Suche Bilder Maps Play YouTube News Gmail Drive Mehr »
Erweiterte Patentsuche | Webprotokoll | Anmelden

Patente

Referenziert von

Zitiert von PatentEingetragenAusgestelltUrsprünglich Bevollmächtigter Titel
US524379126. Nov. 199014. Sept. 1993AMP IncorporatedPolishing fixture and method for polishing light emitting devices
US544341415. Juni 199422. Aug. 1995Sander with orbiting platen and abrasive
US55585682. Nov. 199424. Sept. 1996Ontrak Systems, Inc.Wafer polishing machine with fluid bearings
US558253427. Dez. 199310. Dez. 1996Applied Materials, Inc.Orbital chemical mechanical polishing apparatus and method
US559334411. Okt. 199414. Jan. 1997Ontrak Systems, Inc.Wafer polishing machine with fluid bearings and drive systems
US56073418. Aug. 19944. März 1997Method and structure for polishing a wafer during manufacture of integrated circuits
US56430532. März 19941. Juli 1997Applied Materials, Inc.Chemical mechanical polishing apparatus with improved polishing control
US56500392. März 199422. Juli 1997Applied Materials, Inc.Chemical mechanical polishing apparatus with improved slurry distribution
US567209321. Apr. 199530. Sept. 1997Buehler, Ltd.Specimen load control mechanism for automatic polishing apparatus
US56929473. Dez. 19962. Dez. 1997OnTrak Systems, Inc.Linear polisher and method for semiconductor wafer planarization
US57022877. Juni 199530. Dez. 1997Sander with orbiting platen and abrasive
US57022908. Apr. 199630. Dez. 1997Block for polishing a wafer during manufacture of integrated circuits
US573317525. Apr. 199431. März 1998Polishing a workpiece using equal velocity at all points overlapping a polisher
US575991813. Aug. 19962. Juni 1998Obsidian, Inc.Method for chemical mechanical polishing
US583680725. Apr. 199617. Nov. 1998Method and structure for polishing a wafer during manufacture of integrated circuits
US585113625. Juli 199722. Dez. 1998Obsidian, Inc.Apparatus for chemical mechanical polishing
US58998004. Apr. 19974. Mai 1999Applied Materials, Inc.Chemical mechanical polishing apparatus with orbital polishing
US590853018. Mai 19951. Juni 1999Obsidian, Inc.Apparatus for chemical mechanical polishing
US59385043. Juni 199517. Aug. 1999Applied Materials, Inc.Substrate polishing apparatus
US593888425. Juli 199717. Aug. 1999Obsidian, Inc.Apparatus for chemical mechanical polishing
US606854225. Juni 199730. Mai 2000TOMOE Engineering Co, Ltd.
Sanshin Co., Ltd.
Pad tape surface polishing method and apparatus
US617969011. Juni 199930. Jan. 2001Applied Materials, Inc.Substrate polishing apparatus
US62314278. Mai 199715. Mai 2001Lam Research CorporationLinear polisher and method for semiconductor wafer planarization
US63439788. Mai 20005. Febr. 2002Ebara CorporationMethod and apparatus for polishing workpiece
US63549223. Jan. 200012. März 2002Ebara CorporationPolishing apparatus
US641315629. Apr. 19992. Juli 2002Ebara CorporationMethod and apparatus for polishing workpiece
US648536118. Dez. 199726. Nov. 2002Advanced Micro Devices, Inc.Apparatus for holding and delayering a semiconductor die
US648856529. Aug. 20003. Dez. 2002Applied Materials, Inc.Apparatus for chemical mechanical planarization having nested load cups
US65031348. Juni 20017. Jan. 2003Applied Materials, Inc.Carrier head for a chemical mechanical polishing apparatus
US662988316. Mai 20017. Okt. 2003Ebara Corporation
Mitsubishi Materials Corporation
Polishing apparatus
US668240827. Dez. 200127. Jan. 2004Ebara CorporationPolishing apparatus
US68780445. Jan. 200412. Apr. 2005Ebara CorporationPolishing apparatus
US700481818. Dez. 199728. Febr. 2006Sander with orbiting platen and abrasive
US702566015. Aug. 200311. Apr. 2006Lam Research CorporationAssembly and method for generating a hydrodynamic air bearing
US71985572. Aug. 20023. Apr. 2007Sanding machine incorporating multiple sanding motions
US763237814. März 200515. Dez. 2009Ebara CorporationPolishing apparatus