US5065280A - Flex interconnect module - Google Patents
Flex interconnect module Download PDFInfo
- Publication number
- US5065280A US5065280A US07/575,098 US57509890A US5065280A US 5065280 A US5065280 A US 5065280A US 57509890 A US57509890 A US 57509890A US 5065280 A US5065280 A US 5065280A
- Authority
- US
- United States
- Prior art keywords
- flexible conductor
- module
- circuit board
- motherboard
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to electronic component and circuit packaging techniques and, in particular, to packaging techniques useful for the fabrication of dense, high speed digital circuits and subassemblies such as those used in the construction of computers.
- the performance of today's computers depend primarily on the performance of the main chip-set subassembly and the cache memory access time of each computer. This performance is limited by the delay of the computer package, including the signal paths interconnecting the integrated circuit chips in the subassembly. These paths include the individual chip packages, the interconnect substrate, the motherboard and the various connectors and cables.
- packaging techniques have been used for the fabrication of such electronic circuits and subassemblies.
- the primary requirements for such packaging techniques include high circuit density, convenient construction, testing and repair techniques as well as high speed circuit performance and efficient thermal transfer and dissipation.
- Many conventional packaging techniques satisfy one or more of these requirements for particular applications.
- TAB Tape Automated Bonding
- DTAB Demountable Tape-Automated Bonding
- DTAB utilizes a demountable pressure contact between the outer frame ends and the printed circuit board for electrical connection.
- An elastomer may be used between the frame contacts and a pressure cap for controlled, demountable electrical connection therebetween.
- Heat transfer techniques have become important as circuit densities and speed result in the close proximity of heat generating and heat degradable components.
- Heat sinks are commonly used to transfer heat from individual components, or groups of substantially identical components, to air or other cooling mediums.
- an electronic module including heat spreader means, a plurality of integrated circuit chips, a chip interconnect frame in electrical contact with each chip, a multilayer flexible conductor module in electrical contact with each chip interconnect frame, a motherboard assembly in electrical contact with the flexible conductor module, and mounting means for maintaining the chips in compression between the flexible conductor module and the heat spreader conductor.
- the present invention provides a method of packaging an electronic module by mounting a plurality of integrated circuit chips in contact with a heat spreader, interconnecting the active side of each chip to a multilayer flexible conductor module, interconnecting a motherboard assembly with the flexible conductor module, and maintaining the chips in compression between the flexible conductor module and the heat spreader.
- FIG. 1 is a cross-sectional view of circuit subassembly portion 10 showing the mounting of integrated circuit chip 12 to multilayer flexible printed circuit board 14 including the electrical interconnection therebetween by TAB frame 16.
- FIG. 2 is a cross-sectional view of circuit assembly 18, including a plurality of integrated circuit chips 12, each mounted to multilayer flexible printed circuit board 14, which is itself connected directly to motherboard 20 by heat spreader connectors 42 and 43, fasteners 44 and 46.
- FIG. 3 is an enlarged cross-sectional view of coaxial power connector 24 which provides power and ground connections between multilayer flexible printed circuit board 14 and motherboard 20.
- FIG. 4 is a top view of multilayer flexible printed circuit board 14 as shown in FIGS. 1, 2 and 3, above.
- FIG. 1 is a cross-sectional view of circuit subassembly portion 10 showing the mounting of integrated circuit chip 12 to a flexible conductor module, such as multilayer flexible printed circuit board 14.
- Multilayer flexible printed circuit board 14 may conveniently be a conventional flexible printed circuit board having multiple internal conducting metal layers.
- Integrated circuit chip 12 is oriented so that the active surface, including the active components and electrical connections, is face down - that is - facing towards multilayer flexible printed circuit board 14.
- the opposite surface of integrated circuit chip 12 is oriented upwards toward heat spreader 26.
- the contact between integrated circuit chip 12 and heat spreader 26 may be treated for more efficient heat transfer by, for example, providing a layer of silicone grease, such as THERMALCOAT available from Thermalloy Inc., of Dallas, Tex. or a silicone adhesive such as silicone adhesive 102-32, available from Creative Materials Inc., of Tyngsboro, Mass.
- Integrated circuit chip 12 is pressed against heat spreader 26 by elastomer 28 sandwiched against integrated circuit chip 12 by pressure from multilayer flexible printed circuit board 14.
- Integrated circuit chip 12 is electrically connected to multilayer flexible printed circuit board 14 by TAB frame 16.
- TAB frame 16 may be a conventional TAB frame in which case the inner leads thereof are bonded to integrated circuit chip 12 using conventional techniques such as single point thermosonic or thermocompression gang bonding, while the outer leads are solder bonded to multilayer flexible printed circuit board 14.
- the DTAB technique referenced above may be used so that the outer leads of TAB frame 16 are demountably connected by pressure to the appropriate contacts on multilayer flexible printed circuit board 14.
- the compression needed to maintain this pressure contact is provided by elastomer 32 sandwiched between heat spreader 26 and multilayer flexible printed circuit board 14.
- Multilayer printed circuit board 14 is itself pressed against elastomer 32, TAB frame 16 and elastomer 28 by backing plate 34 which is pulled against heat spreader 26 by a series of fasteners, such as fasteners 36 and 38, each associated with an alignment pin 33 that serves to align all portions of circuit subassembly portion 10.
- circuit subassembly portion 10 heat generated by integrated circuit chip 12 is carried away by contact with heat spreader 26.
- Integrated circuit chip 12 is interconnected to multilayer flexible printed circuit board 14 and any associated circuitry by TAB frame 16.
- integrated circuit chip 12 is first bonded to TAB frame 16. Integrated circuit chip 12 may then be tested by contact with the outer leads of TAB frame 16 before being assembled into any larger subassembly. Repair at this stage would normally consist of repair of the connections between TAB frame 16 and integrated circuit chip 12 and/or replacement of TAB frame 16 if feasible.
- Integrated circuit chip 12 would then be positioned between heat spreader 26 and multilayer flexible printed circuit board 14 and held in place by fasteners 36 and 38 pressing backing plate 34 towards multilayer flexible printed circuit board 14 compressing elastomer 28 and elastomer 32. Electrical connection between TAB frame 16 and multilayer flexible printed circuit board 14 is accomplished by this pressure. Repair or replacement of integrated circuit chip 12 after further testing, or actual use, may easily be accomplished by demounting fasteners 36 and 38.
- Circuit subassembly portion 10 may be part of a larger assembly, including additional integrated circuits and other components interconnected via multilayer flexible printed circuit board 14.
- a larger subassembly including multiple circuit subassembly portions 10, 37 and 39 is shown in FIG. 2 as circuit assembly 18.
- multilayer flexible printed circuit board 14 provides common interconnection between integrated circuit chip 12 in circuit subassembly portion 10 and other integrated circuits in circuit subassembly portions 37 and 39.
- Common backing plate 34 is fastened to heat spreader 26 in the area surrounding circuit subassembly portion 10 by fasteners 36 and 38, each of which is associated with a related alignment pin 33.
- the pressure of backing plate 34 against multilayer flexible printed circuit board 14 assures that this flexible circuit board maintains relatively evenly distributed pressure against the appropriate elastomers, such as elastomers 28 and 32 as shown in FIG. 1, and provides a wider range of component thickness tolerance.
- the demountable electrical connection between the integrated circuits and multilayer flexible printed circuit board 14, as well as the connections between and motherboard 20, is discussed in more detail below.
- Air cooling fin 40 may be added to heat spreader 26 to provide additional cooling for critical components.
- Multilayer printed circuit board 14 may itself be connected to a larger printed circuit board or other assembly, such as motherboard 20, by an integral extension of one or more of the metal layers of multilayer flexible printed circuit board 14, such as extension contacts 22.
- Contacts 22 are compressed against motherboard 20 by elastomer 41.
- Elastomer 41 is held against motherboard 20 by heat spreader connectors 42 and 43 fastened at one end to heat spreader 26 by conventional means not shown and at the other end to motherboard 20 by screws or other fasteners, such as fasteners 44 and 46.
- heat spreader 26 is fastened to motherboard 20 by heat spreader connectors 42 and 43. This permits the testing of the entire subassembly and rework or replacement of components, as necessary.
- power and ground connections between motherboard 20 and multilayer flexible printed circuit board 14 may be accomplished without use of circuit traces within extension contacts 22.
- it may be convenient to bring power and ground connections directly from motherboard 20 to the appropriate locations on multilayer flexible printed circuit board 14 by coaxial power connectors, such as coaxial power connector 24.
- coaxial power connectors may be positioned in any appropriate location, including in openings not shown in backing plate 34. It is, however, most convenient to position such coaxial power connectors in locations in which there is direct access between motherboard 20 and multilayer flexible printed circuit board 14. One such location is shown in FIG. 2 for coaxial power connector 24 which has been positioned between fastener 38 of circuit subassembly portion 10 and fastener 48 of subassembly portion 37.
- coaxial power connector 24 may be understood in greater detail from the enlarged cross sectional view thereof shown in FIG. 3.
- coaxial power connector 24 is shown in cross sectional view providing power and ground connections between multilayer flexible printed circuit board 14 and motherboard 20.
- Coaxial power connector 24 includes outer conducting cylinder 50 which may conveniently be used as a ground interconnection, and inner conducting cylinder 52 which may conveniently be used for power connections.
- Multiply internal conducting cylinders may be used in circuit assemblies which require multiple power buss connections.
- Each conducting cylinder makes contact with appropriate conducting pads on multilayer flexible printed circuit board 14 and motherboard 20, such as ground contact 54 on multilayer flexible printed circuit board 14 and ground contact 56 on motherboard 20.
- Coaxial power connector 24 is held together by multilayer flexible printed circuit board 14, motherboard 20, fastener 58 and/or appropriate insulating washers such as insulating washer 60.
- TAB frame mounting pad areas 62, 64, 66, 68, 70 and 72 This layout may conveniently be used for a memory subassembly.
- TAB frame mounting pad area 62 may be the pads on the upper surface of multilayer flexible printed circuit board 14 used for interconnection with TAB frame 16, as shown in FIG. 1, to provide signal paths to integrated circuit chip 12.
- TAB frame mounting pad area 62 Surrounding TAB frame mounting pad area 62 are fasteners 36 and 38 and coaxial power connector 24 positioned as shown in FIG. 2 between fastener 38 and fastener 48.
- TAB frame mounting pad areas 74 provided for interconnection between multilayer flexible printed circuit board 14 and motherboard 20 by compression of contacts 22 by elastomer 41, as shown in FIG. 2.
- the present invention is extremely useful in the fabrication of electronic subassemblies requiring rework and repair at all levels of assembly while requiring high speed operation and efficient thermal transfer of unwanted heat generated in the circuitry. It is particularly suited to memory boards as shown in FIG. 4 or for the main computer chip-set for high performance computers, such as today's workstations.
Abstract
An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.
Description
1. Field of the Invention
This invention relates to electronic component and circuit packaging techniques and, in particular, to packaging techniques useful for the fabrication of dense, high speed digital circuits and subassemblies such as those used in the construction of computers.
2. Description of the Prior Art
The performance of today's computers depend primarily on the performance of the main chip-set subassembly and the cache memory access time of each computer. This performance is limited by the delay of the computer package, including the signal paths interconnecting the integrated circuit chips in the subassembly. These paths include the individual chip packages, the interconnect substrate, the motherboard and the various connectors and cables.
As the operating frequencies of computers approach 100 MHz, packaging delays are increasingly becoming the limiting factor in the operation and performance of today's computers. For these reasons, high performance main frame computers have used various techniques for packaging and assembling the critical chips of a computer in a compact, high frequency unit which is assembled to the next level subassembly, the backplane, with minimal performance loss.
Many packaging techniques have been used for the fabrication of such electronic circuits and subassemblies. The primary requirements for such packaging techniques include high circuit density, convenient construction, testing and repair techniques as well as high speed circuit performance and efficient thermal transfer and dissipation. Many conventional packaging techniques satisfy one or more of these requirements for particular applications.
A currently popular manufacturing technique, known as TAB or Tape Automated Bonding, has proven to be particularly useful for high volume manufacturing of circuit subassemblies. TAB techniques utilize a frame of conductors in a pattern, the inner contacts of each conductor being connected to appropriate contact points on a semiconductor chip. The outer contacts are utilized first for testing purposes and then for permanent bonding connections to the next high level of circuit subassembly, such as a printed circuit board substrate.
A particularly convenient variation of this technique is known as DTAB which stands for Demountable Tape-Automated Bonding and is disclosed in U.S. patent application Ser. No. 07/401,053, filed 08/31/89 and assigned to a common assignee. DTAB utilizes a demountable pressure contact between the outer frame ends and the printed circuit board for electrical connection. An elastomer may be used between the frame contacts and a pressure cap for controlled, demountable electrical connection therebetween.
Heat transfer techniques have become important as circuit densities and speed result in the close proximity of heat generating and heat degradable components. Heat sinks are commonly used to transfer heat from individual components, or groups of substantially identical components, to air or other cooling mediums.
The most commonly used heat transfer techniques position the circuit components active side facing the printed circuit board, and mount a heat sink on the back side. An alternative approach provides a thermal dissipation path through the printed circuit board or other substrate. Such techniques are cumbersome, expensive and substantially interfere with the repairability of individual components.
The preceding and other shortcomings of the prior art are addressed and overcome by the present invention that provides an electronic module, including heat spreader means, a plurality of integrated circuit chips, a chip interconnect frame in electrical contact with each chip, a multilayer flexible conductor module in electrical contact with each chip interconnect frame, a motherboard assembly in electrical contact with the flexible conductor module, and mounting means for maintaining the chips in compression between the flexible conductor module and the heat spreader conductor.
In a further aspect, the present invention provides a method of packaging an electronic module by mounting a plurality of integrated circuit chips in contact with a heat spreader, interconnecting the active side of each chip to a multilayer flexible conductor module, interconnecting a motherboard assembly with the flexible conductor module, and maintaining the chips in compression between the flexible conductor module and the heat spreader.
These and other features and advantages of this invention will become further apparent from the detailed description that follows which is accompanied by one or more drawing figures. In the figures and description, numerals indicate the various features of the invention, like numerals referring to like features throughout both the drawings and the description.
FIG. 1 is a cross-sectional view of circuit subassembly portion 10 showing the mounting of integrated circuit chip 12 to multilayer flexible printed circuit board 14 including the electrical interconnection therebetween by TAB frame 16.
FIG. 2 is a cross-sectional view of circuit assembly 18, including a plurality of integrated circuit chips 12, each mounted to multilayer flexible printed circuit board 14, which is itself connected directly to motherboard 20 by heat spreader connectors 42 and 43, fasteners 44 and 46.
FIG. 3 is an enlarged cross-sectional view of coaxial power connector 24 which provides power and ground connections between multilayer flexible printed circuit board 14 and motherboard 20.
FIG. 4 is a top view of multilayer flexible printed circuit board 14 as shown in FIGS. 1, 2 and 3, above.
In accordance with the present invention, FIG. 1 is a cross-sectional view of circuit subassembly portion 10 showing the mounting of integrated circuit chip 12 to a flexible conductor module, such as multilayer flexible printed circuit board 14. Multilayer flexible printed circuit board 14 may conveniently be a conventional flexible printed circuit board having multiple internal conducting metal layers.
Integrated circuit chip 12 is oriented so that the active surface, including the active components and electrical connections, is face down - that is - facing towards multilayer flexible printed circuit board 14. The opposite surface of integrated circuit chip 12 is oriented upwards toward heat spreader 26. The contact between integrated circuit chip 12 and heat spreader 26 may be treated for more efficient heat transfer by, for example, providing a layer of silicone grease, such as THERMALCOAT available from Thermalloy Inc., of Dallas, Tex. or a silicone adhesive such as silicone adhesive 102-32, available from Creative Materials Inc., of Tyngsboro, Mass.
Integrated circuit chip 12 is pressed against heat spreader 26 by elastomer 28 sandwiched against integrated circuit chip 12 by pressure from multilayer flexible printed circuit board 14. Integrated circuit chip 12 is electrically connected to multilayer flexible printed circuit board 14 by TAB frame 16. TAB frame 16 may be a conventional TAB frame in which case the inner leads thereof are bonded to integrated circuit chip 12 using conventional techniques such as single point thermosonic or thermocompression gang bonding, while the outer leads are solder bonded to multilayer flexible printed circuit board 14.
In a preferred embodiment of the invention as shown in FIG. 1, the DTAB technique referenced above may be used so that the outer leads of TAB frame 16 are demountably connected by pressure to the appropriate contacts on multilayer flexible printed circuit board 14. The compression needed to maintain this pressure contact is provided by elastomer 32 sandwiched between heat spreader 26 and multilayer flexible printed circuit board 14.
Multilayer printed circuit board 14 is itself pressed against elastomer 32, TAB frame 16 and elastomer 28 by backing plate 34 which is pulled against heat spreader 26 by a series of fasteners, such as fasteners 36 and 38, each associated with an alignment pin 33 that serves to align all portions of circuit subassembly portion 10.
During operation of circuit subassembly portion 10, heat generated by integrated circuit chip 12 is carried away by contact with heat spreader 26. Integrated circuit chip 12 is interconnected to multilayer flexible printed circuit board 14 and any associated circuitry by TAB frame 16.
During assembly of circuit subassembly portion 10, integrated circuit chip 12 is first bonded to TAB frame 16. Integrated circuit chip 12 may then be tested by contact with the outer leads of TAB frame 16 before being assembled into any larger subassembly. Repair at this stage would normally consist of repair of the connections between TAB frame 16 and integrated circuit chip 12 and/or replacement of TAB frame 16 if feasible.
Integrated circuit chip 12 would then be positioned between heat spreader 26 and multilayer flexible printed circuit board 14 and held in place by fasteners 36 and 38 pressing backing plate 34 towards multilayer flexible printed circuit board 14 compressing elastomer 28 and elastomer 32. Electrical connection between TAB frame 16 and multilayer flexible printed circuit board 14 is accomplished by this pressure. Repair or replacement of integrated circuit chip 12 after further testing, or actual use, may easily be accomplished by demounting fasteners 36 and 38.
Referring now to FIG. 2, multilayer flexible printed circuit board 14 provides common interconnection between integrated circuit chip 12 in circuit subassembly portion 10 and other integrated circuits in circuit subassembly portions 37 and 39. Common backing plate 34 is fastened to heat spreader 26 in the area surrounding circuit subassembly portion 10 by fasteners 36 and 38, each of which is associated with a related alignment pin 33.
The pressure of backing plate 34 against multilayer flexible printed circuit board 14 assures that this flexible circuit board maintains relatively evenly distributed pressure against the appropriate elastomers, such as elastomers 28 and 32 as shown in FIG. 1, and provides a wider range of component thickness tolerance. The demountable electrical connection between the integrated circuits and multilayer flexible printed circuit board 14, as well as the connections between and motherboard 20, is discussed in more detail below.
In addition, the pressure from backing plate 34 provides the contact needed for good thermal conduction between the integrated circuits and heat spreader 26. Air cooling fin 40 may be added to heat spreader 26 to provide additional cooling for critical components.
Multilayer printed circuit board 14 may itself be connected to a larger printed circuit board or other assembly, such as motherboard 20, by an integral extension of one or more of the metal layers of multilayer flexible printed circuit board 14, such as extension contacts 22. Contacts 22 are compressed against motherboard 20 by elastomer 41. Elastomer 41 is held against motherboard 20 by heat spreader connectors 42 and 43 fastened at one end to heat spreader 26 by conventional means not shown and at the other end to motherboard 20 by screws or other fasteners, such as fasteners 44 and 46.
During assembly, after appropriate testing and assembly of circuit subassembly portions 10, 37 and 39 to common heat spreader 26, heat spreader 26 is fastened to motherboard 20 by heat spreader connectors 42 and 43. This permits the testing of the entire subassembly and rework or replacement of components, as necessary.
It is important to note that the assembly configuration just described permits direct cooling for the integrated circuits and other components by contact of their inactive sides with common heat spreader 26, and therefore air cooling fin 40, even though such components may have different thicknesses. Mounting stresses related to assembly and/or rework of subassemblies are not transferred to motherboard 20. The circuit board area of motherboard 20 directly beneath circuit assembly 18 is substantially unused for subassembly interconnections, providing opportunity for using this area for other interconnections, thereby increasing potential circuit density.
In accordance with a preferred embodiment of the present invention, power and ground connections between motherboard 20 and multilayer flexible printed circuit board 14 may be accomplished without use of circuit traces within extension contacts 22. In particular, it may be convenient to bring power and ground connections directly from motherboard 20 to the appropriate locations on multilayer flexible printed circuit board 14 by coaxial power connectors, such as coaxial power connector 24.
These coaxial power connectors may be positioned in any appropriate location, including in openings not shown in backing plate 34. It is, however, most convenient to position such coaxial power connectors in locations in which there is direct access between motherboard 20 and multilayer flexible printed circuit board 14. One such location is shown in FIG. 2 for coaxial power connector 24 which has been positioned between fastener 38 of circuit subassembly portion 10 and fastener 48 of subassembly portion 37.
The design and operation of coaxial power connector 24 may be understood in greater detail from the enlarged cross sectional view thereof shown in FIG. 3.
Referring now to FIG. 3, coaxial power connector 24 is shown in cross sectional view providing power and ground connections between multilayer flexible printed circuit board 14 and motherboard 20. Coaxial power connector 24 includes outer conducting cylinder 50 which may conveniently be used as a ground interconnection, and inner conducting cylinder 52 which may conveniently be used for power connections. Multiply internal conducting cylinders may be used in circuit assemblies which require multiple power buss connections.
Each conducting cylinder makes contact with appropriate conducting pads on multilayer flexible printed circuit board 14 and motherboard 20, such as ground contact 54 on multilayer flexible printed circuit board 14 and ground contact 56 on motherboard 20. Coaxial power connector 24 is held together by multilayer flexible printed circuit board 14, motherboard 20, fastener 58 and/or appropriate insulating washers such as insulating washer 60.
Referring now to FIG. 4, a top view of a particular example of multilayer flexible printed circuit board 14 is shown including TAB frame mounting pad areas 62, 64, 66, 68, 70 and 72. This layout may conveniently be used for a memory subassembly. TAB frame mounting pad area 62 may be the pads on the upper surface of multilayer flexible printed circuit board 14 used for interconnection with TAB frame 16, as shown in FIG. 1, to provide signal paths to integrated circuit chip 12. Surrounding TAB frame mounting pad area 62 are fasteners 36 and 38 and coaxial power connector 24 positioned as shown in FIG. 2 between fastener 38 and fastener 48.
Around the periphery of multilayer flexible printed circuit board 14 are shown TAB frame mounting pad areas 74 provided for interconnection between multilayer flexible printed circuit board 14 and motherboard 20 by compression of contacts 22 by elastomer 41, as shown in FIG. 2.
The present invention is extremely useful in the fabrication of electronic subassemblies requiring rework and repair at all levels of assembly while requiring high speed operation and efficient thermal transfer of unwanted heat generated in the circuitry. It is particularly suited to memory boards as shown in FIG. 4 or for the main computer chip-set for high performance computers, such as today's workstations.
While this invention has been described with reference to its presently preferred embodiment(s), its scope is not limited thereto. Rather, such scope is only limited insofar as defined by the following set of claims and all equivalents thereof.
Claims (7)
1. An electronic module, comprising:
heat spreader means;
a plurality of integrated circuit chips;
a chip interconnect frame in electrical contact with each chip;
a multilayer flexible conductor module in electrical contact with each chip interconnect frame;
a motherboard assembly in electrical contact with the flexible conductor module;
elastomer means compressed between the flexible conductor module and the chips; and
mounting means including an inflexible backing plate urging the flexible conductor toward the chips for maintaining the chips in compression between the flexible conductor module and the heat spreader conductor.
2. The electronic module claimed in claim 1, wherein the mounting means further comprises:
means for aligning and compressing the chips, elastomer means and the flexible conducting module between the heat spreader and the backing plate.
3. The electronic module claimed in claim 1, wherein the mounting means further comprises:
means for compressing extension contacts around the periphery of the flexible conductor module to the motherboard.
4. The electronic module claimed in claim 3, wherein the mounting means further comprises:
coaxial power connector means for directly interconnecting non-peripheral portions of the flexible conductor module to the motherboard.
5. A method of packaging an electronic module, comprising the steps of:
mounting a plurality of integrated circuit chips in contact with a heat spreader;
interconnecting the active side of each chip to a multilayer flexible conductor module;
interconnecting a motherboard assembly with the flexible conductor module;
urging an inflexible backing plate against the flexible conductor toward the chips; and
compressing an elastomer between the flexible conductor module and the chips to maintain the chips in compression between the flexible conductor module and the heat spreader.
6. The method of packaging an electronic module claimed in claim 5, further comprising the step of:
compressing extension contacts around the periphery of the flexible conductor module against the motherboard.
7. The method of packaging an electronic module claimed in claim 6, further comprising the step of:
directly interconnecting non-peripheral portions of the flexible conductor module to the motherboard with coaxial power connectors.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/575,098 US5065280A (en) | 1990-08-30 | 1990-08-30 | Flex interconnect module |
JP03244904A JP3126174B2 (en) | 1990-08-30 | 1991-08-30 | Flexible interconnect module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/575,098 US5065280A (en) | 1990-08-30 | 1990-08-30 | Flex interconnect module |
Publications (1)
Publication Number | Publication Date |
---|---|
US5065280A true US5065280A (en) | 1991-11-12 |
Family
ID=24298936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/575,098 Expired - Fee Related US5065280A (en) | 1990-08-30 | 1990-08-30 | Flex interconnect module |
Country Status (2)
Country | Link |
---|---|
US (1) | US5065280A (en) |
JP (1) | JP3126174B2 (en) |
Cited By (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5162975A (en) * | 1991-10-15 | 1992-11-10 | Hewlett-Packard Company | Integrated circuit demountable TAB apparatus |
US5200809A (en) * | 1991-09-27 | 1993-04-06 | Vlsi Technology, Inc. | Exposed die-attach heatsink package |
FR2689361A1 (en) * | 1992-03-24 | 1993-10-01 | Thomson Csf | Inductive circuit cooling device. |
US5262925A (en) * | 1991-10-15 | 1993-11-16 | Hewlett-Packard Company | Tab frame with area array edge contacts |
US5268813A (en) * | 1990-12-12 | 1993-12-07 | International Business Machines Corp. | Flexible printed circuit package and flexible printed circuit for incorporating in such a package |
US5267867A (en) * | 1992-09-11 | 1993-12-07 | Digital Equipment Corporation | Package for multiple removable integrated circuits |
US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
US5329423A (en) * | 1993-04-13 | 1994-07-12 | Scholz Kenneth D | Compressive bump-and-socket interconnection scheme for integrated circuits |
US5348482A (en) * | 1993-06-11 | 1994-09-20 | The Whitaker Corporation | High density integrated backplane assembly |
US5380211A (en) * | 1992-08-05 | 1995-01-10 | The Whitaker Corporation | Coaxial connector for connecting two circuit boards |
US5381314A (en) * | 1993-06-11 | 1995-01-10 | The Whitaker Corporation | Heat dissipating EMI/RFI protective function box |
EP0637079A1 (en) * | 1993-07-30 | 1995-02-01 | Sun Microsystems, Inc. | Upgradable multi-chip module |
US5426405A (en) * | 1993-08-03 | 1995-06-20 | Hewlett-Packard Company | Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
US5471366A (en) * | 1993-08-19 | 1995-11-28 | Fujitsu Limited | Multi-chip module having an improved heat dissipation efficiency |
US5500556A (en) * | 1993-07-12 | 1996-03-19 | Nec Corporation | Packaging structure for microwave circuit |
US5514917A (en) * | 1992-12-24 | 1996-05-07 | The Whitaker Corporation | Heat dissipating housing for current |
US5648893A (en) * | 1993-07-30 | 1997-07-15 | Sun Microsystems, Inc. | Upgradable multi-chip module |
US5715141A (en) * | 1994-11-07 | 1998-02-03 | Atlas Copco Controls Ab | Control circuit arrangement having a clamping structure which connects a heat conductive substrate to a circuit board and provides electrically conducting leads therebetween |
US5729433A (en) * | 1996-01-30 | 1998-03-17 | Micromodule Systems, Inc. | Multiple chip module assembly for top of mother board |
DE19643612A1 (en) * | 1996-10-22 | 1998-04-30 | Oce Printing Systems Gmbh | Heat-sink element for IC module |
US5899758A (en) * | 1994-06-07 | 1999-05-04 | The Whitaker Corporation | Flexible printed circuit harness |
US5920120A (en) * | 1997-12-19 | 1999-07-06 | Intel Corporation | Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved |
US6128190A (en) * | 1997-10-29 | 2000-10-03 | Telefonaktiebolaget L M Ericsson | Electronic assembly |
US6220871B1 (en) * | 1998-08-07 | 2001-04-24 | Ddk Ltd. | Electrical connector and contact construction therefor |
WO2001067512A2 (en) * | 2000-03-08 | 2001-09-13 | Incep Technologies, Inc. | Method and apparatus for delivering power to high performance electronic assemblies |
US6299460B1 (en) | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
US6411507B1 (en) * | 1998-02-13 | 2002-06-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
US6473304B1 (en) * | 1996-12-23 | 2002-10-29 | David Leonard Stevens | Thermally conductive case for electrical components and method of manufacture therefor |
US20030002268A1 (en) * | 1999-07-15 | 2003-01-02 | Dibene Joseph Ted | Ultra-low impedance power interconnection system for electronic packages |
US20030057548A1 (en) * | 1999-07-15 | 2003-03-27 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
US6609914B2 (en) | 1999-07-15 | 2003-08-26 | Incep Technologies, Inc. | High speed and density circular connector for board-to-board interconnection systems |
US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
US20030178719A1 (en) * | 2002-03-22 | 2003-09-25 | Combs Edward G. | Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
US20030183406A1 (en) * | 2001-02-16 | 2003-10-02 | Dibene Joseph T. | Micro-spring interconnect systems for low impedance high power applications |
US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
DE4332115B4 (en) * | 1993-09-22 | 2004-06-03 | Philips Intellectual Property & Standards Gmbh | Arrangement for cooling at least one heat sink printed circuit board |
US6845013B2 (en) | 2002-03-04 | 2005-01-18 | Incep Technologies, Inc. | Right-angle power interconnect electronic packaging assembly |
US6947293B2 (en) | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US20060164810A1 (en) * | 2003-02-28 | 2006-07-27 | Walter Apfelbacher | Electronic device comprising secure heat dissipation |
US20080186681A1 (en) * | 2007-02-02 | 2008-08-07 | Bose Corporation | Electronic assembly cooling |
US20100315785A1 (en) * | 2009-06-12 | 2010-12-16 | Sony Corporation | Electronic equipment |
US20120186799A1 (en) * | 2011-01-24 | 2012-07-26 | Hua-Chun Chin | Laminating Heat Sink Having Enhanced Heat Dissipation Capacity |
WO2012087432A3 (en) * | 2010-12-22 | 2013-04-11 | Raytheon Company | Cooling of coplanar active circuits |
US20130328180A1 (en) * | 2012-06-06 | 2013-12-12 | Stmicroelectronics S.R.L. | Packaged semiconductor device with an exposed metal top surface |
US8665596B2 (en) | 2011-01-05 | 2014-03-04 | Pg Drives Technology Limited | Power switching circuitry |
US20150108630A1 (en) * | 2013-10-22 | 2015-04-23 | Fujitsu Limited | Electronic device, electronic apparatus, and method for manufacturing electronic device |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
GB2539789A (en) * | 2015-05-22 | 2016-12-28 | Deere & Co | System or connector for voltage bus structures |
CN110402012A (en) * | 2018-04-25 | 2019-11-01 | 株式会社东芝 | Electronic equipment |
US10575409B2 (en) * | 2015-09-28 | 2020-02-25 | Boe Technology Group Co., Ltd. | FPC flattening jig and FPC flattening method |
EP3648560A1 (en) * | 2018-11-01 | 2020-05-06 | Franklin Electric Co., Inc. | Discrete power component assembly |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517624A (en) * | 1982-09-09 | 1985-05-14 | Siemens Aktiengesellschaft | Device for cooling a plurality of integrated modules combined on a flexible printed circuitboard to form logic cards |
US4755911A (en) * | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US4954878A (en) * | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
-
1990
- 1990-08-30 US US07/575,098 patent/US5065280A/en not_active Expired - Fee Related
-
1991
- 1991-08-30 JP JP03244904A patent/JP3126174B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517624A (en) * | 1982-09-09 | 1985-05-14 | Siemens Aktiengesellschaft | Device for cooling a plurality of integrated modules combined on a flexible printed circuitboard to form logic cards |
US4755911A (en) * | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US4954878A (en) * | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
Cited By (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5268813A (en) * | 1990-12-12 | 1993-12-07 | International Business Machines Corp. | Flexible printed circuit package and flexible printed circuit for incorporating in such a package |
US5200809A (en) * | 1991-09-27 | 1993-04-06 | Vlsi Technology, Inc. | Exposed die-attach heatsink package |
US5262925A (en) * | 1991-10-15 | 1993-11-16 | Hewlett-Packard Company | Tab frame with area array edge contacts |
US5162975A (en) * | 1991-10-15 | 1992-11-10 | Hewlett-Packard Company | Integrated circuit demountable TAB apparatus |
FR2689361A1 (en) * | 1992-03-24 | 1993-10-01 | Thomson Csf | Inductive circuit cooling device. |
EP0564315A1 (en) * | 1992-03-24 | 1993-10-06 | Thomson-Csf | Cooling device for inductive circuit |
US5380211A (en) * | 1992-08-05 | 1995-01-10 | The Whitaker Corporation | Coaxial connector for connecting two circuit boards |
US5267867A (en) * | 1992-09-11 | 1993-12-07 | Digital Equipment Corporation | Package for multiple removable integrated circuits |
US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
US5514917A (en) * | 1992-12-24 | 1996-05-07 | The Whitaker Corporation | Heat dissipating housing for current |
US5329423A (en) * | 1993-04-13 | 1994-07-12 | Scholz Kenneth D | Compressive bump-and-socket interconnection scheme for integrated circuits |
US5381314A (en) * | 1993-06-11 | 1995-01-10 | The Whitaker Corporation | Heat dissipating EMI/RFI protective function box |
US5348482A (en) * | 1993-06-11 | 1994-09-20 | The Whitaker Corporation | High density integrated backplane assembly |
US5500556A (en) * | 1993-07-12 | 1996-03-19 | Nec Corporation | Packaging structure for microwave circuit |
CN1047717C (en) * | 1993-07-12 | 1999-12-22 | 日本电气株式会社 | Packaging structure for microwave circuit |
EP0637079A1 (en) * | 1993-07-30 | 1995-02-01 | Sun Microsystems, Inc. | Upgradable multi-chip module |
US5648893A (en) * | 1993-07-30 | 1997-07-15 | Sun Microsystems, Inc. | Upgradable multi-chip module |
US5426405A (en) * | 1993-08-03 | 1995-06-20 | Hewlett-Packard Company | Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
US5471366A (en) * | 1993-08-19 | 1995-11-28 | Fujitsu Limited | Multi-chip module having an improved heat dissipation efficiency |
US5592735A (en) * | 1993-08-19 | 1997-01-14 | Fujitsu Limited | Method of making a multi-chip module having an improved heat dissipation efficiency |
DE4332115B4 (en) * | 1993-09-22 | 2004-06-03 | Philips Intellectual Property & Standards Gmbh | Arrangement for cooling at least one heat sink printed circuit board |
US5899758A (en) * | 1994-06-07 | 1999-05-04 | The Whitaker Corporation | Flexible printed circuit harness |
US5715141A (en) * | 1994-11-07 | 1998-02-03 | Atlas Copco Controls Ab | Control circuit arrangement having a clamping structure which connects a heat conductive substrate to a circuit board and provides electrically conducting leads therebetween |
US5729433A (en) * | 1996-01-30 | 1998-03-17 | Micromodule Systems, Inc. | Multiple chip module assembly for top of mother board |
DE19643612A1 (en) * | 1996-10-22 | 1998-04-30 | Oce Printing Systems Gmbh | Heat-sink element for IC module |
US6473304B1 (en) * | 1996-12-23 | 2002-10-29 | David Leonard Stevens | Thermally conductive case for electrical components and method of manufacture therefor |
US6128190A (en) * | 1997-10-29 | 2000-10-03 | Telefonaktiebolaget L M Ericsson | Electronic assembly |
US5920120A (en) * | 1997-12-19 | 1999-07-06 | Intel Corporation | Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved |
US6411507B1 (en) * | 1998-02-13 | 2002-06-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
US6220871B1 (en) * | 1998-08-07 | 2001-04-24 | Ddk Ltd. | Electrical connector and contact construction therefor |
US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
US20030002268A1 (en) * | 1999-07-15 | 2003-01-02 | Dibene Joseph Ted | Ultra-low impedance power interconnection system for electronic packages |
US20030057548A1 (en) * | 1999-07-15 | 2003-03-27 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US6947293B2 (en) | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6609914B2 (en) | 1999-07-15 | 2003-08-26 | Incep Technologies, Inc. | High speed and density circular connector for board-to-board interconnection systems |
US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
US6847529B2 (en) | 1999-07-15 | 2005-01-25 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
US7881072B2 (en) | 1999-07-15 | 2011-02-01 | Molex Incorporated | System and method for processor power delivery and thermal management |
US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
WO2001067512A2 (en) * | 2000-03-08 | 2001-09-13 | Incep Technologies, Inc. | Method and apparatus for delivering power to high performance electronic assemblies |
WO2001067512A3 (en) * | 2000-03-08 | 2002-05-10 | Incep Technologies Inc | Method and apparatus for delivering power to high performance electronic assemblies |
US6299460B1 (en) | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
US20030183406A1 (en) * | 2001-02-16 | 2003-10-02 | Dibene Joseph T. | Micro-spring interconnect systems for low impedance high power applications |
US7167379B2 (en) | 2001-02-16 | 2007-01-23 | Dibene Ii Joseph T | Micro-spring interconnect systems for low impedance high power applications |
US6845013B2 (en) | 2002-03-04 | 2005-01-18 | Incep Technologies, Inc. | Right-angle power interconnect electronic packaging assembly |
US20030178719A1 (en) * | 2002-03-22 | 2003-09-25 | Combs Edward G. | Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package |
US20060164810A1 (en) * | 2003-02-28 | 2006-07-27 | Walter Apfelbacher | Electronic device comprising secure heat dissipation |
US7515421B2 (en) * | 2003-02-28 | 2009-04-07 | Siemens Aktiengesellschaft | Electronic device comprising secure heat dissipation |
US20080186681A1 (en) * | 2007-02-02 | 2008-08-07 | Bose Corporation | Electronic assembly cooling |
US7679917B2 (en) * | 2007-02-02 | 2010-03-16 | Deck Joseph F | Electronic assembly cooling |
US20100315785A1 (en) * | 2009-06-12 | 2010-12-16 | Sony Corporation | Electronic equipment |
US8199509B2 (en) * | 2009-06-12 | 2012-06-12 | Sony Corporation | Electronic equipment |
WO2012087432A3 (en) * | 2010-12-22 | 2013-04-11 | Raytheon Company | Cooling of coplanar active circuits |
US8665596B2 (en) | 2011-01-05 | 2014-03-04 | Pg Drives Technology Limited | Power switching circuitry |
US20120186799A1 (en) * | 2011-01-24 | 2012-07-26 | Hua-Chun Chin | Laminating Heat Sink Having Enhanced Heat Dissipation Capacity |
US20130328180A1 (en) * | 2012-06-06 | 2013-12-12 | Stmicroelectronics S.R.L. | Packaged semiconductor device with an exposed metal top surface |
US9646912B2 (en) * | 2013-09-10 | 2017-05-09 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module having cooling fins |
US20160104654A1 (en) * | 2013-09-10 | 2016-04-14 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
US9935034B2 (en) | 2013-09-10 | 2018-04-03 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module having cooling fins |
US20150108630A1 (en) * | 2013-10-22 | 2015-04-23 | Fujitsu Limited | Electronic device, electronic apparatus, and method for manufacturing electronic device |
GB2539789A (en) * | 2015-05-22 | 2016-12-28 | Deere & Co | System or connector for voltage bus structures |
GB2539789B (en) * | 2015-05-22 | 2020-09-09 | Deere & Co | System or connector for voltage bus structures |
US10575409B2 (en) * | 2015-09-28 | 2020-02-25 | Boe Technology Group Co., Ltd. | FPC flattening jig and FPC flattening method |
CN110402012A (en) * | 2018-04-25 | 2019-11-01 | 株式会社东芝 | Electronic equipment |
US10561014B2 (en) * | 2018-04-25 | 2020-02-11 | Kabushiki Kaisha Toshiba | Electronic device |
CN110402012B (en) * | 2018-04-25 | 2022-08-09 | 株式会社东芝 | Electronic device |
EP3648560A1 (en) * | 2018-11-01 | 2020-05-06 | Franklin Electric Co., Inc. | Discrete power component assembly |
US10667439B1 (en) | 2018-11-01 | 2020-05-26 | Franklin Electric Company, Inc. | Discrete power component assembly |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
Also Published As
Publication number | Publication date |
---|---|
JP3126174B2 (en) | 2001-01-22 |
JPH04330745A (en) | 1992-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5065280A (en) | Flex interconnect module | |
US5703753A (en) | Mounting assembly for multiple chip module with more than one substrate and computer using same | |
US5729433A (en) | Multiple chip module assembly for top of mother board | |
US5619399A (en) | Multiple chip module mounting assembly and computer using same | |
US5432677A (en) | Multi-chip integrated circuit module | |
US5513070A (en) | Dissipation of heat through keyboard using a heat pipe | |
EP0120500B1 (en) | High density lsi package for logic circuits | |
US6397459B2 (en) | Printed wiring board with mounted circuit elements using a terminal density conversion board | |
US6490161B1 (en) | Peripheral land grid array package with improved thermal performance | |
US5014161A (en) | System for detachably mounting semiconductors on conductor substrate | |
US5430611A (en) | Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate | |
EP0913861B1 (en) | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink | |
US6400573B1 (en) | Multi-chip integrated circuit module | |
JP3281220B2 (en) | Circuit module cooling system | |
US5473510A (en) | Land grid array package/circuit board assemblies and methods for constructing the same | |
US7872876B2 (en) | Multi-layered printed circuit board | |
US5737187A (en) | Apparatus, method and system for thermal management of an unpackaged semiconductor device | |
US20040212964A1 (en) | Stack up assembly | |
US5130768A (en) | Compact, high-density packaging apparatus for high performance semiconductor devices | |
JPH07106477A (en) | Heat sink assembly with heat conduction board | |
JPH0645019A (en) | Flat cable and dimple connection of printed- circuit board | |
US6793123B2 (en) | Packaging for multi-processor shared-memory system | |
JP4988132B2 (en) | High reliability interposer for low cost and high reliability applications | |
US5198887A (en) | Semiconductor chip carrier | |
US5359488A (en) | Packaging system for a standard electronic module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HEWLETT-PACKARD COMPANY, A CORP. OF CA, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:KARNEZOS, MARCOS;KAW, RAVINDHAR;HANLON, LAWRENCE;AND OTHERS;REEL/FRAME:005774/0618;SIGNING DATES FROM 19900823 TO 19900830 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 19991112 |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |