US9147623B2 - Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices - Google Patents
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Download PDFInfo
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- US9147623B2 US9147623B2 US14/457,000 US201414457000A US9147623B2 US 9147623 B2 US9147623 B2 US 9147623B2 US 201414457000 A US201414457000 A US 201414457000A US 9147623 B2 US9147623 B2 US 9147623B2
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Definitions
- FIG. 2D is another cross-sectional view of the assembly of FIG. 2A showing electrical isolation of the metal spacers.
- the metal spacers 104 of this embodiment are completed by forming a second tier of metal bumps on top of the first tier of metal bumps.
- An alternative embodiment for forming the metal spacers 104 includes individually soldering or otherwise positioning preformed single- or multi-tiered metal spacers on the spacer sites 106 .
- a packaged microelectronic device may be created by forming a casing over the assembly 100 to encapsulate the first and second dies 102 a - b , the wire bonds 112 a - b , and a top-side surface portion of the substrate 110 . Embodiments of packaged devices are illustrated in further detail with reference to FIGS. 8-10 .
- FIG. 6B shows the first wire 160 a after it has been bent and pressed against a bond pad 164 , for example, by a wire bonding tool.
- the wire bonding tool applies mechanical force, heat, and/or ultrasonic energy until a metallic connection is created between the first bump 162 a and the bond pad 164 .
- the remaining portion of the first wire 160 a may then be stitched to external bond pads of the interposer substrate.
- FIG. 6C shows the first bump 162 a after it has been flattened or coined by applying mechanical pressure to the top and bottom sides of the first bump 162 a .
- An individual metal bump may be flattened immediately after formation, or all of the metal bumps on a die may be simultaneously flattened by compressing the metal bumps against a flat surface.
- FIG. 6D shows a second metal bump 162 b on the first bump 162 a and a second wire 160 b projecting from the second bump 162 b .
- FIG. 6E shows the first and second bumps 162 a - b and the metal wire 160 a after the metal wire 160 b has been removed, which may leave a small wire tail 166 that projects away from the metal bump 162 b .
- the wire tail 166 may be pressed into the metal bump (i.e., via a flattening process) or the wire tail 166 may be sufficiently small so as to be negligible.
- the first and second bumps 162 a - b form the stitched metal spacer 142 .
Abstract
Description
Claims (18)
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Also Published As
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SG150395A1 (en) | 2009-03-30 |
KR20100067084A (en) | 2010-06-18 |
US20090045496A1 (en) | 2009-02-19 |
US20120108010A1 (en) | 2012-05-03 |
US20140346683A1 (en) | 2014-11-27 |
CN106298748A (en) | 2017-01-04 |
EP2191507B1 (en) | 2018-10-03 |
US8501546B2 (en) | 2013-08-06 |
TW200917457A (en) | 2009-04-16 |
WO2009025972A2 (en) | 2009-02-26 |
CN101809737A (en) | 2010-08-18 |
US20130292854A1 (en) | 2013-11-07 |
JP2010537406A (en) | 2010-12-02 |
WO2009025972A3 (en) | 2009-04-23 |
US8093702B2 (en) | 2012-01-10 |
US8803307B2 (en) | 2014-08-12 |
EP2191507A2 (en) | 2010-06-02 |
JP5418918B2 (en) | 2014-02-19 |
KR101257551B1 (en) | 2013-04-23 |
TWI389293B (en) | 2013-03-11 |
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