US6360935B1 - Apparatus and method for assessing solderability - Google Patents
Apparatus and method for assessing solderability Download PDFInfo
- Publication number
- US6360935B1 US6360935B1 US09/237,774 US23777499A US6360935B1 US 6360935 B1 US6360935 B1 US 6360935B1 US 23777499 A US23777499 A US 23777499A US 6360935 B1 US6360935 B1 US 6360935B1
- Authority
- US
- United States
- Prior art keywords
- solderability
- substrate
- lead
- component
- assessing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
TABLE I | ||||||
CHARACTERISTIC | FIG. 4 | FIG. 5 | FIG. 6 | FIG. 7 | FIG. 8 | FIG. 9 |
Peak Ratio | 0.73 | 0.66 | 0.80 | 0.00 | 0.00 | 0.17 |
Lead/Substrate Ratio | 0.36 | 0.39 | 0.36 | 0.60 | 0.64 | 0.64 |
Claims (26)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/237,774 US6360935B1 (en) | 1999-01-26 | 1999-01-26 | Apparatus and method for assessing solderability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/237,774 US6360935B1 (en) | 1999-01-26 | 1999-01-26 | Apparatus and method for assessing solderability |
Publications (1)
Publication Number | Publication Date |
---|---|
US6360935B1 true US6360935B1 (en) | 2002-03-26 |
Family
ID=22895113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/237,774 Expired - Fee Related US6360935B1 (en) | 1999-01-26 | 1999-01-26 | Apparatus and method for assessing solderability |
Country Status (1)
Country | Link |
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US (1) | US6360935B1 (en) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020027941A1 (en) * | 2000-08-25 | 2002-03-07 | Jerry Schlagheck | Method and apparatus for detection of defects using localized heat injection of narrow laser pulses |
US20040000707A1 (en) * | 2001-10-26 | 2004-01-01 | Staktek Group, L.P. | Modularized die stacking system and method |
US20040028113A1 (en) * | 2000-08-25 | 2004-02-12 | Photon Dynamics, Inc. | Method and apparatus for detection of defects using thermal stimulation |
US20040195666A1 (en) * | 2001-10-26 | 2004-10-07 | Julian Partridge | Stacked module systems and methods |
US20040201091A1 (en) * | 2001-10-26 | 2004-10-14 | Staktek Group, L.P. | Stacked module systems and methods |
US6840671B2 (en) * | 2001-04-09 | 2005-01-11 | William R. Barron, Jr. | System and method for non-contact temperature sensing |
US20050041403A1 (en) * | 2001-10-26 | 2005-02-24 | Staktek Group, L.P. | Integrated circuit stacking system and method |
US20050280135A1 (en) * | 2001-10-26 | 2005-12-22 | Staktek Group L.P. | Stacking system and method |
US20060043558A1 (en) * | 2004-09-01 | 2006-03-02 | Staktek Group L.P. | Stacked integrated circuit cascade signaling system and method |
US20060092614A1 (en) * | 2001-10-26 | 2006-05-04 | Staktek Group, L.P. | Stacked module systems and methods |
US20060255446A1 (en) * | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
US20060263938A1 (en) * | 2005-05-18 | 2006-11-23 | Julian Partridge | Stacked module systems and method |
US20070114649A1 (en) * | 2001-10-26 | 2007-05-24 | Staktek Group L.P., A Texas Limited Partnership | Low Profile Stacking System and Method |
US20070235504A1 (en) * | 2006-04-10 | 2007-10-11 | Research In Motion Limited | Method and apparatus for testing solderability of electrical components |
US20080122054A1 (en) * | 2006-11-02 | 2008-05-29 | Leland Szewerenko | Circuit Module Having Force Resistant Construction |
US20110024395A1 (en) * | 2009-07-30 | 2011-02-03 | Hon Hai Precision Industry Co., Ltd. | Electric soldering iron with automatic poweroff and method thereof |
WO2011036278A1 (en) * | 2009-09-24 | 2011-03-31 | Option | Layout of contact pads of a system in package, comprising circuit board and electronic integrated elements |
CN102825355A (en) * | 2012-09-05 | 2012-12-19 | 广州赛宝仪器设备有限公司 | Welding groove mechanism and solderability test method for solderability tester |
EP2565655A1 (en) * | 2011-08-31 | 2013-03-06 | SolarWorld Innovations GmbH | Method for checking a solder joint and arrangement for checking a solder joint |
US20170120362A1 (en) * | 2015-10-30 | 2017-05-04 | Reid Aarne H | Brazing Systems And Methods |
US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
US10495250B2 (en) | 2012-10-03 | 2019-12-03 | Concept Group, Llc | Vacuum insulated structure with end fitting and method of making same |
US20200170155A1 (en) * | 2018-11-28 | 2020-05-28 | International Business Machines Corporation | Flux residue detection |
US10723538B2 (en) | 2014-02-20 | 2020-07-28 | Concept Group Llc | Vacuum insulated articles and methods of making same |
US10823326B2 (en) | 2016-11-15 | 2020-11-03 | Concept Group Llc | Enhanced vacuum-insulated articles with controlled microporous insulation |
US11008153B2 (en) | 2016-11-15 | 2021-05-18 | Concept Group Llp | Multiply-insulated assemblies |
US11320086B2 (en) | 2017-08-25 | 2022-05-03 | Concept Group Llc | Multiple geometry and multiple material insulated components |
CN114682948A (en) * | 2022-03-04 | 2022-07-01 | 广东风华高新科技股份有限公司 | Method, device and system for testing weldability of chip component |
CN114986011A (en) * | 2022-04-27 | 2022-09-02 | 中国电子科技集团公司第三十八研究所 | Rapid nondestructive testing device and testing method for weldability of LTCC substrate |
US11525736B2 (en) * | 2020-01-15 | 2022-12-13 | International Business Machines Corporation | Temperature monitoring for printed circuit board assemblies during mass soldering |
US11702271B2 (en) | 2016-03-04 | 2023-07-18 | Concept Group Llc | Vacuum insulated articles with reflective material enhancement |
Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4227415A (en) | 1979-06-26 | 1980-10-14 | Ernst Spirig | Method and apparatus for testing solderability and de-soldering wicks |
US4409333A (en) | 1981-12-04 | 1983-10-11 | Rca Corporation | Method for the evaluation of solderability |
US4467638A (en) | 1983-05-13 | 1984-08-28 | Rca Corporation | Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system |
US4657196A (en) * | 1984-09-04 | 1987-04-14 | Aluminum Company Of America | Mechanism for supporting and rotating a coil |
US4657169A (en) * | 1984-06-11 | 1987-04-14 | Vanzetti Systems, Inc. | Non-contact detection of liquefaction in meltable materials |
US4696104A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
US4792683A (en) * | 1987-01-16 | 1988-12-20 | Hughes Aircraft Company | Thermal technique for simultaneous testing of circuit board solder joints |
US4941256A (en) * | 1988-08-19 | 1990-07-17 | Canadian Patents & Development Ltd. | Automatic visual measurement of surface mount device placement |
JPH03140852A (en) * | 1989-10-26 | 1991-06-14 | Hitachi Constr Mach Co Ltd | Inspecting apparatus of soldering |
US5089700A (en) * | 1990-01-30 | 1992-02-18 | Amdata, Inc. | Apparatus for infrared imaging inspections |
US5118945A (en) * | 1989-04-24 | 1992-06-02 | Siemens Aktiengesellschaft | Photothermal test process, apparatus for performing the process and heat microscope |
US5148375A (en) * | 1989-11-17 | 1992-09-15 | Matsushita Electric Industrial Co., Ltd. | Soldering appearance inspection apparatus |
US5206705A (en) | 1989-12-13 | 1993-04-27 | Matsushita Electric Industrial Co., Ltd. | Method of checking external shape of solder portion |
US5208528A (en) * | 1989-01-19 | 1993-05-04 | Bull S.A. | Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method |
US5246291A (en) * | 1992-06-01 | 1993-09-21 | Motorola, Inc. | Bond inspection technique for a semiconductor chip |
US5250809A (en) * | 1992-01-24 | 1993-10-05 | Shuji Nakata | Method and device for checking joint of electronic component |
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US5407275A (en) * | 1992-03-31 | 1995-04-18 | Vlsi Technology, Inc. | Non-destructive test for inner lead bond of a tab device |
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US5446549A (en) * | 1993-01-14 | 1995-08-29 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for noncontact surface contour measurement |
US5574801A (en) * | 1993-08-12 | 1996-11-12 | Collet-Beillon; Olivier | Method of inspecting an array of solder ball connections of an integrated circuit module |
US5676302A (en) * | 1995-06-02 | 1997-10-14 | Cognex Corporation | Method and apparatus for crescent boundary thresholding on wire-bonded leads |
EP0849940A2 (en) * | 1996-12-18 | 1998-06-24 | Fujitsu Limited | An apparatus for converting gray levels of an image, a method thereof, a program storage device thereof, and an infrared camera |
US5836504A (en) * | 1994-08-08 | 1998-11-17 | Kabushiki Kaisha Kobe Seiko Sho | Method and apparatus for soldering inspection of a surface mounted circuit board |
US5912984A (en) * | 1996-12-19 | 1999-06-15 | Cognex Corporation | Method and apparatus for in-line solder paste inspection |
US5963662A (en) * | 1996-08-07 | 1999-10-05 | Georgia Tech Research Corporation | Inspection system and method for bond detection and validation of surface mount devices |
US5971249A (en) * | 1997-02-24 | 1999-10-26 | Quad Systems Corporation | Method and apparatus for controlling a time/temperature profile inside of a reflow oven |
US5988487A (en) * | 1997-05-27 | 1999-11-23 | Fujitsu Limited | Captured-cell solder printing and reflow methods |
-
1999
- 1999-01-26 US US09/237,774 patent/US6360935B1/en not_active Expired - Fee Related
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US4227415A (en) | 1979-06-26 | 1980-10-14 | Ernst Spirig | Method and apparatus for testing solderability and de-soldering wicks |
US4409333A (en) | 1981-12-04 | 1983-10-11 | Rca Corporation | Method for the evaluation of solderability |
US4467638A (en) | 1983-05-13 | 1984-08-28 | Rca Corporation | Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system |
US4657169A (en) * | 1984-06-11 | 1987-04-14 | Vanzetti Systems, Inc. | Non-contact detection of liquefaction in meltable materials |
US4657196A (en) * | 1984-09-04 | 1987-04-14 | Aluminum Company Of America | Mechanism for supporting and rotating a coil |
US4696104A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
US4792683A (en) * | 1987-01-16 | 1988-12-20 | Hughes Aircraft Company | Thermal technique for simultaneous testing of circuit board solder joints |
US4941256A (en) * | 1988-08-19 | 1990-07-17 | Canadian Patents & Development Ltd. | Automatic visual measurement of surface mount device placement |
US5208528A (en) * | 1989-01-19 | 1993-05-04 | Bull S.A. | Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method |
US5118945A (en) * | 1989-04-24 | 1992-06-02 | Siemens Aktiengesellschaft | Photothermal test process, apparatus for performing the process and heat microscope |
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US5206705A (en) | 1989-12-13 | 1993-04-27 | Matsushita Electric Industrial Co., Ltd. | Method of checking external shape of solder portion |
US5089700A (en) * | 1990-01-30 | 1992-02-18 | Amdata, Inc. | Apparatus for infrared imaging inspections |
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US5250809A (en) * | 1992-01-24 | 1993-10-05 | Shuji Nakata | Method and device for checking joint of electronic component |
US5407275A (en) * | 1992-03-31 | 1995-04-18 | Vlsi Technology, Inc. | Non-destructive test for inner lead bond of a tab device |
US5246291A (en) * | 1992-06-01 | 1993-09-21 | Motorola, Inc. | Bond inspection technique for a semiconductor chip |
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US5446549A (en) * | 1993-01-14 | 1995-08-29 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for noncontact surface contour measurement |
US5574801A (en) * | 1993-08-12 | 1996-11-12 | Collet-Beillon; Olivier | Method of inspecting an array of solder ball connections of an integrated circuit module |
US5836504A (en) * | 1994-08-08 | 1998-11-17 | Kabushiki Kaisha Kobe Seiko Sho | Method and apparatus for soldering inspection of a surface mounted circuit board |
US5676302A (en) * | 1995-06-02 | 1997-10-14 | Cognex Corporation | Method and apparatus for crescent boundary thresholding on wire-bonded leads |
US5963662A (en) * | 1996-08-07 | 1999-10-05 | Georgia Tech Research Corporation | Inspection system and method for bond detection and validation of surface mount devices |
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US5971249A (en) * | 1997-02-24 | 1999-10-26 | Quad Systems Corporation | Method and apparatus for controlling a time/temperature profile inside of a reflow oven |
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Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020027941A1 (en) * | 2000-08-25 | 2002-03-07 | Jerry Schlagheck | Method and apparatus for detection of defects using localized heat injection of narrow laser pulses |
US6840667B2 (en) * | 2000-08-25 | 2005-01-11 | Photon Dynamics, Inc. | Method and apparatus for detection of defects using thermal stimulation |
US20040028113A1 (en) * | 2000-08-25 | 2004-02-12 | Photon Dynamics, Inc. | Method and apparatus for detection of defects using thermal stimulation |
US6840671B2 (en) * | 2001-04-09 | 2005-01-11 | William R. Barron, Jr. | System and method for non-contact temperature sensing |
US20040201091A1 (en) * | 2001-10-26 | 2004-10-14 | Staktek Group, L.P. | Stacked module systems and methods |
US20080088032A1 (en) * | 2001-10-26 | 2008-04-17 | Staktek Group L.P. | Stacked Modules and Method |
US20080120831A1 (en) * | 2001-10-26 | 2008-05-29 | Staktek Group L.P. | Stacked Modules and Method |
US20050041403A1 (en) * | 2001-10-26 | 2005-02-24 | Staktek Group, L.P. | Integrated circuit stacking system and method |
US20050280135A1 (en) * | 2001-10-26 | 2005-12-22 | Staktek Group L.P. | Stacking system and method |
US7719098B2 (en) | 2001-10-26 | 2010-05-18 | Entorian Technologies Lp | Stacked modules and method |
US20060092614A1 (en) * | 2001-10-26 | 2006-05-04 | Staktek Group, L.P. | Stacked module systems and methods |
US20040000707A1 (en) * | 2001-10-26 | 2004-01-01 | Staktek Group, L.P. | Modularized die stacking system and method |
US20040195666A1 (en) * | 2001-10-26 | 2004-10-07 | Julian Partridge | Stacked module systems and methods |
US20070114649A1 (en) * | 2001-10-26 | 2007-05-24 | Staktek Group L.P., A Texas Limited Partnership | Low Profile Stacking System and Method |
US20070117262A1 (en) * | 2001-10-26 | 2007-05-24 | Staktek Group L.P., A Texas Limited Partnership | Low Profile Stacking System and Method |
US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US20080090329A1 (en) * | 2001-10-26 | 2008-04-17 | Staktek Group L.P. | Stacked Modules and Method |
US20060255446A1 (en) * | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
US20080088003A1 (en) * | 2001-10-26 | 2008-04-17 | Staktek Group L.P. | Stacked Modules and Method |
US20060043558A1 (en) * | 2004-09-01 | 2006-03-02 | Staktek Group L.P. | Stacked integrated circuit cascade signaling system and method |
US20060263938A1 (en) * | 2005-05-18 | 2006-11-23 | Julian Partridge | Stacked module systems and method |
US7874470B2 (en) | 2006-04-10 | 2011-01-25 | Rearch In Motion Limited | Method and apparatus for testing solderability of electrical components |
US20100320256A1 (en) * | 2006-04-10 | 2010-12-23 | Research In Motion Limited | Method and apparatus for testing solderability of electrical components |
US20070235504A1 (en) * | 2006-04-10 | 2007-10-11 | Research In Motion Limited | Method and apparatus for testing solderability of electrical components |
US8528804B2 (en) * | 2006-04-10 | 2013-09-10 | Blackberry Limited | Method and apparatus for testing solderability of electrical components |
US7804985B2 (en) | 2006-11-02 | 2010-09-28 | Entorian Technologies Lp | Circuit module having force resistant construction |
US20080122054A1 (en) * | 2006-11-02 | 2008-05-29 | Leland Szewerenko | Circuit Module Having Force Resistant Construction |
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