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Patente

Referenziert von

Zitiert von PatentEingetragenAusgestelltUrsprünglich Bevollmächtigter Titel
US402541025. Aug. 197524. Mai 1977Western Electric Company, Inc.Sputtering apparatus and methods using a magnetic field
US40309963. März 197521. Juni 1977Telic CorporationElectrode type glow discharge method and apparatus
US403817131. März 197626. Juli 1977Battelle Memorial InstituteSupported plasma sputtering apparatus for high deposition rate over large area
US404666029. Dez. 19756. Sept. 1977Bell Telephone Laboratories, IncorporatedSputter coating with charged particle flux control
US41558252. Mai 197722. Mai 1979Integrated sputtering apparatus and method
US416601831. Jan. 197428. Aug. 1979Airco, Inc.Sputtering process and apparatus
US430580116. Apr. 198015. Dez. 1981The United States of America as represented by the United States Department of EnergyLine-of-sight deposition method
US445782516. Mai 19803. Juli 1984Varian Associates, Inc.Sputter target for use in a sputter coating source
US467348030. Jan. 198416. Juni 1987Varian Associates, Inc.Magnetically enhanced sputter source
US472689012. Aug. 198523. Febr. 1988The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationMethod of producing high T.sub.c superconducting NbN films
US507324510. Juli 199017. Dez. 1991Slotted cylindrical hollow cathode/magnetron sputtering device
US533430213. Nov. 19922. Aug. 1994Tokyo Electron LimitedMagnetron sputtering apparatus and sputtering gun for use in the same
US543777815. Nov. 19931. Aug. 1995Telic Technologies CorporationSlotted cylindrical hollow cathode/magnetron sputtering device
US552967424. Apr. 199525. Juni 1996Telic Technologies CorporationCylindrical hollow cathode/magnetron sputtering system and components thereof
US62177166. Mai 199817. Apr. 2001Novellus Systems, Inc.Apparatus and method for improving target erosion in hollow cathode magnetron sputter source

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