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Patente

Referenziert von

Zitiert von PatentEingetragenAusgestelltUrsprünglich Bevollmächtigter Titel
US40070379. Juli 19758. Febr. 1977General Electric CompanyComposition and method for chemically etching copper elements
US419713923. Aug. 19788. Apr. 1980Process for the reclamation of acid from spent pickle liquor
US427249231. Mai 19799. Juni 1981Selective extraction and recovery of copper
US45578117. Nov. 198410. Dez. 1985Kernforschungsanlage Julich Gesellschaft mit beschrankter Haftung
Elo-Chem Atztechnik GmbH
Regeneration of an ammoniacal etching solution with recycling of solution with electrolytically reduced metal content to the regeneration input
US52483827. Febr. 199228. Sept. 1993Maria Helena SoukupProcess for manufacture of printed circuit boards by etching
US600121525. Sept. 199614. Dez. 1999Mitsubishi Denki Kabushiki KaishaSemiconductor nitride film etching system
US629086530. Nov. 199818. Sept. 2001Applied Materials, Inc.Spin-rinse-drying process for electroplated semiconductor wafers
US65168159. Juli 199911. Febr. 2003Applied Materials, Inc.Edge bead removal/spin rinse dry (EBR/SRD) module
US67705658. Jan. 20023. Aug. 2004Applied Materials Inc.System for planarizing metal conductive layers
US682461226. Dez. 200130. Nov. 2004Applied Materials, Inc.Electroless plating system
US68645708. Juni 20018. März 2005The Regents of The University of CaliforniaMethod and apparatus for fabricating self-assembling microstructures
US732665426. Mai 20045. Febr. 2008Hitachi Software Engineering Co., Ltd.Monodisperse nanoparticles produced by size-selective photoetching reaction
US77278046. Juni 20071. Juni 2010The Regents of the University of CaliforniaMethod and apparatus for fabricating self-assembling microstructures
US789705618. Okt. 20021. März 2011LG Display Co., Ltd.Apparatus for etching or stripping substrate of liquid crystal display device and method thereof
US82361897. Juli 20087. Aug. 2012Sigma Engineering ABMethod for etching copper and recovery of the spent etching solution

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