US4958092A - Integrated circuit device having row structure with clock driver at end of each row - Google Patents

Integrated circuit device having row structure with clock driver at end of each row Download PDF

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US4958092A
US4958092A US07/329,908 US32990889A US4958092A US 4958092 A US4958092 A US 4958092A US 32990889 A US32990889 A US 32990889A US 4958092 A US4958092 A US 4958092A
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power supply
primary
wiring
ground
row
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US07/329,908
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Shigeru Tanaka
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Toshiba Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA, 72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, JAPAN, A CORP. OF JAPAN reassignment KABUSHIKI KAISHA TOSHIBA, 72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, JAPAN, A CORP. OF JAPAN ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: TANAKA, SHIGERU
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
    • G06F1/10—Distribution of clock signals, e.g. skew
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • FIG. 2 is a block diagram of a conventional logic LSI employing a macro block structure.
  • a plurality of rows are arranged in one block to be parallel to each other, and a plurality of blocks including these rows are arranged in a LSI 3 together with a RAM 31, a ROM 33, and so on.
  • input/output blocks 5 are arranged at four sides of the LSI 3.
  • a second secondary power supply wiring (15b) for connecting the primary power supply wiring to the power supply terminal of the second secondary clock driver in the second row, and to the power supply terminals of the second group of logic elements;
  • a primary clock driver 23 is connected to a clock signal input terminal 21 serving as a part of one of input/output blocks 5 which are the same as those in FIGS. 1 and 2, through a primary clock signal wiring 24.
  • the primary clock driver 23 has an inverter (not shown) and outputs an output signal in response to a clock input signal.
  • a plurality of rows 1a, 1b, and 1c respectively include a plurality of logic elements 19 such as flip-flops, registers, latches, and so on, and are arranged parallel.
  • the plurality of rows respectively include secondary clock drivers 27a, 27b, and 27c, each having a smaller driving capability than that of the primary clock driver 23 including the inverter.
  • the primary power supply wiring 9 and the primary ground wiring 13 are also connected to the power supply terminal and the ground terminal of the primary clock driver 23, the power supply terminals and the ground terminals of the plurality of secondary clock drivers 27a, 27b, and 27c, and the power supply terminals and the ground terminals of the plurality of logic elements 19, through secondary power supply wirings 15a, 15b, and 15c, and secondary ground wirings 17a, 17b, and 17c, respectively. Note that if either the primary power supply wiring 9 or the primary ground wiring 13 is arranged adjacent to the rows 1a, 1b, and 1c, the same effect can be obtained.
  • the present invention is not limited thereto.
  • the above-mentioned secondary clock drivers 27 are not required for all the plurality of rows 1, and the secondary clock drivers 27 can be arranged every several rows.

Abstract

In an integrated circuit device such as a logic LSI having a row structure, each row includes a group of logic elements and a clock driver. The clock driver in each row is arranged at one end of the row so as to shorten the distances from the clock driver to a primary power supply wiring and a primary ground wiring.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an integrated circuit device such as a logic LSI using a clock signal and, more particularly, to an improvement of an integrated circuit device having a row structure.
2. Description of the Related Art
FIG. 1 is a block diagram of a conventional integrated circuit device such as a logic LSI, in which a plurality of rows are arranged parallel to each other, i.e., a so-called row structure logic LSI. More specifically, rows 1 in an LSI 3 respectively include a plurality of logic elements such as flip-flops, registers, and latches, and input/output blocks 5 are arranged at four sides of the LSI 3.
FIG. 2 is a block diagram of a conventional logic LSI employing a macro block structure. In FIG. 2, a plurality of rows are arranged in one block to be parallel to each other, and a plurality of blocks including these rows are arranged in a LSI 3 together with a RAM 31, a ROM 33, and so on. In this chip, input/output blocks 5 are arranged at four sides of the LSI 3.
The internal arrangement and the connection relationship of the plurality of rows are shown in detail in FIG. 3. Referring to FIG. 3, the rows 1 are arranged to be parallel to each other. Each row is connected to a primary power supply wiring 9 and a primary ground wiring 13 through a secondary power supply wiring 15 and a secondary ground wiring 17, respectively. The primary power supply wiring 9 is connected to a power supply through a power supply terminal 7 serving as a part of the input/output block 5. The primary ground wiring 13 is grounded through a ground terminal 11 serving as a part of the input/output block 5 to hold a reference potential. A plurality of logic elements 19 in the plurality of rows 1 are driven by a clock signal. When a hierarchical clock driving system is applied, the input terminal of a primary clock driver 23 is connected to a clock signal input terminal 21 serving as a part of the input/output block 5 through a clock signal input wiring 24. The output terminal of the primary clock driver 23 is connected to the input terminals of a plurality of secondary clock drivers 27 through a clock signal input wiring 25. Note that the driving capability of the plurality of secondary clock drivers 27 is generally smaller than that of the primary clock driver 23. The power supply and ground terminals of the primary clock driver 23 are connected to the primary power supply wiring 9 and the primary ground wiring 13 through the secondary power supply wiring 15 and the secondary ground wiring 17, respectively. In addition, the output terminals of the plurality of secondary clock drivers 27 are connected to the plurality of logic elements 19 through clock signal output wirings 29, respectively.
As described above, in the conventional LSI, since the distances from each secondary clock driver 27 to the primary power supply wiring 9 and to the primary ground wiring 13 are large, noise is often generated on the secondary power supply wirings 15 and the secondary ground wirings 17, upon operation of the secondary clock drivers 27.
SUMMARY OF THE INVENTION
An integrated circuit device of the present invention has been made in order to solve the above problems and the present invention has as its object to provide an integrated circuit device for reducing noise in an LSI having a row structure using a clock signal.
In order to achieve the above object, an integrated circuit of the present invention comprises:
a primary power supply wiring (9) connected to a power supply;
a primary ground wiring (13) connected to a ground terminal, for holding a reference potential;
primary clock driver means (23) for receiving a clock signal from a clock signal input terminal;
a first clock signal input wiring (24) for connecting the clock signal input terminal to the primary clock driver means;
a first row including a first secondary clock driver (27a) arranged at one end of the first row to be adjacent to the primary power supply wiring and the primary ground wiring, the first secondary clock driver having a clock signal input terminal connected to the primary clock driver means, a power supply terminal connected to the primary power supply wiring, and a ground terminal connected to the primary ground wiring, and a first group of a plurality of logic elements (19), which switch synchronously with the input clock signal, each having a power supply terminal and a ground terminal respectively connected to the primary power supply wiring and the primary ground wiring;
a first secondary power supply wiring (15a) for connecting the primary power supply wiring to the power supply terminal of the first secondary clock driver in the first row, and to the power supply terminals of the first group of logic elements;
first secondary ground wiring (17a) for connecting the primary ground wiring to the ground terminal of the first secondary clock driver in the first row, and to the ground terminals of the logic elements;
a second row arranged parallel to the first row, the second row including a second secondary clock driver (27b) arranged at one end of the second row to be adjacent to the primary power supply wiring and the primary ground wiring, the second secondary clock driver (27b) having a clock signal input terminal connected to the primary clock driver means, a power supply terminal connected to the primary power supply wiring, and a ground terminal connected to the primary ground wiring, and a second group of a plurality of logic elements (19), which switch synchronously with the input clock signal, each having a power supply terminal and a ground terminal respectively connected to the primary power supply wiring and the primary ground wiring;
a second secondary power supply wiring (15b) for connecting the primary power supply wiring to the power supply terminal of the second secondary clock driver in the second row, and to the power supply terminals of the second group of logic elements;
a second secondary ground wiring (17b) for connecting the primary ground wiring to the ground terminal of the second secondary clock driver in the second row and to the ground terminals of the logic elements;
a second clock signal input wiring (25) arranged along the direction perpendicular to the longitudinal direction of the first and second rows, for connecting the input terminals of the first and second secondary clock drivers (27a and 27b) to an output terminal of the first clock driver means;
a first clock signal wiring (29a) for connecting the output of first secondary clock driver means in the first row to the first group of logic elements; and
a second clock signal wiring (29b) for connecting the output of second secondary clock driver means in the second row to the second group of logic elements.
With the above arrangement, the integrated circuit device according to the present invention can shorten the distances from the primary supply wiring and the primary ground wiring to secondary clock driver means by arranging each secondary clock driver means at one end of the corresponding parallel row. Therefore, noise generated on the secondary power supply wiring and the secondary ground wiring can be reduced.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block diagram showing a conventional logic LSI employing a row structure, in which a plurality of rows are arranged parallel to each other;
FIG. 2 is a block diagram showing a conventional logic LSI employing a macro block structure, in which a plurality of rows are arranged parallel to each other in one block, and a plurality of blocks including the rows are arranged in the LSI;
FIG. 3 is a block diagram showing the internal arrangement and the connection relationship of the plurality of rows in FIGS. 1 and 2;
FIG. 4 is a block diagram showing an arrangement of an integrated circuit device according to an embodiment of the present invention;
FIG. 5 is a block diagram showing an arrangement of the integrated circuit device according to another embodiment of the present invention; and
FIG. 6 is a block diagram showing an arrangement of the integrated circuit device according to still another embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of an integrated circuit device according to the present invention will be described hereinafter with reference to FIGS. 4 to 6.
First, an arrangement according to an embodiment of the present invention in FIG. 4 will be described below. A primary clock driver 23 is connected to a clock signal input terminal 21 serving as a part of one of input/output blocks 5 which are the same as those in FIGS. 1 and 2, through a primary clock signal wiring 24. The primary clock driver 23 has an inverter (not shown) and outputs an output signal in response to a clock input signal. A plurality of rows 1a, 1b, and 1c respectively include a plurality of logic elements 19 such as flip-flops, registers, latches, and so on, and are arranged parallel. The plurality of rows respectively include secondary clock drivers 27a, 27b, and 27c, each having a smaller driving capability than that of the primary clock driver 23 including the inverter. The secondary clock drivers 27a, 27b, and 27c are respectively positioned on end portions of the plurality of rows 1a, 1b, and 1c to be adjacent to a primary power supply wiring 9 and a primary ground wiring 13. The primary power supply wiring 9 and the primary ground wiring 13 are arranged adjacent to the end portions of the rows 1a, 1b, and 1c, along the direction perpendicular to the longitudinal direction of the plurality of rows 1. The clock signal input wiring 25 is arranged in the direction perpendicular to the longitudinal direction of the rows 1a, 1b, and 1c. In addition, the input terminals of the secondary clock drivers 27a, 27b, and 27c are connected to the output terminal of the primary clock driver 23 through the clock signal input wiring 25. The output terminals of the plurality of secondary clock drivers 27a, 27b, and 27c are connected to the plurality of logic elements 19 in the plurality of rows 1a, 1b, and 1c, through clock signal wirings 29a, 29b, and 29c, respectively. The primary power supply wiring 9 and the primary ground wiring 13 are connected to a power supply terminal 7 and a ground terminal 11 serving as parts of the input/output blocks 5, respectively. The primary power supply wiring 9 and the primary ground wiring 13 are also connected to the power supply terminal and the ground terminal of the primary clock driver 23, the power supply terminals and the ground terminals of the plurality of secondary clock drivers 27a, 27b, and 27c, and the power supply terminals and the ground terminals of the plurality of logic elements 19, through secondary power supply wirings 15a, 15b, and 15c, and secondary ground wirings 17a, 17b, and 17c, respectively. Note that if either the primary power supply wiring 9 or the primary ground wiring 13 is arranged adjacent to the rows 1a, 1b, and 1c, the same effect can be obtained.
The effect of the above embodiment will be described hereinafter. In the above embodiment, the distances from the primary power supply wiring 9 and the primary ground wiring 13 to the plurality of secondary clock drivers 27a, 27b, and 27c are shortened, and the resistance, the capacitance, and the impedance of wiring are decreased. Therefore, clock signal switching noise, which causes an operation error of the plurality of logic elements 19 can be suppressed. More specifically, in the leading and trailing edges of the clock signal, due to a switching operation of all the secondary clock drivers 27a, 27b, and 27c, although a large amount of current flows through the secondary power supply wirings 15a, 15b, and 15c, and the secondary ground wirings 17a, 17b, and 17c, the generated noise can be effectively reduced.
The clock signal input wiring 25 is arranged along the direction perpendicular to the longitudinal direction of the plurality of rows 1a, 1b, and 1c to connect the primary clock driver 23 to the plurality of secondary clock drivers 27a, 27b, and 27c, so that the area of the clock signal input wiring 25 in spaces between the plurality of rows 1a, 1b, and 1c is decreased. Therefore, the integration of the LSI is improved, and hence the resistance and capacitance of the clock signal input wiring 25 are decreased. As a result, a skew which is an RC delay caused by the resistance and the capacitance can be effectively reduced as compared to the conventional arrangement.
An arrangement according to a second embodiment shown in FIG. 5 will be described below. In the second embodiment, a plurality of secondary clock drivers 27a, 27b, and 27c are respectively positioned at corresponding ends of a plurality of rows 1a, 1b, and 1c in their longitudinal direction. A primary power supply wiring 9 and a primary ground wiring 13 are arranged on the plurality of secondary clock drivers 27a, 27b, and 27c. In addition, a clock signal input wiring 25 is interposed between the primary power supply wiring 9 and the primary ground wiring 13, and sources (not shown) of the secondary clock drivers 27a, 27b, and 27c are connected to the primary power supply wiring 9 and the primary ground wiring 13. Other arrangements are the same as those in the first embodiment.
The effect of the second embodiment will be described below. In the second embodiment, the same effect as in the first embodiment can be obtained In addition, the distances from the primary power supply wiring 9 and the primary ground wiring 13 to the plurality of secondary clock drivers 27a, 27b, and 27c are further shortened as compared with the first embodiment. Clock signal switching noise which causes an operation error of the plurality of logic elements 19 can be further suppressed as compared to the first embodiment. More specifically, in the leading and trailing edges of the clock signal, due perform a switching operation of all the secondary clock drivers 27a, 27b, and 27c, although a large amount of current flows through the secondary power supply wirings 15a, 15b, and 15c, and the secondary ground wirings 17a, 17b, and 17c, the generated noise can be further effectively reduced as compared with the first embodiment.
An arrangement according to a third embodiment shown in FIG. 6 will be described below. In the third embodiment, pairs of secondary clock drivers 27a1 and 27a2, 27b1 and 27b2, and 27c1 and 27c2 are respectively arranged on both ends of a plurality of rows 1a, 1b, and 1c in their longitudinal direction. In addition, in the same manner as in the second embodiment, primary power supply wirings 9X and 9Y, primary ground wirings 13X and 13Y, and clock signal input wirings 25X and 25Y are linearly arranged on both the ends of the plurality of rows 1a, 1b, and 1c, and on the secondary clock drivers 27a1 and 27a2, 27b1 and 27b2, and 27c1 and 27c2, respectively, in a direction perpendicular to the longitudinal direction in the same manner as in the second embodiment. Furthermore, a plurality of logic elements 19 are connected to the primary power supply wirings 9X and 9Y, and the primary ground wirings 13X and 13Y, through the secondary power supply wirings 15a 15b, and 15c, and the secondary ground wirings 17a, 17b, and 17c in each row, respectively.
The effect of the third embodiment will be described hereinafter. In the third embodiment, in addition to the effect of the second embodiment, the number of secondary clock drivers 27a1 and 27a2, 27b1 and 27b2, and 27c1 and 27c2 respectively included in the plurality of rows 1a, 1b, and 1c can be set to be optimal number for reducing the skews of the clock signal wirings 29a1 and 29a2, depending on the number of gates in the plurality of rows 1a, 1b, and 1c, on the load, and so on. More specifically, in the third embodiment, the pairs of secondary clock drivers 27a1 and 27a2, 27b1 and 27b2, and 27c1 and 27c2 are respectively arranged in the plurality of rows 1a, 1b, and 1c. However, the number of secondary clock drivers 27 included in the plurality of rows 1a, 1b, and 1c is not limited to two, and the optimal number can be determined to reduce the skew of the clock signal wirings 29a1 and 29a2 depending on the amount of the load. Thus, the distances from the output terminals of the secondary clock drivers 27 to the plurality of logic elements 19 are shortened, so that the capacitance and resistance of each clock signal output wiring 29 can be decreased, thereby reducing the skew.
Although the above three embodiments have been described, the present invention is not limited thereto. For example, the above-mentioned secondary clock drivers 27 are not required for all the plurality of rows 1, and the secondary clock drivers 27 can be arranged every several rows.
The above-mentioned secondary clock drivers 27 can be arranged by automatic design, and can be manually arranged by a small number of steps.
In the above-described three embodiments, the distances from the primary power supply wiring 9 and the primary ground wiring 13 to the power supply and ground terminals of the secondary clock drivers 27 in the plurality of rows 1 are further shortened as compared with the conventional arrangement, so that noise generated on the secondary power supply wiring 17 and the secondary ground wiring 15 can be effectively suppressed.

Claims (4)

What is claimed is:
1. An integrated circuit device comprising:
a primary power supply wiring connected to a power supply;
a primary ground wiring connected to a ground terminal, for holding a reference potential;
primary clock driver means, for receiving a clock signal from a clock signal input terminal;
a first clock signal input wiring for connecting said clock signal input terminal to said primary clock driver means;
a first row including a first secondary clock driver arranged at one end of said first row to be adjacent to a primary power supply wiring and a primary ground wiring, said first secondary clock driver having a clock signal input terminal connected to said primary clock driver means, a power supply terminal connected to said primary power supply wiring, and a ground terminal connected to said primary ground wiring, and a first group of a plurality of logic elements, which switch synchronously with the input clock signal, each having a power supply terminal and a ground terminal respectively connected to said primary power supply wiring and said primary ground wiring;
a first secondary power supply wiring for connecting said primary power supply wiring to said power supply terminal of said first secondary clock driver in said first row, and to said power supply terminals of said first group of logic elements;
a first secondary ground wiring for connecting said primary ground wiring to said ground terminal of said first secondary clock driver in said first row, and to said ground terminals of said logic elements;
a second row arranged parallel to a longitudinal direction of said first row, said second row including a second secondary clock driver arranged at one end of said second row to be adjacent to said primary power supply wiring and said primary ground wiring, said second secondary clock driver having a clock signal input terminal connected to said primary clock driver means, a power supply terminal connected to said primary power supply wiring, and a ground terminal connected to said primary ground wiring, and a second group of a plurality logic elements, which switch synchronously with the input clock signal, each having a power supply terminal and a ground terminal respectively connected to said primary power supply wiring and said primary ground wiring;
a second secondary power supply wiring for connecting said primary power supply wiring to said power supply terminal of said second secondary clock driver in said second row, and to said power supply terminals of said second group of logic elements;
a second secondary ground wiring for connecting said primary ground wiring to said ground terminal of said second secondary clock driver in said second row and to said ground terminals of said logic elements;
a second clock signal input wiring for connecting the input terminals of said first and second secondary clock drivers and to an output terminal of said primary clock driver means;
a first clock signal wiring for connecting said first secondary clock driver means in said first row to said logic elements; and
a second clock signal wiring for connecting said second secondary clock driver means in said second row to said logic elements.
2. A device according to claim 1, wherein said primary power supply wiring, said primary ground wiring, and said second clock signal input wiring are arranged in a direction perpendicular to the longitudinal direction of said first and second rows, and arranged on said first and second secondary clock drivers corresponding to said first and second rows.
3. A device according to claim 1, comprising:
first and second primary power supply wirings commonly connected to said power supply, and divided to be arranged as two lines;
first and second primary ground wirings commonly connected to said ground terminal, and divided to be arranged as two lines, for holding a reference potential;
primary clock driver means, for receiving the clock signal from said clock signal input terminal;
a first clock signal input wiring for connecting said clock signal input terminal to said primary clock driver means;
a first row including first and second secondary clock drivers, said drivers respectively having clock signal input terminals connected to said primary clock driver means, power supply terminals respectively connected to said first and second primary power supply wirings, and ground terminals respectively connected to said first and second primary ground wirings, a first group of a plurality of logic elements, which switch synchronously with the input clock signal, each having power supply terminals and ground terminals respectively connected to said first and second primary power supply wirings and said first and second primary ground wirings;
a first secondary power supply wiring for respectively connecting said first and second primary power supply wirings to said power supply terminals of said first and second secondary clock drivers in said first row, and to said power supply terminals of said first group of logic elements;
a first secondary ground wiring for respectively connecting said first and second primary ground wirings to said ground terminals of said first and second secondary clock drivers in said first row, and to said ground terminals of said first group of logic elements;
a second row arranged parallel to the longitudinal direction of said first row, said second row including first and second secondary clock drivers, said drivers respectively having clock signal input terminals connected to said primary clock driver means, power supply terminals connected to said first and second primary power supply wirings, and ground terminals connected to said first and second primary ground wirings, and a second group of a plurality of logic elements, which switch synchronously with the input clock signal, each having power supply terminals and ground terminals respectively connected to said first and second primary power supply wirings and said first and second primary ground wirings;
a second secondary power supply wiring for connecting said first and second primary power supply wirings to said power supply terminals of said first and second secondary clock drivers in said second row and to said power supply terminals of said second group of logic elements;
a second secondary ground wiring for respectively connecting said first and second primary ground wirings to said ground terminals of said first and second secondary clock drivers in said second row, and to said ground terminals of said second group of logic elements;
secondary clock signal input wirings divided from an output terminal of said primary clock driver means, and respectively connected to said first secondary clock drivers, and to said second secondary clock drivers, respectively, included in said first and second rows;
a first clock signal wiring for commonly connecting said first secondary clock driver in said first row to logic elements corresponding to said first and second rows and included therein; and
a second clock signal wiring for commonly connecting said second secondary clock driver in said first row to said logic elements corresponding to said first and second rows and included therein.
4. A device according to claim 3, wherein said first and second primary power supply wirings, said first and second primary ground wirings, and said secondary clock signal input wirings are arranged in a direction perpendicular to the longitudinal direction of said first and second rows, and arranged on said first and second secondary clock drivers.
US07/329,908 1988-03-29 1989-03-28 Integrated circuit device having row structure with clock driver at end of each row Expired - Lifetime US4958092A (en)

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JP63073285A JPH077808B2 (en) 1988-03-29 1988-03-29 Integrated circuit
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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EP0642162A2 (en) * 1993-09-01 1995-03-08 Nec Corporation Semiconductor integrated circuit device having signal wiring construction for suppressing clock skew
US5416431A (en) * 1994-03-21 1995-05-16 At&T Corp. Integrated circuit clock driver having improved layout
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US6057724A (en) * 1998-07-13 2000-05-02 International Business Machines Corp. Method and apparatus for synchronized clock distribution
US20020014898A1 (en) * 2000-07-26 2002-02-07 Nobuyuki Ikeda Semiconductor integrated circuit device and method of laying out clock driver used in the semiconductor integrated circuit device

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US5974560A (en) * 1987-04-27 1999-10-26 Hitachi, Ltd. Information processor and information processing system utilizing clock signal
US7111187B2 (en) 1987-04-27 2006-09-19 Hitachi, Ltd. Information processor and information processing system utilizing interface for synchronizing clock signal
US20040093532A1 (en) * 1987-04-27 2004-05-13 Takashi Hotta Information processor and information processing system utilizing interface for synchronizing clock signal
US5640547A (en) * 1987-04-27 1997-06-17 Hitachi, Ltd. Data processing system generating clock signal from an input clock, phase locked to the input clock and used for clocking logic devices
US6675311B2 (en) 1987-04-27 2004-01-06 Hitachi, Ltd. Data processing system generating clock signal from an input clock, phase locked to the input clock and used for clocking logic devices
US5172330A (en) * 1989-02-08 1992-12-15 Kabushiki Kaisha Toshiba Clock buffers arranged in a peripheral region of the logic circuit area
US5497109A (en) * 1989-11-14 1996-03-05 Mitsubishi Denki Kabushiki Kaisha Integrated circuit with reduced clock skew
US5319605A (en) * 1991-02-05 1994-06-07 Samsung Electronics Co., Ltd. Arrangement of word line driver stage for semiconductor memory device
US5278466A (en) * 1991-09-27 1994-01-11 Mitsubishi Denki Kabushiki Kaisha Integrated circuit with reduced clock skew
US5467316A (en) * 1991-12-04 1995-11-14 Samsung Electronics Co., Ltd. Device and method of reducing word line resistance of a semiconductor memory
US5631183A (en) * 1991-12-04 1997-05-20 Samsung Electronics Co. Ltd. Method of reducing word line resistance of a semiconductor memory
US5376842A (en) * 1991-12-20 1994-12-27 Mitsubishi Denki Kabushiki Kaisha Integrated circuit with reduced clock skew and divided power supply lines
EP0642162A2 (en) * 1993-09-01 1995-03-08 Nec Corporation Semiconductor integrated circuit device having signal wiring construction for suppressing clock skew
EP0642162A3 (en) * 1993-09-01 1997-07-16 Nec Corp Semiconductor integrated circuit device having signal wiring construction for suppressing clock skew.
US5532500A (en) * 1993-09-01 1996-07-02 Nec Corporation Semiconductor integrated circuit device having clock signal wiring construction for suppressing clock skew
US5416431A (en) * 1994-03-21 1995-05-16 At&T Corp. Integrated circuit clock driver having improved layout
US6057724A (en) * 1998-07-13 2000-05-02 International Business Machines Corp. Method and apparatus for synchronized clock distribution
US20020014898A1 (en) * 2000-07-26 2002-02-07 Nobuyuki Ikeda Semiconductor integrated circuit device and method of laying out clock driver used in the semiconductor integrated circuit device
US6400182B2 (en) * 2000-07-26 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device and method of laying out clock driver used in the semiconductor integrated circuit device

Also Published As

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JPH077808B2 (en) 1995-01-30
KR920005321B1 (en) 1992-07-02
EP0335695A3 (en) 1990-05-23
KR890015411A (en) 1989-10-30
JPH01246847A (en) 1989-10-02
EP0335695A2 (en) 1989-10-04

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