US7328506B2 - Method for forming a plated microvia interconnect - Google Patents
Method for forming a plated microvia interconnect Download PDFInfo
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- US7328506B2 US7328506B2 US10/281,463 US28146302A US7328506B2 US 7328506 B2 US7328506 B2 US 7328506B2 US 28146302 A US28146302 A US 28146302A US 7328506 B2 US7328506 B2 US 7328506B2
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L21/486—Via connections through the substrate with or without pins
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09863—Concave hole or via
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- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Definitions
- the present invention relates to interconnect structures, and more specifically relates to a receptor pad for use in a chip carrier package.
- An IC chip package comprises a relatively small IC device encapsulated in a larger package, which is more suitable for use in the industry.
- the “larger” IC chip package includes external connectors (e.g., a ball grid array) suitable for electrical communication with a traditional circuit board.
- the smaller IC device which comprises much smaller connectors, resides within the IC chip package on a landing area or laminate.
- the IC chip package must provide a relatively small landing area as well as a system for internally routing signals between external package connectors and internal IC device connectors.
- a landing area comprised of a circuitized substrate or laminate is provided having a set of internal (high density) receptor pads. Circuit lines within the substrate route the signals from external connectors, which are in communication with external devices, to the receptor pads on a landing area, which connect with the IC device. Connection between the landing area and IC device is generally achieved by soldering. Solder techniques are well known in the art and examples are found in U.S. Pat. No. 5,597,469 issued on Jan. 28, 1997 to Carey et al., and assigned to International Business Machines.
- the circuitized substrate must provide a high number of receptor pads in a very small surface area. This is becoming more difficult to achieve with present design techniques. Specifically, because solder cannot wet down onto non-metal and/or organic materials, receptor pads must be designed with an adequate metal surface to ensure attachment. If such a surface is not provided, solder often fails to properly wet the pads and becomes inadvertently removed from the pad during subsequent reflow and wash processes.
- the most common pad structure to ensure adequate metal surface comprises a “dog bone” structure that utilizes a flat pad attached to an adjacent via. Unfortunately, these structures take up a lot of surface area.
- the present invention provides a method for forming a receptor pad on a laminate, comprising the steps of: providing a circuitized substrate that includes a surface having a conductive element; mounting an external dielectric layer (EDL) on the surface; forming an opening in the EDL to expose the conductive element and create a microvia; treating an interior side wall surface of the microvia to promote copper adhesion; and electroplating the microvia with copper.
- EDL external dielectric layer
- a resist process is used to define and finalize the receptor pad. Thereafter, a wet solder paste may be deposited on the receptor pads followed by a reflowing and washing step to create a reliable solder bump.
- the invention also comprises a laminate having a receptor pad formed thereon, comprising: a circuitized substrate having a conductive element on a surface; an EDL mounted on the circuitized substrate, the EDL having an opening positioned above the conductive element to form a microvia; and an electroplated layer deposited within the microvia.
- FIG. 1 depicts a cross-section of a IC chip package in accordance with a preferred embodiment of the present invention
- FIG. 2 depicts a cross-section of a laminate in accordance with a preferred embodiment of the present invention
- FIG. 3 depicts a cross-section of a receptor pad in accordance with a preferred embodiment of the present invention.
- FIG. 4 depicts a flow chart of a method of fabricating a receptor pad in accordance with a preferred embodiment of the present invention.
- FIG. 1 depicts a cross-section of a integrated circuit chip package 10 .
- the integrated circuit chip package 10 includes a chip 12 , a laminate 14 , connections 16 that interconnect the laminate 14 with the chip 12 , a cover plate 20 , a stiffener 24 , adhesives 26 and 28 , an encapsulation material 22 , and a ball grid array (BGA) structure 18 . While this preferred embodiment deals generally with the electrical interconnect between laminate 14 and chip 12 within a chip package, it is understood that the structure and methods described herein could be used on any planarized surface that provides component interconnections. Moreover, the figures are provided primarily for explanation purposes, and are not necessarily drawn to scale.
- the laminate 14 is depicted in detail, and includes receptor pads 30 on a top surface, BGA pads 32 on a bottom surface, a circuitized substrate 31 , and an external dielectric layer (EDL) 34 mounted on the top surface of the circuitized substrate 31 .
- EDL 34 may comprise a solder mask, a redistribution build-up layer, or any dielectric material that can insulate the top of the circuitized substrate 31 and include an adequate thickness for the purposes described herein.
- the circuitized substrate 31 comprises circuits 36 (e.g., voltage planes, ground planes, signal planes, vias, etc.) that electrically redirect electrical signals from BGA pads 32 to receptor pads 30 .
- laminate 14 includes a multilayer structure that provides an electrical transition between relatively small receptor pads 30 (to handle the IC device) and relatively large BGA pads 32 (for surface mount connections).
- EDL 34 which provides an insulative surface on the laminate 14 , may be comprised of any dielectric material, such as epoxy, plastic, etc.
- the dielectric material may comprise an organic make-up.
- the EDL 34 may be affixed/created with any known method, such as with a “spray-on” application, liquid screening, attachable film, etc. While the preferred thickness will be on the order of 2 mils, the resulting EDL can be any desired thickness.
- In the EDL 34 is an opening 40 having side wall surfaces 42 .
- the side walls can be oriented in a generally perpendicular fashion, or angled. Openings 40 can be created using any technique, including laser ablating, plasma etching, and photoimaging.
- Conductive element 38 is one of many conductors residing within the circuitized substrate 39 , and could be any type of electrical conductor, such as a wire, signal plane, voltage/ground plane, via, etc.
- the receptor pad 30 is comprised of a microvia formed within an opening 40 in the EDL 34 .
- the microvia includes an electroplated layer 44 of copper that is in contact with conductive element 38 .
- the layer 44 could fill the entire microvia structure. Copper plating of the microvias could also be achieved by using an electroless copper plating process, as opposed to electroplating. Alternatively, the microvia structure could be filled with an additional conductive material, such as conductive paste, silver, copper, etc.
- the electroplated layer 44 further comprises a lip 45 that overlaps the surface of the EDL 34 .
- the receptor pad 30 is designed to receive a solder deposit or bump 46 , that extends above the EDL.
- this invention utilizes a metallically plated microvia to provide a surface that will reliably receive and maintain solder bump 46 . Without the plating, solder will not reliably flow over and adhere to the EDL walls, particularly if the EDL is comprised of an organic material.
- a reliable system for attaching the electroplated layer 44 to the interior surface of the EDL 34 opening must likewise be implemented. Accordingly, the present invention provides a treated interior side wall surface 42 that is used to ensure adhesion of the plating 44 .
- the interior side wall surface 42 is treated in any known manner that will promote copper adhesion.
- the interior wall 42 may include a surface that is “roughened” to enhance the adhesion of the electroplating 44 to the EDL 34 . Roughening may be achieved with, for example, a mechanical or a chemical process such as mechanical scrubbing, epoxy etching or plasma sanding.
- a flow chart describing the method for fabricating the receptor pads 30 and solder bump 46 is described.
- a circuitized substrate 39 with conductive elements on the surface is provided.
- a EDL 34 is mounted on the surface of the circuitized structure 39 such that EDL openings expose the desired conductive elements and create microvias.
- the interior side wall surfaces of the microvias are treated to enhance copper adhesion.
- the treatment may include, for example, any of the roughening methods described above.
- the interior surfaces of the microvias are electroplated with copper.
- This may be achieved with a multi-step “plate-up” process that includes the application of a copper seed layer, followed by a full plating operation.
- the application of the seed layer may be accomplished with an electroless strike process that applies copper seeding to the treated side wall surfaces.
- Full panel electroplating with acid copper can then be used to finish the plating.
- This plating process may be accomplished with a bath process utilizing dip tanks, or any other known plating methods.
- an electroless plating methodology could likewise be used.
- the result is a microvia (as well as the laminate surface) lined with metal plating.
- the thickness of the plating may vary depending upon the particular application, this preferred embodiment contemplates a thickness of about 1 mil on the side walls and 0.7 mils on the bottom.
- the microvia could be filled with a conductive material as described above.
- the structure of the receptor pads are formed and finalized with a resist process to etch the pad. This process creates discrete pads on the laminate surface and eliminates copper from the laminate surface where it is not desired. Any known photo resist process to define the pads may be used, including the plate up and etch method described, or by using an additive or semi-additive pattern plating process using electroless copper plating. Because the resultant microvia sidewalls have metal rather than bare epoxy, solder paste can wet down to the pad eliminating unreliable connections.
- solder paste may be applied to the receptor pads to provide solder bumps.
- One method for applying solder paste to the receptor pads involves a “flip chip” screen printing process. This process utilizes a solder screen printer, which is an automated tool used to deposit wet solder paste onto a card or any fine pitch, micro BGA, or chip carrier site.
- the screen printer utilizes a framed metal mask (stencil) with apertures in the same pattern array as the carrier.
- Typical BGA stencils are 8 mils thick with 30 mil diameter apertures. For this preferred embodiment, a 2 mil thick stencil with a 5-6 mil diameter aperture may be used.
- the screen printer may utilize a high magnification vision system to align up the carrier with the stencil. After alignment is complete, a camera moves to the side and the carrier is automatically pushed up to the stencil thereby aligning the pads on the carrier to the stencil. Solder paste is applied to the stencil and squeegee blades or a printing head comes down in contact with the stencil, sweeping across, and depositing the wet solder onto the carrier. The carrier comes down away and out from the stencil and is removed. This process may be repeated multiple times. The carrier may then reflowed and washed and a visual inspection may be performed to inspect for missing bumps. Because the microvias are plated up (approximately 0.7 mils thickness in the bottom of the well), the result is a relatively small gap between the top of the receptor pad and the screened solder paste, which provides higher reliability.
Abstract
Description
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/281,463 US7328506B2 (en) | 1999-06-28 | 2002-10-25 | Method for forming a plated microvia interconnect |
US11/866,163 US20080017410A1 (en) | 1999-06-28 | 2007-10-02 | Method for forming a plated microvia interconnect |
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US09/340,758 US6492600B1 (en) | 1999-06-28 | 1999-06-28 | Laminate having plated microvia interconnects and method for forming the same |
US10/281,463 US7328506B2 (en) | 1999-06-28 | 2002-10-25 | Method for forming a plated microvia interconnect |
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US09/340,758 Division US6492600B1 (en) | 1999-06-28 | 1999-06-28 | Laminate having plated microvia interconnects and method for forming the same |
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US11/866,163 Division US20080017410A1 (en) | 1999-06-28 | 2007-10-02 | Method for forming a plated microvia interconnect |
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US20030102158A1 US20030102158A1 (en) | 2003-06-05 |
US7328506B2 true US7328506B2 (en) | 2008-02-12 |
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US09/340,758 Expired - Fee Related US6492600B1 (en) | 1999-06-28 | 1999-06-28 | Laminate having plated microvia interconnects and method for forming the same |
US10/281,463 Expired - Fee Related US7328506B2 (en) | 1999-06-28 | 2002-10-25 | Method for forming a plated microvia interconnect |
US11/866,163 Abandoned US20080017410A1 (en) | 1999-06-28 | 2007-10-02 | Method for forming a plated microvia interconnect |
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US20080017410A1 (en) * | 1999-06-28 | 2008-01-24 | Jimarez Miguel A | Method for forming a plated microvia interconnect |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080017410A1 (en) * | 1999-06-28 | 2008-01-24 | Jimarez Miguel A | Method for forming a plated microvia interconnect |
US20090294971A1 (en) * | 2008-06-02 | 2009-12-03 | International Business Machines Corporation | Electroless nickel leveling of lga pad sites for high performance organic lga |
Also Published As
Publication number | Publication date |
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US20080017410A1 (en) | 2008-01-24 |
US6492600B1 (en) | 2002-12-10 |
US20030102158A1 (en) | 2003-06-05 |
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