US8101060B2 - Methods and apparatuses for electrochemical-mechanical polishing - Google Patents
Methods and apparatuses for electrochemical-mechanical polishing Download PDFInfo
- Publication number
- US8101060B2 US8101060B2 US12/687,729 US68772910A US8101060B2 US 8101060 B2 US8101060 B2 US 8101060B2 US 68772910 A US68772910 A US 68772910A US 8101060 B2 US8101060 B2 US 8101060B2
- Authority
- US
- United States
- Prior art keywords
- microfeature workpiece
- polishing
- workpiece
- polishing liquid
- microfeature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
Description
Removal rate=electropolishing (EP) rate+electrochemical-mechanical polishing (ECMP) rate, (1)
where the EP rate is the rate at which material is removed solely by electrical polishing, and the ECMP rate is the rate at which material is removed by the chemical solution in combination with both the physical application of the pad to the surface of the wafer and additional electrical interactions. However, the uncontrolled application of both electropolishing and ECMP to the wafer may not produce an overall material removal rate that is acceptably uniform.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/687,729 US8101060B2 (en) | 2004-02-20 | 2010-01-14 | Methods and apparatuses for electrochemical-mechanical polishing |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/783,763 US7153777B2 (en) | 2004-02-20 | 2004-02-20 | Methods and apparatuses for electrochemical-mechanical polishing |
US11/397,419 US7670466B2 (en) | 2004-02-20 | 2006-04-03 | Methods and apparatuses for electrochemical-mechanical polishing |
US12/687,729 US8101060B2 (en) | 2004-02-20 | 2010-01-14 | Methods and apparatuses for electrochemical-mechanical polishing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/397,419 Continuation US7670466B2 (en) | 2004-02-20 | 2006-04-03 | Methods and apparatuses for electrochemical-mechanical polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100116685A1 US20100116685A1 (en) | 2010-05-13 |
US8101060B2 true US8101060B2 (en) | 2012-01-24 |
Family
ID=34911406
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/783,763 Expired - Fee Related US7153777B2 (en) | 2004-02-20 | 2004-02-20 | Methods and apparatuses for electrochemical-mechanical polishing |
US11/397,419 Expired - Fee Related US7670466B2 (en) | 2004-02-20 | 2006-04-03 | Methods and apparatuses for electrochemical-mechanical polishing |
US12/687,729 Expired - Fee Related US8101060B2 (en) | 2004-02-20 | 2010-01-14 | Methods and apparatuses for electrochemical-mechanical polishing |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/783,763 Expired - Fee Related US7153777B2 (en) | 2004-02-20 | 2004-02-20 | Methods and apparatuses for electrochemical-mechanical polishing |
US11/397,419 Expired - Fee Related US7670466B2 (en) | 2004-02-20 | 2006-04-03 | Methods and apparatuses for electrochemical-mechanical polishing |
Country Status (10)
Country | Link |
---|---|
US (3) | US7153777B2 (en) |
EP (1) | EP1732732B1 (en) |
JP (1) | JP4485536B2 (en) |
KR (1) | KR100851516B1 (en) |
CN (1) | CN101094748A (en) |
AT (1) | ATE448049T1 (en) |
DE (1) | DE602005017595D1 (en) |
SG (1) | SG135188A1 (en) |
TW (1) | TWI286959B (en) |
WO (1) | WO2005082574A1 (en) |
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US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
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US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
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US7220166B2 (en) | 2000-08-30 | 2007-05-22 | Micron Technology, Inc. | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
US7153195B2 (en) | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
US7129160B2 (en) | 2002-08-29 | 2006-10-31 | Micron Technology, Inc. | Method for simultaneously removing multiple conductive materials from microelectronic substrates |
US7078308B2 (en) | 2002-08-29 | 2006-07-18 | Micron Technology, Inc. | Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate |
US7153777B2 (en) | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatuses for electrochemical-mechanical polishing |
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US7435324B2 (en) | 2004-09-02 | 2008-10-14 | Micron Technology, Inc. | Noncontact localized electrochemical deposition of metal thin films |
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US7935242B2 (en) * | 2006-08-21 | 2011-05-03 | Micron Technology, Inc. | Method of selectively removing conductive material |
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US8192568B2 (en) * | 2007-02-09 | 2012-06-05 | Alliant Techsystems Inc. | Non-toxic percussion primers and methods of preparing the same |
US8974655B2 (en) * | 2008-03-24 | 2015-03-10 | Micron Technology, Inc. | Methods of planarization and electro-chemical mechanical polishing processes |
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US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
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US11787008B2 (en) * | 2020-12-18 | 2023-10-17 | Applied Materials, Inc. | Chemical mechanical polishing with applied magnetic field |
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CN101094748A (en) | 2007-12-26 |
US20060189139A1 (en) | 2006-08-24 |
TWI286959B (en) | 2007-09-21 |
JP2007522952A (en) | 2007-08-16 |
KR100851516B1 (en) | 2008-08-11 |
US7153777B2 (en) | 2006-12-26 |
WO2005082574A1 (en) | 2005-09-09 |
US7670466B2 (en) | 2010-03-02 |
SG135188A1 (en) | 2007-09-28 |
TW200538233A (en) | 2005-12-01 |
JP4485536B2 (en) | 2010-06-23 |
EP1732732A1 (en) | 2006-12-20 |
EP1732732B1 (en) | 2009-11-11 |
US20050196963A1 (en) | 2005-09-08 |
ATE448049T1 (en) | 2009-11-15 |
DE602005017595D1 (en) | 2009-12-24 |
KR20060118012A (en) | 2006-11-17 |
US20100116685A1 (en) | 2010-05-13 |
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