US2932772A - Circuitry systems and methods of making the same - Google Patents
Circuitry systems and methods of making the same Download PDFInfo
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- US2932772A US2932772A US590673A US59067356A US2932772A US 2932772 A US2932772 A US 2932772A US 590673 A US590673 A US 590673A US 59067356 A US59067356 A US 59067356A US 2932772 A US2932772 A US 2932772A
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- Prior art keywords
- strips
- sheets
- perforations
- cards
- extending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
Definitions
- Another object of the invention is to provide composite component mounting boards or cards having universally connectible points thereon.
- Another object of the invention is to provide circuitry mounting boards having pins driven through insulating sheets or cards to connect conductive strips some of which are disposed in parallel positions in between two sheets or cards, and others are disposed in positions extending transversely -of the first conductive strips and located between other sheets, and pins connecting the strips of the diiierent layers at intersecting points thereof.
- a further object of the invention is to provide wiring systems having conductive strips extending along coordinate rows of pertorations of interleaving insulating sheets or cards at angles to one another in the diterent layers between these sheets, and a plurality of pins driven through the perforations in the sheets or cards at points of intersections ofthe strips and methods of making such wiring systems.
- a wiring system illustrating certain features of the invention may include a plurality of insulating sheets or cards having coordinate rows of perforations aligned with one another, conductive strips extending parallelly between two insulating sheets or cards along rows of perforations and conductive strips positioned between another pair of sheets or cards along rows of perforations extending angularly relative to the first-mentioned conductive strips. Pins driven through perforations at the intersections of the rows connect the intersecting strips electrically together and-lock the 'sheets or cards of insulating material together.
- FIG. 1 is a top planview of a wiring system for connecting a plurality of mounting boards into one system forming one embodiment of the invention
- Fig. 2 is a sectional view taken along ⁇ line 2-2 of Fig. 1;
- Fig. 3 is a perspective view of a wiring system made in accordance with another embodiment of the invention.
- Fig. 4 is an exploded, perspective view of the system shown in Fig. 3.
- the composite board 10 includes insulating sheets or cards 13, 14, 15, 16, 17 and 18 (Figs. 3 and 4) having coordinate rows of perforations 'i9 therein and stacked so that predetermined pertorations in one of the sheets are aligned with predetermined perforations in the other sheets.
- the sheets 13 and 14 have a hole 2,932,772 Patented Apr. 12, 1960l 21 and a socket 22 which are aligned for mounting a tubek23 therein, and conductive strips 25 are positioned between the sheets 13 and 14 along radially disposed rows of periorations relative to the hole 21 and socket 22, the strips 25 may be composed of copper or brass, or the like, and may be coated with solder if desired, or may be bare. The strips 25 also may be secured to one of the sheets 13 and 14 by a suitable adhesive or bonding means.
- Conductive strips 31 are positioned between the insulating sheets 14 and i5 and extend along rows of perf forations 19 parallel to edges 32 and 33 of sheets 13 and 14. The strips 31 are secured by adhesives or like over the certain desired rows of the periorations 19 in the,
- the lefthand strip 31 (Figs. 3 and 4) is secured over the third row of holes 19 of the sheet or card 15, the next strip 31 is secured to the sixth row of perforations 19 from the lefthand edge of the card 15 and the other strips likewise secured to every third row of perforations, the last strip being secured over the iifteenth row of perforations 19, there being fteen rows or" perforations extending parallel to the strips 31.
- Each of the cards 16, 17 and 1S is identical with the card 15 but the strips on card 17 are arranged differently with respect to the strips on card 15 so that strips 36 on the card 17 are not positioned directly below the strips 31 but are offset laterally from the strips 31 one row or perforations on the lefthand side, and are in the next row of perforations for those of the strips 31 on the lefthand side of the strips 3,6.
- the cards 16 and 18 are turned 180 relative to one another in the plane of the cards so that strips 37 and the row of perforations 19 along which they extend are positioned one row of perforations to the left of strips 38 on the card 16, and there is one row of perforations between the righthand edges of the strips 38 and the lefthand edges of the next strips 37.
- One of the strips 38 may be discontinuous and be connected by a resistor 39 (Fig. 2) or other component.
- a pin is driven through e'rforations 41 it does not strike any of the conductive strips and may serve as a mechanical interlock between the cards 15 through 18 and as an insulated mounting post for one of the electrical components.
- a pin driven through the pertorations 42 will connect Vthe strips 36 and 37.
- a pin driven through the perforations 43 will connect one of the strips 31 and one of the strips 37.
- a pin driven through the perforations 44 will connect the strip 31 to one of the strips 38.
- a pin driven through the perforation 4S will connect at least one of the strips 38 to the strip 36.
- the composite boards 1li may be interconnected together ⁇ by inserting the projecting portions of the cards 16 and 18 between the corresponding ends of the cards 16 and 13 of another board 10 so that the conductive strips 3S of each of the cards 18 are superimposed, and the conductive strips 37 of each of the boards 16 are superimposed. Then pins 51 may be driven through aligned perforations 52 in the overlapping end portions of the cards to connect the strips 37 electrically together and interlock the boards, and pins 55 may be driven through perforations 55 in the overlapping ends of the cards to connect the strips 38 together electrically.
- a third card 10 having projecting end portions of the cards 15 and 17 may be interleaved With the projecting end portions of the cards 15 and 1'7 of the first card with the strips 31 or one board superimposed over the strips 31 of the other board, and the strips 36 of one of the boards superimposed over the strips 36 of the other board.
- Pins 61 may be driven through perforations 62 to form electrical connections between the strips 36 and on the boards 17 and the strips 36 on the other board.
- Pins 65 may be driven through perforations 66 to connect asserts the two boards together mechanically.
- continuity between the conductive strips 31 of each of the boards' may be made as wellv as possible for mounting as many@ ductive strips which are coated with resin-flux,k the pins are ⁇ the portions project, the projecting portions ofy one side tions extending therealong generally in the direction that of the sheets of one pileup being interleaved'with projecting portions of one side of the sheets of another pileup, and pins driven through the interleaved portions of the sheets of the two pileups to lock" them together and Valso driven throughthe conductive strips to connect them elec trically together.
- a universal wiring system comprising a stack of several sheets of insulator material having aligned spaced perforation?. forming parallel rows and extending parallelly, perpendicularly anddiagonally relative to one edge coated with solder and as they vperforate the strips, ⁇ they push down the edges of the perforations into the holes in the perforated board into which the pins are entering rso that a good pressure point is connected therebetween.
- the pins are heated as by passing an electrical current therethrough suliicient to heat the pins and melt the solder, the solder melts and then is permitted to cool to solder the pins to the ⁇ strips that they have been driven to.
- a universal wiring system which comprises a stack Vof sheets of insulating material each having perforations arranged in a plurality of coordinate rows and aligned with the perforations in the other sheets, a first group of of the sheets, metallic conductive strips extending along certain of saidrrows of perforations between the sheets of insulator material, a first group of conductive strips extending parallelly to one edge ofthe sheets and between a conductive strips extending parallelly in one' direction ⁇ between one pair of the sheets along first parallel rows of perforations, a second group of conductive strips extending between another pair of the sheets along second parallel rows of perforations crossing said first parallel rows of perforations, a'third group of conductive strips extending parallelly to the tirst group of strips along rows of perforations offset from the rst rows of perforations, a fourth group ot conductive strips positioned between another pair of the sheets and extending diagonally'relative to the other conductive strips and crossing the other conductive strips at perforations in the sheets, and
- Aruniversal wiring system comprising a plurality of pileups including insulating sheets and conductive strips, alternate ones of the insulating Vsheets of each pileup having portions extending lbeyond the other sheets of that pileup and interleaving with and interlocked with similar portions of another pileup, and means connecting the strips of the interlocked pileups electrically.
- a universal wiringV system comprising a plurality of pileups, veach pileup including a plurality of insulating l sheets'having conductive strips on one face thereof, the
- a universal wiring system comprising a plurality of stacks ot insulator sheets having parallel rowsrof perforations throughout the sheets extending parallelly, perpendicularly and diagonally relative to one edge of each sheet, said perforations in each sheet aligned with corresponding perforations in the other sheets, conductive strips positioned parallelly between the sheets extending along one of the directions defined by and coveringrows of perforations Vin the sheets, the strips Abetween different sheets and extending in the same direction being offset a row ⁇ of pertorations from one anothersuch that no one strip overlays another, alternate sheets in the stack having portions extending beyond the other sheets for interleaving and interlocking with sheets of another stack, and conductive pins inserted in certain of the'Y perforation for connecting the strips of various stacks together and connecting any strip to Yany otherk strip to formy a desired circuit.
Description
April 12, 1960 P. H. BowMAN ErAL 2,932,772
CIRCUITRY SYSTEMS AND METHODS OF MAKING THE SAME Filed June l1, 1956 2 Sheets-Sheet l P. H. BowMAN ETAL 2,932,772
MS AND METHODS OF MAKING THE SAME April l2, 1960 CIRCUITRY sysTE Filed Jgme 11, 1956 2 Sheets-Sheet 2 united Sees Parent O CIRCUITRY SYSTEMS AND METHODS F MAKING THE SAME Paul H. Bowman, La Grange Park, and Howard A. Dvorak, Brookfield, Ill., assignors to Western Electric Company, Incorporated, New York, NX., a corporation of New York Application June 11, 1956, Serial No. `590,673 Claims. (Cl. 317-101) This invention relates to circuitry systems, and has for an object thereof the provision of universal wiring systems for interconnecting electrical components.
Another object of the invention is to provide composite component mounting boards or cards having universally connectible points thereon.
Another object of the invention is to provide circuitry mounting boards having pins driven through insulating sheets or cards to connect conductive strips some of which are disposed in parallel positions in between two sheets or cards, and others are disposed in positions extending transversely -of the first conductive strips and located between other sheets, and pins connecting the strips of the diiierent layers at intersecting points thereof.
A further object of the invention is to provide wiring systems having conductive strips extending along coordinate rows of pertorations of interleaving insulating sheets or cards at angles to one another in the diterent layers between these sheets, and a plurality of pins driven through the perforations in the sheets or cards at points of intersections ofthe strips and methods of making such wiring systems.
A wiring system illustrating certain features of the invention may include a plurality of insulating sheets or cards having coordinate rows of perforations aligned with one another, conductive strips extending parallelly between two insulating sheets or cards along rows of perforations and conductive strips positioned between another pair of sheets or cards along rows of perforations extending angularly relative to the first-mentioned conductive strips. Pins driven through perforations at the intersections of the rows connect the intersecting strips electrically together and-lock the 'sheets or cards of insulating material together.
A complete understanding of the'invention may be obtained from the following detailed description of a wiring system forming speciiic embodiments thereof when read in conjunction with the appended drawings, in which Fig. 1 is a top planview of a wiring system for connecting a plurality of mounting boards into one system forming one embodiment of the invention;
Fig. 2 is a sectional view taken along` line 2-2 of Fig. 1;
Fig. 3 is a perspective view of a wiring system made in accordance with another embodiment of the invention, and
Fig. 4 is an exploded, perspective view of the system shown in Fig. 3.
Referring now in detail to the drawings, there is shown a wiring system or wired mounting board mounting electrical components 11 and interconnecting the components 11 as desired. The composite board 10 includes insulating sheets or cards 13, 14, 15, 16, 17 and 18 (Figs. 3 and 4) having coordinate rows of perforations 'i9 therein and stacked so that predetermined pertorations in one of the sheets are aligned with predetermined perforations in the other sheets.
The sheets 13 and 14 have a hole 2,932,772 Patented Apr. 12, 1960l 21 and a socket 22 which are aligned for mounting a tubek23 therein, and conductive strips 25 are positioned between the sheets 13 and 14 along radially disposed rows of periorations relative to the hole 21 and socket 22, the strips 25 may be composed of copper or brass, or the like, and may be coated with solder if desired, or may be bare. The strips 25 also may be secured to one of the sheets 13 and 14 by a suitable adhesive or bonding means.
Conductive strips 31 are positioned between the insulating sheets 14 and i5 and extend along rows of perf forations 19 parallel to edges 32 and 33 of sheets 13 and 14. The strips 31 are secured by adhesives or like over the certain desired rows of the periorations 19 in the,
insulating sheet or card 15. In the present instance, the lefthand strip 31 (Figs. 3 and 4) is secured over the third row of holes 19 of the sheet or card 15, the next strip 31 is secured to the sixth row of perforations 19 from the lefthand edge of the card 15 and the other strips likewise secured to every third row of perforations, the last strip being secured over the iifteenth row of perforations 19, there being fteen rows or" perforations extending parallel to the strips 31. Each of the cards 16, 17 and 1S is identical with the card 15 but the strips on card 17 are arranged differently with respect to the strips on card 15 so that strips 36 on the card 17 are not positioned directly below the strips 31 but are offset laterally from the strips 31 one row or perforations on the lefthand side, and are in the next row of perforations for those of the strips 31 on the lefthand side of the strips 3,6. Similarly, the cards 16 and 18 are turned 180 relative to one another in the plane of the cards so that strips 37 and the row of perforations 19 along which they extend are positioned one row of perforations to the left of strips 38 on the card 16, and there is one row of perforations between the righthand edges of the strips 38 and the lefthand edges of the next strips 37. One of the strips 38 may be discontinuous and be connected by a resistor 39 (Fig. 2) or other component.
hus, as viewed in Fig. l, it' a pin is driven through e'rforations 41 it does not strike any of the conductive strips and may serve as a mechanical interlock between the cards 15 through 18 and as an insulated mounting post for one of the electrical components. Similarly, a pin driven through the pertorations 42 will connect Vthe strips 36 and 37. A pin driven through the perforations 43 will connect one of the strips 31 and one of the strips 37. A pin driven through the perforations 44 will connect the strip 31 to one of the strips 38. A pin driven through the perforation 4S will connect at least one of the strips 38 to the strip 36.
The composite boards 1li may be interconnected together `by inserting the projecting portions of the cards 16 and 18 between the corresponding ends of the cards 16 and 13 of another board 10 so that the conductive strips 3S of each of the cards 18 are superimposed, and the conductive strips 37 of each of the boards 16 are superimposed. Then pins 51 may be driven through aligned perforations 52 in the overlapping end portions of the cards to connect the strips 37 electrically together and interlock the boards, and pins 55 may be driven through perforations 55 in the overlapping ends of the cards to connect the strips 38 together electrically. Similarly, a third card 10 having projecting end portions of the cards 15 and 17 may be interleaved With the projecting end portions of the cards 15 and 1'7 of the first card with the strips 31 or one board superimposed over the strips 31 of the other board, and the strips 36 of one of the boards superimposed over the strips 36 of the other board. Pins 61 may be driven through perforations 62 to form electrical connections between the strips 36 and on the boards 17 and the strips 36 on the other board. Pins 65 may be driven through perforations 66 to connect asserts the two boards together mechanically. Thus, continuity between the conductive strips 31 of each of the boards' may be made as wellv as possible for mounting as many@ ductive strips which are coated with resin-flux,k the pins are` the portions project, the projecting portions ofy one side tions extending therealong generally in the direction that of the sheets of one pileup being interleaved'with projecting portions of one side of the sheets of another pileup, and pins driven through the interleaved portions of the sheets of the two pileups to lock" them together and Valso driven throughthe conductive strips to connect them elec trically together. Y .Y
4. A universal wiring system comprising a stack of several sheets of insulator material having aligned spaced perforation?. forming parallel rows and extending parallelly, perpendicularly anddiagonally relative to one edge coated with solder and as they vperforate the strips,`they push down the edges of the perforations into the holes in the perforated board into which the pins are entering rso that a good pressure point is connected therebetween.
Then if the pins are heated as by passing an electrical current therethrough suliicient to heat the pins and melt the solder, the solder melts and then is permitted to cool to solder the pins to the `strips that they have been driven to.
lt is to be understood that the above-described arrangements are `simply illustrative of the application of the principles of the invention. Numerous other arrange ments may be readily devisedby those skilled in the art which will embody the principles of the invention and Lfall within the spirit and scope thereof. Y
yWhat is claimed is:
1. A universal wiring system, which comprises a stack Vof sheets of insulating material each having perforations arranged in a plurality of coordinate rows and aligned with the perforations in the other sheets, a first group of of the sheets, metallic conductive strips extending along certain of saidrrows of perforations between the sheets of insulator material, a first group of conductive strips extending parallelly to one edge ofthe sheets and between a conductive strips extending parallelly in one' direction` between one pair of the sheets along first parallel rows of perforations, a second group of conductive strips extending between another pair of the sheets along second parallel rows of perforations crossing said first parallel rows of perforations, a'third group of conductive strips extending parallelly to the tirst group of strips along rows of perforations offset from the rst rows of perforations, a fourth group ot conductive strips positioned between another pair of the sheets and extending diagonally'relative to the other conductive strips and crossing the other conductive strips at perforations in the sheets, and a plurality of electrical components having leads driven through the perforations .and the strips where predetermined strips` cross and soldered to the strips. l
2. Aruniversal wiring system comprising a plurality of pileups including insulating sheets and conductive strips, alternate ones of the insulating Vsheets of each pileup having portions extending lbeyond the other sheets of that pileup and interleaving with and interlocked with similar portions of another pileup, and means connecting the strips of the interlocked pileups electrically.
3. A universal wiringV system comprising a plurality of pileups, veach pileup including a plurality of insulating l sheets'having conductive strips on one face thereof, the
strips on each sheet extending parallel to the other strips on that sheet, alternate sheets on each pileup projecting beyond the edges of the other sheets of that pileup and the portions of the conductive strips on the projecting porpair of sheets, a second group of conductive strips between another pair of sheets extending perpendicularly to said first group, a third group of conductive strips extending diagonally to the rst two groups of strips and between a third pair of sheets, other groups of conductive strips between pairsV of insulator sheets oriented in the saine direction as one of the aforementioned groups Vand oiset 'at least one row of perforations from said group such that no one strip overlays anothenand elongated connectors extending through the perforations and strips where certain of the strips cross to connect any one strip to any `other strip to produce a desired circuitry. l
5. v A universal wiring system comprising a plurality of stacks ot insulator sheets having parallel rowsrof perforations throughout the sheets extending parallelly, perpendicularly and diagonally relative to one edge of each sheet, said perforations in each sheet aligned with corresponding perforations in the other sheets, conductive strips positioned parallelly between the sheets extending along one of the directions defined by and coveringrows of perforations Vin the sheets, the strips Abetween different sheets and extending in the same direction being offset a row `of pertorations from one anothersuch that no one strip overlays another, alternate sheets in the stack having portions extending beyond the other sheets for interleaving and interlocking with sheets of another stack, and conductive pins inserted in certain of the'Y perforation for connecting the strips of various stacks together and connecting any strip to Yany otherk strip to formy a desired circuit.
' References Cited inthe tile or this patentl UNITED sTATEs PATENTS Great Britain Oct. 23, 1924 OTHER REFERENCES Stamped Wiring, 4 pages, a reprint from Electronics, lune `1947; copyrighted (all rights reserved), by McGrawkHill Pub. Co. Y
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US590673A US2932772A (en) | 1956-06-11 | 1956-06-11 | Circuitry systems and methods of making the same |
Applications Claiming Priority (1)
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US590673A US2932772A (en) | 1956-06-11 | 1956-06-11 | Circuitry systems and methods of making the same |
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US2932772A true US2932772A (en) | 1960-04-12 |
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US590673A Expired - Lifetime US2932772A (en) | 1956-06-11 | 1956-06-11 | Circuitry systems and methods of making the same |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3065439A (en) * | 1959-07-01 | 1962-11-20 | Associated Products And Servic | Universal circuits interconnector |
US3072734A (en) * | 1958-08-26 | 1963-01-08 | Eastman Kodak Co | Circuit board for mounting and inter-connecting electrical components |
US3113248A (en) * | 1960-07-13 | 1963-12-03 | Sperry Rand Corp | Electrical assembly of modules |
US3148438A (en) * | 1959-05-25 | 1964-09-15 | Vero Prec Engineering Ltd | Method of making wiring boards |
US3157828A (en) * | 1960-08-11 | 1964-11-17 | Gen Motors Corp | Encapsulated printed circuit module with heat transfer means |
US3184830A (en) * | 1961-08-01 | 1965-05-25 | Weldon V Lane | Multilayer printed circuit board fabrication technique |
US3191100A (en) * | 1963-03-07 | 1965-06-22 | Sorvillo Eugene | Laminated electric circuit mounting boards |
US3202879A (en) * | 1959-12-24 | 1965-08-24 | Ibm | Encapsulated circuit card |
US3208029A (en) * | 1961-09-01 | 1965-09-21 | Robert J Leslie | Electrical connector |
US3214827A (en) * | 1962-12-10 | 1965-11-02 | Sperry Rand Corp | Electrical circuitry fabrication |
US3226802A (en) * | 1959-10-08 | 1966-01-04 | Acf Ind Inc | Method of making a matrix board system |
DE1233038B (en) * | 1962-04-27 | 1967-01-26 | Siemens Ag | Electrical device in which the electrical connections between its components are made by means of circuit boards |
DE1240960B (en) * | 1965-08-11 | 1967-05-24 | Messerschmitt Boelkow Blohm | Electronic assembly with a printed circuit |
US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
US3424854A (en) * | 1967-07-20 | 1969-01-28 | Motorola Inc | Multilayer printed circuit with soldered eyelets forming the sole means joining the same |
US3432796A (en) * | 1966-12-14 | 1969-03-11 | Automatic Elect Lab | Multiplanar electrical connection techniques |
DE1566963B1 (en) * | 1967-01-13 | 1970-01-15 | Bbc Brown Boveri & Cie | Crossbar distributor and method for soldering the switching elements |
US3591922A (en) * | 1968-12-05 | 1971-07-13 | Sperry Rand Corp | Fabrication of electrical solder joints using electrodeposited solder |
US3634602A (en) * | 1969-04-17 | 1972-01-11 | Licentia Gmbh | Multilayer conductor sheet |
US3660726A (en) * | 1970-10-12 | 1972-05-02 | Elfab Corp | Multi-layer printed circuit board and method of manufacture |
US3824433A (en) * | 1973-03-05 | 1974-07-16 | Thunderco Inc | Universal circuit board |
DE2900838A1 (en) * | 1979-01-11 | 1980-07-24 | Bruno M Hess | Printed circuit board assembly for small quantity prodn. - comprises two parallel boards with components mounted between them with lead ends protruding |
US4598166A (en) * | 1984-08-06 | 1986-07-01 | Gte Communication Systems Corporation | High density multi-layer circuit arrangement |
US5384433A (en) * | 1991-10-29 | 1995-01-24 | Aptix Corporation | Printed circuit structure including power, decoupling and signal termination |
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GB223402A (en) * | 1923-10-24 | 1924-10-23 | Charles Stuart Lambton | Improvements in and connected with panels and units for electrical installations andparticularly wireless installations |
US2268619A (en) * | 1938-01-08 | 1942-01-06 | Joseph A Beasley | Radio receiving apparatus |
US2492235A (en) * | 1945-05-30 | 1949-12-27 | Motorola Inc | Wave-signal translating apparatus chassis |
US2502291A (en) * | 1946-02-27 | 1950-03-28 | Lawrence H Taylor | Method for establishing electrical connections in electrical apparatus |
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Publication number | Priority date | Publication date | Assignee | Title |
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GB223402A (en) * | 1923-10-24 | 1924-10-23 | Charles Stuart Lambton | Improvements in and connected with panels and units for electrical installations andparticularly wireless installations |
US2268619A (en) * | 1938-01-08 | 1942-01-06 | Joseph A Beasley | Radio receiving apparatus |
US2492235A (en) * | 1945-05-30 | 1949-12-27 | Motorola Inc | Wave-signal translating apparatus chassis |
US2502291A (en) * | 1946-02-27 | 1950-03-28 | Lawrence H Taylor | Method for establishing electrical connections in electrical apparatus |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3072734A (en) * | 1958-08-26 | 1963-01-08 | Eastman Kodak Co | Circuit board for mounting and inter-connecting electrical components |
US3148438A (en) * | 1959-05-25 | 1964-09-15 | Vero Prec Engineering Ltd | Method of making wiring boards |
US3065439A (en) * | 1959-07-01 | 1962-11-20 | Associated Products And Servic | Universal circuits interconnector |
US3226802A (en) * | 1959-10-08 | 1966-01-04 | Acf Ind Inc | Method of making a matrix board system |
US3202879A (en) * | 1959-12-24 | 1965-08-24 | Ibm | Encapsulated circuit card |
US3113248A (en) * | 1960-07-13 | 1963-12-03 | Sperry Rand Corp | Electrical assembly of modules |
US3157828A (en) * | 1960-08-11 | 1964-11-17 | Gen Motors Corp | Encapsulated printed circuit module with heat transfer means |
US3184830A (en) * | 1961-08-01 | 1965-05-25 | Weldon V Lane | Multilayer printed circuit board fabrication technique |
US3208029A (en) * | 1961-09-01 | 1965-09-21 | Robert J Leslie | Electrical connector |
DE1233038B (en) * | 1962-04-27 | 1967-01-26 | Siemens Ag | Electrical device in which the electrical connections between its components are made by means of circuit boards |
US3214827A (en) * | 1962-12-10 | 1965-11-02 | Sperry Rand Corp | Electrical circuitry fabrication |
US3191100A (en) * | 1963-03-07 | 1965-06-22 | Sorvillo Eugene | Laminated electric circuit mounting boards |
DE1240960B (en) * | 1965-08-11 | 1967-05-24 | Messerschmitt Boelkow Blohm | Electronic assembly with a printed circuit |
US3432796A (en) * | 1966-12-14 | 1969-03-11 | Automatic Elect Lab | Multiplanar electrical connection techniques |
DE1566963B1 (en) * | 1967-01-13 | 1970-01-15 | Bbc Brown Boveri & Cie | Crossbar distributor and method for soldering the switching elements |
US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
US3424854A (en) * | 1967-07-20 | 1969-01-28 | Motorola Inc | Multilayer printed circuit with soldered eyelets forming the sole means joining the same |
US3591922A (en) * | 1968-12-05 | 1971-07-13 | Sperry Rand Corp | Fabrication of electrical solder joints using electrodeposited solder |
US3634602A (en) * | 1969-04-17 | 1972-01-11 | Licentia Gmbh | Multilayer conductor sheet |
US3660726A (en) * | 1970-10-12 | 1972-05-02 | Elfab Corp | Multi-layer printed circuit board and method of manufacture |
US3824433A (en) * | 1973-03-05 | 1974-07-16 | Thunderco Inc | Universal circuit board |
DE2900838A1 (en) * | 1979-01-11 | 1980-07-24 | Bruno M Hess | Printed circuit board assembly for small quantity prodn. - comprises two parallel boards with components mounted between them with lead ends protruding |
US4598166A (en) * | 1984-08-06 | 1986-07-01 | Gte Communication Systems Corporation | High density multi-layer circuit arrangement |
US5384433A (en) * | 1991-10-29 | 1995-01-24 | Aptix Corporation | Printed circuit structure including power, decoupling and signal termination |
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