US4220460A - Vapor delivery system and method - Google Patents

Vapor delivery system and method Download PDF

Info

Publication number
US4220460A
US4220460A US06/009,565 US956579A US4220460A US 4220460 A US4220460 A US 4220460A US 956579 A US956579 A US 956579A US 4220460 A US4220460 A US 4220460A
Authority
US
United States
Prior art keywords
vapor
temperature controlled
controlled chamber
bubblers
vaporizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/009,565
Inventor
Fred P. Partus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Priority to US06/009,565 priority Critical patent/US4220460A/en
Application granted granted Critical
Publication of US4220460A publication Critical patent/US4220460A/en
Assigned to AT & T TECHNOLOGIES, INC., reassignment AT & T TECHNOLOGIES, INC., CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE JAN. 3,1984 Assignors: WESTERN ELECTRIC COMPANY, INCORPORATED
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • C23C16/4482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material by bubbling of carrier gas through liquid source material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J4/00—Feed or outlet devices; Feed or outlet control devices
    • B01J4/008—Feed or outlet control devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
    • C03B37/01—Manufacture of glass fibres or filaments
    • C03B37/012—Manufacture of preforms for drawing fibres or filaments
    • C03B37/014—Manufacture of preforms for drawing fibres or filaments made entirely or partially by chemical means, e.g. vapour phase deposition of bulk porous glass either by outside vapour deposition [OVD], or by outside vapour phase oxidation [OVPO] or by vapour axial deposition [VAD]
    • C03B37/01413—Reactant delivery systems
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2207/00—Glass deposition burners
    • C03B2207/80—Feeding the burner or the burner-heated deposition site
    • C03B2207/85—Feeding the burner or the burner-heated deposition site with vapour generated from liquid glass precursors, e.g. directly by heating the liquid
    • C03B2207/86—Feeding the burner or the burner-heated deposition site with vapour generated from liquid glass precursors, e.g. directly by heating the liquid by bubbling a gas through the liquid
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2207/00—Glass deposition burners
    • C03B2207/80—Feeding the burner or the burner-heated deposition site
    • C03B2207/85—Feeding the burner or the burner-heated deposition site with vapour generated from liquid glass precursors, e.g. directly by heating the liquid
    • C03B2207/87—Controlling the temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S261/00—Gas and liquid contact apparatus
    • Y10S261/65—Vaporizers

Definitions

  • This invention relates to methods and systems for generating and delivering vapors to vapor deposition sites.
  • vapor deposition As a materials forming technique.
  • vapors of materials such as SiCl 4 , GeCl 4 , and PoCl 3 must be precisely blended and delivered at controlled mass flow rates to a preform construction site or station where they are reacted and deposited on or in a support. This can be done by passing carrier gases such as H 2 , He, N 2 , O 2 , or Ar through supplies of the materials in liquid form to the deposition site with the vapors entrained with the carrier gas.
  • carrier gases such as H 2 , He, N 2 , O 2 , or Ar
  • a group of vaporizors is normally used of the type known as bubblers.
  • a bubbler has a chamber in which a gas intake conduit terminates with an outlet orifice located below the surface of liquid materials container therein.
  • An outlet conduit communicates between the space above the surface of the liquid and the vapor deposition site.
  • a group of bubblers has typically been mounted within a temperature controlled chamber or oven together with associated conduits, manifolds, sensors and system control elements of which the vapor delivery system is comprised.
  • heat is provided to the liquids housed within the bubblers causing an accelerated rate of vaporization.
  • improved vapor delivery control may be achieved by individually controlling the heating of each bubbler in the group as through the use of individual heaters jacketed about each bubble. This however increases the risk of condensation forming in the system since significant temperature differentials may occur in the vapor stream from the bubblers that merge in the system manifolds causing the warmer of the streams to be cooled.
  • a system for generating and delivering vapors to a vapor deposition station.
  • the system comprises a vaporizer adapted to contain a supply of liquid, a heater thermally coupled with the vaporizer and electrically coupled with a heater controller, a temperature controlled chamber located above the vaporizer, and means for heating the space within the temperature controlled chamber.
  • a carrier gas intake conduit extends through the temperature controlled chamber down into the vaporizer through which a carrier gas may be introduced into the vaporizer.
  • a vapor exhaust conduit extends upwardly from the vaporizer and through the temperature controlled chamber through which vapors may be carrier from the vaporizer entrained with the carrier gas to the vapor deposition station.
  • a vapor sensor is positioned within that portion of the vapor exhaust conduit located within the temperature controlled chamber and operatively coupled with the vaporizer heater controller.
  • a system for delivering a vapor blend to a vapor deposition site substantially uncontaminated with vapor condensate which system comprises a plurality of bubblers each having means for containing and heating liquids to form vapors. Means are provided for introducing a carrier gas into each of the bubblers.
  • a temperature controlled chamber is located adjacent the bubblers and means provided for heating the space within the temperature controlled chamber.
  • a manifold is mounted within the temperature chamber and means for providing fluid communication between the manifold within the temperature controlled chamber and the vapor deposition site. Conduits extends from each of the bubblers into the temperature controlled chamber where they are coupled with the manifold thereby providing fluid communication between the bubblers and the vapor deposition site.
  • a method for generating and delivering a vapor blend to a vapor deposition station substantially uncontaminated with vapor condensate.
  • the method comprises the steps of heating liquids of diverse compositions disposed within a plurality of bubblers while bubbling carrier gases through the liquids. Vapors entrained with the carrier gases in vapor streams are conveyed from each of the bubblers upwardly through upright conduits whereby vapor condensate formed within the upright conduits may gravitate down into the bubblers.
  • the vapor streams are merged into a common vapor stream and the common vapor stream conveyed to the vapor deposition station while continuously being heated.
  • FIG. 1 is a schematic diagram of a vapor generating and delivering system embodying principles of the invention in one preformed form.
  • FIG. 2 is a schematic illustration of a sensor employed by the system shown in FIG. 1.
  • FIG. 3 is another schematic diagram of another sensor employed by the system depicted in FIG. 1.
  • FIG. 1 a vapor delivery system which comprises a pair of bubblers 10 and 12 having resistance heaters 14 and 16 jacketed about their exterior surfaces. Each bubbler is partially filled with liquids of mutually different composition. The surfaces 18 and 19 of these liquids are maintained at substantially constant heights within the bubblers by relatively large reservoirs R 1 , R 2 under head pressure in fluid communication therewith through conduits 22 and 21.
  • a carrier gas intake conduit 27 extends from an unshown supply of carrier gas into the upper zone of the temperature controlled chamber where it branches into two branch conduits 28 and 29 at a manifold 30.
  • the branch conduit 28 is seen to extend through a sensors unit 32, a valve V 1 , then downwardly through the lower zone of the chamber and into the bubbler 10, terminating with an outlet orifice 34 located beneath the surface 18 adjacent the bubbler bottom 35.
  • the other branch conduit 29 is also seen to extend through a sensors unit 36, a valve V 2 , and then down through the lower zone of the chamber and into the bubbler 12, terminating with an outlet orifice 38 located adjacent the bubbler bottom 39.
  • the vapor delivery system is further seen to include a vapor exhaust conduit 41 which extends upwardly from the upper portion of bubbler 10 into the temperature controlled chamber 23 passing first through the lower zone and then into the upper zone where it extends through a sensors unit 43 and then down into the lower zone to a vapor stream manifold.
  • another vapor exhaust conduit 45 extends upwardly from bubbler 12 into the temperature control chamber 23 also passing first through the lower zone then into the upper zone and through a sensors unit 47 before descending down into the lower zone to the vapor stream manifold.
  • the two vapor exhaust conduits merge into a common vapor exhaust conduit 49 which extends out of the lower zone of the chamber and to a vapor reaction zone where the vapor is deposited as in making an optical waveguide preform.
  • a resistance heating element 50 coiled thereabout.
  • the sensors units 32 and 36 through which the carrier gas passes include a vapor-to-carrier gas ratio sensor in the form of an exposed, electrically conductive coil 52 as shown in FIG. 2, and a carrier gas flow rate sensor.
  • the flow rate sensor includes a pair of electric resistance heating elements 54 wound in series about a sensor tube 56 which communicates with the carrier gas intake branch conduits 28 and 29 as shown in FIG. 3.
  • Sensors units 43 and 47 similarly have a carrier gas to vapor ratio sensor in the form of an exposed conductive coil positioned within the flow stream of the carrier gas and vapor.
  • These sensors within the units 32, 36, 43 and 47 are electrically connected through unshown control circuitry to a heater controller which controls the bubbler heaters 14 and 16. Exemplary control circuitry is illustrated in U.S. Pat. No.
  • liquid is supplied to the bubblers from the reservoirs and surface levels 18 and 19 established.
  • the heaters 14 and 16 jacketed about the bubblers are then energized causing the liquids contained within the bubblers to be heated and vaporized under individual control.
  • Carrier gas is introduced through the carrier gas conduits into the bubblers beneath the surfaces 18 and 19. During introduction the carrier gas is heated by passing through the temperature control chamber 23 which serves to avoid heat from being drawn by the carrier gas from the liquids.
  • the carrier gas then rises to the surfaces of the liquids within the bubblers during which time vapor is also formed within the rising carrier gas bubbles.
  • the vapors entrained with the carrier gas then exits the bubblers through the exhaust conduits 41 and 45.
  • conduits 41 and 45 As the vapor stream rises through the conduits 41 and 45 some condensate may form on the inside surface of the conduits since it is passing through a spacial environment at a relatively cooler temperature than that within the bubblers. Nevertheless, since the conduits are upwardly oriented condensate so formed will tend to gravitate back into the bubblers rather than enter the sensors units 43 and 47.
  • the vapor stream then passes into the temperature controlled chamber and into the upper chamber zone or space which is heated by a heater schematically shown at 58 to a temperature somewhat below that of the temperature of the lower zone which is heated by a heater 59. From here the stream passes through the sensor units 43 and 47 substantially free of condensate due both to the orientation of the conduits 41 and 45 beneath the temperature controlled chamber and to the fact that heat is being inputted into the stream within the chamber upper zone. The vapor stream is then directed downwardly into the lower zone, which is maintained at a somewhat higher temperature such as 5° to 10° F. than that of the upper zone, and to the vapor stream manifold.
  • a vapor delivery system and method for generating and delivering vapor to a vapor reaction station substantially free of vapor condensate which could adversely interfere with both the vapor reaction as well as delivery control.
  • the system and method enables bubblers to be maintained, if desired, at ambient room temperature where they may be readily accessable for maintenance.
  • the bubblers may be maintained within a portion of the temperature controlled chamber itself if the space within the bubblers is maintained cooler than the vapor stream exhausted therefrom or by further chamber compartmentalization.
  • Many other modifications, additions, and deletions may, of course, be made thereto without departure from the spirit and scope of the invention as set forth in the following claims.

Abstract

A system for generating and delivering vapors to a vapor deposition station is disclosed which comprises a bubbler 10 adapted to contain a supply of liquid, a bubbler heater 14 thermally coupled with the bubbler and electrically coupled with a heater controller, a temperature controlled chamber 23 located above the bubbler, and means 58,59 for heating the space within the temperature controlled chamber. A carrier gas intake conduit 27,28 extends through the temperature controlled chamber and down into the bubbler through which carrier gas may be introduced into the bubbler. A vapor exhaust conduit 41,49 extends upwardly from the bubbler and through the temperature controlled chamber through which vapors may be carried from the bubbler entrained with the carrier gas to the vapor deposition station. A sensor 52 is positioned within that portion of the vapor exhaust conduit located within the temperature controlled chamber and operatively coupled with the bubbler heater controller.

Description

TECHNICAL FIELD
This invention relates to methods and systems for generating and delivering vapors to vapor deposition sites.
BACKGROUND OF THE INVENTION
With the advent of optical waveguides for use in the communications industry, much emphasis has recently been placed on vapor deposition as a materials forming technique. In constructing preforms from which optical fibers may be drawn, vapors of materials such as SiCl4, GeCl4, and PoCl3 must be precisely blended and delivered at controlled mass flow rates to a preform construction site or station where they are reacted and deposited on or in a support. This can be done by passing carrier gases such as H2, He, N2, O2, or Ar through supplies of the materials in liquid form to the deposition site with the vapors entrained with the carrier gas. In performing this operation a group of vaporizors is normally used of the type known as bubblers. A bubbler has a chamber in which a gas intake conduit terminates with an outlet orifice located below the surface of liquid materials container therein. An outlet conduit communicates between the space above the surface of the liquid and the vapor deposition site. Exemplary of deposition systems employing bubblers is that illustrated in U.S. Pat. No. 3,826,560.
Heretofore a group of bubblers has typically been mounted within a temperature controlled chamber or oven together with associated conduits, manifolds, sensors and system control elements of which the vapor delivery system is comprised. By heating the entire temperature controlled chamber heat is provided to the liquids housed within the bubblers causing an accelerated rate of vaporization. Recently, it has been found that improved vapor delivery control may be achieved by individually controlling the heating of each bubbler in the group as through the use of individual heaters jacketed about each bubble. This however increases the risk of condensation forming in the system since significant temperature differentials may occur in the vapor stream from the bubblers that merge in the system manifolds causing the warmer of the streams to be cooled.
Where condensate is formed it may settle upon various sensors employed by the control system employed thereby producing false control signals. This will, in turn, erroneously alter the ratio of carrier gas to vapors delivered and the various vapor blend ratios. Should any condensate actually be delivered through the vapor system to the reaction zone itself a significant imperfection may be formed, particularly so since condensate may carry impurities to the deposition site. In addition, the placement of the bubblers within the temperature controlled chamber has rendered them less accessible for maintenance and blend alterations. It is to these problems which the present invention is directed.
SUMMARY OF THE INVENTION
In one form of the invention a system is provided for generating and delivering vapors to a vapor deposition station. The system comprises a vaporizer adapted to contain a supply of liquid, a heater thermally coupled with the vaporizer and electrically coupled with a heater controller, a temperature controlled chamber located above the vaporizer, and means for heating the space within the temperature controlled chamber. A carrier gas intake conduit extends through the temperature controlled chamber down into the vaporizer through which a carrier gas may be introduced into the vaporizer. A vapor exhaust conduit extends upwardly from the vaporizer and through the temperature controlled chamber through which vapors may be carrier from the vaporizer entrained with the carrier gas to the vapor deposition station. A vapor sensor is positioned within that portion of the vapor exhaust conduit located within the temperature controlled chamber and operatively coupled with the vaporizer heater controller.
In another form of the invention a system is provided for delivering a vapor blend to a vapor deposition site substantially uncontaminated with vapor condensate which system comprises a plurality of bubblers each having means for containing and heating liquids to form vapors. Means are provided for introducing a carrier gas into each of the bubblers. A temperature controlled chamber is located adjacent the bubblers and means provided for heating the space within the temperature controlled chamber. A manifold is mounted within the temperature chamber and means for providing fluid communication between the manifold within the temperature controlled chamber and the vapor deposition site. Conduits extends from each of the bubblers into the temperature controlled chamber where they are coupled with the manifold thereby providing fluid communication between the bubblers and the vapor deposition site.
In yet another form of the invention a method is provided for generating and delivering a vapor blend to a vapor deposition station substantially uncontaminated with vapor condensate. The method comprises the steps of heating liquids of diverse compositions disposed within a plurality of bubblers while bubbling carrier gases through the liquids. Vapors entrained with the carrier gases in vapor streams are conveyed from each of the bubblers upwardly through upright conduits whereby vapor condensate formed within the upright conduits may gravitate down into the bubblers. The vapor streams are merged into a common vapor stream and the common vapor stream conveyed to the vapor deposition station while continuously being heated.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a schematic diagram of a vapor generating and delivering system embodying principles of the invention in one preformed form.
FIG. 2 is a schematic illustration of a sensor employed by the system shown in FIG. 1.
FIG. 3 is another schematic diagram of another sensor employed by the system depicted in FIG. 1.
DETAILED DESCRIPTION
Referring now in more detail to the drawing, there is shown in FIG. 1 a vapor delivery system which comprises a pair of bubblers 10 and 12 having resistance heaters 14 and 16 jacketed about their exterior surfaces. Each bubbler is partially filled with liquids of mutually different composition. The surfaces 18 and 19 of these liquids are maintained at substantially constant heights within the bubblers by relatively large reservoirs R1, R2 under head pressure in fluid communication therewith through conduits 22 and 21.
Above the bubblers is located a temperature controlled chamber 23 which is compartmentalized by a petition 25 into upper and lower zones or spaces. The bubblers themselves may, of course, also be located within some type of chamber provided that the temperature of the space within the bubblers is cooler than that within the other compartments. A carrier gas intake conduit 27 extends from an unshown supply of carrier gas into the upper zone of the temperature controlled chamber where it branches into two branch conduits 28 and 29 at a manifold 30. The branch conduit 28 is seen to extend through a sensors unit 32, a valve V1, then downwardly through the lower zone of the chamber and into the bubbler 10, terminating with an outlet orifice 34 located beneath the surface 18 adjacent the bubbler bottom 35. Similarly, the other branch conduit 29 is also seen to extend through a sensors unit 36, a valve V2, and then down through the lower zone of the chamber and into the bubbler 12, terminating with an outlet orifice 38 located adjacent the bubbler bottom 39.
With continued reference to FIG. 1 the vapor delivery system is further seen to include a vapor exhaust conduit 41 which extends upwardly from the upper portion of bubbler 10 into the temperature controlled chamber 23 passing first through the lower zone and then into the upper zone where it extends through a sensors unit 43 and then down into the lower zone to a vapor stream manifold. Similarly, another vapor exhaust conduit 45 extends upwardly from bubbler 12 into the temperature control chamber 23 also passing first through the lower zone then into the upper zone and through a sensors unit 47 before descending down into the lower zone to the vapor stream manifold. At the manifold the two vapor exhaust conduits merge into a common vapor exhaust conduit 49 which extends out of the lower zone of the chamber and to a vapor reaction zone where the vapor is deposited as in making an optical waveguide preform. In route to the reaction zone from the chamber the conduit is heated by a resistance heating element 50 coiled thereabout.
The sensors units 32 and 36 through which the carrier gas passes include a vapor-to-carrier gas ratio sensor in the form of an exposed, electrically conductive coil 52 as shown in FIG. 2, and a carrier gas flow rate sensor. The flow rate sensor includes a pair of electric resistance heating elements 54 wound in series about a sensor tube 56 which communicates with the carrier gas intake branch conduits 28 and 29 as shown in FIG. 3. Sensors units 43 and 47 similarly have a carrier gas to vapor ratio sensor in the form of an exposed conductive coil positioned within the flow stream of the carrier gas and vapor. These sensors within the units 32, 36, 43 and 47 are electrically connected through unshown control circuitry to a heater controller which controls the bubbler heaters 14 and 16. Exemplary control circuitry is illustrated in U.S. Pat. No. 3,938,384 and in pending patent application Ser. No. 967,806 filed Dec. 8, 1978, which is assigned to the assignee of the present invention. Operation of these sensors is effected by the flow of a gaseous stream over the surface of the conductive elements or through auxiliary sensor conduits about which heater elements are wound. Should vapor condensate be deposited upon the exposes sensor elements or upon the walls of the auxiliary conduits their operation may become severely impaired through the generation of false signals to the control circuitry. Further, contaminants may be dissolved in the liquid condensate and thus be carried off downstream.
In operation, liquid is supplied to the bubblers from the reservoirs and surface levels 18 and 19 established. The heaters 14 and 16 jacketed about the bubblers are then energized causing the liquids contained within the bubblers to be heated and vaporized under individual control. Carrier gas is introduced through the carrier gas conduits into the bubblers beneath the surfaces 18 and 19. During introduction the carrier gas is heated by passing through the temperature control chamber 23 which serves to avoid heat from being drawn by the carrier gas from the liquids. The carrier gas then rises to the surfaces of the liquids within the bubblers during which time vapor is also formed within the rising carrier gas bubbles. The vapors entrained with the carrier gas then exits the bubblers through the exhaust conduits 41 and 45.
As the vapor stream rises through the conduits 41 and 45 some condensate may form on the inside surface of the conduits since it is passing through a spacial environment at a relatively cooler temperature than that within the bubblers. Nevertheless, since the conduits are upwardly oriented condensate so formed will tend to gravitate back into the bubblers rather than enter the sensors units 43 and 47.
The vapor stream then passes into the temperature controlled chamber and into the upper chamber zone or space which is heated by a heater schematically shown at 58 to a temperature somewhat below that of the temperature of the lower zone which is heated by a heater 59. From here the stream passes through the sensor units 43 and 47 substantially free of condensate due both to the orientation of the conduits 41 and 45 beneath the temperature controlled chamber and to the fact that heat is being inputted into the stream within the chamber upper zone. The vapor stream is then directed downwardly into the lower zone, which is maintained at a somewhat higher temperature such as 5° to 10° F. than that of the upper zone, and to the vapor stream manifold. Here the two vapor streams from the two bubblers are combined into a single, common stream while being heated which common stream is directed out of the temperature controlled chamber. During this final passage from the manifold to the exterior of the chamber condensate is again inhibited from forming due to the fact that the lower zone is at a higher temperature than that of the upper zone whereby heat is continued to be conducted into the vapor stream. During its passage from the temperature controlled chamber itself to the reaction zone or deposition site heat is further inputted by the heater element 50 wound about the exterior of that portion of conduit 49 located exteriorly of the chamber.
It thus is now shown that a vapor delivery system and method is provided for generating and delivering vapor to a vapor reaction station substantially free of vapor condensate which could adversely interfere with both the vapor reaction as well as delivery control. The system and method enables bubblers to be maintained, if desired, at ambient room temperature where they may be readily accessable for maintenance. Of course if otherwise desired the bubblers may be maintained within a portion of the temperature controlled chamber itself if the space within the bubblers is maintained cooler than the vapor stream exhausted therefrom or by further chamber compartmentalization. Many other modifications, additions, and deletions may, of course, be made thereto without departure from the spirit and scope of the invention as set forth in the following claims.

Claims (7)

What is claimed is:
1. A system for generating and delivering vapors to a vapor deposition station comprising, in combination, a vaporizer adapted to contain a supply of liquid; a vaporizer heater thermally coupled with said vaporizer and electrically coupled with a heater controller; a temperature controlled chamber located above said vaporizer; means for heating the space within said temperature controlled chamber; a carrier gas intake conduit extending through said temperature controlled chamber and down into said vaporizer through which a carrier gas may be introduced into said vaporizer; a vapor exhaust conduit extending upwardly from said vaporizer and through said temperature controlled chamber through which vapors may be carried from said vaporizer entrained with the carrier gas to the vapor deposition station; and a vapor sensor positioned within that portion of said vapor exhaust conduit located within said temperature controlled chamber and operatively coupled with said vaporizer heater controller.
2. A vapor delivery system in accordance with claim 1 wherein said temperature controlled chamber is compartmentalized into at least two spaces with one space being maintained relatively cool and another space relatively warm by said heater means; and wherein said vapor exhaust conduit passes through said cooler space between said vaporizer and said warmer space.
3. A vapor delivery system in accordance with claim 1 or 2 wherein said vaporizer is located in an ambient spacial environment below said temperature controlled chamber, and wherein said heater means maintains the temperature of the space within said temperature controlled chamber elevated above the temperature of said ambient spacial environment.
4. A system for delivering a vapor blend to a vapor deposition site substantially uncontaminated with vapor condensate which system comprises a plurality of bubblers each having means for containing and heating liquids to form vapors; means for introducing a carrier gas into each of said bubblers; a temperature controlled chamber located adjacent said plurality of bubblers compartmentalized into a plurality of spaces; means for heating the compartmentalized spaces within said temperature controlled chamber and for maintaining said spaces at mutually diverse temperatures; a manifold mounted within the warmer of said two spaces; means for providing fluid communication between said manifold and the vapor deposition site; and a conduit extending from each of said bubblers into said temperature controlled chamber wherein the said conduits are coupled with said manifold thereby providing fluid communication between the bubbler and the vapor deposition site and through the cooler of said two spaces between said bubblers and said manifold to inhibit the formation of condensates.
5. A vapor delivery system in accordance with claim 4 wherein said plurality of bubblers is located in an ambient special environment below said temperature controlled chamber, and wherein said heater means maintains the temperature of the space within said temperature controlled chamber elevated above the temperature of said ambient special environment.
6. A vapor delivery system in accordance with claim 5 wherein said means for introducing a carrier gas into said bubblers includes carrier gas conduits that pass through said temperature controlled chamber having outlet orifices located within each of said bubblers.
7. A vapor delivery system in accordance with claim 4 comprising means for controlling said bubbler heating means that includes a vapor sensor mounted within a portion of said conduits located within said temperature controlled chamber.
US06/009,565 1979-02-05 1979-02-05 Vapor delivery system and method Expired - Lifetime US4220460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/009,565 US4220460A (en) 1979-02-05 1979-02-05 Vapor delivery system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/009,565 US4220460A (en) 1979-02-05 1979-02-05 Vapor delivery system and method

Publications (1)

Publication Number Publication Date
US4220460A true US4220460A (en) 1980-09-02

Family

ID=21738439

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/009,565 Expired - Lifetime US4220460A (en) 1979-02-05 1979-02-05 Vapor delivery system and method

Country Status (1)

Country Link
US (1) US4220460A (en)

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278458A (en) * 1979-02-07 1981-07-14 Bell Telephone Laboratories, Incorporated Optical fiber fabrication method and apparatus
US4314837A (en) * 1979-03-01 1982-02-09 Corning Glass Works Reactant delivery system method
US4356834A (en) * 1979-11-02 1982-11-02 Lemay Dan B Vapor feed regulator
US4393013A (en) * 1970-05-20 1983-07-12 J. C. Schumacher Company Vapor mass flow control system
EP0151200A1 (en) * 1984-02-07 1985-08-14 Sumitomo Electric Industries Limited Raw material supply device
WO1986000153A1 (en) * 1984-06-15 1986-01-03 Oy Nokia Ab A calibration system for the calibration of mass flow controllers
EP0412511A1 (en) * 1989-08-10 1991-02-13 Linde Aktiengesellschaft Process for preparation of fuel gas mixture
US5035200A (en) * 1988-06-03 1991-07-30 Tokyo Electron Limited Processing liquid supply unit
US5451258A (en) * 1994-05-11 1995-09-19 Materials Research Corporation Apparatus and method for improved delivery of vaporized reactant gases to a reaction chamber
US5455014A (en) * 1993-07-20 1995-10-03 Hughes Aircraft Company Liquid deposition source gas delivery system
US5551309A (en) * 1995-01-17 1996-09-03 Olin Corporation Computer-controlled chemical dispensing with alternative operating modes
US5551671A (en) * 1994-07-27 1996-09-03 General Electric Company Hot argon cleaning and protective coating of components made of metal or alloy
US5681613A (en) * 1990-01-08 1997-10-28 Lsi Logic Corporation Filtering technique for CVD chamber process gases
US5971368A (en) * 1997-10-29 1999-10-26 Fsi International, Inc. System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
US6161398A (en) * 1998-04-09 2000-12-19 Lucent Technologies, Inc. Methods of and systems for vapor delivery control in optical preform manufacture
US6235641B1 (en) 1998-10-30 2001-05-22 Fsi International Inc. Method and system to control the concentration of dissolved gas in a liquid
US6274506B1 (en) 1999-05-14 2001-08-14 Fsi International, Inc. Apparatus and method for dispensing processing fluid toward a substrate surface
US6299147B1 (en) * 1998-09-25 2001-10-09 E&E Elektronik Ges M.B.H. Device for generating a defined relative humidity
US6322057B1 (en) * 2000-05-22 2001-11-27 United Microelectronics Corp. Auxiliary gasline-heating unit in chemical vapor deposition
US6349722B1 (en) * 1997-06-17 2002-02-26 Fisher & Paykel Limited Respiratory humidification system
US6406551B1 (en) 1999-05-14 2002-06-18 Fsi International, Inc. Method for treating a substrate with heat sensitive agents
US6546757B1 (en) * 1998-07-28 2003-04-15 Brown University Research Foundation Liquid spray pyrolysis method for the fabrication of optical fiber preforms, with reactant mixing
US20030072875A1 (en) * 2001-10-11 2003-04-17 Sandhu Gurtej S. Delivery of solid chemical precursors
US20030123080A1 (en) * 2001-12-27 2003-07-03 Toshiba Tec Kabushiki Kaisha Image forming device and method for controling the same
KR100402678B1 (en) * 2000-12-29 2003-10-22 주식회사 세미텔 A evaporation vapor deposition system
US6660096B2 (en) * 1998-01-07 2003-12-09 Tokyo Electron Limited Gas treatment apparatus
US20040041286A1 (en) * 2002-08-30 2004-03-04 Jai-Dong Lee Method and apparatus for supplying a source gas
US20040221844A1 (en) * 1997-06-17 2004-11-11 Hunt Peter John Humidity controller
US20050000425A1 (en) * 2003-07-03 2005-01-06 Aeromet Technologies, Inc. Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings
DE102008045672A1 (en) * 2008-03-07 2009-09-24 Falk Steuerungssysteme Gmbh Humidifier for humidifying air to climatize coating process, has condensator receiving steam together with subflow of gas, where steam is mixed with subflow such that temperature of evaporator is higher than temperature of condensator
US20100093174A1 (en) * 2008-10-15 2010-04-15 Jae-Young Yang Method of manufacturing low-k dielectric film, and formation of air-gap using the low-k dielectric film
US20110070360A1 (en) * 2009-09-22 2011-03-24 Samsung Mobile Display Co., Ltd. Source gas supply unit, and deposition apparatus and method using the same
US20140305168A1 (en) * 2011-09-29 2014-10-16 Sumitomo Electric Industries, Ltd. Method for manufacturing glass-fine-particle-deposited body and method for manufacturing glass base material
US8973407B2 (en) 2011-11-25 2015-03-10 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
US8984911B2 (en) 2011-11-25 2015-03-24 Heraeus Quarzglas Gmbh & Co. Kg Atomizing method for producing synthetic quartz glass
US8997528B2 (en) 2011-11-25 2015-04-07 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
JP2015514005A (en) * 2012-03-28 2015-05-18 ラシリック, インコーポレイテッドRASIRC, Inc. Method for delivering process gases from multi-component solutions
US9061935B2 (en) 2011-11-25 2015-06-23 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
US10130787B2 (en) 1997-06-17 2018-11-20 Fisher & Paykel Healthcare Limited Humidity controller
WO2020025561A1 (en) 2018-08-02 2020-02-06 Leoni Kabel Gmbh Method and apparatus for reproducibly producing a preform for glass fiber manufacture

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3771260A (en) * 1970-01-29 1973-11-13 Black Sivalls & Bryson Inc Method of vaporizing and combining a liquefied cryogenic fluid stream with a gas stream
US3826560A (en) * 1972-03-30 1974-07-30 Corning Glass Works Method of forming a light focusing fiber waveguide
US3859073A (en) * 1973-10-19 1975-01-07 Corning Glass Works Method of producing glass by flame hydrolysis
US3938384A (en) * 1972-10-13 1976-02-17 Tylan Corporation Mass flow meter with reduced attitude sensitivity
US3939858A (en) * 1974-09-13 1976-02-24 Tylan Corporation Assembly and method of obtaining a controlled gas mixture
US4111219A (en) * 1977-05-11 1978-09-05 Tmc, Inc. Industrial fuel blender and fuel blending method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3771260A (en) * 1970-01-29 1973-11-13 Black Sivalls & Bryson Inc Method of vaporizing and combining a liquefied cryogenic fluid stream with a gas stream
US3826560A (en) * 1972-03-30 1974-07-30 Corning Glass Works Method of forming a light focusing fiber waveguide
US3938384A (en) * 1972-10-13 1976-02-17 Tylan Corporation Mass flow meter with reduced attitude sensitivity
US3859073A (en) * 1973-10-19 1975-01-07 Corning Glass Works Method of producing glass by flame hydrolysis
US3939858A (en) * 1974-09-13 1976-02-24 Tylan Corporation Assembly and method of obtaining a controlled gas mixture
US4111219A (en) * 1977-05-11 1978-09-05 Tmc, Inc. Industrial fuel blender and fuel blending method

Cited By (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4393013A (en) * 1970-05-20 1983-07-12 J. C. Schumacher Company Vapor mass flow control system
US4278458A (en) * 1979-02-07 1981-07-14 Bell Telephone Laboratories, Incorporated Optical fiber fabrication method and apparatus
US4314837A (en) * 1979-03-01 1982-02-09 Corning Glass Works Reactant delivery system method
US4356834A (en) * 1979-11-02 1982-11-02 Lemay Dan B Vapor feed regulator
EP0151200A1 (en) * 1984-02-07 1985-08-14 Sumitomo Electric Industries Limited Raw material supply device
WO1986000153A1 (en) * 1984-06-15 1986-01-03 Oy Nokia Ab A calibration system for the calibration of mass flow controllers
US5035200A (en) * 1988-06-03 1991-07-30 Tokyo Electron Limited Processing liquid supply unit
EP0412511A1 (en) * 1989-08-10 1991-02-13 Linde Aktiengesellschaft Process for preparation of fuel gas mixture
US5681613A (en) * 1990-01-08 1997-10-28 Lsi Logic Corporation Filtering technique for CVD chamber process gases
US6113699A (en) * 1990-01-08 2000-09-05 Lsi Logic Corporation Purging gas control structure for CVD chamber
US5914001A (en) * 1990-01-08 1999-06-22 Lsi Logic Corporation In-situ etch of CVD chamber
US5853804A (en) * 1990-01-08 1998-12-29 Lsi Logic Corporation Gas control technique for limiting surging of gas into a CVD chamber
US5455014A (en) * 1993-07-20 1995-10-03 Hughes Aircraft Company Liquid deposition source gas delivery system
US5451258A (en) * 1994-05-11 1995-09-19 Materials Research Corporation Apparatus and method for improved delivery of vaporized reactant gases to a reaction chamber
WO1995031583A1 (en) * 1994-05-11 1995-11-23 Materials Research Corporation Apparatus and method for delivery of reactant gases
US5551671A (en) * 1994-07-27 1996-09-03 General Electric Company Hot argon cleaning and protective coating of components made of metal or alloy
US5551309A (en) * 1995-01-17 1996-09-03 Olin Corporation Computer-controlled chemical dispensing with alternative operating modes
US7962018B2 (en) 1997-06-17 2011-06-14 Fisher & Paykel Healthcare Limited Humidity controller
US9186477B2 (en) 1997-06-17 2015-11-17 Fisher & Paykel Healthcare Limited Humidity controller
US7263994B2 (en) 1997-06-17 2007-09-04 Fisher & Paykel Healthcare Limited Respiratory humidification system
US20040221844A1 (en) * 1997-06-17 2004-11-11 Hunt Peter John Humidity controller
US6802314B2 (en) 1997-06-17 2004-10-12 Fisher & Paykel Limited Respiratory humidification system
US20090065002A1 (en) * 1997-06-17 2009-03-12 Peter John Hunt Humidity controller
US6349722B1 (en) * 1997-06-17 2002-02-26 Fisher & Paykel Limited Respiratory humidification system
US6694974B1 (en) 1997-06-17 2004-02-24 Fisher & Paykel Limited Respiratory humidification system
US20040079370A1 (en) * 1997-06-17 2004-04-29 Fisher & Paykel Limited Respiratory humidification system
US7051733B2 (en) 1997-06-17 2006-05-30 Fisher & Paykel Healthcare Limited Respiratory humidification system
US20040060558A1 (en) * 1997-06-17 2004-04-01 Fisher & Paykel Limited Respiratory humidification system
US10130787B2 (en) 1997-06-17 2018-11-20 Fisher & Paykel Healthcare Limited Humidity controller
US6584972B2 (en) 1997-06-17 2003-07-01 Fisher & Paykel Limited Respiratory humidification system
USRE39724E1 (en) 1997-06-17 2007-07-17 Fisher & Paykel Healthcare Limited Respiratory humidification system
USRE40806E1 (en) 1997-06-17 2009-06-30 Fisher & Paykel Healthcare Limited Respiratory humidification system
US6648307B2 (en) 1997-10-29 2003-11-18 Fsi International, Inc. Method to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
US6488271B1 (en) * 1997-10-29 2002-12-03 Fsi International, Inc. Method to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
US5971368A (en) * 1997-10-29 1999-10-26 Fsi International, Inc. System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
US6660096B2 (en) * 1998-01-07 2003-12-09 Tokyo Electron Limited Gas treatment apparatus
US6161398A (en) * 1998-04-09 2000-12-19 Lucent Technologies, Inc. Methods of and systems for vapor delivery control in optical preform manufacture
US6546757B1 (en) * 1998-07-28 2003-04-15 Brown University Research Foundation Liquid spray pyrolysis method for the fabrication of optical fiber preforms, with reactant mixing
US6299147B1 (en) * 1998-09-25 2001-10-09 E&E Elektronik Ges M.B.H. Device for generating a defined relative humidity
US6235641B1 (en) 1998-10-30 2001-05-22 Fsi International Inc. Method and system to control the concentration of dissolved gas in a liquid
US6406551B1 (en) 1999-05-14 2002-06-18 Fsi International, Inc. Method for treating a substrate with heat sensitive agents
US6274506B1 (en) 1999-05-14 2001-08-14 Fsi International, Inc. Apparatus and method for dispensing processing fluid toward a substrate surface
US6352244B2 (en) * 2000-05-22 2002-03-05 United Microelectronics, Corp. Auxiliary gasline-heating unit in chemical vapor deposition
US6322057B1 (en) * 2000-05-22 2001-11-27 United Microelectronics Corp. Auxiliary gasline-heating unit in chemical vapor deposition
KR100402678B1 (en) * 2000-12-29 2003-10-22 주식회사 세미텔 A evaporation vapor deposition system
US20040165870A1 (en) * 2001-10-11 2004-08-26 Sandhu Gurtej S. Delivery of solid chemical precursors
US6701066B2 (en) * 2001-10-11 2004-03-02 Micron Technology, Inc. Delivery of solid chemical precursors
US7050708B2 (en) 2001-10-11 2006-05-23 Micron Technology, Inc. Delivery of solid chemical precursors
US20050115505A1 (en) * 2001-10-11 2005-06-02 Sandhu Gurtej S. Delivery of solid chemical precursors
US20060151461A1 (en) * 2001-10-11 2006-07-13 Sandhu Gurtej S Delivery of solid chemical precursors
US20030072875A1 (en) * 2001-10-11 2003-04-17 Sandhu Gurtej S. Delivery of solid chemical precursors
US6839505B2 (en) 2001-10-11 2005-01-04 Micron Technology, Inc. Delivery of solid chemical precursors
US20080164244A9 (en) * 2001-10-11 2008-07-10 Sandhu Gurtej S Delivery of solid chemical precursors
US7428373B2 (en) 2001-10-11 2008-09-23 Micron Technology, Inc. Delivery of solid chemical precursors
US20040170402A1 (en) * 2001-10-11 2004-09-02 Sandhu Gurtej S. Delivery of solid chemical precursors
US20030123080A1 (en) * 2001-12-27 2003-07-03 Toshiba Tec Kabushiki Kaisha Image forming device and method for controling the same
US20040041286A1 (en) * 2002-08-30 2004-03-04 Jai-Dong Lee Method and apparatus for supplying a source gas
US7007933B2 (en) * 2002-08-30 2006-03-07 Samsung Electronics Co., Ltd. Method and apparatus for supplying a source gas
US8839740B2 (en) 2003-07-03 2014-09-23 Mt Coatings, Llc Simple chemical vapor deposition systems for depositing multiple-metal aluminide coatings
US20050000425A1 (en) * 2003-07-03 2005-01-06 Aeromet Technologies, Inc. Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings
US7390535B2 (en) 2003-07-03 2008-06-24 Aeromet Technologies, Inc. Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings
DE102008045672A1 (en) * 2008-03-07 2009-09-24 Falk Steuerungssysteme Gmbh Humidifier for humidifying air to climatize coating process, has condensator receiving steam together with subflow of gas, where steam is mixed with subflow such that temperature of evaporator is higher than temperature of condensator
DE102008045672B4 (en) * 2008-03-07 2021-06-24 Falk Steuerungssysteme Gmbh Humidification device for gases with integrated dew point calibration
US20100093174A1 (en) * 2008-10-15 2010-04-15 Jae-Young Yang Method of manufacturing low-k dielectric film, and formation of air-gap using the low-k dielectric film
US8343281B2 (en) * 2009-09-22 2013-01-01 Samsung Display Co., Ltd. Source gas supply unit, and deposition apparatus and method using the same
US20110070360A1 (en) * 2009-09-22 2011-03-24 Samsung Mobile Display Co., Ltd. Source gas supply unit, and deposition apparatus and method using the same
US9630872B2 (en) * 2011-09-29 2017-04-25 Sumitomo Electric Industries, Ltd. Method for manufacturing glass-fine-particle-deposited body and method for manufacturing glass base material
US20140305168A1 (en) * 2011-09-29 2014-10-16 Sumitomo Electric Industries, Ltd. Method for manufacturing glass-fine-particle-deposited body and method for manufacturing glass base material
US10604439B2 (en) * 2011-09-29 2020-03-31 Sumitomo Electric Industries, Ltd. Method for manufacturing glass-fine-particle-deposited body and method for manufacturing glass base material
US20170225998A1 (en) * 2011-09-29 2017-08-10 Sumitomo Electric Industries, Ltd. Method for manufacturing glass-fine-particle-deposited body and method for manufacturing glass base material
US8973407B2 (en) 2011-11-25 2015-03-10 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
US9061935B2 (en) 2011-11-25 2015-06-23 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
US8997528B2 (en) 2011-11-25 2015-04-07 Heraeus Quarzglas Gmbh & Co. Kg Method for producing synthetic quartz glass
US8984911B2 (en) 2011-11-25 2015-03-24 Heraeus Quarzglas Gmbh & Co. Kg Atomizing method for producing synthetic quartz glass
JP2015514005A (en) * 2012-03-28 2015-05-18 ラシリック, インコーポレイテッドRASIRC, Inc. Method for delivering process gases from multi-component solutions
WO2020025561A1 (en) 2018-08-02 2020-02-06 Leoni Kabel Gmbh Method and apparatus for reproducibly producing a preform for glass fiber manufacture
DE102018118771A1 (en) * 2018-08-02 2020-02-06 Leoni Kabel Gmbh Method and device for reproducibly producing a preform for glass fiber production
US20210309558A1 (en) * 2018-08-02 2021-10-07 Leoni Kabel Gmbh Method and apparatus for reproducibly producing a preform for glass fiber manufacture
DE102018118771B4 (en) 2018-08-02 2022-07-07 Leoni Kabel Gmbh Process and device for the reproducible production of a preform for glass fiber production
US11702358B2 (en) * 2018-08-02 2023-07-18 J-Fiber Gmbh Method and apparatus for reproducibly producing a preform for glass fiber manufacture

Similar Documents

Publication Publication Date Title
US4220460A (en) Vapor delivery system and method
CA1256330A (en) Methods of and apparatus for vapor delivery control in optical preform manufacture
US4235829A (en) Vapor delivery system and method of maintaining a constant level of liquid therein
US4314837A (en) Reactant delivery system method
CA1152183A (en) Vapor delivery control system and method
US6161398A (en) Methods of and systems for vapor delivery control in optical preform manufacture
US5558687A (en) Vertical, packed-bed, film evaporator for halide-free, silicon-containing compounds
US5078092A (en) Flash vaporizer system for use in manufacturing optical waveguide fiber
EP0719575B1 (en) Method for vaporizing halide-free, silicon-containing compounds
US10167543B2 (en) Method for manufacturing optical fiber preform
US7730747B2 (en) Method for vaporizing a liquid reactant in manufacturing a glass preform
EP0200215B1 (en) Raw material supplying device and process for using this device
CA2128188A1 (en) Gas producing apparatus and method and apparatus for manufacturing optical waveguide and optical fiber preform
EP0908418B1 (en) Manufacturing method of synthetic silica glass
JPS6135139B2 (en)
EP1283819A1 (en) Method of making a titania-doped fused silica preform
JPH0834623A (en) Production of silica glass
CN1951849B (en) Apparatus for fabricating soot preform
JPS604977Y2 (en) Raw material supply equipment for manufacturing optical fiber base material
JPH033619B2 (en)
JPS61151032A (en) Apparatus for feeding raw material gas for production of optical fiber preform
KR20040095428A (en) Feeding device of porous glass preform material gas
JP2000211928A (en) Device for producing silica glass

Legal Events

Date Code Title Description
AS Assignment

Owner name: AT & T TECHNOLOGIES, INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868

Effective date: 19831229