US6262938B1 - Synchronous DRAM having posted CAS latency and method for controlling CAS latency - Google Patents

Synchronous DRAM having posted CAS latency and method for controlling CAS latency Download PDF

Info

Publication number
US6262938B1
US6262938B1 US09/518,144 US51814400A US6262938B1 US 6262938 B1 US6262938 B1 US 6262938B1 US 51814400 A US51814400 A US 51814400A US 6262938 B1 US6262938 B1 US 6262938B1
Authority
US
United States
Prior art keywords
access command
clock
rcl
clock cycles
column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/518,144
Inventor
Jung-Bae Lee
Choong-Sun Shin
Dong-yang Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, DONG-YANG, LEE, JUNG-BAE, SHIN, CHOONG-SUN
Application granted granted Critical
Publication of US6262938B1 publication Critical patent/US6262938B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/18Address timing or clocking circuits; Address control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor
    • G11C7/1012Data reordering during input/output, e.g. crossbars, layers of multiplexers, shifting or rotating
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1015Read-write modes for single port memories, i.e. having either a random port or a serial port
    • G11C7/1045Read-write mode select circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/106Data output latches
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits

Definitions

  • the present invention relates to a synchronous DRAM (SDRAM). More particularly, the present invention relates to an SDRAM having a column access strobe (CAS) latency, as well as a method for controlling the CAS latency.
  • SDRAM synchronous DRAM
  • CAS column access strobe
  • FIG. 13 describes the latency from the application of a row access command or a column access command to the output of data.
  • RAS latency The number of clock cycles of an external clock signal from the application of a row access command to the output of first data is called the RAS latency (RL).
  • the number of clock cycles of the external clock signal from the application of a column access command to the output of the first data is called the CAS latency (CL).
  • the number of clock cycles of the external clock signal from the application of the row access command to the application of the column access command with respect to the same memory bank is called the RAS-CAS latency (RCL).
  • RCL The relationship between RCL, RL, and CL is shown in Equation 1.
  • RCL min (the minimum RAS-CAS latency) is expressed as shown in Equation 3.
  • SDRAM synchronous DRAM
  • CAS posted column access strobe
  • a synchronous DRAM operating in synchronization with a clock signal.
  • the SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting a column of the memory bank, a column address input port for inputting a column address that selects the column of the memory bank, a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder, and a delay counter for sensing the number of clock cycles RCL of the clock signal from the application of the row access command to the application of the column access command with respect to the same bank, and for providing a first delay clock control signal to the first shift register.
  • the first delay clock control signal has information on the difference between RCL and (RL min ⁇ CL min ), and the first number of delay clock cycles is determined in response to the difference between RCL and (RL min ⁇ CL min ).
  • the first shift register my comprise a plurality of registers serially coupled to each other for continuously transmitting the column address in response to the clock signal of every period, and a multiplexer for selectively providing one signal among the output signals of the plurality of registers to the column decoder.
  • the registers are preferably D flip-flops.
  • the delay counter may comprise a down counter for reducing the value of (RL min ⁇ CL min ) by 1 in response to the clock signal, a register for providing a first delay clock control signal having information on an output value stored as an output value of the down counter when the column access command is generated or an output value of the down counter having the value of 0 to the first shift register after the row access command is generated, a clock controller that is disabled when the output value of the down counter is 0, for providing a first clock control signal which is enabled by the generation of the row access command and responds to the clock signal to the down counter, and a logic unit disabled by the generation of the column access command, for providing a second clock control signal that is enabled by the generation of the row access command and responds to the first clock control signal.
  • the delay counter may further comprise an RCL measuring unit for providing an output signal activated by the generation of the row access command and disabled by the generation of the column access command to the logic unit.
  • the synchronous DRAM may further comprise a second shift register for delaying the output data of a selected memory cell by CL min , and a buffer for buffering the output signal of the second shift register and delaying the output signal of the second shift register by a second number of delay clock cycles in response to a second predetermined delay clock control signal.
  • the SDRAM may further comprising a buffer controller for generating a second delay clock control signal for controlling the buffer.
  • the buffer controller itself may comprise a first register for delaying the column access command by the second number of delay clock cycles and outputting the delayed column access command, every cycle of the clock signal, and a second register for delaying the output signal of the first register by CL min and generating a second delay control signal for controlling the buffer.
  • a synchronous DRAM (SDRAM) operating in synchronization with a clock signal comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting a column of the memory bank, a pair of bit lines for outputting data from the selected column, a sense amplifier for amplifying the data of the bit lines, a column address input port for inputting a column address for selecting the column of the memory bank, a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder, and a delay counter for providing a first delay clock control signal having information on the difference between RCL and SAE to the first shift register.
  • SDRAM synchronous DRAM
  • RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the same bank
  • SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled are determined
  • the first number of delay clock cycles is determined in response to the difference between RCL and SAE.
  • the first shift register may comprise a plurality of registers serially coupled to each other, for continuously transmitting the column address every cycle of the clock signal, and a multiplexer for selectively providing one signal among the output signals of the registers to the column decoder in response to the difference between RCL and SAE.
  • the registers are D flip-flops.
  • the delay counter may comprise a first counting circuit for counting SAE and generating a first number of clock cycles, a second counting circuit for counting RCL and generating a second number of clock cycles, and a subtracter for calculating a third number of clock cycles by subtracting the first number of clock cycles from the second number of clock cycles and using 0 as the third number of clock cycles when the first number of clock cycles is larger than the second number of clock cycles.
  • the first counting circuit may comprise a first logic latch unit for generating a first logic latch output signal activated by the generation of the row access command and deactivated by the activation of the sense amplifier enable signal, and a first counter enabled in a period when the first logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of first clock cycles.
  • the second counting circuit may comprise a second logic latch unit for generating a second logic latch output signal activated by the generation of the row access command and deactivated by the generation of the column access command, and a second counter enabled in a period where the second logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of second clock cycles.
  • the delay counter may comprise a logic unit for generating a logic output signal that is activated in response to the generation of the column access command and is deactivated in response to a sense amplifier enable signal, the logic output signal operating to enable the sense amplifier, and a clock counter for counting the number of clock cycles of the clock signal generated in a period where the output signal of the logic unit is activated.
  • the synchronous DRAM may further comprise a second shift register for delaying the output data of the memory cell by CL min , where CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell, and a buffer for buffering the output signal of the second shift register, and for delaying the output signal of the second shift register by the first number of delay clock cycles in response to a second delay clock control signal.
  • CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell
  • a buffer for buffering the output signal of the second shift register, and for delaying the output signal of the second shift register by the first number of delay clock cycles in response to a second delay clock control signal.
  • the synchronous DRAM may further comprise a buffer controller for generating a second delay clock control signal for controlling the buffer.
  • the buffer controller may itself comprise a first register for delaying the column access command by the first number of delay clock cycles and outputting the delayed column access command, and a second register for generating a second delay control signal for delaying the output signal of the first register by the first number of delay clock cycles and controlling the buffer every cycle of the clock signal.
  • the first delay clock signal is preferably provided from outside of the SDRAM.
  • a synchronous DRAM (SDRAM) synchronized with a clock signal after predetermined column access strobe (CAS) latency has lapsed from a column access command is also provided.
  • SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, and a decoder for selecting one of the memory cells based on a column address and a row address.
  • the CAS latency is determined by the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank.
  • a synchronous DRAM comprising a memory bank having a plurality of memory cells arranged in rows and columns, and a decoder for selecting one of the memory cells based on a column address and a row address.
  • RL min is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell
  • CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell
  • RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank.
  • a CAS latency which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined to be (RL min ⁇ RCL) when RCL is less than (RL min ⁇ CL min ), and is determined to be CL min when RCL is not less than (RL min ⁇ CL min ).
  • the quantity (RL min ⁇ CL min ) is preferably input from the outside of the SDRAM.
  • a synchronous DRAM (SDRAM), operating in synchronization with a clock signal, is also provided.
  • SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting the column of the memory bank, a pair of bit lines for outputting data from a selected memory cell, and a sense amplifier for amplifying the data of the pair of bit lines.
  • RL min is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell
  • CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell
  • RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank
  • SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled.
  • the CAS latency which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined by the difference between RCL and SAE.
  • the CAS latency is preferably determined to be (RL min ⁇ RCL) when RCL is less than SAE and the difference between RCL and SAE is no less than the predetermined number of reference clock cycles, and is determined to be CL min when RCL is no less than SAE and the difference between RCL and SAE is no more than the number of reference clock cycles.
  • a method of controlling CAS latency of an SDRAM, synchronized with a clock signal, that includes a memory bank having a plurality of memory cells arranged in rows and columns and outputs the data of a selected memory cell is also provided.
  • the method comprises inputting a quantity (RL min ⁇ CL min ) from the outside of the SDRAM, where RL min is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell, and CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell, comparing RCL with (RL min ⁇ CL min ), where RCL is a number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank, determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RL min ⁇ RCL)
  • a of controlling CAS latency of an SDRAM which includes a bank having a plurality of memory cells arranged in rows and columns that outputs the data of a selected memory cell in synchronization with the clock signal.
  • the method comprises sensing RCL, where RCL is the number of clock cycles of the clock signal from an application of a row access command to an application of a column access command, sensing SAE, where SAE is the number of clock cycles of the clock signal from the application of the row access command to a point of time at which a sense amplifier is enabled, comparing RCL with SAE, determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RL min ⁇ RCL) when RCL is less than SAE and the difference between RCL and SAE is not less than a predetermined number of reference clock cycles, and determining the CAS latency to be CL min when RCL is not less than SAE or the difference between RCL and SAE is less than the predetermined number
  • RL min is the minimum number of clock cycles of a clock signal required from the application of a row access command to the output of the data of the selected memory cell
  • CL min is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell.
  • a posted CAS latency operation and a general CAS latency operation can be appropriately performed by the SDRAM without a mode register set (MRS) command.
  • MRS mode register set
  • FIG. 1 is a block diagram schematically showing a synchronous DRAM (SDRAM) having a posted column access strobe (CAS) latency according to a first preferred embodiment of the present invention
  • SDRAM synchronous DRAM
  • CAS posted column access strobe
  • FIG. 2 is a detailed circuit diagram showing the counter of FIG. 1;
  • FIG. 3 is a detailed circuit diagram showing the buffer controller of FIG. 1;
  • FIG. 4 is a timing diagram of the main terminal of the SDRAM in a posted CAS command mode according to the first preferred embodiment
  • FIG. 5 is a timing diagram of the main terminal of the SDRAM in a general CAS command mode according to the first preferred embodiment
  • FIG. 6 is a flowchart describing a method of controlling CAS latency using the SDRAM according to the first preferred embodiment
  • FIG. 7 is a block diagram schematically showing an SDRAM having a posted CAS latency according to a second preferred embodiment of the present invention.
  • FIG. 8 is a detailed circuit diagram showing a first design for the counter of FIG. 7;
  • FIG. 9 is a detailed circuit diagram showing the first sense signal generator of FIG. 8;
  • FIG. 10 is a detailed circuit diagram showing the second sense signal generator of FIG. 8;
  • FIG. 11 is another detailed circuit diagram showing a second design for the counter of FIG. 7;
  • FIG. 12 is a flowchart describing a method of controlling CAS latency using an SDRAM according to a second preferred embodiment.
  • FIG. 13 is a view for describing latency from the application of a general row access command or a general column access command to the output of data.
  • Structural elements related to the output of data from a general synchronous DRAM (SDRAM) and a data output operation are as follows.
  • the SDRAM has a plurality of memory banks.
  • Each memory bank includes a plurality of memory cells arranged in rows and columns.
  • a row decoder for selecting rows and a column decoder for selecting columns are included in order to select a specific memory cell from among the plurality of memory cells included in one memory bank.
  • the data of the memory cells of the row selected by the row decoder are then output to a pair of bit lines, and the output data is amplified by a sense amplifier.
  • the amplified data of the pair of bit lines corresponding to a selected column is then output to a data input and output line through a transmission switch.
  • the transmission switch is selectively turned on by a decoded column address input through a column decoder.
  • the data sent to the input and output line is provided to the outside through an output buffer.
  • the output operation of the SDRAM is preferably controlled in synchronization with the clock signal input from the outside.
  • FIG. 1 is a block diagram schematically showing an SDRAM having posted column access strobe (CAS) latency according to a first preferred embodiment of the present invention. Elements related to the present invention are shown.
  • the SDRAM according to the first preferred embodiment includes a column address input port N 1 , a first shift register 103 , a column decoder 109 , a counter 115 , and a memory cell bank 105 .
  • the memory cell bank 105 includes a plurality of memory cells arranged in rows and columns, although only one is specifically shown in the specification.
  • the column decoder 109 operates to select a column of the memory cell bank 105 .
  • the column address input port N 1 receives a column address CA for selecting the column of the bank 105 .
  • the first shift register 103 delays the column address CA input through the column address input port N 1 by a number of delay clock cycles T D1 and provides the delayed column address to the column decoder 109 .
  • the number of delay clock cycles T D1 satisfies Equation 5.
  • T D1 ( RL min ⁇ CL min ) ⁇ RCL (5)
  • RL min represents the minimum number of clock cycles of a clock signal CLK required from the application of a row access command to the output of data from the memory cell
  • CL min represents the minimum number of clock cycles of the clock signal CLK required from the application of a column access command to the output of data from the memory cell
  • RCL represents the number of clock cycles of the clock signal CLK from the application of the row access command to the application of the column access command with respect to the same memory bank.
  • the first shift register 103 preferably includes a plurality of registers 103 a, 103 b, and 103 c, and a multiplexer 103 x.
  • the registers 103 a, 103 b, and 103 c are serially coupled to each other and sequentially transmit the column address CA in response to the clock signal CLK. In operation, the column address CA is transmitted to the next register every clock cycle of the clock signal CLK.
  • the multiplexer 103 x provides one signal selected in response to a first delay clock control signal DCC, output from the counter 115 , to the column decoder 109 , using the output signals of the column address input port N 1 and the registers 103 a, 103 b, and 103 c as input signals.
  • the number of registers included in the first shift register 103 can be varied, although only three registers are shown in the present specification. According to the first preferred embodiment, the registers 103 a, 103 b, and 103 c are D flip-flops.
  • the counter 115 senses the RAS-CAS latency (RCL) and provides the first delay clock control signal DCC 1 , which includes information on the difference between RCL and (RL min ⁇ CL min ), to the multiplexer 103 x of the first shift register 103 .
  • the value of (RL min ⁇ CL min ) can be input from the outside of the SDRAM through an MRS command.
  • the structure and operation of the counter 115 will be described in detail with reference to FIG. 2 .
  • the SDRAM according to the first preferred embodiment shown in FIG. 1 further includes a sense amplifier 107 , a second shift register 111 , and a buffer 113 .
  • the sense amplifier 107 controls the transmission of the data output from the memory cell. In particular, it amplifies the data of the memory cell, which is output via a pair of bit lines.
  • the second shift register 111 delays the output data of the memory cell by CL min and provides the delayed output data to the buffer 113 . Since the second shift register 111 has the same structure and operation as the first shift register 103 , a detailed description of the second shift register 111 will be omitted.
  • the multiplexer 111 x of the second shift register 111 is preferably controlled by CL min .
  • the buffer 113 buffers an output signal S 1 of the second shift register 111 and delays the output signal S 1 of the second shift register 111 by the number of delay clock cycles T D1 , in response to a second delay clock control signal DCC 2 .
  • the first embodiment of the SDRAM further includes a buffer controller 117 for generating the second delay clock control signal DCC 2 that controls the buffer 113 .
  • the structure and operation of the buffer controller 117 will be described in detail with reference to FIG. 3 .
  • An AND gate 119 is further provided in the first preferred embodiment.
  • the AND gate 119 is enabled by a counting stop signal STOP described as follows in relation to FIG. 2, and operates to generate a column control signal CLCON in response to the clock signal CLK.
  • the column control signal CLCON controls the operation of the column decoder 109 .
  • FIG. 2 is a detailed circuit diagram showing the counter 115 of FIG. 1 .
  • the counter 115 includes a down counter 201 , a register 203 , a clock controller 205 , a logic unit 207 , and an RCL measuring unit 209 .
  • the down counter 201 receives RCL min , which is the value of (RL min ⁇ CL min ), and generates an output signal DOWN having the value obtained by reducing RCL min by 1 in response to a first clock control signal CKCON 1 , which is the output signal of the clock controller 205 .
  • the register 203 stores the output signal DOWN of the down counter 201 in response to a second clock control signal CKCON 2 , which is output from the logic unit 207 , and provides the first delay clock control signal DCC 1 to the first shift register 103 (refer to FIG. 1 ).
  • the clock controller 205 is enabled by the generation of the row access command and provides the first clock control signal CKCON 1 which responds to the clock signal CLK, to the down counter 201 .
  • the clock controller 205 is disabled when the value of the output signal DOWN of the down counter 201 corresponds to logic “0.” This is true because the stop signal STOP is the output signal of a logic circuit that receives the signal DOWN.
  • the stop signal STOP is enabled when the signal DOWN is logic “0.”
  • the clock controller 205 preferably comprises an inverter 205 a and an AND gate 205 b.
  • the inverter 205 a inverts the counting stop signal STOP, which is activated to high when the value of the output signal DOWN of the down counter 201 corresponds to 0.
  • the AND gate 205 b performs an AND operation on a row access signal RACC, a clock signal CLK, and an output signal S 2 of the inverter 205 a and generates the first clock control signal CKCON 1 .
  • the row access signal RACC is activated to high when a row access command is generated. Therefore, the first clock control signal CKCON 1 responds to the clock signal CLK after the row access command is generated. However, the first clock control signal CKCON 1 is maintained at a low level after the output signal DOWN of the down counter 201 corresponds to 0.
  • the RCL measuring unit 209 receives the row access signal RACC and a column access signal CACC and generates a RCL measuring signal RCLM which is output to the logic unit 207 .
  • the column access signal CACC is activated to logic high when a column access command is generated.
  • the RCL measuring signal RCLM is activated by the generation of the row access command and is disabled by the generation of the column access command.
  • the RCL measuring unit 209 preferably comprises two invertors 209 a and 209 d and two NAND gates 209 b and 209 c.
  • the inverter 209 a inverts the column access signal CACC.
  • the two NAND gates 209 b and 209 c receive the row access signal RACC and the output signal of the inverter 209 a as input signals, respectively, and are cross-coupled to each other.
  • the inverter 209 d inverts the output signal of the NAND gate 209 b and generates the RCL measuring signal RCLM.
  • the RCL measuring signal RCLM is activated by the generation of the row access command and is disabled by the generation of the column access command.
  • the logic unit 207 performs an OR operation on the first clock control signal CKCON 1 and the RCL measuring signal RCLM to generate an output signal CKCON 2 , which is provided to the clock port of the register 203 .
  • the logic unit 207 is preferably realized by a NOR gate.
  • the counter 115 shown in FIG. 2 receives RCL min , the row access signal RACC, the column access signal CACC, and the clock signal CLK, and generates the first delay clock control signal DCC 1 , which has information on (RCL min ⁇ RCL).
  • the first delay clock control signal DCC 1 has the same information as for the case where (RCL min ⁇ RCL) is 0.
  • FIG. 3 is a detailed circuit diagram showing the buffer controller 117 of FIG. 1 .
  • the buffer controller 117 preferably includes a first register 301 and a second register 303 .
  • the internal clock signal ICLK is preferably generated in response to the rising edge of the clock signal CLK.
  • the first register 301 has the same structure and operation as the first shift register 101 of FIG. 1 .
  • the difference between the first register 301 and the first shift register 101 is in that the first register 301 delays the column access signal CACC by the number of delay clock cycles T D1 , while the first shift register 103 delays the column address CA by the number of delay clock cycles T D1 .
  • the second register 303 preferably delays the output signal N 3 of the first register 301 by the delay clock cycles CL min , i.e., the minimum CAS latency, and outputs the delayed output signal as the second delay clock control signal DCC 2 .
  • the second register 303 preferably has the same structure and operation as the second shift register 111 of FIG. 1 .
  • the difference between the second register 303 and the second shift register 111 is in that the second register 303 delays the output signal N 3 of the first register 301 by CL min while the second shift register 111 delays the output data of the memory cell by CL min .
  • FIG. 4 is a timing diagram of a posted CAS command in the main terminal of the SDRAM according to the first preferred embodiment.
  • RCL min is 4
  • CL min is 4
  • RCL is 2.
  • RCL is less than RCL min
  • the CAS latency CL is changed to 6.
  • an appropriate data output operation is performed.
  • FIG. 5 is a timing diagram of a general CAS command in the main terminal of the SDRAM according to the first preferred embodiment.
  • RCL min is 4
  • CL min is 4
  • RCL is 6.
  • the CAS latency CL becomes 4 , which is equal to CL min .
  • an appropriate data output operation is performed without loss of the CAS latency.
  • FIG. 6 is a flowchart describing a method of controlling the CAS latency using the SDRAM according to the first preferred embodiment. The method of controlling the CAS latency will be described with reference to FIG. 6 .
  • a value for RCL min is received from the outside of the SDRAM (step 603 ). Then, RCL is measured (step 605 ), and RCL is compared with RCL min (step 607 ). When RCL is less than RCL min , CL is determined to be (RL min ⁇ RCL) (step 609 ). When RCL is not less than RCL min , CL is determined to be CL min (step 611 ).
  • FIG. 7 is a block diagram schematically showing a SDRAM having posted CAS latency according to a second preferred embodiment of the present invention. Elements related to the present invention are shown in FIG. 7 .
  • the same reference numerals will be used for signals that perform the same functions as corresponding signals in the first preferred embodiment of FIG. 1 .
  • the second preferred embodiment shown in FIG. 7 has a similar structure and operation as the first preferred embodiment of FIG. 1 . Therefore, for the convenience of explanation, in the second preferred embodiment, only the parts whose structure and operation are different from the structure and operation of the corresponding parts of the first preferred embodiment will be described.
  • a counter 715 for generating the first delay clock control signal DCC 1 is different from the counter 115 of FIG. 1 .
  • the counter 715 senses RCL and the information SAE and provides the first delay clock control signal DCC 1 having information on the difference between RCL and the information SAE to a multiplexer 103 x of a first shift register 103 .
  • the first delay clock control signal can be directly applied from the outside through means such as an MRS.
  • the information SAE is the number of clock cycles of the clock signal CLK from the application of the row access command to the point of time at which a sense amplifier 107 is enabled. SAE is preferably measured inside the SDRAM.
  • the number of delay clock cycles T D2 is generated by delaying the column address CA in the first shift register 103 .
  • the number of delay clock cycles T D2 must satisfy Equation 6.
  • FIG. 8 is a detailed circuit diagram showing a first design for the counter 715 of FIG. 7 .
  • the counter 715 includes a first counting circuit 801 , a second counting circuit 803 , a subtracter 805 , a first sense signal generator 807 , and a second sense signal generator 809 .
  • the first counting circuit 801 counts SAE and generates the number of first clock cycles CNT 1 .
  • the second counting circuit 803 counts RCL and generates the number of second clock cycles CNT 2 .
  • the subtracter 805 subtracts the number of first clock cycles CNT 1 from the number of second clock cycles CNT 2 and generates the first delay clock control signal DCC 1 .
  • the first delay clock control signal DCC 1 has information of logic 0.
  • the first counting circuit 801 includes a logic latch unit and a counter 801 c.
  • the logic latch unit comprises two NAND gates 801 a and 801 b.
  • the NAND gates 801 a and 801 b use a row sense signal/RS and a sense amplifier sense signal/SAS as inputs, respectively.
  • the NAND gates 801 a and 801 b are preferably cross-coupled to each other.
  • the row sense signal/RS is generated in the form of a pulse in response to the rising transition of the row access signal RACC.
  • the sense amplifier sense signal/SAS is generated in the form of a pulse in response to the rising transition of the sense amplifier enable signal SAE, which instructs that a sense amplifier 107 (refer to FIG. 7) be enabled.
  • an output signal S 4 of the logic latch unit is activated by the generation of the row access command and is deactivated by the activation of the sense amplifier enable signal SAE.
  • the counter 801 c is enabled in a period where the output signal S 4 of the NAND gates 801 a and 801 b is activated.
  • the counter 801 c counts the number of clock cycles of the clock signal CLK generated in the activation period, and provides the number of first clock cycles CNT 1 to the subtracter 805 .
  • the number of first clock cycles CNT 1 is the number of clock cycles SAE of the clock signal CLK from the application of the row access command to the point of time at which a sense amplifier 107 is enabled.
  • the second counting circuit 803 includes a logic latch unit and a counter 803 c.
  • the logic latch unit comprise two NAND gates 803 a and 803 b.
  • the NAND gates 803 a and 803 b use the row sense signal/RS and a column sense signal/CS as input signals, respectively.
  • the NAND gates 803 a and 803 b are also cross-coupled to each other.
  • the column sense signal/CS is generated in the form of a pulse in response to the rising transition of the column access signal CACC. Therefore, an output signal S 5 of the logic latch unit is activated by the generation of the row access command and is deactivated according to the activation of the column access signal CACC.
  • the counter 803 c is enabled during a period in which the output signal S 4 of the logic latch units 803 a and 803 b counts the number of clock cycles of the clock signal CLK generated in the activation period, and provides the number of second clock cycles CNT 2 to the subtracter 805 .
  • the number of second clock cycles CNT 2 is the number of clock cycles RCL of the clock signal CLK from the application of the row access command to the application of the column access command with respect to the same memory bank.
  • the first sense signal generator 807 of FIG. 8 is a circuit for generating the row sense signal/RS or the column sense signal/CS in response to the row access signal RACC or the column access signal CACC.
  • the detailed structure of the first sense signal generator 807 will be described with reference to FIG. 9 .
  • the second sense signal generator 809 of FIG. 8 is a circuit for generating the sense amplifier sense signal/SAS in response to the sense amplifier enable signal SAE. The detailed structure of the second sense signal generator 809 will be described with reference to FIG. 10 .
  • FIG. 9 is a detailed circuit diagram showing the first sense signal generator 807 of FIG. 8 .
  • both the row sense signal/RS and the column sense signal/CS are generated as a pulse in response to the row access signal RACC or the column access signal CACC.
  • FIG. 10 is a circuit diagram showing the second sense signal generator 809 of FIG. 8 in detail.
  • the sense amplifier sense signal/SAS is generated as a pulse in response to the sense amplifier enable signal SAE.
  • the response of the sense amplifier sense signal/SAS to the sense amplifier enable signal SAE is delayed by a delay time T DEL by a delayer 1001 .
  • the delay time T DEL is preferably a time taken from the generation of the column access command to the turning on of the transmission switch for transmitting data of the pair of bit lines to the input and output line.
  • the delay time T DEL is also the time taken for the clock signal CLK to generate the required number of reference clock cycles T 1 .
  • FIG. 11 is detailed circuit diagram of a second design for the counter 715 of FIG. 7 .
  • the counter 715 of FIG. 11 includes a logic unit 1101 , a counter 1103 , a first sense signal generator 1107 , and a second sense signal generator 1109 .
  • the logic unit 1101 includes three NAND gates 1101 a, 1101 b, and 1101 c.
  • the NAND gate 1101 a generates an output signal S 6 activated by the generation of the row access command and the column access command.
  • the NAND gates 1101 b and 1101 c use the output signal S 6 of the NAND gate 1101 a and the sense amplifier sense signal/SAS as input signals, respectively.
  • the NAND gates 1101 b and 1101 c are also cross-coupled to each other. Therefore, an output signal S 7 of the logic unit 1101 is activated in response to the generation of the column access command and is deactivated in response to the sense amplifier enable signal SAE.
  • the counter 1103 counts the number of clock cycles of the clock signal CLK generated in the activation period of the output signal S 7 .
  • the first and second sense signal generators 1107 and 1109 of FIG. 11 can be implemented using the first and second signal generators 807 and 809 of FIG. 8 . Therefore, a detailed description of the first and second signal generators 1107 and 1109 of FIG. 11 is omitted in this specification.
  • FIG. 12 is a flow chart showing the method of controlling CAS latency using the SDRAM according to the second preferred embodiment.
  • the method of controlling CAS latency is described as follows.
  • RCL and SAE are both measured inside the SDRAM (step 1203 ), and RCL is then compared with SAE (step 1205 ). If RCL is less than SAE and the difference between RCL and SAE is no less than the number of reference clock cycles T 1 , the CAS latency CL is determined to be (RL min ⁇ RCL) in step 1207 . If RCL is not less than SAE or the difference between RCL and SAE is less than the number of reference clock cycles T 1 , then the CAS latency CL is determined to CL min (step 1209 ).
  • the SDRAM according to the first preferred embodiment of the present invention receives RCL min from the outside of the SDRAM through the MRS, compares RCL with RCL min , and controls the CAS latency CL according to the comparison result.
  • the SDRAM according to the second preferred embodiment is different from the SDRAM of the first preferred embodiment in that the SDRAM measures RCL and SAE, compares RCL with SAE, and controls the CAS latency CL according to the comparison result.

Abstract

A synchronous DRAM (SDRAM) having a posted column access strobe (CAS) latency and a method of controlling CAS latency are provided. In order to control a delay time from the application of a CAS command and a column address to the beginning of memory, reading or writing operations in units of clock cycles, a first method of programing the delay time as a mode register set (MRS) and a second method of detecting the delay time using an internal signal and an external signal, are provided. In the second method, the SDRAM can include a counter for controlling the CAS latency. This counter controls the CAS latency of the SDRAM by generating a signal for controlling the CAS latency according to the number of clock cycles of a clock signal from the generation of a row access command to a column access command in the same memory bank and reading the signal. It is therefore possible to appropriately perform a posted CAS latency operation and a general CAS latency operation by the SDRAM without an additional MRS command according to this SDRAM and the method of controlling the CAS latency.

Description

This application relies for priority upon Korean Patent Application Nos. 99-6939 and 99-20821, filed on Mar. 3, 1999, and Jun. 5, 1999, respectively, the contents of which are herein incorporated by reference in their entirety.
BACKGROUND OF THE INVENTION
The present invention relates to a synchronous DRAM (SDRAM). More particularly, the present invention relates to an SDRAM having a column access strobe (CAS) latency, as well as a method for controlling the CAS latency.
In general, an SDRAM is synchronized with a clock signal input from outside the circuit and so the read or write operation of the SRAM is controlled. FIG. 13 describes the latency from the application of a row access command or a column access command to the output of data.
The number of clock cycles of an external clock signal from the application of a row access command to the output of first data is called the RAS latency (RL). The number of clock cycles of the external clock signal from the application of a column access command to the output of the first data is called the CAS latency (CL). The number of clock cycles of the external clock signal from the application of the row access command to the application of the column access command with respect to the same memory bank is called the RAS-CAS latency (RCL). The relationship between RCL, RL, and CL is shown in Equation 1.
RL=RCL+CL  (1)
When the minimum value of the RAS latency in the frequency of a specific external clock signal is RLmin, then RL must satisfy Equation 2.
RL≧RL min  (2)
When the minimum value of the CAS latency in the frequency of the specific external clock signal is CLmin, then RCLmin (the minimum RAS-CAS latency) is expressed as shown in Equation 3.
RCL min =RL min −CL min  (3)
In a system using an SDRAM, a function of normally outputting data even when RCL<RCLmin, namely, in posted CAS latency, is required in order to improve the performance of the system. In this application, posted CAS latency refers to the fact that the CAS command comes earlier than the conventional RCLmin. In other words,RL≧RLmin, which is generally the product specification, must be satisfied even when RCL<RCLmin. In order to satisfy the equality RL≧RLmin in the posted CAS latency, the CAS latency CL must satisfy Equation 4
CL>CL min+(RCL min −RCL)  (4)
In a conventional SDRAM, since the specification of (RCLmin−RCL)<0 is required, it is enough to determine the CL, which guarantees the minimum CAS latency CLmin by a mode register set (MRS) command. However, in a posted CAS state, it is possible to input a CAS command (including a column address command), which controls an appropriate delay time and the latency of a data path only when each of the values in Equation 4, i.e., (RCLmin−RCL) and CLmin, are known.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a synchronous DRAM (SDRAM) by which it is possible to perform a posted column access strobe (CAS) command.
It is another object of the present invention to provide a method for outputting data using the SDRAM.
Accordingly, to achieve the first object, A synchronous DRAM (SDRAM), operating in synchronization with a clock signal, is provided. The SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting a column of the memory bank, a column address input port for inputting a column address that selects the column of the memory bank, a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder, and a delay counter for sensing the number of clock cycles RCL of the clock signal from the application of the row access command to the application of the column access command with respect to the same bank, and for providing a first delay clock control signal to the first shift register. RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the memory, and CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell. The first delay clock control signal has information on the difference between RCL and (RLmin−CLmin), and the first number of delay clock cycles is determined in response to the difference between RCL and (RLmin−CLmin).
The first shift register my comprise a plurality of registers serially coupled to each other for continuously transmitting the column address in response to the clock signal of every period, and a multiplexer for selectively providing one signal among the output signals of the plurality of registers to the column decoder. The registers are preferably D flip-flops.
The delay counter may comprise a down counter for reducing the value of (RLmin−CLmin) by 1 in response to the clock signal, a register for providing a first delay clock control signal having information on an output value stored as an output value of the down counter when the column access command is generated or an output value of the down counter having the value of 0 to the first shift register after the row access command is generated, a clock controller that is disabled when the output value of the down counter is 0, for providing a first clock control signal which is enabled by the generation of the row access command and responds to the clock signal to the down counter, and a logic unit disabled by the generation of the column access command, for providing a second clock control signal that is enabled by the generation of the row access command and responds to the first clock control signal. The delay counter may further comprise an RCL measuring unit for providing an output signal activated by the generation of the row access command and disabled by the generation of the column access command to the logic unit.
The synchronous DRAM may further comprise a second shift register for delaying the output data of a selected memory cell by CLmin, and a buffer for buffering the output signal of the second shift register and delaying the output signal of the second shift register by a second number of delay clock cycles in response to a second predetermined delay clock control signal.
The SDRAM may further comprising a buffer controller for generating a second delay clock control signal for controlling the buffer. The buffer controller itself may comprise a first register for delaying the column access command by the second number of delay clock cycles and outputting the delayed column access command, every cycle of the clock signal, and a second register for delaying the output signal of the first register by CLmin and generating a second delay control signal for controlling the buffer.
A synchronous DRAM (SDRAM) operating in synchronization with a clock signal, is also provided. The SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting a column of the memory bank, a pair of bit lines for outputting data from the selected column, a sense amplifier for amplifying the data of the bit lines, a column address input port for inputting a column address for selecting the column of the memory bank, a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder, and a delay counter for providing a first delay clock control signal having information on the difference between RCL and SAE to the first shift register. RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the same bank; SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled are determined; and the first number of delay clock cycles is determined in response to the difference between RCL and SAE.
The first shift register may comprise a plurality of registers serially coupled to each other, for continuously transmitting the column address every cycle of the clock signal, and a multiplexer for selectively providing one signal among the output signals of the registers to the column decoder in response to the difference between RCL and SAE. Preferably, the registers are D flip-flops.
The delay counter may comprise a first counting circuit for counting SAE and generating a first number of clock cycles, a second counting circuit for counting RCL and generating a second number of clock cycles, and a subtracter for calculating a third number of clock cycles by subtracting the first number of clock cycles from the second number of clock cycles and using 0 as the third number of clock cycles when the first number of clock cycles is larger than the second number of clock cycles.
The first counting circuit may comprise a first logic latch unit for generating a first logic latch output signal activated by the generation of the row access command and deactivated by the activation of the sense amplifier enable signal, and a first counter enabled in a period when the first logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of first clock cycles. The second counting circuit may comprise a second logic latch unit for generating a second logic latch output signal activated by the generation of the row access command and deactivated by the generation of the column access command, and a second counter enabled in a period where the second logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of second clock cycles.
The delay counter may comprise a logic unit for generating a logic output signal that is activated in response to the generation of the column access command and is deactivated in response to a sense amplifier enable signal, the logic output signal operating to enable the sense amplifier, and a clock counter for counting the number of clock cycles of the clock signal generated in a period where the output signal of the logic unit is activated.
The synchronous DRAM may further comprise a second shift register for delaying the output data of the memory cell by CLmin, where CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell, and a buffer for buffering the output signal of the second shift register, and for delaying the output signal of the second shift register by the first number of delay clock cycles in response to a second delay clock control signal.
The synchronous DRAM may further comprise a buffer controller for generating a second delay clock control signal for controlling the buffer. The buffer controller may itself comprise a first register for delaying the column access command by the first number of delay clock cycles and outputting the delayed column access command, and a second register for generating a second delay control signal for delaying the output signal of the first register by the first number of delay clock cycles and controlling the buffer every cycle of the clock signal. The first delay clock signal is preferably provided from outside of the SDRAM.
A synchronous DRAM (SDRAM) synchronized with a clock signal after predetermined column access strobe (CAS) latency has lapsed from a column access command, is also provided. The SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, and a decoder for selecting one of the memory cells based on a column address and a row address. The CAS latency is determined by the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank.
A synchronous DRAM (SDRAM) is also provided, comprising a memory bank having a plurality of memory cells arranged in rows and columns, and a decoder for selecting one of the memory cells based on a column address and a row address. RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell; CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell; and RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank. A CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined to be (RLmin−RCL) when RCL is less than (RLmin−CLmin), and is determined to be CLmin when RCL is not less than (RLmin−CLmin). The quantity (RLmin−CLmin) is preferably input from the outside of the SDRAM.
A synchronous DRAM (SDRAM), operating in synchronization with a clock signal, is also provided. The SDRAM comprises a memory bank having a plurality of memory cells arranged in rows and columns, a column decoder for selecting the column of the memory bank, a pair of bit lines for outputting data from a selected memory cell, and a sense amplifier for amplifying the data of the pair of bit lines. RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell; CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell; RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank; and SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled. The CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined by the difference between RCL and SAE.
The CAS latency is preferably determined to be (RLmin−RCL) when RCL is less than SAE and the difference between RCL and SAE is no less than the predetermined number of reference clock cycles, and is determined to be CLmin when RCL is no less than SAE and the difference between RCL and SAE is no more than the number of reference clock cycles.
A method of controlling CAS latency of an SDRAM, synchronized with a clock signal, that includes a memory bank having a plurality of memory cells arranged in rows and columns and outputs the data of a selected memory cell, is also provided. The method comprises inputting a quantity (RLmin−CLmin) from the outside of the SDRAM, where RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell, and CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell, comparing RCL with (RLmin−CLmin), where RCL is a number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank, determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RLmin−RCL) when RCL is less than (RLmin−Clmin), and determining the CAS latency to be CLmin when RCL is no less than (RLmin−CLmin).
A of controlling CAS latency of an SDRAM which includes a bank having a plurality of memory cells arranged in rows and columns that outputs the data of a selected memory cell in synchronization with the clock signal, is also provided. The method comprises sensing RCL, where RCL is the number of clock cycles of the clock signal from an application of a row access command to an application of a column access command, sensing SAE, where SAE is the number of clock cycles of the clock signal from the application of the row access command to a point of time at which a sense amplifier is enabled, comparing RCL with SAE, determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RLmin−RCL) when RCL is less than SAE and the difference between RCL and SAE is not less than a predetermined number of reference clock cycles, and determining the CAS latency to be CLmin when RCL is not less than SAE or the difference between RCL and SAE is less than the predetermined number of reference clock cycles. RLminis the minimum number of clock cycles of a clock signal required from the application of a row access command to the output of the data of the selected memory cell; and CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell.
According to the SDRAM and the method for controlling the CAS latency of the present invention, a posted CAS latency operation and a general CAS latency operation can be appropriately performed by the SDRAM without a mode register set (MRS) command.
BRIEF DESCRIPTION OF THE DRAWINGS
The above objects and advantages of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings in which:
FIG. 1 is a block diagram schematically showing a synchronous DRAM (SDRAM) having a posted column access strobe (CAS) latency according to a first preferred embodiment of the present invention;
FIG. 2 is a detailed circuit diagram showing the counter of FIG. 1;
FIG. 3 is a detailed circuit diagram showing the buffer controller of FIG. 1;
FIG. 4 is a timing diagram of the main terminal of the SDRAM in a posted CAS command mode according to the first preferred embodiment;
FIG. 5 is a timing diagram of the main terminal of the SDRAM in a general CAS command mode according to the first preferred embodiment;
FIG. 6 is a flowchart describing a method of controlling CAS latency using the SDRAM according to the first preferred embodiment;
FIG. 7 is a block diagram schematically showing an SDRAM having a posted CAS latency according to a second preferred embodiment of the present invention;
FIG. 8 is a detailed circuit diagram showing a first design for the counter of FIG. 7;
FIG. 9 is a detailed circuit diagram showing the first sense signal generator of FIG. 8;
FIG. 10 is a detailed circuit diagram showing the second sense signal generator of FIG. 8;
FIG. 11 is another detailed circuit diagram showing a second design for the counter of FIG. 7;
FIG. 12 is a flowchart describing a method of controlling CAS latency using an SDRAM according to a second preferred embodiment; and
FIG. 13 is a view for describing latency from the application of a general row access command or a general column access command to the output of data.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention now will be described more fully with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The same reference numerals in different drawings represent the same element.
Structural elements related to the output of data from a general synchronous DRAM (SDRAM) and a data output operation are as follows. The SDRAM has a plurality of memory banks. Each memory bank includes a plurality of memory cells arranged in rows and columns. A row decoder for selecting rows and a column decoder for selecting columns are included in order to select a specific memory cell from among the plurality of memory cells included in one memory bank. The data of the memory cells of the row selected by the row decoder are then output to a pair of bit lines, and the output data is amplified by a sense amplifier.
The amplified data of the pair of bit lines corresponding to a selected column is then output to a data input and output line through a transmission switch. At this time, the transmission switch is selectively turned on by a decoded column address input through a column decoder. The data sent to the input and output line is provided to the outside through an output buffer. The output operation of the SDRAM is preferably controlled in synchronization with the clock signal input from the outside.
First Preferred Embodiment
FIG. 1 is a block diagram schematically showing an SDRAM having posted column access strobe (CAS) latency according to a first preferred embodiment of the present invention. Elements related to the present invention are shown. Referring to FIG. 1, the SDRAM according to the first preferred embodiment includes a column address input port N1, a first shift register 103, a column decoder 109, a counter 115, and a memory cell bank 105.
The memory cell bank 105 includes a plurality of memory cells arranged in rows and columns, although only one is specifically shown in the specification. The column decoder 109 operates to select a column of the memory cell bank 105. The column address input port N1 receives a column address CA for selecting the column of the bank 105. The first shift register 103 delays the column address CA input through the column address input port N1 by a number of delay clock cycles TD1 and provides the delayed column address to the column decoder 109. Here, the number of delay clock cycles TD1 satisfies Equation 5.
T D1=(RL min −CL min)−RCL  (5)
where RLmin represents the minimum number of clock cycles of a clock signal CLK required from the application of a row access command to the output of data from the memory cell; CLmin represents the minimum number of clock cycles of the clock signal CLK required from the application of a column access command to the output of data from the memory cell; and RCL represents the number of clock cycles of the clock signal CLK from the application of the row access command to the application of the column access command with respect to the same memory bank.
The first shift register 103 preferably includes a plurality of registers 103 a, 103 b, and 103 c, and a multiplexer 103 x. The registers 103 a, 103 b, and 103 c are serially coupled to each other and sequentially transmit the column address CA in response to the clock signal CLK. In operation, the column address CA is transmitted to the next register every clock cycle of the clock signal CLK. The multiplexer 103 x provides one signal selected in response to a first delay clock control signal DCC, output from the counter 115, to the column decoder 109, using the output signals of the column address input port N1 and the registers 103 a, 103 b, and 103 c as input signals. The number of registers included in the first shift register 103 can be varied, although only three registers are shown in the present specification. According to the first preferred embodiment, the registers 103 a, 103 b, and 103 c are D flip-flops.
The counter 115 senses the RAS-CAS latency (RCL) and provides the first delay clock control signal DCC1, which includes information on the difference between RCL and (RLmin−CLmin), to the multiplexer 103 x of the first shift register 103. The value of (RLmin−CLmin) can be input from the outside of the SDRAM through an MRS command. The structure and operation of the counter 115 will be described in detail with reference to FIG. 2.
The SDRAM according to the first preferred embodiment shown in FIG. 1 further includes a sense amplifier 107, a second shift register 111, and a buffer 113.
The sense amplifier 107 controls the transmission of the data output from the memory cell. In particular, it amplifies the data of the memory cell, which is output via a pair of bit lines.
The second shift register 111 delays the output data of the memory cell by CLmin and provides the delayed output data to the buffer 113. Since the second shift register 111 has the same structure and operation as the first shift register 103, a detailed description of the second shift register 111 will be omitted. The multiplexer 111 x of the second shift register 111 is preferably controlled by CLmin.
The buffer 113 buffers an output signal S1 of the second shift register 111 and delays the output signal S1 of the second shift register 111 by the number of delay clock cycles TD1, in response to a second delay clock control signal DCC2.
The first embodiment of the SDRAM further includes a buffer controller 117 for generating the second delay clock control signal DCC2 that controls the buffer 113. The structure and operation of the buffer controller 117 will be described in detail with reference to FIG. 3.
An AND gate 119 is further provided in the first preferred embodiment. The AND gate 119 is enabled by a counting stop signal STOP described as follows in relation to FIG. 2, and operates to generate a column control signal CLCON in response to the clock signal CLK. The column control signal CLCON controls the operation of the column decoder 109.
FIG. 2 is a detailed circuit diagram showing the counter 115 of FIG. 1. Referring to FIG. 2, the counter 115 includes a down counter 201, a register 203, a clock controller 205, a logic unit 207, and an RCL measuring unit 209.
The down counter 201 receives RCLmin, which is the value of (RLmin−CLmin), and generates an output signal DOWN having the value obtained by reducing RCLmin by 1 in response to a first clock control signal CKCON1, which is the output signal of the clock controller 205. The register 203 stores the output signal DOWN of the down counter 201 in response to a second clock control signal CKCON2, which is output from the logic unit 207, and provides the first delay clock control signal DCC1 to the first shift register 103 (refer to FIG. 1).
The clock controller 205 is enabled by the generation of the row access command and provides the first clock control signal CKCON1 which responds to the clock signal CLK, to the down counter 201. The clock controller 205 is disabled when the value of the output signal DOWN of the down counter 201 corresponds to logic “0.” This is true because the stop signal STOP is the output signal of a logic circuit that receives the signal DOWN. The stop signal STOP is enabled when the signal DOWN is logic “0.”
The clock controller 205 preferably comprises an inverter 205 a and an AND gate 205 b. The inverter 205 a inverts the counting stop signal STOP, which is activated to high when the value of the output signal DOWN of the down counter 201 corresponds to 0. The AND gate 205 b performs an AND operation on a row access signal RACC, a clock signal CLK, and an output signal S2 of the inverter 205 a and generates the first clock control signal CKCON1.
The row access signal RACC is activated to high when a row access command is generated. Therefore, the first clock control signal CKCON1 responds to the clock signal CLK after the row access command is generated. However, the first clock control signal CKCON1 is maintained at a low level after the output signal DOWN of the down counter 201 corresponds to 0.
When the row access command is generated, an output signal RESET of a reset controller 211 is activated and the down counter 201 is reset. Then, the first clock control signal CKCON1 again responds to the clock signal CLK.
The RCL measuring unit 209 receives the row access signal RACC and a column access signal CACC and generates a RCL measuring signal RCLM which is output to the logic unit 207. Here, the column access signal CACC is activated to logic high when a column access command is generated. The RCL measuring signal RCLM is activated by the generation of the row access command and is disabled by the generation of the column access command.
According to the first embodiment, the RCL measuring unit 209 preferably comprises two invertors 209 a and 209 d and two NAND gates 209 b and 209 c. The inverter 209 a inverts the column access signal CACC. The two NAND gates 209 b and 209 c receive the row access signal RACC and the output signal of the inverter 209 a as input signals, respectively, and are cross-coupled to each other. The inverter 209 d inverts the output signal of the NAND gate 209 b and generates the RCL measuring signal RCLM. As a result of this logic, the RCL measuring signal RCLM is activated by the generation of the row access command and is disabled by the generation of the column access command.
The logic unit 207 performs an OR operation on the first clock control signal CKCON1 and the RCL measuring signal RCLM to generate an output signal CKCON2, which is provided to the clock port of the register 203. The logic unit 207 is preferably realized by a NOR gate.
The counter 115 shown in FIG. 2 receives RCLmin, the row access signal RACC, the column access signal CACC, and the clock signal CLK, and generates the first delay clock control signal DCC1, which has information on (RCLmin−RCL). Here, when (RCLmin−RCL) is less than 0, the first delay clock control signal DCC1 has the same information as for the case where (RCLmin−RCL) is 0.
FIG. 3 is a detailed circuit diagram showing the buffer controller 117 of FIG. 1. Referring to FIG. 3, the buffer controller 117 preferably includes a first register 301 and a second register 303.
The internal clock signal ICLK is preferably generated in response to the rising edge of the clock signal CLK. The first register 301 has the same structure and operation as the first shift register 101 of FIG. 1. The difference between the first register 301 and the first shift register 101 is in that the first register 301 delays the column access signal CACC by the number of delay clock cycles TD1, while the first shift register 103 delays the column address CA by the number of delay clock cycles TD1.
The second register 303 preferably delays the output signal N3 of the first register 301 by the delay clock cycles CLmin, i.e., the minimum CAS latency, and outputs the delayed output signal as the second delay clock control signal DCC2. The second register 303 preferably has the same structure and operation as the second shift register 111 of FIG. 1. The difference between the second register 303 and the second shift register 111 is in that the second register 303 delays the output signal N3 of the first register 301 by CLmin while the second shift register 111 delays the output data of the memory cell by CLmin.
FIG. 4 is a timing diagram of a posted CAS command in the main terminal of the SDRAM according to the first preferred embodiment. In FIG. 4, RCLmin is 4, CLmin is 4, and RCL is 2. When RCL is less than RCLmin, the CAS latency CL is changed to 6. As a result, an appropriate data output operation is performed.
FIG. 5 is a timing diagram of a general CAS command in the main terminal of the SDRAM according to the first preferred embodiment. In FIG. 4, RCLmin is 4, CLmin is 4, and RCL is 6. When RCL is larger than RCLmin, the CAS latency CL becomes 4, which is equal to CLmin. As a result, an appropriate data output operation is performed without loss of the CAS latency.
FIG. 6 is a flowchart describing a method of controlling the CAS latency using the SDRAM according to the first preferred embodiment. The method of controlling the CAS latency will be described with reference to FIG. 6.
Initially, a value for RCLmin is received from the outside of the SDRAM (step 603). Then, RCL is measured (step 605), and RCL is compared with RCLmin (step 607). When RCL is less than RCLmin, CL is determined to be (RLmin−RCL) (step 609). When RCL is not less than RCLmin, CL is determined to be CLmin (step 611).
Second Preferred Embodiment
FIG. 7 is a block diagram schematically showing a SDRAM having posted CAS latency according to a second preferred embodiment of the present invention. Elements related to the present invention are shown in FIG. 7. In the second preferred embodiment of FIG. 7, the same reference numerals will be used for signals that perform the same functions as corresponding signals in the first preferred embodiment of FIG. 1. The second preferred embodiment shown in FIG. 7 has a similar structure and operation as the first preferred embodiment of FIG. 1. Therefore, for the convenience of explanation, in the second preferred embodiment, only the parts whose structure and operation are different from the structure and operation of the corresponding parts of the first preferred embodiment will be described.
In the second preferred embodiment of FIG. 7, a counter 715 for generating the first delay clock control signal DCC1 is different from the counter 115 of FIG. 1. The counter 715 senses RCL and the information SAE and provides the first delay clock control signal DCC1 having information on the difference between RCL and the information SAE to a multiplexer 103 x of a first shift register 103. The first delay clock control signal can be directly applied from the outside through means such as an MRS. The information SAE is the number of clock cycles of the clock signal CLK from the application of the row access command to the point of time at which a sense amplifier 107 is enabled. SAE is preferably measured inside the SDRAM.
The number of delay clock cycles TD2 is generated by delaying the column address CA in the first shift register 103. The number of delay clock cycles TD2 must satisfy Equation 6.
T D2 =RSE−RCL  (6)
The structure and operation of the counter will be described in detail with reference to FIGS. 8 through 11.
FIG. 8 is a detailed circuit diagram showing a first design for the counter 715 of FIG. 7. Referring to FIG. 8, the counter 715 includes a first counting circuit 801, a second counting circuit 803, a subtracter 805, a first sense signal generator 807, and a second sense signal generator 809.
The first counting circuit 801 counts SAE and generates the number of first clock cycles CNT1. The second counting circuit 803 counts RCL and generates the number of second clock cycles CNT2. The subtracter 805 subtracts the number of first clock cycles CNT1 from the number of second clock cycles CNT2 and generates the first delay clock control signal DCC1. However, when the number of second clock cycles CNT2 is less than the number of first clock cycles CNT1, the first delay clock control signal DCC1 has information of logic 0.
The first counting circuit 801 includes a logic latch unit and a counter 801 c. According to the second preferred embodiment, the logic latch unit comprises two NAND gates 801 a and 801 b. The NAND gates 801 a and 801 b use a row sense signal/RS and a sense amplifier sense signal/SAS as inputs, respectively. The NAND gates 801 a and 801 b are preferably cross-coupled to each other. Here, the row sense signal/RS is generated in the form of a pulse in response to the rising transition of the row access signal RACC. The sense amplifier sense signal/SAS is generated in the form of a pulse in response to the rising transition of the sense amplifier enable signal SAE, which instructs that a sense amplifier 107 (refer to FIG. 7) be enabled. As a result of this, an output signal S4 of the logic latch unit is activated by the generation of the row access command and is deactivated by the activation of the sense amplifier enable signal SAE.
The counter 801 c is enabled in a period where the output signal S4 of the NAND gates 801 a and 801 b is activated. The counter 801 c counts the number of clock cycles of the clock signal CLK generated in the activation period, and provides the number of first clock cycles CNT1 to the subtracter 805. As a result, the number of first clock cycles CNT1 is the number of clock cycles SAE of the clock signal CLK from the application of the row access command to the point of time at which a sense amplifier 107 is enabled.
The second counting circuit 803 includes a logic latch unit and a counter 803 c. According to the second preferred embodiment, the logic latch unit comprise two NAND gates 803 a and 803 b. The NAND gates 803 a and 803 b use the row sense signal/RS and a column sense signal/CS as input signals, respectively. The NAND gates 803 a and 803 b are also cross-coupled to each other. Here, the column sense signal/CS is generated in the form of a pulse in response to the rising transition of the column access signal CACC. Therefore, an output signal S5 of the logic latch unit is activated by the generation of the row access command and is deactivated according to the activation of the column access signal CACC.
The counter 803 c is enabled during a period in which the output signal S4 of the logic latch units 803 a and 803 b counts the number of clock cycles of the clock signal CLK generated in the activation period, and provides the number of second clock cycles CNT2 to the subtracter 805. As a result, the number of second clock cycles CNT2 is the number of clock cycles RCL of the clock signal CLK from the application of the row access command to the application of the column access command with respect to the same memory bank.
The first sense signal generator 807 of FIG. 8 is a circuit for generating the row sense signal/RS or the column sense signal/CS in response to the row access signal RACC or the column access signal CACC. The detailed structure of the first sense signal generator 807 will be described with reference to FIG. 9. The second sense signal generator 809 of FIG. 8 is a circuit for generating the sense amplifier sense signal/SAS in response to the sense amplifier enable signal SAE. The detailed structure of the second sense signal generator 809 will be described with reference to FIG. 10.
FIG. 9 is a detailed circuit diagram showing the first sense signal generator 807 of FIG. 8. Referring to FIG. 9, both the row sense signal/RS and the column sense signal/CS are generated as a pulse in response to the row access signal RACC or the column access signal CACC.
FIG. 10 is a circuit diagram showing the second sense signal generator 809 of FIG. 8 in detail. Referring to FIG. 10, the sense amplifier sense signal/SAS is generated as a pulse in response to the sense amplifier enable signal SAE. However, the response of the sense amplifier sense signal/SAS to the sense amplifier enable signal SAE is delayed by a delay time TDEL by a delayer 1001. The delay time TDEL is preferably a time taken from the generation of the column access command to the turning on of the transmission switch for transmitting data of the pair of bit lines to the input and output line. The delay time TDEL is also the time taken for the clock signal CLK to generate the required number of reference clock cycles T1.
FIG. 11 is detailed circuit diagram of a second design for the counter 715 of FIG. 7. The counter 715 of FIG. 11 includes a logic unit 1101, a counter 1103, a first sense signal generator 1107, and a second sense signal generator 1109.
The logic unit 1101 includes three NAND gates 1101 a, 1101 b, and 1101 c. The NAND gate 1101 a generates an output signal S6 activated by the generation of the row access command and the column access command. The NAND gates 1101 b and 1101 c use the output signal S6 of the NAND gate 1101 a and the sense amplifier sense signal/SAS as input signals, respectively. The NAND gates 1101 b and 1101 c are also cross-coupled to each other. Therefore, an output signal S7 of the logic unit 1101 is activated in response to the generation of the column access command and is deactivated in response to the sense amplifier enable signal SAE.
The counter 1103 counts the number of clock cycles of the clock signal CLK generated in the activation period of the output signal S7.
The first and second sense signal generators 1107 and 1109 of FIG. 11 can be implemented using the first and second signal generators 807 and 809 of FIG. 8. Therefore, a detailed description of the first and second signal generators 1107 and 1109 of FIG. 11 is omitted in this specification.
FIG. 12 is a flow chart showing the method of controlling CAS latency using the SDRAM according to the second preferred embodiment. Referring to FIG. 12, the method of controlling CAS latency is described as follows. RCL and SAE are both measured inside the SDRAM (step 1203), and RCL is then compared with SAE (step 1205). If RCL is less than SAE and the difference between RCL and SAE is no less than the number of reference clock cycles T1, the CAS latency CL is determined to be (RLmin−RCL) in step 1207. If RCL is not less than SAE or the difference between RCL and SAE is less than the number of reference clock cycles T1, then the CAS latency CL is determined to CLmin (step 1209).
The SDRAM according to the first preferred embodiment of the present invention receives RCLmin from the outside of the SDRAM through the MRS, compares RCL with RCLmin, and controls the CAS latency CL according to the comparison result. The SDRAM according to the second preferred embodiment is different from the SDRAM of the first preferred embodiment in that the SDRAM measures RCL and SAE, compares RCL with SAE, and controls the CAS latency CL according to the comparison result.
It is possible to appropriately perform the posted CAS latency operation and the general CAS latency operation by the SDRAM according to the SDRAM and according the method of controlling CAS latency of the present invention.
While this invention has been particularly shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (24)

What is claimed is:
1. A synchronous DRAM (SDRAM), operating in synchronization with a clock signal, the SDRAM comprising:
a memory bank having a plurality of memory cells arranged in rows and columns;
a column decoder for selecting a column of the memory bank;
a column address input port for inputting a column address that selects the column of the memory bank;
a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder; and
a delay counter for sensing the number of clock cycles RCL of the clock signal from the application of the row access command to the application of the column access command with respect to the same bank, and for providing a first delay clock control signal to the first shift register,
wherein RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the memory and CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell, and
wherein the first delay clock control signal has information on the difference between RCL and (RLmin−CLmin), and the first number of delay clock cycles is determined in response to the difference between RCL and (RLmin−CLmin).
2. A synchronous DRAM, as recited in claim 1, wherein the first shift register comprises:
a plurality of registers serially coupled to each other for continuously transmitting the column address in response to the clock signal of every period; and
a multiplexer for selectively providing one signal among the output signals of the plurality of registers to the column decoder.
3. A synchronous DRAM, as recited in claim 2, wherein the registers are D flip-flops.
4. A synchronous DRAM, as recited in claim 1, wherein the delay counter comprises:
a down counter for reducing the value of (RLmin−CLmin) by 1 in response to the clock signal;
a register for providing a first delay clock control signal having information on an output value stored as an output value of the down counter when the column access command is generated or an output value of the down counter having the value of 0 to the first shift register after the row access command is generated;
a clock controller that is disabled when the output value of the down counter is 0, for providing a first clock control signal which is enabled by the generation of the row access command and responds to the clock signal to the down counter; and
a logic unit disabled by the generation of the column access command, for providing a second clock control signal that is enabled by the generation of the row access command and responds to the first clock control signal.
5. A synchronous DRAM, as recited in claim 4, the delay counter further comprising an RCL measuring unit for providing an output signal activated by the generation of the row access command and disabled by the generation of the column access command to the logic unit.
6. A synchronous DRAM, as recited in claim 1, further comprising:
a second shift register for delaying the output data of a selected memory cell by CLmin; and
a buffer for buffering the output signal of the second shift register and delaying the output signal of the second shift register by a second number of delay clock cycles in response to a second predetermined delay clock control signal.
7. A synchronous DRAM, as recited in claim 6, the SDRAM further comprising a buffer controller for generating a second delay clock control signal for controlling the buffer, the buffer controller comprising:
a first register for delaying the column access command by the second number of delay clock cycles and outputting the delayed column access command, every cycle of the clock signal; and
a second register for delaying the output signal of the first register by CLmin and generating a second delay control signal for controlling the buffer.
8. A synchronous DRAM (SDRAM) operating in synchronization with a clock signal, the SDRAM comprising:
a memory bank having a plurality of memory cells arranged in rows and columns;
a column decoder for selecting a column of the memory bank;
a sense amplifier for amplifying data from the selected column;
a column address input port for inputting a column address for selecting the column of the memory bank;
a first shift register for delaying the column address by a first number of delay clock cycles between the column address input port and the column decoder; and
a delay counter for providing a first delay clock control signal having information on the difference between RCL and SAE to the first shift register,
wherein RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the same bank,
wherein SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled are determined, and
wherein the first number of delay clock cycles is determined in response to the difference between RCL and SAE.
9. A synchronous DRAM, as recited in claim 8, wherein the first shift register comprises:
a plurality of registers serially coupled to each other, for continuously transmitting the column address every cycle of the clock signal; and
a multiplexer for selectively providing one signal among the output signals of the registers to the column decoder in response to the difference between RCL and SAE.
10. A synchronous DRAM, as recited in claim 9, wherein the registers are D flip-flops.
11. A synchronous DRAM, as recited in claim 8, wherein the delay counter comprises:
a first counting circuit for counting SAE and generating a first number of clock cycles;
a second counting circuit for counting RCL and generating a second number of clock cycles; and
a subtracter for calculating a third number of clock cycles by subtracting the first number of clock cycles from the second number of clock cycles and using 0 as the third number of clock cycles when the first number of clock cycles is larger than the second number of clock cycles.
12. A synchronous DRAM, as recited in claim 11, wherein the first counting circuit comprises:
a first logic latch unit for generating a first logic latch output signal activated by the generation of the row access command and deactivated by the activation of the sense amplifier enable signal; and
a first counter enabled in a period when the first logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of first clock cycles.
13. A synchronous DRAM, as recited in claim 12, wherein the second counting circuit comprises:
a second logic latch unit for generating a second logic latch output signal activated by the generation of the row access command and deactivated by the generation of the column access command; and
a second counter enabled in a period where the second logic latch output signal is activated, for counting the number of clock cycles of the clock signal generated in the activation period, and for generating the number of second clock cycles.
14. A synchronous DRAM, as recited in claim 8, wherein the delay counter comprises:
a logic unit for generating a logic output signal that is activated in response to the generation of the column access command and is deactivated in response to a sense amplifier enable signal, the logic output signal operating to enable the sense amplifier; and
a clock counter for counting the number of clock cycles of the clock signal generated in a period where the output signal of the logic unit is activated.
15. A synchronous DRAM, as recited in claim 8, further comprising:
a second shift register for delaying the output data of the memory cell by CLmin, where CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the memory cell; and
a buffer for buffering the output signal of the second shift register, and for delaying the output signal of the second shift register by the first number of delay clock cycles in response to a second delay clock control signal.
16. A synchronous DRAM, as recited in claim 15, further comprising a buffer controller for generating a second delay clock control signal for controlling the buffer, wherein the buffer controller comprises:
a first register for delaying the column access command by the first number of delay clock cycles and outputting the delayed column access command; and
a second register for generating a second delay control signal for delaying the output signal of the first register by the first number of delay clock cycles and controlling the buffer every cycle of the clock signal.
17. A synchronous DRAM, as recited in claim 8, wherein the first delay clock signal is provided from outside of the SDRAM.
18. A synchronous DRAM (SDRAM) synchronized with a clock signal after predetermined column access strobe (CAS) latency has lapsed from a column access command, the SDRAM comprising:
a memory bank having a plurality of memory cells arranged in rows and columns; and
a decoder for selecting one of the memory cells based on a column address and a row address,
wherein the CAS latency is determined by the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank.
19. A synchronous DRAM (SDRAM), comprising:
a memory bank having a plurality of memory cells arranged in rows and columns; and
a decoder for selecting one of the memory cells based on a column address and a row address,
wherein RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell,
wherein CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell,
wherein RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank, and
wherein a CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined to be (RLmin−RCL) when RCL is less than (RLmin−CLmin), and is determined to be CLmin when RCL is not less than (RLmin−CLmin).
20. A synchronous DRAM, as recited in claim 19, wherein (RLmin−CLmin) is input from the outside of the SDRAM.
21. A synchronous DRAM (SDRAM) operating in synchronization with a clock signal, the SDRAM comprising:
a memory bank having a plurality of memory cells arranged in rows and columns;
a column decoder for selecting the column of the memory bank;
a sense amplifier for amplifying data from the selected column;
wherein RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell,
CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell,
RCL is the number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank,
SAE is the number of clock cycles of the clock signal from the application of the row access command to the point of time at which the sense amplifier is enabled, and
wherein a CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of data, is determined by the difference between RCL and SAE.
22. A synchronous DRAM, as recited in claim 21, wherein the CAS latency is determined to be (RLmin−RCL) when RCL is less than SAE and the difference between RCL and SAE is no less than the predetermined number of reference clock cycles, and is determined to be CLmin when RCL is no less than SAE and the difference between RCL and SAE is no more than the number of reference clock cycles.
23. A method of controlling CAS latency of an SDRAM, synchronized with a clock signal, that includes a memory bank having a plurality of memory cells arranged in rows and columns and outputs the data of a selected memory cell, the method comprising:
inputting a quantity (RLmin−CLmin) from the outside of the SDRAM, where RLmin is the minimum number of clock cycles of the clock signal required from the application of a row access command to the output of the data of the selected memory cell, and CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell;
comparing RCL with (RLmin−CLmin), where RCL is a number of clock cycles of the clock signal from the application of a row access command to the application of a column access command with respect to the memory bank;
determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RLmin−RCL) when RCL is less than (RLmin−CLmin); and
determining the CAS latency to be CLmin when RCL is no less than (RLmin−CLmin).
24. A method of controlling CAS latency of an SDRAM which includes a bank having a plurality of memory cells arranged in rows and columns that outputs the data of a selected memory cell in synchronization with the clock signal, the method comprising:
sensing RCL, where RCL is the number of clock cycles of the clock signal from an application of a row access command to an application of a column access command;
sensing SAE, where SAE is the number of clock cycles of the clock signal from application of the row access command to a point of time at which a sense amplifier is enabled;
comparing RCL with SAE;
determining CAS latency, which is the number of clock cycles of the clock signal required from the application of the column access command to the output of the data, to be (RLmin−RCL) when RCL is less than SAE and the difference between RCL and SAE is not less than a predetermined number of reference clock cycles; and
determining the CAS latency to be CLmin when RCL is not less than SAE or the difference between RCL and SAE is less than the predetermined number of reference clock cycles,
wherein RLmin is the minimum number of clock cycles of a clock signal required from the application of a row access command to the output of the data of the selected memory cell, and
CLmin is the minimum number of clock cycles of the clock signal required from the application of a column access command to the output of the data of the selected memory cell.
US09/518,144 1999-03-03 2000-03-03 Synchronous DRAM having posted CAS latency and method for controlling CAS latency Expired - Lifetime US6262938B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR19990006939 1999-03-03
KR99-6939 1999-03-03
KR1019990020821A KR100304705B1 (en) 1999-03-03 1999-06-05 SDRAM having posted CAS latency and CAS latency control method therefor
KR99-20821 1999-06-05

Publications (1)

Publication Number Publication Date
US6262938B1 true US6262938B1 (en) 2001-07-17

Family

ID=26634763

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/518,144 Expired - Lifetime US6262938B1 (en) 1999-03-03 2000-03-03 Synchronous DRAM having posted CAS latency and method for controlling CAS latency

Country Status (5)

Country Link
US (1) US6262938B1 (en)
JP (1) JP3865561B2 (en)
KR (1) KR100304705B1 (en)
DE (1) DE10010440B9 (en)
TW (1) TW464876B (en)

Cited By (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469940B1 (en) * 1999-07-22 2002-10-22 Nec Corporation Memory access method and system for writing and reading SDRAM
US20020176316A1 (en) * 2001-05-23 2002-11-28 Alexander Benedix Semiconductor memory and method for operating the semiconductor memory
US20030223293A1 (en) * 2002-05-31 2003-12-04 Kabushiki Kaisha Toshiba Synchronous type semiconductor memory device
US6683816B2 (en) * 2001-10-05 2004-01-27 Hewlett-Packard Development Company, L.P. Access control system for multi-banked DRAM memory
US6813195B2 (en) 2002-11-20 2004-11-02 Hynix Semiconductor Inc. Pipe latch circuit for outputting data with high speed
US20040233773A1 (en) * 2001-11-12 2004-11-25 Samsung Electronics Co., Ltd. Circuit and method for generating output control signal in synchronous semiconductor memory device
US20050108590A1 (en) * 2003-11-13 2005-05-19 Janzen Leel S. Apparatus and method for generating a delayed clock signal
US20050213417A1 (en) * 2004-03-01 2005-09-29 Rex Kho Circuit arrangement for latency regulation
US20050229051A1 (en) * 2004-04-08 2005-10-13 Tae-Yun Kim Delay detecting apparatus of delay element in semiconductor device and method thereof
US20070002643A1 (en) * 2005-06-30 2007-01-04 Hynix Semiconductor Inc. Semiconductor memory device
US7161856B2 (en) 2004-12-28 2007-01-09 Hynix Semiconductor Inc. Circuit for generating data strobe signal of semiconductor memory device
US20070070730A1 (en) * 2005-09-29 2007-03-29 Hynix Semiconductor Inc. Semiconductor memory device
US20070192563A1 (en) * 2006-02-09 2007-08-16 Rajan Suresh N System and method for translating an address associated with a command communicated between a system and memory circuits
US20070263427A1 (en) * 2006-05-15 2007-11-15 Kabushiki Kaisha Toshiba General purpose register circuit
US20080043547A1 (en) * 2006-08-16 2008-02-21 Samsung Electronics Co., Ltd. Latency control circuit and method using queuing design method
US7730338B2 (en) 2006-07-31 2010-06-01 Google Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US7761724B2 (en) 2006-07-31 2010-07-20 Google Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8019589B2 (en) 2006-07-31 2011-09-13 Google Inc. Memory apparatus operable to perform a power-saving operation
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8154935B2 (en) 2006-07-31 2012-04-10 Google Inc. Delaying a signal communicated from a system to at least one of a plurality of memory circuits
US8169233B2 (en) 2009-06-09 2012-05-01 Google Inc. Programming of DIMM termination resistance values
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8280714B2 (en) 2006-07-31 2012-10-02 Google Inc. Memory circuit simulation system and method with refresh capabilities
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8406079B2 (en) 2010-04-30 2013-03-26 SK Hynix Inc. Address output timing control circuit of semiconductor apparatus
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8566516B2 (en) 2006-07-31 2013-10-22 Google Inc. Refresh management of memory modules
US8582339B2 (en) 2005-09-02 2013-11-12 Google Inc. System including memory stacks
US8588017B2 (en) 2010-10-20 2013-11-19 Samsung Electronics Co., Ltd. Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8972673B2 (en) 2006-07-31 2015-03-03 Google Inc. Power management of memory circuits by virtual memory simulation
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US9224442B2 (en) 2013-03-15 2015-12-29 Qualcomm Incorporated System and method to dynamically determine a timing parameter of a memory device
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US9606907B2 (en) 2009-07-16 2017-03-28 Netlist, Inc. Memory module with distributed data buffers and method of operation
US9659601B2 (en) 2010-11-03 2017-05-23 Netlist, Inc. Memory module with packages of stacked memory chips
US9858215B1 (en) 2004-03-05 2018-01-02 Netlist, Inc. Memory module with data buffering
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US10025731B1 (en) 2008-04-14 2018-07-17 Netlist, Inc. Memory module and circuit providing load isolation and noise reduction
US10068626B2 (en) 2016-10-28 2018-09-04 Integrated Silicon Solution, Inc. Clocked commands timing adjustments in synchronous semiconductor integrated circuits
US10204670B2 (en) 2012-05-17 2019-02-12 Samsung Electronics Co., Ltd. Spin transfer torque magnetic random access memory for supporting operational modes with mode register
US10236042B2 (en) * 2016-10-28 2019-03-19 Integrated Silicon Solution, Inc. Clocked commands timing adjustments method in synchronous semiconductor integrated circuits
US10268608B2 (en) 2012-07-27 2019-04-23 Netlist, Inc. Memory module with timing-controlled data paths in distributed data buffers
US11450367B2 (en) * 2019-08-29 2022-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Shared decoder circuit and method
US11874682B1 (en) * 2022-12-06 2024-01-16 Infineon Technologies Ag Voltage regulator and circuits with a voltage regulator

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100418524B1 (en) * 2001-10-06 2004-02-11 삼성전자주식회사 digitally controllable internal clock generating circuit in semiconductor memory device and method therefore
KR100446291B1 (en) * 2001-11-07 2004-09-01 삼성전자주식회사 Delay locked loop circuit capable of adjusting locking resolution using CAS latency
US6898682B2 (en) * 2002-08-12 2005-05-24 Freescale Semiconductor, Inc. Automatic READ latency calculation without software intervention for a source-synchronous interface
KR100590855B1 (en) * 2003-10-14 2006-06-19 주식회사 하이닉스반도체 Semiconductor memory device for reducing current consumption
JP4152308B2 (en) 2003-12-08 2008-09-17 エルピーダメモリ株式会社 Semiconductor integrated circuit device
KR100605590B1 (en) * 2004-05-10 2006-07-31 주식회사 하이닉스반도체 Semiconductor memory device with ability to mediate impedance of data output-driver
KR100608372B1 (en) 2004-12-03 2006-08-08 주식회사 하이닉스반도체 Method for controlling the timing of outputting data from synchronous memory device
JP2007200504A (en) * 2006-01-30 2007-08-09 Fujitsu Ltd Semiconductor memory, memory controller, and control method of semiconductor memory
EP2450800B1 (en) * 2006-02-09 2014-04-23 Google Inc. Memory circuit system and method
KR101507122B1 (en) 2008-04-29 2015-04-01 삼성전자주식회사 Semiconductor memory device and access method thereof
JP5587562B2 (en) * 2009-05-28 2014-09-10 ピーエスフォー ルクスコ エスエイアールエル Semiconductor memory device
JP5431028B2 (en) * 2009-05-28 2014-03-05 ピーエスフォー ルクスコ エスエイアールエル Semiconductor memory device
US11823767B2 (en) 2021-04-01 2023-11-21 Micron Technology, Inc. Dynamic random access memory speed bin compatibility

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587950A (en) * 1993-05-25 1996-12-24 Mitsubishi Denki Kabushiki Kaisha Test circuit in clock synchronous semiconductor memory device
US5835956A (en) 1899-10-02 1998-11-10 Samsung Electronics Co., Ltd. Synchronous dram having a plurality of latency modes
US6088255A (en) * 1998-03-20 2000-07-11 Fujitsu Limited Semiconductor device with prompt timing stabilization

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617779B2 (en) * 1988-08-31 1997-06-04 三菱電機株式会社 Semiconductor memory device
JPH0745068A (en) * 1993-08-02 1995-02-14 Mitsubishi Electric Corp Synchronizing type semiconductor storage device
JP2616567B2 (en) * 1994-09-28 1997-06-04 日本電気株式会社 Semiconductor storage device
US5655105A (en) * 1995-06-30 1997-08-05 Micron Technology, Inc. Method and apparatus for multiple latency synchronous pipelined dynamic random access memory
JP3183159B2 (en) * 1996-03-29 2001-07-03 日本電気株式会社 Synchronous DRAM
JP3406790B2 (en) * 1996-11-25 2003-05-12 株式会社東芝 Data transfer system and data transfer method
JPH10228772A (en) * 1997-02-18 1998-08-25 Mitsubishi Electric Corp Synchronous semiconductor memory
JPH10283779A (en) * 1997-04-09 1998-10-23 Mitsubishi Electric Corp Synchronous type semiconductor storage device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5835956A (en) 1899-10-02 1998-11-10 Samsung Electronics Co., Ltd. Synchronous dram having a plurality of latency modes
US5587950A (en) * 1993-05-25 1996-12-24 Mitsubishi Denki Kabushiki Kaisha Test circuit in clock synchronous semiconductor memory device
US6088255A (en) * 1998-03-20 2000-07-11 Fujitsu Limited Semiconductor device with prompt timing stabilization

Cited By (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469940B1 (en) * 1999-07-22 2002-10-22 Nec Corporation Memory access method and system for writing and reading SDRAM
US20020176316A1 (en) * 2001-05-23 2002-11-28 Alexander Benedix Semiconductor memory and method for operating the semiconductor memory
US6738309B2 (en) * 2001-05-23 2004-05-18 Infineon Technologies Ag Semiconductor memory and method for operating the semiconductor memory
US6683816B2 (en) * 2001-10-05 2004-01-27 Hewlett-Packard Development Company, L.P. Access control system for multi-banked DRAM memory
US20040233773A1 (en) * 2001-11-12 2004-11-25 Samsung Electronics Co., Ltd. Circuit and method for generating output control signal in synchronous semiconductor memory device
US6862250B2 (en) * 2001-11-12 2005-03-01 Samsung Electronics Co., Ltd. Circuit and method for generating output control signal in synchronous semiconductor memory device
US20030223293A1 (en) * 2002-05-31 2003-12-04 Kabushiki Kaisha Toshiba Synchronous type semiconductor memory device
US6757214B2 (en) 2002-05-31 2004-06-29 Kabushiki Kaisha Toshiba Synchronous type semiconductor memory device
US6813195B2 (en) 2002-11-20 2004-11-02 Hynix Semiconductor Inc. Pipe latch circuit for outputting data with high speed
US20060265619A1 (en) * 2003-11-13 2006-11-23 Janzen Leel S Apparatus and method for generating a delayed clock signal
US8677170B2 (en) 2003-11-13 2014-03-18 Round Rock Research, Llc Method for generating a clock signal
US7308594B2 (en) 2003-11-13 2007-12-11 Micron Technology, Inc. Apparatus and method for generating a delayed clock signal
US20060117204A1 (en) * 2003-11-13 2006-06-01 Janzen Leel S Apparatus and method for generating a delayed clock signal
US7065666B2 (en) 2003-11-13 2006-06-20 Micron Technology, Inc. Apparatus and method for generating a delayed clock signal
US7278045B2 (en) 2003-11-13 2007-10-02 Micron Technology, Inc. Apparatus and method for generating a delayed clock signal
US20060265618A1 (en) * 2003-11-13 2006-11-23 Janzen Leel S Apparatus and method for generating a delayed clock signal
US7350093B2 (en) 2003-11-13 2008-03-25 Micron Technology, Inc. Apparatus and method for generating a delayed clock signal
US20060265620A1 (en) * 2003-11-13 2006-11-23 Janzen Leel S Apparatus and method for generating a delayed clock signal
US20060265621A1 (en) * 2003-11-13 2006-11-23 Janzen Leel S Apparatus and method for generating a delayed clock signal
US20060277427A1 (en) * 2003-11-13 2006-12-07 Janzen Leel S Apparatus and method for generating a delayed clock signal
US7275172B2 (en) 2003-11-13 2007-09-25 Micron Technology, Inc. Apparatus and method for generating a delayed clock signal
US20050108590A1 (en) * 2003-11-13 2005-05-19 Janzen Leel S. Apparatus and method for generating a delayed clock signal
US7610502B2 (en) 2003-11-13 2009-10-27 Micron Technology, Inc. Computer systems having apparatus for generating a delayed clock signal
US8127171B2 (en) 2003-11-13 2012-02-28 Round Rock Research, Llc Method for generating a clock signal
US7610503B2 (en) 2003-11-13 2009-10-27 Micron Technology, Inc. Methods for generating a delayed clock signal
US20050213417A1 (en) * 2004-03-01 2005-09-29 Rex Kho Circuit arrangement for latency regulation
US7102940B2 (en) * 2004-03-01 2006-09-05 Infineon Technologies Ag Circuit arrangement for latency regulation
US11093417B2 (en) 2004-03-05 2021-08-17 Netlist, Inc. Memory module with data buffering
US10489314B2 (en) 2004-03-05 2019-11-26 Netlist, Inc. Memory module with data buffering
US9858215B1 (en) 2004-03-05 2018-01-02 Netlist, Inc. Memory module with data buffering
US7493533B2 (en) * 2004-04-08 2009-02-17 Hynix Semiconductor Inc. Delay detecting apparatus of delay element in semiconductor device and method thereof
US20050229051A1 (en) * 2004-04-08 2005-10-13 Tae-Yun Kim Delay detecting apparatus of delay element in semiconductor device and method thereof
US20070076493A1 (en) * 2004-12-28 2007-04-05 Hynix Semiconductor Inc. Circuit for generating data strobe signal of semiconductor memory device
US7230864B2 (en) 2004-12-28 2007-06-12 Hynix Semiconductors Inc Circuit for generating data strobe signal of semiconductor memory device
US7161856B2 (en) 2004-12-28 2007-01-09 Hynix Semiconductor Inc. Circuit for generating data strobe signal of semiconductor memory device
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US8386833B2 (en) 2005-06-24 2013-02-26 Google Inc. Memory systems and memory modules
US8615679B2 (en) 2005-06-24 2013-12-24 Google Inc. Memory modules with reliability and serviceability functions
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US20070002643A1 (en) * 2005-06-30 2007-01-04 Hynix Semiconductor Inc. Semiconductor memory device
US7263008B2 (en) 2005-06-30 2007-08-28 Hynix Semiconductor Inc. Semiconductor memory device for securing a stable operation at a high speed operation
US8619452B2 (en) 2005-09-02 2013-12-31 Google Inc. Methods and apparatus of stacking DRAMs
US8811065B2 (en) 2005-09-02 2014-08-19 Google Inc. Performing error detection on DRAMs
US8582339B2 (en) 2005-09-02 2013-11-12 Google Inc. System including memory stacks
US7529140B2 (en) 2005-09-29 2009-05-05 Hynix Semiconductor Inc. Semiconductor memory device
US7675810B2 (en) 2005-09-29 2010-03-09 Hynix Semiconductor, Inc. Semiconductor memory device
US20070070730A1 (en) * 2005-09-29 2007-03-29 Hynix Semiconductor Inc. Semiconductor memory device
US20090052271A1 (en) * 2005-09-29 2009-02-26 Hynix Semiconductor Inc. Semiconductor memory device
US8797779B2 (en) 2006-02-09 2014-08-05 Google Inc. Memory module with memory stack and interface with enhanced capabilites
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US9542353B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US9632929B2 (en) * 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US9727458B2 (en) * 2006-02-09 2017-08-08 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US20070192563A1 (en) * 2006-02-09 2007-08-16 Rajan Suresh N System and method for translating an address associated with a command communicated between a system and memory circuits
US8566556B2 (en) 2006-02-09 2013-10-22 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US20070263427A1 (en) * 2006-05-15 2007-11-15 Kabushiki Kaisha Toshiba General purpose register circuit
US7486542B2 (en) * 2006-05-15 2009-02-03 Kabushiki Kaisha Toshiba General purpose register circuit
US8340953B2 (en) 2006-07-31 2012-12-25 Google, Inc. Memory circuit simulation with power saving capabilities
US8112266B2 (en) 2006-07-31 2012-02-07 Google Inc. Apparatus for simulating an aspect of a memory circuit
US8280714B2 (en) 2006-07-31 2012-10-02 Google Inc. Memory circuit simulation system and method with refresh capabilities
US7730338B2 (en) 2006-07-31 2010-06-01 Google Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US7761724B2 (en) 2006-07-31 2010-07-20 Google Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US9047976B2 (en) 2006-07-31 2015-06-02 Google Inc. Combined signal delay and power saving for use with a plurality of memory circuits
US8745321B2 (en) 2006-07-31 2014-06-03 Google Inc. Simulating a memory standard
US8972673B2 (en) 2006-07-31 2015-03-03 Google Inc. Power management of memory circuits by virtual memory simulation
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8868829B2 (en) 2006-07-31 2014-10-21 Google Inc. Memory circuit system and method
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US8566516B2 (en) 2006-07-31 2013-10-22 Google Inc. Refresh management of memory modules
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US8671244B2 (en) 2006-07-31 2014-03-11 Google Inc. Simulating a memory standard
US8154935B2 (en) 2006-07-31 2012-04-10 Google Inc. Delaying a signal communicated from a system to at least one of a plurality of memory circuits
US8595419B2 (en) 2006-07-31 2013-11-26 Google Inc. Memory apparatus operable to perform a power-saving operation
US8601204B2 (en) 2006-07-31 2013-12-03 Google Inc. Simulating a refresh operation latency
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8019589B2 (en) 2006-07-31 2011-09-13 Google Inc. Memory apparatus operable to perform a power-saving operation
US8631220B2 (en) 2006-07-31 2014-01-14 Google Inc. Adjusting the timing of signals associated with a memory system
US20080043547A1 (en) * 2006-08-16 2008-02-21 Samsung Electronics Co., Ltd. Latency control circuit and method using queuing design method
US7979605B2 (en) * 2006-08-16 2011-07-12 Samsung Electronics Co., Ltd. Latency control circuit and method using queuing design method
US8230140B2 (en) 2006-08-16 2012-07-24 Samsung Electronics Co., Ltd. Latency control circuit and method using queuing design method
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8751732B2 (en) 2006-10-05 2014-06-10 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8370566B2 (en) 2006-10-05 2013-02-05 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8977806B1 (en) 2006-10-05 2015-03-10 Google Inc. Hybrid memory module
US8760936B1 (en) 2006-11-13 2014-06-24 Google Inc. Multi-rank partial width memory modules
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8446781B1 (en) 2006-11-13 2013-05-21 Google Inc. Multi-rank partial width memory modules
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8675429B1 (en) 2007-11-16 2014-03-18 Google Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8730670B1 (en) 2007-12-18 2014-05-20 Google Inc. Embossed heat spreader
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8705240B1 (en) 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8631193B2 (en) 2008-02-21 2014-01-14 Google Inc. Emulation of abstracted DIMMS using abstracted DRAMS
US10025731B1 (en) 2008-04-14 2018-07-17 Netlist, Inc. Memory module and circuit providing load isolation and noise reduction
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8762675B2 (en) 2008-06-23 2014-06-24 Google Inc. Memory system for synchronous data transmission
US8819356B2 (en) 2008-07-25 2014-08-26 Google Inc. Configurable multirank memory system with interface circuit
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8169233B2 (en) 2009-06-09 2012-05-01 Google Inc. Programming of DIMM termination resistance values
US9606907B2 (en) 2009-07-16 2017-03-28 Netlist, Inc. Memory module with distributed data buffers and method of operation
US10949339B2 (en) 2009-07-16 2021-03-16 Netlist, Inc. Memory module with controlled byte-wise buffers
US8406079B2 (en) 2010-04-30 2013-03-26 SK Hynix Inc. Address output timing control circuit of semiconductor apparatus
US8588017B2 (en) 2010-10-20 2013-11-19 Samsung Electronics Co., Ltd. Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same
US9659601B2 (en) 2010-11-03 2017-05-23 Netlist, Inc. Memory module with packages of stacked memory chips
US10290328B2 (en) 2010-11-03 2019-05-14 Netlist, Inc. Memory module with packages of stacked memory chips
US10204670B2 (en) 2012-05-17 2019-02-12 Samsung Electronics Co., Ltd. Spin transfer torque magnetic random access memory for supporting operational modes with mode register
US10446207B2 (en) 2012-05-17 2019-10-15 Samsung Electronics Co., Ltd. Spin transfer torque magnetic random access memory for supporting operational modes with mode register
US10860506B2 (en) 2012-07-27 2020-12-08 Netlist, Inc. Memory module with timing-controlled data buffering
US10268608B2 (en) 2012-07-27 2019-04-23 Netlist, Inc. Memory module with timing-controlled data paths in distributed data buffers
US11762788B2 (en) 2012-07-27 2023-09-19 Netlist, Inc. Memory module with timing-controlled data buffering
US9224442B2 (en) 2013-03-15 2015-12-29 Qualcomm Incorporated System and method to dynamically determine a timing parameter of a memory device
US10832747B2 (en) 2016-10-28 2020-11-10 Integrated Silicon Solution, Inc. Clocked commands timing adjustments method in synchronous semiconductor integrated circuits
US10236042B2 (en) * 2016-10-28 2019-03-19 Integrated Silicon Solution, Inc. Clocked commands timing adjustments method in synchronous semiconductor integrated circuits
US10068626B2 (en) 2016-10-28 2018-09-04 Integrated Silicon Solution, Inc. Clocked commands timing adjustments in synchronous semiconductor integrated circuits
US11450367B2 (en) * 2019-08-29 2022-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Shared decoder circuit and method
US11874682B1 (en) * 2022-12-06 2024-01-16 Infineon Technologies Ag Voltage regulator and circuits with a voltage regulator

Also Published As

Publication number Publication date
DE10010440B9 (en) 2013-06-20
TW464876B (en) 2001-11-21
KR20000062099A (en) 2000-10-25
JP3865561B2 (en) 2007-01-10
DE10010440B4 (en) 2013-04-11
JP2000276877A (en) 2000-10-06
DE10010440A1 (en) 2000-09-07
KR100304705B1 (en) 2001-10-29

Similar Documents

Publication Publication Date Title
US6262938B1 (en) Synchronous DRAM having posted CAS latency and method for controlling CAS latency
KR100866958B1 (en) Method and apparatus for controlling read latency in high speed DRAM
US6337832B1 (en) Operable synchronous semiconductor memory device switching between single data rate mode and double data rate mode
US7672191B2 (en) Data output control circuit
JP4600825B2 (en) Semiconductor memory device
KR100638747B1 (en) Clock generation apparatus in semiconductor memory device and its method
US6337809B1 (en) Semiconductor memory device capable of improving data processing speed and efficiency of a data input and output pin and related method for controlling read and write
US6982924B2 (en) Data output control circuit
US6194916B1 (en) Phase comparator circuit for high speed signals in delay locked loop circuit
US7102939B2 (en) Semiconductor memory device having column address path therein for reducing power consumption
US20050201183A1 (en) Column address path circuit and method for memory devices having a burst access mode
US7715245B2 (en) Pipe latch device of semiconductor memory device
JPH09198875A (en) Synchronous type semiconductor memory
KR20000077097A (en) Phase control circuit, semiconductor device and semiconductor memory
US8804447B2 (en) Semiconductor memory device for controlling write recovery time
US6002615A (en) Clock shift circuit and synchronous semiconductor memory device using the same
JP3341710B2 (en) Semiconductor storage device
US20070076493A1 (en) Circuit for generating data strobe signal of semiconductor memory device
KR20040038740A (en) Semiconductor memory device and control method thereof
JP4061029B2 (en) Semiconductor memory device, buffer and signal transmission circuit
US7408394B2 (en) Measure control delay and method having latching circuit integral with delay circuit
US6292430B1 (en) Synchronous semiconductor memory device
US6208583B1 (en) Synchronous semiconductor memory having an improved reading margin and an improved timing control in a test mode
EP0766251A2 (en) Semiconducteur memory device having extended margin in latching input signal
US8081538B2 (en) Semiconductor memory device and driving method thereof

Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, JUNG-BAE;SHIN, CHOONG-SUN;LEE, DONG-YANG;REEL/FRAME:010920/0366;SIGNING DATES FROM 20000607 TO 20000612

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12