US4204248A - Heat transfer mounting arrangement for a solid state device connected to a circuit board - Google Patents

Heat transfer mounting arrangement for a solid state device connected to a circuit board Download PDF

Info

Publication number
US4204248A
US4204248A US05/962,094 US96209478A US4204248A US 4204248 A US4204248 A US 4204248A US 96209478 A US96209478 A US 96209478A US 4204248 A US4204248 A US 4204248A
Authority
US
United States
Prior art keywords
circuit board
solid state
state device
printed circuit
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/962,094
Inventor
Daniel S. Proffit
Maurice Regignano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to US05/962,094 priority Critical patent/US4204248A/en
Priority to GB7939566A priority patent/GB2037484B/en
Priority to JP14783479A priority patent/JPS5588361A/en
Application granted granted Critical
Publication of US4204248A publication Critical patent/US4204248A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Our invention relates to a mounting arrangement for a solid state device, and particularly to such an arrangement for providing good heat transfer from the solid state device to a chassis or heat sink, and for providing connections from the solid state device to a printed circuit board without strain.
  • Solid state devices particularly power transistors in radio or electronic equipment, are frequnetly operated under conditions (considered normal) that require that the device be attached to or in engagement with a heat conductor or sink so that the device will not overheat.
  • a printed circuit board is an insulating material having relatively thin metallic patterns, none of which provides very good heat transfer.
  • the connecting leads of the solid state device and the metallic pattern of the printed circuit board are relatively fragile, and hence must be protected against strain during the soldering operation and thereafter during normal usage.
  • a principal and relatively general object of our invention is to provide a new and improved mounting arrangement for a solid state device.
  • Another object of our invention is to provide a new and improved mounting arrangement for providing good heat transfer from a solid state device or power transistor to a heat sink.
  • Another object of our invention is to provide a new and improved mounting arrangement for a solid state device that permits the device to be connected to a printed circuit board without strain on either the solid state device or the printed circuit board patterns.
  • Another and fairly specific object of our invention is to provide a new and improved mounting arrangement for a solid state device, the mounting arrangement providing good heat transfer characteristics so that the solid state device will not overheat, and providing good mechanical characteristics that protect the solid state device leads and the printed circuit board pattern from strain or breakage.
  • Another object of our invention is to provide a new and improved solid state mounting device that provides good heat transfer from the solid state device to a chassis or heat sink, and that enables the solid state device to be readily connected to or removed from a printed circuit board pattern.
  • a mounting device that is formed of a metallic heat conductor.
  • the mounting device comprises a plate having projections which pass through appropriate holes in a printed circuit board pattern, and which are soldered to the pattern.
  • the device further comprises a connecting portion which is located between the projections and which extends from the plate at an angle.
  • the solid state device is positioned on or in close proximity to the plate and held by any suitable means.
  • the leads of the solid state device are soldered in holes in the proper circuit patterns of the printed circuit board.
  • the printed circuit board, with the attached mounting device and solid state device is then positioned on the heat sink or chassis.
  • the connecting portion of the mounting device is positioned in contact with and fastened to the heat sink or chassis.
  • the close proximity of the solid state device and mounting arrangement, and the fastening of the connecting portion to the chassis or heat sink provide good heat conduction.
  • the arrangement also provides a secure structure that protects the solid state device leads and the printed circuit board patterns against strain and breakage.
  • FIG. 1 is a perspective view of a preferred embodiment of an improved mounting arrangement in accordance with our invention
  • FIG. 2 is a side view, partly in cross section, of our mounting arrangement with a solid state device mounted on a printed circuit board and chassis;
  • FIG. 3 is a front view of our mounting arrangement with a solid state device mounted on a printed circuit board and chassis.
  • FIG. 1 shows a perspective view of a preferred embodiment of our heat transfer mounting arrangement 10.
  • Our arrangement 10 is preferably formed from a sheet of metal of good heat conducting material, such as aluminum.
  • Our arrangement 10 comprises a substantially rectangular, relatively thin plate 13 having spaced parallel, elongated projections 11, 12 at one side. We prefer that the projection 11, 12 have respective shoulders 11a, 12a to prevent the projections 11, 12 from passing entirely through holes or openings in a printed circuit board.
  • a metallic connecting portion 15 is positioned between the projections 11, 12 and extends at an angle (preferably 90 degrees) from the plane of the plate 13.
  • the plate 13, the projections 11, 12, and the connecting portion 15 be integrally formed from one sheet of metal by punching or stamping, and the portion 15 bent at substantially a right angle with respect to the plane of the plate 13.
  • a hole or opening 16 is provided in the plate 13 for mounting a solid state device or power transistor, and a hole or opening 17 is provided in the connecting portion 15 for attaching the portion 15 to a chassis or heat sink.
  • the arrangement 10 is preferably plated to permit the projections 11, 12 to be soldered.
  • FIGS. 2 and 3 we show our arrangement 10 in side and front views respectively with a solid state device 20, such as a power transistor, mounted on the arrangement 10 in good heat transfer relation.
  • the solid state device 20 can either be insulated from or placed directly against and in contact with the plate 13.
  • the device 20 is fastened by suitable means such as a threaded screw 18a which passes through the opening 16 in the plate 13, and which is held by a nut 18b.
  • the projections 11, 12 are passed through suitable openings in a printed circuit board 30 that has the usual holes and conducting patterns on it.
  • the arrangement 10 is held in the proper position above the board 30 by the shoulders 11a, 12a which do not pass through the openings in the board 30, but rest on the upper surface of the board 30.
  • the leads 21 of the solid state device 20 are also passed through suitable holes or openings in the circuit board 30. If desired, other components (not shown) are placed in suitable holes in the circuit board 30. In accordance with typical practice, the entire circuit board, with the components (not shown), the mounting arrangement 10 of our invention, and the solid state device 20, can then be soldered in accordance with typical practices. With respect to this operation, it will be noted that the projections 11, 12 and the leads 21 pass through the circuit board 30.
  • the circuit board 30 with its soldered components can be mounted on a chassis 40 in any suitable way, such as by screws 41 which thread into suitable projections or bosses 42 on the chassis 40.
  • the metallic connecting portion 15 of our arrangement 10 is positioned over and in contact with a suitable projection or boss 43 that is preferably an integral part of the chassis 40.
  • the connecting portion 15 is securely fastened to and in good heat transfer contact with the boss 43 by a suitable threaded member or screw 44.
  • the solid state device 20 can be operated at maximum ratings and still have good cooling through the heat conductive metal arrangement 10 in accordance with our invention.
  • our arrangement 10 holds the solid state device 20 mechanically, and permits the device 20 to be soldered to a circuit board 30 without strain on the relatively fragile leads 21. Thereafter, the connecting portion 15 can be mechanically connected to a chassis 40 to provide good heat transfer.
  • the exact angle of the connecting portion 15 with the plate 13 can be varied to overcome dimensional tolerances, and the hole 17 can be sufficiently large so that the screw 44 can engage the threads in the boss 43 without putting a strain on the projections 11, 12 and the leads 21 of the solid state device 20.
  • Our arrangement 10 permits the device 20 to be removed by unsoldering the leads 21 from the circuit board 30 without unsoldering the projections 11, 12.

Abstract

A solid state device, such as a power transistor, is fastened to a mounting arrangement that provides good heat conduction to a chassis or heat sink, that holds the solid state device so that its leads can be connected to a printed circuit board without strain, and that occupies a relatively small area of the printed circuit board.

Description

BACKGROUND OF THE INVENTION
Our invention relates to a mounting arrangement for a solid state device, and particularly to such an arrangement for providing good heat transfer from the solid state device to a chassis or heat sink, and for providing connections from the solid state device to a printed circuit board without strain.
Solid state devices, particularly power transistors in radio or electronic equipment, are frequnetly operated under conditions (considered normal) that require that the device be attached to or in engagement with a heat conductor or sink so that the device will not overheat. At the same time, such devices must frequently be connected to a printed circuit board. Typically, the printed circuit board is an insulating material having relatively thin metallic patterns, none of which provides very good heat transfer. Furthermore, the connecting leads of the solid state device and the metallic pattern of the printed circuit board are relatively fragile, and hence must be protected against strain during the soldering operation and thereafter during normal usage.
Accordingly, a principal and relatively general object of our invention is to provide a new and improved mounting arrangement for a solid state device.
Another object of our invention is to provide a new and improved mounting arrangement for providing good heat transfer from a solid state device or power transistor to a heat sink.
Another object of our invention is to provide a new and improved mounting arrangement for a solid state device that permits the device to be connected to a printed circuit board without strain on either the solid state device or the printed circuit board patterns.
Another and fairly specific object of our invention is to provide a new and improved mounting arrangement for a solid state device, the mounting arrangement providing good heat transfer characteristics so that the solid state device will not overheat, and providing good mechanical characteristics that protect the solid state device leads and the printed circuit board pattern from strain or breakage.
Another object of our invention is to provide a new and improved solid state mounting device that provides good heat transfer from the solid state device to a chassis or heat sink, and that enables the solid state device to be readily connected to or removed from a printed circuit board pattern.
SUMMARY OF THE INVENTION
Briefly, these and other objects are achieved in accordance with our invention by a mounting device that is formed of a metallic heat conductor. The mounting device comprises a plate having projections which pass through appropriate holes in a printed circuit board pattern, and which are soldered to the pattern. The device further comprises a connecting portion which is located between the projections and which extends from the plate at an angle. The solid state device is positioned on or in close proximity to the plate and held by any suitable means. The leads of the solid state device are soldered in holes in the proper circuit patterns of the printed circuit board. The printed circuit board, with the attached mounting device and solid state device, is then positioned on the heat sink or chassis. The connecting portion of the mounting device is positioned in contact with and fastened to the heat sink or chassis. The close proximity of the solid state device and mounting arrangement, and the fastening of the connecting portion to the chassis or heat sink provide good heat conduction. The arrangement also provides a secure structure that protects the solid state device leads and the printed circuit board patterns against strain and breakage.
BRIEF DESCRIPTION OF THE DRAWING
The subject matter which we regard as our invention is particularly pointed out and distinctly claimed in the claims. The structure and operation of our invention, together with further objects and advantages, may be better understood from the following description given in connection with the accompanying drawing, in which:
FIG. 1 is a perspective view of a preferred embodiment of an improved mounting arrangement in accordance with our invention;
FIG. 2 is a side view, partly in cross section, of our mounting arrangement with a solid state device mounted on a printed circuit board and chassis; and
FIG. 3 is a front view of our mounting arrangement with a solid state device mounted on a printed circuit board and chassis.
DESCRIPTION OF THE PREFERRED EMBODIMENT
FIG. 1 shows a perspective view of a preferred embodiment of our heat transfer mounting arrangement 10. Our arrangement 10 is preferably formed from a sheet of metal of good heat conducting material, such as aluminum. Our arrangement 10 comprises a substantially rectangular, relatively thin plate 13 having spaced parallel, elongated projections 11, 12 at one side. We prefer that the projection 11, 12 have respective shoulders 11a, 12a to prevent the projections 11, 12 from passing entirely through holes or openings in a printed circuit board. A metallic connecting portion 15 is positioned between the projections 11, 12 and extends at an angle (preferably 90 degrees) from the plane of the plate 13. We prefer that the plate 13, the projections 11, 12, and the connecting portion 15 be integrally formed from one sheet of metal by punching or stamping, and the portion 15 bent at substantially a right angle with respect to the plane of the plate 13. A hole or opening 16 is provided in the plate 13 for mounting a solid state device or power transistor, and a hole or opening 17 is provided in the connecting portion 15 for attaching the portion 15 to a chassis or heat sink. The arrangement 10 is preferably plated to permit the projections 11, 12 to be soldered.
With respect to FIGS. 2 and 3, we show our arrangement 10 in side and front views respectively with a solid state device 20, such as a power transistor, mounted on the arrangement 10 in good heat transfer relation. The solid state device 20 can either be insulated from or placed directly against and in contact with the plate 13. The device 20 is fastened by suitable means such as a threaded screw 18a which passes through the opening 16 in the plate 13, and which is held by a nut 18b. The projections 11, 12 are passed through suitable openings in a printed circuit board 30 that has the usual holes and conducting patterns on it. The arrangement 10 is held in the proper position above the board 30 by the shoulders 11a, 12a which do not pass through the openings in the board 30, but rest on the upper surface of the board 30. The leads 21 of the solid state device 20 are also passed through suitable holes or openings in the circuit board 30. If desired, other components (not shown) are placed in suitable holes in the circuit board 30. In accordance with typical practice, the entire circuit board, with the components (not shown), the mounting arrangement 10 of our invention, and the solid state device 20, can then be soldered in accordance with typical practices. With respect to this operation, it will be noted that the projections 11, 12 and the leads 21 pass through the circuit board 30.
After the soldering operation is completed, the circuit board 30 with its soldered components can be mounted on a chassis 40 in any suitable way, such as by screws 41 which thread into suitable projections or bosses 42 on the chassis 40.
In accordance with our invention, the metallic connecting portion 15 of our arrangement 10 is positioned over and in contact with a suitable projection or boss 43 that is preferably an integral part of the chassis 40. The connecting portion 15 is securely fastened to and in good heat transfer contact with the boss 43 by a suitable threaded member or screw 44.
With an arrangement as shown in the figures in accordance with our invention, good heat transfer is provided from the solid state device 20, through the flat plate 13 of our arrangement 10, through the connecting portion 15, to the boss 43 and chassis 40, which forms a heat sink. Thus, the solid state device 20 can be operated at maximum ratings and still have good cooling through the heat conductive metal arrangement 10 in accordance with our invention. In addition, our arrangement 10 holds the solid state device 20 mechanically, and permits the device 20 to be soldered to a circuit board 30 without strain on the relatively fragile leads 21. Thereafter, the connecting portion 15 can be mechanically connected to a chassis 40 to provide good heat transfer. The exact angle of the connecting portion 15 with the plate 13 can be varied to overcome dimensional tolerances, and the hole 17 can be sufficiently large so that the screw 44 can engage the threads in the boss 43 without putting a strain on the projections 11, 12 and the leads 21 of the solid state device 20. Our arrangement 10 permits the device 20 to be removed by unsoldering the leads 21 from the circuit board 30 without unsoldering the projections 11, 12.
It will thus be seen that we have provided a new and improved arrangement which securely holds a solid state device, which also provides a good heat transfer for that device, and which occupies very little area. While we have shown only one embodiment of our invention, persons skilled in the art will appreciate the modifications that may be made. For example, if the solid state device 20 must be electrically insulated, a thin sheet of insulating material can be placed between the device 20 and the plate 13 to provide sufficient electrical insulation but at the same time permit good heat transfer. Such insulation would also require that the screw 18a be insulated from the device 20. It is also possible for the connecting portion 15 to be soldered or welded to the arrangement 10, although we prefer that it be integrally formed from the plate 13. Also, other fastening means may be used in place of the screws 18a, 44. Therefore, while our invention has been described with reference to a particular embodiment, it is to be understood that modifications may be made without departing from the spirit of the invention or from the scope of the claims.

Claims (6)

What we claim as new and desire to secure by Letters Patent of the United States is:
1. An improved radio construction comprising:
a. a metallic chassis;
b. a printed circuit board mounted on said chassis, said printed circuit board having holes therethrough in which electrical leads can be placed and soldered;
c. and a mounting arrangement for a solid state device comprising:
1. a metallic plate extending away from said printed circuit board and having at least two spaced projections, said spaced projections extending into respective holes in said printed circuit board, and being soldered thereto;
2.
2. a metallic member attached to said plate in the vicinity of said spaced projections, said metallic member extending from said plate over and in contact with a portion of said chassis;
3. means fastening said metallic member to said chassis to provide a heat path from said metallic plate through said metallic member to said chassis;
4. and a solid state device attached to said metallic plate in heat transfer relation therewith, said solid state device having leads extending into respective holes in said printed circuit board and being
soldered thereto. 2. The improved construction of claim 1 wherein said metallic member extends from said plate at substantially a right angle therewith.
3. The improved construction of claim 1 or claim 2 wherein said metallic member is an integral portion of said metallic plate.
4. The improved construction of claim 3 wherein said projections include shoulders that rest against a surface of said printed circuit board.
5. The improved construction of claim 4 wherein said solid state device physically contacts said metallic plate.
US05/962,094 1978-11-20 1978-11-20 Heat transfer mounting arrangement for a solid state device connected to a circuit board Expired - Lifetime US4204248A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US05/962,094 US4204248A (en) 1978-11-20 1978-11-20 Heat transfer mounting arrangement for a solid state device connected to a circuit board
GB7939566A GB2037484B (en) 1978-11-20 1979-11-15 Heat transfer mounting arrangement for a solid state device connected to a circuit board
JP14783479A JPS5588361A (en) 1978-11-20 1979-11-16 Device for mounting solid device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/962,094 US4204248A (en) 1978-11-20 1978-11-20 Heat transfer mounting arrangement for a solid state device connected to a circuit board

Publications (1)

Publication Number Publication Date
US4204248A true US4204248A (en) 1980-05-20

Family

ID=25505412

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/962,094 Expired - Lifetime US4204248A (en) 1978-11-20 1978-11-20 Heat transfer mounting arrangement for a solid state device connected to a circuit board

Country Status (3)

Country Link
US (1) US4204248A (en)
JP (1) JPS5588361A (en)
GB (1) GB2037484B (en)

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982002980A1 (en) * 1981-02-27 1982-09-02 Inc Motorola High current package with multi-level leads
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4471407A (en) * 1982-09-27 1984-09-11 Kohler Company Combination heat sink for a semiconductor
DE3308350A1 (en) * 1983-03-09 1984-09-13 ANT Nachrichtentechnik GmbH, 7150 Backnang Attachment device for the electrically insulating and heat-conducting attachment of electrical components to a cold body
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
US4498120A (en) * 1982-03-01 1985-02-05 Kaufman Lance R Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink
DE3416348A1 (en) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Compact assembly in which a printed-circuit board is connected to a heat sink
US4574330A (en) * 1982-12-20 1986-03-04 Burr-Brown Corporation Heat sink for dissipating heat generated by electronic displays
US4593342A (en) * 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
US4604529A (en) * 1984-09-28 1986-08-05 Cincinnati Microwave, Inc. Radar warning receiver with power plug
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
US4631819A (en) * 1985-05-29 1986-12-30 Motorola, Inc. Low stress, tolerance free method for mounting power devices
US4674005A (en) * 1985-03-07 1987-06-16 Bendix Electronics S.A. Multiple fastening clip and device for the collective mounting of electronic power components
WO1987005183A1 (en) * 1986-02-18 1987-08-27 Ncr Corporation Mounting arrangement for solid state devices
US4695691A (en) * 1985-01-14 1987-09-22 Aktieselskabet Laur.Knudsen Nordisk Elektricitets Selskab Switch housing having fixed external nuts for attachment of contacts and terminals
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4738024A (en) * 1987-08-24 1988-04-19 Hytek Microsystems Incorporated Method of making a heat dissipating assembly
DE3807144A1 (en) * 1987-03-12 1988-09-22 Vaillant Joh Gmbh & Co Electrically operated instantaneous water heater
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
DE3935272A1 (en) * 1989-10-24 1991-04-25 Loewe Opta Gmbh Cooling plate for electronic components - is fitted into frame by projections for positioning w.r.t. PCB
US5031023A (en) * 1989-07-11 1991-07-09 Sgs-Thomson Microelectronics S.R.L. Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
US5272593A (en) * 1990-06-29 1993-12-21 Robert Bosch Gmbh Housing for an electronic circuit with improved heat dissipation means
DE4305147A1 (en) * 1993-02-19 1994-08-25 Philips Patentverwaltung Electrical apparatus having a device for the dissipation of heat from electrical components
US5363552A (en) * 1993-07-23 1994-11-15 Eaton Corporation Method of heat sinking and mounting a solid-state device
US5463251A (en) * 1992-07-08 1995-10-31 Mitsubishi Denki Kabushiki Kaisha Power semiconductor package having improved durability
US5493897A (en) * 1994-05-16 1996-02-27 Figaro Engineering Inc. Gas sensor
US5841633A (en) * 1997-09-16 1998-11-24 Huang; Chuan-Wen Cup and heat sink mounting arrangement
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
US6266244B1 (en) 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
US6574121B1 (en) * 1999-09-29 2003-06-03 Silicon Graphics, Inc. Housing ground bracket and method
US20050078454A1 (en) * 2001-12-04 2005-04-14 Jun Hyodo Power supply
US20080055862A1 (en) * 2006-09-06 2008-03-06 Delta Electronics, Inc. Heat sink fastening device and assembling process thereof
US8081475B1 (en) * 2009-05-29 2011-12-20 Brunswick Corporation Heat sinking assembly and method for power electronics in a trolling motor controller head
US20120069525A1 (en) * 2010-09-21 2012-03-22 Delta Electronics, Inc. Assembled structure of electronic component and heat-dissipating device
US20120182691A1 (en) * 2011-01-18 2012-07-19 Chicony Power Technology Co., Ltd. Integrated device of heat dissipation unit and package component and a fastening structure for the same
US9704776B2 (en) * 2014-07-17 2017-07-11 Fuji Electric Co., Ltd. Semiconductor device having semiconductor module and cooler coupled with bolt
US20180035530A1 (en) * 2016-07-28 2018-02-01 JVC Kenwood Corporation Heat dissipating structure and electronic device
JP2018032775A (en) * 2016-08-25 2018-03-01 田淵電機株式会社 Electronic component heat dissipation structure and assembly method therefor
US20220183179A1 (en) * 2020-12-09 2022-06-09 Chicony Power Technology Co., Ltd. Heat dissipation plate

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584259A (en) * 1981-06-30 1983-01-11 Toshiba Corp Fluorescent lamp
JPS587351U (en) * 1981-07-07 1983-01-18 パイオニア株式会社 Heat dissipation mechanism
GB2174541B (en) * 1985-05-04 1989-05-24 Stc Plc Dil package adaptor
GB2338826B (en) * 1998-06-23 2003-04-16 Eev Ltd Semiconductor arrangement
CN104684338B (en) * 2013-11-26 2018-01-30 台达电子企业管理（上海）有限公司 Cooling base and electronic installation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2947957A (en) * 1957-04-22 1960-08-02 Zenith Radio Corp Transformers
GB911445A (en) * 1959-11-09 1962-11-28 Northrop Corp A holder for electric or electronic components
US3487267A (en) * 1968-01-02 1969-12-30 Jerrold Electronics Corp Thermally conducting transistor support arms
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
US3665256A (en) * 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2947957A (en) * 1957-04-22 1960-08-02 Zenith Radio Corp Transformers
GB911445A (en) * 1959-11-09 1962-11-28 Northrop Corp A holder for electric or electronic components
US3487267A (en) * 1968-01-02 1969-12-30 Jerrold Electronics Corp Thermally conducting transistor support arms
US3665256A (en) * 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982002980A1 (en) * 1981-02-27 1982-09-02 Inc Motorola High current package with multi-level leads
US4498120A (en) * 1982-03-01 1985-02-05 Kaufman Lance R Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
US4471407A (en) * 1982-09-27 1984-09-11 Kohler Company Combination heat sink for a semiconductor
US4574330A (en) * 1982-12-20 1986-03-04 Burr-Brown Corporation Heat sink for dissipating heat generated by electronic displays
DE3308350A1 (en) * 1983-03-09 1984-09-13 ANT Nachrichtentechnik GmbH, 7150 Backnang Attachment device for the electrically insulating and heat-conducting attachment of electrical components to a cold body
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
DE3416348A1 (en) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Compact assembly in which a printed-circuit board is connected to a heat sink
US4604529A (en) * 1984-09-28 1986-08-05 Cincinnati Microwave, Inc. Radar warning receiver with power plug
US4593342A (en) * 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
US4695691A (en) * 1985-01-14 1987-09-22 Aktieselskabet Laur.Knudsen Nordisk Elektricitets Selskab Switch housing having fixed external nuts for attachment of contacts and terminals
US4674005A (en) * 1985-03-07 1987-06-16 Bendix Electronics S.A. Multiple fastening clip and device for the collective mounting of electronic power components
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4631819A (en) * 1985-05-29 1986-12-30 Motorola, Inc. Low stress, tolerance free method for mounting power devices
WO1987005183A1 (en) * 1986-02-18 1987-08-27 Ncr Corporation Mounting arrangement for solid state devices
DE3807144A1 (en) * 1987-03-12 1988-09-22 Vaillant Joh Gmbh & Co Electrically operated instantaneous water heater
US4738024A (en) * 1987-08-24 1988-04-19 Hytek Microsystems Incorporated Method of making a heat dissipating assembly
US5031023A (en) * 1989-07-11 1991-07-09 Sgs-Thomson Microelectronics S.R.L. Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink
DE3935272A1 (en) * 1989-10-24 1991-04-25 Loewe Opta Gmbh Cooling plate for electronic components - is fitted into frame by projections for positioning w.r.t. PCB
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
US5272593A (en) * 1990-06-29 1993-12-21 Robert Bosch Gmbh Housing for an electronic circuit with improved heat dissipation means
US5463251A (en) * 1992-07-08 1995-10-31 Mitsubishi Denki Kabushiki Kaisha Power semiconductor package having improved durability
DE4305147A1 (en) * 1993-02-19 1994-08-25 Philips Patentverwaltung Electrical apparatus having a device for the dissipation of heat from electrical components
DE4305147C2 (en) * 1993-02-19 1998-01-22 Philips Patentverwaltung Electrical device with a device for dissipating heat from electrical components
US5363552A (en) * 1993-07-23 1994-11-15 Eaton Corporation Method of heat sinking and mounting a solid-state device
US5493897A (en) * 1994-05-16 1996-02-27 Figaro Engineering Inc. Gas sensor
US5841633A (en) * 1997-09-16 1998-11-24 Huang; Chuan-Wen Cup and heat sink mounting arrangement
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
US6574121B1 (en) * 1999-09-29 2003-06-03 Silicon Graphics, Inc. Housing ground bracket and method
US6266244B1 (en) 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
DE10085150B4 (en) * 1999-10-25 2008-03-27 Harman International Industries, Incorporated, Northridge Heat sink with clamping device for electrical components
US7151671B2 (en) * 2001-12-04 2006-12-19 Tokyo R & D Co., Ltd. Power supply
US20050078454A1 (en) * 2001-12-04 2005-04-14 Jun Hyodo Power supply
US20080055862A1 (en) * 2006-09-06 2008-03-06 Delta Electronics, Inc. Heat sink fastening device and assembling process thereof
US7505274B2 (en) * 2006-09-06 2009-03-17 Delta Electronics, Inc. Heat sink fastening device and assembling process thereof
US8081475B1 (en) * 2009-05-29 2011-12-20 Brunswick Corporation Heat sinking assembly and method for power electronics in a trolling motor controller head
US20120069525A1 (en) * 2010-09-21 2012-03-22 Delta Electronics, Inc. Assembled structure of electronic component and heat-dissipating device
US20120182691A1 (en) * 2011-01-18 2012-07-19 Chicony Power Technology Co., Ltd. Integrated device of heat dissipation unit and package component and a fastening structure for the same
US8363409B2 (en) * 2011-01-18 2013-01-29 Chicony Power Technology Co., Ltd. Integrated device of heat dissipation unit and package component and a fastening structure for the same
US9704776B2 (en) * 2014-07-17 2017-07-11 Fuji Electric Co., Ltd. Semiconductor device having semiconductor module and cooler coupled with bolt
US20180035530A1 (en) * 2016-07-28 2018-02-01 JVC Kenwood Corporation Heat dissipating structure and electronic device
US10271419B2 (en) * 2016-07-28 2019-04-23 JVC Kenwood Corporation Heat dissipating structure and electronic device
JP2018032775A (en) * 2016-08-25 2018-03-01 田淵電機株式会社 Electronic component heat dissipation structure and assembly method therefor
US20220183179A1 (en) * 2020-12-09 2022-06-09 Chicony Power Technology Co., Ltd. Heat dissipation plate

Also Published As

Publication number Publication date
GB2037484B (en) 1982-12-01
JPS5588361A (en) 1980-07-04
GB2037484A (en) 1980-07-09

Similar Documents

Publication Publication Date Title
US4204248A (en) Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4167031A (en) Heat dissipating assembly for semiconductor devices
US6377462B1 (en) Circuit board assembly with heat sinking
WO2017169820A1 (en) Circuit structure
US4446504A (en) Mounting means with solderable studs
JP2904050B2 (en) Electronic circuit unit
GB2025161A (en) Device for connecting a coaxial cable connector to a printed circuit board
JP4089300B2 (en) Substrate storage box
JPH08148842A (en) Electronic apparatus
JPH0563034B2 (en)
JPH0515036A (en) Electric connection box
JPH03268348A (en) Heat dissipating structure for surface-mounted ic package
US6921273B2 (en) Electric connection arrangement for electronic devices
US5260602A (en) Hybrid integrated-circuit device having an asymmetrical thermal dissipator
JPH0720940Y2 (en) Power type electronic circuit device
JP3008809B2 (en) Electric connection box with built-in electronic circuit unit
JP2546304Y2 (en) Device for fixing semiconductor elements
JP2671700B2 (en) Electrical equipment
KR200256593Y1 (en) Structure for heat sink of the power device
KR880000314Y1 (en) Terminal for high power transistor
KR200157480Y1 (en) Pcb support structure with cooling plate
JPH0751828Y2 (en) Heat dissipation and grounding structure for electronic circuits
JP2590583B2 (en) Printed wiring board with bar conductor
JP2563680Y2 (en) Power unit
GB2352872A (en) Cooling a component mounted on a PCB