Such surfaces are characterized by the presence of a layer of amorphous or pseudo amorphous materials.
  • the surface will be found to be marked by microscopic scratches.
  • Mechanical polishing has the further objection that it involves a considerable amount of comparatively highly paid labor.
  • mechanical polishing is one of the most expensive steps in the finishing operations, so that polished stainless steels have heretofore sold for a price which is very high in comparison with the material cost.
  • the cost of mechanical polishing is also a major item in the manufacture of chromium plated articles, particularly articles of irregular shape that must first be polished, then nickel plated and finally buffed before the application of the chromium plate.
  • the method to which this invention pertains involves making the metal to be polished an anode in an electrolytic bath of suitable composition and passing a current of sufllcient density and for a sufficient length of time to produce a high lustre or polish on the metal.
  • the electrolytic solution that I have found to possess the most general applicability comprises a mixture of sulfuric acid and an organic compound capable of forming a complex ion with a metallic component of the metal or alloy undergoing treatment, such organic compounds including a wide variety of organic materials, such as glycerol, soluble glycols, ammoniated glycyrrhizin and glycyrrhiza extract or liquor. Certain alcohols, such as methanol, may be a-dvantageously used in conjunction with mixtures of sulfuric acid and any one or more of the foregoing organic compounds.
  • the electrolytic solutions so produced are effective in producing lustrous surfaces when employed in accordance with the method of this invention in the treatment of iron and its alloys, nickel and its alloys and copper.
  • the sulfuric acid content may be widely varied, as from 1 to 90%, but is preferably in excess of 50% and not over 90%.
  • another mineral acid such as ortho phosphoric acid
  • the total acid concentration should likewise lie within the range of 50 to 90%.
  • the higher concentration of total acid is more particularly required, when water is present, if a good polish is to be obtained, while the lower concentrations of acid may be satisfactorily used in an electrolytic solution containing practically no water.
  • An example of the latter case is an electrolytic solution comprising 94% of glycerol, 1% of sulfuric acid and 5% of ammonium chloride.
  • the treatment depends to some degree on the previous heat treatment, if any, of the metal.
  • the condition of the various phases present in the metal influences the character and degree of the attack upon the grain boundaries, and in some cases it is necessary to increase the current densities in order to obtain satisfactory polishes.
  • This bath when employed with current densi-- ties of 300 to 1000 amperes per sq. ft. for the anodic treatment of 18-8 and 24-12 chromiumnickel, and straight chromium stainless steel, develops a very brilliant surface.
  • the time required at temperatures of to 200 F. ranges from 3 to 9 minutes, depending somewhat upon the current densities used and the original state polishing of 18% straight chromium stainless steel at current densities of around 1000 amperes per sq. ft. r
  • EXAMPLE 4 Bath composition Percent Sulfuric acid 1 Ammonium chloride 5 Glycerol 94 This bath produ es a -good polish on Monel metal at current densities of 750 to-1000 amperes per sq. ft. if the treatment is carried out for 1 minute at 86 F.
  • EXAMPLE Bath composition Per cent Sulfuric acid 33 Glycerol 33 Water 34 A bath of the foregoing composition produces a satisfactory polish on nickel and German silver when they are treated anodically therein at current densities of 1000 to 2000 amperes per sq. ft. for seconds at 96 F.
  • the method of electropolishing metals selected from the group consisting of iron and its alloys and nickel and its alloys and German silver which comprises passing an electric current from the metal as the anode through a solution consisting of about sulfuric acid and 40% glycerol by weight, the balance being largely water, the current being of suflicient density and being continued for a sufiicient length of time to efiect the polish on said metal.
  • the method of electropolishing a metal or alloy selected from the group consisting of iron and its alloys, nickel and its alloys and German silver which comprises passing an electric current from a metal or alloy selected from the group named as the anode through a solution of about 33% sulfuric acid, 33% glycerol and 34% water, all percentages being by weight, and continuing to pass said electric current while of a sufllcient density for a sufiicient length of time to efiect the polish of said metal or alloy.
  • the method of electro-polishing a metal or alloy selected from the group consisting of iron and its alloys, nickel and its alloys, and German silver which comprises passing an electric current from the metal or alloy selected from the group named as the anode through a solution of from about 33 to 50% sulfuric acid and from about 33 to 40% glycerine by weight, the balance being largely water, and continuing to pass such electric current while of a suflicient density for a suflicient length of time to affect the polish of said metal or alloy.

Description

Patented Apr. 6, 1943 Charles L. Faust, Columbus, Ohio, assignor to Battelle Memorial Institute, Columbus, Ohio, a
corporation of Ohio No Drawing.
Application November 23, 1938,
Serial No. 241,976
3 Claims.
This invention relates to a method of polishing metals. to impart thereto a lustrous,- mirrorlike polish.
It has heretofore been common practice to polish metals by a mechanical operation, either on automatic polishing and bufling machines, or manually, or by a combination of automatic and manual operations. In addition to the considerable cost of mechanical polishing and bufilng operations, particularly where the final bufllng operations have to be performed manually, there are some drawbacks in the mechanical polishing of metals which are inherent because of the properties of the metals themselves. Some metals, such as stainless steels, for instance, are relatively poor conductors of heat, in consequence of which the high speeds of the polishing or bufflng wheels tend to burn the surfaces thereof. This greatly limits the speed at which the pol- 1shing operations may be carried out.
Furthermore, in the mechanical polishing of metals, the surfaces exhibit a tendency to pile, with the result that the polished surfaces so produced are cold worked and strained. Such surfaces are characterized by the presence of a layer of amorphous or pseudo amorphous materials. Also, in any commercial polishing process, the surface will be found to be marked by microscopic scratches.
Mechanical polishing has the further objection that it involves a considerable amount of comparatively highly paid labor. In the case of stainless steel, for example, mechanical polishing is one of the most expensive steps in the finishing operations, so that polished stainless steels have heretofore sold for a price which is very high in comparison with the material cost. The cost of mechanical polishing is also a major item in the manufacture of chromium plated articles, particularly articles of irregular shape that must first be polished, then nickel plated and finally buffed before the application of the chromium plate.
While electrolytic methods for the treatment of metals and alloys to clean or etch the surfaces of the metals are well known, such methods have been directed mainly to those purposes and not to the production of polished surfaces. The patent to Burns et al. No. 1,658,222, dated February 7, 1928, for instance, refers to the anodic electrocleaning of ferrous metals preparatory to nickel plating and alleges that a smooth, polished and uniformly etched surface may be produced by an electrochemical cleaning action. By following the procedure disclosed in this patent, however, I have been unable to obtain a brightly polished surface but merely a surface that is somewhat brighter than that obtainable by the usual pickling processes.
Similarly, although the Blaut et a1. Patent 2,115,005, dated April 26, 1938, purports to describe an electrochemical cleaning process that will produce a burnished surface, I have been unable to obtain by following the procedure therein disclosed such a highly lustrous polish as is readily produced by the use of the electrolytic solution of my present invention.
I have now found that a superior polishing effect may be produced more readily and at a lower cost than was heretofore possible through the use of an electrolytic solution consisting essentially of sulfuric acid and an organic compound capable of forming a complex ion with a metallic component of the metal or alloy undergoing treatment. Sulfuric acid alone is not sufficient to produce the polishing effect characteristic of my process, but this effect can be obtained by the use in conjunction with sulfuric acid of any one of a wide variety of organic materials, such as glycerol, glycyrrhiza and soluble glycols.
It is therefore an important object of my invention to provide an electrolytic solution for use in the anodic treatment of metals to impart thereto a highly lustrous surface directly and without requiring any subsequent mechanical buffing or polishing operations.
It is a further important object of my invention to provide a method for the electrochemical treatment of metals to produce thereon surfaces that are highly lustrous and free from the scratches and piled layers characteristic of mechanically polished surfaces of metals, such as stainless steels.
It is a further important object of this invention to provide an electrolytic solution consisting essentially of sulfuric acid and an organic compound capable of forming a complex ion with iron, which solution may be used in the polishing of metals'to impart thereto highly lustrous surfaces at a cost considerably less than that entailed by mechanical operations, while at the same time producing surfaces having relatively superior characteristics to those obtainable by mechanical polishing or bufiing operations.
Other and further important objects of this invention will become apparent from the following description and appended claims.
The method to which this invention pertains involves making the metal to be polished an anode in an electrolytic bath of suitable composition and passing a current of sufllcient density and for a sufficient length of time to produce a high lustre or polish on the metal. By employing the electrolytic solution'of my present invention, results are obtained that transcend the mere electrolytic cleaning process, in that there is produced a highly lustrous or polished surface. This high lustre is an important feature of my invention and one that sharply distinguishes it from prior art finishes produced in the electrolytic cleaning of metals.
The electrolytic solution that I have found to possess the most general applicability comprises a mixture of sulfuric acid and an organic compound capable of forming a complex ion with a metallic component of the metal or alloy undergoing treatment, such organic compounds including a wide variety of organic materials, such as glycerol, soluble glycols, ammoniated glycyrrhizin and glycyrrhiza extract or liquor. Certain alcohols, such as methanol, may be a-dvantageously used in conjunction with mixtures of sulfuric acid and any one or more of the foregoing organic compounds. The electrolytic solutions so produced are effective in producing lustrous surfaces when employed in accordance with the method of this invention in the treatment of iron and its alloys, nickel and its alloys and copper.
The formation of highly polished and lustrous surfaces, which is a distinguishing feature of my invention, is undoubtedly associated with the presence of a polarizing film over the surface of the metal during the process of anodic dissolution. The nature of this film is such that selective attack of the various phases present in the metal or alloy is minimized' Anodic dissolution apparently takes place at a relatively high rate at high anodic polarization value, with the result that the anodic dissolution of the metal acts to level the crystal surfaces thereof and to produce a mirror-like finish. These conditions do not prevail in the simple electrolytic cleaning treatments known to the prior art.
In the electrolytic solution of my invention the sulfuric acid content may be widely varied, as from 1 to 90%, but is preferably in excess of 50% and not over 90%. Where another mineral acid, such as ortho phosphoric acid, is mixed with the sulfuric acid and organic compound, the total acid concentration should likewise lie within the range of 50 to 90%. The higher concentration of total acid is more particularly required, when water is present, if a good polish is to be obtained, while the lower concentrations of acid may be satisfactorily used in an electrolytic solution containing practically no water. An example of the latter case is an electrolytic solution comprising 94% of glycerol, 1% of sulfuric acid and 5% of ammonium chloride.
In order to obtain the best results, in a reasonable length of time, it is preferable to use relatively high current densities of the order of magnitude of from 300 to 1,000 amperes per sq. it, although it will be understood that lower current densities may be employed with consequent prolongation of the time of treatment.
'Higher current densities than indicated by the foregoing range may also be used, although such high current densities are necessarily more costly because of the higher cost of electrical energy. The length of time to-efiect the desired results depends upon the magnitude of the current densities employed and to some extent upon the of its surface initially. Rough surfaces, of course, require a longer time to polish than relatively smooth ones.
The treatment depends to some degree on the previous heat treatment, if any, of the metal. The condition of the various phases present in the metal influences the character and degree of the attack upon the grain boundaries, and in some cases it is necessary to increase the current densities in order to obtain satisfactory polishes.
The following examples will serve to illustrate preferred compositions of my electrolytic solutions and the conditions under which such solutions produce satisfactory polishes. Unless otherwise stated, all percentages will be understood to indicate percentages by weight, rather than by volume.
EXAMPLE 1 Bath composition With the above bath, excellent polishes are obtained on 18-8 chromium-nickel stainless steel,
particular metal to be polisheda'nd the character when the stainless steel is made the anode therein at current densities of 500 amperes per sq. ft. and the treatment carried out for a period of 1 to 12 minutes. This time suffices to produce a very brilliant surface at a bath temperature of to 175 F.
EXAMPLE 2 Bath, composition I Per cent Sulfuric acid 50 Glycerol 40 Water 10 This bath, when employed with current densi-- ties of 300 to 1000 amperes per sq. ft. for the anodic treatment of 18-8 and 24-12 chromiumnickel, and straight chromium stainless steel, develops a very brilliant surface. The time required at temperatures of to 200 F. ranges from 3 to 9 minutes, depending somewhat upon the current densities used and the original state polishing of 18% straight chromium stainless steel at current densities of around 1000 amperes per sq. ft. r
. EXAMPLE 4 Bath composition Percent Sulfuric acid 1 Ammonium chloride 5 Glycerol 94 This bath produ es a -good polish on Monel metal at current densities of 750 to-1000 amperes per sq. ft. if the treatment is carried out for 1 minute at 86 F.
EXAMPLE Bath composition Per cent Sulfuric acid 33 Glycerol 33 Water 34 A bath of the foregoing composition produces a satisfactory polish on nickel and German silver when they are treated anodically therein at current densities of 1000 to 2000 amperes per sq. ft. for seconds at 96 F.
ExAMPLE 6 Bath composition Per cent Sulfuric acid 50 Glycerol Hydrochloric acid 2 Water Balance The foregoing bath produces a surface of high lustre on ordinary steel at 50 amperes per sq. ft. for 2 hours at F. v
From the foregoing description of my invention, it will be apparent that I have provided a novel and effective way of producing highly lustrous polishes on stainless steels, nickel and its alloys, and plain carbon steels. My method avoids the disadvantages above enumerated of the old method of mechanical polishing and enables the production of metal articles having surfaces that are free from mechanical strain, dragging and piling," and which are superior to those obtainable by mechanical polishing methods.
This application is a continuation-in-part of my application Serial No. 218,388, filed July 9,-
wide range without departing from the principles of this invention and it is, therefore, not the purpose to limit the patent granted hereon otherwise than necessitated by the scope of the appended claims.
I claim as my invention:
1. The method of electropolishing metals selected from the group consisting of iron and its alloys and nickel and its alloys and German silver which comprises passing an electric current from the metal as the anode through a solution consisting of about sulfuric acid and 40% glycerol by weight, the balance being largely water, the current being of suflicient density and being continued for a sufiicient length of time to efiect the polish on said metal.
2. The method of electropolishing a metal or alloy selected from the group consisting of iron and its alloys, nickel and its alloys and German silver, which comprises passing an electric current from a metal or alloy selected from the group named as the anode through a solution of about 33% sulfuric acid, 33% glycerol and 34% water, all percentages being by weight, and continuing to pass said electric current while of a sufllcient density for a sufiicient length of time to efiect the polish of said metal or alloy.
3. The method of electro-polishing a metal or alloy selected from the group consisting of iron and its alloys, nickel and its alloys, and German silver, which comprises passing an electric current from the metal or alloy selected from the group named as the anode through a solution of from about 33 to 50% sulfuric acid and from about 33 to 40% glycerine by weight, the balance being largely water, and continuing to pass such electric current while of a suflicient density for a suflicient length of time to affect the polish of said metal or alloy.
CHARLES L. FAUST.
US241976A 1938-11-23 1938-11-23 Method of polishing metals Expired - Lifetime US2315695A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US241976A US2315695A (en) 1938-11-23 1938-11-23 Method of polishing metals

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US241976A US2315695A (en) 1938-11-23 1938-11-23 Method of polishing metals
US290493A US2315696A (en) 1939-08-16 1939-08-16 Polishing of metal surfaces

Publications (1)

Publication Number Publication Date
US2315695A true US2315695A (en) 1943-04-06

Family

ID=26934740

Family Applications (1)

Application Number Title Priority Date Filing Date
US241976A Expired - Lifetime US2315695A (en) 1938-11-23 1938-11-23 Method of polishing metals

Country Status (1)

Country Link
US (1) US2315695A (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2424674A (en) * 1940-04-29 1947-07-29 American Rolling Mill Co Electrolytic bright polishing
US2440715A (en) * 1943-07-23 1948-05-04 Battelle Development Corp Continuous method for electropolishing nickel and nickel-containing alloys
US2461035A (en) * 1944-02-23 1949-02-08 Armco Steel Corp Electrolytic stainless steel polishing
US2461036A (en) * 1944-03-31 1949-02-08 Armco Steel Corp Stainless steel polishing
US2674571A (en) * 1951-07-06 1954-04-06 Nobilium Proc Inc Method of electropolishing dental appliances
US2692853A (en) * 1951-11-03 1954-10-26 Shawinigan Chem Ltd Process and composition for electropolishing stainless iron and steel
US2753301A (en) * 1952-01-11 1956-07-03 Dow Chemical Co Electropolishing of copper and its alloys
US2894883A (en) * 1949-07-18 1959-07-14 David E Walker Method of electropolishing uranium
US3377257A (en) * 1948-04-28 1968-04-09 Atomic Energy Commission Usa Electrolytic process for cleaning plutonium metal
EP0475026A1 (en) * 1990-09-07 1992-03-18 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
US5486282A (en) * 1994-11-30 1996-01-23 Ibm Corporation Electroetching process for seed layer removal in electrochemical fabrication of wafers
US5567300A (en) * 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US20020025759A1 (en) * 2000-08-30 2002-02-28 Whonchee Lee Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US20020025763A1 (en) * 2000-08-30 2002-02-28 Whonchee Lee Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US20030054729A1 (en) * 2000-08-30 2003-03-20 Whonchee Lee Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US20030109198A1 (en) * 2000-08-30 2003-06-12 Whonchee Lee Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US6579439B1 (en) 2001-01-12 2003-06-17 Southern Industrial Chemicals, Inc. Electrolytic aluminum polishing processes
US20030129927A1 (en) * 2000-08-30 2003-07-10 Whonchee Lee Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US20030226764A1 (en) * 2000-08-30 2003-12-11 Moore Scott E. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US20040043705A1 (en) * 2002-08-29 2004-03-04 Whonchee Lee Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US20040043629A1 (en) * 2002-08-29 2004-03-04 Whonchee Lee Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US20040043582A1 (en) * 2002-08-29 2004-03-04 Dinesh Chopra Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US20050034999A1 (en) * 2000-08-30 2005-02-17 Whonchee Lee Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US20050056550A1 (en) * 2003-09-17 2005-03-17 Whonchee Lee Methods and apparatus for removing conductive material from a microelectronic substrate
US20050196963A1 (en) * 2004-02-20 2005-09-08 Whonchee Lee Methods and apparatuses for electrochemical-mechanical polishing
US20060043534A1 (en) * 2004-08-26 2006-03-02 Kirby Kyle K Microfeature dies with porous regions, and associated methods and systems
US20060042956A1 (en) * 2004-09-01 2006-03-02 Whonchee Lee Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7074113B1 (en) 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
EP3805434A1 (en) 2019-10-08 2021-04-14 Lake Region Manufacturing, Inc. Electropolishing of mp35n wire for fatigue life improvement of an implantable lead

Cited By (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2424674A (en) * 1940-04-29 1947-07-29 American Rolling Mill Co Electrolytic bright polishing
US2440715A (en) * 1943-07-23 1948-05-04 Battelle Development Corp Continuous method for electropolishing nickel and nickel-containing alloys
US2461035A (en) * 1944-02-23 1949-02-08 Armco Steel Corp Electrolytic stainless steel polishing
US2461036A (en) * 1944-03-31 1949-02-08 Armco Steel Corp Stainless steel polishing
US3377257A (en) * 1948-04-28 1968-04-09 Atomic Energy Commission Usa Electrolytic process for cleaning plutonium metal
US2894883A (en) * 1949-07-18 1959-07-14 David E Walker Method of electropolishing uranium
US2674571A (en) * 1951-07-06 1954-04-06 Nobilium Proc Inc Method of electropolishing dental appliances
US2692853A (en) * 1951-11-03 1954-10-26 Shawinigan Chem Ltd Process and composition for electropolishing stainless iron and steel
US2753301A (en) * 1952-01-11 1956-07-03 Dow Chemical Co Electropolishing of copper and its alloys
EP0475026A1 (en) * 1990-09-07 1992-03-18 International Business Machines Corporation Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
US5567300A (en) * 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US5486282A (en) * 1994-11-30 1996-01-23 Ibm Corporation Electroetching process for seed layer removal in electrochemical fabrication of wafers
US5543032A (en) * 1994-11-30 1996-08-06 Ibm Corporation Electroetching method and apparatus
US7220166B2 (en) 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7604729B2 (en) 2000-08-30 2009-10-20 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US20030054729A1 (en) * 2000-08-30 2003-03-20 Whonchee Lee Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US20030109198A1 (en) * 2000-08-30 2003-06-12 Whonchee Lee Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US9214359B2 (en) 2000-08-30 2015-12-15 Micron Technology, Inc. Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US20030129927A1 (en) * 2000-08-30 2003-07-10 Whonchee Lee Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US20030226764A1 (en) * 2000-08-30 2003-12-11 Moore Scott E. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US8048287B2 (en) 2000-08-30 2011-11-01 Round Rock Research, Llc Method for selectively removing conductive material from a microelectronic substrate
US7972485B2 (en) 2000-08-30 2011-07-05 Round Rock Research, Llc Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US20100032314A1 (en) * 2000-08-30 2010-02-11 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7618528B2 (en) 2000-08-30 2009-11-17 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US20020025763A1 (en) * 2000-08-30 2002-02-28 Whonchee Lee Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US20050034999A1 (en) * 2000-08-30 2005-02-17 Whonchee Lee Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US20050035000A1 (en) * 2000-08-30 2005-02-17 Whonchee Lee Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7588677B2 (en) 2000-08-30 2009-09-15 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7560017B2 (en) 2000-08-30 2009-07-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US20020025759A1 (en) * 2000-08-30 2002-02-28 Whonchee Lee Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US20070111641A1 (en) * 2000-08-30 2007-05-17 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US20070037490A1 (en) * 2000-08-30 2007-02-15 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7074113B1 (en) 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7160176B2 (en) 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7094131B2 (en) 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7153410B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US20060191800A1 (en) * 2000-08-30 2006-08-31 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7134934B2 (en) 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7112121B2 (en) 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US20060234604A1 (en) * 2000-08-30 2006-10-19 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US20060249397A1 (en) * 2000-08-30 2006-11-09 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US6579439B1 (en) 2001-01-12 2003-06-17 Southern Industrial Chemicals, Inc. Electrolytic aluminum polishing processes
US20100176083A1 (en) * 2002-08-29 2010-07-15 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate
US20040043582A1 (en) * 2002-08-29 2004-03-04 Dinesh Chopra Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US20040043705A1 (en) * 2002-08-29 2004-03-04 Whonchee Lee Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US20040043629A1 (en) * 2002-08-29 2004-03-04 Whonchee Lee Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7078308B2 (en) 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7129160B2 (en) 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US20060199351A1 (en) * 2002-08-29 2006-09-07 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and non-conductive materials of a microelectronic substrate
US20050020192A1 (en) * 2002-08-29 2005-01-27 Whonchee Lee Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US20080045009A1 (en) * 2002-08-29 2008-02-21 Micron Technology, Inc. Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US8048756B2 (en) 2002-08-29 2011-11-01 Micron Technology, Inc. Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing
US20050020004A1 (en) * 2002-08-29 2005-01-27 Dinesh Chopra Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US7700436B2 (en) 2002-08-29 2010-04-20 Micron Technology, Inc. Method for forming a microelectronic structure having a conductive material and a fill material with a hardness of 0.04 GPA or higher within an aperture
US20050056550A1 (en) * 2003-09-17 2005-03-17 Whonchee Lee Methods and apparatus for removing conductive material from a microelectronic substrate
US20050059324A1 (en) * 2003-09-17 2005-03-17 Whonchee Lee Methods and apparatus for removing conductive material from a microelectronic substrate
US7524410B2 (en) 2003-09-17 2009-04-28 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7112122B2 (en) 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US8101060B2 (en) 2004-02-20 2012-01-24 Round Rock Research, Llc Methods and apparatuses for electrochemical-mechanical polishing
US7670466B2 (en) 2004-02-20 2010-03-02 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US20050196963A1 (en) * 2004-02-20 2005-09-08 Whonchee Lee Methods and apparatuses for electrochemical-mechanical polishing
US20100116685A1 (en) * 2004-02-20 2010-05-13 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US20060189139A1 (en) * 2004-02-20 2006-08-24 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US20060043534A1 (en) * 2004-08-26 2006-03-02 Kirby Kyle K Microfeature dies with porous regions, and associated methods and systems
US8603319B2 (en) 2004-09-01 2013-12-10 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US20060042956A1 (en) * 2004-09-01 2006-03-02 Whonchee Lee Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
EP3805434A1 (en) 2019-10-08 2021-04-14 Lake Region Manufacturing, Inc. Electropolishing of mp35n wire for fatigue life improvement of an implantable lead

Similar Documents

Publication Publication Date Title
US2315695A (en) Method of polishing metals
US2334699A (en) Electrolyte for the polishing of metal surfaces and method of use
US2231373A (en) Coating of articles of aluminum or aluminum alloys
US2708655A (en) Electrolytic polishing of aluminum
US2115005A (en) Electrochemical treatment of metal
JPS5832240B2 (en) Aluminum Denkaimetatehouhou
US1838273A (en) Method of producing chromium plated tools
US2542779A (en) Electropolishing composition and process
US2335354A (en) Polishing stainless iron and steel
US2282351A (en) Electrolyte for and method of polishing metal surfaces anodically
US2773821A (en) Composition for use in electropolishing
US2366712A (en) Method of anodically polishing stainless steel
US1970549A (en) Process of electroplating bronze
US2553937A (en) Method of electrolytically polishing aluminum and its alloys
US2330170A (en) Electrolytic polishing of metal
US1549022A (en) Method of treating the surfaces of cold-worked iron chromium alloys
US1939241A (en) Pickling stainless steel
US2383434A (en) Oxidation removing process
US1902621A (en) Zinc coated article
US1211218A (en) Process for plating metals.
US1782092A (en) Articles having tarnish-resisting surface and process of making same
US2331721A (en) Polishing stainless iron and steel
US2092130A (en) Anodic cleaning process
US2347039A (en) Method of anodically polishing copper
US2820003A (en) Compositions for smoothening metal surfaces and processes for using the same